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WO2013017504A1 - Carte de circuits imprimés à transpondeur rfid intégré - Google Patents

Carte de circuits imprimés à transpondeur rfid intégré Download PDF

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Publication number
WO2013017504A1
WO2013017504A1 PCT/EP2012/064590 EP2012064590W WO2013017504A1 WO 2013017504 A1 WO2013017504 A1 WO 2013017504A1 EP 2012064590 W EP2012064590 W EP 2012064590W WO 2013017504 A1 WO2013017504 A1 WO 2013017504A1
Authority
WO
WIPO (PCT)
Prior art keywords
transponder
circuit board
printed circuit
antenna
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/064590
Other languages
German (de)
English (en)
Inventor
Rainer Kronberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fh Koln
Original Assignee
Fh Koln
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fh Koln filed Critical Fh Koln
Publication of WO2013017504A1 publication Critical patent/WO2013017504A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G06K19/041—Constructional details
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07716—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising means for customization, e.g. being arranged for personalization in batch
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10366—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves the interrogation device being adapted for miscellaneous applications
    • G06K7/10415—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves the interrogation device being adapted for miscellaneous applications the interrogation device being fixed in its position, such as an access control device for reading wireless access cards, or a wireless ATM
    • G06K7/10425—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves the interrogation device being adapted for miscellaneous applications the interrogation device being fixed in its position, such as an access control device for reading wireless access cards, or a wireless ATM the interrogation device being arranged for interrogation of record carriers passing by the interrogation device
    • G06K7/10435—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves the interrogation device being adapted for miscellaneous applications the interrogation device being fixed in its position, such as an access control device for reading wireless access cards, or a wireless ATM the interrogation device being arranged for interrogation of record carriers passing by the interrogation device the interrogation device being positioned close to a conveyor belt or the like on which moving record carriers are passing
    • G06K7/10455—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves the interrogation device being adapted for miscellaneous applications the interrogation device being fixed in its position, such as an access control device for reading wireless access cards, or a wireless ATM the interrogation device being arranged for interrogation of record carriers passing by the interrogation device the interrogation device being positioned close to a conveyor belt or the like on which moving record carriers are passing the record carriers being fixed to an endless tape or at least not fixed to further objects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion

Definitions

  • the invention relates to a printed circuit board into which an RFID transponder is already integrated at the beginning of the production process, so that the printed circuit board can be identified during subsequent process steps. Furthermore, the invention relates to an RFID transponder, which can already be integrated into a printed circuit board at the beginning of the manufacturing process, and to a method for integrating an RFID transponder into a printed circuit board.
  • Modern printed circuit boards in particular multilayer printed circuit boards, require a multitude of process steps in their manufacture, such as laminating different layers of insulating and conductive materials, electroplating of layers, etching, painting and mechanical processing such as drilling and milling.
  • process steps such as laminating different layers of insulating and conductive materials, electroplating of layers, etching, painting and mechanical processing such as drilling and milling.
  • process steps for multilayer printed circuit boards, approx. 30-40 of these process steps are necessary. These must be closely monitored and matched to the printed circuit boards in order to achieve a high production quality. For this it is necessary to uniquely identify the individual circuit boards.
  • German Utility Model DE 20 2010 014862 U1 discloses a printed circuit board with an integrated RFID microchip. It will be finished here Printed circuit board made an opening, in the later an RFID microchip is used. Prerequisite here is that the circuit board is already completed. Thus, the RFID microchip can not be used to identify the PCB during the manufacturing process.
  • German published patent application DE 10 2008 021750 A1 discloses an electronically identifiable printed circuit board equipped with components. The circuit board here has a recess, which is used an RFID transponder. Again, the transponder is applied to a finished circuit board, prior to their assembly with electronic components. Thus, even here, no identification of the circuit board itself during the manufacturing process is possible.
  • the invention has for its object to make a circuit board such that it can be identified during its manufacturing process by an RFID transponder.
  • Another aspect of the invention is to design an RFID transponder, which can already be integrated into a printed circuit board at the beginning of the manufacturing process.
  • a method for integrating an RFID transponder at the beginning of the manufacturing process is to be specified in a circuit board.
  • a printed circuit board with an RFID transponder In order to provide a printed circuit board with an RFID transponder at the beginning of its production process, it could be applied from the outside to the printed circuit board or at least one of its material layers or layers. However, this is not compatible with the manufacturing processes, as these are either a assuming a plane surface or would destroy the transponder by processing the surface. For example, this would be completely short-circuited during metallization or chemically decomposed during etching.
  • An alternative would be embedding a transponder in or between two layers of material, preferably of an insulating material.
  • a metal layer is applied to the outside of the material layers in one or more manufacturing steps, galvanically or else by lamination, so that a closed metal layer is formed. If a transponder comprising an RFID chip including an antenna is embedded in it, then it can no longer be interrogated because it is surrounded by the closed and electrically shielding metal layer.
  • the term RFID chip refers to an integrated circuit or a hybrid circuit that realizes the transponder function. For transmitting or receiving electromagnetic waves, this RFID chip is connected to an antenna.
  • a transponder is the combination of an RFID chip with an antenna and possibly other components that are necessary for a transponder function. This can be, for example, a memory.
  • the material layers may comprise electrically conductive copper layers, non-conductive insulating layers, optionally also with conductor structures.
  • a very thin RFID chip with a special, adapted antenna is inserted between two layers of material. This is preferably two insulating layers of material, otherwise the RFID chip would have to have its own insulation. It is particularly favorable if the RFID chip and the antenna are located centrally between two insulating layers of material, which are advantageously realized on the outside, at least in the region of the RFID chip and / or the antenna.
  • recesses or holes are regularly (summarized below under the term recess) made, which have no metallization or need.
  • the distance of the antenna to the recess is smaller than the distance to the nearest metallized surface.
  • the recess is in at least one layer of insulating material.
  • the recess is only in a metallization, for example in a metallization above and / or below the antenna and / or laterally next to the antenna. Holes are, for example, mating holes in which dowel pins are used to align different layers accurately to each other.
  • the antenna and / or a segment of the antenna, preferably a coupling segment of the antenna of the transponder is mounted in the vicinity of such a recess.
  • the antenna and / or the coupling segment encloses such a recess at least partially. It is essential that at least a part of the antenna is in the vicinity of the recess.
  • a reader for reading and / or writing data from and / or in the transponder can now communicate with a coupler, for example in the form of a coil via the antenna with the RFID chip and query data from the transponder and / or manufacturing data in a memory of the transponder.
  • the coil is for this purpose brought directly into the recess or at least in the vicinity of the recess.
  • the coil may for example be part of a dowel pin, which is inserted into a fitting bore.
  • the coupler may have a coupling surface for capacitive communication with the RFID chip. This coupling surface is then also brought directly into the recess or at least in the vicinity of the recess.
  • the coupler is equipped with a tool for removing a conductive coating, such as a copper layer, from the sides of the recess. bined.
  • a conductive coating such as a copper layer
  • this could have a blade or a grinding surface on the tip, so that a copper layer is removed when inserting the pass pin into the fitting bore.
  • the antenna of a transponder is at least partially located on an edge of the printed circuit board.
  • the edge is usually freed of conductive material.
  • the antenna lying on the edge is accessible from the outside again.
  • the transponder can now also be inductively or capacitively coupled with a coupler as described above. Particularly preferably, it can be coupled with a commercially available reader.
  • the antenna is designed as a line, or at least comprises a line which makes an adaptation to the input impedance of the RFID chip.
  • common RFID chips have a complex input impedance with a real and a capacitively imaginary component. These RFID chips could, for example, be operated with an antenna with conjugate complex impedance, so that the necessary for the operation of the RFID chip electrical energy can be transmitted with high efficiency.
  • a part of the antenna referred to here as a reference segment, and / or a further line for coupling high-frequency signals to a circuit ground, here a metallized area, are provided. This can be done for example by a line with a quarter of the line wavelength. This then transforms an open circuit at the end of the line into a short circuit at the location of the RFID chip.
  • the upper and lower sides are at least partially freed from conductive materials in the region of the antenna.
  • the transponder can be read out again by conventional RFI D readers.
  • Circuit boards are often made in use, which are divided into a variety of small circuit boards towards the end of the manufacturing process.
  • An inventive transponder can now optionally in one or more of these small circuit boards or in a piece of the benefits, for example, at the edge, which will not be used later, be integrated.
  • the transponder has a writable memory in which information about individual production steps can be written. This allows documentation of the production process. It is particularly favorable, if only after previous authentication with a key in the transponder can be written. Thus, a long-term, forgery-proof documentation can be realized.
  • the transponder operates in a frequency range greater than 100 MHz, particularly preferably at 868 MHz.
  • the transponder can also be operated at lower frequencies, such as 13.56 MHz. In a higher frequency range, the required power can be coupled into the antenna more efficiently via the coupler.
  • a transponder system comprises a printed circuit board with an integrated transponder and a reader antenna, which comprises a stamp, fitting in the recess.
  • the stamp may also have the function of a dowel pin and / or be a modified dowel pin.
  • transponder which can be embedded in a printed circuit board, the antenna being designed as described above.
  • Another aspect of the invention is a method of embedding a transponder in a printed circuit board as described above.
  • the method comprises the following steps: a) embedding a transponder comprising an RFID chip and an antenna between at least two layers of insulating material, b) applying a metallization on the outer sides of the insulating material, c) introducing a recess on and / or in the printed circuit board in the
  • the individual steps can also be reversed in their order.
  • a step of removing the metallization in the region of the recess must be inserted.
  • this step is not necessary if the recess is introduced only after the application of the metallization.
  • the embedding of the transponder can be done in various ways.
  • the entire transponder comprising an RFID chip and an antenna can be preassembled on a carrier, so that before embedding only the carrier with the transponder has to be placed on one of the layers of insulating material or fixed there.
  • only certain parts of the transponder can be preassembled on a carrier.
  • the antenna or parts thereof could be prefabricated as a conductor structure on one or more layers of insulating material, so that only the RFID chip placed on the insulating material and optionally electrically connected (for example by soldering) must. Thereafter, the embedding can be done, for example, by laminating the layers of insulating material. Description of the drawings
  • FIG. 1 shows a device according to the invention.
  • FIG. 2 shows the coupling of the transponder
  • FIG. 3 shows an intermediate step in printed circuit board production.
  • FIG. 4 shows a plan view of an arrangement according to FIG. 1.
  • FIG. 5 shows, by way of example, the equivalent circuit diagram of an RFID chip.
  • FIG. 6 shows another antenna form.
  • Figure 7 shows an external to the circuit board antenna.
  • FIG. 8 shows prefabricated transponders on a carrier.
  • FIG. 9 shows several options for arranging transponders on a printed circuit board.
  • FIG. 1 shows a device according to the invention in a side view.
  • a printed circuit board 100 (shown here in section) consists of a first layer of insulating material 101 and a second layer of insulating material 102, which are both laminated together. The outsides of the layers of insulating material are metallized. Thus, on the outside of the first layer of insulating material 101, a first metallization 105 and on the second layer of insulating material 102, a second metallization 106 is applied. Between the layers of insulating material, a transponder is embedded. This transponder includes an RFID chip 10 and an antenna connected to it. The antenna has at least one coupling segment 20 and a reference segment 30.
  • both segments of the antenna can be used individually and / or jointly for coupling and / or decoupling electromagnetic waves.
  • the coupling segment 20 of the antenna is guided in the vicinity, particularly preferably the immediate vicinity of a recess, here a fitting hole 110.
  • the printed circuit board 100 shown here is typically only an intermediate step in the manufacturer of a multilayer printed circuit board. Thus, further layers of insulating material and / or metallizations can be applied to the layers shown here.
  • the transponder is to be read with a commercially available or simplified transponder reader after completion of the printed circuit board, then the metallizations above and / or below the transponder or at least the antenna are removed during production, so that an electromagnetic coupling between one and the other in the vicinity of the printed circuit board mounted reader and the transponder is possible.
  • FIG. 2 shows the coupling of the transponder.
  • a reader not shown here, communicates with the transponder via a reader antenna 210.
  • a punch 200 is inserted into the fitting hole 110.
  • This punch has a preferably cylindrical shaft 203 on a head 204, which simultaneously represents the depth stop, so that the reader antenna 210 is positioned on the shaft at a defined height of the registration hole 110. This height corresponds to the position of the coupling segment 20 of the antenna.
  • an electrical or magnetic coupling between the reader antenna 210 and the coupling segment 20 of the antenna is achieved.
  • the coupling is independent of the number of layers and / or metallizations above or below the transponder.
  • this preferably has a conical end 202. It is particularly advantageous if this still with milling grooves 201 or other means for the mechanical removal of a Metallic is provided. It is preferred if the stamp makes a ground contact with a metallization, here the first metallization 105. This ground contact can also be capacitive. Thus, the stamp works like a coaxial connector.
  • FIG. 3 shows an intermediate step in printed circuit board production. Here, the outside of the circuit board was metallized. In this case, a metallization 107 was also applied to the inside of the fitting hole 110. In this state, communication with the transponder is not possible.
  • FIG. 4 shows a plan view of an arrangement according to FIG. It can be seen here how the coupling segment 20 of the antenna at least partially surrounds the fitting hole 110. It could also be sufficient that the coupling segment 20 is guided only in the vicinity of the fitting hole 110.
  • FIG. 5 shows, by way of example, the equivalent circuit diagram of an RFID chip and its circuitry.
  • the RFID chip has an input impedance, which can be represented by an equivalent circuit 11, for example by a parallel connection of a capacitance with a resistor.
  • the reference segment 30 transforms the open circuit in terms of high frequency on the side that is not connected further, in this figure to the right, into a short circuit on the side of the RFID chip. This provides the RFID chip with a low impedance to ground. This is represented by the dashed mass symbol 31. It can now be the line Capacitive 20 are coupled via a stamp 200 with a reader antenna 210.
  • FIG. 6 shows another antenna form.
  • an inductive antenna with a coupling segment 21 in the form of a closed conductor loop around the fitting hole 110 can be realized in order to enable a magnetic coupling with the reader antenna 210.
  • the reference segment 30 of the antenna is no longer needed. But it can still be provided.
  • Figure 7 shows an external to the circuit board antenna.
  • the circuit board 100 has a recess on the edge 113.
  • the coupling segment is now arranged in the vicinity of this recess and follows its contour.
  • the transponder During the manufacturing process of the printed circuit board, it is possible to communicate with the transponder via a reader antenna, not shown here, which is introduced into the recess 113. It can also, in particular for a communication after completion of the circuit board, the edge of the circuit board 100 in the region of the coupling segment 20 and the reference segment 30 are removed from a metallization. Thus, can be communicated with the transponder with a commercially available or simpler reader near the edge of the PCB.
  • FIG. 8 shows prefabricated transponders which are arranged on a carrier 40.
  • This carrier is divided into several sections 41, 42 and 43, each section preferably carrying a transponder.
  • the carrier is preferably made of a plastic material, preferably a foil, for example polyimide.
  • the carrier can now be divided into several sections. A single section is placed at the appropriate location between the layers and laminated together.
  • FIG. 9 shows several possibilities of arranging transponders on a printed circuit board.
  • the printed circuit board 100 has three fitting holes 110, 111 and 112 here.
  • a first transponder 50 is arranged here in the vicinity of the first fitting hole 110.
  • a second transponder 51 is arranged in the vicinity of the recess 113 at the edge of the printed circuit board.
  • a third transponder 52 is finally mounted in the vicinity of a recess 114 in the surface of the circuit board 100.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Une carte de circuits imprimés (100) présente un transpondeur intégré (10) qui peut être interrogé également pendant des étapes de fabrication individuelles dans lesquelles des métallisations (105, 106) sont réalisés au-dessus et en dessous du transpondeur. A cet effet, le transpondeur comporte une antenne (20, 30) entourant un trou alésé (110) ménagé dans la carte de circuits imprimés. Pour interroger le transpondeur (10), on introduit un poinçon (200) muni d'une antenne de lecture intégrée (210) dans le trou alésé (110). Lors d'étapes de fabrication ultérieures, la métallisation dans la zone de l'antenne du transpondeur peut être éliminée de façon que ledit transpondeur puisse être interrogé au moyen de lecteurs d'usage courant dans le commerce.
PCT/EP2012/064590 2011-08-03 2012-07-25 Carte de circuits imprimés à transpondeur rfid intégré Ceased WO2013017504A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011080344.0A DE102011080344B4 (de) 2011-08-03 2011-08-03 Leiterplatte mit integriertem RFID Transponder
DE102011080344.0 2011-08-03

Publications (1)

Publication Number Publication Date
WO2013017504A1 true WO2013017504A1 (fr) 2013-02-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/064590 Ceased WO2013017504A1 (fr) 2011-08-03 2012-07-25 Carte de circuits imprimés à transpondeur rfid intégré

Country Status (2)

Country Link
DE (1) DE102011080344B4 (fr)
WO (1) WO2013017504A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11644501B2 (en) 2020-09-21 2023-05-09 International Business Machines Corporation Method for identifying PCB core-layer properties

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317011B1 (en) * 2000-03-09 2001-11-13 Avaya Technology Corp. Resonant capacitive coupler
US20040263189A1 (en) * 2003-06-30 2004-12-30 Perry Richard S. Probe of under side of component through opening in a printed circuit board
DE102008021750A1 (de) 2008-04-30 2009-11-05 Endress + Hauser Gmbh + Co. Kg Elektronisch identifizierbare mit Bauteilen bestückte Leiterplatte und Verfahren zu deren Herstellung
GB2460071A (en) * 2008-05-15 2009-11-18 Lyncolec Ltd Printed Circuit Board Including a RFID device
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