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WO2013016928A1 - Métamatériau isotrope entièrement diélectrique et procédé de préparation de celle-ci et matière composite et procédé de préparation - Google Patents

Métamatériau isotrope entièrement diélectrique et procédé de préparation de celle-ci et matière composite et procédé de préparation Download PDF

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Publication number
WO2013016928A1
WO2013016928A1 PCT/CN2011/084468 CN2011084468W WO2013016928A1 WO 2013016928 A1 WO2013016928 A1 WO 2013016928A1 CN 2011084468 W CN2011084468 W CN 2011084468W WO 2013016928 A1 WO2013016928 A1 WO 2013016928A1
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WIPO (PCT)
Prior art keywords
dielectric
substrate
spherical
metamaterial
isotropic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2011/084468
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English (en)
Chinese (zh)
Inventor
刘若鹏
赵治亚
缪锡根
李春来
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuang-Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
Original Assignee
Kuang-Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2011102154439A external-priority patent/CN102480035A/zh
Priority claimed from CN 201110215596 external-priority patent/CN102480038B/zh
Application filed by Kuang-Chi Institute of Advanced Technology, Kuang Chi Innovative Technology Ltd filed Critical Kuang-Chi Institute of Advanced Technology
Publication of WO2013016928A1 publication Critical patent/WO2013016928A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type

Definitions

  • the present invention relates to the field of metamaterials, and more particularly to an isotropic full dielectric metamaterial and a preparation method thereof, and a preparation method of the composite material.
  • Metamaterials are artificial composite structures or composites that have extraordinary physical properties not found in natural materials. Through the orderly design of the structure on the key physical scale of the material, it is possible to break through the limitations of some apparent natural laws, thereby obtaining the extraordinary material function beyond the ordinary nature inherent in nature books.
  • the properties and functions of metamaterials are mainly derived from their internal structure rather than the materials that make them. Therefore, many research work has been done to design and synthesize metamaterials.
  • Smith et al. of the University of California pointed out that a composite structure of periodically arranged metal lines and open-loop resonators (SRR) can achieve a double negative material with a negative dielectric constant ⁇ and a magnetic permeability ⁇ , also known as a left-handed material. . They then implemented two-dimensional double-negative materials by fabricating metal lines and SRR composite structures on a printed circuit board (PCB).
  • PCB printed circuit board
  • the existing metamaterials generally produce metal microstructures on a dielectric substrate, and the metal microstructures are regularly arranged in a two-dimensional plane. It is difficult in the prior art to make the microstructures into a three-dimensional three-dimensional structure. It is difficult to achieve a very precise arrangement of the microstructure of the three-dimensional structure into the dielectric substrate.
  • the artificial composite material is mainly prepared in the following manner: A hole in a cube is punched on a substrate, and then the hole is filled with a material having a desired dielectric constant.
  • the metamaterials prepared by the prior art can achieve anisotropy, but cannot achieve isotropy.
  • the present invention provides an isotropic full dielectric metamaterial and a preparation method thereof.
  • the technical solution adopted by the present invention is an isotropic all-dielectric super material, comprising a plurality of stacked dielectric substrates, wherein the dielectric substrate is provided with a plurality of hemispherical grooves, two adjacent The hemispherical grooves on the dielectric substrate are symmetrically disposed to form a plurality of spherical cavities which are filled with a spherical particulate dielectric material.
  • the dielectric material is ceramic microsphere particles having a spherical structure.
  • the plurality of spherical cavities are different in size.
  • the dielectric substrate is a Teflon material.
  • the invention also provides a method for preparing an isotropic all-dielectric metamaterial, comprising the following steps:
  • the step further comprises: controlling the plurality of hemispherical groove structures to have a predetermined arrangement pattern.
  • the step further comprises: controlling the plurality of hemispherical groove structures to have different sizes.
  • the step b further comprises: controlling the difference in the spherical granular dielectric material placed in each of the hemispherical groove structures.
  • the dielectric material is a ceramic material.
  • the dielectric substrate is a Teflon material.
  • the isotropic all-dielectric metamaterial prepared by the preparation method of the present invention has the advantages of low loss, easy to achieve isotropy and application to the infrared light band. Moreover, the invention is convenient in processing and manufacturing. By controlling the size of the spherical shaped dielectric material, the arrangement law and selecting a suitable material, the electromagnetic characteristics of each substrate unit of the super material can be accurately controlled, and the electromagnetic electromagnetic characteristic design path is adopted. .
  • the invention further provides a method for preparing a composite material, the method comprising:
  • the second substrate is spliced with the first substrate, and the spherical dielectric material is embedded in the spherical cavity obtained by splicing the first substrate and the second substrate to obtain a composite material having a spherical dielectric material as a microstructure.
  • a spherical cavity By forming a predetermined array of hemispherical grooves on two substrates, a spherical cavity can be obtained when the two substrates are spliced, and a spherical dielectric material having the same diameter as that of the filled cavity is embedded in the spherical cavity. In this way, a composite material having a spherical cavity shape as a microstructure is obtained, which is simple to prepare, and since the microstructure is spherical, isotropy can be achieved.
  • Figure 1 is a schematic view showing the structure of a dielectric substrate in an embodiment of the present invention.
  • Figure 2 is a schematic view showing the preparation of the metamaterial embodiment 1.
  • Figure 3 is a schematic view showing the preparation of the metamaterial embodiment 2.
  • Figure 4 is a schematic view showing the preparation of the metamaterial embodiment 3.
  • Fig. 5 is a view showing a state of preparation of a composite material in an embodiment of the present invention.
  • Figure 7 is a flow chart showing the second embodiment of the composite material preparation method provided by the present invention.
  • An isotropic full-dielectric metamaterial comprising a plurality of stacked dielectric substrates, a schematic structural view of the dielectric substrate.
  • the dielectric substrate 1 is provided with a plurality of hemispherical grooves 2, in the metamaterial, phase
  • the hemispherical grooves on the adjacent two dielectric substrates 1 are symmetrically arranged to form a plurality of spherical cavities, balls
  • the shaped cavity is filled with a spherical granular dielectric material 3, and a schematic diagram of the preparation of the metamaterial is shown in FIG.
  • each spherical cavity has the same size
  • the spherical granular dielectric material 3 also selects the same ceramic microsphere particles
  • the dielectric substrate 1 uses a glass fiber epoxy substrate.
  • the hemispherical grooves 2 in Figures 1 and 2 are enlarged views, the number of which does not represent the actual number.
  • the isotropic all-dielectric metamaterial prepared by the preparation method of the invention has the advantages of low loss, easy to achieve isotropy and application to the infrared light frequency band, and provides a microstructure for preparing a three-dimensional structure in a dielectric matrix material. Ways and methods.
  • Metamaterial Example 2
  • An isotropic all-dielectric metamaterial comprising a plurality of stacked dielectric substrates, wherein the dielectric substrate 1 is provided with a plurality of hemispherical grooves 2, and in the metamaterial, hemispheres on two adjacent dielectric substrates 1
  • the shaped grooves are symmetrically arranged to form a plurality of spherical cavities, the spherical cavities are filled with ceramic microsphere particles 3, and the multilayer dielectric holes are laminated, and the plurality of spherical holes are formed, and the ceramics in the spherical cavities of the respective layers in this embodiment
  • the microsphere particles are alternately repeated in size, and a schematic diagram of the preparation of the metamaterial is shown in FIG.
  • the hemispherical groove 2 in Fig. 3 is an enlarged schematic view, and the number thereof does not represent the actual number.
  • the preparation method of the isotropic all-dielectric super material of the embodiment includes the following steps: a. processing a plurality of hemispherical groove structures on the first dielectric substrate by mechanical processing, and can be processed by a numerically controlled machine tool in a specific implementation, and the size of the processed hemispherical groove structure is in the order of millimeters;
  • steps 1 ⁇ 1, b, c stacking a plurality of dielectric substrates in sequence, and repeating the ceramic microsphere particles in the spherical holes of each layer in an alternating size, since the ceramic microsphere particles have a spherical structure,
  • a spherical microstructure having a three-dimensional structure is formed inside the dielectric substrate, and the spherical structure ensures the isotropic characteristics of the microstructure, and at the same time, the microstructure and the dielectric substrate are both dielectric.
  • the material is such that an isotropic full dielectric metamaterial is obtained.
  • the ceramic microsphere particles in the spherical cavity of each layer are alternately repeated in size, and the negative dielectric constant and the negative magnetic permeability can be realized.
  • the principle is: Since the dielectric constant of the ceramic microsphere particles is much larger than the dielectric substrate Electromagnetic waves with similar wavelengths and ceramic microsphere particles can generate rice resonance in the sphere. A large number of ceramic microsphere particles of the same size can enhance this resonance, and two different sizes of ceramic microsphere particles can provide effective negative respectively. Dielectric constant and effective negative magnetic permeability.
  • the isotropic all-dielectric metamaterial prepared by the preparation method of the invention has the advantages of low loss, easy to achieve isotropy and application to the infrared light frequency band, and provides a microstructure for preparing a three-dimensional structure in a dielectric matrix material. Ways and methods. Metamaterial Example 3
  • An isotropic all-dielectric metamaterial comprising a plurality of stacked dielectric substrates, wherein the dielectric substrate is provided with a plurality of hemispherical grooves, and in the metamaterial, the hemispherical concaves on the adjacent two dielectric substrates 1
  • the groove is symmetrically arranged to form a plurality of spherical cavities, and the spherical cavities are filled with ceramic microsphere particles 3, and a schematic diagram of preparation of the metamaterial is shown in FIG.
  • each spherical cavity has a non-uniform size, and the size of the ceramic microsphere particles 3 gradually increases from the periphery to the middle, and the dielectric substrate 1 is made of a Teflon material.
  • the hemispherical groove 2 and the ceramic microsphere particles 3 in Fig. 4 are enlarged schematic views, and the number thereof does not represent the actual number.
  • the method for preparing the isotropic all-dielectric super material of the embodiment comprises the following steps: a. processing a plurality of hemispherical groove structures on the first dielectric substrate by a mechanical processing method, and the numerical control machine tool can be used in the specific implementation. After machining, the processed hemispherical groove structure has a size range of the order of millimeters, and during processing, the diameter of the hemispherical groove structure is precisely controlled so that the diameter thereof gradually increases from the periphery to the middle;
  • the ceramic microsphere particles in the embodiment can be selected from different materials to further accurately control electromagnetic parameters such as dielectric constant of each substrate unit of the super material.
  • the isotropic all-dielectric metamaterial prepared by the preparation method of the present invention has the advantages of low loss, easy to achieve isotropy and application to the infrared light band. Moreover, the invention is convenient in processing and manufacturing. By controlling the size of the spherical shaped dielectric material, the arrangement law and selecting a suitable material, the electromagnetic characteristics of each substrate unit of the super material can be accurately controlled, and the electromagnetic electromagnetic characteristic design path is adopted. .
  • the composite of the present invention and its preparation process are depicted in Figures 5-8. Referring to FIG. 5, a state diagram of a preparation state of a composite material according to an embodiment of the present invention includes:
  • State diagram 11 shown after forming a predetermined array of hemispherical grooves on the first substrate; state 12 shown after filling the preset spherical dielectric material in the hemispherical groove of the first plate; a state shown in FIG. 13 after forming the same hemispherical groove as the first substrate on the second substrate; splicing the second substrate with the first substrate, embedding the spherical dielectric material into the first substrate and the second substrate In the spherical cavity obtained by splicing the substrate, the state shown after the composite material having the spherical dielectric material as a microstructure is obtained Figure 14.
  • the composite material prepared by the embodiment of the present invention has a first substrate and a second substrate as a substrate, and a spherical dielectric material is embedded in the substrate, because the dielectric constant of the spherical dielectric material and the substrate are interposed.
  • the electrical constants are different, so a spherical dielectric material can be considered as a microstructure formed on its material.
  • the size and material type of the spherical dielectric material can be selected according to the required electromagnetic characteristics, and the preparation is simple, and since the shape of the microstructure is spherical, isotropy can be achieved.
  • FIG. 6 is a flow chart of a method for preparing a composite material according to a first embodiment of the present invention, the preparation method comprising:
  • S22 filling a hemispherical groove of the first substrate with a preset spherical dielectric material, the diameter of the spherical dielectric material being the same as the diameter of the filled hemispherical groove.
  • the dielectric constant of the spherical dielectric material is greater than the dielectric constant of the first substrate material; and the diameter of each of the spherical dielectric materials is on the order of millimeters.
  • the material of the second substrate and the first substrate are the same or different, and in a specific implementation process, the selection is made according to the properties of the composite material required.
  • S24 splicing the second substrate with the first substrate, and inserting the spherical dielectric material into the spherical cavity obtained by splicing the first substrate and the second substrate to obtain a composite material.
  • the dielectric constant of the spherical dielectric material is greater than the dielectric constant of the second substrate material.
  • FIG. 7 is a flow chart of a method for preparing a composite material according to Embodiment 2 of the present invention, the preparation method comprising:
  • S31 Forming a predetermined array of hemispherical grooves on the first substrate. Specifically, it can be processed by a digital control machine or an electric discharge machine.
  • the first substrate is a dielectric material substrate.
  • the material of the first substrate is Teflon.
  • S32 filling a predetermined spherical dielectric material in all the hemispherical grooves of the first substrate, the diameter of the spherical dielectric material being the same as the diameter of the filled hemispherical groove.
  • each spherical dielectric material is on the order of millimeters; the dielectric constant of each spherical dielectric material is greater than the dielectric constant of the first substrate; the material of each spherical dielectric material is the same, for example, each spherical dielectric material is Ceramic microspheres, each spherical dielectric material can also be different.
  • the diameters of the hemispherical grooves may be the same or different.
  • the second substrate is a dielectric material substrate, and the materials of the second substrate and the first substrate are the same or different.
  • the material is selected according to the desired properties of the composite material.
  • S34 splicing the second substrate with the first substrate, and embedding the spherical dielectric material into the spherical cavity obtained by splicing the first substrate and the second substrate to obtain a composite material having a spherical dielectric material as a microstructure.
  • S35 laminating at least two spliced first substrate and second substrate to obtain a three-dimensional composite material having a spherical micro-dielectric material as a microstructure.
  • At least two spliced first substrate and second substrate may be laminated by using an adhesive to obtain a three-dimensional composite material having a spherical dielectric material as a microstructure.
  • the dielectric constant of the spherical dielectric material is greater than the dielectric constant of the second substrate material.
  • FIG. 8 is a flow chart of a method for preparing a composite material according to Embodiment 3 of the present invention, the preparation method comprising:
  • S41 Forming a predetermined array of hemispherical grooves on the first substrate. Specifically, the number can be used Control machine or EDM machine processing.
  • the first substrate is a dielectric material substrate.
  • the material of the first substrate is Teflon.
  • S42 filling a part of the hemispherical groove of the first substrate with a preset spherical dielectric material, the diameter of the spherical dielectric material is the same as the diameter of the filled hemispherical groove, and the remaining part of the hemispherical groove is filled with air.
  • the dielectric constant of each of the spherical dielectric materials is greater than the dielectric constant of the first substrate; the material of each of the spherical dielectric materials is the same, for example, the spherical dielectric materials are ceramic microspheres, and the spherical dielectric materials may also be different. .
  • the diameter of the hemispherical groove is on the order of millimeters; the diameter of each hemispherical groove may be the same or different.
  • the second substrate is a dielectric material substrate, and the materials of the second substrate and the first substrate are the same or different.
  • the material is selected according to the desired properties of the composite material.
  • the dielectric constant of the spherical dielectric material is greater than the dielectric constant of the second substrate material.
  • S45 laminating at least two spliced first substrate and second substrate to obtain a composite material having a three-dimensional structure in which a spherical micro dielectric material and a cavity are microstructured.
  • the spherical cavity obtained by splicing the first substrate and the second substrate is partially filled with a spherical dielectric material, and the remaining portion is filled with air.
  • a suitable embodiment is selected as needed.

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Abstract

L'invention porte sur le métamatériau isotrope entièrement diélectrique et un procédé de préparation de celle-ci. Le métamatériau tout diélectrique isotopique préparé selon le procédé de préparation comprend de multiples substrats diélectriques empilés. Le substrat diélectrique comporte de multiples rainures hémisphériques. Les rainures hémisphériques sur deux substrats diélectriques adjacents sont disposées de manière symétrique pour former de multiples cavités sphériques. Les cavités sphériques sont chacune remplies d'une matière diélectrique en forme de particules sphériques. La présente invention présente peu de perte, atteint facilement l'isotopie et est appliquée à la bande de fréquence de lumière infrarouge. En outre, la fabrication est commode. Par commande de la dimension et de l'agencement de la matière diélectrique sphérique, et par sélection d'une matière appropriée, les propriétés électromagnétiques de chaque unité de substrat du métamatériau peuvent être commandées de façon précise, atteignant ainsi une conception flexible des propriétés électromagnétiques. L'invention porte également sur un procédé de préparation d'une matière composite. Par remplissage d'un substrat avec une matière diélectrique sphérique pour préparer la matière composite, l'isotopie peut être obtenue, et le procédé est simple.
PCT/CN2011/084468 2011-07-29 2011-12-22 Métamatériau isotrope entièrement diélectrique et procédé de préparation de celle-ci et matière composite et procédé de préparation Ceased WO2013016928A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN2011102154439A CN102480035A (zh) 2011-07-29 2011-07-29 一种各向同性的全介电超材料及其制备方法
CN201110215596.3 2011-07-29
CN201110215443.9 2011-07-29
CN 201110215596 CN102480038B (zh) 2011-07-29 2011-07-29 一种复合材料的制备方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10411320B2 (en) 2015-04-21 2019-09-10 3M Innovative Properties Company Communication devices and systems with coupling device and waveguide
US10658724B2 (en) 2015-04-21 2020-05-19 3M Innovative Properties Company Waveguide with a non-linear portion and including dielectric resonators disposed within the waveguide
US10759815B2 (en) 2016-03-10 2020-09-01 Nissan Chemical Corporation Condensed heterocyclic compounds and pesticides

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101194195A (zh) * 2005-06-09 2008-06-04 惠普开发有限公司 使用超级透镜元件光学耦合的集成电路层
WO2009142280A1 (fr) * 2008-05-22 2009-11-26 学校法人明星学苑 Structure de ligne de source d'alimentation et de ligne de masse appariées à impédance caractéristique faible
WO2010020836A1 (fr) * 2008-08-22 2010-02-25 Taiwan Semiconductor Manufacturing Co., Ltd Interconnexion électrique à impédance maîtrisée employant des méta-matériaux
CN101673869A (zh) * 2009-10-10 2010-03-17 北京理工大学 陶瓷小球和铜线构成的左手材料的制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101194195A (zh) * 2005-06-09 2008-06-04 惠普开发有限公司 使用超级透镜元件光学耦合的集成电路层
WO2009142280A1 (fr) * 2008-05-22 2009-11-26 学校法人明星学苑 Structure de ligne de source d'alimentation et de ligne de masse appariées à impédance caractéristique faible
WO2010020836A1 (fr) * 2008-08-22 2010-02-25 Taiwan Semiconductor Manufacturing Co., Ltd Interconnexion électrique à impédance maîtrisée employant des méta-matériaux
CN101673869A (zh) * 2009-10-10 2010-03-17 北京理工大学 陶瓷小球和铜线构成的左手材料的制备方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10411320B2 (en) 2015-04-21 2019-09-10 3M Innovative Properties Company Communication devices and systems with coupling device and waveguide
US10658724B2 (en) 2015-04-21 2020-05-19 3M Innovative Properties Company Waveguide with a non-linear portion and including dielectric resonators disposed within the waveguide
US10759815B2 (en) 2016-03-10 2020-09-01 Nissan Chemical Corporation Condensed heterocyclic compounds and pesticides

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