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WO2013014723A1 - Module de cellules solaires et procédé de fabrication de celui-ci - Google Patents

Module de cellules solaires et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2013014723A1
WO2013014723A1 PCT/JP2011/066669 JP2011066669W WO2013014723A1 WO 2013014723 A1 WO2013014723 A1 WO 2013014723A1 JP 2011066669 W JP2011066669 W JP 2011066669W WO 2013014723 A1 WO2013014723 A1 WO 2013014723A1
Authority
WO
WIPO (PCT)
Prior art keywords
solar cell
resin composition
wiring
cell module
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/066669
Other languages
English (en)
Japanese (ja)
Inventor
俊行 佐久間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to PCT/JP2011/066669 priority Critical patent/WO2013014723A1/fr
Publication of WO2013014723A1 publication Critical patent/WO2013014723A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/804—Materials of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
    • H10F77/937—Busbar structures for modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a solar cell module and a manufacturing method thereof.
  • Patent Document 1 discloses a form in which an insulator is disposed on the outer peripheral portion of one of the stacked wiring members to prevent electrical contact between one wiring member and the other wiring member.
  • the solar cell and the wiring material are sealed with a filler to prevent moisture from entering them.
  • a solar cell module uses two resin films as fillers, and laminates the solar cells with the film. When laminating, the resin film melts and adheres to the surface of the solar cell or wiring material, but if there are gaps along the surface direction of the resin film, such as between overlapping wiring materials, the solar cell is less likely to contain the filler. Gaps may remain inside the module. If it does so, there exists a possibility that the reliability of a solar cell module may fall.
  • the solar cell module according to the present invention includes a plurality of solar cells, a plurality of first wiring members that connect the solar cells, and a plurality of first wiring members that are connected to the first wiring member and guide the output of the solar cells to the outside.
  • 2 wiring material and a filler for sealing the solar cell, the first wiring material, and the second wiring material, the second wiring material is disposed so that a part thereof overlaps, and the filling material overlaps the first It is provided between the two wiring members without a gap.
  • a method for manufacturing a solar cell module according to the present invention is connected to a plurality of solar cells, a plurality of first wiring members that connect solar cells to each other, and a first wiring member, and guides the output of the solar cells to the outside.
  • a method for manufacturing a solar cell module comprising a plurality of second wiring members and a solar cell, a first wiring member, and a filler for sealing the second wiring member, wherein a part of the second wiring members overlap each other.
  • a step of arranging the second wiring material a step of inserting a resin member constituting a part of the filler between the overlapping second wiring materials, and a part of the filler on the light receiving surface of the solar cell
  • a step of laminating the first resin film constituting the second resin film constituting a part of the filler on the back surface of the solar cell, the resin member, the first resin film, and the second resin film Are thermocompression bonded to each other so that the solar cell, the first wiring material, and And a step of sealing the second wiring member.
  • the solar cell module according to the present invention it is possible to suppress a decrease in reliability.
  • FIG. 4 is an enlarged view of a part B in FIG. 3, illustrating an example of a configuration of a filler. It is the B section enlarged view of Drawing 3, and is a figure showing other examples of composition of a filler. It is a figure for demonstrating the manufacturing method of the solar cell module which is embodiment which concerns on this invention.
  • the solar cell module 10 which is embodiment which concerns on this invention is demonstrated in detail.
  • the present invention is not limited to the following embodiments.
  • the drawings referred to in the embodiments are schematically described, and the dimensional ratios of the components drawn in the drawings may be different from the actual products. Specific dimensional ratios and the like should be determined in consideration of the following description.
  • FIG. 1 is a plan view of the solar cell module 10 viewed from the light receiving surface side
  • FIG. 2 is a plan view of the solar cell module 10 viewed from the back surface side
  • FIG. 3 is a view showing a part of a cross section taken along the line AA of FIGS. 1 and 2 and showing a cross section of a portion where the second wiring members 19 overlap each other.
  • the solar cell module 10 includes a plurality of solar cells 11, a first protective member 12 disposed on the light receiving surface side of the solar cell 11, and a second protective member 13 disposed on the back surface side of the solar cell 11. That is, the solar cell 11 is sandwiched between the first protective member 12 and the second protective member 13.
  • the light receiving surfaces of the plurality of solar cells 11 are arranged side by side on the same plane.
  • the “light receiving surface” means a surface on which sunlight mainly enters from the outside of the solar cell 11. For example, more than 50% to 100% of the sunlight incident on the solar cell 11 enters from the light receiving surface side.
  • the “back surface” means a surface opposite to the light receiving surface.
  • the solar cell 11 includes a photoelectric conversion unit 30 which generates carriers (electrons and holes) by receiving sunlight, a light receiving surface electrode 31 provided on the light receiving surface of the photoelectric conversion unit 30, and the photoelectric conversion unit 30. And a back electrode 32 provided on the back surface. In the solar cell 11, carriers generated by the photoelectric conversion unit 30 are collected by the light receiving surface electrode 31 and the back surface electrode 32.
  • the photoelectric conversion unit 30 includes, for example, a semiconductor substrate such as a crystalline silicon substrate, a gallium arsenide (GaAs) substrate, or an indium phosphide (InP) substrate.
  • a semiconductor substrate such as a crystalline silicon substrate, a gallium arsenide (GaAs) substrate, or an indium phosphide (InP) substrate.
  • B p-type amorphous material doped with boron
  • a silicon layer was sequentially formed, and an i-type amorphous silicon layer and an n-type amorphous silicon layer doped with phosphorus (P) or the like were sequentially formed on the back surface of the n-type
  • An i-type amorphous silicon layer and an n-type amorphous silicon layer doped with phosphorus (P) or the like are sequentially formed on the light-receiving surface of the n-type single crystal silicon substrate.
  • a structure in which an i-type amorphous silicon layer and a p-type amorphous silicon layer doped with boron (B) or the like are sequentially formed on the back surface of the substrate.
  • the light receiving surface electrode 31 preferably includes a transparent conductive layer formed on the light receiving surface of the photoelectric conversion unit 30.
  • a transparent conductive layer As the transparent conductive layer, a transparent conductive oxide (TCO) in which tin (Sn), antimony (Sb), or the like is doped into a metal oxide such as indium oxide (In 2 O 3 ) or zinc oxide (ZnO) is applied. it can.
  • TCO transparent conductive oxide
  • the transparent conductive layer is preferably formed on the entire front and back surfaces of the photoelectric conversion unit 30.
  • the light receiving surface electrode 31 includes a plurality of (for example, 50) finger electrodes 33 and a plurality (for example, two) of bus bar electrodes 34.
  • the finger electrode 33 and the bus bar electrode 34 are preferably formed on the transparent conductive layer.
  • the finger electrode 33 is a thin line electrode that collects carriers from the entire photoelectric conversion unit 30.
  • the bus bar electrode 34 is an electrode wider than the finger electrode 33 and mainly collects carriers from the finger electrode 33.
  • the finger electrode 33 and the bus bar electrode 34 are arranged so as to cross each other and are electrically connected. These are formed, for example, by screen-printing a conductive paste in which conductive particles such as silver (Ag) are dispersed in a binder resin in a desired pattern on the light receiving surface of the photoelectric conversion unit 30.
  • the back surface electrode 32 preferably includes a plurality of finger electrodes 35, a plurality of bus bar electrodes 36, and a transparent conductive layer.
  • the number of the finger electrodes 35 may be set larger than that of the finger electrodes 33 and the interval may be set narrower.
  • a metal film such as a silver (Ag) thin film may be formed instead of the finger electrode 35.
  • the first protective member 12 a transparent substrate or film, for example, a glass substrate, a resin substrate, a resin film, or the like can be used.
  • the second protective member 13 the same glass substrate, resin substrate, resin film and the like as the first protective member 12 can be used.
  • the second protection member 13 may be an opaque substrate or film, and may be a metal substrate such as an aluminum plate, for example.
  • a filler 14 is provided between the first protective member 12 and the second protective member 13.
  • the filler 14 has a function of sealing the solar cell 11 and the like.
  • the filler 14 includes a first resin composition 15, a second resin composition 16, and a third resin composition 17, which will be described in detail later.
  • the solar cell module 10 further includes a first wiring member 18 that electrically connects the solar cells 11, and a second wiring member 19 that is electrically connected to the first wiring member 18 (part of which is the solar cell 11. ), A terminal portion 20 for electrically connecting the second wiring member 19 and an external device (not shown), and the first protection member 12 and the second protection. A frame 21 or the like attached to the end of the member 13 is provided.
  • the four second wiring members 19 (19a to 19d) and the lead wires extending from the external device are electrically connected.
  • the first wiring member 18 electrically connects the solar cells 11 together to form the string S.
  • the string S is a plurality of solar cells 11 connected in series and arranged in a row.
  • the solar cell module 10 includes a plurality of strings S, and FIG. 1 shows a configuration in which six strings S (S1 to S6) each having four solar cells 11 connected in series are arranged in parallel with each other. ing.
  • the first wiring member 18 is connected to, for example, the light receiving surface electrode 31 of one of the solar cells 11 disposed adjacent to the first wiring member 18 and connected to the back surface electrode 32 of the other solar cell 11. More specifically, the first wiring member 18 is soldered or resin-bonded to the bus bar electrode 34 of the light receiving surface electrode 31 of one solar cell 11 and the bus bar electrode 36 of the back surface electrode 32 of the other solar cell 11. Connected. That is, the 1st wiring material 18 bends in the thickness direction of the solar cell module 10 between the adjacent solar cells 11, and connects the adjacent solar cells 11 in series.
  • the second wiring member 19 includes second wiring members 19e to 19g for connecting adjacent strings S and the second wiring members 19a to 19d for electrically connecting the string S and the terminal portion 20.
  • Each of the plurality of second wiring members 19 is arranged close to the end of the string S so as to intersect the longitudinal direction of each string S and not touch the string S.
  • the first wiring member 18 and the second wiring member 19 are orthogonal to each other, the end of the first wiring member 18 extending from each string S, the second wiring member 19, Is connected.
  • the connection between the first wiring member 18 and the second wiring member 19 is made by soldering or a resin adhesive.
  • the second wiring material 19e connects the strings S1 and S2, the second wiring material 19f connects the strings S3 and S4, and the second wiring material 19g connects the strings S5 and S6.
  • the second wiring member 19a connects the string S1 and the terminal portion 20, and the second wiring member 19d connects the string S6 and the terminal portion 20, respectively.
  • the second wiring member 19b connects the string S2 and the string S3 and is also connected to the terminal unit 20.
  • the second wiring member 19c connects the string S4 and the string S5 and is also connected to the terminal portion 20.
  • the second wiring members 19a to 19d have a shape in which one end connected to the terminal portion 20 is bent in an L shape.
  • An insulating member 22 such as an insulating tape is attached to the portion bent in the L shape, and the insulation between the second wiring members 19a to 19d and the solar cell 11 is ensured.
  • the second wiring member 19 is arranged so that a part thereof overlaps with each other in order to increase the power generation amount per unit area and improve the module efficiency.
  • the second wiring members 19 connected to the terminal portion 20 are arranged so as to overlap each other, and the second wiring member 19a and the second wiring member 19b, and the second wiring member 19c and the second wiring member 19d. Respectively overlap in the thickness direction of the module.
  • the width of each of the second wiring members 19 can be set to be the same, and a portion where the second wiring members 19 overlap (hereinafter also referred to as “overlapping portion”) is viewed in plan view from the light receiving surface side and the back surface side. It is preferable to arrange them so that they appear as one when they are.
  • the filler 14 is inserted between the second wiring material 19a and the second wiring material 19b, and between the second wiring material 19c and the second wiring material 19d so as to be in close contact with each wiring material without any gap.
  • the terminal portion 20 is formed with openings for drawing out the second wiring members 19a to 19d to the outside. That is, a through hole is formed in the second protection member 13.
  • the terminal portion 20 includes, for example, a terminal block for connecting the second wiring members 19a to 19d and lead wires extending from the external device, and a terminal box that covers the terminal block and the opening. The opening is sealed with an appropriate sealing material as necessary so that moisture does not enter.
  • FIGS. 4 and 5 are both enlarged views of part B in FIG.
  • the form illustrated in FIG. 4 is different from the form illustrated in FIG. 5 only in the shape of the layer made of the third resin composition 17.
  • the filler 14 is provided in close contact not only with the solar cell 11 but also with the first wiring member 18 and the second wiring member 19.
  • the filler 14 includes a first resin composition 15 that covers the light receiving surface side of the solar cell 11, a second resin composition 16 that covers the back surface side of the solar cell 11, and an overlapping second wiring material 19. It is comprised including the 3rd resin composition 17 inserted without gap between them. Then, the second resin composition 16, the third resin composition 17, and the first resin composition 15 are laminated in this order from the second protective member 13 side. As will be described later, by using an appropriate resin composition, there is no gap at the interface of each layer, and good adhesiveness is exhibited.
  • the “gap” is a gap that can be detected by cross-sectional observation with a scanning electron microscope (SEM). Specifically, it means a gap having a maximum length of 50 nm or more. That is, in the solar cell module 10, it means that there is no gap of at least a maximum length of 50 nm or more between the overlapping second wiring members 19.
  • SEM scanning electron microscope
  • the first resin composition 15 is provided in layers so as to cover the light receiving surface side of all the solar cells 11.
  • the layer made of the first resin composition 15 has substantially the same area as the first protective member 12.
  • the 2nd resin composition 16 covers the back side of all the solar cells 11, and is provided in layered form.
  • the layer made of the second resin composition 16 has substantially the same area as the second protective member 13. Further, the thickness of each layer is preferably about 0.2 mm to 1.0 mm, for example, about 0.4 mm to 0.8 mm.
  • the third resin composition 17 is inserted without a gap between portions where the first resin composition 15 and the second resin composition 16 cannot enter, that is, between the overlapping second wiring members 19. Has the function of preventing mechanical contact. Moreover, the 3rd resin composition 17 has a function which prevents that the gap
  • the third resin composition 17 is provided so as to protrude from between the overlapping second wiring material 19a and the second wiring material 19b and between the overlapping second wiring material 19c and the second wiring material 19d. Is preferred. That is, the third resin composition 17 is provided in a wider range than the range where the second wiring members 19 overlap each other. In the present embodiment, the width (length in the short direction) and the length (length in the longitudinal direction) of the layer made of the third resin composition 17 are larger than the width and length of the overlapping portion, and from the entire periphery of the overlapping portion. It protrudes (see FIG. 1).
  • the width of the layer made of the third resin composition 17 is wider than the width of the second wiring member 19, for example, within a range not in contact with the string S and the frame 21.
  • the width of the material 19 is preferably 1.1 times or more, more preferably 1.5 times or more, and more than 2.0 times.
  • the layer made of the third resin composition 17 is arranged substantially parallel to the surface direction of the module. This form is formed, for example, when the melting point of the third resin composition 17 is higher than that of the first resin composition 15 and the second resin composition 16. Further, the second wiring members 19a and 19b are embedded in the third resin composition 17 and are in close contact with each other. In this embodiment, for example, the third resin composition 17 having a thickness larger than the distance between the second wiring member 19a and the second wiring member 19b that is overlapped is pushed into the third resin composition 17 in the thermocompression bonding step. Obtained by melting.
  • a part of the layer made of the third resin composition 17 is bent or curved toward the first protective member 12 side. More specifically, the portion protruding from the overlapping portion is unevenly distributed on the layer side made of the first resin composition 15.
  • the contact area between the portion protruding from the overlapping portion and the first resin composition 15 is larger than the contact area between the portion protruding from the overlapping portion and the second resin composition 16. This form is formed by arranging and laminating the first resin composition 15 on the vertically lower side, for example.
  • the solubility parameter (SP value) of both compositions is close, at least It is preferable that the main components are the same. In other words, it is preferable that the portion of the third resin composition 17 that protrudes from the overlapping portion is unevenly distributed on the resin composition side where the SP value is close to the first resin composition 15 and the second resin composition 16. .
  • Each resin composition constituting the filler 14 is, for example, a resin having high adhesion to the solar cell 11, the first wiring member 18, and the second wiring member 19 without melting in an environment irradiated with sunlight. It is preferable to use as a main component. Moreover, it is preferable that the resin as the main component is difficult to contain water.
  • the “main component” means a component having the largest weight ratio (% by weight) in the resin composition.
  • Each resin composition may be a composition composed of a plurality of resins, but from the viewpoint of productivity, etc., the resin as the main component (hereinafter also simply referred to as “main component”) is 50% by weight. % Or more of the composition is preferred. Furthermore, since it is suitable that the SP value of the composition is close, the proportion of the main component in the resin composition is more preferably 70% by weight or more, and particularly preferably 90% by weight or more.
  • Each resin composition can contain various additives. Additives include antioxidants, ultraviolet absorbers, weather resistance imparting agents, silane coupling agents, crosslinking agents, crosslinking aids (catalysts), tackifiers, white pigments such as titanium oxide (TiO 2 ), and the like. It can be illustrated. When light reception from the back surface side is not assumed, for example, by adding titanium oxide (TiO 2 ) to the second resin composition 16, the reflectance of light on the back surface side of the solar cell 11 is increased and the solar cell 11. The light receiving efficiency can be improved.
  • Additives include antioxidants, ultraviolet absorbers, weather resistance imparting agents, silane coupling agents, crosslinking agents, crosslinking aids (catalysts), tackifiers, white pigments such as titanium oxide (TiO 2 ), and the like. It can be illustrated. When light reception from the back surface side is not assumed, for example, by adding titanium oxide (TiO 2 ) to the second resin composition 16, the reflectance of light on the back surface
  • Each resin composition preferably has an SP value of 7.0 to 11.0, more preferably 7.3 to 10.0, from the viewpoint of moisture content and adhesion to the solar cell 11 and the like. It is particularly preferably 7.5 to 9.0. And the difference of each SP value of each resin composition is preferably less than 1.5, more preferably less than 1, and particularly preferably less than 0.5. If the difference in the SP value is within this range, the adhesiveness between the resin compositions is further improved, so that generation of a gap due to peeling of the layer interface or the like can be highly suppressed.
  • Each resin composition further preferably has a softening temperature of 60 ° C. to 150 ° C., particularly 65 ° C. to 130 ° C., from the viewpoints of heat resistance and productivity that do not melt in the use environment. preferable. And it is preferable that the softening temperature of each resin composition is mutually substantially the same.
  • the “softening temperature” is defined as a temperature at which a predetermined deformation occurs when a certain load is applied to the test sample.
  • the “substantially the same” softening temperature means that they can be regarded as the same or substantially the same, and specifically means that the difference in softening temperature is within a range of about 10%.
  • the melting points of the resin compositions are preferably substantially the same (the difference in melting point is within a range of about 10%).
  • the main component of the third resin composition 17 is preferably substantially the same as at least one of the main component of the first resin composition 15 and the main component of the second resin composition 16.
  • the main component of the first resin composition 15 and the main component of the third resin composition 17 are substantially the same, and the main component of the second resin composition 16 and the main component of the third resin composition 17 are different.
  • the main components of each resin composition are substantially the same. From the viewpoint of productivity, it is preferable that the main components of each resin composition are substantially the same.
  • the third resin composition 17 can be substantially the same as at least one of the first resin composition 15 and the second resin composition 16, that is, the entire composition including the additive can be made substantially the same.
  • the 1st resin composition 15 and the 3rd resin composition 17 are substantially the same, and the 2nd resin composition 16 and the 3rd resin composition 17 differ, or each resin composition is mutually substantially the same.
  • the filler 14 is composed of a single resin composition, and exhibits, for example, a single layer structure. Even when the filler 14 is composed of a single resin composition, as will be described later, if the filler 14 is formed by laminating three members, the interface of each member remains and the same kind of laminated structure is formed. May present.
  • the phrase “substantially the same” for the resin composition or its main component means that it can be regarded as the same or substantially the same as described above.
  • the difference in the copolymerization ratio of monomers constituting the main component is within a range of about 5%, and the difference in molecular weight (for example, weight average molecular weight). Is within the range of about 5%.
  • the case where the resin compositions can be regarded as substantially the same can be exemplified by the fact that the difference in the proportion of the weight of each constituent component is within the range of about 5%.
  • a polyolefin resin obtained by polymerizing at least one selected from ⁇ -olefins having 2 to 20 carbon atoms (for example, polyethylene (PE), polypropylene (PP), ethylene, etc.) And other ⁇ -olefin random or block copolymers), polyester resins (eg, polycondensates of polyols with polycarboxylic acids or their acid anhydrides / lower alkyl esters), polyurethane resins (eg, polyisocyanates) And active hydrogen group-containing compounds (such as polyaddition products of diols, polyol riols, dicarboxylic acids, polycarboxylic acids, polyamines, polythiols, etc.), epoxy resins (for example, polyepoxide ring-opening polymers, polyepoxides and active hydrogen groups) Polyaddition product with compound) And a copolymer (e.g., EVA or ion
  • those suitable as the main component are polyolefin resins, copolymers of alpha olefins with vinyl carboxylates, acrylate esters, or other vinyl monomers (for example, EVA and ionomers), especially polyolefins. Resins are preferred.
  • polyethylene including copolymers of ethylene and other ⁇ -olefins is particularly preferable.
  • each resin composition for example, all are composed mainly of polyolefin resin, all are composed mainly of polyolefin resin, and only second resin composition 16 contains titanium oxide (TiO 2 ).
  • Configuration, or configuration in which second resin composition 16 and third resin composition 17 contain titanium oxide (TiO 2 ), first resin composition 15 and second resin composition 16 are polyolefin resins, and third resin composition The structure etc. which make the thing 17 crosslinkable resin, such as EVA, can be illustrated.
  • FIG. 6 is a cross-sectional view showing each member constituting the solar cell module 10.
  • FIG. 6 shows a state in which the third resin composition 17 is inserted and laminated between the overlapping second wiring members 19.
  • the solar cell module 10 is preferably manufactured by a laminating process in which the constituent members are laminated and thermocompression bonded.
  • the first resin composition 15 and the second resin composition 16 are in the form of a film having a thickness of about 0.1 mm to 1.0 mm (hereinafter referred to as a first resin film 15p and a second resin film 16p, respectively).
  • the third resin composition 17 is supplied in the form of a small resin piece (hereinafter referred to as a resin member 17p) larger than the overlapping portion.
  • the solar cell 11 is manufactured by a known method (a detailed description of the manufacturing process of the solar cell 11 is omitted).
  • the 1st wiring material 18 is attached to the light-receiving surface electrode 31 and the back surface electrode 32 of the solar cell 11, and the several solar cell 11 arrange
  • a plurality of strings S are obtained.
  • the second wiring member 19 is attached to the first wiring member 18 extending from the end of the string S, and the strings S are electrically connected.
  • a part of the strings S and the terminal block of the terminal portion 20 are electrically connected by the second wiring member 19.
  • a part of the second wiring member 19a and a part of the second wiring member 19b, and a part of the second wiring member 19c and a part of the second wiring member 19d are overlapped in the thickness direction of the module. Be placed. In this way, a structure is obtained in which a part of the second wiring material 19 is arranged to overlap each other.
  • the resin member 17p is inserted between the overlapping second wiring material 19a and the second wiring material 19b and between the overlapping second wiring material 19c and the second wiring material 19d.
  • the resin member 17p a member larger than the overlapping portion is used, and a part thereof is inserted so as to protrude from the periphery between the overlapping second wiring members 19. If inserted in this way, even if the resin member 17p or the second wiring member 19 is misaligned in the laminating process or the like, the third resin composition 17 has no gap between the overlapping second wiring members 19. Can be filled.
  • the first resin film 15p is laminated on the first protective member 12, and the solar cell 11 is laminated on the first resin film 15p.
  • the second resin film 16p is laminated on the solar cell 11, and the second protective member 13 is laminated on the second resin film 16p. And it laminates by applying a pressure from the 2nd protective member 13 side, heating at the temperature which the 1st resin film 15p, the 2nd resin film 16p, and the resin member 17p fuse
  • the first resin film 15p, the second resin film 16p, and the resin member 17p are in close contact with each other without gaps, and the solar cell 11, the first protection member 12, the second protection member 13, and the first wiring member. 18 and the second wiring member 19 are also in close contact with each other without a gap.
  • a structure in which the solar cell 11 and the like are sealed with the filler 14 is obtained.
  • the first protective member 12 / first resin film 15p / solar cell 11 / second resin film 16p / second protective member 13 are stacked in this order to form a laminate, for example, in a vacuum state,
  • the laminate is integrated by thermocompression bonding.
  • the temperature of the hot plate for compressing the laminate is set to be equal to or higher than the melting temperature of each resin composition (for example, about 150 ° C.). Since the resin member 17p is inserted between the second wiring member 19a and the second wiring member 19b and between the second wiring member 19c and the second wiring member 19d, there is a gap between the overlapping portions.
  • a filler 14 is provided.
  • the solar cell module 10 a part of the second wiring material 19 is arranged so as to overlap in the thickness direction of the module. Thereby, the power generation amount per unit area can be increased and the module efficiency can be improved.
  • the filler 14 is inserted between the overlapping second wiring members 19 in close contact with the second wiring members 19 without any gaps. Thereby, while being able to ensure the insulation of the 2nd wiring materials 19 which overlap, mixing of impurities, such as a water
  • the solar cell 11 may have a so-called back junction structure in which the light receiving surface electrode 31 is not provided and an electrode is formed only on the back surface of the photoelectric conversion unit 30. Also in this case, a plurality of second wiring members 19 for guiding the output of the solar cell 11 to the outside are used. Then, a part of the second wiring material 19 is arranged so as to overlap each other in the thickness direction of the module, and a structure in which the filler 14 is inserted between the overlapping second wiring materials 19 without a gap can be formed.
  • the third resin composition 17 is described as protruding from the entire periphery of the overlapping portion.
  • the third resin composition 17 is provided so as to protrude from a part of the periphery of the overlapping portion. Form may be sufficient.

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

Afin de rendre minimale la présence d'espaces qui peuvent devenir des passages pour l'humidité et similaire dans un module dans une structure dans laquelle des matériaux de raccordement destinés à augmenter la production d'électricité par unité de surface sont disposés de manière superposée, un module de cellules solaires (10) comprend : une pluralité de cellules solaires (11) ; une pluralité de premiers matériaux de raccordement (18) qui connectent électriquement les cellules solaires (11) ; une pluralité de seconds matériaux de raccordement (19) qui sont connectés électriquement aux premiers matériaux de raccordement (18) et qui conduisent la sortie des cellules solaires (11) vers l'extérieur ; et une charge de remplissage (14) destinée à sceller les cellules solaires (11), les premiers matériaux de raccordement (18) et les seconds matériaux de raccordement (19). Les seconds matériaux de raccordement (19) sont disposés de telle sorte qu'une partie des seconds matériaux de raccordement (19) se chevauche. La charge de remplissage (14) est placée sur les seconds matériaux de raccordement (19) de telle sorte qu'il ne se trouve pas d'espaces entre les seconds matériaux de raccordement (19) chevauchant.
PCT/JP2011/066669 2011-07-22 2011-07-22 Module de cellules solaires et procédé de fabrication de celui-ci Ceased WO2013014723A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015029069A (ja) * 2013-06-27 2015-02-12 京セラ株式会社 太陽電池モジュール
CN110892540A (zh) * 2017-09-29 2020-03-17 积水化学工业株式会社 太阳能电池组件、以及太阳能电池组件的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278905A (ja) * 2005-03-30 2006-10-12 Sanyo Electric Co Ltd 太陽電池モジュール及びこれを備えた太陽電池装置
JP2011109129A (ja) * 2011-01-26 2011-06-02 Sanyo Electric Co Ltd 太陽電池モジュールの製造方法及び太陽電池装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278905A (ja) * 2005-03-30 2006-10-12 Sanyo Electric Co Ltd 太陽電池モジュール及びこれを備えた太陽電池装置
JP2011109129A (ja) * 2011-01-26 2011-06-02 Sanyo Electric Co Ltd 太陽電池モジュールの製造方法及び太陽電池装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015029069A (ja) * 2013-06-27 2015-02-12 京セラ株式会社 太陽電池モジュール
CN110892540A (zh) * 2017-09-29 2020-03-17 积水化学工业株式会社 太阳能电池组件、以及太阳能电池组件的制造方法

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