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WO2013006811A1 - Module de caméra à protection magnétique et procédé de fabrication - Google Patents

Module de caméra à protection magnétique et procédé de fabrication Download PDF

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Publication number
WO2013006811A1
WO2013006811A1 PCT/US2012/045796 US2012045796W WO2013006811A1 WO 2013006811 A1 WO2013006811 A1 WO 2013006811A1 US 2012045796 W US2012045796 W US 2012045796W WO 2013006811 A1 WO2013006811 A1 WO 2013006811A1
Authority
WO
WIPO (PCT)
Prior art keywords
voice coil
image sensor
module
magnetic shield
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2012/045796
Other languages
English (en)
Inventor
Hong Wei PHOON
Giap Chye TOH
Yeow Thiam OOI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flextronics AP LLC
Original Assignee
Flextronics AP LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flextronics AP LLC filed Critical Flextronics AP LLC
Publication of WO2013006811A1 publication Critical patent/WO2013006811A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053—Driving means for the movement of one or more optical element
    • G03B2205/0069—Driving means for the movement of one or more optical element using electromagnetic actuators, e.g. voice coils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10—Power-operated focusing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Definitions

  • the disclosure herein relates generally to electronic devices, and more particularly to digital camera modules. Even more particularly, it relates to a digital camera module manufacturing technique.
  • Digital camera modules are currently being incorporated into a variety of electronic devices.
  • Such camera hosting devices include, but are not limited to, cellular telephones, personal digital assistants (PDAs), and computers.
  • PDAs personal digital assistants
  • the demand for digital camera modules continues to grow as the ability to incorporate the camera modules into host devices expands. Therefore, one design goal of digital camera modules is to make them as small as possible so that they will fit into an electronic device without substantially increasing the overall size of the device. Means for achieving this goal must, of course, preserve the quality of the image captured by the camera modules.
  • Such digital camera modules typically include a substrate, an image capture device, a housing, and a lens unit.
  • the substrate is typically a printed circuit board (PCB) that includes circuitry to facilitate data exchange between the image capture device and the host device.
  • the image capture device is mounted and electrically coupled to the circuitry of the PCB.
  • the housing is then mounted on the PCB over the image capture device.
  • the housing includes an opening that receives and centers the lens unit with respect to the image capture device.
  • the housing may include a voice coil motor (VCM) module for adjusting the position of the lens unit.
  • VCM voice coil motor
  • the VCM module may include components such as a frame, permanent magnets, one or more springs, and an EMI shield.
  • the magnets produce a strong magnetic field and will interact with another magnet nearby, such as if another VCM module is nearby.
  • An example of this is shown in Figure 1 .
  • This can present challenges in array manufacturing. Repelling forces from the magnets inside the VCM modules can cause inconsistent repelling distances, in one case in the range of 3.0-4.0 mm. Accordingly, larger spacing between image sensors on the silicon (minimum unit to unit gap 4.50 mm) may be required. This spacing increases the cost per camera module significantly.
  • the EMI shield is designed to significantly block electromagnetic interference or flux, but does not significantly block magnetic flux.
  • One approach to addressing this problem is to increase the unit to unit gap. That is, increase the unit to unit gap to 4.50 mm in order to minimize the repelling force between the VCM. (Refer to panel layout in FIG. 2).
  • One problem with this approach is that it results in inefficient and costly use of the silicon.
  • Another problem is that the reduced unit quantity per silicon wafer results in a low VCM attach machine throughput (measured in units per hour, or UPH).
  • FIG. 3 Another approach to addressing this problem includes the singulation method illustrated in FIG. 3.
  • the image sensors on the silicon can be singulated and attached onto a copper frame with greater spacing than on the silicon.
  • the singulation method is an additional process that increases the manufacturing cost. Also, the singulation method tends to generate particulate debris that can degrade the image quality of the camera module and cause high yield loss.
  • What is needed, therefore, is a camera module manufacturing technique that is allows for small module spacing in array processing.
  • a method for manufacturing camera modules that includes: providing a plurality of image sensors on a substrate, including a first and a second image sensor that are adjacent to each other; providing a plurality of VCM modules, including a first and a second VCM module, each VCM module adapted for attachment to an image sensor; providing a plurality of magnetic shields, including a first and a second magnetic shield, each shield adapted for placement over a VCM module; placing the first magnetic shield on the first VCM module and the second magnetic shield on the second VCM module; attaching the first VCM module, with the first magnetic shield thereon, to the first image sensor; and attaching the second VCM module, with the second magnetic shield thereon, to the second image sensor.
  • the method may further include moving the first and second image sensor, with the VCM modules and magnetic shields thereon, away from each other.
  • the method may further include removing the magnetic shields from the VCM modules.
  • the magnetic shields may include high magnetic permeability metal alloy material.
  • a camera module that includes: an image sensor; a VCM module attached to the image sensor; and a magnetic shield attached to the camera module so as to surround the VCM module.
  • the magnetic shield significantly reduces a magnetic field from the VCM module in the immediate vicinity around the exterior of the magnetic shield.
  • the magnetic shield may include high magnetic permeability metal alloy material.
  • a method of manufacturing camera modules comprising providing a plurality of image sensors affixed to a substrate, applying an adhesive to the substrate generally around the perimeter of each image sensor, providing a first voice coil motor and associated movable lens, associating a magnetic shield with the first voice coil motor and lens, positioning the first voice coil motor, lens and associated magnetic shield on the adhesive associated with a first image sensor, providing a second voice coil motor and associated movable lens, associating a second magnetic shield with the second voice coil motor and lens, and positioning the second voice coil motor, lens and associated magnetic shield closely adjacent the first voice coil motor, lens and associated first magnetic shield, wherein the distance separating the first and second voice coil motors is reduced due to the presence of the magnetic shields.
  • the number of camera modules assembled on the substrate may be increased compared to the number of camera modules that could be assembled on the substrate in the absence of the magnetic shields.
  • the magnetic shield associated with each voice coil motor and lens may be reused with a different voice coil motor and lens after the adhesive is cured to bond the first voice coil motor to the first image sensor.
  • the magnetic shield is associated with a voice coil motor after the voice coil motor is positioned on adhesive associated with an image sensor.
  • the magnetic shield is associated with the voice coil motor before the voice coil motor is positioned on adhesive associated with an image sensor.
  • the magnetic shield remains associated with the voice coil motor and is included in the final electronic device as part of the camera module.
  • multiple magnetic shields comprise a single, integral structure.
  • the electromagnetic shield of the voice coil motor is eliminated from the voice coil motor assembly and is replaced by the magnetic shield.
  • the term camera module refers to an individual voice coil motor lens and associated image sensor bonded to a printed circuit board or substrate. Multiple voice coil motors and associated lens and image sensors mounted on a single printed circuit board or substrate is referred to as a camera assembly on a printed circuit board.
  • Figure 1 is a perspective view of the repelling force generated by permanent magnets of two adjacent voice coil motors;
  • Figure 2 is a plan view of a wafer with a plurality of image sensors defined thereon, the spacing between individual image sensors being relatively high;
  • Figure 3 is a process flow of a method for singulating image sensors and significantly spacing them apart from each other before assembling camera modules;
  • Figures 4a, 4b, and 4c are perspective views of portions of a camera module, with the three views showing various degrees of explosion;
  • Figure 5 is a schematic view of an array of image sensors, an array of VCM modules, and an array of magnetic shield caps;
  • Figure 6 is a schematic view of an array of image sensors and an array of VCM modules with magnetic shield caps applied thereto;
  • Figure 7 is a schematic view of an array of image sensors with VCM modules and magnetic shield caps applied thereto;
  • Figure 8 is a schematic view like Figure 7, with the magnetic shield caps removed therefrom;
  • Figure 9 is a plan view of a wafer with a plurality of image sensors defined thereon, the spacing between individual image sensors being relatively lower than the wafer of Figure 2.
  • FIGS 4a-4c are exploded views of a VCM-based camera module 10.
  • the camera module 10 includes an axially-movable lens 12, a frame member 14, a voice coil motor top spring 16, an electromagnetic interference (EMI) shield 18, a yoke 20, a base 22, and an image sensor 34.
  • the voice coil motor (formed by the frame 14, spring 16, EMI shield 18, yoke 20, and base 22) serves to adjust the position of the lens 12.
  • the voice coil motor of the camera module 10 includes one or more permanent magnets 24 fixed to the yoke 20 and a wire coil associated with the lens housing 28. The coil comprises a number of turns of wire and is positioned radially inwardly from the permanent magnet 24.
  • an electromagnetic field is created which interacts with the magnetic field of the permanent magnet 24 to move the lens 12 and drive the lens 12 outwardly or inwardly along its optical axis 30.
  • Changing direction of the current flowing in the coil causes the lens to move in opposite directions. Moving the lens along its optical axis 30, towards or away from the image sensor 34, to focus a target image on the image sensor 34.
  • One or more springs 16 are utilized to assist in maintaining the orientation of the lens 12 within the camera module 10 and relative to the image sensor 34 and to provide a known resistive or opposing force to the movement imparted by the voice coil motor on the lens 12.
  • the permanent magnet 24 is generally in the form of a ring or cylinder or may comprise a plurality of arc-shaped magnets which are arranged around the perimeter of the inner wall of the yoke 20.
  • the permanent magnet(s) or magnets generates or creates a magnetic flux field that is always present.
  • the coil in combination with the yoke also creates a flux field when current flows through the coil. This latter flux field creates what is known as electromagnetic interference (EMI), which may adversely affect nearby or adjacent electrical circuits.
  • EMI shield 18 is designed to reduce the adverse effects of EMI on surrounding electronics once the VCM is installed in an electronic device and is in operation with current flowing through the coil.
  • the magnetic flux field created by the permanent magnet adversely affects the manufacturing process and, potentially, the acceptable production yield of camera modules. More specifically, the repelling force or magnetic interference from the permanent magnet(s) inside VCMs in adjacent or proximally located camera modules can cause the camera modules to physically shift or move. This is particularly problematic during the manufacturing step of adhering the VCMs to image sensors 34 on a printed circuit board or substrate where an adhesive is used to bond these two components to a printed circuit board to create camera modules. Alignment of the VCM relative to the image sensor 34 is a critical step in achieving a camera module that outputs acceptable images.
  • VCMs and associated image sensors 34 a sufficient distance apart from adjacent or proximately positioned VCMs and associated image sensors 34 such that, during the time period before the bonding adhesive fully cures, the repelling force or magnetic interference of nearby permanent magnets does not cause the position of a voice coil motor to shift relative to its associated image sensor 34.
  • the existing EMI shields 18 are not designed to resolve this problem, but are designed solely to restrict electromagnetic flux created by the coil and yoke when current is flowing in the coil.
  • Figure 5 includes a schematic view of an array of image sensors 34, such as complementary metal oxide semiconductor (CMOS) image sensors or charge coupled device (CCD) image sensors.
  • CMOS complementary metal oxide semiconductor
  • CCD charge coupled device
  • the image sensors 34 may be already attached to a single substrate, each attached to a separate substrate, each attached together (e.g., as part of a wafer), or otherwise arranged.
  • a plurality of VCMs ready for attachment to the image sensors and a plurality of magnetic shield caps 50 ready for attachment thereto.
  • An optical axis 38 is shown for a representative one of the image sensors 34 and an optical axis 30 for a representative one of the lenses.
  • an epoxy or other adhesive 36 is positioned around the outside of the active area of each of the sensors 34. As part of the
  • the magnetic shield caps 50 are each placed over a corresponding one of the VCMs.
  • the VCMs (with the magnetic shield caps thereon) are next affixed to the image sensors 34 via the adhesive associated with each individual image sensor 34.
  • This may be accomplished with robotics, such as a pick and place machine, or manually.
  • the entire array of assembled camera modules (with magnetic shield caps thereon) may then be positioned within an oven to cause curing of the adhesive 36 such that the VCM camera module and image sensor 34 are effectively bonded together to form a camera module.
  • the optical axis 30 of the lens 12 can be kept in alignment with the optical axis 38 of the image sensor 34, since the magnetic shield caps 50 help to prevent the magnetic flux from the permanent magnets in the VCMs from affecting the relative positioning of adjacent VCMs.
  • the adhesive is described as having been applied to the top surface of the image sensor 34, it may
  • VCMs may alternatively be applied to a substrate to which the image sensor 34 is applied.
  • some other means of connection of the VCMs to the image sensors may be achieved.
  • the assembled camera modules may be separated or singulated resulting in individual camera modules, depending on whether the image sensors were still part of a wafer or otherwise arranged.
  • the image sensors 34 were arranged in four 4 x 4 arrays of image sensors. In this
  • the illustrated area is approximately 62 millimeters by 237 millimeters, and the individual image sensors are 8.5 millimeters by 8.5 millimeters and separated by a distance "d.”
  • the distance "d" in the array shown in Fig. 2 is approximately 4.5 millimeters.
  • the image sensors cover approximately 32% of the surface area of the illustrated area, and 64 camera modules may be assembled in this space without magnetic interference causing undesired movement of adjacent VCMs.
  • the repelling force of the permanent magnets can be substantially constrained or controlled by adding one of the magnetic shield caps 50 on top of each VCM.
  • FIG. 5 An illustration of four of the magnetic shield caps is shown in Figure 5.
  • the magnetic shield cap 50 is positioned over the VCM before it is positioned on the adhesive 36 on the image sensor 34.
  • the magnetic shield cap 50 constrains and controls the flux generated by the permanent magnets.
  • the shield cap 50 includes four side wall panels 46 that generally match the size of the side walls 48 of the VCM.
  • the upper panel 51 is shown with an opening 52 such that it does not interfere with the optical functioning of the lens 12.
  • An example of material used for the magnetic shield cap 50 is a Co-Netic® foil product, Model AA6F006-4, made by Magnetic Shield Corporation of Bensenville, Illinois, having a thickness of 0.15 millimeters.
  • foil ranging in thickness from approximately 0.05 millimeters to 0.25 millimeters can provide effective shielding with minimum tooling costs, although other thicknesses may also suffice.
  • many alternative versions of this material will work, with thicker shielding providing a higher shielding effect.
  • the caps have been shown as having an opening corresponding with the lens, but that may not be necessary in instances where the cap will be removed prior to operation.
  • Table 1 Set forth below in Table 1 is a comparison of repelling distance in millimeters of two adjacent VCMs of the same construction. Fifteen tests were performed involving 30 VCMs of the same construction. In the first test, the repelling distance was determined without a magnetic shield cap 50 in place. In the second test, the repelling distance was determined with a magnetic shield cap 50 in place. For purposes of this test, the foregoing identified Co-Netic Foil AA6F006-4 having a thickness of 0.15 millimeters.
  • the average repelling distance was slightly under 5 millimeters, specifically 4.9866 millimeters.
  • the average repelling distance was reduced by a factor of 33 to 0.1518 millimeters. The resulting effect is that by using magnetic shield caps 50 during the adhesive curing stage of the
  • adjacent VCMs may be positioned closer together to increase the through-put of the manufacturing process and reduce costs without sacrificing quality or yield.
  • Fig. 9 using a magnetic shield, the same illustrated area as depicted in Fig. 7 may comfortably hold 100 camera modules 10 during the curing process with the distance "d" separating the VCM camera assemblies modules approximately 1 .75 millimeters. As a result, the number of camera modules 10 increases by more than 50% using a substrate of the same size.
  • the data in Table 1 shows that the VCMs may be positioned even closer together utilizing a magnetic shield cap 50. However, the limiting factor is the ability for other tooling to cut the substrate and singulate the individual camera modules from each other.
  • the magnetic shield caps 50 are removed from the camera modules 10 following curing of the adhesive, either prior to or following singulation. The removed magnetic shield caps 50 may then be reused during the curing process of a subsequent batch of camera modules, thereby achieving further savings from re-use of the magnetic shield caps 50. Alternatively, it should be appreciated that the magnetic shield caps 50 may remain in place and be included into the final camera module. In such circumstances, the electromagnetic interference shield 18 may be completely removed from the VCM and replaced by the magnetic shield cap 50.
  • the magnetic shield cap 50 will control both the magnetic flux generated by the permanent magnets during the manufacturing process and also the EMI shielding needed to control the electromagnetic flux generated by the electromagnetics sufficient to meet applicable standards.
  • multiple magnetic shield caps may be formed in a single integral piece. Such a structure may reduce the manufacturing through put time and increase efficiencies in the manufacturing process.
  • shields made of high magnetic permeability metal alloys can be used, such as sheets of Permalloy and Mu-metal or with nanocrystalline grain structure ferromagnetic metal coatings. These materials do not block the magnetic field, as with electric shielding, but rather draw the field into the material, providing a path for the magnetic field lines around the shielded volume.
  • One optimal shape for magnetic shields is thus a closed container surrounding the shielded volume.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente invention se rapporte à un procédé de fabrication de modules de caméra à utiliser dans des dispositifs électroniques portatifs, tels que des téléphones mobiles. Plus spécifiquement, dans des modules de caméra utilisant un actionnement à mise au point automatique du type à mouvement de lentille, des aimants permanents associés à des moteurs de bobine acoustique utilisés dans le système de mise au point automatique génèrent un flux magnétique qui peut interférer avec le processus de liaison de capteurs d'image à des modules de caméra si les aimants permanents de différents moteurs de bobine acoustique sont trop serrés. L'incorporation d'une protection magnétique lors du processus de fabrication pour limiter ou réguler le flux magnétique généré par les aimants permanents permet aux modules de caméra à moteurs de bobine acoustique d'être positionnés plus serrés au cours du processus de fabrication. Cela augmente le rendement de fabrication et réduit le coût.
PCT/US2012/045796 2011-07-06 2012-07-06 Module de caméra à protection magnétique et procédé de fabrication Ceased WO2013006811A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161504778P 2011-07-06 2011-07-06
US61/504,778 2011-07-06

Publications (1)

Publication Number Publication Date
WO2013006811A1 true WO2013006811A1 (fr) 2013-01-10

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PCT/US2012/045796 Ceased WO2013006811A1 (fr) 2011-07-06 2012-07-06 Module de caméra à protection magnétique et procédé de fabrication

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US (1) US9143664B2 (fr)
WO (1) WO2013006811A1 (fr)

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