[go: up one dir, main page]

WO2013002201A1 - Display panel - Google Patents

Display panel Download PDF

Info

Publication number
WO2013002201A1
WO2013002201A1 PCT/JP2012/066234 JP2012066234W WO2013002201A1 WO 2013002201 A1 WO2013002201 A1 WO 2013002201A1 JP 2012066234 W JP2012066234 W JP 2012066234W WO 2013002201 A1 WO2013002201 A1 WO 2013002201A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
frame
display panel
substrate
color filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/066234
Other languages
French (fr)
Japanese (ja)
Inventor
榎本 弘美
中村 仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2013002201A1 publication Critical patent/WO2013002201A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133514Colour filters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133388Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region

Definitions

  • the present invention relates to a display panel, and particularly to a display panel provided with a color filter substrate.
  • a liquid crystal display device mounted on a portable electronic device or the like includes a display panel and a backlight device.
  • the display panel includes a color filter substrate on which a color filter layer is formed, and displays a color image when irradiated with light from a backlight device.
  • FIG. 14 is a cross-sectional view showing the structure of a display panel according to a conventional example.
  • a display panel 1001 according to a conventional example includes an active matrix substrate 1002 on which a TFT (Thin Film Transistor) element (not shown) is formed, and a color filter substrate 1003 arranged to face the active matrix substrate 1002.
  • TFT Thin Film Transistor
  • a color filter layer (not shown) is formed on the color filter substrate 1003. Accordingly, the display panel 1001 displays a color image by being irradiated with the backlight.
  • a transparent plate 1006 is fixed on the color filter substrate 1003 via an adhesive tape 1005. This transparent plate 1006 has a function of protecting the entire display panel 1001.
  • a resin layer 1007 made of black resin ink is formed on the surface of the transparent plate 1006 on the color filter substrate 1003 side.
  • the resin layer 1007 forms a frame pattern, and an opening of the resin layer 1007 defines a display area.
  • the resin layer 1007 has a thickness of about 10 ⁇ m to 20 ⁇ m and is formed by printing black resin ink on the surface of the transparent plate 1006 (the surface on the color filter substrate 1003 side).
  • a display panel in which a transparent plate is provided on a color filter substrate is disclosed in, for example, Patent Document 1.
  • a step of about 10 ⁇ m to 20 ⁇ m is formed by the resin layer 1007. Therefore, when the transparent plate 1006 is bonded to the color filter substrate 1003, as shown in FIG. Bubbles 1010 may be mixed in the vicinity. For this reason, there exists a problem that an external appearance quality falls and a yield falls.
  • the present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a display panel capable of suppressing deterioration in appearance quality due to mixing of bubbles and reduction in yield due thereto. Is to provide.
  • a display panel of the present invention includes an active matrix substrate, a color filter substrate disposed opposite to the active matrix substrate, a liquid crystal layer disposed between the active matrix substrate and the color filter substrate, A sealing member for enclosing a liquid crystal layer between the active matrix substrate and the color filter substrate, the color filter substrate including a display region for displaying an image, and a frame region arranged around the display region, A frame layer representing at least one of a frame pattern, a mark, and a pattern is formed in a portion outside the seal member in the frame region.
  • a mark is a concept including characters, figures, symbols, and the like.
  • the pattern includes various patterns such as a checkered pattern, a striped pattern, a floral pattern, a polka dot pattern, and a check pattern.
  • a frame layer representing at least one of a frame pattern, a mark, and a pattern is formed in a portion outside the seal member in the frame region.
  • the frame layer is preferably formed of the same material as the layer formed in the display area of the color filter substrate. If comprised in this way, a frame layer can be formed in the same manufacturing process as the layer formed in a display area.
  • the layer formed in the display region includes a black matrix layer, and the frame layer is formed of the same material as the black matrix layer. Is formed. If comprised in this way, a frame layer can be made black.
  • the layer formed in the display region includes a color filter layer, and the frame layer is formed of the same material as the color filter layer. Is formed. If comprised in this way, a frame layer can be made into a color and a design property can be improved.
  • the frame layer is preferably formed to have substantially the same thickness as the layer formed in the display region. If comprised in this way, a frame layer can be simultaneously formed using a common mask in the same manufacturing process as the layer formed in a display area.
  • the frame layer is preferably made of a metal material. If comprised in this way, a frame layer can be made into a metallic color and glossiness can be provided.
  • the frame layer includes a frame forming portion representing a frame pattern and a logo / pattern forming portion representing at least one of a mark and a pattern, and the frame forming portion and the logo / pattern forming portion are mutually connected. It is made of different color materials. If comprised in this way, a logo and a pattern formation part can be made easy to see. That is, the visibility of a mark or a pattern can be improved.
  • a light-shielding layer is provided on the inner side of the seal member and is formed of the same material as the black matrix layer, and the frame layer has a predetermined distance from the light-shield layer. Are arranged apart from each other.
  • the frame layer may be formed of a material different from that of the black matrix layer.
  • the seal member is preferably disposed between the frame layer and the light shielding layer.
  • a light shielding layer is provided on the inner side of the seal member and is formed of the same material as the black matrix layer, and the frame layer is formed to be connected to the light shielding layer. It may be.
  • the seal member is preferably bonded to the color filter substrate via the frame layer.
  • the color filter substrate is preferably formed using a tempered glass substrate. If comprised in this way, it can suppress that a display panel is damaged by external force.
  • the color filter substrate is preferably formed using a resin substrate. If comprised in this way, a display panel can be reduced in weight.
  • an IC mounting region in which an IC is mounted is provided on one side of the active matrix substrate, and the color filter substrate protrudes on the other side with respect to the active matrix substrate.
  • the color filter substrate can be disposed away from the IC mounting region, and therefore, it is possible to suppress the IC from contacting the color filter substrate when mounting the IC in the IC mounting region. That is, it is possible to prevent the IC from being in contact with the color filter substrate and being unable to be mounted on the active matrix substrate.
  • the frame layer includes a logo / pattern forming portion representing at least one of a mark and a pattern, and the logo / pattern forming portion is disposed on the other side portion of the color filter substrate. . Since the mark and the pattern need to have a certain size, the width of the part of the frame layer where the logo / pattern forming part is formed becomes large. For this reason, the color filter substrate can be easily separated from the IC mounting area by arranging the logo / pattern forming portion on the other side of the color filter substrate (position away from the IC mounting area of the active matrix substrate). Can be arranged.
  • the frame layer includes a frame forming portion representing a frame pattern, and the frame forming portion may be provided with an opening representing at least one of a mark and a pattern.
  • the frame layer includes a logo / pattern forming portion representing at least one of a mark and a pattern
  • the logo / pattern forming portion includes two of the color filter substrates in the longitudinal direction of the color filter substrate. It may be formed at least on the side. If comprised in this way, design property can be improved.
  • the frame layer includes a logo / pattern forming portion representing at least one of a mark and a pattern
  • the logo / pattern forming portion is a color filter substrate in a short direction of the color filter substrate. It may be formed at least on two sides. If comprised in this way, design property can be improved.
  • a frame layer representing at least one of a frame pattern, a mark, and a pattern is formed on the outer side of the seal member in the frame region.
  • FIG. 1 is a perspective view schematically showing a structure of a display panel according to a first embodiment of the present invention.
  • 1 is a cross-sectional view illustrating a structure of a display panel according to a first embodiment of the present invention.
  • 1 is a cross-sectional view illustrating a structure of a display panel according to a first embodiment of the present invention.
  • 1 is a cross-sectional view illustrating a structure of a display panel according to a first embodiment of the present invention.
  • 1 is a cross-sectional view illustrating a structure of a display panel according to a first embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a structure of a display panel according to a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a structure of a display panel according to a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a structure of a display panel according to a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a structure of a display panel according to a third embodiment of the present invention.
  • FIG. 6 is a perspective view schematically showing a structure of a display panel according to a fourth embodiment of the present invention.
  • 6 is a cross-sectional view illustrating a structure of a display panel according to a fourth embodiment of the present invention.
  • FIG. It is the perspective view which showed schematically the structure of the display panel by the 1st modification of this invention.
  • the display panel 1 constitutes a liquid crystal display device mounted on, for example, a portable electronic device, and is irradiated with light from a backlight device (not shown). To display an image.
  • the display panel 1 is not limited to a transmissive type, and may be a reflective type or a transflective type display panel.
  • the display panel 1 includes a TFT substrate 10, a CF (color filter) substrate 20 disposed opposite to the TFT substrate 10, and a liquid crystal disposed between the TFT substrate 10 and the CF substrate 20.
  • a layer 30 (see FIG. 2) and a sealing member 40 (see FIG. 2) for enclosing the liquid crystal layer 30 between the TFT substrate 10 and the CF substrate 20 are provided.
  • the TFT substrate 10 is an example of the “active matrix substrate” in the present invention.
  • the TFT substrate 10 includes an insulating substrate having translucency.
  • a TFT element, a wiring pattern, an alignment film, and the like (not shown) are formed on the insulating substrate.
  • the CF substrate 20 includes a rectangular display area 20a for displaying an image, and a frame area 20b arranged around the display area 20a.
  • the CF substrate 20 includes an insulating substrate 21 having translucency, a BM (black matrix) layer 22 formed on the lower surface of the insulating substrate 21 (the surface on the TFT substrate 10 side), and a color filter layer. 23, a light shielding layer 24 and a frame layer 25.
  • the BM layer 22, the color filter layer 23, and the light shielding layer 24 are examples of the “layer formed in the display region” in the present invention.
  • the insulating substrate 21 is formed of a glass substrate, a tempered glass substrate, a resin substrate, or the like.
  • the resin used for the resin substrate include acrylic resin, PMMA (polymethyl methacrylate), and plastic.
  • the BM layer 22 is provided in the display area 20a and is formed in a lattice shape.
  • a red layer 23R, a green layer 23G, and a blue layer 23B of the color filter layer 23 are provided between the lattices of the BM layer 22, respectively.
  • the BM layer 22, the red layer 23R, the green layer 23G, and the blue layer 23B are made of black, red, green, and blue resins, respectively, and have a thickness of about 100 nm, for example.
  • a common electrode and an alignment film (not shown) are provided so as to cover the color filter layer 23.
  • the light shielding layer 24 is disposed inside the sealing member 40 along the sealing member 40 and around the BM layer 22 and the color filter layer 23.
  • the light shielding layer 24 has a width of about 1 mm or less and has a function of preventing the TFT element (not shown) of the TFT substrate 10 from being visible from the outside at the edge of the display region 20a.
  • the light shielding layer 24 is formed of the same material (resin) as that of the BM layer 22 and is simultaneously formed in the same manufacturing process as that of the BM layer 22.
  • the light shielding layer 24 may be formed so as to be connected to the BM 22.
  • the sealing member 40 is provided around the light shielding layer 24.
  • the sealing member 40 adheres the TFT substrate 10 and the CF substrate 20 to enclose the liquid crystal layer 30.
  • the seal member 40 contains, for example, a black pigment and has a light shielding property.
  • the pigment contained in the sealing member 40 is not limited to black and can be changed as appropriate.
  • the seal member 40 can also be red, green, blue and metal colors, for example, and the seal member 40 can be the same color as the frame layer 25 or a different color from the frame layer 25. is there.
  • the frame layer 25 is provided around the seal member 40 and is disposed in the frame region 20b together with the seal member 40.
  • the frame layer 25 is disposed at a predetermined interval from the light shielding layer 24, and the seal member 40 is disposed between the frame layer 25 and the light shielding layer 24.
  • the frame layer 25 has a width of about several millimeters to several tens of millimeters.
  • a logo is formed on one side in the longitudinal direction of the CF substrate 20 (A direction side). Since the portion 25b (logo / pattern forming portion) is provided, one side of the frame layer 25 on the A direction side is formed with a large width.
  • the frame layer 25 includes a frame forming portion 25a representing a frame pattern and a logo forming portion 25b representing a mark (characters, figures, symbols, etc.).
  • the frame forming portion 25a is formed of the same material (resin) as the BM layer 22 and the light shielding layer 24, and is formed simultaneously in the same manufacturing process as the BM layer 22 and the light shielding layer 24.
  • the frame forming portion 25a is simultaneously formed using a common mask designed for the BM layer 22, the light shielding layer 24, and the frame forming portion 25a.
  • the frame forming portion 25 a is formed to have substantially the same thickness as the BM layer 22 and the light shielding layer 24.
  • the frame forming portion 25a may be formed so as to be connected to the light shielding layer 24 as shown in FIG. In this case, the seal member 40 is bonded to the insulating substrate 21 through the frame forming portion 25a.
  • the logo forming portion 25b (see FIG. 3) is formed of the same material (resin) as the red layer 23R, the green layer 23G, or the blue layer 23B of the color filter layer 23, and the red layer 23R, the green layer 23G, or the blue layer 23B They are formed simultaneously in the same manufacturing process. That is, the logo forming portion 25b is simultaneously formed using a common mask designed for the red layer 23R, the green layer 23G or the blue layer 23B and the logo forming portion 25b. For this reason, the logo formation part 25b is formed in the same thickness as the red layer 23R, the green layer 23G, or the blue layer 23B.
  • the metal material include titanium, aluminum, tungsten, and molybdenum used for the gate electrode (not shown) of the TFT element of the TFT substrate 10.
  • the frame layer 25 representing the frame pattern and the mark is formed on the outer side of the seal member 40 in the frame region 20b.
  • the frame layer 25 is formed of the same material and the same thickness as the BM layer 22 and the color filter layer 23 formed in the display region 20a. As a result, the frame layer 25 can be formed simultaneously using the same mask in the same manufacturing process as the BM layer 22 and the color filter layer 23. Moreover, since the BM layer 22 and the color filter layer 23 are small in thickness, the thickness of the frame layer 25 can be reduced.
  • the frame pattern can be made to be a commonly used black.
  • the frame forming portion 25a and the logo forming portion 25b are different from each other by forming the frame forming portion 25a with the BM layer 22 and forming the logo forming portion 25b with the color filter layer 23 or a metal material. Can be formed into color. Thereby, the logo formation part 25b can be made easy to see. That is, the visibility of the mark can be improved.
  • the seal member 40 can be bonded to the insulating substrate 21 of the CF substrate 20 without the frame layer 25 interposed therebetween. . Thereby, it can suppress that the adhesive strength of the sealing member 40 falls.
  • the display panel 1 can be prevented from being damaged by an external force.
  • the display panel 1 can be reduced in weight. Further, if the TFT substrate 10 is also formed using a resin substrate, the display panel 1 can be configured to be bendable.
  • the frame forming portion 125a of the frame layer 125 is the same material (resin) as the red layer 23R, the green layer 23G, or the blue layer 23B of the color filter layer 23. It is formed by.
  • the frame forming portion 125a is simultaneously formed in the same manufacturing process as the red layer 23R, the green layer 23G, or the blue layer 23B.
  • the logo forming portion 125b (logo / pattern forming portion) of the frame layer 125 may be simultaneously formed in the same manufacturing process as the BM layer 22 and the light shielding layer 24 as shown in FIG. That is, the logo forming part 125b may be formed with the same material (resin) as the BM layer 22 and the light shielding layer 24 and with the same thickness. Moreover, the logo formation part 125b may be simultaneously formed in the same manufacturing process as the red layer 23R, the green layer 23G, or the blue layer 23B of the color filter layer 23, as shown in FIG.
  • the logo forming portion 125b may be formed with the same thickness (the same material and resin) as the red layer 23R, the green layer 23G, or the blue layer 23B of the color filter layer 23.
  • the frame forming portion 125a and the logo forming portion 125b are formed of the same material as two different layers of the red layer 23R, the green layer 23G, and the blue layer 23B, respectively.
  • the frame pattern can be colored, and the design can be improved.
  • the frame forming portion 225a of the frame layer 225 is formed of a metal material.
  • the metal material include titanium, aluminum, tungsten, and molybdenum used for the gate electrode (not shown) of the TFT element of the TFT substrate 10.
  • the frame pattern can be made into a metallic color and gloss can be imparted.
  • the CF substrate 20 protrudes toward the A direction with respect to the TFT substrate 10, and the TFT substrate 10 faces the CF substrate 20. It protrudes on the opposite side to the A direction (B direction side). That is, the CF substrate 20 is arranged so as to be shifted with respect to the TFT substrate 10.
  • the logo forming portion 25b of the frame layer 25 is provided in a portion on the A direction side of the CF substrate 20 (a portion opposite to an IC mounting region 10a described later).
  • the side having the largest width among the four sides of the frame layer 25 is provided in a portion on the A direction side of the CF substrate 20 (a portion on the side opposite to the IC mounting region 10a).
  • an IC mounting area 10 a and an FPC (Flexible Printed Circuit) mounting area 10 b are provided in a portion on the B direction side of the TFT substrate 10.
  • An IC 302 that drives the display panel 301 is mounted in the IC mounting area 10a, and an FPC 303 that supplies a signal to the IC 302 is mounted in the FPC mounting area 10b.
  • the IC mounting area 10a and the FPC mounting area 10b are disposed at a predetermined distance from the CF substrate 20 in the B direction, and the CF substrate 20 is not disposed on the IC mounting area 10a and the FPC mounting area 10b.
  • the other structure of the fourth embodiment is the same as that of the first to third embodiments.
  • the CF substrate 20 protrudes toward the A direction with respect to the TFT substrate 10.
  • the CF substrate 20 can be disposed away from the IC mounting region 10a, and therefore, the IC 302 can be prevented from contacting the CF substrate 20 when the IC 302 is mounted in the IC mounting region 10a. That is, it is possible to suppress the IC 302 from coming into contact with the CF substrate 20 and being unable to mount the IC 302 on the TFT substrate 10.
  • the logo forming portion 25b is disposed in the portion of the CF substrate 20 on the A direction side. Since the mark needs to have a certain size, the width of the portion of the frame layer 25 where the logo forming portion 25b is formed becomes large. For this reason, the CF substrate 20 can be easily separated from the IC mounting region 10a by arranging the logo forming portion 25b in the portion on the A direction side of the CF substrate 20 (a position away from the IC mounting region 10a of the TFT substrate 10). Can be arranged.
  • the frame layer includes a frame formation portion and a logo formation portion (logo / pattern formation portion) is shown, but the present invention is not limited to this.
  • the frame layer may include only the frame forming part, or may include only the logo / pattern forming part.
  • a logo forming part representing a mark is provided as an example of a logo / pattern forming part, but the present invention is not limited to this.
  • a logo / pattern forming part representing both a mark and a pattern may be provided, or a pattern forming part representing a pattern may be provided.
  • one side of the frame area 20b on the A direction side is formed with a large width
  • a logo forming portion is formed on the A direction side of the frame area 20b.
  • this invention is not restricted to this.
  • the portions on the C direction side and D direction side (both sides in the short direction of the CF substrate 20) of the frame region 20b are also formed with a large width.
  • a pattern forming portion 25d (logo / pattern forming portion) representing a pattern may be provided at that portion.
  • the A direction side, the B direction side, the C direction side, and the D direction side of the frame region 20b are all formed to have a large width.
  • a pattern forming portion 25d (logo / pattern forming portion) representing a pattern may be provided in that portion.
  • a protective transparent plate made of tempered glass or the like may be provided on the CF substrate.
  • a resin layer of several tens of ⁇ m on the transparent plate it is possible to suppress air bubbles from being mixed between the display panel and the transparent plate.
  • the present invention is not limited to this.
  • a circuit included in the IC may be formed on the TFT substrate in the same manner as the TFT element.
  • Display panel 10 TFT substrate 10a IC mounting area 20 CF substrate (color filter substrate) 20a display area 20b frame area 22 BM layer (layer formed in display area, black matrix layer) 23 Color filter layer (layer formed in the display area) 24 light shielding layer (layer formed in display area) 25, 125, 225 Frame layer 25a, 125a, 225a Frame forming part 25b, 125b Logo forming part (logo / pattern forming part) 25c opening 25d pattern formation part (logo / pattern formation part) 30 Liquid crystal layer 40 Sealing member 302 IC

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)

Abstract

Provided is a display panel configured so as to prevent the degradation of the quality of appearance due to the inclusion of bubbles and to prevent a reduction in the yield rate due to the degradation in the quality of appearance. A display panel (1) is provided with a TFT board (10), a CF board (20), a liquid crystal layer (30), and a seal member (40). The CF board includes a display region (20a) which displays an image and a frame region (20b) which is disposed around the display region. A frame layer (25) displaying at least one of a frame pattern, a mark or a design pattern is formed in the portion of the frame region which is on the outer side of the seal member.

Description

表示パネルDisplay panel

 この発明は、表示パネルに関し、特に、カラーフィルタ基板を備えた表示パネルに関する。 The present invention relates to a display panel, and particularly to a display panel provided with a color filter substrate.

 従来、携帯型電子機器などに搭載される液晶表示装置は、表示パネルおよびバックライト装置を備えている。表示パネルはカラーフィルタ層が形成されたカラーフィルタ基板を含んでおり、バックライト装置から光が照射されることにより、カラー画像を表示する。 Conventionally, a liquid crystal display device mounted on a portable electronic device or the like includes a display panel and a backlight device. The display panel includes a color filter substrate on which a color filter layer is formed, and displays a color image when irradiated with light from a backlight device.

 図14は従来の一例による表示パネルの構造を示した断面図である。従来の一例による表示パネル1001は図14に示すように、TFT(Thin Film Transistor)素子(図示せず)が形成されたアクティブマトリクス基板1002と、アクティブマトリクス基板1002に対向配置されるカラーフィルタ基板1003と、アクティブマトリクス基板1002およびカラーフィルタ基板1003の間に配置される液晶層1004と、アクティブマトリクス基板1002およびカラーフィルタ基板1003の間に液晶層1004を封入するためのシール部材(図示せず)とを備えている。 FIG. 14 is a cross-sectional view showing the structure of a display panel according to a conventional example. As shown in FIG. 14, a display panel 1001 according to a conventional example includes an active matrix substrate 1002 on which a TFT (Thin Film Transistor) element (not shown) is formed, and a color filter substrate 1003 arranged to face the active matrix substrate 1002. A liquid crystal layer 1004 disposed between the active matrix substrate 1002 and the color filter substrate 1003, and a seal member (not shown) for enclosing the liquid crystal layer 1004 between the active matrix substrate 1002 and the color filter substrate 1003 It has.

 カラーフィルタ基板1003には図示しないカラーフィルタ層が形成されている。これにより、表示パネル1001はバックライト光が照射されることによりカラー画像を表示する。カラーフィルタ基板1003上には粘着テープ1005を介して透明板1006が固定されている。この透明板1006は表示パネル1001全体を保護する機能を有する。透明板1006のカラーフィルタ基板1003側の面には、黒色の樹脂インクからなる樹脂層1007が形成されている。この樹脂層1007は額縁パターンを形成しており、樹脂層1007の開口部が表示領域を規定している。また、樹脂層1007は10μm~20μm程度の厚みを有するとともに、透明板1006の表面(カラーフィルタ基板1003側の面)上に黒色の樹脂インクを印刷することにより形成されている。 A color filter layer (not shown) is formed on the color filter substrate 1003. Accordingly, the display panel 1001 displays a color image by being irradiated with the backlight. A transparent plate 1006 is fixed on the color filter substrate 1003 via an adhesive tape 1005. This transparent plate 1006 has a function of protecting the entire display panel 1001. A resin layer 1007 made of black resin ink is formed on the surface of the transparent plate 1006 on the color filter substrate 1003 side. The resin layer 1007 forms a frame pattern, and an opening of the resin layer 1007 defines a display area. The resin layer 1007 has a thickness of about 10 μm to 20 μm and is formed by printing black resin ink on the surface of the transparent plate 1006 (the surface on the color filter substrate 1003 side).

 なお、カラーフィルタ基板上に透明板が設けられた表示パネルは、例えば特許文献1に開示されている。 A display panel in which a transparent plate is provided on a color filter substrate is disclosed in, for example, Patent Document 1.

特開2009-175531号公報JP 2009-175531 A

 しかしながら、従来の一例による表示パネル1001では、樹脂層1007により10μm~20μm程度の段差が形成されるので、透明板1006をカラーフィルタ基板1003に接着する際に図15に示すように、樹脂層1007周辺に気泡1010が混入する場合がある。このため、外観品位が低下して歩留まりが低下するという問題点がある。 However, in the display panel 1001 according to the conventional example, a step of about 10 μm to 20 μm is formed by the resin layer 1007. Therefore, when the transparent plate 1006 is bonded to the color filter substrate 1003, as shown in FIG. Bubbles 1010 may be mixed in the vicinity. For this reason, there exists a problem that an external appearance quality falls and a yield falls.

 この発明は、上記のような課題を解決するためになされたものであり、この発明の目的は、気泡の混入による外観品位の低下と、それによる歩留まりの低下を抑制することが可能な表示パネルを提供することである。 The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a display panel capable of suppressing deterioration in appearance quality due to mixing of bubbles and reduction in yield due thereto. Is to provide.

 上記目的を達成するために、この発明の表示パネルは、アクティブマトリクス基板と、アクティブマトリクス基板に対向配置されるカラーフィルタ基板と、アクティブマトリクス基板およびカラーフィルタ基板の間に配置される液晶層と、アクティブマトリクス基板およびカラーフィルタ基板の間に液晶層を封入するためのシール部材と、を備え、カラーフィルタ基板は画像を表示する表示領域と、表示領域の周囲に配置される額縁領域とを含み、額縁領域のうちのシール部材よりも外側の部分には、額縁パターン、標章および模様の少なくとも1つを表す額縁層が形成されている。なお、本明細書および請求の範囲において、標章とは文字、図形、記号等を含む概念である。また、模様とは、例えば市松模様、縞模様、花柄模様、水玉模様、チェック柄模様等の様々な模様が含まれる。 In order to achieve the above object, a display panel of the present invention includes an active matrix substrate, a color filter substrate disposed opposite to the active matrix substrate, a liquid crystal layer disposed between the active matrix substrate and the color filter substrate, A sealing member for enclosing a liquid crystal layer between the active matrix substrate and the color filter substrate, the color filter substrate including a display region for displaying an image, and a frame region arranged around the display region, A frame layer representing at least one of a frame pattern, a mark, and a pattern is formed in a portion outside the seal member in the frame region. In the present specification and claims, a mark is a concept including characters, figures, symbols, and the like. The pattern includes various patterns such as a checkered pattern, a striped pattern, a floral pattern, a polka dot pattern, and a check pattern.

 この表示パネルでは、上記のように、額縁領域のうちのシール部材よりも外側の部分には、額縁パターン、標章および模様の少なくとも1つを表す額縁層が形成されている。これにより、額縁パターンなどを形成するために、従来のように透明板に樹脂層を形成し、その透明板をカラーフィルタ基板上に粘着テープなどを介して取り付ける必要がない。このため、樹脂層周辺に気泡が混入することによる歩留まりの低下といった問題とは無縁である。 In this display panel, as described above, a frame layer representing at least one of a frame pattern, a mark, and a pattern is formed in a portion outside the seal member in the frame region. Thus, in order to form a frame pattern or the like, there is no need to form a resin layer on a transparent plate as in the prior art and attach the transparent plate to the color filter substrate via an adhesive tape or the like. For this reason, there is no problem with a decrease in yield due to air bubbles mixed in around the resin layer.

 上記表示パネルにおいて、好ましくは、額縁層はカラーフィルタ基板の表示領域に形成される層と同じ材料により形成されている。このように構成すれば、額縁層を表示領域に形成される層と同じ製造工程で形成することができる。 In the above display panel, the frame layer is preferably formed of the same material as the layer formed in the display area of the color filter substrate. If comprised in this way, a frame layer can be formed in the same manufacturing process as the layer formed in a display area.

 上記額縁層が表示領域に形成される層と同じ材料により形成されている表示パネルにおいて、好ましくは、表示領域に形成される層はブラックマトリクス層を含み、額縁層はブラックマトリクス層と同じ材料により形成されている。このように構成すれば、額縁層を黒色にすることができる。 In the display panel in which the frame layer is formed of the same material as the layer formed in the display region, preferably, the layer formed in the display region includes a black matrix layer, and the frame layer is formed of the same material as the black matrix layer. Is formed. If comprised in this way, a frame layer can be made black.

 上記額縁層が表示領域に形成される層と同じ材料により形成されている表示パネルにおいて、好ましくは、表示領域に形成される層はカラーフィルタ層を含み、額縁層はカラーフィルタ層と同じ材料により形成されている。このように構成すれば、額縁層をカラーにすることができ、デザイン性を向上させることができる。 In the display panel in which the frame layer is formed of the same material as the layer formed in the display region, preferably, the layer formed in the display region includes a color filter layer, and the frame layer is formed of the same material as the color filter layer. Is formed. If comprised in this way, a frame layer can be made into a color and a design property can be improved.

 上記額縁層が表示領域に形成される層と同じ材料により形成されている表示パネルにおいて、好ましくは、額縁層は表示領域に形成される層と実質的に同じ厚みに形成されている。このように構成すれば、額縁層を表示領域に形成される層と同じ製造工程で共通のマスクを用いて同時に形成することができる。 In the display panel in which the frame layer is formed of the same material as the layer formed in the display region, the frame layer is preferably formed to have substantially the same thickness as the layer formed in the display region. If comprised in this way, a frame layer can be simultaneously formed using a common mask in the same manufacturing process as the layer formed in a display area.

 上記表示パネルにおいて、好ましくは、額縁層は金属材料により形成されている。このように構成すれば、額縁層を金属色にして光沢感を付与することができる。 In the display panel, the frame layer is preferably made of a metal material. If comprised in this way, a frame layer can be made into a metallic color and glossiness can be provided.

 上記表示パネルにおいて、好ましくは、額縁層は額縁パターンを表す額縁形成部と、標章および模様の少なくとも一方を表すロゴ・模様形成部とを含み、額縁形成部およびロゴ・模様形成部は、互いに異なる色の材料により形成されている。このように構成すれば、ロゴ・模様形成部を見えやすくすることができる。すなわち、標章や模様の視認性を向上させることができる。 In the display panel, preferably, the frame layer includes a frame forming portion representing a frame pattern and a logo / pattern forming portion representing at least one of a mark and a pattern, and the frame forming portion and the logo / pattern forming portion are mutually connected. It is made of different color materials. If comprised in this way, a logo and a pattern formation part can be made easy to see. That is, the visibility of a mark or a pattern can be improved.

 上記表示パネルにおいて、好ましくは、シール部材の内側には、シール部材に沿って配置され、ブラックマトリクス層と同じ材料により形成される遮光層が設けられており、額縁層は遮光層から所定の間隔を隔てて配置されている。この場合、額縁層をブラックマトリクス層とは異なる材料により形成してもよい。 In the display panel, preferably, a light-shielding layer is provided on the inner side of the seal member and is formed of the same material as the black matrix layer, and the frame layer has a predetermined distance from the light-shield layer. Are arranged apart from each other. In this case, the frame layer may be formed of a material different from that of the black matrix layer.

 上記額縁層が遮光層から所定の間隔を隔てて配置されている表示パネルにおいて、好ましくは、シール部材は額縁層と遮光層との間に配置されている。 In the display panel in which the frame layer is disposed at a predetermined interval from the light shielding layer, the seal member is preferably disposed between the frame layer and the light shielding layer.

 上記表示パネルにおいて、シール部材の内側には、シール部材に沿って配置され、ブラックマトリクス層と同じ材料により形成される遮光層が設けられており、額縁層は遮光層に連結するように形成されていてもよい。 In the display panel, a light shielding layer is provided on the inner side of the seal member and is formed of the same material as the black matrix layer, and the frame layer is formed to be connected to the light shielding layer. It may be.

 上記額縁層が遮光層に連結するように形成されている表示パネルにおいて、好ましくは、シール部材は額縁層を介してカラーフィルタ基板に接着している。 In the display panel in which the frame layer is formed so as to be connected to the light shielding layer, the seal member is preferably bonded to the color filter substrate via the frame layer.

 上記表示パネルにおいて、好ましくは、カラーフィルタ基板は強化ガラス基板を用いて形成されている。このように構成すれば、表示パネルが外力により損傷するのを抑制することができる。 In the above display panel, the color filter substrate is preferably formed using a tempered glass substrate. If comprised in this way, it can suppress that a display panel is damaged by external force.

 上記表示パネルにおいて、好ましくは、カラーフィルタ基板は樹脂基板を用いて形成されている。このように構成すれば、表示パネルを軽量化することができる。 In the display panel, the color filter substrate is preferably formed using a resin substrate. If comprised in this way, a display panel can be reduced in weight.

 上記表示パネルにおいて、好ましくは、アクティブマトリクス基板の一方側の部分には、ICが実装されるIC実装領域が設けられており、カラーフィルタ基板はアクティブマトリクス基板に対して他方側に突出している。このように構成すれば、カラーフィルタ基板をIC実装領域から離して配置することができるので、IC実装領域にICを実装する際にICがカラーフィルタ基板に接触するのを抑制することができる。すなわち、ICがカラーフィルタ基板に接触してICをアクティブマトリクス基板に実装できなくなるのを、抑制することができる。 In the display panel, preferably, an IC mounting region in which an IC is mounted is provided on one side of the active matrix substrate, and the color filter substrate protrudes on the other side with respect to the active matrix substrate. With this configuration, the color filter substrate can be disposed away from the IC mounting region, and therefore, it is possible to suppress the IC from contacting the color filter substrate when mounting the IC in the IC mounting region. That is, it is possible to prevent the IC from being in contact with the color filter substrate and being unable to be mounted on the active matrix substrate.

 上記表示パネルにおいて、好ましくは、額縁層は標章および模様の少なくとも一方を表すロゴ・模様形成部を含み、ロゴ・模様形成部はカラーフィルタ基板のうちの前記他方側の部分に配置されている。標章や模様はある程度の大きさが必要なので、額縁層のうちのロゴ・模様形成部が形成される部分の幅は大きくなる。このため、ロゴ・模様形成部をカラーフィルタ基板のうちの他方側の部分(アクティブマトリクス基板のIC実装領域から離れた位置)に配置することによって、カラーフィルタ基板を容易にIC実装領域から離して配置することができる。 In the display panel, preferably, the frame layer includes a logo / pattern forming portion representing at least one of a mark and a pattern, and the logo / pattern forming portion is disposed on the other side portion of the color filter substrate. . Since the mark and the pattern need to have a certain size, the width of the part of the frame layer where the logo / pattern forming part is formed becomes large. For this reason, the color filter substrate can be easily separated from the IC mounting area by arranging the logo / pattern forming portion on the other side of the color filter substrate (position away from the IC mounting area of the active matrix substrate). Can be arranged.

 上記表示パネルにおいて、好ましくは、額縁層は額縁パターンを表す額縁形成部を含み、額縁形成部には、標章および模様の少なくとも一方を表す開口部が設けられていてもよい。 In the display panel, preferably, the frame layer includes a frame forming portion representing a frame pattern, and the frame forming portion may be provided with an opening representing at least one of a mark and a pattern.

 上記表示パネルにおいて、好ましくは、額縁層は標章および模様の少なくとも一方を表すロゴ・模様形成部を含み、ロゴ・模様形成部は、カラーフィルタ基板のうちの、カラーフィルタ基板の長手方向の2辺に少なくとも形成されていてもよい。このように構成すれば、デザイン性を向上させることができる。 In the above display panel, preferably, the frame layer includes a logo / pattern forming portion representing at least one of a mark and a pattern, and the logo / pattern forming portion includes two of the color filter substrates in the longitudinal direction of the color filter substrate. It may be formed at least on the side. If comprised in this way, design property can be improved.

 上記表示パネルにおいて、好ましくは、額縁層は標章および模様の少なくとも一方を表すロゴ・模様形成部を含み、ロゴ・模様形成部は、カラーフィルタ基板のうちの、カラーフィルタ基板の短手方向の2辺に少なくとも形成されていてもよい。このように構成すれば、デザイン性を向上させることができる。 In the display panel, preferably, the frame layer includes a logo / pattern forming portion representing at least one of a mark and a pattern, and the logo / pattern forming portion is a color filter substrate in a short direction of the color filter substrate. It may be formed at least on two sides. If comprised in this way, design property can be improved.

 以上のように、本発明によれば、額縁領域のうちのシール部材よりも外側の部分には、額縁パターン、標章および模様の少なくとも1つを表す額縁層が形成されている。これにより、額縁パターンなどを形成するために、従来のように透明板に樹脂層を形成し、その透明板をカラーフィルタ基板上に粘着テープなどを介して取り付ける必要がない。このため、樹脂層周辺に気泡が混入することがない。これにより、本発明では、表示パネルの外観品位が低下して歩留まりが低下するのを防止することができる。 As described above, according to the present invention, a frame layer representing at least one of a frame pattern, a mark, and a pattern is formed on the outer side of the seal member in the frame region. Thus, in order to form a frame pattern or the like, there is no need to form a resin layer on a transparent plate as in the prior art and attach the transparent plate to the color filter substrate via an adhesive tape or the like. For this reason, bubbles are not mixed around the resin layer. Thereby, in this invention, it can prevent that the external appearance quality of a display panel falls and a yield falls.

本発明の第1実施形態による表示パネルの構造を概略的に示した斜視図である。1 is a perspective view schematically showing a structure of a display panel according to a first embodiment of the present invention. 本発明の第1実施形態による表示パネルの構造を示した断面図である。1 is a cross-sectional view illustrating a structure of a display panel according to a first embodiment of the present invention. 本発明の第1実施形態による表示パネルの構造を示した断面図である。1 is a cross-sectional view illustrating a structure of a display panel according to a first embodiment of the present invention. 本発明の第1実施形態による表示パネルの構造を示した断面図である。1 is a cross-sectional view illustrating a structure of a display panel according to a first embodiment of the present invention. 本発明の第1実施形態による表示パネルの構造を示した断面図である。1 is a cross-sectional view illustrating a structure of a display panel according to a first embodiment of the present invention. 本発明の第2実施形態による表示パネルの構造を示した断面図である。FIG. 6 is a cross-sectional view illustrating a structure of a display panel according to a second embodiment of the present invention. 本発明の第2実施形態による表示パネルの構造を示した断面図である。FIG. 6 is a cross-sectional view illustrating a structure of a display panel according to a second embodiment of the present invention. 本発明の第2実施形態による表示パネルの構造を示した断面図である。FIG. 6 is a cross-sectional view illustrating a structure of a display panel according to a second embodiment of the present invention. 本発明の第3実施形態による表示パネルの構造を示した断面図である。FIG. 6 is a cross-sectional view illustrating a structure of a display panel according to a third embodiment of the present invention. 本発明の第4実施形態による表示パネルの構造を概略的に示した斜視図である。FIG. 6 is a perspective view schematically showing a structure of a display panel according to a fourth embodiment of the present invention. 本発明の第4実施形態による表示パネルの構造を示した断面図である。6 is a cross-sectional view illustrating a structure of a display panel according to a fourth embodiment of the present invention. FIG. 本発明の第1変形例による表示パネルの構造を概略的に示した斜視図である。It is the perspective view which showed schematically the structure of the display panel by the 1st modification of this invention. 本発明の第2変形例による表示パネルの構造を概略的に示した斜視図である。It is the perspective view which showed schematically the structure of the display panel by the 2nd modification of this invention. 従来の一例による表示パネルの構造を示した断面図である。It is sectional drawing which showed the structure of the display panel by an example of the past. 従来の一例による表示パネルの樹脂層周辺に気泡が混入した状態を示した拡大断面図である。It is the expanded sectional view which showed the state in which the bubble mixed in the resin layer periphery of the display panel by a prior art example.

 以下、本発明の実施形態について図面を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(第1実施形態)
 図1~図5を参照して、本発明の第1実施形態による表示パネル1の構造について説明する。
(First embodiment)
The structure of the display panel 1 according to the first embodiment of the present invention will be described with reference to FIGS.

 本発明の第1実施形態による表示パネル1は、例えば携帯型の電子機器などに搭載される液晶表示装置を構成するものであって、バックライト装置(図示せず)から光が照射されることにより画像を表示する。なお、表示パネル1は透過型に限らず、反射型や半透過型の表示パネルであってもよい。 The display panel 1 according to the first embodiment of the present invention constitutes a liquid crystal display device mounted on, for example, a portable electronic device, and is irradiated with light from a backlight device (not shown). To display an image. The display panel 1 is not limited to a transmissive type, and may be a reflective type or a transflective type display panel.

 表示パネル1は図1および図2に示すように、TFT基板10と、TFT基板10に対向配置されるCF(カラーフィルタ)基板20と、TFT基板10およびCF基板20の間に配置される液晶層30(図2参照)と、TFT基板10およびCF基板20の間に液晶層30を封入するためのシール部材40(図2参照)とを備えている。なお、TFT基板10は本発明の「アクティブマトリクス基板」の一例である。 As shown in FIGS. 1 and 2, the display panel 1 includes a TFT substrate 10, a CF (color filter) substrate 20 disposed opposite to the TFT substrate 10, and a liquid crystal disposed between the TFT substrate 10 and the CF substrate 20. A layer 30 (see FIG. 2) and a sealing member 40 (see FIG. 2) for enclosing the liquid crystal layer 30 between the TFT substrate 10 and the CF substrate 20 are provided. The TFT substrate 10 is an example of the “active matrix substrate” in the present invention.

 TFT基板10は透光性を有する絶縁基板を含んでいる。絶縁基板上には図示しないTFT素子、配線パターンおよび配向膜などが形成されている。 The TFT substrate 10 includes an insulating substrate having translucency. A TFT element, a wiring pattern, an alignment film, and the like (not shown) are formed on the insulating substrate.

 CF基板20は画像を表示する長方形状の表示領域20aと、表示領域20aの周囲に配置される額縁領域20bとを含んでいる。CF基板20は図2に示すように、透光性を有する絶縁基板21と、絶縁基板21の下面(TFT基板10側の面)上に形成されたBM(ブラックマトリクス)層22、カラーフィルタ層23、遮光層24および額縁層25とを含んでいる。なお、BM層22、カラーフィルタ層23および遮光層24は、本発明の「表示領域に形成される層」の一例である。 The CF substrate 20 includes a rectangular display area 20a for displaying an image, and a frame area 20b arranged around the display area 20a. As shown in FIG. 2, the CF substrate 20 includes an insulating substrate 21 having translucency, a BM (black matrix) layer 22 formed on the lower surface of the insulating substrate 21 (the surface on the TFT substrate 10 side), and a color filter layer. 23, a light shielding layer 24 and a frame layer 25. The BM layer 22, the color filter layer 23, and the light shielding layer 24 are examples of the “layer formed in the display region” in the present invention.

 絶縁基板21はガラス基板、強化ガラス基板または樹脂基板などにより形成されている。なお、樹脂基板に用いる樹脂としては、アクリル樹脂、PMMA(ポリメチルメタクリレート)およびプラスチックなどが挙げられる。 The insulating substrate 21 is formed of a glass substrate, a tempered glass substrate, a resin substrate, or the like. Examples of the resin used for the resin substrate include acrylic resin, PMMA (polymethyl methacrylate), and plastic.

 BM層22は表示領域20aに設けられているとともに、格子状に形成されている。BM層22の各格子間には、カラーフィルタ層23の赤色層23R、緑色層23Gおよび青色層23Bがそれぞれ設けられている。BM層22、赤色層23R、緑色層23Gおよび青色層23Bはそれぞれ黒色、赤色、緑色および青色の樹脂により形成されているとともに、例えば100nm程度の厚みに形成されている。カラーフィルタ層23を覆うように、図示しない共通電極および配向膜などが設けられている。 The BM layer 22 is provided in the display area 20a and is formed in a lattice shape. A red layer 23R, a green layer 23G, and a blue layer 23B of the color filter layer 23 are provided between the lattices of the BM layer 22, respectively. The BM layer 22, the red layer 23R, the green layer 23G, and the blue layer 23B are made of black, red, green, and blue resins, respectively, and have a thickness of about 100 nm, for example. A common electrode and an alignment film (not shown) are provided so as to cover the color filter layer 23.

 遮光層24はシール部材40の内側において、シール部材40に沿って配置されているとともに、BM層22およびカラーフィルタ層23の周囲に設けられている。遮光層24は約1mm以下の幅を有するとともに、表示領域20aの縁部においてTFT基板10のTFT素子(図示せず)が外部から見えるのを防止する機能を有する。遮光層24はBM層22と同じ材料(樹脂)により形成されており、BM層22と同じ製造工程で同時に形成されている。なお、遮光層24はBM22に連結するように形成されていてもよい。 The light shielding layer 24 is disposed inside the sealing member 40 along the sealing member 40 and around the BM layer 22 and the color filter layer 23. The light shielding layer 24 has a width of about 1 mm or less and has a function of preventing the TFT element (not shown) of the TFT substrate 10 from being visible from the outside at the edge of the display region 20a. The light shielding layer 24 is formed of the same material (resin) as that of the BM layer 22 and is simultaneously formed in the same manufacturing process as that of the BM layer 22. The light shielding layer 24 may be formed so as to be connected to the BM 22.

 シール部材40は遮光層24の周囲に設けられている。シール部材40はTFT基板10とCF基板20とを接着して液晶層30を封入している。シール部材40は例えば黒色顔料を含有しており、遮光性を有する。なお、シール部材40に含有させる顔料は黒色に限らず適宜変更可能である。このため、シール部材40を例えば赤色、緑色、青色および金属色にすることも可能であり、シール部材40を額縁層25と同じ色にしたり、額縁層25とは異なる色にすることが可能である。 The sealing member 40 is provided around the light shielding layer 24. The sealing member 40 adheres the TFT substrate 10 and the CF substrate 20 to enclose the liquid crystal layer 30. The seal member 40 contains, for example, a black pigment and has a light shielding property. In addition, the pigment contained in the sealing member 40 is not limited to black and can be changed as appropriate. For this reason, the seal member 40 can also be red, green, blue and metal colors, for example, and the seal member 40 can be the same color as the frame layer 25 or a different color from the frame layer 25. is there.

 額縁層25はシール部材40の周囲に設けられているとともに、シール部材40と共に額縁領域20bに配置されている。額縁層25は遮光層24から所定の間隔を隔てて配置されており、シール部材40は額縁層25と遮光層24との間に配置されている。額縁層25は数mm~数十mm程度の幅を有する。なお、額縁層25は4辺が同じ幅に形成されていてもよいが、本実施形態では図1に示すように、CF基板20の長手方向の一方側(A方向側)に後述するロゴ形成部25b(ロゴ・模様形成部)を設けるので、額縁層25のうちのA方向側の1辺が大きい幅に形成されている。 The frame layer 25 is provided around the seal member 40 and is disposed in the frame region 20b together with the seal member 40. The frame layer 25 is disposed at a predetermined interval from the light shielding layer 24, and the seal member 40 is disposed between the frame layer 25 and the light shielding layer 24. The frame layer 25 has a width of about several millimeters to several tens of millimeters. Although the frame layer 25 may be formed with the same width on all four sides, in this embodiment, as shown in FIG. 1, a logo is formed on one side in the longitudinal direction of the CF substrate 20 (A direction side). Since the portion 25b (logo / pattern forming portion) is provided, one side of the frame layer 25 on the A direction side is formed with a large width.

 額縁層25は図3に示すように、額縁パターンを表す額縁形成部25aと、標章(文字、図形、記号等)を表すロゴ形成部25bとを含む。本実施形態では、額縁形成部25aはBM層22および遮光層24と同じ材料(樹脂)により形成されており、BM層22および遮光層24と同じ製造工程で同時に形成されている。すなわち、額縁形成部25aは、BM層22、遮光層24および額縁形成部25a用に設計された共通のマスクを用いて同時に形成されている。このため、額縁形成部25aはBM層22および遮光層24と実質的に同じ厚みに形成されている。なお、額縁形成部25aは図4に示すように、遮光層24に連結するように形成されていてもよい。この場合、シール部材40は額縁形成部25aを介して絶縁基板21に接着する。 As shown in FIG. 3, the frame layer 25 includes a frame forming portion 25a representing a frame pattern and a logo forming portion 25b representing a mark (characters, figures, symbols, etc.). In the present embodiment, the frame forming portion 25a is formed of the same material (resin) as the BM layer 22 and the light shielding layer 24, and is formed simultaneously in the same manufacturing process as the BM layer 22 and the light shielding layer 24. In other words, the frame forming portion 25a is simultaneously formed using a common mask designed for the BM layer 22, the light shielding layer 24, and the frame forming portion 25a. For this reason, the frame forming portion 25 a is formed to have substantially the same thickness as the BM layer 22 and the light shielding layer 24. The frame forming portion 25a may be formed so as to be connected to the light shielding layer 24 as shown in FIG. In this case, the seal member 40 is bonded to the insulating substrate 21 through the frame forming portion 25a.

 ロゴ形成部25b(図3参照)はカラーフィルタ層23の赤色層23R、緑色層23Gまたは青色層23Bと同じ材料(樹脂)により形成されており、赤色層23R、緑色層23Gまたは青色層23Bと同じ製造工程で同時に形成されている。すなわち、ロゴ形成部25bは、赤色層23R、緑色層23Gまたは青色層23Bとロゴ形成部25bと用に設計された共通のマスクを用いて同時に形成されている。このため、ロゴ形成部25bは赤色層23R、緑色層23Gまたは青色層23Bと同じ厚みに形成されている。 The logo forming portion 25b (see FIG. 3) is formed of the same material (resin) as the red layer 23R, the green layer 23G, or the blue layer 23B of the color filter layer 23, and the red layer 23R, the green layer 23G, or the blue layer 23B They are formed simultaneously in the same manufacturing process. That is, the logo forming portion 25b is simultaneously formed using a common mask designed for the red layer 23R, the green layer 23G or the blue layer 23B and the logo forming portion 25b. For this reason, the logo formation part 25b is formed in the same thickness as the red layer 23R, the green layer 23G, or the blue layer 23B.

 なお、ロゴ形成部25bを金属材料により形成してもよい。金属材料としては、TFT基板10のTFT素子のゲート電極(図示せず)に用いられるチタン、アルミニウム、タングステン、モリブデンなどが挙げられる。また、図5に示すように、額縁層25のうちのロゴ形成部25bに対応する領域に開口部25cを形成することによって、標章を表してもよい。言い換えると、額縁形成部25aに標章を表す開口部25cを設けてもよい。 In addition, you may form the logo formation part 25b with a metal material. Examples of the metal material include titanium, aluminum, tungsten, and molybdenum used for the gate electrode (not shown) of the TFT element of the TFT substrate 10. Moreover, as shown in FIG. 5, you may represent a mark by forming the opening part 25c in the area | region corresponding to the logo formation part 25b of the frame layer 25. FIG. In other words, you may provide the opening part 25c showing a mark in the frame formation part 25a.

 本実施形態では、上記のように、額縁領域20bのシール部材40よりも外側の部分に、額縁パターンおよび標章を表す額縁層25が形成されている。これにより、額縁パターンなどを形成するために、従来のように透明板に樹脂層を形成し、その透明板をCF基板20上に粘着テープなどを介して取り付ける必要がない。このため、樹脂層周辺に気泡が混入することがない。これにより、本実施形態では、表示パネル1の外観品位が低下して歩留まりが低下するのを防止することができる。また、CF基板20上に粘着テープなどを介して透明板を取り付ける必要がないので、表示パネル1の製造工程を簡略化することができる。また、表示パネル1の厚みが大きくなるのを抑制することができる。 In the present embodiment, as described above, the frame layer 25 representing the frame pattern and the mark is formed on the outer side of the seal member 40 in the frame region 20b. Thereby, in order to form a frame pattern or the like, it is not necessary to form a resin layer on a transparent plate as in the prior art and attach the transparent plate to the CF substrate 20 via an adhesive tape or the like. For this reason, bubbles are not mixed around the resin layer. Thereby, in this embodiment, it can prevent that the external appearance quality of the display panel 1 falls and a yield falls. In addition, since it is not necessary to attach a transparent plate on the CF substrate 20 via an adhesive tape or the like, the manufacturing process of the display panel 1 can be simplified. Moreover, it can suppress that the thickness of the display panel 1 becomes large.

 また、上記のように、額縁層25は表示領域20aに形成されるBM層22やカラーフィルタ層23と同じ材料で同じ厚みに形成されている。これにより、額縁層25をBM層22やカラーフィルタ層23と同じ製造工程で共通のマスクを用いて同時に形成することができる。また、BM層22やカラーフィルタ層23は厚みが小さいので、額縁層25の厚みを小さくすることができる。 As described above, the frame layer 25 is formed of the same material and the same thickness as the BM layer 22 and the color filter layer 23 formed in the display region 20a. As a result, the frame layer 25 can be formed simultaneously using the same mask in the same manufacturing process as the BM layer 22 and the color filter layer 23. Moreover, since the BM layer 22 and the color filter layer 23 are small in thickness, the thickness of the frame layer 25 can be reduced.

 また、上記のように、額縁形成部25aをBM層22と同じ材料により形成することによって、額縁パターンを、一般的に用いられる黒色にすることができる。 Also, as described above, by forming the frame forming portion 25a from the same material as that of the BM layer 22, the frame pattern can be made to be a commonly used black.

 また、上記のように、額縁形成部25aをBM層22により形成し、ロゴ形成部25bをカラーフィルタ層23や金属材料により形成することによって、額縁形成部25aおよびロゴ形成部25bを、互いに異なる色に形成することができる。これにより、ロゴ形成部25bを見えやすくすることができる。すなわち、標章の視認性を向上させることができる。 Further, as described above, the frame forming portion 25a and the logo forming portion 25b are different from each other by forming the frame forming portion 25a with the BM layer 22 and forming the logo forming portion 25b with the color filter layer 23 or a metal material. Can be formed into color. Thereby, the logo formation part 25b can be made easy to see. That is, the visibility of the mark can be improved.

 また、上記のように、シール部材40を額縁層25と遮光層24との間に配置すれば、額縁層25を介さずにシール部材40をCF基板20の絶縁基板21に接着することができる。これにより、シール部材40の接着強度が低下するのを抑制することができる。 Further, as described above, if the seal member 40 is disposed between the frame layer 25 and the light shielding layer 24, the seal member 40 can be bonded to the insulating substrate 21 of the CF substrate 20 without the frame layer 25 interposed therebetween. . Thereby, it can suppress that the adhesive strength of the sealing member 40 falls.

 また、上記のように、CF基板20を、強化ガラス基板を用いて形成すれば、表示パネル1が外力により損傷するのを抑制することができる。 Further, as described above, if the CF substrate 20 is formed using a tempered glass substrate, the display panel 1 can be prevented from being damaged by an external force.

 また、上記のように、CF基板20を、樹脂基板を用いて形成すれば、表示パネル1を軽量化することができる。また、TFT基板10も樹脂基板を用いて形成すれば、表示パネル1を湾曲可能に構成することもできる。 Further, as described above, if the CF substrate 20 is formed using a resin substrate, the display panel 1 can be reduced in weight. Further, if the TFT substrate 10 is also formed using a resin substrate, the display panel 1 can be configured to be bendable.

(第2実施形態)
 この第2実施形態では図6~図8を参照して、上記第1実施形態とは異なり、額縁層125の額縁形成部125aがカラーフィルタ層23と同じ材料で形成されている場合について説明する。
(Second Embodiment)
In the second embodiment, with reference to FIGS. 6 to 8, a case where the frame forming portion 125a of the frame layer 125 is formed of the same material as the color filter layer 23 will be described, unlike the first embodiment. .

 本発明の第2実施形態の表示パネル101では図6に示すように、額縁層125の額縁形成部125aはカラーフィルタ層23の赤色層23R、緑色層23Gまたは青色層23Bと同じ材料(樹脂)により形成されている。また、額縁形成部125aは、赤色層23R、緑色層23Gまたは青色層23Bと同じ製造工程で同時に形成されている。 In the display panel 101 of the second embodiment of the present invention, as shown in FIG. 6, the frame forming portion 125a of the frame layer 125 is the same material (resin) as the red layer 23R, the green layer 23G, or the blue layer 23B of the color filter layer 23. It is formed by. The frame forming portion 125a is simultaneously formed in the same manufacturing process as the red layer 23R, the green layer 23G, or the blue layer 23B.

 額縁層125のロゴ形成部125b(ロゴ・模様形成部)は図7に示すように、BM層22および遮光層24と同じ製造工程で同時に形成されてもよい。すなわち、ロゴ形成部125bは、BM層22および遮光層24と同じ材料(樹脂)で同じ厚みに形成されてもよい。また、ロゴ形成部125bは図8に示すように、カラーフィルタ層23の赤色層23R、緑色層23Gまたは青色層23Bと同じ製造工程で同時に形成されてもよい。すなわち、ロゴ形成部125bは、カラーフィルタ層23の赤色層23R、緑色層23Gまたは青色層23Bと同じ材料(樹脂)で同じ厚みに形成されてもよい。この場合、額縁形成部125aおよびロゴ形成部125bは、それぞれ赤色層23R、緑色層23Gおよび青色層23Bのうちの異なる2つの層と同じ材料により形成される。 The logo forming portion 125b (logo / pattern forming portion) of the frame layer 125 may be simultaneously formed in the same manufacturing process as the BM layer 22 and the light shielding layer 24 as shown in FIG. That is, the logo forming part 125b may be formed with the same material (resin) as the BM layer 22 and the light shielding layer 24 and with the same thickness. Moreover, the logo formation part 125b may be simultaneously formed in the same manufacturing process as the red layer 23R, the green layer 23G, or the blue layer 23B of the color filter layer 23, as shown in FIG. That is, the logo forming portion 125b may be formed with the same thickness (the same material and resin) as the red layer 23R, the green layer 23G, or the blue layer 23B of the color filter layer 23. In this case, the frame forming portion 125a and the logo forming portion 125b are formed of the same material as two different layers of the red layer 23R, the green layer 23G, and the blue layer 23B, respectively.

 第2実施形態のその他の構造は、上記第1実施形態と同様である。 Other structures of the second embodiment are the same as those of the first embodiment.

 本実施形態では、上記のように、額縁形成部125aをカラーフィルタ層23と同じ材料により形成することによって、額縁パターンをカラーにすることができ、デザイン性を向上させることができる。 In the present embodiment, as described above, by forming the frame forming portion 125a from the same material as the color filter layer 23, the frame pattern can be colored, and the design can be improved.

 第2実施形態のその他の効果は、上記第1実施形態と同様である。 Other effects of the second embodiment are the same as those of the first embodiment.

(第3実施形態)
 この第3実施形態では図9に示すように、上記第1および第2実施形態とは異なり、額縁層225の額縁形成部225aが金属材料により形成されている。金属材料としては、TFT基板10のTFT素子のゲート電極(図示せず)に用いられるチタン、アルミニウム、タングステン、モリブデンなどが挙げられる。
(Third embodiment)
In the third embodiment, as shown in FIG. 9, unlike the first and second embodiments, the frame forming portion 225a of the frame layer 225 is formed of a metal material. Examples of the metal material include titanium, aluminum, tungsten, and molybdenum used for the gate electrode (not shown) of the TFT element of the TFT substrate 10.

 第3実施形態のその他の構造は、上記第1および第2実施形態と同様である。 Other structures of the third embodiment are the same as those of the first and second embodiments.

 本実施形態では、上記のように、額縁形成部225aを金属材料により形成することによって、額縁パターンを金属色にして、光沢感を付与することができる。 In the present embodiment, as described above, by forming the frame forming portion 225a from a metal material, the frame pattern can be made into a metallic color and gloss can be imparted.

 第3実施形態のその他の効果は、上記第1および第2実施形態と同様である。 Other effects of the third embodiment are the same as those of the first and second embodiments.

(第4実施形態)
 この第4実施形態では図10および図11を参照して、上記第1~第3実施形態とは異なり、CF基板20がTFT基板10に対してA方向側に突出している場合について説明する。
(Fourth embodiment)
In the fourth embodiment, the case where the CF substrate 20 protrudes toward the A direction with respect to the TFT substrate 10 will be described with reference to FIGS. 10 and 11 unlike the first to third embodiments.

 本発明の第4実施形態の表示パネル301では図10および図11に示すように、CF基板20はTFT基板10に対してA方向側に突出しているとともに、TFT基板10はCF基板20に対してA方向とは反対側(B方向側)に突出している。すなわち、CF基板20はTFT基板10に対してずらして配置されている。 In the display panel 301 according to the fourth embodiment of the present invention, as shown in FIGS. 10 and 11, the CF substrate 20 protrudes toward the A direction with respect to the TFT substrate 10, and the TFT substrate 10 faces the CF substrate 20. It protrudes on the opposite side to the A direction (B direction side). That is, the CF substrate 20 is arranged so as to be shifted with respect to the TFT substrate 10.

 額縁層25のロゴ形成部25bは、CF基板20のうちのA方向側の部分(後述するIC実装領域10aとは反対側の部分)に設けられている。言い換えると、額縁層25の4辺のうちの最も大きい幅を有する辺は、CF基板20のうちのA方向側の部分(IC実装領域10aとは反対側の部分)に設けられている。 The logo forming portion 25b of the frame layer 25 is provided in a portion on the A direction side of the CF substrate 20 (a portion opposite to an IC mounting region 10a described later). In other words, the side having the largest width among the four sides of the frame layer 25 is provided in a portion on the A direction side of the CF substrate 20 (a portion on the side opposite to the IC mounting region 10a).

 TFT基板10のB方向側の部分には図11に示すように、IC実装領域10aおよびFPC(Flexible Printed Circuit)実装領域10bが設けられている。IC実装領域10aには表示パネル301を駆動するIC302が実装されており、FPC実装領域10bにはIC302に信号を供給するFPC303が実装されている。IC実装領域10aおよびFPC実装領域10bはCF基板20からB方向に所定の間隔を隔てて配置されており、IC実装領域10aおよびFPC実装領域10b上にはCF基板20は配置されていない。 As shown in FIG. 11, an IC mounting area 10 a and an FPC (Flexible Printed Circuit) mounting area 10 b are provided in a portion on the B direction side of the TFT substrate 10. An IC 302 that drives the display panel 301 is mounted in the IC mounting area 10a, and an FPC 303 that supplies a signal to the IC 302 is mounted in the FPC mounting area 10b. The IC mounting area 10a and the FPC mounting area 10b are disposed at a predetermined distance from the CF substrate 20 in the B direction, and the CF substrate 20 is not disposed on the IC mounting area 10a and the FPC mounting area 10b.

 第4実施形態のその他の構造は、上記第1~第3実施形態と同様である。 The other structure of the fourth embodiment is the same as that of the first to third embodiments.

 本実施形態では、上記のように、CF基板20はTFT基板10に対してA方向側に突出している。これにより、CF基板20をIC実装領域10aから離して配置することができるので、IC実装領域10aにIC302を実装する際にIC302がCF基板20に接触するのを抑制することができる。すなわち、IC302がCF基板20に接触してIC302をTFT基板10に実装できなくなるのを、抑制することができる。 In the present embodiment, as described above, the CF substrate 20 protrudes toward the A direction with respect to the TFT substrate 10. As a result, the CF substrate 20 can be disposed away from the IC mounting region 10a, and therefore, the IC 302 can be prevented from contacting the CF substrate 20 when the IC 302 is mounted in the IC mounting region 10a. That is, it is possible to suppress the IC 302 from coming into contact with the CF substrate 20 and being unable to mount the IC 302 on the TFT substrate 10.

 また、上記のように、ロゴ形成部25bはCF基板20のA方向側の部分に配置されている。標章はある程度の大きさが必要なので、額縁層25のうちのロゴ形成部25bが形成される部分の幅は大きくなる。このため、ロゴ形成部25bをCF基板20のA方向側の部分(TFT基板10のIC実装領域10aから離れた位置)に配置することによって、CF基板20を容易にIC実装領域10aから離して配置することができる。 Further, as described above, the logo forming portion 25b is disposed in the portion of the CF substrate 20 on the A direction side. Since the mark needs to have a certain size, the width of the portion of the frame layer 25 where the logo forming portion 25b is formed becomes large. For this reason, the CF substrate 20 can be easily separated from the IC mounting region 10a by arranging the logo forming portion 25b in the portion on the A direction side of the CF substrate 20 (a position away from the IC mounting region 10a of the TFT substrate 10). Can be arranged.

 第4実施形態のその他の効果は、上記第1~第3実施形態と同様である。 Other effects of the fourth embodiment are the same as those of the first to third embodiments.

 なお、今回開示された実施形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施形態の説明ではなく請求の範囲によって示され、さらに請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims, and further includes meanings equivalent to the scope of claims and all modifications within the scope.

 例えば、上記実施形態では、額縁層が額縁形成部とロゴ形成部(ロゴ・模様形成部)とを含む例について示したが、本発明はこれに限らない。額縁層は額縁形成部だけを含んでいてもよいし、ロゴ・模様形成部だけを含んでいてもよい。 For example, in the above-described embodiment, an example in which the frame layer includes a frame formation portion and a logo formation portion (logo / pattern formation portion) is shown, but the present invention is not limited to this. The frame layer may include only the frame forming part, or may include only the logo / pattern forming part.

 また、上記実施形態では、ロゴ・模様形成部の一例として、標章を表すロゴ形成部を設けた例について示したが、本発明はこれに限らない。例えば、標章および模様の両方を表すロゴ・模様形成部を設けてもよいし、模様を表す模様形成部を設けてもよい。 In the above embodiment, an example in which a logo forming part representing a mark is provided as an example of a logo / pattern forming part is shown, but the present invention is not limited to this. For example, a logo / pattern forming part representing both a mark and a pattern may be provided, or a pattern forming part representing a pattern may be provided.

 また、上記実施形態では、額縁領域20bのA方向側(CF基板20の長手方向の一方側)の1辺を大きい幅に形成し、額縁領域20bのA方向側の部分にロゴ形成部(ロゴ・模様形成部)を設けた例について示したが、本発明はこれに限らない。例えば図12に示した本発明の第1変形例による表示パネル401のように、額縁領域20bのC方向側およびD方向側(CF基板20の短手方向の両側)の部分も大きい幅に形成し、その部分に模様を表す模様形成部25d(ロゴ・模様形成部)を設けてもよい。また、例えば図13に示した本発明の第2変形例による表示パネル501のように、額縁領域20bのA方向側、B方向側、C方向側およびD方向側の部分を全て大きい幅に形成し、その部分に模様を表す模様形成部25d(ロゴ・模様形成部)等を設けてもよい。 Further, in the above embodiment, one side of the frame area 20b on the A direction side (one side in the longitudinal direction of the CF substrate 20) is formed with a large width, and a logo forming portion (logo) is formed on the A direction side of the frame area 20b. -Although the example which provided the pattern formation part) was shown, this invention is not restricted to this. For example, like the display panel 401 according to the first modification of the present invention shown in FIG. 12, the portions on the C direction side and D direction side (both sides in the short direction of the CF substrate 20) of the frame region 20b are also formed with a large width. However, a pattern forming portion 25d (logo / pattern forming portion) representing a pattern may be provided at that portion. Further, like the display panel 501 according to the second modified example of the present invention shown in FIG. 13, for example, the A direction side, the B direction side, the C direction side, and the D direction side of the frame region 20b are all formed to have a large width. However, a pattern forming portion 25d (logo / pattern forming portion) representing a pattern may be provided in that portion.

 また、CF基板上に強化ガラスなどからなる保護用の透明板を設けてもよい。本発明では透明板に数十μmの樹脂層を設ける必要がないので、表示パネルと透明板との間に気泡が混入するのを抑制することができる。 Further, a protective transparent plate made of tempered glass or the like may be provided on the CF substrate. In the present invention, since it is not necessary to provide a resin layer of several tens of μm on the transparent plate, it is possible to suppress air bubbles from being mixed between the display panel and the transparent plate.

 また、例えば上記第4実施形態では、ICをTFT基板に実装した例について説明したが、本発明はこれに限らない。例えば、ICに含まれる回路を、TFT素子と同様にTFT基板に作り込んでおいてもよい。 For example, in the fourth embodiment, the example in which the IC is mounted on the TFT substrate has been described, but the present invention is not limited to this. For example, a circuit included in the IC may be formed on the TFT substrate in the same manner as the TFT element.

 1、101、301、401、501 表示パネル
 10 TFT基板
 10a IC実装領域
 20 CF基板(カラーフィルタ基板)
 20a 表示領域
 20b 額縁領域
 22 BM層(表示領域に形成される層、ブラックマトリクス層)
 23 カラーフィルタ層(表示領域に形成される層)
 24 遮光層(表示領域に形成される層)
 25、125、225 額縁層
 25a、125a、225a 額縁形成部
 25b、125b ロゴ形成部(ロゴ・模様形成部)
 25c 開口部
 25d 模様形成部(ロゴ・模様形成部)
 30 液晶層
 40 シール部材
 302 IC
1, 101, 301, 401, 501 Display panel 10 TFT substrate 10a IC mounting area 20 CF substrate (color filter substrate)
20a display area 20b frame area 22 BM layer (layer formed in display area, black matrix layer)
23 Color filter layer (layer formed in the display area)
24 light shielding layer (layer formed in display area)
25, 125, 225 Frame layer 25a, 125a, 225a Frame forming part 25b, 125b Logo forming part (logo / pattern forming part)
25c opening 25d pattern formation part (logo / pattern formation part)
30 Liquid crystal layer 40 Sealing member 302 IC

Claims (15)

 アクティブマトリクス基板と、
 前記アクティブマトリクス基板に対向配置されるカラーフィルタ基板と、
 前記アクティブマトリクス基板および前記カラーフィルタ基板の間に配置される液晶層と、
 前記アクティブマトリクス基板および前記カラーフィルタ基板の間に前記液晶層を封入するためのシール部材と、
 を備え、
 前記カラーフィルタ基板は画像を表示する表示領域と、前記表示領域の周囲に配置される額縁領域とを含み、
 前記額縁領域のうちの前記シール部材よりも外側の部分には、額縁パターン、標章および模様の少なくとも1つを表す額縁層が形成されていることを特徴とする表示パネル。
An active matrix substrate;
A color filter substrate disposed opposite to the active matrix substrate;
A liquid crystal layer disposed between the active matrix substrate and the color filter substrate;
A sealing member for enclosing the liquid crystal layer between the active matrix substrate and the color filter substrate;
With
The color filter substrate includes a display area for displaying an image, and a frame area arranged around the display area,
A display panel, wherein a frame layer representing at least one of a frame pattern, a mark, and a pattern is formed in a portion outside the seal member in the frame region.
 前記額縁層は前記カラーフィルタ基板の表示領域に形成される層と同じ材料により形成されていることを特徴とする請求項1に記載の表示パネル。 The display panel according to claim 1, wherein the frame layer is formed of the same material as a layer formed in a display region of the color filter substrate.  前記表示領域に形成される層はブラックマトリクス層を含み、
 前記額縁層は前記ブラックマトリクス層と同じ材料により形成されていることを特徴とする請求項2に記載の表示パネル。
The layer formed in the display area includes a black matrix layer,
The display panel according to claim 2, wherein the frame layer is made of the same material as the black matrix layer.
 前記表示領域に形成される層はカラーフィルタ層を含み、
 前記額縁層は前記カラーフィルタ層と同じ材料により形成されていることを特徴とする請求項2に記載の表示パネル。
The layer formed in the display area includes a color filter layer,
The display panel according to claim 2, wherein the frame layer is made of the same material as the color filter layer.
 前記額縁層は前記表示領域に形成される層と実質的に同じ厚みに形成されていることを特徴とする請求項2~4のいずれか1項に記載の表示パネル。 The display panel according to any one of claims 2 to 4, wherein the frame layer is formed to have substantially the same thickness as a layer formed in the display region.  前記額縁層は金属材料により形成されていることを特徴とする請求項1に記載の表示パネル。 The display panel according to claim 1, wherein the frame layer is formed of a metal material.  前記額縁層は額縁パターンを表す額縁形成部と、標章および模様の少なくとも一方を表すロゴ・模様形成部とを含み、
 前記額縁形成部および前記ロゴ・模様形成部は、互いに異なる色の材料により形成されていることを特徴とする請求項1~6のいずれか1項に記載の表示パネル。
The frame layer includes a frame forming part representing a frame pattern, and a logo / pattern forming part representing at least one of a mark and a pattern,
7. The display panel according to claim 1, wherein the frame forming portion and the logo / pattern forming portion are formed of materials of different colors.
 前記シール部材の内側には、前記シール部材に沿って配置され、ブラックマトリクス層と同じ材料により形成される遮光層が設けられており、
 前記額縁層は前記遮光層から所定の間隔を隔てて配置されていることを特徴とする請求項1~7のいずれか1項に記載の表示パネル。
Inside the seal member, a light shielding layer is provided that is disposed along the seal member and formed of the same material as the black matrix layer.
The display panel according to any one of claims 1 to 7, wherein the frame layer is disposed at a predetermined interval from the light shielding layer.
 前記シール部材は前記額縁層と前記遮光層との間に配置されていることを特徴とする請求項8に記載の表示パネル。 The display panel according to claim 8, wherein the sealing member is disposed between the frame layer and the light shielding layer.  前記シール部材の内側には、前記シール部材に沿って配置され、ブラックマトリクス層と同じ材料により形成される遮光層が設けられており、
 前記額縁層は前記遮光層に連結するように形成されていることを特徴とする請求項1~7のいずれか1項に記載の表示パネル。
Inside the seal member, a light shielding layer is provided that is disposed along the seal member and formed of the same material as the black matrix layer.
The display panel according to claim 1, wherein the frame layer is formed so as to be connected to the light shielding layer.
 前記シール部材は前記額縁層を介して前記カラーフィルタ基板に接着していることを特徴とする請求項10に記載の表示パネル。 11. The display panel according to claim 10, wherein the seal member is bonded to the color filter substrate via the frame layer.  前記カラーフィルタ基板は強化ガラス基板を用いて形成されていることを特徴とする請求項1~11のいずれか1項に記載の表示パネル。 12. The display panel according to claim 1, wherein the color filter substrate is formed using a tempered glass substrate.  前記カラーフィルタ基板は樹脂基板を用いて形成されていることを特徴とする請求項1~11のいずれか1項に記載の表示パネル。 12. The display panel according to claim 1, wherein the color filter substrate is formed using a resin substrate.  前記アクティブマトリクス基板の一方側の部分には、ICが実装されるIC実装領域が設けられており、
 前記カラーフィルタ基板は前記アクティブマトリクス基板に対して他方側に突出していることを特徴とする請求項1~13のいずれか1項に記載の表示パネル。
On one side of the active matrix substrate, an IC mounting area for mounting an IC is provided,
The display panel according to any one of claims 1 to 13, wherein the color filter substrate protrudes to the other side with respect to the active matrix substrate.
 前記額縁層は標章および模様の少なくとも一方を表すロゴ・模様形成部を含み、
 前記ロゴ・模様形成部は前記カラーフィルタ基板のうちの前記他方側の部分に配置されていることを特徴とする請求項14に記載の表示パネル。
The frame layer includes a logo / pattern forming portion representing at least one of a mark and a pattern,
The display panel according to claim 14, wherein the logo / pattern forming portion is disposed on the other side portion of the color filter substrate.
PCT/JP2012/066234 2011-06-29 2012-06-26 Display panel Ceased WO2013002201A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-144689 2011-06-29
JP2011144689 2011-06-29

Publications (1)

Publication Number Publication Date
WO2013002201A1 true WO2013002201A1 (en) 2013-01-03

Family

ID=47424093

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/066234 Ceased WO2013002201A1 (en) 2011-06-29 2012-06-26 Display panel

Country Status (1)

Country Link
WO (1) WO2013002201A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112399928A (en) * 2018-07-25 2021-02-23 大众汽车股份公司 Display and operating device for motor vehicles

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1062768A (en) * 1996-08-19 1998-03-06 Sharp Corp Liquid crystal display
JPH10325951A (en) * 1997-05-26 1998-12-08 Hitachi Ltd Liquid crystal display
JP2003043463A (en) * 2001-08-02 2003-02-13 Casio Comput Co Ltd Liquid crystal display
WO2003030131A1 (en) * 2001-08-29 2003-04-10 Seiko Epson Corporation Electrooptical device, and electronic apparatus
JP2004109341A (en) * 2002-09-17 2004-04-08 Fuji Photo Film Co Ltd Method for forming light shielding image and color filter
JP2006201652A (en) * 2005-01-24 2006-08-03 Toppan Printing Co Ltd Color filter for liquid crystal display
JP2009175531A (en) * 2008-01-25 2009-08-06 Hitachi Displays Ltd Liquid crystal display

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1062768A (en) * 1996-08-19 1998-03-06 Sharp Corp Liquid crystal display
JPH10325951A (en) * 1997-05-26 1998-12-08 Hitachi Ltd Liquid crystal display
JP2003043463A (en) * 2001-08-02 2003-02-13 Casio Comput Co Ltd Liquid crystal display
WO2003030131A1 (en) * 2001-08-29 2003-04-10 Seiko Epson Corporation Electrooptical device, and electronic apparatus
JP2004109341A (en) * 2002-09-17 2004-04-08 Fuji Photo Film Co Ltd Method for forming light shielding image and color filter
JP2006201652A (en) * 2005-01-24 2006-08-03 Toppan Printing Co Ltd Color filter for liquid crystal display
JP2009175531A (en) * 2008-01-25 2009-08-06 Hitachi Displays Ltd Liquid crystal display

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112399928A (en) * 2018-07-25 2021-02-23 大众汽车股份公司 Display and operating device for motor vehicles
CN112399928B (en) * 2018-07-25 2025-10-17 大众汽车股份公司 Display and operating device for a motor vehicle

Similar Documents

Publication Publication Date Title
CN105785632B (en) Display device
US9207475B2 (en) Display apparatus
WO2020034666A1 (en) Flexible display screen and display device
CN107589579A (en) Narrow frame display panel and preparation method thereof, display device
WO2019127714A1 (en) Display panel, manufacturing method therefor, and display device
JP2012168493A (en) Display device and manufacturing method thereof
US10347864B2 (en) Display device
US9285625B2 (en) Display device
JP2010237447A (en) Display device
KR20190050136A (en) Light control member and display device
KR20160100004A (en) Display apparatus
JP5044830B2 (en) Electro-optical device and electronic apparatus
KR102409590B1 (en) Display device
KR20150017568A (en) Productive window for display device and display device with the same
KR102501537B1 (en) Cover window for electronic device and electronic device comprising the same
JP2018159890A (en) Liquid crystal display
KR101995778B1 (en) Liquid crystal display device
TWI427372B (en) Optical devices and display devices
WO2013002201A1 (en) Display panel
JP2019015772A (en) Liquid crystal display device
KR20190048578A (en) Shielding member and display device
KR102608111B1 (en) Light route control member and display device
TWI877519B (en) Display device
KR102309490B1 (en) Display device
JP2009163131A (en) Display apparatus and electronic equipment using the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12803644

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12803644

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP