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WO2013000560A1 - Corps de circuit, en particulier platine d'élément - Google Patents

Corps de circuit, en particulier platine d'élément Download PDF

Info

Publication number
WO2013000560A1
WO2013000560A1 PCT/EP2012/002681 EP2012002681W WO2013000560A1 WO 2013000560 A1 WO2013000560 A1 WO 2013000560A1 EP 2012002681 W EP2012002681 W EP 2012002681W WO 2013000560 A1 WO2013000560 A1 WO 2013000560A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit arrangement
arrangement body
carrier element
conductive paste
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/002681
Other languages
German (de)
English (en)
Inventor
John Fitzgerald
Yorck KÖHN
Harald Liebich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entertainment Distribution Co GmbH
Original Assignee
Entertainment Distribution Co GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entertainment Distribution Co GmbH filed Critical Entertainment Distribution Co GmbH
Priority to EP12731305.4A priority Critical patent/EP2756742A1/fr
Publication of WO2013000560A1 publication Critical patent/WO2013000560A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • Circuit arrangement body in particular component board
  • circuit arrangement bodies in particular component boards, that is to say circuit boards, which are equipped with at least one component, these generally being formed by means of photolithographic and via acid or coating baths formed conductive structures, in particular in the form of Conductor tracks have, wherein electrical and / or electronic components on the board with the lead structures soldering or mechanically or electrically conductively connected by means of metal particles, in particular silver metal particles containing conductive pastes.
  • US 3,947,801 A discloses a film resistor comprising a resistive material disposed between conductive means, the resistive material having one or more notches defining the path for the electrical current in the resistive material, the notch having one end at an edge of the resistive material and a second end terminating in an area that is outside and spaced from the electrical path.
  • CONFIRMATION COPY on standard LCDs liquid crystal displays
  • LCDs liquid crystal displays
  • a high-impedance supply line is provided for the application of a separate control signal, common to all LCD Electrodes without distinction on segment connection or back electrode connection is performed.
  • DE 196 35 564 AI discloses a printed circuit board which is equipped with light-emitting diodes and to these series-connected current-limiting resistors, wherein the conductor paste is formed strip-shaped and the current limiting resistors are made of a resistor paste and provided with a protective varnish.
  • DE 42 05 789 AI discloses a light source, in particular for signaling the switching state of electrical equipment, with at least one light emitting device and an upstream protection device, preferably a series resistor, to limit the supply current, wherein the protective device is constructed by means of a sheet resistor, which together with the light-emitting component on a support plate, preferably an AL 2 0 3 - substrate, is housed, wherein the thick-film resistor is arranged on the support plate so that its resistance by means of a laser beam can be adjusted to a predetermined by the required light intensity of the light emitting device value.
  • DE 10 2008 032 346 A1 discloses a luminous means with at least one semiconductor light source comprising a circuit carrier on which at least one group of electrical components is arranged, the group comprising at least one resistor and at least one connected in series with the corresponding resistor Semiconductor light source, wherein the at least one resistor is designed as a paste resistor, which is printed on the circuit carrier.
  • a specific object of the invention is to provide a circuit board body which is particularly efficient to manufacture.
  • the circuit arrangement body according to the invention which is configured in particular in the form of a component board, has a carrier element, for example and in particular a circuit board.
  • the circuit arrangement body according to the invention comprises at least one electrical or electronic component, for example and in particular an LED, and at least one conductive paste section based on a conductive paste, for example and in particular based on carbon, which is mounted on and / or in the carrier element.
  • the conductive paste section which is formed, for example, and in particular in the form of a conductor, electrically connected directly to pads of the electrical or electronic component and mechanically, at least one located on the carrier element, electrically conductive lead structure is directly electrically conductive and mechanically connected to the Leitpastenabêt and / or the Leitpastenabterrorism electrically conductive and mechanically connected directly to pads of or another electrical or electronic component.
  • the Leitpastenabterrorism acts as an ohmic resistance and replaced an otherwise electrically necessary further resistive resistance element, in particular with respect to the at least one electrical or electronic component.
  • the conductive paste or the spatial dimensioning of the at least one Leitpastenabiteses is such that in particular with respect to the at least one electrical or electronic component, an otherwise further resistive element must be used within the circuit arrangement body, falls correspondingly otherwise a necessary separate resistance element on the one hand away, and on the other hand, and depending on the case of application of the Wegungsanord- tion body at least a part of the otherwise necessary to be etched and usually made of copper conductive structures, usually in the form of printed conductors, just in an environmentally friendly manner by simple in particular printing Applying or introducing on or in the support element ecological and economic benefits are recorded; this in particular if the circuit arrangement as such has a large number of separate resistances which are necessary from an electrical point of view. Stance elements required, which are then replaced accordingly by corresponding Leitpastenabitese.
  • the conductive structures is metallic in nature, which are then advantageously sputter-conducting structures, ie sputtered conductive structures, in terms of the diversity of the possible electrical and electronic applications of the most diverse circuit arrangements.
  • sputter-conducting structures ie sputtered conductive structures
  • precise conductive structures can be applied to the carrier element, which consists, for example and in particular, of polycarbonate, in a resource-saving and accurate manner, in particular via masks arranged in front of the carrier element.
  • the sputter conducting structure is metallic in nature, for example and in particular if these are made of copper, copper alloys, silver or silver alloys. stands, because these materials have a high specific conductivity.
  • the Sputterleit Geneva-Coupled Device
  • the Sputterleit Geneva-Coupled Device
  • the Sputterleit Jardin-Coupled Device
  • the first sputtered layer of copper is due to the high specific conductivity, and then on the other hand sputtered over a brass or aluminum layer to have a relatively high abrasion resistance, which is particularly important for plug contacts of importance.
  • the conductive paste is based on carbon, for example and in particular has carbon particles, for example, and in particular the paste type Carbo e -Therm LT Jäklechemie GmbH & Co. KG, Nuremberg, Germany.
  • the conductive paste is transparent, as this may be advantageous for specific optical applications, for example, and in particular the permeability of certain areas for measuring and detecting optical properties or to produce certain aesthetic impressions.
  • the conductive paste is free of metal particles, and thus usually the relatively expensive silver-containing silver conductive pastes are replaced by the intrinsic properties of the respective material compositions, such as, for example, the above-mentioned and especially mentioned Carbo e- Therm LT conductive paste from Jäklechemie GmbH & Co. KG, Nuremberg, Germany, or in the case of transparent pastes, for example and in particular Clevios type SV3 pastes from Heraeus Clevios GmbH, Leverkusen, Germany.
  • the support element is plate-shaped, thus platinum-like, designed, since this form has been found in practice to be practice-oriented.
  • the electrical or electronic component which is located on the carrier element is a luminous element, for example, and in particular a semiconductor light element, for example and in particular an LED or an LED-DIE (ie a LED-specific design of a luminous element or to a precursor of an LED, so to speak an LED without housing).
  • a luminous element for example, and in particular a semiconductor light element, for example and in particular an LED or an LED-DIE (ie a LED-specific design of a luminous element or to a precursor of an LED, so to speak an LED without housing).
  • the carrier element it is particularly advantageous if this has at least one material recess and / or at least one material omission, as in this way the electrical or electronic component application specifically in the support element itself, so usually in the board admitted or can be arranged, for example, and in particular an LED can be embedded in a material recess, so that it is virtually mechanically fixed surrounding the carrier element itself, in particular up to the form-fitting, with appropriate dimensioning of the material recess with respect to the component to be inserted, so that a relatively high mechanical protection is provided.
  • the electrical and mechanical contact technik with the corresponding Leitpasteabêt by simply printing on an electrical and mechanical contact of the component on the support element itself realized.
  • the guide structure is arranged at least partially in the material depression or in the material outlet, so that in extreme cases at least one to all guide structures are arranged in one or more material recesses, so that, for example, and in particular conductor track-shaped material recesses
  • the surfaces of the carrier element are sputtered with metals, in particular copper, or metal alloys, so that ultimately the sputtered conductive structures are arranged, for example, in the particular conductor track-shaped conductive structures. It is particularly advantageous that at least the part of the guide structure, which is located in the material recess or in the material omission, a higher mechanical protection innehat against external influences.
  • Leitpin- section is at least partially disposed in the material recess or in the material omission, as also explained here as the lead structures, a higher mechanical protection against external influences is given or in cross-section the profile of the surface of the
  • Circuit arrangement body or the support element of the circuit assembly body has a profile which is free of projections.
  • carrier element or circuit board is not only generally plate-shaped.
  • the term carrier element or circuit board is not only generally plate-shaped.
  • the term carrier element or circuit board is not only classical multilayer structures, of course, and in particular also simple and generally plastic-based carrier elements with no layer structure are to be understood. so that fall in the simplest case by means of, for example and in particular injection molding produced plastic plates, for example, and in particular of polycarbonate, with this term.
  • the surface of the carrier element is roughened, for example by mechanical roughening, chemical etching or by the production as
  • At least one light-emitting means is arranged in at least one material recess of the carrier element, wherein at least a predominant to complete part of the light emitted by the light source passes at least partially before it exits the carrier element during operation, in order to achieve a relative effect in this way elegant quasi indirect lighting in relation to the light beams directly emitted by the light source.
  • circuit arrangement body according to the invention as a light source, in particular by means of LED, should be emphasized at this point, as a circuit arrangement body according to the invention, the above-mentioned advantages depending on the embodiment holds.
  • FIG. 1 is a sketch of a cross-sectional view of a first embodiment of a circuit arrangement body according to the invention in the form of a component circuit board, and
  • FIG. 2 sketchy and in cross-sectional view a second and to the alternative embodiment shown in Figure 1;
  • FIG. 3 an alternative to Figure 1 embodiment.
  • Figure 1 shows a first embodiment of the circuit arrangement body according to the invention in the form of a component board, wherein the support member 5 made of transparent polycarbonate, wherein in two material recesses 6 and a material recess 7 each have a LED 2 is positively and non-positively embedded.
  • the LEDs 2 are each mechanically and electrically conductive contacted by screen printing on the surface of the support member 5 applied Leitpastenabêten 3, so that between the three LEDs 2 two Leitpastenab mustarde 3 act as resistors and thus simultaneously connect these components electrically conductive together and beyond the two outer LEDs 2 are each mechanically and electrically connected to electrically conductive conductive structures 4 in the form of sputtered copper conductors.
  • the LEDs 2 are connected correspondingly via the ohmic resistors of the Leitpastenabête 3 energized energized, so that it is in the circuit arrangement arrangement body shown here is a bulb.
  • FIG. 3 corresponds to the first embodiment shown in FIG. 1 with the difference that the LED 2 is arranged as light source in such a way that it emits its emitted light exclusively into the material of the carrier element 5 during operation, so that the light at least partially surrounds the carrier element 5 passes through, after appropriate reflections, diffractions and other optical phenomena then leave the material of the carrier element 5, so that in this way, almost an indirect type of lighting is realized.
  • the contacts 1 of the LED 2 are directly mechanically and electrically connected to two conductive paste sections 3 and corresponding sputtered metallic conductive structures 4, so that during operation energizing the LED 2 emits light into the carrier element 5, wherein the LED 2 in the material reduction of the material recess. 6 is arranged.
  • the light rays pass through different paths, depending on the exit angle, in order then to leave the carrier element 5.
  • microstructures 8 for example in the form of lens-like or prism-like elements, on the surface of the carrier element 5, can the respective desired optical effects are brought about or amplified. Except for the light exit side of the support element 5, this is completely surrounded by a reflector or a reflector layer 9 in order to increase the light output.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne en particulier un corps de circuit comprenant un élément de support (5) et au moins un élément électrique ou électronique (2) et au moins une partie de pâte conductrice (3) comportant une pâte conductrice et/ou disposée dans l'élément de support (5). La partie de pâte conductrice (3) est reliée de manière électroconductrice et mécanique directement aux surfaces de connexion (1) de l'élément électrique ou électronique (2). La partie de pâte conductrice (3) fonctionne du point de vue électrique comme une résistance ohmique, sachant que : a) la partie de pâte conductrice (3) est reliée directement de façon électroconductrice et mécanique à une structure conductrice électroconductrice située sur l'élément de support, et/ou b) la partie de pâte conductrice (3) est reliée de manière électroconductrice et mécanique directement aux surfaces de connexion d'un autre élément électrique ou électronique.
PCT/EP2012/002681 2011-06-27 2012-06-26 Corps de circuit, en particulier platine d'élément Ceased WO2013000560A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP12731305.4A EP2756742A1 (fr) 2011-06-27 2012-06-26 Corps de circuit, en particulier platine d'élément

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011106251.7 2011-06-27
DE102011106251A DE102011106251A1 (de) 2011-06-27 2011-06-27 Schaltungsanordnungskörper, insbesondere Bauteilplatine

Publications (1)

Publication Number Publication Date
WO2013000560A1 true WO2013000560A1 (fr) 2013-01-03

Family

ID=46456487

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/002681 Ceased WO2013000560A1 (fr) 2011-06-27 2012-06-26 Corps de circuit, en particulier platine d'élément

Country Status (3)

Country Link
EP (1) EP2756742A1 (fr)
DE (1) DE102011106251A1 (fr)
WO (1) WO2013000560A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2544142A (en) * 2015-11-03 2017-05-10 Avexir Tech Corp Electronic device and circuit module thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3001357B1 (fr) * 2013-01-22 2015-02-06 Sylumis Support de fixation mecanique et de raccordement electrique de diodes electroluminescentes
FI20155964A (fi) * 2015-12-17 2017-06-18 Teknologian Tutkimuskeskus Vtt Oy Sähköinen komponentti, piiri, laite, komponentin valmistusmenetelmä ja toimintamenetelmä
DE102017211659A1 (de) * 2017-07-07 2019-01-10 Bayerische Motoren Werke Aktiengesellschaft Beleuchtungseinheit für ein Fahrzeug und Verfahren zu dessen Herstellung

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947801A (en) 1975-01-23 1976-03-30 Rca Corporation Laser-trimmed resistor
GB2131624A (en) * 1982-12-09 1984-06-20 Standard Telephones Cables Ltd Thick film circuits
DE3432247A1 (de) 1984-09-01 1986-03-13 Mannesmann Kienzle GmbH, 7730 Villingen-Schwenningen Verfahren und schaltungsanordnung zur anzeige einer fehlerhaften funktionsweise einer fluessigkristallanzeige
DE4205789A1 (de) 1992-02-26 1993-09-02 Abb Patent Gmbh Lichtquelle mit mindestens einem lichtemittierenden bauelement und einer vorgeschalteten schutzeinrichtung
DE19635564A1 (de) 1995-09-26 1997-03-27 Siemens Ag Leiterplatte
DE10308890A1 (de) * 2003-02-28 2004-09-09 Opto Tech Corporation Gehäusestruktur für eine Lichtemissionsdiode und Verfahren zu dessen Herstellung
US20090015168A1 (en) * 2005-03-15 2009-01-15 Hans Layer Flat Lighting Device
DE102008032346A1 (de) 2008-07-09 2010-01-14 Hella Kgaa Hueck & Co. Leuchtmittel mit mindestens einer Halbleiterlichtquelle und Verfahren zur Herstellung eines Leuchtmittels
US20100277931A1 (en) * 2009-05-04 2010-11-04 Peterson Manufacturing Co. Vehicle lamp with polymer conductors and mounting structures
DE102009053688A1 (de) * 2009-11-19 2011-05-26 Ferro Gmbh Siebdruckfähige Zusammensetzung und Verfahren zur Herstellung einer leitfähigen und transparenten Schicht

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947801A (en) 1975-01-23 1976-03-30 Rca Corporation Laser-trimmed resistor
GB2131624A (en) * 1982-12-09 1984-06-20 Standard Telephones Cables Ltd Thick film circuits
DE3432247A1 (de) 1984-09-01 1986-03-13 Mannesmann Kienzle GmbH, 7730 Villingen-Schwenningen Verfahren und schaltungsanordnung zur anzeige einer fehlerhaften funktionsweise einer fluessigkristallanzeige
DE4205789A1 (de) 1992-02-26 1993-09-02 Abb Patent Gmbh Lichtquelle mit mindestens einem lichtemittierenden bauelement und einer vorgeschalteten schutzeinrichtung
DE19635564A1 (de) 1995-09-26 1997-03-27 Siemens Ag Leiterplatte
DE10308890A1 (de) * 2003-02-28 2004-09-09 Opto Tech Corporation Gehäusestruktur für eine Lichtemissionsdiode und Verfahren zu dessen Herstellung
US20090015168A1 (en) * 2005-03-15 2009-01-15 Hans Layer Flat Lighting Device
DE102008032346A1 (de) 2008-07-09 2010-01-14 Hella Kgaa Hueck & Co. Leuchtmittel mit mindestens einer Halbleiterlichtquelle und Verfahren zur Herstellung eines Leuchtmittels
US20100277931A1 (en) * 2009-05-04 2010-11-04 Peterson Manufacturing Co. Vehicle lamp with polymer conductors and mounting structures
DE102009053688A1 (de) * 2009-11-19 2011-05-26 Ferro Gmbh Siebdruckfähige Zusammensetzung und Verfahren zur Herstellung einer leitfähigen und transparenten Schicht

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2544142A (en) * 2015-11-03 2017-05-10 Avexir Tech Corp Electronic device and circuit module thereof

Also Published As

Publication number Publication date
EP2756742A1 (fr) 2014-07-23
DE102011106251A1 (de) 2012-09-13

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