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WO2013000420A1 - Dispositif de serrage de tranche à attaches à ressort - Google Patents

Dispositif de serrage de tranche à attaches à ressort Download PDF

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Publication number
WO2013000420A1
WO2013000420A1 PCT/CN2012/077747 CN2012077747W WO2013000420A1 WO 2013000420 A1 WO2013000420 A1 WO 2013000420A1 CN 2012077747 W CN2012077747 W CN 2012077747W WO 2013000420 A1 WO2013000420 A1 WO 2013000420A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
tray
edge
slider
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2012/077747
Other languages
English (en)
Chinese (zh)
Inventor
杨开明
朱煜
李鑫
汪劲松
尹文生
胡金春
张鸣
徐登峰
穆海华
崔乐卿
余东东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tsinghua University
Original Assignee
Tsinghua University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsinghua University filed Critical Tsinghua University
Publication of WO2013000420A1 publication Critical patent/WO2013000420A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the invention relates to a wafer clamping device, which is mainly used in a semiconductor wafer processing equipment and belongs to the field of ultra-precision processing. Background technique
  • the wafer transfer device of the patent US2006/0182561A1 is shown in Figs. 10(a) and 10(b).
  • the wafer tray 20 has circular grooves 24, 21a, 22a, 24a, 24b which are circular steps.
  • the bottom surface of the wafer is in contact with the surfaces of the steps 24a, 24b, and 24a, 24b support the wafer.
  • the edge of the wafer is in contact with the side faces of the step 21a and the step 22a, and the movement of the wafer in the horizontal direction is restricted.
  • the device can be used for the transfer of wafers in the semiconductor industry, but this structure has certain disadvantages: 1.
  • the size of the circular groove 24, the steps 21a, 22a, 24a, 24b for fixing the wafer has been fixed, so the device is subjected to
  • the size of the wafer is limited by the size of the wafer. 2
  • the sides of the steps 21a, 22a collide with the edge of the wafer in a rigid contact, which easily breaks the wafer. 3
  • the wafer cannot fall on the steps 24a, 24b, and the wafer will fall off during the transfer.
  • the patent US6276731B1 wafer transfer device is shown in FIG.
  • the wafer carrying area is 2, and a stepped circular groove is formed at the carrying area 2, which is a step 3 and a step 4, respectively.
  • the inner diameter of the step 3 is slightly larger than the wafer, and the height is equal to the thickness of the wafer.
  • the inner diameter of the step 4 is larger than the diameter of the wafer, and the height is equal to the thickness of the wafer.
  • the side of the step is brought into contact with the outer edge of the wafer to limit its horizontal movement for a fixed purpose.
  • the outer edge of the wafer is in contact with the side of the step 3 below the circular groove, and the design has the advantage that even if the wafer is not aligned, it is not aligned (Fig. 1 ib ), the side of the step 4 can also be used to limit its movement, ensuring that the wafer does not slip during transport.
  • this structure has some shortcomings: 1 In the high-speed transmission process, the side of the wafer collides with the rigid side of the step to collide, which is easy to damage the wafer; 2 The size of the step 3 and the step 4 is fixed, so the device is subjected to the wafer diameter. Due to size limitations, only fixed-size wafers can be transferred.
  • the invention designs a wafer clamping device using a spring clip, the purpose of which is to allow the end effector to have a certain positioning error when grasping the wafer, and to reduce the collision degree on the edge of the wafer during the transmission, and avoid The wafer is damaged due to the collision of the tray with the edge of the wafer, and the device is not limited by the diameter of the wafer.
  • a wafer clamping device using a spring clip characterized in that: a sheet V-shaped tray 101 is mounted, and two wafer clips 108 and two convex support blocks 106 are mounted on the top end and the end of the tray, and both ends of the tray end Each has two threaded holes, and the positions of the two wafer clips 108 at the end of the tray can be adjusted in different threaded holes depending on the diameter of the wafer.
  • the upper surface of the raised support block 106 is planar to support the wafer.
  • the wafer clip 108 is composed of a bracket 102, a link 104, a spring 105, and a slider 103.
  • the bracket 102 is cylindrical, is threadedly connected to the sheet V-tray 101, and is rotatable by a certain angle.
  • the slider 103 is provided with a through hole, and can be linearly moved along the connecting rod 104.
  • the side has a sloped portion and a vertical portion. The wafer falls along the inclined portion, and finally the edge thereof is in contact with the vertical portion, so that the wafer 109 is placed on the four sliders.
  • the end of the connecting rod 104 is fixedly connected to the bracket, and the other end supports the slider.
  • the spring 105 is sleeved on the connecting rod 104, one end is fixed to the bracket 102, and the other end is fixed to the slider 103. When the slider 103 moves, the spring 105 is deformed, and a certain pressure is generated on the edge of the wafer 109 through the slider 103 to make the crystal
  • the circle 109 is fixed.
  • the present invention adopts the above technical solution.
  • the wafer 109 is allowed to fall within the range of the inclined portion 103a of the slider 103, so that the end effector is allowed to exist when the wafer 109 is grasped.
  • a certain positioning error The use of elastic elements increases the flexibility of the device and avoids breakage caused by collisions at the edge of the wafer 109 during transport.
  • the position of the end wafer clip can be adjusted so that the device is not limited by the size of the transport wafer diameter.
  • Figure 1 is a top plan view of the wafer transfer apparatus of the patent.
  • Figure 2 is a side view of the wafer transfer apparatus shown in Figure 1.
  • Figure 3 (a) is a partially enlarged plan view of the wafer clip.
  • Figure 3 (b) is a partially enlarged front elevational view of the wafer clip.
  • Figure 4 is a diagram showing the state of instantaneous contact with the edge of the wafer when the wafer is grabbed.
  • Figure 5 is a diagram showing the state of the wafer in the process of transmission.
  • Figure 6 (a) is a plot of wafer clip size versus wafer diameter size.
  • Figure 6 (b) is a plot of wafer clip size versus wafer diameter size.
  • Figure 7 is a perspective view of the wafer clip that can be rotated.
  • Figure 8 is a wafer center diagram through the wafer center.
  • Figure 9 is a diagram of the slider height dimension requirement.
  • Figure 10 is a structural diagram of a wafer transfer apparatus of US2006/0182561A1.
  • Figure 11 is a structural view of a wafer transfer apparatus of the patent US6276731B1.
  • FIG. 1 is a plan view of a wafer chucking apparatus 100 in the present invention.
  • 2 is a side view of the wafer clamping device 100 of FIG. 1.
  • the sheet tray 101 in the wafer holding device 100 has an approximate V shape, and may be Y-shaped or U-shaped.
  • a partial enlarged view of the wafer clip is shown in Figures 3a and 3b.
  • the bracket 102 has a cylindrical shape and is screwed to the tray 101.
  • the wafer clip at the front end of the tray 101 is fixed in position.
  • the slider 103 has a ramp shape at 103a, a bottom portion at the bottom portion 103b for contacting the edge of the wafer 109, and 103c is a through hole for linearly moving the slider 103 along the link 104.
  • the connecting rod 104 has a cylindrical shape, one end of which is fixedly connected to the bracket 102, and the other end supports the slider 103 for linear movement.
  • the spring 105 is sleeved on the connecting rod 104, and one end is fixedly connected to the bracket, and the other end is fixedly connected to the slider 103.
  • Each of the top ends of the tray 101 has a raised support member 106 located adjacent to the wafer clip and adjacent the wafer clip to the inside of the tray 101; there is a projection 106 on each side of the end of the tray 101.
  • 106 is cylindrical, and the top surface 106a is flat and chamfered circumferentially, and may be screwed to the tray 101 or bonded. When the wafer 109 is supported, the top surface 106a contacts the bottom surface of the wafer 109 to support the wafer.
  • the wafer 109 is first brought into contact with the sliders 103a of the four wafer clips.
  • the wafer 109 will move downward under the force of gravity. Since the 103a is inclined, the force component of the gravity of the wafer 109 causes the slider 103 to move linearly along the link 104 toward the holder while compressing the spring 105.
  • the slider 103 moves a certain distance along the link 104, and the wafer 109 falls between the four sliders.
  • the slider surface 103b and the wafer 109 The edge contact limits the horizontal movement of the wafer 109, and the bottom surface of the wafer is in contact with the top surface 106a of the four raised supports 106 and is supported by the four raised members 106.
  • the wafer 109 is sandwiched between the four wafer clips, and the wafer 109 is fixed by a certain clamping force on the wafer 109 due to the deformation of the spring 105.
  • the length of the link 104, the length of the spring 105, and the position of the end wafer clip should be adjusted according to the diameter of the wafer 109 so that the wafer 109 can fall while sliding the wafer 109.
  • the inclined portion 103a of the block 103 is in the range. As shown in Fig. 6 (a) and Fig. 6 (b), assuming that the diameter of the wafer 109 is D, D1 ⁇ D ⁇ D2 should be made. If D ⁇ D1, the edge of the wafer cannot be subjected to pressure, and thus the horizontal movement of the wafer 109 cannot be restricted. If D > D2, the wafer 109 cannot fall between the four clips, and the wafer 109 will be detached during the transfer.
  • the holder 102 of the wafer clip can be rotated a certain angle.
  • the deformation amount of the spring 105 in each clip should be equal, that is, the amount of movement of the slider 103 should be equal, so the angle of the bracket 102 should be adjusted so that the axis of each clip passes through the wafer 109. center.
  • Figure 8 the deformation amount of the spring 105 in each clip should be equal, that is, the amount of movement of the slider 103 should be equal, so the angle of the bracket 102 should be adjusted so that the axis of each clip passes through the wafer 109. center.
  • the distance between the bottom of the slope 103a and the upper surface of the tray 101 is L1
  • the distance between the bottom of the surface 103b and the upper surface of the tray 101 is L2
  • the wafer 109 is supported by the projections 106, the upper surface of the wafer 109
  • the distance from the upper surface of the tray 101 is H1
  • the distance between the lower surface of the wafer 109 and the upper surface of the tray 101 is H2, and the following relationship should be satisfied between the sizes, that is, L1>H1, L2 ⁇ H2 o
  • the slider 103 is fixedly coupled to the spring 105 so that the length of the spring 105 or the stiffness of the spring 105 can be varied.
  • the number of thrusts of the wafer clip fixed wafer 109 is changed to avoid damage to the wafer due to excessive pressure.
  • the wafer 109 when the wafer 109 is lifted, the wafer 109 can be placed within the inclined portion 103a of the slider 103, so that the end effector is allowed when the wafer 109 is grasped. There is a certain positioning error.
  • the use of elastic elements increases the flexibility of the device and avoids wafer breakage caused by collision of the wafer with the edge of the wafer 109 during transport.
  • the position of the two wafer clips at the end can be adjusted so that the device is not limited by the size of the transport wafer diameter.

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de serrage de tranche à attaches élastiques. Le dispositif comprend une plaque (101), des pinces pour tranche (108) et des blocs de support faisant saillie (106). Une pince pour tranche (108) comprend un support (102), une tige de liaison (104), un ressort (105), et un bloc coulissant (103). Pendant la capture de la tranche (109), son bord est en contact avec les parties plus minces du bloc coulissant (103). La force composante de la gravité de la tranche entraîne le déplacement des blocs coulissants (103) le long des tiges de liaison (104) vers les supports (102), et la compression des ressorts, la tranche (109) étant serrée entre les pinces pour tranche (108). La surface inférieure de la tranche est en contact avec la surface supérieure des quatre blocs de support faisant saillie (106), la tranche étant supportée par les blocs de support faisant saillie (106). Le bord de la tranche est en contact avec le côté des blocs coulissants. Les ressorts se déforment, exercent un certain degré de pression sur le bord de la tranche et serrent étroitement la tranche, ce qui la maintient en place. Le changement de position des pinces pour tranche sur l'extrémité distante de la plaque permet de transporter des tranches de diamètres différents. Les ressorts améliorent la flexibilité du système, ce qui évite l'endommagement de la tranche causé par un contact dur entre la plaque et le bord de la tranche pendant son transport. Pendant sa capture, la tranche doit seulement être déposée dans la zone plus mince des blocs coulissants pour répondre aux exigences, ce qui permet aux actionneurs sur l'extrémité distante d'avoir un certain degré d'erreurs de position.
PCT/CN2012/077747 2011-06-28 2012-06-28 Dispositif de serrage de tranche à attaches à ressort Ceased WO2013000420A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110176775 2011-06-28
CN201110176775.0 2011-06-28

Publications (1)

Publication Number Publication Date
WO2013000420A1 true WO2013000420A1 (fr) 2013-01-03

Family

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Application Number Title Priority Date Filing Date
PCT/CN2012/077747 Ceased WO2013000420A1 (fr) 2011-06-28 2012-06-28 Dispositif de serrage de tranche à attaches à ressort

Country Status (2)

Country Link
CN (2) CN202678300U (fr)
WO (1) WO2013000420A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106373918A (zh) * 2016-09-30 2017-02-01 无锡宏纳科技有限公司 带有滑动卡位装置的晶圆夹持装置
CN111426938A (zh) * 2020-04-07 2020-07-17 东莞市蒙威智能科技有限公司 晶圆测试装置
WO2021179000A1 (fr) * 2020-03-06 2021-09-10 Lam Research Corporation Structure annulaire à doigts de centrage souples

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CN202678300U (zh) * 2011-06-28 2013-01-16 清华大学 一种利用弹簧夹子的晶圆夹持装置
CN103943545A (zh) * 2013-01-21 2014-07-23 北京北方微电子基地设备工艺研究中心有限责任公司 机械手和半导体设备
CN103745949B (zh) * 2013-12-24 2017-02-15 苏州市奥普斯等离子体科技有限公司 一种芯片夹持装置
CN104752287B (zh) * 2013-12-30 2018-03-09 北京北方华创微电子装备有限公司 托盘装卸手
CN103752576B (zh) * 2014-01-14 2015-11-18 无锡江南计算技术研究所 一种离心清洗通用治具
CN104034662B (zh) * 2014-06-13 2016-05-25 北京工业大学 一种用于拉曼光谱法测量晶圆残余应力的精确定位工具-定位仪
CN106711071B (zh) * 2015-11-13 2020-06-19 北京北方华创微电子装备有限公司 装卸手
US9919430B1 (en) * 2016-12-06 2018-03-20 Jabil Inc. Apparatus, system and method for providing an end effector
CN109244181B (zh) * 2018-08-28 2020-09-25 旌德君创科技发展有限公司 一种太阳能电池片用放置卡夹
CN109578911A (zh) * 2018-12-05 2019-04-05 中山悦美光电有限公司 一种新型太阳能路灯
CN109676515B (zh) * 2018-12-26 2020-09-11 江苏纳沛斯半导体有限公司 一种带清洗功能的半导体晶圆研磨装置
DE102020109866B3 (de) 2020-04-08 2021-07-01 Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh Vorrichtung und Verfahren zum Entnehmen eines gerahmten Wafers aus einer Waferablage
WO2022049786A1 (fr) * 2020-09-03 2022-03-10 川崎重工業株式会社 Main porte-substrat et robot portant un substrat
CN114496868A (zh) * 2020-11-11 2022-05-13 中国科学院微电子研究所 一种晶圆传送机械臂夹、半导体加工设备和晶圆传送方法
CN112324756B (zh) * 2020-11-28 2022-09-30 内蒙古中卷钢板有限公司 一种液压系统中用于铁屑吸附的布磁装置
CN112466808B (zh) * 2021-02-01 2021-05-25 西安奕斯伟硅片技术有限公司 一种夹持晶圆的部件及机构
CN112509964B (zh) * 2021-02-05 2021-05-18 宁波润华全芯微电子设备有限公司 一种基于物联网的清洗用夹持结构
CN113161282B (zh) * 2021-04-22 2024-04-12 北京北方华创微电子装备有限公司 用于半导体设备的支撑装置及半导体设备
CN115122369B (zh) * 2022-08-31 2022-11-25 上海果纳半导体技术有限公司武汉分公司 一种末端执行器、机械手和晶圆传输装置
CN117766446B (zh) * 2024-02-20 2024-05-03 无锡星微科技有限公司 一种送片机械手及具有该机械手的晶圆传输系统
CN120413510B (zh) * 2025-07-03 2025-09-02 苏州智程半导体科技股份有限公司 一种半导体晶圆化学清洗夹具

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06278806A (ja) * 1993-03-29 1994-10-04 Dainippon Screen Mfg Co Ltd 基板支持アーム
WO2000005761A1 (fr) * 1998-07-24 2000-02-03 Mitsubishi Denki Kabushiki Kaisha Bras de saisie de tranche
US6273484B1 (en) * 1999-10-29 2001-08-14 Winbond Electronics Corp. Wafer holding device
CN201024212Y (zh) * 2007-03-06 2008-02-20 中芯国际集成电路制造(上海)有限公司 晶圆支架
CN201075384Y (zh) * 2007-08-15 2008-06-18 陈汉阳 热处理用晶圆支持器
CN101582389A (zh) * 2009-06-04 2009-11-18 东莞宏威数码机械有限公司 柔性伸缩杆机构
WO2010068598A2 (fr) * 2008-12-11 2010-06-17 Novellus Systems, Inc. Serrage de plaquette à zone de contact minimale à circulation de gaz pour le refroidissement rapide de la plaquette
CN102097352A (zh) * 2010-07-14 2011-06-15 北京七星华创电子股份有限公司 盘状物固定装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001274226A (ja) * 2000-03-28 2001-10-05 Sony Corp ウェーハ支持装置
JPWO2006057050A1 (ja) * 2004-11-29 2008-06-05 平田機工株式会社 基板把持装置
JP4596361B2 (ja) * 2005-01-25 2010-12-08 株式会社安川電機 ウェハのアライナー装置
JP4959427B2 (ja) * 2007-06-05 2012-06-20 日本電産サンキョー株式会社 産業用ロボット
CN101728302B (zh) * 2009-12-08 2013-06-12 中国电子科技集团公司第四十五研究所 边缘接触夹持式晶圆末端执行器
CN202678300U (zh) * 2011-06-28 2013-01-16 清华大学 一种利用弹簧夹子的晶圆夹持装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06278806A (ja) * 1993-03-29 1994-10-04 Dainippon Screen Mfg Co Ltd 基板支持アーム
WO2000005761A1 (fr) * 1998-07-24 2000-02-03 Mitsubishi Denki Kabushiki Kaisha Bras de saisie de tranche
US6273484B1 (en) * 1999-10-29 2001-08-14 Winbond Electronics Corp. Wafer holding device
CN201024212Y (zh) * 2007-03-06 2008-02-20 中芯国际集成电路制造(上海)有限公司 晶圆支架
CN201075384Y (zh) * 2007-08-15 2008-06-18 陈汉阳 热处理用晶圆支持器
WO2010068598A2 (fr) * 2008-12-11 2010-06-17 Novellus Systems, Inc. Serrage de plaquette à zone de contact minimale à circulation de gaz pour le refroidissement rapide de la plaquette
CN101582389A (zh) * 2009-06-04 2009-11-18 东莞宏威数码机械有限公司 柔性伸缩杆机构
CN102097352A (zh) * 2010-07-14 2011-06-15 北京七星华创电子股份有限公司 盘状物固定装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106373918A (zh) * 2016-09-30 2017-02-01 无锡宏纳科技有限公司 带有滑动卡位装置的晶圆夹持装置
WO2021179000A1 (fr) * 2020-03-06 2021-09-10 Lam Research Corporation Structure annulaire à doigts de centrage souples
KR20220150960A (ko) * 2020-03-06 2022-11-11 램 리써치 코포레이션 순응성 (compliant) 센터링 핑거들을 갖는 링 구조
KR102883638B1 (ko) * 2020-03-06 2025-11-07 램 리써치 코포레이션 순응성 (compliant) 센터링 핑거들을 갖는 링 구조
CN111426938A (zh) * 2020-04-07 2020-07-17 东莞市蒙威智能科技有限公司 晶圆测试装置

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Publication number Publication date
CN102751228A (zh) 2012-10-24
CN202678300U (zh) 2013-01-16
CN102751228B (zh) 2014-11-26

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