WO2013099083A1 - Method for manufacturing glass substrate for hdd - Google Patents
Method for manufacturing glass substrate for hdd Download PDFInfo
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- WO2013099083A1 WO2013099083A1 PCT/JP2012/007072 JP2012007072W WO2013099083A1 WO 2013099083 A1 WO2013099083 A1 WO 2013099083A1 JP 2012007072 W JP2012007072 W JP 2012007072W WO 2013099083 A1 WO2013099083 A1 WO 2013099083A1
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- Prior art keywords
- glass substrate
- polishing
- colloidal silica
- lubricating layer
- cleaning
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
Definitions
- the present invention relates to a method for manufacturing a glass substrate for HDD. More specifically, the present invention includes a rinsing process for cleaning the polishing pad and a lubrication layer forming process for providing a lubrication layer on the polishing pad in the mirror polishing process, thereby suppressing micro-waviness of the glass substrate to be obtained and flattening.
- the present invention relates to a method for manufacturing a glass substrate for HDD, which can increase the degree.
- a glass substrate for HDD (hereinafter sometimes simply referred to as a glass substrate) is required to have small undulation and high flatness.
- the micro waviness refers to the height of micro unevenness measured at a constant measurement wavelength using a surface roughness measuring machine.
- flatness means the distance (height difference) of the up-down direction of the highest part and the lowest part of the glass substrate surface.
- the fine waviness and flatness can be adjusted mainly by precisely polishing both main surfaces of the glass substrate in the mirror polishing process. According to recent research, it is known that micro waviness can be improved by adjusting the opening diameter of a polishing pad used in a mirror polishing process (see Patent Document 1).
- the glass substrate that has undergone the mirror polishing process is sent to the subsequent chemical strengthening process and final cleaning process.
- the chemical strengthening step for example, the glass substrate is immersed in a processing tank that stores the strengthening treatment liquid.
- the final cleaning step for example, the glass substrate is immersed in a storage container in which the cleaning liquid is stored. Since the abrasive slurry remains on the surface of the glass substrate after the mirror polishing process, there is a problem that the glass substrate contaminates the strengthening treatment liquid and the cleaning liquid. Therefore, the glass substrate that has finished the mirror polishing process is washed on the surface plate. At this time, the polishing pad on the surface plate is also cleaned together with the glass substrate.
- the present invention has been made in view of such a conventional problem, and in a method for producing a glass substrate having a mirror polishing step having a cleaning step, a glass substrate having excellent flatness and less microwaviness. It aims at providing the manufacturing method of the glass substrate for obtaining.
- a method for producing a glass substrate according to one aspect of the present invention includes a mirror polishing process using a double-side polishing machine having upper and lower surface plates provided with polishing pads, and the mirror polishing process includes polishing the glass substrate after mirror polishing and polishing.
- the colloidal silica has an average primary particle diameter of 15 to 90 nm, and the surface density of the colloidal silica in the lubricating layer is 10 to 500 particles / ⁇ m 2 .
- a process of cleaning a glass substrate that has undergone mirror polishing is referred to as a rinsing process in order to distinguish it from cleaning in a final cleaning process subsequent to the mirror polishing process.
- the glass substrate is, for example, a blanks manufacturing process, a first grinding process, a coring process, an inner / outer grinding process, an inner circumference polishing process, an outer circumference polishing process, a second grinding process, a first It is manufactured through a polishing step (rough polishing step), a second polishing step (mirror polishing step), a chemical strengthening step, and a final cleaning step.
- the mirror polishing process includes a rinsing process and a lubricating layer forming process.
- the mirror polishing process which is a characteristic part of the present embodiment will be described in detail.
- the mirror polishing process is a polishing process performed on a glass substrate that has been subjected to a rough polishing process described later, and is a process of precisely polishing using a double-side polishing machine.
- a double-side polishing machine (for example, 16B type manufactured by Hamai Sangyo Co., Ltd.) polishes both main surfaces of a glass substrate while sandwiching them between upper and lower surface plates provided with polishing pads on the surface.
- polishing pad used in the mirror polishing step it is preferable to use a soft pad having a lower hardness than the polishing pad used in the rough polishing step described later (for example, NP225 manufactured by Filwel, hardness Asker-C hardness 76).
- a soft pad having a lower hardness than the polishing pad used in the rough polishing step described later for example, NP225 manufactured by Filwel, hardness Asker-C hardness 76.
- Examples of such a polishing pad include urethane foam and suede polishing pads.
- the surface of the polishing pad In order to reduce the fine waviness of the glass substrate that has undergone the mirror polishing process, it is preferable to cut the surface of the polishing pad by about 20 to 150 ⁇ m before starting the mirror polishing. When the cutting amount exceeds 150 ⁇ m, there is a tendency that minute undulation is likely to occur in the obtained glass substrate. On the other hand, when the cutting amount is less than 20 ⁇ m, the flatness of the obtained glass substrate may be lowered.
- the polishing pad preferably has a holding part (holding means) for holding colloidal silica contained in a lubricating layer described later on the surface layer part.
- the lubricating layer contains colloidal silica that is abrasive grains.
- the holding portion is not particularly limited, and examples thereof include a plurality of opening holes formed on the foamed surface.
- the depth of the opening hole is not particularly limited, and is generally 10 to 800 ⁇ m although it depends on the cutting amount of the polishing pad. Further, the average opening area of the opening holes is not particularly limited, and is approximately 0.0001 to 0.0010 mm 2 . Further, the number of opening holes is not particularly limited, and is generally 100 to 800 holes / mm 2 .
- the colloidal silica held in the holding part continues to contact the glass substrate continuously during the mirror polishing process. Therefore, the polishing accuracy is improved, and the flatness of the obtained glass substrate can be further improved.
- abrasive it is possible to use an abrasive slurry in which colloidal silica having an average primary particle size of 15 to 90 nm is dispersed in water as abrasive grains to form a slurry.
- the mixing ratio of water and colloidal silica is preferably about 1: 9 to 3: 7.
- the pH is preferably adjusted to 1.5 to 6.5 with an adjustment solution containing sulfuric acid.
- the abrasive slurry is added continuously or as needed on the surface plate during the mirror polishing process.
- the addition amount of the abrasive slurry is about 200 to 2000 mL / min.
- the polishing amount of the glass substrate in the mirror polishing step is preferably about 2 to 5 ⁇ m. By setting the polishing amount in such a range, micro defects such as micro undulations generated on the surface of the glass substrate and micro scratches generated in the previous step can be satisfactorily removed. Further, the flatness of both main surfaces of the glass substrate can be reduced to less than 0.5 ⁇ m.
- the load applied to the glass substrate by the polishing pad in the mirror polishing step is, for example, about 50 to 180 g / cm 2 .
- the rinsing process is performed after the glass substrate is polished under the above conditions.
- the rinsing step is a step of cleaning the abrasive slurry remaining on the glass substrate and the polishing pad after mirror polishing.
- the glass substrate and the polishing pad are cleaned using a rinsing liquid.
- the cleaning method is not particularly limited.
- the glass slurry and the polishing pad may be gradually cleaned while replacing the abrasive slurry added at any time during mirror polishing with a rinse liquid.
- the supply may be stopped and a rinse solution may be added.
- the rinse liquid is not particularly limited, and, for example, pure water, deaerated water whose gas dissolved amount is adjusted, and the like can be used.
- the addition amount of the rinse liquid is not particularly limited, and is about 0.5 to 20 L / min.
- the addition amount of the rinsing liquid is less than 0.5 L / min, the glass substrate cannot be sufficiently cleaned, and the glass substrate may contaminate the tempering treatment liquid or the cleaning liquid in the subsequent chemical strengthening process or the final cleaning process. There is.
- the addition amount of the rinsing liquid exceeds 20 L / min, there is a possibility that improvement of the cleaning effect on the glass substrate cannot be expected.
- the addition pressure of the rinsing liquid is not particularly limited, and it is added to a glass substrate or polishing pad at a water pressure of 100 to 500 kPa.
- the addition pressure of the rinsing liquid is less than 100 kPa, the glass substrate or the polishing pad may not be sufficiently cleaned.
- the addition pressure of the rinsing liquid exceeds 500 kPa, the glass substrate and the polishing pad may be damaged.
- the temperature of the rinse liquid is not particularly limited, and is about 5 to 50 ° C. When the temperature of the rinse liquid is less than 5 ° C., the glass substrate may not be sufficiently cleaned. On the other hand, when the rinse liquid is washed at a temperature exceeding 50 ° C., the glass substrate may be deformed or the polishing pad may be deteriorated.
- the glass substrate that has undergone the rinsing process is sent to the subsequent chemical strengthening process and the final cleaning process. Since the glass substrate is cleaned cleanly by the rinsing process, the strengthening treatment liquid and the cleaning liquid are not extremely contaminated. On the other hand, the surface of the surface plate provided with the polishing pad that has undergone the rinsing process is cleaned cleanly. In the present embodiment, a lubricating layer is formed on such a polishing pad.
- the lubricating layer forming step is a step of adding an abrasive slurry containing colloidal silica to the polishing pad to form a lubricating layer on the surface of the polishing pad.
- a slurry in which colloidal silica having an average primary particle diameter of 15 to 90 nm is dispersed in water as abrasive grains can be used.
- the average primary particle diameter of the colloidal silica is less than 15 nm, the particle diameter of the colloidal silica held in the lubricating layer described later is too small, so that sufficient lubrication performance tends not to be obtained.
- it exceeds 90 nm since the particle diameter of colloidal silica held in the lubricating layer described later is too large, the fine undulation tends to increase.
- the mixing ratio of water and colloidal silica is preferably about 1: 9 to 3: 7. If necessary, it is preferable to adjust the pH to 1.5 to 6 with an adjusting solution containing sulfuric acid.
- the abrasive slurry used in the lubricating layer forming step can be the same as the abrasive slurry used during the mirror polishing step.
- a new glass substrate can be placed on a surface plate having a polishing pad on which a lubricating layer is formed, and the time required to start mirror polishing can be shortened.
- the method of adding the abrasive slurry in the lubricating layer forming step is not particularly limited.
- the abrasive slurry may be added by supplying from the outside through a through-hole disposed on the upper surface plate of the double-side polishing machine.
- the slurry can be added by a method such as immersing it in a storage container storing the slurry.
- the surface density of colloidal silica in the lubricating layer is 10 to 500 / ⁇ m 2 , and more preferably 100 to 250 / ⁇ m 2 .
- the surface density is less than 10 pieces / ⁇ m 2 , the flatness of the glass substrate obtained by mirror polishing tends to deteriorate.
- the surface density exceeds 500 / ⁇ m 2 , many defects tend to be formed on the main surface and the end surface of the glass substrate after the mirror polishing.
- a defect refers to an area or location that cannot be recorded to the extent that it can be accurately reproduced due to scratches or dust existing on the glass substrate, deterioration of the glass substrate, or the like.
- the surface density is adjusted to the above range by adjusting the proportion of colloidal silica contained in the abrasive slurry, the average primary particle diameter, the depth, number, and area of the openings formed in the polishing pad surface. Can do.
- the manufacturing method of the glass substrate of this Embodiment should just have an above-described mirror polishing process, and it does not specifically limit about other processes. For this reason, the other steps described below are examples, and the design can be changed as appropriate.
- the blanks manufacturing process is a process of melting a glass material and obtaining a glass substrate (blanks) from the molten glass material.
- the glass material examples include soda lime glass, aluminosilicate glass, borosilicate glass, Li 2 O—SiO 2 glass, Li 2 O—Al 2 O 3 —SiO 2 glass, R′O—Al 2 O 3.
- the method for obtaining blanks is not particularly limited, and for example, a method of obtaining a disk-shaped glass substrate (blanks) by pouring a molten glass material into a lower mold and press molding with an upper mold can be employed.
- blanks are not restricted to press molding, For example, you may cut and produce the sheet glass formed by the down draw method, the float method, etc. with the grinding stone. In this molding process, foreign matter and bubbles are mixed in the vicinity of the surface of the blank, or scratches are generated, resulting in defects.
- the size of the blanks is not particularly limited, and for example, blanks having various outer diameters of 2.5 inches, 1.8 inches, 1 inch, 0.8 inches, and the like can be produced. It does not specifically limit about the thickness of a glass substrate, For example, blanks of various thickness, such as 2 mm, 1 mm, 0.8 mm, 0.63 mm, can be produced.
- Blanks produced by press molding or cutting can be alternately laminated with heat-stable setters and passed through a high-temperature electric furnace to promote reduction of warpage and crystallization of glass.
- the first grinding step is a step of preliminarily adjusting the parallelism, flatness and thickness of the glass substrate by grinding both surfaces of the blank.
- the main surface of the blank is lapped (ground) to obtain a glass base material.
- the lapping process is performed using alumina-based loose abrasive grains by a double-sided lapping apparatus using a planetary gear mechanism. Specifically, in the lapping process, both main surfaces of the blanks are pressed against the lapping platen from above and below, a grinding liquid containing free abrasive grains is supplied onto the main surface of the plate glass, and these are moved relatively. Do it. By this lapping process, a glass substrate having a flat main surface is obtained.
- the coring step is a step of opening a circular hole (center hole) in the center of the glass substrate.
- the coring step is a step of forming an annular glass substrate by forming an inner hole at the center of the glass substrate using a cylindrical diamond drill.
- the inner / outer grinding step is a step in which the inner peripheral end surface and the outer peripheral end surface of the glass substrate are ground with a drum-shaped grinding wheel using diamond or the like and subjected to a predetermined chamfering process.
- the inner peripheral polishing step is a step of alternately laminating glass substrates and spacers one by one to create a laminate, and polishing the inner peripheral end surface with an inner peripheral end surface polishing machine.
- the spacer is not particularly limited.
- a spacer made of polypropylene having a thickness of 0.3 mm, an inner diameter of 21 mm, and an outer diameter of 64 mm can be employed.
- nylon fibers having a diameter of 0.2 mm can be used for the brush bristles of the polishing machine.
- the number of rotations of the rotating brush can be set to 10,000 rpm, for example.
- As the polishing liquid for inner circumference polishing for example, a polishing liquid containing a hydrofluoric acid solvent can be used, and as the polishing agent, for example, cerium oxide having an average primary particle diameter of 3 ⁇ m can be used.
- the outer peripheral polishing step is a step of alternately laminating glass substrates and spacers one by one to create a laminate, and polishing the outer peripheral end surface by an outer peripheral end surface polishing machine.
- the polishing conditions of the spacer and the polishing machine used are the same as those used in the inner peripheral polishing step.
- the second grinding step is a step of grinding both main surfaces of the glass substrate to remove large scratches and improve flatness.
- both main surfaces of the glass substrate are lapped with a lapping machine (manufactured by HAMAI).
- the wrapping conditions are not particularly limited.
- diamond pellets of # 1500 mesh can be used, the load can be 100 g / cm 2 , the upper surface plate can be rotated at 30 rpm, and the lower surface plate can be rotated at 10 rpm.
- Rmax is about 3 ⁇ m and Ra is about 0.3 ⁇ m.
- the glass substrate that has undergone the second grinding step is substantially free from defects such as large undulations, chippings, and cracks.
- the grinding liquid or glass powder remains on the surface of the glass substrate that has undergone the grinding process. Therefore, in this embodiment, it is preferable to provide a cleaning process.
- various cleaning methods can be employed.
- the glass substrate may be subjected only to alkali cleaning, may be subjected to acid cleaning after acid cleaning, or may be only subjected to acid cleaning.
- the rough polishing step is a step of polishing both surfaces of the glass substrate so as to efficiently obtain the surface roughness finally required in the subsequent mirror polishing step. It does not specifically limit as a grinding
- the polishing liquid preferably uses cerium oxide having an average primary particle size of 0.6 to 2.5 ⁇ m as abrasive grains, and the abrasive grains are dispersed in water to form a slurry.
- the mixing ratio of water and cerium oxide is about 1: 9 to 3: 7.
- the polishing amount of the glass substrate in the rough polishing step is preferably about 25 to 40 ⁇ m. When the polishing amount of the glass substrate is less than 25 ⁇ m, there is a tendency that scratches and defects cannot be sufficiently removed. On the other hand, when the polishing amount of the glass substrate exceeds 40 ⁇ m, polishing is performed more than necessary, and the production efficiency tends to decrease.
- ⁇ Second polishing step (mirror polishing step)>
- the mirror polishing process has already been described above.
- the manufacturing method of the glass substrate of this Embodiment has a rinse process in a mirror polishing process, and the glass substrate which finished mirror polishing is wash
- the present embodiment includes the lubricating layer forming step, the lubricating layer is formed on the polishing pad cleaned by the rinsing step.
- the chemical strengthening step is a step of immersing the glass substrate in a strengthening treatment solution to improve the impact resistance, vibration resistance, heat resistance, and the like of the glass substrate.
- the chemical strengthening method employed in the chemical strengthening step is not particularly limited, but usually, a glass substrate is immersed in a heated strengthening treatment solution, and alkali ions (for example, lithium ions) contained in the glass substrate have a relatively small ion radius.
- An ion exchange method is employed in which ions are replaced with alkali ions having a larger ion radius (for example, potassium ions and sodium ions).
- a reinforcing layer ion exchange layer and compressive stress layer
- the obtained glass substrate has a uniform chemical strengthening layer, a uniform compressive strain, hardly deforms, has good flatness, and is excellent in mechanical strength.
- the waiting time and the water temperature in the water immersing step are not particularly limited.
- the water temperature may be waited for 1 to 60 seconds in the air and immersed in water at about 35 to 100 ° C., and is appropriately determined in consideration of manufacturing efficiency.
- the final cleaning step is a step of cleaning and cleaning the glass substrate. It does not specifically limit as a washing
- the cleaned glass substrate is subjected to ultrasonic cleaning and drying as necessary.
- the drying step is a step of drying the surface of the glass substrate after removing the cleaning liquid remaining on the surface of the glass substrate with isopropyl alcohol (IPA) or the like.
- IPA isopropyl alcohol
- the final cleaning step for example, a step of performing a water rinsing cleaning step on the glass substrate after the scrub cleaning for 2 minutes to remove a residue of the cleaning liquid can be employed.
- an IPA cleaning process is performed for 2 minutes, and a process of removing water remaining on the surface of the glass substrate by IPA can be employed.
- the final cleaning step may employ a step of performing the IPA vapor drying step for 2 minutes and drying while removing the liquid IPA adhering to the surface of the glass substrate with the IPA vapor.
- the method for drying the glass substrate is not particularly limited, and a known drying method such as spin drying or air knife drying can be employed. After the glass substrate that has undergone these steps is inspected for scratches, cracks, adhesion of foreign matter, etc. visually or using an optical surface analyzer (for example, “OSA6100” manufactured by KLA-TENCOL), the foreign matter etc. In a clean environment, it is stored in a dedicated storage cassette, vacuum packed, and then shipped.
- a known drying method such as spin drying or air knife drying can be employed.
- the present embodiment is not limited to the HDD manufacturing method, and can be used as a manufacturing method of a magneto-optical disk, an optical disk, or the like.
- this embodiment is designed to change the grinding process into two processes in order, to omit the rough polishing process, to perform the chemical strengthening process before the mirror polishing process, etc. Is possible.
- the present embodiment may perform chemical strengthening treatment on the outer peripheral end face and inner peripheral end face other than the main surface of the glass substrate as a measure for drop strength, or as an edge mitigation process for scratches generated on the glass substrate.
- the substrate may be subjected to a hydrogen fluoride immersion treatment.
- the manufacturing method of the glass substrate for HDD for obtaining the glass substrate which has the outstanding flatness and few microwaviness can be provided.
- the method for producing a glass substrate of the present invention has a mirror polishing process using a double-side polishing machine having upper and lower surface plates provided with a polishing pad, and the mirror polishing process is performed on the glass substrate and the polishing pad after mirror polishing.
- the average primary particle diameter of the colloidal silica is 15 to 90 nm, and the surface density of the colloidal silica in the lubricating layer is 10 to 500 particles / ⁇ m 2 .
- the glass substrate is less likely to contaminate the cleaning liquid in the subsequent process.
- the cleaned polishing pad of the surface plate has a lubrication layer newly containing colloidal silica. Therefore, when the glass substrate before mirror polishing is newly arranged on the surface plate, a large frictional force is unlikely to be generated between the glass substrate and the polishing pad. As a result, when mirror polishing is started, the glass substrate smoothly moves horizontally, and the horizontality of the glass substrate during mirror polishing is maintained. Therefore, a glass substrate having excellent flatness and less microwaviness can be obtained.
- the polishing pad has a holding means for holding the lubricating layer on the surface layer portion.
- the polishing pad has the holding means, the colloidal silica abrasive grains are continuously held on the surface layer portion of the polishing pad during the mirror polishing process, and can come into contact with the glass substrate. As a result, the polishing accuracy is improved, and the flatness of the resulting glass substrate can be further improved.
- the manufacturing method of the glass substrate of this invention is explained in full detail by an Example.
- the manufacturing method of the glass substrate of this invention is not limited to the Example shown below at all.
- a glass substrate was prepared by the following method.
- polishing slurry was added to the polishing pad, and a lubricating layer was formed on the polishing pad.
- the added polishing slurry was a slurry obtained by dispersing colloidal silica having an average primary particle size of 20 nm as abrasive grains (polishing component) in water.
- the mixing ratio of water and abrasive grains in the polishing slurry was adjusted between 99: 1 and 80:20 so that the surface density of the colloidal silica in the lubricating layer of the polishing pad was a predetermined value.
- the pH was adjusted to 4.5 with an adjusting solution containing sulfuric acid.
- the surface density of the colloidal silica in the lubricating layer of the obtained polishing pad was 120 / ⁇ m 2 .
- the surface density was calculated by drying the polishing pad with the lubricating layer formed and measuring the number of colloidal silica particles on the surface with a scanning electron microscope (SEM). About the aggregated colloidal silica, the number was estimated from the area, and it was set as the number of particles of colloidal silica.
- both main surfaces of the glass substrate were polished more precisely by using a double-side polishing machine (Type 16B, manufactured by Hamai Sangyo Co., Ltd.).
- abrasive slurry colloidal silica having an average primary particle diameter of 20 nm was dispersed in water as abrasive grains (polishing liquid component) to form a slurry, and the mixing ratio of water and abrasive grains was 80:20 did.
- pH was adjusted with the adjustment liquid containing a sulfuric acid.
- the load was 120 g / cm 2 . In this step, 100 batches of glass substrates were processed into 5 batches.
- the obtained glass substrate was chemically strengthened.
- the chemical strengthening treatment liquid an aqueous solution of a mixed molten salt of potassium nitrate (KNO 3 ) and sodium nitrate (NaNO 3 ) was used. The mixing ratio was 1: 1 by mass ratio. The temperature of the chemical strengthening treatment liquid was 380 ° C., and the immersion time was 25 minutes.
- the glass substrate was scrubbed.
- a cleaning liquid a liquid obtained by diluting KOH and NaOH mixed at a mass ratio of 1: 1 with ultrapure water (DI water) and adding a nonionic surfactant to enhance the cleaning performance is obtained.
- DI water ultrapure water
- the cleaning liquid was supplied by spraying. After scrub cleaning, in order to remove the cleaning liquid remaining on the surface of the glass substrate, a water rinse cleaning process is performed in an ultrasonic bath for 2 minutes, an IPA cleaning process is performed in an ultrasonic bath for 2 minutes, and finally the glass substrate is cleaned with IPA vapor. The surface of was dried.
- Example 2 A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 200 pieces / ⁇ m 2 .
- Example 3 A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 400 / ⁇ m 2 .
- Example 4 A glass substrate was produced in the same manner as in Example 1 except that the average primary particle diameter of colloidal silica in the lubricating layer forming step was 80 nm and the surface density was 200 particles / ⁇ m 2 .
- Example 5 A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 12 / ⁇ m 2 .
- Example 6 A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 80 / ⁇ m 2 .
- Example 1 A glass substrate was produced in the same manner as in Example 1 except that the lubricating layer forming step was not adopted.
- a glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 8 pieces / ⁇ m 2 .
- Example 3 A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 800 pieces / ⁇ m 2 .
- Example 4 A glass substrate was produced in the same manner as in Example 1 except that the average primary particle diameter of colloidal silica in the lubricating layer forming step was 10 nm.
- Example 5 A glass substrate was produced in the same manner as in Example 1 except that the average primary particle diameter of colloidal silica in the lubricating layer forming step was 100 nm and the surface density was 200 particles / ⁇ m 2 .
- the glass substrates obtained in Examples 1 to 6 and Comparative Examples 1 to 5 were subjected to flatness measurement, microwaviness measurement, and deposit inspection. The test method is shown below, and the results are shown in Table 1.
- Comparative Example 4 since the average primary particle diameter of the colloidal silica held in the lubricating layer was small, sufficient lubrication performance was not exhibited, friction acted on the substrate at the initial stage of processing, and the flatness was 0.6 ⁇ m or more. It was. In Comparative Example 5, since the average primary particle diameter of the colloidal silica held in the lubricating layer was too large, the value of the microwaviness was high.
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Abstract
Description
本発明は、HDD用ガラス基板の製造方法に関する。より詳細には、本発明は、鏡面研磨工程において、研磨パッドを洗浄するリンス工程と、研磨パッドに潤滑層を設ける潤滑層形成工程を備えることにより、得られるガラス基板の微小うねりを抑え、平坦度を上げることのできるHDD用ガラス基板の製造方法に関する。 The present invention relates to a method for manufacturing a glass substrate for HDD. More specifically, the present invention includes a rinsing process for cleaning the polishing pad and a lubrication layer forming process for providing a lubrication layer on the polishing pad in the mirror polishing process, thereby suppressing micro-waviness of the glass substrate to be obtained and flattening. The present invention relates to a method for manufacturing a glass substrate for HDD, which can increase the degree.
近年、情報記録媒体を搭載したディスク装置(たとえばハードディスクドライブ HDD)の高性能化に伴い、使用されるメディアに求められる品質水準が高まっている。HDD用ガラス基板(以下、単にガラス基板という場合がある)では、微小うねりが小さく、平坦度が高いことが求められる。なお、本明細書において、微小うねりとは、表面粗さ測定機を用いて一定の測定波長で測定された微小な凹凸を高さで表したものをいう。また、平坦度とは、ガラス基板表面の最も高い部分と最も低い部分との上下方向の距離(高低差)をいう。微小うねりや平坦度は、主に、鏡面研磨工程においてガラス基板の両主表面を精密に研磨することにより調整することができる。近年の研究により、微小うねりは、鏡面研磨工程で使用する研磨パッドの開口径を調整して改善することができることが知られている(特許文献1参照)。 In recent years, with the improvement in performance of disk devices (for example, hard disk drives and HDDs) equipped with information recording media, the quality level required for the media used has increased. A glass substrate for HDD (hereinafter sometimes simply referred to as a glass substrate) is required to have small undulation and high flatness. In the present specification, the micro waviness refers to the height of micro unevenness measured at a constant measurement wavelength using a surface roughness measuring machine. Moreover, flatness means the distance (height difference) of the up-down direction of the highest part and the lowest part of the glass substrate surface. The fine waviness and flatness can be adjusted mainly by precisely polishing both main surfaces of the glass substrate in the mirror polishing process. According to recent research, it is known that micro waviness can be improved by adjusting the opening diameter of a polishing pad used in a mirror polishing process (see Patent Document 1).
ところで、鏡面研磨工程を経たガラス基板は、後続する化学強化工程や最終洗浄工程に送られる。化学強化工程では、たとえば強化処理液を貯留した処理槽にガラス基板が浸漬される。また、最終洗浄工程では、たとえば洗浄液が貯留された貯留容器にガラス基板が浸漬される。鏡面研磨工程を終えたガラス基板の表面には、研磨剤スラリーが残存しているため、ガラス基板は、強化処理液や洗浄液を汚染する、という問題がある。そのため、鏡面研磨工程を終えたガラス基板は、定盤上において洗浄される。この際、定盤の研磨パッドもガラス基板とともに洗浄される。 By the way, the glass substrate that has undergone the mirror polishing process is sent to the subsequent chemical strengthening process and final cleaning process. In the chemical strengthening step, for example, the glass substrate is immersed in a processing tank that stores the strengthening treatment liquid. In the final cleaning step, for example, the glass substrate is immersed in a storage container in which the cleaning liquid is stored. Since the abrasive slurry remains on the surface of the glass substrate after the mirror polishing process, there is a problem that the glass substrate contaminates the strengthening treatment liquid and the cleaning liquid. Therefore, the glass substrate that has finished the mirror polishing process is washed on the surface plate. At this time, the polishing pad on the surface plate is also cleaned together with the glass substrate.
ここで、バフ量(表面切削量)を小さく抑えた研磨パッドを用いて鏡面研磨を行った場合、研磨の初期段階でガラス基板の平坦度が悪化する、という問題がある。この原因としては、上記した鏡面研磨工程において洗浄を経た定盤上に、新たな研磨前のガラス基板を配置すると、該ガラス基板と研磨パッドとの間に大きな摩擦力が発生し、バフ量の小さな研磨パッドを用いて鏡面研磨を開始した際に、当該摩擦力によってガラス基板のスムーズな水平移動が妨げられて、ガラス基板の水平性が保たれないことが挙げられる。 Here, when mirror polishing is performed using a polishing pad with a small buff amount (surface cutting amount), there is a problem that the flatness of the glass substrate deteriorates at the initial stage of polishing. As a cause of this, when a new unpolished glass substrate is placed on the surface plate that has been cleaned in the mirror polishing step described above, a large frictional force is generated between the glass substrate and the polishing pad, and the buff amount is reduced. When mirror polishing is started using a small polishing pad, smooth horizontal movement of the glass substrate is hindered by the frictional force, and the horizontality of the glass substrate cannot be maintained.
本発明は、このような従来の問題に鑑みてなされたものであり、洗浄工程を有する鏡面研磨工程を有するガラス基板の製造方法において、優れた平坦度を有し、微小うねりの少ないガラス基板を得るためのガラス基板の製造方法を提供することを目的とする。 The present invention has been made in view of such a conventional problem, and in a method for producing a glass substrate having a mirror polishing step having a cleaning step, a glass substrate having excellent flatness and less microwaviness. It aims at providing the manufacturing method of the glass substrate for obtaining.
本発明の一局面によるガラス基板の製造方法は、研磨パッドを備えた上下の定盤を有する両面研磨機を用いる鏡面研磨工程を有し、該鏡面研磨工程は、鏡面研磨後のガラス基板と研磨パッドとに残存する研磨剤スラリーを洗浄するリンス工程と、リンス工程を経たガラス基板を移動させ、研磨パッドにコロイダルシリカを含む研磨剤スラリーを添加して潤滑層を形成する潤滑層形成工程と、を有し、前記コロイダルシリカの平均一次粒子径は、15~90nmであり、前記潤滑層における前記コロイダルシリカの面密度は、10~500個/μm2であることを特徴とする。 A method for producing a glass substrate according to one aspect of the present invention includes a mirror polishing process using a double-side polishing machine having upper and lower surface plates provided with polishing pads, and the mirror polishing process includes polishing the glass substrate after mirror polishing and polishing. A rinsing step for cleaning the abrasive slurry remaining on the pad, a lubricating layer forming step for forming a lubricating layer by moving the glass substrate that has undergone the rinsing step and adding an abrasive slurry containing colloidal silica to the polishing pad, The colloidal silica has an average primary particle diameter of 15 to 90 nm, and the surface density of the colloidal silica in the lubricating layer is 10 to 500 particles / μm 2 .
本発明の目的、特徴および利点は、以下の詳細な説明によって、より明白となる。 The objects, features and advantages of the present invention will become more apparent from the following detailed description.
以下、本実施の形態のガラス基板の製造方法について、詳細に説明する。なお、本明細書では、鏡面研磨工程に後続する最終洗浄工程における洗浄と区別するために、鏡面研磨を経たガラス基板を洗浄する工程のことをリンス工程という。 Hereinafter, the manufacturing method of the glass substrate of the present embodiment will be described in detail. In this specification, a process of cleaning a glass substrate that has undergone mirror polishing is referred to as a rinsing process in order to distinguish it from cleaning in a final cleaning process subsequent to the mirror polishing process.
本実施の形態のガラス基板の製造方法において、ガラス基板は、たとえばブランクス製造工程、第一研削工程、コアリング工程、内外研削工程、内周研磨工程、外周研磨工程、第二研削工程、第一研磨工程(粗研磨工程)、第二研磨工程(鏡面研磨工程)、化学強化工程、最終洗浄工程を経て作製される。鏡面研磨工程は、リンス工程と、潤滑層形成工程を有する。以下、本実施の形態の特徴部分である鏡面研磨工程を詳述する。 In the method for manufacturing a glass substrate of the present embodiment, the glass substrate is, for example, a blanks manufacturing process, a first grinding process, a coring process, an inner / outer grinding process, an inner circumference polishing process, an outer circumference polishing process, a second grinding process, a first It is manufactured through a polishing step (rough polishing step), a second polishing step (mirror polishing step), a chemical strengthening step, and a final cleaning step. The mirror polishing process includes a rinsing process and a lubricating layer forming process. Hereinafter, the mirror polishing process which is a characteristic part of the present embodiment will be described in detail.
<鏡面研磨工程>
鏡面研磨工程は、後述する粗研磨工程を経たガラス基板に対して行う研磨工程であり、両面研磨機を使用して精密に研磨加工する工程である。両面研磨機(たとえば浜井産業(株)製、16Bタイプ)は、ガラス基板の両主表面を、研磨パッドを表面に備えた上下の定盤で挟みながら研磨する。
<Mirror polishing process>
The mirror polishing process is a polishing process performed on a glass substrate that has been subjected to a rough polishing process described later, and is a process of precisely polishing using a double-side polishing machine. A double-side polishing machine (for example, 16B type manufactured by Hamai Sangyo Co., Ltd.) polishes both main surfaces of a glass substrate while sandwiching them between upper and lower surface plates provided with polishing pads on the surface.
鏡面研磨工程で使用する研磨パッドとしては、後述する粗研磨工程で使用する研磨パッドよりも低硬度の軟質パッド(たとえばFilwel製のNP225、硬度Asker-C硬度76)を使用することが好ましい。このような研磨パッドとしては、たとえば発泡ウレタンやスウェードの研磨パッドが挙げられる。 As the polishing pad used in the mirror polishing step, it is preferable to use a soft pad having a lower hardness than the polishing pad used in the rough polishing step described later (for example, NP225 manufactured by Filwel, hardness Asker-C hardness 76). Examples of such a polishing pad include urethane foam and suede polishing pads.
鏡面研磨工程を経たガラス基板の微小うねりを少なくするために、鏡面研磨を開始する前に、研磨パッドの表面を、20~150μm程度、切削することが好ましい。切削量が150μmを超える場合には、得られるガラス基板に微小うねりが発生しやすい傾向がある。一方、切削量が20μm未満の場合には、得られるガラス基板の平坦度が低下する可能性がある。 In order to reduce the fine waviness of the glass substrate that has undergone the mirror polishing process, it is preferable to cut the surface of the polishing pad by about 20 to 150 μm before starting the mirror polishing. When the cutting amount exceeds 150 μm, there is a tendency that minute undulation is likely to occur in the obtained glass substrate. On the other hand, when the cutting amount is less than 20 μm, the flatness of the obtained glass substrate may be lowered.
研磨パッドは、表層部に、後述する潤滑層に含まれるコロイダルシリカを保持する保持部(保持手段)を有することが好ましい。後記により詳述するが、潤滑層には、砥粒であるコロイダルシリカが含まれる。保持部としては特に限定されず、たとえば発泡した表面に形成された複数の開口孔を挙げることができる。 The polishing pad preferably has a holding part (holding means) for holding colloidal silica contained in a lubricating layer described later on the surface layer part. As will be described in detail later, the lubricating layer contains colloidal silica that is abrasive grains. The holding portion is not particularly limited, and examples thereof include a plurality of opening holes formed on the foamed surface.
開口孔の深さは特に限定されず、研磨パッドの切削量にもよるが、概ね10~800μmである。また、開口孔の平均開口面積は特に限定されず、概ね0.0001~0.0010mm2である。さらに、開口孔の個数は特に限定されず、概ね100~800個/mm2である。 The depth of the opening hole is not particularly limited, and is generally 10 to 800 μm although it depends on the cutting amount of the polishing pad. Further, the average opening area of the opening holes is not particularly limited, and is approximately 0.0001 to 0.0010 mm 2 . Further, the number of opening holes is not particularly limited, and is generally 100 to 800 holes / mm 2 .
保持部に保持されたコロイダルシリカは、鏡面研磨の工程中に、継続的にガラス基板と接触し続ける。そのため、研磨精度が向上し、得られるガラス基板の平坦度がより向上し得る。 The colloidal silica held in the holding part continues to contact the glass substrate continuously during the mirror polishing process. Therefore, the polishing accuracy is improved, and the flatness of the obtained glass substrate can be further improved.
研磨剤としては、平均一次粒子径が15~90nmのコロイダルシリカを砥粒として水に分散させてスラリー状にした研磨剤スラリーを使用することができる。水とコロイダルシリカとの混合比率は、1:9~3:7程度が好ましい。また、必要に応じて、硫酸を含有する調整液でpHを1.5~6.5に調整することが好ましい。研磨剤スラリーは、鏡面研磨の工程中に、定盤上に連続的に、または、随時添加される。研磨剤スラリーの添加量としては、200~2000mL/分程度である。 As the abrasive, it is possible to use an abrasive slurry in which colloidal silica having an average primary particle size of 15 to 90 nm is dispersed in water as abrasive grains to form a slurry. The mixing ratio of water and colloidal silica is preferably about 1: 9 to 3: 7. If necessary, the pH is preferably adjusted to 1.5 to 6.5 with an adjustment solution containing sulfuric acid. The abrasive slurry is added continuously or as needed on the surface plate during the mirror polishing process. The addition amount of the abrasive slurry is about 200 to 2000 mL / min.
鏡面研磨工程におけるガラス基板の研磨量は、2~5μm程度とすることが好ましい。研磨量をこのような範囲とすることにより、ガラス基板の表面に発生した微小うねり、先の工程で発生した微小なキズ痕といった微小欠陥を良好に除去することができる。また、ガラス基板の両主表面の平坦度を0.5μm未満にまで小さくすることができる。 The polishing amount of the glass substrate in the mirror polishing step is preferably about 2 to 5 μm. By setting the polishing amount in such a range, micro defects such as micro undulations generated on the surface of the glass substrate and micro scratches generated in the previous step can be satisfactorily removed. Further, the flatness of both main surfaces of the glass substrate can be reduced to less than 0.5 μm.
鏡面研磨工程における研磨パッドがガラス基板に与える荷重は、たとえば50~180g/cm2程度である。 The load applied to the glass substrate by the polishing pad in the mirror polishing step is, for example, about 50 to 180 g / cm 2 .
本実施の形態のガラス基板の鏡面研磨工程では、上記条件によりガラス基板を研磨した後に、リンス工程が実施される。 In the mirror polishing process of the glass substrate of the present embodiment, the rinsing process is performed after the glass substrate is polished under the above conditions.
(リンス工程)
リンス工程は、鏡面研磨後のガラス基板と研磨パッドとに残存する研磨剤スラリーを洗浄する工程である。
(Rinse process)
The rinsing step is a step of cleaning the abrasive slurry remaining on the glass substrate and the polishing pad after mirror polishing.
リンス工程では、リンス液を使用してガラス基板と研磨パッドとを洗浄する。洗浄方法としては特に限定されず、たとえば、鏡面研磨中に随時添加される研磨剤スラリーを、リンス液で置換しながら、徐々にガラス基板と研磨パッドを洗浄してもよく、一旦研磨剤スラリーの供給を停止して、リンス液を添加してもよい。 In the rinsing process, the glass substrate and the polishing pad are cleaned using a rinsing liquid. The cleaning method is not particularly limited. For example, the glass slurry and the polishing pad may be gradually cleaned while replacing the abrasive slurry added at any time during mirror polishing with a rinse liquid. The supply may be stopped and a rinse solution may be added.
リンス液としては特に限定されず、たとえば純水、気体溶存量を調整した脱気水などを採用することができる。 The rinse liquid is not particularly limited, and, for example, pure water, deaerated water whose gas dissolved amount is adjusted, and the like can be used.
リンス液の添加量としては特に限定されず、0.5~20L/分程度である。リンス液の添加量が0.5L/分未満の場合には、ガラス基板を充分に洗浄できず、後続する化学強化工程や最終洗浄工程において、ガラス基板が強化処理液や洗浄液を汚染する可能性がある。一方、リンス液の添加量が20L/分を超える場合には、ガラス基板に対する洗浄効果の向上が見込めない可能性がある。 The addition amount of the rinse liquid is not particularly limited, and is about 0.5 to 20 L / min. When the addition amount of the rinsing liquid is less than 0.5 L / min, the glass substrate cannot be sufficiently cleaned, and the glass substrate may contaminate the tempering treatment liquid or the cleaning liquid in the subsequent chemical strengthening process or the final cleaning process. There is. On the other hand, when the addition amount of the rinsing liquid exceeds 20 L / min, there is a possibility that improvement of the cleaning effect on the glass substrate cannot be expected.
また、リンス液の添加圧としては特に限定されず、ガラス基板や研磨パッドに対して、100~500kPaの水圧で添加する。リンス液の添加圧が100kPa未満の場合には、ガラス基板や研磨パッドを充分に洗浄できない可能性がある。一方、リンス液の添加圧が500kPaを超える場合には、ガラス基板や研磨パッドを損傷する可能性がある。 Further, the addition pressure of the rinsing liquid is not particularly limited, and it is added to a glass substrate or polishing pad at a water pressure of 100 to 500 kPa. When the addition pressure of the rinsing liquid is less than 100 kPa, the glass substrate or the polishing pad may not be sufficiently cleaned. On the other hand, when the addition pressure of the rinsing liquid exceeds 500 kPa, the glass substrate and the polishing pad may be damaged.
リンス液の温度としては特に限定されず、5~50℃程度である。リンス液の温度が5℃未満の場合には、ガラス基板を充分に洗浄できない可能性がある。一方、リンス液の温度が50℃を超えて洗浄した場合には、ガラス基板を変形させたり、研磨パッドを劣化させる可能性がある。 The temperature of the rinse liquid is not particularly limited, and is about 5 to 50 ° C. When the temperature of the rinse liquid is less than 5 ° C., the glass substrate may not be sufficiently cleaned. On the other hand, when the rinse liquid is washed at a temperature exceeding 50 ° C., the glass substrate may be deformed or the polishing pad may be deteriorated.
リンス工程を経たガラス基板は、後続する化学強化工程や、最終洗浄工程に送られる。ガラス基板は、リンス工程により清浄に洗浄されているため、強化処理液や洗浄液を極端に汚染することがない。一方、リンス工程を経た研磨パッドを備えた定盤は、表面が清浄に洗浄されている。本実施の形態では、このような研磨パッドに対して潤滑層を形成する。 The glass substrate that has undergone the rinsing process is sent to the subsequent chemical strengthening process and the final cleaning process. Since the glass substrate is cleaned cleanly by the rinsing process, the strengthening treatment liquid and the cleaning liquid are not extremely contaminated. On the other hand, the surface of the surface plate provided with the polishing pad that has undergone the rinsing process is cleaned cleanly. In the present embodiment, a lubricating layer is formed on such a polishing pad.
(潤滑層形成工程)
潤滑層形成工程は、研磨パッドにコロイダルシリカを含む研磨剤スラリーを添加して、研磨パッドの表面に潤滑層を形成する工程である。上記のとおり、表面が清浄な状態の研磨パッドを有する定盤に、鏡面研磨前のあらたなガラス基板を配置して鏡面研磨を開始した場合、当該ガラス基板と研磨パッドとの間には大きな摩擦力が発生する。そのため、ガラス基板は、鏡面研磨の初期においてスムーズに水平移動することができず、水平性が保たれない。その結果、得られるガラス基板の水平度が悪化する。潤滑層形成工程では、清浄な研磨パッドの表面に、コロイダルシリカを含む潤滑層を形成することにより、鏡面研磨前のあらたなガラス基板と接した場合に生じる摩擦力を軽減している。
(Lubrication layer forming process)
The lubricating layer forming step is a step of adding an abrasive slurry containing colloidal silica to the polishing pad to form a lubricating layer on the surface of the polishing pad. As described above, when a new glass substrate before mirror polishing is placed on a surface plate having a polishing pad with a clean surface and mirror polishing is started, large friction is caused between the glass substrate and the polishing pad. Force is generated. Therefore, the glass substrate cannot smoothly move horizontally in the initial stage of mirror polishing, and the horizontality cannot be maintained. As a result, the levelness of the obtained glass substrate is deteriorated. In the lubricating layer forming step, the frictional force generated when contacting a new glass substrate before mirror polishing is reduced by forming a lubricating layer containing colloidal silica on the surface of a clean polishing pad.
研磨剤スラリーとしては、平均一次粒子径が15~90nmのコロイダルシリカを砥粒として水に分散させたスラリーを使用することができる。コロイダルシリカの平均一次粒子径が15nm未満の場合、後述する潤滑層に保持されるコロイダルシリカの粒子径が小さ過ぎるため、充分な潤滑性能が得られない傾向がある。一方、90nmを超える場合、後述する潤滑層に保持されるコロイダルシリカの粒子径が大き過ぎるため、微小うねりが大きくなる傾向がある。 As the abrasive slurry, a slurry in which colloidal silica having an average primary particle diameter of 15 to 90 nm is dispersed in water as abrasive grains can be used. When the average primary particle diameter of the colloidal silica is less than 15 nm, the particle diameter of the colloidal silica held in the lubricating layer described later is too small, so that sufficient lubrication performance tends not to be obtained. On the other hand, when it exceeds 90 nm, since the particle diameter of colloidal silica held in the lubricating layer described later is too large, the fine undulation tends to increase.
水とコロイダルシリカとの混合比率は、1:9~3:7程度が好ましい。また、必要に応じて、硫酸を含有する調整液でpHを1.5~6に調整することが好ましい。 The mixing ratio of water and colloidal silica is preferably about 1: 9 to 3: 7. If necessary, it is preferable to adjust the pH to 1.5 to 6 with an adjusting solution containing sulfuric acid.
なお、潤滑層形成工程で使用する研磨剤スラリーは、鏡面研磨の工程中に使用した研磨剤スラリーと同じものを使用することができる。同じ研磨剤スラリーを使用することにより、潤滑層を形成した研磨パッドを有する定盤にあらたなガラス基板を配置し、鏡面研磨を開始するまでの時間を短縮することができる。 In addition, the abrasive slurry used in the lubricating layer forming step can be the same as the abrasive slurry used during the mirror polishing step. By using the same abrasive slurry, a new glass substrate can be placed on a surface plate having a polishing pad on which a lubricating layer is formed, and the time required to start mirror polishing can be shortened.
潤滑層形成工程における研磨剤スラリーの添加方法は特に限定されない。研磨剤スラリーは、鏡面研磨の工程において添加する場合と同様に、両面研磨機の上定盤に配置された貫通孔を通して外部から供給する事により添加してもよく、研磨パッドの表面を研磨剤スラリーを貯留した貯留容器に浸漬して添加する等の方法により添加することができる。 The method of adding the abrasive slurry in the lubricating layer forming step is not particularly limited. As in the case of adding in the mirror polishing step, the abrasive slurry may be added by supplying from the outside through a through-hole disposed on the upper surface plate of the double-side polishing machine. The slurry can be added by a method such as immersing it in a storage container storing the slurry.
潤滑層におけるコロイダルシリカの面密度は、10~500個/μm2であり、より好ましくは100~250個/μm2である。面密度が10個/μm2未満の場合、鏡面研磨により得られるガラス基板の平坦度が悪化する傾向がある。一方、面密度が500個/μm2を超える場合、鏡面研磨を終えたガラス基板の主表面や端面にディフェクトが多く形成される傾向がある。なお、本明細書においてディフェクトとは、ガラス基板上に存在する傷や塵埃、ガラス基板の劣化等により正確に再生可能な程度に記録できない領域または箇所をいう。 The surface density of colloidal silica in the lubricating layer is 10 to 500 / μm 2 , and more preferably 100 to 250 / μm 2 . When the surface density is less than 10 pieces / μm 2 , the flatness of the glass substrate obtained by mirror polishing tends to deteriorate. On the other hand, when the surface density exceeds 500 / μm 2 , many defects tend to be formed on the main surface and the end surface of the glass substrate after the mirror polishing. In the present specification, a defect refers to an area or location that cannot be recorded to the extent that it can be accurately reproduced due to scratches or dust existing on the glass substrate, deterioration of the glass substrate, or the like.
面密度は、研磨剤スラリーに含まれるコロイダルシリカの割合、平均一次粒子径、研磨パッド表面に形成された開口孔の深さ、個数、開口面積などを調整することにより、上記範囲に調整することができる。 The surface density is adjusted to the above range by adjusting the proportion of colloidal silica contained in the abrasive slurry, the average primary particle diameter, the depth, number, and area of the openings formed in the polishing pad surface. Can do.
次に、本実施の形態が採用し得るその他の工程について説明する。なお、本実施の形態のガラス基板の製造方法は、上記した鏡面研磨工程を有していればよく、その他の工程については特に限定されない。そのため、以下に説明するその他の工程は、例示であり、適宜設計変更を行うことができる。 Next, other steps that can be adopted by the present embodiment will be described. In addition, the manufacturing method of the glass substrate of this Embodiment should just have an above-described mirror polishing process, and it does not specifically limit about other processes. For this reason, the other steps described below are examples, and the design can be changed as appropriate.
<ブランクス製造工程>
ブランクス製造工程は、ガラス素材を溶融し、溶融したガラス素材からガラス基板(ブランクス)を得る工程である。
<Blanks manufacturing process>
The blanks manufacturing process is a process of melting a glass material and obtaining a glass substrate (blanks) from the molten glass material.
ガラス素材の材料としては、ソーダライムガラス、アルミノシリケートガラス、ボロシリケートガラス、Li2O-SiO2系ガラス、Li2O-Al2O3-SiO2系ガラス、R’O-Al2O3-SiO2系ガラス(R’=Mg、Ca、Sr、Ba)等を使用することができる。ガラス素材の溶融方法としては特に限定されず、通常は上記ガラス素材を公知の温度、時間にて高温で溶融する方法を採用することができる。 Examples of the glass material include soda lime glass, aluminosilicate glass, borosilicate glass, Li 2 O—SiO 2 glass, Li 2 O—Al 2 O 3 —SiO 2 glass, R′O—Al 2 O 3. —SiO 2 glass (R ′ = Mg, Ca, Sr, Ba) or the like can be used. It does not specifically limit as a melting method of a glass raw material, Usually, the method of melting the said glass raw material at high temperature by well-known temperature and time is employable.
ブランクスを得る方法としては特に限定されず、たとえば溶融したガラス素材を下型に流し込み、上型によってプレス成型して円板状のガラス基板(ブランクス)を得る方法を採用することができる。なお、ブランクスは、プレス成型に限られず、たとえばダウンドロー法やフロート法等で形成したシートガラスを研削砥石で切り出して作製してもよい。この成型工程において、ブランクスの表面近傍には、異物や気泡が混入し、あるいはキズがついて、欠陥が発生することとなる。 The method for obtaining blanks is not particularly limited, and for example, a method of obtaining a disk-shaped glass substrate (blanks) by pouring a molten glass material into a lower mold and press molding with an upper mold can be employed. In addition, blanks are not restricted to press molding, For example, you may cut and produce the sheet glass formed by the down draw method, the float method, etc. with the grinding stone. In this molding process, foreign matter and bubbles are mixed in the vicinity of the surface of the blank, or scratches are generated, resulting in defects.
ブランクスの大きさとしては特に限定されず、たとえば、外径が2.5インチ、1.8インチ、1インチ、0.8インチ等の種々の大きさのブランクスを作製することができる。ガラス基板の厚みについては特に限定されず、たとえば、2mm、1mm、0.8mm、0.63mm等の種々の厚みのブランクスを作製することができる。 The size of the blanks is not particularly limited, and for example, blanks having various outer diameters of 2.5 inches, 1.8 inches, 1 inch, 0.8 inches, and the like can be produced. It does not specifically limit about the thickness of a glass substrate, For example, blanks of various thickness, such as 2 mm, 1 mm, 0.8 mm, 0.63 mm, can be produced.
プレス成型や切り出しによって作製されたブランクスは、耐熱部材のセッターと交互に積層し、高温の電気炉を通過させることにより、反りの低減やガラスの結晶化を促進させることができる。 Blanks produced by press molding or cutting can be alternately laminated with heat-stable setters and passed through a high-temperature electric furnace to promote reduction of warpage and crystallization of glass.
<第一研削工程>
第一研削工程は、ブランクスの両表面を研削加工し、ガラス基板の平行度、平坦度および厚みを予備調整する工程である。
<First grinding process>
The first grinding step is a step of preliminarily adjusting the parallelism, flatness and thickness of the glass substrate by grinding both surfaces of the blank.
第一研削工程では、ブランクスの主表面がラッピング(研削)加工され、ガラス母材が得られる。ラッピング加工は、遊星歯車機構を利用した両面ラッピング装置により、アルミナ系遊離砥粒を用いて行う。具体的には、ラッピング加工は、ブランクスの両主表面に上下からラップ定盤を押圧させ、遊離砥粒を含む研削液を板状ガラスの主表面上に供給し、これらを相対的に移動させて行う。このラッピング加工により、平坦な主表面を有するガラス基板が得られる。 In the first grinding step, the main surface of the blank is lapped (ground) to obtain a glass base material. The lapping process is performed using alumina-based loose abrasive grains by a double-sided lapping apparatus using a planetary gear mechanism. Specifically, in the lapping process, both main surfaces of the blanks are pressed against the lapping platen from above and below, a grinding liquid containing free abrasive grains is supplied onto the main surface of the plate glass, and these are moved relatively. Do it. By this lapping process, a glass substrate having a flat main surface is obtained.
<コアリング工程>
コアリング工程は、ガラス基板の中心部に円形の孔(中心孔)を開ける工程である。具体的には、コアリング工程は、円筒状のダイヤモンドドリルを用いて、このガラス基板の中心部に内孔を形成し、円環状のガラス基板を成形する工程である。
<Coring process>
The coring step is a step of opening a circular hole (center hole) in the center of the glass substrate. Specifically, the coring step is a step of forming an annular glass substrate by forming an inner hole at the center of the glass substrate using a cylindrical diamond drill.
<内外研削工程>
内外研削工程は、ガラス基板の内周端面および外周端面を、ダイヤモンド等を用いた鼓状の研削砥石によって研削し、所定の面取り加工を施す工程である。
<Internal and external grinding process>
The inner / outer grinding step is a step in which the inner peripheral end surface and the outer peripheral end surface of the glass substrate are ground with a drum-shaped grinding wheel using diamond or the like and subjected to a predetermined chamfering process.
<内周研磨工程>
内周研磨工程は、ガラス基板とスペーサとを1枚ずつ交互に重ねて積層体を作成し、内周端面研磨機により内周端面を研磨する工程である。スペーサとしては特に限定されないが、たとえばポリプロピレン製で厚さ0.3mm、内径21mm、外径64mmのものを採用することができる。研磨機のブラシ毛は、たとえば直径0.2mmのナイロン繊維を採用することができる。回転ブラシの回転数は、たとえば10000rpmとすることができる。内周研磨用研磨液は、たとえばフッ酸系溶剤を含むものを用いることができ、研磨剤としてはたとえば平均一次粒子径3μmの酸化セリウムを用いることができる。
<Inner circumference polishing process>
The inner peripheral polishing step is a step of alternately laminating glass substrates and spacers one by one to create a laminate, and polishing the inner peripheral end surface with an inner peripheral end surface polishing machine. The spacer is not particularly limited. For example, a spacer made of polypropylene having a thickness of 0.3 mm, an inner diameter of 21 mm, and an outer diameter of 64 mm can be employed. For example, nylon fibers having a diameter of 0.2 mm can be used for the brush bristles of the polishing machine. The number of rotations of the rotating brush can be set to 10,000 rpm, for example. As the polishing liquid for inner circumference polishing, for example, a polishing liquid containing a hydrofluoric acid solvent can be used, and as the polishing agent, for example, cerium oxide having an average primary particle diameter of 3 μm can be used.
<外周研磨工程>
外周研磨工程は、ガラス基板とスペーサとを1枚ずつ交互に重ねて積層体を作成し、外周端面研磨機により外周端面を研磨する工程である。スペーサ、使用する研磨機の研磨条件は、内周研磨工程で採用した条件と同様である。
<Outer periphery polishing process>
The outer peripheral polishing step is a step of alternately laminating glass substrates and spacers one by one to create a laminate, and polishing the outer peripheral end surface by an outer peripheral end surface polishing machine. The polishing conditions of the spacer and the polishing machine used are the same as those used in the inner peripheral polishing step.
<第二研削工程>
第二研削工程は、ガラス基板の両主表面を研削し、大きな傷を除去するとともに、平坦度を向上させる工程である。
<Second grinding process>
The second grinding step is a step of grinding both main surfaces of the glass substrate to remove large scratches and improve flatness.
第二研削工程では、ガラス基板の両主表面をラッピング機(HAMAI社製)でラッピング加工する。ラッピング条件としては特に限定されないが、たとえば、#1500メッシュのダイヤモンドペレットを用い、荷重100g/cm2とし、上定盤の回転数30rpm、下定盤の回転数10rpmとすることができる。第二研削工程を経て得られるガラス基板の表面粗さは、例えば、Rmaxが3μm、Raが0.3μm程度である。第二研削工程を経たガラス基板は、大きなうねり、欠け、ひび等の欠陥がほぼ除去される。 In the second grinding step, both main surfaces of the glass substrate are lapped with a lapping machine (manufactured by HAMAI). The wrapping conditions are not particularly limited. For example, diamond pellets of # 1500 mesh can be used, the load can be 100 g / cm 2 , the upper surface plate can be rotated at 30 rpm, and the lower surface plate can be rotated at 10 rpm. As for the surface roughness of the glass substrate obtained through the second grinding step, for example, Rmax is about 3 μm and Ra is about 0.3 μm. The glass substrate that has undergone the second grinding step is substantially free from defects such as large undulations, chippings, and cracks.
なお、研削工程を経たガラス基板には、表面に研削液やガラス粉が残存している可能性がある。そのため、本実施形態では、洗浄工程を設けることが好ましい。洗浄工程においては、種々の洗浄方法を採用することができる。たとえば、ガラス基板に対して、アルカリ洗浄のみを行ってもよく、また、酸洗浄を行った後にアルカリ洗浄を行ってもよく、また、酸洗浄のみを行ってもよい。 In addition, there is a possibility that the grinding liquid or glass powder remains on the surface of the glass substrate that has undergone the grinding process. Therefore, in this embodiment, it is preferable to provide a cleaning process. In the cleaning process, various cleaning methods can be employed. For example, the glass substrate may be subjected only to alkali cleaning, may be subjected to acid cleaning after acid cleaning, or may be only subjected to acid cleaning.
<第一研磨工程(粗研磨工程)>
粗研磨工程は、後続する鏡面研磨工程において最終的に必要とされる面粗さが効率よく得られるように、ガラス基板の両表面を研磨加工する工程である。この工程で採用される研磨方法としては特に限定されず、両面研磨機を用いて研磨することができる。
<First polishing step (rough polishing step)>
The rough polishing step is a step of polishing both surfaces of the glass substrate so as to efficiently obtain the surface roughness finally required in the subsequent mirror polishing step. It does not specifically limit as a grinding | polishing method employ | adopted at this process, It can grind | polish using a double-side polisher.
使用する研磨パッドは、研磨パッドの硬度が研磨による発熱により低下すると研磨面の形状変化が大きくなるため、硬質パッドを使用することが好ましく、たとえば発泡ウレタンを使用することが好ましい。研磨液は、平均一次粒子径が0.6~2.5μmの酸化セリウムを砥粒として使用し、この砥粒を水に分散させてスラリー状にしたものが好ましい。水と酸化セリウムとの混合比率は、1:9~3:7程度である。粗研磨工程におけるガラス基板の研磨量は25~40μm程度とするのが好ましい。ガラス基板の研磨量が25μm未満の場合には、キズや欠陥を充分に除去できない傾向がある。一方、ガラス基板の研磨量が40μmを超える場合には、必要以上に研磨を行うことになって製造効率が低下する傾向がある。 As the polishing pad used, it is preferable to use a hard pad, for example, urethane foam is preferable because the shape change of the polishing surface increases when the hardness of the polishing pad decreases due to heat generated by polishing. The polishing liquid preferably uses cerium oxide having an average primary particle size of 0.6 to 2.5 μm as abrasive grains, and the abrasive grains are dispersed in water to form a slurry. The mixing ratio of water and cerium oxide is about 1: 9 to 3: 7. The polishing amount of the glass substrate in the rough polishing step is preferably about 25 to 40 μm. When the polishing amount of the glass substrate is less than 25 μm, there is a tendency that scratches and defects cannot be sufficiently removed. On the other hand, when the polishing amount of the glass substrate exceeds 40 μm, polishing is performed more than necessary, and the production efficiency tends to decrease.
<第二研磨工程(鏡面研磨工程)>
鏡面研磨工程は、すでに上記したとおりである。本実施の形態のガラス基板の製造方法は、鏡面研磨工程においてリンス工程を有しており、鏡面研磨を終えたガラス基板が洗浄される。そのため、後続する化学強化工程や最終洗浄工程において、ガラス基板を強化処理液や洗浄液に浸漬した場合に、ガラス基板がこれらの液体を汚染しにくい。また、本実施の形態は、潤滑層形成工程を有しているため、リンス工程により清浄となった研磨パッドに潤滑層を形成する。潤滑層が形成された研磨パッドは、鏡面研磨前のガラス基板が定盤上にあらたに配置された場合に、当該ガラス基板との間に大きな摩擦力が生じることがない。そのため、本実施の形態では、鏡面研磨を開始した際に、ガラス基板の水平移動が妨げられないため、本工程を経たガラス基板は、優れた平坦度を有する。
<Second polishing step (mirror polishing step)>
The mirror polishing process has already been described above. The manufacturing method of the glass substrate of this Embodiment has a rinse process in a mirror polishing process, and the glass substrate which finished mirror polishing is wash | cleaned. Therefore, in the subsequent chemical strengthening process and final cleaning process, when the glass substrate is immersed in a strengthening treatment liquid or a cleaning liquid, the glass substrate is unlikely to contaminate these liquids. In addition, since the present embodiment includes the lubricating layer forming step, the lubricating layer is formed on the polishing pad cleaned by the rinsing step. When the glass substrate before mirror polishing is newly placed on the surface plate, a large frictional force is not generated between the polishing pad on which the lubricating layer is formed and the glass substrate. Therefore, in this embodiment, when mirror polishing is started, the horizontal movement of the glass substrate is not hindered, and thus the glass substrate that has undergone this step has excellent flatness.
<化学強化工程>
化学強化工程は、ガラス基板を強化処理液に浸漬し、ガラス基板の耐衝撃性、耐振動性および耐熱性等を向上させる工程である。
<Chemical strengthening process>
The chemical strengthening step is a step of immersing the glass substrate in a strengthening treatment solution to improve the impact resistance, vibration resistance, heat resistance, and the like of the glass substrate.
化学強化工程において採用される化学強化方法としては特に限定されないが、通常は、加熱された強化処理液にガラス基板を浸漬させて、ガラス基板に含まれる比較的イオン半径の小さなアルカリイオン(たとえばリチウムイオン)を、イオン半径のより大きなアルカリイオン(たとえばカリウムイオン、ナトリウムイオン)に置換するイオン交換法が採用される。化学強化工程を採用することにより、ガラス基板の主表面、外周端面および内周端面に強化層(イオン交換層および圧縮応力層)を形成することができる。 The chemical strengthening method employed in the chemical strengthening step is not particularly limited, but usually, a glass substrate is immersed in a heated strengthening treatment solution, and alkali ions (for example, lithium ions) contained in the glass substrate have a relatively small ion radius. An ion exchange method is employed in which ions are replaced with alkali ions having a larger ion radius (for example, potassium ions and sodium ions). By adopting the chemical strengthening step, a reinforcing layer (ion exchange layer and compressive stress layer) can be formed on the main surface, outer peripheral end surface and inner peripheral end surface of the glass substrate.
なお、化学強化工程後に、ガラス基板を大気中に待機させる待機工程や、水浸漬工程を採用して、ガラス基板の表面に付着した強化処理液を除去するとともに、ガラス基板の表面を均質化することが好ましい。このような工程を採用することにより、得られるガラス基板は、化学強化層が均質に形成され圧縮歪が均質となり変形が生じ難く平坦度が良好であり、機械的強度に優れる。待機時間や水浸漬工程の水温は特に限定されず、たとえば大気中に1~60秒待機させ、35~100℃程度の水に浸漬させるとよく、製造効率を考慮して適宜決定される。 In addition, after the chemical strengthening process, a standby process for waiting the glass substrate in the air and a water immersion process are adopted to remove the strengthening treatment liquid adhering to the surface of the glass substrate and to homogenize the surface of the glass substrate. It is preferable. By adopting such a process, the obtained glass substrate has a uniform chemical strengthening layer, a uniform compressive strain, hardly deforms, has good flatness, and is excellent in mechanical strength. The waiting time and the water temperature in the water immersing step are not particularly limited. For example, the water temperature may be waited for 1 to 60 seconds in the air and immersed in water at about 35 to 100 ° C., and is appropriately determined in consideration of manufacturing efficiency.
<最終洗浄工程>
最終洗浄工程は、ガラス基板を洗浄し、清浄にする工程である。洗浄方法としては特に限定されず、鏡面研磨工程後のガラス基板の表面を清浄にできる洗浄方法であればよい。本実施の形態では、スクラブ洗浄が採用される。
<Final cleaning process>
The final cleaning step is a step of cleaning and cleaning the glass substrate. It does not specifically limit as a washing | cleaning method, What is necessary is just the washing | cleaning method which can clean the surface of the glass substrate after a mirror polishing process. In the present embodiment, scrub cleaning is employed.
洗浄されたガラス基板は、必要に応じて超音波による洗浄および乾燥が行われる。乾燥工程は、ガラス基板の表面に残る洗浄液をイソプロピルアルコール(IPA)等により除去した後、ガラス基板の表面を乾燥させる工程である。 The cleaned glass substrate is subjected to ultrasonic cleaning and drying as necessary. The drying step is a step of drying the surface of the glass substrate after removing the cleaning liquid remaining on the surface of the glass substrate with isopropyl alcohol (IPA) or the like.
最終洗浄工程は、たとえば、スクラブ洗浄後のガラス基板に水リンス洗浄工程を2分間行ない、洗浄液の残渣を除去する工程を採用することができる。次いで、最終洗浄工程は、IPA洗浄工程を2分間行い、ガラス基板の表面に残る水をIPAにより除去する工程を採用することができる。最後に、最終洗浄工程は、IPA蒸気乾燥工程を2分間行い、ガラス基板の表面に付着している液状のIPAをIPA蒸気により除去しつつ乾燥させる工程を採用することができる。 As the final cleaning step, for example, a step of performing a water rinsing cleaning step on the glass substrate after the scrub cleaning for 2 minutes to remove a residue of the cleaning liquid can be employed. Next, as the final cleaning process, an IPA cleaning process is performed for 2 minutes, and a process of removing water remaining on the surface of the glass substrate by IPA can be employed. Finally, the final cleaning step may employ a step of performing the IPA vapor drying step for 2 minutes and drying while removing the liquid IPA adhering to the surface of the glass substrate with the IPA vapor.
ガラス基板の乾燥方法としては特に限定されず、たとえばスピン乾燥、エアーナイフ乾燥などの、ガラス基板の乾燥方法として公知の乾燥方法を採用することができる。これらの工程を経たガラス基板は、キズ、割れ、異物の付着等の有無を、目視や光学表面アナライザ(たとえば、KLA-TENCOL社製の「OSA6100」)を用いて検査した後、異物等が表面に付着しないように、清浄な環境中で、専用収納カセットに収納され、真空パックされた後、出荷される。 The method for drying the glass substrate is not particularly limited, and a known drying method such as spin drying or air knife drying can be employed. After the glass substrate that has undergone these steps is inspected for scratches, cracks, adhesion of foreign matter, etc. visually or using an optical surface analyzer (for example, “OSA6100” manufactured by KLA-TENCOL), the foreign matter etc. In a clean environment, it is stored in a dedicated storage cassette, vacuum packed, and then shipped.
なお、本実施の形態は、HDDの製造方法に限定されるものではなく、たとえば、光磁気ディスクや光ディスク等の製造方法としても用いることができる。 The present embodiment is not limited to the HDD manufacturing method, and can be used as a manufacturing method of a magneto-optical disk, an optical disk, or the like.
また、本実施の形態は、必要に応じて、研削工程を2つの工程に分けて順次行ったり、粗研磨工程を省略したり、化学強化工程を鏡面研磨工程の前に行ったりなどの設計変更が可能である。 In addition, as necessary, this embodiment is designed to change the grinding process into two processes in order, to omit the rough polishing process, to perform the chemical strengthening process before the mirror polishing process, etc. Is possible.
さらに、本実施の形態は、落下強度対策として、ガラス基板の主表面以外の外周端面や内周端面に化学強化処理を行ってもよいし、ガラス基板に生じた傷のエッジ緩和処理として、ガラス基板をフッ化水素浸漬処理に供してもよい。 Furthermore, the present embodiment may perform chemical strengthening treatment on the outer peripheral end face and inner peripheral end face other than the main surface of the glass substrate as a measure for drop strength, or as an edge mitigation process for scratches generated on the glass substrate. The substrate may be subjected to a hydrogen fluoride immersion treatment.
以上、本実施の形態によれば、優れた平坦度を有し、微小うねりの少ないガラス基板を得るためのHDD用ガラス基板の製造方法を提供することができる。 As mentioned above, according to this Embodiment, the manufacturing method of the glass substrate for HDD for obtaining the glass substrate which has the outstanding flatness and few microwaviness can be provided.
上記ガラス基板の製造方法の技術的特徴を下記にまとめる。 The technical features of the glass substrate manufacturing method are summarized below.
本発明のガラス基板の製造方法は、研磨パッドを備えた上下の定盤を有する両面研磨機を用いる鏡面研磨工程を有し、該鏡面研磨工程は、鏡面研磨後のガラス基板と研磨パッドとに残存する研磨剤スラリーを洗浄するリンス工程と、リンス工程を経たガラス基板を移動させ、研磨パッドにコロイダルシリカを含む研磨剤スラリーを添加して潤滑層を形成する潤滑層形成工程と、を有する。コロイダルシリカの平均一次粒子径は、15~90nmであり、潤滑層におけるコロイダルシリカの面密度は、10~500個/μm2であることを特徴とする。 The method for producing a glass substrate of the present invention has a mirror polishing process using a double-side polishing machine having upper and lower surface plates provided with a polishing pad, and the mirror polishing process is performed on the glass substrate and the polishing pad after mirror polishing. A rinsing step for cleaning the remaining abrasive slurry, and a lubricating layer forming step for moving the glass substrate that has undergone the rinsing step and adding an abrasive slurry containing colloidal silica to the polishing pad to form a lubricating layer. The average primary particle diameter of the colloidal silica is 15 to 90 nm, and the surface density of the colloidal silica in the lubricating layer is 10 to 500 particles / μm 2 .
鏡面研磨工程を経たガラス基板を洗浄工程により洗浄することにより、ガラス基板は後続する工程における洗浄液等を汚染しにくい。また、洗浄された定盤の研磨パッドは、あらたにコロイダルシリカを含む潤滑層が形成されている。そのため、鏡面研磨前のガラス基板をあらたに定盤上に配置した際に、ガラス基板と研磨パッドとの間には、大きな摩擦力が発生しにくい。その結果、鏡面研磨を開始した際にガラス基板は、スムーズに水平移動し、鏡面研磨中のガラス基板の水平性が維持される。したがって、優れた平坦度を有し、微小うねりの少ないガラス基板が得られ得る。 By washing the glass substrate that has undergone the mirror polishing process in the washing process, the glass substrate is less likely to contaminate the cleaning liquid in the subsequent process. Further, the cleaned polishing pad of the surface plate has a lubrication layer newly containing colloidal silica. Therefore, when the glass substrate before mirror polishing is newly arranged on the surface plate, a large frictional force is unlikely to be generated between the glass substrate and the polishing pad. As a result, when mirror polishing is started, the glass substrate smoothly moves horizontally, and the horizontality of the glass substrate during mirror polishing is maintained. Therefore, a glass substrate having excellent flatness and less microwaviness can be obtained.
前記研磨パッドが、その表層部に潤滑層を保持する保持手段を有することが好ましい。 It is preferable that the polishing pad has a holding means for holding the lubricating layer on the surface layer portion.
研磨パッドが保持手段を有することにより、鏡面研磨の工程中において、継続的にコロイダルシリカの砥粒が研磨パッドの表層部に保持され、ガラス基板と接触し得る。その結果、研磨精度が向上し、得られるガラス基板の平坦度がより向上し得る。 Since the polishing pad has the holding means, the colloidal silica abrasive grains are continuously held on the surface layer portion of the polishing pad during the mirror polishing process, and can come into contact with the glass substrate. As a result, the polishing accuracy is improved, and the flatness of the resulting glass substrate can be further improved.
以下、本発明のガラス基板の製造方法を実施例により詳述する。なお、本発明のガラス基板の製造方法は、以下に示す実施例になんら限定されるものではない。 Hereafter, the manufacturing method of the glass substrate of this invention is explained in full detail by an Example. In addition, the manufacturing method of the glass substrate of this invention is not limited to the Example shown below at all.
<実施例1>
以下の方法によりガラス基板を作製した。
<Example 1>
A glass substrate was prepared by the following method.
[ブランクス製造工程]
ガラス素材として、SiO2、Al2O3、R2O(R=K、Na、Li)を主成分としたアルミノシリケートガラスを用い、溶融したガラス素材をプレス成形して、外径が67mmの円板状のブランクスを作製した。ブランクスの厚みは1.0mmとした。
[Blanks manufacturing process]
As the glass material, an aluminosilicate glass mainly composed of SiO 2 , Al 2 O 3 , R 2 O (R = K, Na, Li) is used, and the molten glass material is press-molded, and the outer diameter is 67 mm. Disk-shaped blanks were produced. The thickness of the blanks was 1.0 mm.
[第一研削工程]
ブランクスの両主表面を、両面研削機(浜井産業(株)製、16Bタイプ)を用いて研削加工した。研削条件として、粒度#600のアルミナ粉末を使用し、荷重は50g/cm2、上定盤回転数を30rpm、下定盤回転数を20rpmとした。
[First grinding process]
Both main surfaces of the blanks were ground using a double-side grinding machine (Hamai Sangyo Co., Ltd., 16B type). As grinding conditions, alumina powder having a particle size of # 600 was used, the load was 50 g / cm 2 , the upper surface plate rotation speed was 30 rpm, and the lower surface plate rotation speed was 20 rpm.
[コアリング・内外研削工程]
円筒状のダイヤモンド砥石を備えたコアドリルを用いてブランクスの中心部に直径が約19.6mmの円形の中心孔を開けた。鼓状のダイヤモンド砥石を用いて、ブランクスの外周端面および内周端面を、外径65mm、内径20mmに内・外径加工した。
[Coring / Internal / External Grinding Process]
Using a core drill equipped with a cylindrical diamond grindstone, a circular center hole having a diameter of about 19.6 mm was formed in the center of the blank. Using a drum-shaped diamond grindstone, the outer peripheral end surface and the inner peripheral end surface of the blanks were processed to have an inner diameter and an outer diameter of 65 mm in outer diameter and 20 mm in inner diameter.
[内周研磨・外周研磨工程]
ブランクスを100枚重ね、この状態で、ブランクスの外周端面および内周端面を、端面研磨機((株)舘野機械製作所製、TKV-1)を用いて研磨加工した。研磨機のブラシ毛として、直径が0.2mmのナイロン繊維を用いた。研磨液は、平均一次粒子径が3μmの酸化セリウムを砥粒(研磨液成分)として含有するスラリーを用いた。
[Inner grinding / outer grinding]
100 blanks were stacked, and in this state, the outer peripheral end surface and the inner peripheral end surface of the blanks were polished using an end surface polishing machine (TKV-1 manufactured by Hadano Machinery Co., Ltd.). Nylon fiber having a diameter of 0.2 mm was used as the brush hair of the polishing machine. As the polishing liquid, a slurry containing cerium oxide having an average primary particle diameter of 3 μm as abrasive grains (polishing liquid component) was used.
[第二研削工程]
ブランクスの両表面を、両面研削機(浜井産業(株)製、16Bタイプ)を用いて再び研削加工した。研削条件として、ダイヤモンドペレットは#1700メッシュのものを用い、加重は100g/cm2とし、上定盤の回転数は30rpmとし、下定盤の回転数は20rpmとした。
[Second grinding process]
Both surfaces of the blanks were ground again using a double-side grinding machine (Hamai Sangyo Co., Ltd., 16B type). As grinding conditions, diamond pellets of # 1700 mesh were used, the load was 100 g / cm 2 , the upper platen was rotated at 30 rpm, and the lower platen was rotated at 20 rpm.
[粗研磨工程]
ブランクスの両表面を、両面研磨機(浜井産業(株)製、16Bタイプ)を用いて粗研磨加工した。研磨パッドには発泡ウレタンパッドを、砥粒には平均一次粒子径1μmの酸化セリウム砥粒を用いた。荷重は100g/cm2とした。
[Rough polishing process]
Both surfaces of the blanks were roughly polished using a double-side polishing machine (Hamai Sangyo Co., Ltd., 16B type). A foamed urethane pad was used as the polishing pad, and a cerium oxide abrasive having an average primary particle diameter of 1 μm was used as the abrasive. The load was 100 g / cm 2 .
[鏡面研磨工程]
(リンス工程)
まず、本実施例の前に鏡面研磨を行ったガラス基板を、研磨パッドを有する定盤とともに純水で洗浄した。洗浄条件は、洗浄時間5分、水温20℃、5L/分、水圧約250kPaとした。研磨パッドは、軟質スウェードパッド(Filwel製のNP225、硬度Asker-C硬度76)を用いた。研磨パッドの表面は、表面バフ加工により、バフ加工を行わない初期の状態から50μm切削したものを使用した。
[Mirror polishing process]
(Rinse process)
First, a glass substrate that had been mirror-polished before this example was washed with pure water together with a surface plate having a polishing pad. The washing conditions were a washing time of 5 minutes, a water temperature of 20 ° C., 5 L / min, and a water pressure of about 250 kPa. As the polishing pad, a soft suede pad (NP225 manufactured by Filwel, hardness Asker-C hardness 76) was used. The surface of the polishing pad was cut by 50 μm from the initial state where buffing was not performed by surface buffing.
(潤滑層形成工程)
次いで、このガラス基板を移動させ、研磨パッドに研磨液スラリーを添加し、研磨パッドに潤滑層を形成した。添加した研磨液スラリーは、平均一次粒子径が20nmのコロイダルシリカを砥粒(研磨液成分)として水に分散させてスラリー状にしたものであった。研磨液スラリーにおける水と砥粒との混合比率は、研磨パッドの潤滑層におけるコロイダルシリカの面密度が所定の値になるよう、99:1から80:20の間で調整を行った。さらに硫酸を含有する調整液でpHを4.5に調整した。
(Lubrication layer forming process)
Next, the glass substrate was moved, a polishing slurry was added to the polishing pad, and a lubricating layer was formed on the polishing pad. The added polishing slurry was a slurry obtained by dispersing colloidal silica having an average primary particle size of 20 nm as abrasive grains (polishing component) in water. The mixing ratio of water and abrasive grains in the polishing slurry was adjusted between 99: 1 and 80:20 so that the surface density of the colloidal silica in the lubricating layer of the polishing pad was a predetermined value. Further, the pH was adjusted to 4.5 with an adjusting solution containing sulfuric acid.
得られた研磨パッドの潤滑層におけるコロイダルシリカの面密度は、120個/μm2であった。なお、面密度は、潤滑層を作成した状態で研磨パッドを乾燥させ、走査型電子顕微鏡(SEM)により表面のコロイダルシリカ粒子数を計測して算出した。凝集したコロイダルシリカについては、その面積から個数の推定を行い、コロイダルシリカの粒子数とした。 The surface density of the colloidal silica in the lubricating layer of the obtained polishing pad was 120 / μm 2 . The surface density was calculated by drying the polishing pad with the lubricating layer formed and measuring the number of colloidal silica particles on the surface with a scanning electron microscope (SEM). About the aggregated colloidal silica, the number was estimated from the area, and it was set as the number of particles of colloidal silica.
潤滑層を形成した研磨パッドを使用して、ガラス基板の両主表面を、両面研磨機(浜井産業(株)製、16Bタイプ)を用いてさらに精密に研磨加工した。研磨剤スラリーは、平均一次粒子径が20nmのコロイダルシリカを砥粒(研磨液成分)として水に分散させてスラリー状にしたものを用い、水と砥粒との混合比率は、80:20とした。さらに硫酸を含有する調整液でpHを調整した。また、加重は120g/cm2とした。本工程では、ガラス基板100枚を1バッチとし、5バッチずつ加工した。 Using the polishing pad on which the lubricating layer was formed, both main surfaces of the glass substrate were polished more precisely by using a double-side polishing machine (Type 16B, manufactured by Hamai Sangyo Co., Ltd.). As the abrasive slurry, colloidal silica having an average primary particle diameter of 20 nm was dispersed in water as abrasive grains (polishing liquid component) to form a slurry, and the mixing ratio of water and abrasive grains was 80:20 did. Furthermore, pH was adjusted with the adjustment liquid containing a sulfuric acid. The load was 120 g / cm 2 . In this step, 100 batches of glass substrates were processed into 5 batches.
[化学強化工程]
次いで、得られたガラス基板の化学強化処理を行った。化学強化処理液としては、硝酸カリウム(KNO3)と硝酸ナトリウム(NaNO3)との混合溶融塩の水溶液を用いた。混合比は質量比で1:1とした。化学強化処理液の温度は380℃とし、浸漬時間は25分とした。
[Chemical strengthening process]
Subsequently, the obtained glass substrate was chemically strengthened. As the chemical strengthening treatment liquid, an aqueous solution of a mixed molten salt of potassium nitrate (KNO 3 ) and sodium nitrate (NaNO 3 ) was used. The mixing ratio was 1: 1 by mass ratio. The temperature of the chemical strengthening treatment liquid was 380 ° C., and the immersion time was 25 minutes.
[最終洗浄工程]
ガラス基板をスクラブ洗浄した。洗浄液として、KOHとNaOHとを質量比で1:1に混合したものを超純水(DI水)で希釈し、洗浄能力を高めるために非イオン界面活性剤を添加して得られた液体を用いた。洗浄液の供給は、スプレー噴霧によって行った。スクラブ洗浄後、ガラス基板の表面に残る洗浄液を除去するために、水リンス洗浄工程を超音波槽で2分間行い、IPA洗浄工程を超音波槽で2分間行い、最後に、IPA蒸気によりガラス基板の表面を乾燥させた。
[Final cleaning process]
The glass substrate was scrubbed. As a cleaning liquid, a liquid obtained by diluting KOH and NaOH mixed at a mass ratio of 1: 1 with ultrapure water (DI water) and adding a nonionic surfactant to enhance the cleaning performance is obtained. Using. The cleaning liquid was supplied by spraying. After scrub cleaning, in order to remove the cleaning liquid remaining on the surface of the glass substrate, a water rinse cleaning process is performed in an ultrasonic bath for 2 minutes, an IPA cleaning process is performed in an ultrasonic bath for 2 minutes, and finally the glass substrate is cleaned with IPA vapor. The surface of was dried.
<実施例2>
潤滑層形成工程におけるコロイダルシリカの面密度を200個/μm2とした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Example 2>
A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 200 pieces / μm 2 .
<実施例3>
潤滑層形成工程におけるコロイダルシリカの面密度を400個/μm2とした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Example 3>
A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 400 / μm 2 .
<実施例4>
潤滑層形成工程におけるコロイダルシリカの平均一次粒子径を80nmとし、面密度を200個/μm2とした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Example 4>
A glass substrate was produced in the same manner as in Example 1 except that the average primary particle diameter of colloidal silica in the lubricating layer forming step was 80 nm and the surface density was 200 particles / μm 2 .
<実施例5>
潤滑層形成工程におけるコロイダルシリカの面密度を12個/μm2とした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Example 5>
A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 12 / μm 2 .
<実施例6>
潤滑層形成工程におけるコロイダルシリカの面密度を80個/μm2とした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Example 6>
A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 80 / μm 2 .
<比較例1>
潤滑層形成工程を採用しなかった以外は、実施例1と同様の方法によりガラス基板を作製した。
<Comparative Example 1>
A glass substrate was produced in the same manner as in Example 1 except that the lubricating layer forming step was not adopted.
<比較例2>
潤滑層形成工程におけるコロイダルシリカの面密度を8個/μm2とした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Comparative example 2>
A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 8 pieces / μm 2 .
<比較例3>
潤滑層形成工程におけるコロイダルシリカの面密度を800個/μm2とした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Comparative Example 3>
A glass substrate was produced in the same manner as in Example 1 except that the surface density of the colloidal silica in the lubricating layer forming step was 800 pieces / μm 2 .
<比較例4>
潤滑層形成工程におけるコロイダルシリカの平均一次粒子径を10nmとした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Comparative Example 4>
A glass substrate was produced in the same manner as in Example 1 except that the average primary particle diameter of colloidal silica in the lubricating layer forming step was 10 nm.
<比較例5>
潤滑層形成工程におけるコロイダルシリカの平均一次粒子径を100nmとし、面密度を200個/μm2とした以外は、実施例1と同様の方法によりガラス基板を作製した。
<Comparative Example 5>
A glass substrate was produced in the same manner as in Example 1 except that the average primary particle diameter of colloidal silica in the lubricating layer forming step was 100 nm and the surface density was 200 particles / μm 2 .
実施例1~6および比較例1~5で得られたガラス基板について、平坦度測定、微小うねり測定、付着物検査に供した。試験方法を以下に示すとともに、結果を表1に示す。 The glass substrates obtained in Examples 1 to 6 and Comparative Examples 1 to 5 were subjected to flatness measurement, microwaviness measurement, and deposit inspection. The test method is shown below, and the results are shown in Table 1.
[平坦度測定]
表面形状測定装置(フェイズシフトテクノロジー社製、Optiflat)を用いて測定した。
(評価基準)
◎:平坦度が0.3μm未満であった。
○:平坦度が0.3μm以上0.6μm未満であった。
×:平坦度が0.6μm以上であった。
[Flatness measurement]
It measured using the surface shape measuring apparatus (The phase shift technology company make, Optiflat).
(Evaluation criteria)
A: The flatness was less than 0.3 μm.
A: The flatness was 0.3 μm or more and less than 0.6 μm.
X: The flatness was 0.6 μm or more.
[微小うねり測定]
光学計測器(Zygo社製、Newview5000)を用いて測定した。計測は、ガラス基板の中心から半径方向に29mmの表面地点について行い、波長50~300μmのうねり成分を対象とした算術平均粗さを評価した。
(評価基準)
○:算術平均粗さが1.0Å未満であった。
×:算術平均粗さが1.0Å以上であった。
[Small waviness measurement]
It measured using the optical measuring device (The Zygo company make, Newview5000). The measurement was performed at a surface point of 29 mm in the radial direction from the center of the glass substrate, and the arithmetic average roughness for the waviness component having a wavelength of 50 to 300 μm was evaluated.
(Evaluation criteria)
A: The arithmetic average roughness was less than 1.0 mm.
X: The arithmetic average roughness was 1.0 mm or more.
[付着物検査]
ガラス基板の表面の付着物をレーザー式表面検査装置(KLA-TENCOR社製、OSA6100)で計測した。
(評価基準)
○:ディフェクト数が29以下であった。
×:ディフェクト数が30以上であった。
[Adhesion inspection]
Deposits on the surface of the glass substrate were measured with a laser surface inspection apparatus (OSA6100, manufactured by KLA-TENCOR).
(Evaluation criteria)
○: The number of defects was 29 or less.
X: The number of defects was 30 or more.
表1に示されるように、実施例1~6のガラス基板の製造方法では、優れた平坦度を有し、微小うねりが小さく、付着物が少ないガラス基板が得られた。比較例1では、加工初期に基板に対して摩擦が働き、平坦度が0.6μm以上であった。比較例2では、潤滑層に保持されたコロイダルシリカの面密度が小さかったため、潤滑層としての効果が得られず、加工初期に基板に対して摩擦が働き、平坦度が0.6μm以上であった。比較例3では、潤滑層に保持されたコロイダルシリカの面密度が大きすぎたため、付着物が増加した。比較例4では、潤滑層に保持されたコロイダルシリカの平均一次粒子径が小さかったため、充分な潤滑性能が示されず、加工初期に基板に対して摩擦が働き、平坦度が0.6μm以上であった。比較例5では、潤滑層に保持されたコロイダルシリカの平均一次粒子径が大きすぎたため、微小うねりの値が高く出る結果となった。 As shown in Table 1, in the glass substrate production methods of Examples 1 to 6, glass substrates having excellent flatness, small undulations, and few deposits were obtained. In Comparative Example 1, friction acted on the substrate in the initial stage of processing, and the flatness was 0.6 μm or more. In Comparative Example 2, since the surface density of the colloidal silica held in the lubricating layer was small, the effect as the lubricating layer was not obtained, the friction acted on the substrate in the initial stage of processing, and the flatness was 0.6 μm or more. It was. In Comparative Example 3, since the surface density of the colloidal silica held in the lubricating layer was too large, the amount of deposits increased. In Comparative Example 4, since the average primary particle diameter of the colloidal silica held in the lubricating layer was small, sufficient lubrication performance was not exhibited, friction acted on the substrate at the initial stage of processing, and the flatness was 0.6 μm or more. It was. In Comparative Example 5, since the average primary particle diameter of the colloidal silica held in the lubricating layer was too large, the value of the microwaviness was high.
Claims (2)
該鏡面研磨工程は、
鏡面研磨後のガラス基板と研磨パッドとに残存する研磨剤スラリーを洗浄するリンス工程と、
リンス工程を経たガラス基板を移動させ、研磨パッドにコロイダルシリカを含む研磨剤スラリーを添加して潤滑層を形成する潤滑層形成工程と、を有し、
前記コロイダルシリカの平均一次粒子径は、15~90nmであり、
前記潤滑層における前記コロイダルシリカの面密度は、10~500個/μm2である、HDD用ガラス基板の製造方法。 Having a mirror polishing process using a double-side polishing machine having upper and lower surface plates with polishing pads;
The mirror polishing process includes
A rinsing step of cleaning the abrasive slurry remaining on the glass substrate and the polishing pad after mirror polishing;
A lubricating layer forming step of moving the glass substrate that has undergone the rinsing step and adding an abrasive slurry containing colloidal silica to the polishing pad to form a lubricating layer;
The colloidal silica has an average primary particle size of 15 to 90 nm,
The method for producing a glass substrate for HDD, wherein the surface density of the colloidal silica in the lubricating layer is 10 to 500 pieces / μm 2 .
The manufacturing method of the glass substrate for HDD of Claim 1 with which the said polishing pad has a holding means to hold | maintain a lubricating layer in the surface layer part.
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| JP2011286097 | 2011-12-27 | ||
| JP2011-286097 | 2011-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2016016505A (en) * | 2014-07-11 | 2016-02-01 | 旭硝子株式会社 | Polishing pad cleaning method |
| CN117912934A (en) * | 2023-12-01 | 2024-04-19 | 福建晶安光电有限公司 | Substrate polishing method, substrate and light emitting diode |
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| JP2001006162A (en) * | 1999-06-24 | 2001-01-12 | Mitsubishi Chemicals Corp | Method of manufacturing magnetic disk substrate |
| JP2001155332A (en) * | 1999-09-27 | 2001-06-08 | Fujimi America Inc | Abrasive composition and method for manufacturing memory hard disk using the same |
| WO2004058450A1 (en) * | 2002-12-26 | 2004-07-15 | Hoya Corporation | Method for producing glass substrate for information recording medium, polishing apparatus and glass substrate for information recording medium |
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| JP2006351081A (en) * | 2005-06-14 | 2006-12-28 | Fuji Electric Holdings Co Ltd | Polishing method of magnetic disk substrate |
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| JP2001006162A (en) * | 1999-06-24 | 2001-01-12 | Mitsubishi Chemicals Corp | Method of manufacturing magnetic disk substrate |
| JP2001155332A (en) * | 1999-09-27 | 2001-06-08 | Fujimi America Inc | Abrasive composition and method for manufacturing memory hard disk using the same |
| WO2004058450A1 (en) * | 2002-12-26 | 2004-07-15 | Hoya Corporation | Method for producing glass substrate for information recording medium, polishing apparatus and glass substrate for information recording medium |
| JP2006095677A (en) * | 2004-08-30 | 2006-04-13 | Showa Denko Kk | Polishing method |
| JP2006351081A (en) * | 2005-06-14 | 2006-12-28 | Fuji Electric Holdings Co Ltd | Polishing method of magnetic disk substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2016016505A (en) * | 2014-07-11 | 2016-02-01 | 旭硝子株式会社 | Polishing pad cleaning method |
| CN117912934A (en) * | 2023-12-01 | 2024-04-19 | 福建晶安光电有限公司 | Substrate polishing method, substrate and light emitting diode |
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