WO2013094645A1 - Optical substrate and method for manufacturing same, light-emitting element, liquid crystal element, display device, liquid crystal device, and illumination device - Google Patents

Abstract

A light-emitting substrate (optical substrate) comprises: a first light-transmissive substrate, a light-emitting functional layer (optical layer) that is provided at a specified interval from the first substrate and emits light towards the first substrate, a plurality of structures that are connected to the first substrate and/or the light-emitting function layer and are provided at a specified interval in the direction along the surface opposite the light-emitting functional layer of the first substrate, and a gas layer provided between the first substrate and the light-emitting functional layer.

Description

Optical substrate and method for manufacturing the same, light emitting element, liquid crystal element, display device, liquid crystal device, and illumination device

The present invention relates to an optical substrate provided with a layer having a light emitting function, such as a phosphor, or a layer having a light scattering function, and a manufacturing method thereof, a light emitting element, a liquid crystal element, a display device, a liquid crystal device, and a lighting device.
This application claims priority based on Japanese Patent Application No. 2011-279780 filed in Japan on December 21, 2011, the contents of which are incorporated herein by reference.

A film having a light emitting function such as a phosphor can be used for wavelength conversion, energy conversion, and the like. For example, an organic EL device in which a phosphor is combined with an organic electroluminescence (hereinafter also referred to as “organic EL”) element is well known as a color conversion organic EL device (see, for example, Patent Document 1 below). A display device in which a phosphor is combined with a liquid crystal element is also known (for example, see Patent Document 2 below).

However, in these devices, one of the major problems is that light emitted from a film having a light emitting function such as a phosphor cannot be sufficiently extracted. The phosphor is generally used in such a form that it is formed on a light-transmitting substrate such as a glass substrate or dispersed inside a resin substrate such as an acrylic plate. In that case, since the refractive index of the substrate is larger than the refractive index of air, light cannot be efficiently extracted from the substrate according to the total reflection condition based on Snell's law.

For such a problem, for example, Patent Document 1 discloses providing a reflective film on a side surface of a phosphor layer combined with an organic EL element.
Patent Document 3 listed below discloses an active matrix light emitting element in which a low refractive index layer having a refractive index in the range of 1.01 to 1.3 is provided on the surface of the transparent conductive layer opposite to the light emitting layer. .
In the following Patent Document 4, an EL is provided with a leaching light diffusing layer in which light scattering particles are diffused in a matrix resin made of a low refractive index material between a transparent electrode layer and a light transmissive substrate. An element is disclosed.
Patent Document 5 listed below discloses a light emitting element in which light extraction efficiency is improved by providing a reflective layer on the side surface of a pixel.

Japanese Patent Laid-Open No. 11-329726 JP 2009-134275 A JP 2002-278477 A JP 2004-296437 A JP 2010-009793 A

The inventions disclosed in Patent Document 1 and Patent Document 5 described above are intended to extract light toward the side surface of the light emitting unit to the front side by providing a reflecting member on the side surface of the light emitting unit. However, for the purpose of protecting the organic EL element, a light transmissive substrate such as glass may be disposed on the light emission side of the organic EL element. In that case, in Patent Document 1 and Patent Document 5, no effective countermeasure is taken against the total reflection component generated by the difference in refractive index between the light-transmitting substrate through which light from the light emitting portion is transmitted and air. Therefore, the techniques of Patent Document 1 and Patent Document 5 have a limit in improving the light extraction efficiency.

On the other hand, Patent Document 3 and Patent Document 4 describe that the light extraction efficiency can be improved by the arrangement of the low refractive index layer. However, when light is extracted from the low refractive index layer, there is still a refractive index difference between the low refractive index layer and air. Therefore, it is difficult to sufficiently increase the light extraction efficiency.

The problem has been described above by taking as an example the case of directly extracting light from a light emitting element such as an organic EL element. However, there is a similar problem when, for example, light from a light emitting element is extracted through an optical layer such as a light scattering layer.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an optical substrate that can sufficiently increase the light extraction efficiency and a method for manufacturing the same. It is another object of the present invention to provide a light-emitting element, a liquid crystal element, a display device, a liquid crystal device, and a lighting device that include the optical substrate and have high luminance.

In order to achieve the above object, an optical substrate of the present invention is provided with a first substrate having optical transparency and a predetermined distance from the first substrate, and directed toward the first substrate. Provided at a predetermined interval in a direction along the surface facing the optical layer of the first substrate, in contact with at least one of the optical layer that emits light, the first substrate, and the optical layer A plurality of structures and a gas layer provided between the first substrate and the optical layer are provided.

The optical substrate of the present invention is characterized in that a second substrate is provided on the surface of the optical layer opposite to the surface facing the first substrate.

In the optical substrate of the present invention, the structure is constituted by a plurality of layers of structures arranged in a normal direction of the first substrate, and the plurality of layers of the structure is opposed to the first substrate. A first structure in contact with the surface and a second structure in contact with the optical layer are included.

The optical substrate of the present invention is characterized in that the first structure and the second structure are in contact with each other.

In the optical substrate of the present invention, the first structure and the second structure are separated from each other, and a support member that is in contact with the facing surface of the first substrate at an outer edge portion of the first substrate. Is provided.

The optical substrate of the present invention is characterized in that at least a part of the first structure is composed of a light absorbing member made of a light-absorbing material.

The optical substrate of the present invention is characterized in that at least a part of the outer surface of the first structure is composed of a light reflecting member made of a light reflective material.

In the optical substrate of the present invention, the first structure is in contact with the first substrate and includes a light absorbing member made of a light-absorbing material, and a surface of the light absorbing member in contact with the first substrate. It is characterized by comprising a light reflecting member made of a material having a light reflecting property and covering the remaining surface.

The optical substrate of the present invention is characterized in that a light reflecting member made of a material having light reflectivity is provided on at least a part of the outer surface of the second structure.

The optical substrate of the present invention is characterized in that the thickness of the optical layer is thinner than the thickness of the second structure.

The optical substrate of the present invention is characterized in that the structure is composed of a single layer structure.

The optical substrate of the present invention is characterized in that the structure is in contact with both the facing surface of the first substrate and the optical layer.

In the optical substrate of the present invention, the structure is in contact with either the opposing surface of the first substrate or the optical layer, and an outer edge portion of the first substrate and an outer edge portion of the optical layer. Further, a support member is provided in contact with each of the opposing surface of the first substrate and the optical layer.

The optical substrate of the present invention is characterized in that at least a part of the structure is composed of a light-absorbing member made of a light-absorbing material.

The optical substrate of the present invention is characterized in that at least a part of the outer surface of the structure is composed of a light reflecting member made of a light reflective material.

In the optical substrate of the present invention, the structure is in contact with the first substrate and is made of a light-absorbing member made of a light-absorbing material, and the remaining surface except for the surface of the light-absorbing member in contact with the first substrate. And a light reflecting member made of a material having a light reflecting property.

The optical substrate of the present invention is characterized in that the optical layer is a light emitting layer that emits light in a predetermined wavelength range.

The optical substrate of the present invention selectively reflects light in the wavelength region on the surface of the optical layer opposite to the surface facing the first substrate, and transmits light in a wavelength region other than the wavelength region. A wavelength selective reflection member having a characteristic of selectively transmitting is provided.

The optical substrate of the present invention is characterized in that the wavelength selective reflection member is a second substrate provided on the surface of the optical layer opposite to the surface facing the first substrate.

The optical substrate of the present invention is characterized in that the optical layer is a light scattering layer that scatters incident light.

The optical substrate of the present invention is characterized in that a color filter is provided between the first substrate and the optical layer.

In the optical substrate of the present invention, the structure penetrates the optical layer, and the surface of the structure opposite to the surface in contact with the first substrate is opposite to the first substrate of the optical layer. The surface opposite to the surface is substantially on the same plane.

The method for manufacturing an optical substrate according to the present invention includes a step of forming a plurality of first structures at a predetermined interval on one surface of a light-transmitting first substrate, and a light-transmitting second substrate. A step of forming a plurality of second structures on one surface of the substrate at a predetermined interval; and an optical layer in a region surrounded by the adjacent second structures on the one surface of the second substrate. And forming the first substrate and the second substrate at a predetermined interval so that a formation surface of the first structure and a formation surface of the second structure face each other. And holding and fixing.

The method of manufacturing an optical substrate according to the present invention is characterized in that the first substrate and the second substrate are fixed in a state where the first structure and the second structure are in contact with each other. .

The method for manufacturing an optical substrate according to the present invention includes a step of forming a support member on at least one outer edge of one surface of the first substrate and one surface of the second substrate, and the first structure and the first substrate The first substrate and the second substrate are fixed via the support member in a state where the second structure is not in contact.

The method for manufacturing an optical substrate according to the present invention is characterized in that the optical layer is formed so that the thickness of the optical layer is thinner than the thickness of the second structure.

According to the method of manufacturing an optical substrate of the present invention, a plurality of structures are provided at a predetermined interval on one surface of a first substrate having light transmittance and one surface of a second substrate having light transmittance. And forming an optical layer in a region surrounded by the adjacent structures on one surface of the first substrate and the second substrate on which the plurality of structures are formed. A predetermined step so that a surface on which the structure of the substrate on which the plurality of structures are formed and one surface of the other substrate face each other. A step of holding and fixing the interval.

The method for manufacturing an optical substrate according to the present invention is characterized in that the first substrate and the second substrate are fixed in a state where the structure and one surface of the other substrate are in contact with each other.

The method for manufacturing an optical substrate according to the present invention includes a step of forming a support member on at least one outer edge of one surface of the first substrate and one surface of the second substrate, and the structure and the other substrate The first substrate and the second substrate are fixed via the support member in a state where the first surface is not in contact with the first surface.

The method for manufacturing an optical substrate of the present invention includes a step of peeling at least a part of the second substrate in the thickness direction after fixing the first substrate and the second substrate. And

In the method for manufacturing an optical substrate according to the present invention, after peeling at least a part of the second substrate in the thickness direction, a third surface of the optical layer on the side where the second substrate is peeled off, And a step of fixing the substrate.

In the method for producing an optical substrate of the present invention, the optical layer is a light emitting layer that emits light in a predetermined wavelength range, and the third substrate selectively reflects light in the wavelength range, It is a wavelength selective reflection plate having a characteristic of selectively transmitting light in a wavelength range other than.

The optical substrate manufacturing method of the present invention includes a step of forming a sacrificial layer on the second substrate, and at least a part of the second substrate in the thickness direction is peeled off at the position of the sacrificial layer. And

The method for manufacturing an optical substrate according to the present invention is characterized in that the first substrate and the second substrate are fixed in a reduced-pressure atmosphere.

The light-emitting element of the present invention includes the optical substrate of the present invention and a light source that emits light toward the optical substrate.

The light emitting device of the present invention is characterized in that the optical layer of the optical substrate is a light emitting layer that emits light using excitation light as light emitted from the light source.

The liquid crystal element of the present invention includes the optical substrate of the present invention, a light source that emits light toward the optical substrate, and a liquid crystal cell that adjusts the transmittance of the light emitted from the light source. Features.

The liquid crystal element of the present invention is characterized in that the optical layer of the optical substrate is a light emitting layer that emits light using excitation light as light emitted from the light source and adjusted in transmittance by the liquid crystal cell.

The display device of the present invention includes the light emitting element of the present invention and a control unit that controls a light emission state of the light source in the light emitting element.

The liquid crystal device of the present invention includes the liquid crystal element of the present invention and a control unit that controls the transmittance of the liquid crystal cell in the liquid crystal element.

The illuminating device of the present invention includes the light emitting element of the present invention and a control unit that controls the light emission state of the light source in the light emitting element.

According to the present invention, it is possible to provide an optical substrate having a sufficiently high light extraction efficiency and a manufacturing method thereof. In addition, a light-emitting element, a liquid crystal element, a display device, a liquid crystal device, and a lighting device each including the above-described optical substrate can be provided.

It is a top view which shows the optical board | substrate of 1st Embodiment of this invention. FIG. 2 is a cross-sectional view taken along the line A-A ′ of FIG. 1 showing the optical substrate of the first embodiment. It is a top view which shows the optical board | substrate of 2nd Embodiment of this invention. FIG. 4 is a cross-sectional view taken along line A-A ′ of FIG. 3 showing an optical substrate of a second embodiment. It is sectional drawing which shows the optical board | substrate of 3rd Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 4th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 5th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 6th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 7th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 8th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of the 1st modification of this invention. It is sectional drawing which shows the optical board | substrate of the 2nd modification of this invention. It is sectional drawing which shows the optical board | substrate of the 3rd modification of this invention. It is sectional drawing which shows the optical board | substrate of the 4th modification of this invention. It is sectional drawing which shows the optical board | substrate of the 5th modification of this invention. It is sectional drawing which shows the optical board | substrate of the 6th modification of this invention. It is sectional drawing which shows the optical board | substrate of 9th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 10th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 11th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 12th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 13th Embodiment of this invention. It is sectional drawing which shows the optical board | substrate of 14th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 15th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 15th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 15th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 15th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 16th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 16th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 16th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 16th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 16th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 17th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 17th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 17th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 17th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 18th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 18th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 18th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 18th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 18th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 19th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 19th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 19th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 19th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 19th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 20th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 20th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 20th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 20th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 20th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 20th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 21st Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 21st Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 21st Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 21st Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 21st Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 21st Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 22nd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 22nd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 22nd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 22nd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 22nd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 22nd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 23rd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 23rd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 23rd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 23rd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 23rd Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 24th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 24th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 24th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 24th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 24th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 25th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 25th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 25th Embodiment of this invention. It is process sectional drawing which shows the manufacturing method of the optical board | substrate of 25th Embodiment of this invention. It is sectional drawing which shows the light emitting element of 26th Embodiment of this invention. It is sectional drawing which shows the light emitting element of a 1st modification. It is sectional drawing which shows the liquid crystal element of 27th Embodiment of this invention. It is a front view which shows the display apparatus of 28th Embodiment of this invention. It is a front view which shows the display apparatus of 28th Embodiment of this invention. It is a perspective view which shows the illuminating device of 29th Embodiment of this invention. It is a perspective view which shows the illuminating device of 29th Embodiment of this invention.

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 and 2.
The optical substrate of the present embodiment includes a layer having a light emitting function, and an example of an optical substrate suitable for use as, for example, a light emitting substrate of a display device is shown.
FIG. 1 is a plan view showing an optical substrate of the present embodiment. FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1, showing the optical substrate of the present embodiment.
In the following drawings, in order to make each component easy to see, the scale of the size may be varied depending on the component.

As shown in FIGS. 1 and 2, the luminescent substrate 1 (optical substrate) of the present embodiment includes a first substrate 2, a second substrate 3, a plurality of structures 4, and a layer having a light emitting function. 5 (optical layer) and a gas layer 6. Hereinafter, the “layer having a light emitting function” is referred to as a “light emitting functional layer”. As shown in FIG. 1, when viewed from the normal direction of the first substrate 2 and the second substrate 3, the plurality of structures 4 are a plurality of structures 4 arranged in parallel with each other at a predetermined interval. Two sets of structures consisting of are arranged so as to be orthogonal to each other. In other words, the plurality of structures 4 are arranged in a lattice shape as a whole. The light emitting functional layer 5 is provided in a rectangular region surrounded by the adjacent structures 4.

As shown in FIG. 2, the first substrate 2 and the second substrate 3 are arranged at a predetermined interval via the structure 4. A light emitting functional layer 5 that emits light toward the first substrate 2 is provided on the surface of the second substrate 3 facing the first substrate 2. A plurality of structures 4 are provided at predetermined intervals in the direction along the facing surface 2a of the first substrate 2 facing the light emitting functional layer 5.

The structure 4 includes a plurality of layers of structures 7 and 8 stacked in the thickness direction of the first substrate 2 and the second substrate 3. The multi-layer structures 7 and 8 are opposed to the first structure 7 in contact with the surface 2a of the first substrate 2 facing the second substrate 3 and the first substrate 2 of the second substrate 3. The second structure 8 is in contact with the surface 3a. In the case of this embodiment, the first structure 7 and the second structure 8 are in contact with each other. Gas exists in the space surrounded by the first substrate 2, the light emitting functional layer 5, and the structure 4, and this portion constitutes the gas layer 6.

The first substrate 2 is a substrate having optical transparency. The first substrate 2 is composed of, for example, an inorganic material substrate such as glass or quartz, a transparent resin substrate such as polyethylene terephthalate, polycarbazole, or polyimide. The first substrate 2 is a substrate on the side from which light emitted from the light emitting functional layer 5 described later is emitted, and needs to have light transmittance. As a specific example of this embodiment, a glass substrate having a thickness of 0.7 mm that is often used for a liquid crystal display or the like is used for the first substrate 2.

The second substrate 3 is a light-transmitting substrate, like the first substrate. The second substrate 3 is composed of, for example, an inorganic material substrate such as glass or quartz, a transparent resin substrate such as polyethylene terephthalate, polycarbazole, or polyimide. As a specific example of this embodiment, a glass substrate having a thickness of 0.7 mm, for example, is used for the second substrate 3. In the case of this embodiment, it is necessary to irradiate light to the light emitting functional layer 5 described later via the second substrate 3. For this reason, the second substrate 3 needs to have optical transparency. However, when it is not necessary to irradiate the light emitting functional layer 5 with light through the second substrate 3, the second substrate 3 may not have light transmittance. In that case, the 2nd board | substrate 3 may be comprised from the material which does not have light transmittance, such as a metal and an inorganic material, for example.

The first structure 7 is formed in a wall shape on the surface 2 a of the first substrate 2 facing the second substrate 3. For the first structure 7, for example, an inorganic material, an organic material, an inorganic-organic hybrid material, or the like is used. When the luminescent substrate 1 of the present embodiment is used for a display device, the first structure 7 is desirably disposed so as to surround each pixel or each sub-pixel. However, the first structure 7 does not necessarily have such an arrangement. Or when the luminescent board | substrate 1 of this embodiment is used for the use of an illuminating device, it is desirable for the 1st structure 7 to be arrange | positioned on the 1st board | substrate 2 at a fixed space | interval.

The second structure 8 is formed in a wall shape on the surface 3 a of the second substrate 3 facing the first substrate 2. For the second structure 8, for example, an inorganic material, an organic material, an inorganic-organic hybrid material, or the like is used. Similar to the first structure 7, when the luminescent substrate 1 of this embodiment is used in a display device, the second structure 8 may be disposed so as to surround each pixel or each sub-pixel. Although desirable, such an arrangement is not necessarily required. Or when the luminescent board | substrate 1 of this embodiment is used for an illuminating device, it is desirable for the 2nd structure 8 to be arrange | positioned on the 2nd board | substrate 3 with a fixed space | interval.

In the present embodiment, the width W1 of the first structure 7 is wider than the width W2 of the second structure 8.
However, the width W1 of the first structure 7 is not necessarily larger than the width W2 of the second structure 8. That is, the width W1 of the first structure 7 and the width W2 of the second structure 8 may be equal. Alternatively, the width W1 of the first structure 7 may be narrower than the width W2 of the second structure 8.

The first substrate 2 and the second substrate 3 face each other so that the positions of the first structure 7 and the second structure 8 coincide with each other. However, there may be a place where the first structure 7 exists and the second structure 8 does not exist, or a place where the second structure 8 exists and the first structure 7 does not exist. . In the present embodiment, the first structure 7 and the second structure 8 are in contact with each other, and an adhesive is disposed between the first structure 7 and the second structure 8 as necessary. Then, the first structure 7 and the second structure 8 are fixed by the adhesive. At this time, for example, when particles such as titanium oxide are dispersed in the adhesive, it is preferable in terms of imparting light reflectivity to the adhesive layer.

The first structure 7 and the second structure 8 are merely in contact with each other and need not be fixed. In that case, it is necessary to maintain the state in which the first structure 7 and the second structure 8 are in contact with each other without separating the first substrate 2 and the second substrate 3. Therefore, for example, a sealing member for bonding the first substrate 2 and the second substrate 3 may be provided on the peripheral portions of the first substrate 2 and the second substrate 3.

The first structure 7 and the second structure 8 may have various characteristics with respect to light, such as light transmission, light non-transmission, light absorption, light reflection, and light scattering, respectively. . When the first structure 7 or the second structure 8 is made light-impermeable, these structures 7 and 8 function as a light-shielding layer that partitions pixels or sub-pixels, a so-called black matrix. In that case, the first structure 7 or the second structure 8 can use a black matrix technique used for a normal liquid crystal display, a color filter substrate, or the like. Specifically, for example, a metal such as titanium may be used as a constituent material of the first structure 7 or the second structure 8, or an organic material such as a black resist may be used.

By using these structures 7 and 8 as a black matrix, when the light-emitting substrate 1 of this embodiment is applied to a display device, reflection of external light is suppressed, contrast in a bright environment is improved, and visual recognition is performed. The effect which improves property is acquired.

On the other hand, when either one or both of the first structure 7 and the second structure 8 are light reflecting structures, the light emitted from the light emitting functional layer 5 propagates in the lateral direction, It is possible to prevent escape through. When either one or both of the first structure 7 and the second structure 8 are made light reflective, the side surfaces of the structures 7 and 8 can be obtained simply by having the light reflective properties of the structures 7 and 8. The profile of the extracted light varies greatly depending on the angle of each of the substrates 2 and 3 and the shape of the structures 7 and 8. Therefore, in order to obtain a desired profile, it is necessary to appropriately control the angles of the side surfaces of the structures 7 and 8 with respect to the substrates 2 and 3 and the shapes of the structures 7 and 8.

On the other hand, when the structures 7 and 8 have whiteness or light scattering in addition to light reflectivity, the emission direction of light reflected by the structures 7 and 8 is widened. Therefore, the profile of the extracted light does not depend so much on the angle of the side surfaces of the structures 7 and 8 with respect to the substrates 2 and 3 and the shape of the structures 7 and 8, and a natural light emission profile is easily obtained.

As an example, in the case where one or both of the first structure 7 and the second structure 8 is made light scattering, JP 2007-322546 A, JP 2008-211036 A, and 2011 2011. The structures 7 and 8 can be formed by utilizing a high reflectance white solder resist disclosed in Japanese Patent Application No. -66267. Alternatively, a photosensitive resin such as polyimide or acrylic dispersing the particles, such as TiO _2, light reflectivity, light-scattering, it is also an effective method of imparting functions such as whiteness. In this case, the particles such as TiO ₂ preferably have a particle size of 200 nm to 5 μm. By using this type of particles, it is possible to impart light reflectivity to the structures 7 and 8 and also provide light scattering properties that make the light reflection direction random.

When one or both of the first structure 7 and the second structure 8 are light scattering, the first structure 7 and the second structure 8 are the first substrate 2 and the second structure 8. 2 is formed in a predetermined pattern on one or both surfaces of the two substrates 3. In order to pattern these structures 7 and 8 into a predetermined shape, for example, a method of patterning a material obtained by adding titanium oxide particles or the like to a photosensitive resin by photolithography can be employed. Alternatively, a method in which a material obtained by adding titanium oxide particles or the like to the resin is formed on the entire surface, a photoresist pattern is formed thereon, and the resin layer to which the titanium oxide particles are added may be etched into a predetermined pattern. Thus, a known manufacturing process used in a semiconductor manufacturing process, a liquid crystal panel manufacturing process, or the like can be applied.

Regarding the film thicknesses of the first structure 7 and the second structure 8, for example, a film thickness of about 1 μm to 5 μm is generally in an appropriate range. However, a film thickness outside the above range may be appropriately selected according to the purpose. For example, structures 7 and 8 having a film thickness (height) of 100 nm to several tens of μm can be used, and the effects of the present embodiment can be obtained in any case.

Before the light emitted from the light emitting functional layer 5 by the second structure 8 is reflected, it is not preferable that total reflection is repeated inside the light emitting functional layer 5 to cause loss of light each time. Therefore, it is desirable that the interval (opening diameter) between the structures 4 adjacent to each other is not so large.
The interval between the adjacent structures 4 is preferably set to a value such as 50 mm, 20 mm, 10 mm, 5 mm, 1 mm, 500 μm, 100 μm, 50 μm, 20 μm, or the like.

The positions of the first structure 7 and the second structure 8 are the same for the basic units of the light emitting functional layer 5 as in the present embodiment. It is ideal to cover with. However, even when only a part of the periphery of the light emitting functional layer 5 is covered with these structures 7 and 8, the effect of improving the light extraction efficiency can be obtained.

The second structure 8 prevents the liquid applied to a predetermined pixel region of the second substrate 3 from flowing to an adjacent pixel region when the light emitting functional layer 5 is formed by a wet process such as inkjet. You may give the function to do. In order to enhance such a function, it is also preferable to perform a process for imparting liquid repellency to the second structure 8.

For example, a phosphor is used for the light emitting functional layer 5. When the light emitting functional layer 5 is made of a phosphor, more specifically, it can be formed of a mixture of a phosphor and a polymer resin. As the phosphor, an inorganic phosphor, an organic phosphor, an organic / inorganic hybrid phosphor, a quantum dot phosphor, or the like can be used. The phosphor may be composed of a plurality of materials such as a host / guest type.

In this embodiment, since the light emitting functional layer 5 is composed of a phosphor, when the phosphor is irradiated with excitation light from the outside, the phosphor emits light by the light energy of the excitation light. However, the light emission functional layer 5 does not necessarily need to be comprised with fluorescent substance. The light emitting functional layer 5 may be made of a material that emits light by external energy such as electric energy, mechanical energy, thermal energy, charged particle beam energy, radiation energy, and acoustic energy. Furthermore, the light emitting functional layer 5 may be made of a material that emits light by a chemical reaction or a biochemical reaction.

As a method for selectively forming the light emitting functional layer 5 in the region surrounded by the second structure 8, for example, a method of coating materials using a mask vapor deposition method or a wet method such as an inkjet method or a printing method, A method using a laser, such as LITI (Laser Induced Thermal Imaging), LIPS (Laser Induced® Pattern® Wise Sublimation), or a method such as a photo bleaching method may be appropriately selected. However, the light emitting functional layer 5 does not necessarily have to be selectively formed in a region surrounded by the second structure 8, and in addition to the region surrounded by the second structure 8, It may be formed on the upper surface of the structure 8.

When a phosphor is used for the light emitting functional layer 5, the light emitting functional layer 5 absorbs excitation light from an excitation light source such as an ultraviolet light emitting organic EL element, a blue light emitting organic EL element, an ultraviolet light emitting LED, or a blue LED, and emits red light. A red phosphor layer that emits light, a green phosphor layer that emits green light, a blue phosphor layer that emits blue light, and the like. However, when blue light is applied as the excitation light, the blue phosphor layer may not be provided and the blue excitation light may be used as it is for display. When blue light with directionality is used as excitation light, a light scattering layer is used instead of the blue phosphor layer so that the excitation light with directionality is scattered and isotropically extracted. May be. By doing so, the light distribution characteristic of the light from the phosphor layer and the light distribution characteristic of the light from the light scattering layer can be matched, and a display with excellent viewing angle characteristics can be realized. In addition, when the light emission from the phosphor layer is not isotropic light emission, the material for forming the light scattering layer can be adjusted to match the light distribution characteristic of the light scattering layer with the light distribution characteristic of the phosphor layer.

The phosphor layer may be composed of only the phosphor material exemplified below. The phosphor layer may optionally contain an additive or the like, and may be configured such that these materials are dispersed in a polymer material (binding resin) or an inorganic material.
A known phosphor material can be used as the phosphor material of the present embodiment. Such phosphor materials are classified into organic phosphor materials and inorganic phosphor materials. Although these specific compounds are illustrated below, this embodiment is not limited to these materials.

Organic phosphor materials include blue fluorescent dyes, stilbenzene dyes: 1,4-bis (2-methylstyryl) benzene, trans-4,4′-diphenylstilbenzene, coumarin dyes: 7-hydroxy- 4-methylcoumarin and the like can be mentioned. As green fluorescent dyes, coumarin dyes: 2,3,5,6-1H, 4H-tetrahydro-8-trifluoromethylquinolidine (9,9a, 1-gh) coumarin (coumarin 153), 3- (2 ′ -Benzothiazolyl) -7-diethylaminocoumarin (coumarin 6), 3- (2'-benzimidazolyl) -7-N, N-diethylaminocoumarin (coumarin 7), naphthalimide dyes: basic yellow 51, solvent yellow 11, solvent yellow 116 or the like. Examples of red fluorescent dyes include cyanine dyes: 4-dicyanomethylene-2-methyl-6- (p-dimethylaminostyryl) -4H-pyran, pyridine dyes: 1-ethyl-2- [4- (p- Dimethylaminophenyl) -1,3-butadienyl] -pyridinium-perchlorate and rhodamine dyes: rhodamine B, rhodamine 6G, rhodamine 3B, rhodamine 101, rhodamine 110, basic violet 11, sulforhodamine 101 and the like.

Inorganic phosphor materials include blue phosphors such as Sr ₂ P ₂ O ₇ : Sn ⁴⁺ , Sr ₄ Al ₁₄ O ₂₅ : Eu ²⁺ , BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , SrGa ₂ S ₄ : Ce. ³⁺ , CaGa ₂ S ₄ : Ce ³⁺ , (Ba, Sr) (Mg, Mn) Al ₁₀ O ₁₇ : Eu ²⁺ , (Sr, Ca, Ba ₂ , 0 Mg) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu ²⁺ , BaAl ₂ SiO ₈ : Eu ²⁺ , Sr ₂ P ₂ O ₇ : Eu ²⁺ , Sr ₅ (PO ₄ ) ₃ Cl: Eu ²⁺ , (Sr, Ca, Ba) ₅ (PO ₄ ) ₃ Cl: Eu ²⁺ , BaMg ₂ Al ₁₆ O ₂₇ : Eu ²⁺ , (Ba, Ca) ₅ (PO ₄ ) ₃ Cl: Eu ²⁺ , Ba ₃ MgSi ₂ O ₈ : Eu ²⁺ , Sr ₃ MgSi ₂ Examples include O ₈ : Eu ²⁺ . As the green phosphor, (BaMg) Al ₁₆ O ₂₇ : Eu ²⁺ , Mn ²⁺ , Sr ₄ Al ₁₄ O ₂₅ : Eu ²⁺ , (SrBa) Al ₁₂ Si ₂ O ₈ : Eu ²⁺ , (BaMg) ₂ SiO ₄ : Eu ²⁺ , Y ₂ SiO ₅ : Ce ³⁺ , Tb ³⁺ , Sr ₂ P ₂ O ₇ —Sr ₂ B ₂ O ₅ : Eu ²⁺ , (BaCaMg) ₅ (PO ₄ ) ₃ Cl: Eu ^{_{2+, Sr 2 Si 3 O 8}} -2SrCl 2: Eu 2+, Zr 2 SiO 4, MgAl 11 O 19: Ce 3+, Tb 3+, Ba 2 SiO 4: Eu 2+, Sr 2 SiO 4: Eu ²⁺ , (BaSr) SiO ₄ : Eu ^{2+ and the} like. As red phosphors, Y ₂ O ₂ S: Eu ³⁺ , YAlO ₃ : Eu ³⁺ , Ca ₂ Y ₂ (SiO ₄ ) ₆ : Eu ³⁺ , LiY ₉ (SiO ₄ ) ₆ O ₂ : Eu ³⁺ YVO ₄ : Eu ³⁺ , CaS: Eu ³⁺ , Gd ₂ O ₃ : Eu ³⁺ , Gd ₂ O ₂ S: Eu ³⁺ , Y (P, V) O ₄ : Eu ³⁺ , Mg ₄ GeO _5.5 F: Mn ⁴⁺ , Mg ₄ GeO ₆ : Mn ⁴⁺ , K ₅ Eu _2.5 (WO ₄ ) _6.25 , Na ₅ Eu _2.5 (WO ₄ ) _6.25 , K ₅ Eu _2.5 (MoO ₄ ) _6.25 , Na ₅ Eu _2.5 ( MoO ₄ ) _{6.25 and the} like.

The above-mentioned inorganic phosphor may be subjected to surface modification treatment as necessary. Examples of the surface modification treatment include chemical treatment using a silane coupling agent, physical treatment using addition of submicron-order fine particles, and combinations thereof. In view of stability against deterioration due to excitation light, light emission, and the like, it is preferable to use an inorganic material. Further, when an inorganic material is used, the average particle size of the inorganic material is preferably 0.5 μm to 50 μm. If the average particle size of the inorganic material is 0.5 μm or less, the luminous efficiency of the phosphor is drastically reduced. When the average particle size of the inorganic material is 50 μm or more, it becomes difficult to perform patterning with high resolution.

The phosphor layer is prepared by using a phosphor layer forming coating solution obtained by dissolving and dispersing the phosphor material and the resin material in a solvent, using a spin coating method, a dipping method, a doctor blade method, a discharge coating method, a spray coating method. It can be formed by a known wet process such as a coating method such as an inkjet method, a relief printing method, an intaglio printing method, a screen printing method, a micro gravure coating method, or the like. Alternatively, a known dry process such as a resistance heating vapor deposition method, an electron beam (EB) vapor deposition method, a molecular beam epitaxy (MBE) method, a sputtering method, an organic vapor deposition (OVPD) method, or the like, or It can be formed by a laser transfer method or the like.

The phosphor layer can be patterned by a photolithography method by using a photosensitive resin as the polymer material. Here, as the photosensitive resin, a photosensitive resin (photocurable resist material) having a reactive vinyl group such as an acrylic acid resin, a methacrylic acid resin, a polyvinyl cinnamate resin, or a hard rubber resin is used. One kind or a mixture of two or more kinds can be used. In addition, wet processes such as inkjet printing, letterpress printing, intaglio printing, and screen printing, resistance heating vapor deposition using a shadow mask, electron beam (EB) vapor deposition, molecular beam epitaxy (MBE), sputtering, The phosphor material can also be directly patterned by a known dry process such as an organic vapor deposition (OVPD) method or a laser transfer method.

The film thickness of the phosphor layer is generally about 100 nm to 100 μm, but is particularly preferably in the range of 1 μm to 100 μm. If the thickness of the phosphor layer is less than 100 nm, the light from the excitation light source cannot be sufficiently absorbed and the light emission efficiency is lowered. The color purity is deteriorated by mixing the required color with the transmitted light of the excitation light. , Problems arise. Furthermore, in order to increase the absorption of light emitted from the excitation light source and reduce the transmitted light of the excitation light to the extent that the color purity is not adversely affected, the thickness of the phosphor layer is preferably 1 μm or more. When the thickness of the phosphor layer exceeds 100 μm, the efficiency is not increased, and only the material is consumed, and the material cost increases.

When using blue light as excitation light, when a light scattering layer is applied instead of a blue phosphor layer, the light scattering particles may be composed of either an organic material or an inorganic material, but are composed of an inorganic material. It is preferable. Thereby, it becomes possible to diffuse or scatter excitation light having directivity more isotropically and efficiently. Further, by using an inorganic material, a light scattering layer that is stable to light and heat can be provided.

It is preferable that the light scattering particles have high transparency. In addition, the light scattering layer is preferably a layer in which fine particles having a higher refractive index than the base material are dispersed in a low refractive index base material. Further, in order for blue light to be effectively scattered by the light scattering layer, it is necessary that the particle size of the light scattering particles is in the Mie scattering region. Therefore, the particle size of the light scattering particles is preferably about 100 nm to 500 nm.

When an inorganic material is used as the light scattering particle, for example, the main component is an oxide of at least one metal selected from the group consisting of silicon, titanium, zirconium, aluminum, indium, zinc, tin, and antimony. Examples thereof include particles (fine particles). When particles (inorganic fine particles) made of an inorganic material are used as the light scattering particles, for example, silica beads (refractive index: 1.44), alumina beads (refractive index: 1.63), titanium oxide beads ( Examples of the refractive index include anatase type: 2.50, rutile type: 2.70), zirconia bead (refractive index: 2.05), and zinc oxide bead (refractive index: 2.00).

When particles (organic fine particles) made of an organic material are used as the light scattering particles, for example, polymethyl methacrylate beads (refractive index: 1.49), acrylic beads (refractive index: 1.50), acrylic- Styrene copolymer beads (refractive index: 1.54), melamine beads (refractive index: 1.57), high refractive index melamine beads (refractive index: 1.65), polycarbonate beads (refractive index: 1.57), Styrene beads (refractive index: 1.60), crosslinked polystyrene beads (refractive index: 1.61), polyvinyl chloride beads (refractive index: 1.60), benzoguanamine-melamine formaldehyde beads (refractive index: 1.68), Examples thereof include silicone beads (refractive index: 1.50).

The resin material used by mixing with the above-described light scattering particles is preferably a translucent resin. Examples of the resin material include melamine resin (refractive index: 1.57), nylon (refractive index: 1.53), polystyrene (refractive index: 1.60), melamine beads (refractive index: 1.57). , Polycarbonate (refractive index: 1.57), polyvinyl chloride (refractive index: 1.60), polyvinylidene chloride (refractive index: 1.61), polyvinyl acetate (refractive index: 1.46), polyethylene (refractive Ratio: 1.53), polymethyl methacrylate (refractive index: 1.49), poly MBS (refractive index: 1.54), medium density polyethylene (refractive index: 1.53), high density polyethylene (refractive index: 1.54), tetrafluoroethylene (refractive index: 1.35), polytrifluoroethylene chloride (refractive index: 1.42), polytetrafluoroethylene (refractive index: 1.35), and the like.

The gas layer 6 can be composed of various gases such as air, nitrogen, and argon, and the type of gas is not particularly limited. However, it is desirable to use an inert gas from the viewpoint of suppressing characteristic deterioration due to reaction with the light emitting functional layer 5. From the viewpoint of suppressing characteristic deterioration due to the ingress of moisture into the light emitting functional layer 5, it is desirable to use a gas with low humidity such as dry air. At atmospheric pressure, the refractive index of air is about 1.000293, the refractive index of nitrogen is about 1.000297, and the refractive index of argon is 1.000281. Even if other gases are included, the refractive index of the gas can be regarded as approximately 1.000.

It can be considered that the refractive index of gas does not change substantially even if the pressure changes. Therefore, the pressure of the gas layer 6 may be arbitrary, may be atmospheric pressure (1.01325 × 10 ⁵ Pa), may be in a reduced pressure state relative to atmospheric pressure, or may be in a pressurized state. Also good. In the reduced pressure state, an absolute vacuum does not actually exist, but if the form of the gas layer 6 is maintained, for example, a high vacuum state (0.1 Pa to 10 ⁻⁵ Pa) or an ultrahigh vacuum state (10 ^-5 Pa or less).
That is, regardless of the gas pressure, the light emitting functional layer 5 and the first substrate 2 are arranged at a predetermined distance without contacting each other, and between the light emitting functional layer 5 and the first substrate 2. The gas layer 6 having a substantially constant thickness needs to be formed. In the following description, the refractive index of the gas layer 6 is 1.000.

In the luminescent substrate 1 of the present embodiment, the gas layer 6 exists between the light emitting functional layer 5 on the second substrate 3 and the first substrate 2. As described above, the refractive index of the gas layer 6 is 1.000, and when the general optical glass is used for the first substrate 2, the refractive index of the first substrate 2 is about 1.5. Accordingly, for example, if the second substrate 3 is a light-impermeable substrate, the light L1 emitted from the light emitting functional layer 6 is refracted from the gas layer 6 having a refractive index of 1.000 as shown in FIG. The light passes through the first substrate 2 having a rate of 1.5 and is injected into the external space.

At this time, the light L1 traveling from the gas layer 6 toward the first substrate 2 enters the high refractive index material from the low refractive index material, and is totally reflected at the interface between the gas layer 6 and the first substrate 2. Does not occur. Therefore, substantially all of the light traveling from the gas layer 6 toward the first substrate 2 enters the first substrate 2. When the light L1 is incident on the first substrate 2 from the gas layer 6, the light L1 is refracted at an angle θ2 smaller than the incident angle θ1 and travels inside the first substrate 2.

Next, the critical angle at the interface between the first substrate 2 having a refractive index of 1.5 and the atmosphere (external space) having a refractive index of 1.000 is about 42 °. Therefore, when the light L1 travels inside the first substrate 2 and enters the upper surface of the first substrate 2 (the interface between the first substrate 2 and the external space) at an incident angle of less than 42 °, It is injected from the upper surface of one substrate 2. On the other hand, when the light L1 is incident at an incident angle of 42 ° or more, the light L1 is totally reflected on the upper surface of the first substrate. However, since the light L1 is refracted at an angle close to the normal direction of the first substrate 2 when entering the first substrate 2, the light L1 has a sufficiently small incident angle with respect to the upper surface of the first substrate 2. Incident. Therefore, the amount of light totally reflected on the upper surface of the first substrate 2 is small, and a lot of light is emitted from the first substrate 2 to the external space.

For example, the conventional light emitting device disclosed in Patent Document 3 has a low refractive index layer having a refractive index of about 1.01 to 1.30 in the light path from the light emitting layer to the external space. On the other hand, the luminescent substrate 1 of this embodiment has a gas layer 6 having a refractive index of 1.000 between the light emitting functional layer 5 and the first substrate 2. Therefore, in the case of the luminescent substrate 1 of the present embodiment, the light L1 is refracted more than the conventional light emitting element when entering the first substrate 2, and the traveling direction of the light L1 is the normal line of the first substrate 2. Closer to the direction. Therefore, the incident angle of the light L1 with respect to the upper surface of the first substrate 2 is smaller than that of the conventional light emitting element. As a result, in the luminescent substrate 1 of the present embodiment, the proportion of light totally reflected on the upper surface of the first substrate 2 and confined in the first substrate 2 is reduced, and emitted from the upper surface of the first substrate 2. The proportion of light increases. Thus, in the luminescent board | substrate 1 of this embodiment, the extraction efficiency of light can be improved.

Furthermore, when the second structure 8 has light reflectivity, as shown in FIG. 2, the light L2 traveling in the lateral direction from the light emitting functional layer 5 toward the second structure 8 is the second structure. The light is reflected at 8 to change the traveling direction, and travels toward the first substrate 2. In this way, the light L2 traveling in the lateral direction from the light emitting functional layer 5 can be extracted from the first substrate 2. Thereby, the light extraction efficiency can be increased.

[Second Embodiment]
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS.
The basic structure of the luminescent substrate of this embodiment is the same as that of the first embodiment, and the structure of the structure is different from that of the first embodiment.
FIG. 3 is a plan view showing the optical substrate of the present embodiment. 4 is a cross-sectional view taken along the line AA ′ of FIG. 3, showing the optical substrate of the present embodiment.
3 and 4, the same reference numerals are given to the same components as those in FIGS. 1 and 2 of the first embodiment, and description thereof will be omitted.

In the luminescent substrate 1 of the first embodiment, the first structure 7 and the second structure 8 were in contact with each other. With this configuration, the first structure 7 and the second structure 8 have a role of supporting the first substrate 2 and the second substrate 3 with each other. On the other hand, in the luminescent substrate 10 of this embodiment, as shown in FIG. 4, the first structure 7 and the second structure 8 are separated by a predetermined distance d. The distance d is, for example, about 20 μm or less. When the surface of the first substrate 2 or the second substrate 3 is uneven, the distance d may vary. In some cases, the first structure 7 and the second structure 8 come into contact with each other, and the distance d may be 0 μm. In any case, since at least a part of the first structure 7 and the second structure 8 are separated from each other in the luminescent substrate 10 of the present embodiment, the first structure 7 and the second structure 8 are separated from each other. It is difficult for the structure 8 to play a role of supporting the first substrate 2 and the second substrate 3 with each other.

Therefore, a bonding member 11 for fixing the first substrate 2 and the second substrate 3 to each other in a state where the first substrate 2 and the second substrate 3 are bonded to each other is provided on the outer edges of the first substrate 2 and the second substrate 3. Yes. The bonding member 11 may use, for example, a resin adhesive, or may be formed of an inorganic material or the like. The material of the bonding member 11 is not particularly limited as long as adhesion between the first substrate 2 and the second substrate 3 and the bonding member 11 can be secured.

The bonding member 11 is in contact with both the facing surface 2 a of the first substrate 2 facing the second substrate 3 and the facing surface 3 a of the second substrate 3 facing the first substrate 2. That is, the bonding member 11 functions as a support member for supporting the first substrate 2 and the second substrate 3 with each other. The bonding member 11 also functions as an interval holding member that holds an interval d between the first structure 7 and the second structure 8. Accordingly, the height H3 of the bonding member 11 is set to be equal to the sum of the height H1 of the first structure 7, the height H2 of the second structure 8, and the distance d. . In order to define the height H3 of the bonding member 11, for example, a particulate gap material having a certain diameter may be mixed in the constituent material of the bonding member 11.

As shown in FIG. 3, the bonding member 11 is provided in a rectangular ring shape so as to surround the lattice-like structure 4 on the outer edges of the first substrate 2 and the second substrate 3. However, it is not necessary to be provided so as to surround the entire circumference of the structure 4. For example, a part of the bonding member 11 may be interrupted, and a plurality of bonding members may be arranged at intervals.

Also in the luminescent substrate 10 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased can be obtained.

[Third Embodiment]
Hereinafter, a third embodiment of the present invention will be described with reference to FIG.
The basic structure of the luminescent substrate of this embodiment is the same as that of the first embodiment, and the structure of the structure is different from that of the first embodiment.
FIG. 5 is a cross-sectional view showing the optical substrate of the present embodiment.
In FIG. 5, the same code | symbol is attached | subjected to the same component as FIG. 2 of 1st Embodiment, and description is abbreviate | omitted.

In the luminescent substrate 1 of the first embodiment, the structure 4 is composed of the first structure 7 and the second structure 8. On the other hand, in the luminescent substrate 13 of the present embodiment, as shown in FIG. 5, the structure is composed of only the second structure 8, and the first structure 7 in the first embodiment. Does not have. That is, in the luminescent substrate 13 of the present embodiment, the structure is composed of a single layer structure. The second structure 8 is in contact with both the facing surface 2 a of the first substrate 2 facing the second substrate 3 and the facing surface 3 a of the second substrate 3 facing the first substrate 2. The second structure 8 is also in contact with the light emitting functional layer 5. The second structure 8 desirably has light reflectivity, light scattering, whiteness, and the like. Other configurations are the same as those of the first embodiment.

Also in the luminescent substrate 13 of the present embodiment, the same effect as the first embodiment that the light extraction efficiency can be increased can be obtained. In the case of this embodiment, since the first structure 7 does not exist, the structure of the structure is simple, and there is no need to match the first structure 7 and the second structure 8 together. Therefore, the alignment accuracy is low when the first substrate 2 and the second substrate 3 are bonded together, and the bonding operation can be performed easily.

[Fourth Embodiment]
Hereinafter, a fourth embodiment of the present invention will be described with reference to FIG.
The basic configuration of the luminescent substrate of this embodiment is the same as that of the second embodiment, and the configuration of the structure is different from that of the second embodiment.
FIG. 6 is a cross-sectional view showing the optical substrate of the present embodiment.
In FIG. 6, the same code | symbol is attached | subjected to the same component as FIG. 4 of 2nd Embodiment, and description is abbreviate | omitted.

In the luminescent substrate 10 of the second embodiment, the structure 4 is composed of the first structure 7 and the second structure 8. On the other hand, in the luminescent substrate 15 of the present embodiment, as shown in FIG. 6, the structure is composed of only the second structure 8, and the first structure 7 in the second embodiment. Does not have. The second structure 8 is in contact with both the facing surface 2 a of the first substrate 2 facing the second substrate 3 and the facing surface 3 a of the second substrate 3 facing the first substrate 2. The second structure 8 is also in contact with the light emitting functional layer 5. The second structure 8 desirably has light reflectivity, light scattering, whiteness, and the like. Other configurations are the same as those of the second embodiment.

Also in the luminescent substrate 15 of the present embodiment, the same effect as the first embodiment that the light extraction efficiency can be increased can be obtained. In the case of this embodiment, since the first structure 7 does not exist, the structure of the structure is simple, and there is no need to match the first structure 7 and the second structure 8 together. When the first substrate 2 and the second substrate 3 are bonded together, the alignment accuracy is low, and the bonding operation can be performed easily.

[Fifth Embodiment]
Hereinafter, a fifth embodiment of the present invention will be described with reference to FIG.
The basic configuration of the luminescent substrate of this embodiment is the same as that of the second embodiment, and the configuration of the second substrate is different from that of the second embodiment.
FIG. 7 is a cross-sectional view showing the optical substrate of the present embodiment.
In FIG. 7, the same components as those in FIG. 4 of the second embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the first embodiment, it has been described that the second substrate 3 is a light transmissive or light opaque substrate. However, when adopting a configuration in which a phosphor layer is used as the light emitting functional layer 5 and the phosphor layer is irradiated with excitation light through the second substrate 3, the second substrate 3 is practically used in this embodiment. It is more desirable to have a configuration of form.

In the luminescent substrate 17 of the present embodiment, as shown in FIG. 7, the second substrate 18 selectively transmits light in a specific wavelength range and selectively reflects light in other wavelength ranges. It has a function. This type of function can be realized by forming a multilayer film in which layers having different refractive indexes are alternately laminated on one surface of the substrate body. Alternatively, this type of function can be realized by laminating a sheet formed by alternately laminating layers having different refractive indexes on a substrate. A member having this kind of function is often called a bandpass filter or the like. Other configurations are the same as those of the second embodiment.

Specifically, the second substrate 18 selectively transmits light in the wavelength region of the excitation light for causing the light emitting functional layer 5 to emit light, and selectively transmits light in the wavelength region emitted by the light emitting functional layer 5. It has the function of reflecting. Therefore, when ultraviolet light is used as excitation light, the second substrate 18 desirably has a function of selectively transmitting light in the ultraviolet region and selectively reflecting light in the blue region to red region.
Alternatively, when blue light is used as the excitation light, the second substrate 18 desirably has a function of selectively transmitting blue light and selectively reflecting green to red light.

According to this configuration, as shown in FIG. 7, the excitation light L 0 can pass through the second substrate 18 and reach the light emitting functional layer 5. On the other hand, the light L 1 emitted from the light emitting functional layer 5 cannot pass through the second substrate 18. The light L 1 emitted from the light emitting functional layer 5 is reflected by the second substrate 18, then sequentially passes through the gas layer 6 and the first substrate 2, and is emitted from the upper surface of the first substrate 2 to the external space.

The same effect as that of the first embodiment that the light extraction efficiency can be increased also in the luminescent substrate 17 of the present embodiment. Furthermore, since the luminescent substrate 17 of the present embodiment includes the gas layer 6 and the second substrate 18 has a wavelength selective reflection function, the light extraction efficiency can be further increased. .

[Sixth Embodiment]
Hereinafter, a sixth embodiment of the present invention will be described with reference to FIG.
The basic configuration of the luminescent substrate of this embodiment is the same as that of the fifth embodiment, and the configuration of the first structure is different from that of the fifth embodiment.
FIG. 8 is a cross-sectional view showing the optical substrate of the present embodiment.
In FIG. 8, the same components as those in FIG. 7 of the fifth embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the first embodiment, the entire first structure 7 is formed of a material having light absorption or light reflection. On the other hand, in the luminescent substrate 20 of the present embodiment, as shown in FIG. 8, the first structure 21 includes a light absorption layer 22 and a light reflection layer 23 that covers the outer surface of the light absorption layer 22. And a two-layer structure. The light reflection layer 23 is formed on the side surface and the lower surface of the light absorption layer 22, but is not formed on the surface in contact with the first substrate 2. As the constituent material of the light absorption layer 22 and the light reflection layer 23, those exemplified in the first embodiment are used. Other configurations are the same as those of the fifth embodiment.

The first structure 21 may have a configuration in which the light absorption layer 22 and the light reflection layer 23 have the same width, and the light reflection layer 23 is laminated on the light absorption layer 22. However, it is desirable that the width W4 of the light reflection layer 23 is larger than the width W3 of the light absorption layer 22 and the light reflection layer 23 covers the outer surface of the light absorption layer 22 as in the present embodiment. The reason is that if the light reflecting layer 23 does not cover the outer surface of the light absorbing layer 22, the light emitted from the light emitting functional layer 5 strikes the light absorbing layer 22. This is because when light emitted from the light emitting functional layer 5 hits the light absorbing layer 22, it is absorbed and leads to light loss.

Also in the luminescent substrate 20 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased can be obtained. Furthermore, according to the present embodiment, since the first structure 21 having the two-layer structure is provided, the external light LG incident from the outside of the first substrate 2 is light absorption layer 22 as shown in FIG. The light L1 emitted from the light emitting functional layer 5 is reflected by the light reflecting layer 23 and extracted outside. As a result, when this luminescent substrate 20 is used in a display device, the contrast ratio of display can be further increased.

[Seventh Embodiment]
Hereinafter, a seventh embodiment of the present invention will be described with reference to FIG.
The basic configuration of the luminescent substrate of this embodiment is the same as that of the sixth embodiment, and is different from the sixth embodiment in that a color filter is added.
FIG. 9 is a cross-sectional view showing the optical substrate of the present embodiment.
9, the same code | symbol is attached | subjected to the same component as FIG. 8 of 6th Embodiment, and description is abbreviate | omitted.

As shown in FIG. 9, the luminescent substrate 25 of the present embodiment includes a color filter including color filter layers 26R, 26G, and 26B of different colors on the surface 2a of the first substrate 2 facing the second substrate 18. 26 is provided. The gas layer 6 is interposed between the color filter 26 on the first substrate 2 and the light emitting functional layer 5 on the second substrate 18. The color filter 26 is formed in a region surrounded by the first structure 21 on the surface 2 a of the first substrate 2 facing the second substrate 18. Other configurations are the same as those of the sixth embodiment.

The color filter 26 of the present embodiment includes a red color filter layer 26R that transmits red light, a green color filter layer 26G that transmits green light, and a blue color filter layer 26B that transmits blue light. The color filter 26 has both a function of adjusting a spectral spectrum of light emitted from the light emitting functional layer 5 and a function of suppressing reflection of external light incident on the first substrate 2 from the outside.

The red color filter layer 26R, the green color filter layer 26G, and the blue color filter layer 26B are arranged corresponding to the color of light emitted from the light emitting functional layer 5 or the light scattering layer. That is, the red color filter layer 26R is disposed at a position corresponding to the light emitting functional layer 5R that emits red light. Similarly, the green color filter layer 26G is disposed at a position corresponding to the light emitting functional layer 5G that emits green light. The blue color filter layer 26B is disposed at a position corresponding to the light emitting functional layer 5B that emits blue light or the light scattering layer 27 that emits blue light.

In the corresponding light emitting functional layers 5R, 5G, and 5B and the color filter layers 26R, 26G, and 26B, the spectral spectrum of the light emitted from the light emitting functional layers 5R, 5G, and 5B and the transmission through the color filter layers 26R, 26G, and 26B. The spectral spectrum of light does not need to coincide completely, and it is sufficient that at least a part of both spectra overlap. That is, it is only necessary that the hue of light emitted from the light emitting functional layers 5R, 5G, and 5B and the hue of light transmitted through the color filter layers 26R, 26G, and 26B match at least.

Also in the luminescent substrate 25 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased can be obtained. Furthermore, since the luminescent substrate 25 of the present embodiment includes the color filter 26, the light emitted from the luminescent substrate 25 is adjusted to a desired hue by appropriately adjusting the spectral spectrum of the color filter 26 to be used. be able to. Further, since the reflection of external light is suppressed by the color filter 26, the contrast ratio of display can be increased.

[Eighth Embodiment]
Hereinafter, an eighth embodiment of the present invention will be described with reference to FIG.
The basic configuration of the luminescent substrate of this embodiment is the same as that of the seventh embodiment, and the arrangement of the color filters is different from that of the seventh embodiment.
FIG. 10 is a cross-sectional view showing the optical substrate of the present embodiment.
10, the same code | symbol is attached | subjected to the same component as FIG. 9 of 7th Embodiment, and description is abbreviate | omitted.

As shown in FIG. 10, the luminescent substrate 28 of the present embodiment is provided with a color filter 26 including color filter layers 26 </ b> R, 26 </ b> G, and 26 </ b> B of different colors on the light emitting functional layer 5 of the second substrate 18. Yes. The gas layer 6 is interposed between the first substrate 2 and the color filter 26 on the second substrate 18. The color filter 26 is formed in a region surrounded by the second structure 8 on the light emitting functional layer 5 of the second substrate 18.

In the case of the present embodiment, the red color filter layer 26R is laminated on the light emitting functional layer 5R that emits red light. Similarly, the green color filter layer 26G is laminated on the light emitting functional layer 5G that emits green light. The blue color filter layer 26B is laminated on the light emitting functional layer 5B that emits blue light or the light scattering layer 27 that scatters blue light. That is, the color filter 26 may be disposed on the first substrate 2 side or on the second substrate 18 side as long as it is between the light emitting functional layer 5 and the first substrate 2. It may be. The configuration of the color filter 26 is the same as that of the seventh embodiment. Other configurations are the same as those of the seventh embodiment.

Also in the luminescent substrate 28 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased is obtained. Further, by using the color filter 26, it is possible to obtain the same effect as the seventh embodiment that the light from the luminescent substrate 28 can be adjusted to a desired hue and the contrast ratio of display can be increased.

Hereinafter, some modifications of the luminescent substrate will be exemplified.
The following modifications are obtained by changing the combinations of the constituent elements of the luminescent substrates of the first to eighth embodiments.
In the following drawings, components common to those used in the first to eighth embodiments are denoted by the same reference numerals, and description thereof is omitted.

[First Modification]
As shown in FIG. 11, the light-emitting substrate 30 of the first modification has a structure composed of only the first structure 21. The first structure 21 has a two-layer structure of a light absorption layer 22 and a light reflection layer 23. The second substrate 18 has a wavelength selective reflection function.

[Second Modification]
As shown in FIG. 12, the light emitting substrate 32 of the second modified example is composed of only the second structure 8. The second structure 8 is not in contact with the first substrate 2. The second substrate 18 has a wavelength selective reflection function.

[Third Modification]
As shown in FIG. 13, the light emitting substrate 34 of the third modified example includes a structure 4 including a first structure 7 and a second structure 8. The first structure 7 and the second structure 8 are in contact with each other. The second substrate 18 has a wavelength selective reflection function.

[Fourth Modification]
As shown in FIG. 14, the light emitting substrate 36 according to the fourth modified example includes a first structure 21 and a second structure 8. The first structure 21 and the second structure 8 are in contact with each other. The first structure 21 has a two-layer structure of a light absorption layer 22 and a light reflection layer 23. The second substrate 18 has a wavelength selective reflection function.

[Fifth Modification]
As shown in FIG. 15, the light emitting substrate 38 of the fifth modified example includes a first structure 21 and a second structure 8. The first structure 21 and the second structure 8 are in contact with each other. The first structure 21 has a two-layer structure of a light absorption layer 22 and a light reflection layer 23. The second substrate 18 has a wavelength selective reflection function. A color filter 26 is provided on the first substrate 2.

[Sixth Modification]
As shown in FIG. 16, the light emitting substrate 40 according to the sixth modification has a structure including a first structure 21 and a second structure 8. The first structure 21 and the second structure 8 are in contact with each other. The first structure 21 has a two-layer structure of a light absorption layer 22 and a light reflection layer 23. The second substrate 18 has a wavelength selective reflection function. A color filter 26 is provided on the second substrate 18.

Also in the luminescent substrates 30, 32, 34, 36, 38, and 40 of the first to sixth modifications, the same effect as the first embodiment that the light extraction efficiency can be improved is obtained.

[Ninth Embodiment]
The ninth embodiment of the present invention will be described below with reference to FIG.
The basic configuration of the luminescent substrate of the present embodiment is the same as that of the fourth modified example, and the configuration of the structure is different from that of the fourth modified example.
FIG. 17 is a cross-sectional view showing the optical substrate of the present embodiment.
In FIG. 17, the same components as those in FIG. 14 of the fourth modification are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIG. 17, the luminescent substrate 42 of the present embodiment is provided with another structure 43 in each region surrounded by the lattice-shaped structure 21. The structure 43 has the same configuration as the first structure 21 on the first substrate 2, and has a two-layer structure of the light absorption layer 22 and the light reflection layer 23. The second structure 8 does not exist in the region where the structure 43 is provided, and the structure 43 faces the gas layer 6. Other configurations are the same as those of the fourth modification.

The same effect as that of the first embodiment that the light extraction efficiency can be increased also in the luminescent substrate 42 of the present embodiment. Furthermore, the luminescent substrate 42 of the present embodiment includes the structure 43, and the ratio of the light absorption layer 22 is increased. Since these light absorption layers 22 suppress the reflection of external light, the contrast ratio of display can be further increased.

[Tenth embodiment]
Hereinafter, a tenth embodiment of the present invention will be described with reference to FIG.
The basic structure of the luminescent substrate of this embodiment is the same as that of the ninth embodiment, and the structure of the structure is different from that of the ninth embodiment.
FIG. 18 is a cross-sectional view showing the optical substrate of the present embodiment.
18, the same code | symbol is attached | subjected to the same component as FIG. 17 of 9th Embodiment, and description is abbreviate | omitted.

In the luminescent substrate 45 of this embodiment, as shown in FIG. 18, another structure 46 is further provided in each region surrounded by the lattice-shaped structure 21. The structure 46 is different in height from the first structure 21 on the first substrate 2. The structure 46 is higher than the first structure 21 and is in contact with the light emitting functional layer 5 on the second substrate 18. The structure 46 has a two-layer structure of the light absorption layer 22 and the light reflection layer 23. Other configurations are the same as those of the ninth embodiment.

Also in the luminescent substrate 45 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased is obtained. Further, the same effect as that of the ninth embodiment that the contrast ratio of display can be increased can be obtained.

[Eleventh embodiment]
Hereinafter, an eleventh embodiment of the present invention will be described with reference to FIG.
While the luminescent substrates of the first to tenth embodiments include the second substrate, the following eleventh to fourteenth embodiments exemplify luminescent substrates that do not include the second substrate. .
FIG. 19 is a cross-sectional view showing the optical substrate of the present embodiment.
19, the same code | symbol is attached | subjected to the same component as FIG. 2 of 1st Embodiment, and description is abbreviate | omitted.

In the luminescent substrate 48 of the present embodiment, as shown in FIG. 19, the structure 4 includes a first structure 7 and a second structure 8. The first structure 7 and the second structure 8 are joined. The light emitting functional layer 5 is supported by the first substrate 2 in contact with the second structure 8. In the manufacturing process, the second structure 8 is originally formed on the second substrate. After the first substrate and the second substrate are bonded together, the second structure 8 is left, leaving the second structure 8. The substrate from which the second substrate is peeled is the luminescent substrate 48 of the present embodiment. A method for manufacturing the luminescent substrate 48 of this embodiment will be described later. The configuration is the same as that of the first embodiment except that the second substrate is not provided.

Also in the luminescent substrate 48 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased is obtained. In addition, since the luminescent substrate 48 of this embodiment does not include the second substrate, the luminescent substrate can be thinned.

[Twelfth embodiment]
Hereinafter, a twelfth embodiment of the present invention will be described with reference to FIG.
The luminescent substrate of the present embodiment is the same as that of the second embodiment, except that the second substrate is not provided.
FIG. 20 is a cross-sectional view showing the optical substrate of the present embodiment.
20, the same code | symbol is attached | subjected to the same component as FIG. 4 of 2nd Embodiment, and description is abbreviate | omitted.

In the luminescent substrate 50 of the present embodiment, as shown in FIG. 20, the structure 4 includes a first structure 7 and a second structure 8. The first structure 7 and the second structure 8 are separated from each other with a predetermined interval. The lower surface of the bonding member 11 provided on the outer edge portion of the first substrate 2 is bonded to the light emitting functional layer 5. Thereby, the light emitting functional layer 5 is supported on the first substrate 2 via the bonding member 11. That is, the bonding member 11 functions as a support member for supporting the light emitting functional layer 5 on the first substrate 2. Other configurations are the same as those of the second embodiment.

Also in the luminescent substrate 50 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased is obtained. Further, the same effect as that of the eleventh embodiment that the light emitting substrate can be thinned can be obtained.

[Thirteenth embodiment]
Hereinafter, a thirteenth embodiment of the present invention will be described with reference to FIG.
The basic configuration of the luminescent substrate of this embodiment is the same as that of the eleventh embodiment, and the configuration of the structure is different from that of the eleventh embodiment.
FIG. 21 is a cross-sectional view showing the optical substrate of the present embodiment.
In FIG. 21, the same components as those in FIG. 19 of the eleventh embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the luminescent substrate 48 of the eleventh embodiment, the structure 4 is composed of the first structure 7 and the second structure 8. On the other hand, in the luminescent substrate 52 of the present embodiment, as shown in FIG. 21, the structure is composed of only the second structure 8, and the first structure 7 in the eleventh embodiment. Does not have. That is, in the luminescent substrate 52 of the present embodiment, the structure is composed of a single layer structure. The second structure 8 is in contact with the first substrate 2 and the light emitting functional layer 5. In this configuration, the light emitting functional layer 5 is supported on the first substrate 2 by the second structure 8. Other configurations are the same as those in the eleventh embodiment.

Also in the luminescent substrate 52 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased is obtained. Further, the same effect as that of the eleventh embodiment that the light emitting substrate can be thinned can be obtained.

[Fourteenth embodiment]
The fourteenth embodiment of the present invention will be described below with reference to FIG.
The basic structure of the luminescent substrate of this embodiment is the same as that of the twelfth embodiment, and the structure of the structure is different from that of the twelfth embodiment.
FIG. 22 is a cross-sectional view showing the optical substrate of the present embodiment.
22, the same code | symbol is attached | subjected to the same component as FIG. 20 of 12th Embodiment, and description is abbreviate | omitted.

In the luminescent substrate 50 of the twelfth embodiment, the structure 4 is composed of the first structure 7 and the second structure 8. On the other hand, in the luminescent substrate 54 of the present embodiment, as shown in FIG. 22, the structure is composed of only the second structure 8, and the first structure 7 in the twelfth embodiment. Does not have. That is, in the luminescent substrate 54 of the present embodiment, the structure is composed of a single layer structure. The second structure 8 is not in contact with the first substrate 2, and the light emitting functional layer 5 is supported on the first substrate 2 via the bonding member 11. Other configurations are the same as those in the twelfth embodiment.

Also in the luminescent substrate 54 of the present embodiment, the same effect as that of the first embodiment that the light extraction efficiency can be increased is obtained. Further, the same effect as that of the eleventh embodiment that the light emitting substrate can be thinned can be obtained.

[Fifteenth embodiment]
The fifteenth embodiment of the present invention will be described below with reference to FIGS. 23A to 23D.
In the following fifteenth to twenty-fifth embodiments, the method for producing an optical substrate of the present invention is illustrated.
FIG. 23A to FIG. 23D are cross-sectional views sequentially showing the manufacturing process of the luminescent substrate of this embodiment.

The manufacturing process of the light emitting substrate of the present embodiment includes a first structure forming step, a second structure forming step, a light emitting functional layer forming step, a first substrate, a second substrate, Bonding process. The manufacturing process of this embodiment is a manufacturing process of the luminescent substrate of the first embodiment.

As shown in FIG. 23A, the first structure 7 is formed on the one surface 2 a of the first substrate 2.
As already described, the first structure 7 can have various functions such as light transmission, light non-transmission, light absorption, light reflection, and light scattering. A particularly preferable example is a light-absorbing structure. In this case, the first structure 7 is a so-called black matrix. Another preferred example is a laminated structure of a light absorption layer and a light reflection layer.

In forming the first structure 7, for example, a black matrix forming technique used in a manufacturing process of a normal liquid crystal display or a color filter substrate can be used. Alternatively, the technique of forming a high reflectance white solder resist disclosed in Japanese Patent Application Laid-Open Nos. 2007-322546, 2008-211036, 2011-66267, and the like can be used. Alternatively, it is also an effective technique to disperse particles such as TiO ₂ in a photosensitive resin such as polyimide or acrylic to impart functions such as light reflectivity, light scattering, and whiteness. In these cases, the patterning can be performed by processes such as exposure, development, and etching that are frequently used in the manufacture of liquid crystal displays and semiconductors, but is not limited thereto.

Separately, as shown in FIG. 23B, the second structure 8 is formed on the one surface 3 a of the second substrate 3.
As with the first structure 7, the second structure 8 can have various functions such as light transmission, light non-transmission, light absorption, light reflection, and light scattering. A particularly preferred example is a structure having light scattering properties. In this case as well, for example, a white solder resist forming technique can be used.

Next, as shown in FIG. 23C, the light emitting functional layer 5 is formed on the one surface 3a on which the second structure 8 of the second substrate 3 is formed. When a phosphor layer is used as the light emitting functional layer 5, a material in which a phosphor is dispersed in a resin is applied on the second substrate 3. As a coating method, for example, a method in which a material in which a phosphor is dispersed in a resin is applied to the entire surface of the substrate by using a spin coating method, a cup coating method, or the like. Alternatively, a method of applying a material to each region partitioned by the second structure 8 using an ink jet method, a dispenser method, or the like can be used. Alternatively, a method of forming a light emitting functional material such as a phosphor on the second substrate 3 using an evaporation method or the like may be used.

In this step, it is desirable to adjust the coating amount of the material so that the thickness of the light emitting functional layer 5 is thinner than the thickness (height) of the second structure 8. By doing so, the flow of the material is blocked by the second structure 8 when the light emitting functional layer material is applied onto the second substrate 3. Therefore, the light emitting functional layer material can be prevented from flowing out to an unintended position.

Next, as shown in FIG. 23D, the first substrate 2 and the second substrate 3 are bonded together so that the first structure 7 and the second structure 8 face each other. Thereby, the gas layer 6 is formed between the first substrate 2 and the second substrate 3. At this time, alignment is performed so that the position of the first structure 7 on the first substrate 2 and the position of the second structure 8 on the second substrate 3 coincide.
The following various methods can be adopted as a method of bonding the substrates.

The simplest method is a method of pressing the first substrate 2 and the second substrate 3 after aligning the first substrate 2 and the second substrate 3. At this time, the first substrate 2 and the second substrate 3 may be pressurized or heated as necessary. However, although this method is a simple method, sufficient bonding strength may not be obtained.

A more realistic method is to apply an adhesive to at least one of the opposing surfaces of the first structure 7 and the second structure 8, and then align the first substrate 2 and the second substrate 3. This is a method of pasting together. Also in this case, the first substrate 2 and the second substrate 3 may be pressurized as necessary. Depending on the type of adhesive, the first substrate 2 and the second substrate 3 may be heated or may be irradiated with light. The adhesive can be applied by printing or the like.

According to the manufacturing method of the present embodiment, a luminescent substrate having excellent light extraction efficiency can be manufactured.

[Sixteenth Embodiment]
The sixteenth embodiment of the present invention will be described below with reference to FIGS. 24A to 24E.
The basic configuration of the manufacturing method of the light emitting substrate of the present embodiment is the same as that of the fifteenth embodiment, and is different from the fifteenth embodiment in that two substrates are bonded through a bonding member.
24A to 24E are cross-sectional views showing the manufacturing process of the luminescent substrate of this embodiment step by step.
24A to 24E, the same components as those in FIGS. 23A to 23D of the fifteenth embodiment are denoted by the same reference numerals, and description thereof is omitted.

The manufacturing process of the luminescent substrate according to the present embodiment includes a first structure forming step, a second structure forming step, a light emitting functional layer forming step, a bonding member forming step, And a bonding step between the substrate and the second substrate. The manufacturing process of this embodiment is a manufacturing process of the luminescent substrate of the second embodiment.

In the manufacturing process of this embodiment, the steps shown in FIGS. 24A to 24C are the same as those in the fifteenth embodiment.
After forming the light emitting functional layer 5 on the second substrate 3 as shown in FIG. 24A, the bonding member 11 is formed in a frame shape on the light emitting functional layer 5 of the second substrate 3 as shown in FIG. 24D. Form. For example, an adhesive is used as a constituent material of the bonding member 11. Application of the adhesive onto the second substrate 3 can be performed using a dispenser method, a printing method, or the like. Further, a gap material may be mixed in advance in the adhesive in order to keep the distance d between the first structure 7 and the second structure 8 constant after the substrates are bonded together. Here, although the example which forms the bonding member 11 on the light emission functional layer 5 of the 2nd board | substrate 3 was shown, the bonding member 11 was shown in the area | region in which the light emission functional layer 5 on the 2nd board | substrate 3 is not formed. May be formed. Alternatively, the bonding member 11 may be formed on the first substrate 2 instead of the second substrate 3.

Next, as shown in FIG. 24E, the first substrate 2 and the second substrate 3 are bonded via the bonding member 11 so that the first structure 7 and the second structure 8 face each other. And paste them together.
At this time, alignment is performed so that the position of the first structure 7 on the first substrate 2 matches the position of the second structure 8 on the second substrate 3. At the time of bonding, the first substrate 2 and the second substrate 3 may be pressurized as necessary. Depending on the type of adhesive used for the bonding member 11, it may be heated or irradiated with light.

Also in the manufacturing method of the present embodiment, an effect similar to that of the fifteenth embodiment can be obtained, in which a luminescent substrate having excellent light extraction efficiency can be manufactured.

[Seventeenth embodiment]
The seventeenth embodiment of the present invention will be described below with reference to FIGS. 25A to 25D.
The basic configuration of the method for manufacturing a luminescent substrate of the present embodiment is the same as that of the fifteenth embodiment, and is different from the fifteenth embodiment in that the first structure is not formed.
FIG. 25A to FIG. 25D are cross-sectional views sequentially showing the manufacturing steps of the luminescent substrate of this embodiment.
25A to 25D, the same components as those in FIGS. 23A to 23D of the fifteenth embodiment are denoted by the same reference numerals, and description thereof is omitted.

The manufacturing process of the light emitting substrate of the present embodiment includes a second structure forming step, a light emitting functional layer forming step, and a bonding step between the first substrate and the second substrate. . The manufacturing process of this embodiment is a manufacturing process of the luminescent substrate of the third embodiment.

In the manufacturing process of the present embodiment, the first structure is not formed on the first substrate 2 as shown in FIG. 25A. The other steps shown in FIGS. 25B to 25E are the same as those in the fifteenth embodiment. That is, in the step shown in FIG. 25D, the first substrate 2 on which the structure is not formed and the second substrate 3 on which the second structure 8 is formed are pasted via the second structure 8. Match.

Also in the manufacturing method of the present embodiment, the same effects as those of the fifteenth to sixteenth embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured.

[Eighteenth embodiment]
The eighteenth embodiment of the present invention will be described below with reference to FIGS. 26A to 26E.
The basic configuration of the manufacturing method of the light emitting substrate of this embodiment is the same as that of the seventeenth embodiment, and is different from the seventeenth embodiment in that two substrates are bonded through a bonding member.
26A to 26E are cross-sectional views showing the manufacturing process of the light emitting substrate of this embodiment in order.
In FIG. 26A to FIG. 26E, the same reference numerals are given to the same constituent elements as those in FIG. 25A to FIG.

The manufacturing process of the light emitting substrate of the present embodiment includes a second structure forming step, a light emitting functional layer forming step, a bonding member forming step, and a bonding between the first substrate and the second substrate. And a combining step. The manufacturing process of this embodiment is a manufacturing process of the luminescent board | substrate of 4th Embodiment.

In the manufacturing process of the present embodiment, the steps shown in FIGS. 26A to 26C are the same as those in the seventeenth embodiment.
After forming the light emitting functional layer 5 on the second substrate 3 as shown in FIG. 26C, the bonding member 11 is formed in a frame shape on the light emitting functional layer 5 of the second substrate 3 as shown in FIG. 26D. Form. For example, an adhesive is used as a constituent material of the bonding member 11. Application of the adhesive onto the second substrate 3 can be performed using a dispenser method, a printing method, or the like. Further, in order to keep the distance d between the first substrate 2 and the second structure 8 constant, a gap material may be mixed in the adhesive in advance. Here, although the example which forms the bonding member 11 on the light emission functional layer 5 of the 2nd board | substrate 3 was shown, the bonding member 11 was shown in the area | region in which the light emission functional layer 5 on the 2nd board | substrate 3 is not formed. May be formed. Alternatively, a bonding member may be formed on the first substrate 2.

Next, as shown in FIG. 26E, the first substrate 2 and the second substrate 3 are bonded via the bonding member 11 so that the second structure 8 faces the first substrate 2. Match. When the substrates are bonded together, the first substrate 2 and the second substrate 3 may be pressurized as necessary. Depending on the type of adhesive used for the bonding member 11, it may be heated or irradiated with light.

Also in the manufacturing method of the present embodiment, the same effects as those of the fifteenth to seventeenth embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured.

[Nineteenth Embodiment]
The nineteenth embodiment of the present invention will be described below with reference to FIGS. 27A to 27E.
The basic configuration of the method for manufacturing a light emitting substrate of this embodiment is the same as that of the fifteenth embodiment, and differs from the fifteenth embodiment in that after the two substrates are bonded together, the second substrate is peeled off.
27A to 27E are cross-sectional views showing the manufacturing process of the luminescent substrate of this embodiment in order.
In FIGS. 27A to 27E, the same components as those in FIGS. 23A to 23D of the fifteenth embodiment are denoted by the same reference numerals, and description thereof is omitted.

The manufacturing process of the luminescent substrate of the present embodiment includes a first structure forming step, a sacrificial layer forming step, a second structure forming step, a light emitting functional layer forming step, A bonding process between the substrate and the second substrate and a peeling process of the second substrate are provided. The manufacturing process of this embodiment is a manufacturing process of the luminescent substrate of the eleventh embodiment.

As shown in FIG. 27A, the first structure 7 is formed on the one surface 2 a of the first substrate 2.
A specific method for forming the first structure 7 is as described in the fifteenth embodiment.

Separately, as shown in FIG. 27B, the second structure 8 is formed on the one surface 3 a of the second substrate 3. A specific method for forming the second structure 8 is as described in the fifteenth embodiment. In the post-process, after the first substrate 2 and the second substrate 3 are bonded together, the second substrate 3 is peeled from the second structure 8. Therefore, if the second substrate 3 can be easily peeled at the position of the interface between the second structure 8 and the second substrate 3, it is not necessary to process the second substrate 3. The second structure 8 may be formed on one surface of the substrate 3. However, in general, it is often difficult to peel the substrate from the interface between the structure and the substrate without processing the second substrate 3. In that case, the following steps may be added.

Before the second structure 8 is formed on the second substrate 3, the sacrificial layer 57 is formed at a position slightly deep from the one surface 3a of the second substrate 3. As a specific method of forming the sacrificial layer 57, for example, a method of introducing a high concentration of hydrogen ions into the second substrate 3 using an ion implantation method to form a layer into which hydrogen ions are introduced can be employed. A method of peeling the second substrate 3 from the layer into which hydrogen ions are introduced by applying a heat treatment later is a known method.

Alternatively, as a method for forming the sacrificial layer 57, an alkali metal oxide such as lithium oxide, carbonate, sulfate, hydroxide, or alkaline earth metal such as sodium carbonate is formed on one surface 3 a of the second substrate 3. A method of forming a layer made of oxide, carbonate, sulfate, hydroxide or the like can be employed. The second substrate 3 is peeled off by etching and removing the sacrificial layer 57 later. According to this method, since the sacrificial layer 57 can be formed on the one surface 3a of the second substrate 3, the second substrate 3 is peeled off at the position of the interface between the second structure 8 and the second substrate 3. Can do.

Next, as shown in FIG. 27C, the light emitting functional layer 5 is formed on the surface of the second substrate 3 on which the second structures 8 are formed. A specific method for forming the light emitting functional layer 5 is as described in the fifteenth embodiment.

Next, as shown in FIG. 27D, the first substrate 2 and the second substrate 3 are bonded together so that the first structure 7 and the second structure 8 face each other. A specific bonding method is as described in the fifteenth embodiment.

Next, as shown in FIG. 27E, by removing the sacrificial layer 57, the second substrate 3 is peeled off at the position where the sacrificial layer 57 is formed. As described above, when removing the sacrificial layer 57, if the sacrificial layer 57 is a hydrogen ion introduction layer, heat treatment may be applied to the entire bonded substrate. When the sacrificial layer 57 is an alkali metal or alkaline earth metal compound, etching such as wet etching or dry etching may be performed. When the sacrificial layer 57 is a hydrogen ion introduction layer, a part 3 f of the second substrate 3 having a slight thickness remains on the lower surface side of the light emitting functional layer 5. In this case, if a light-transmitting substrate is used as the second substrate 3, even if a part 3f of the second substrate 3 remains, there is no particular problem in terms of characteristics. Further, it is preferable in that the light emitting functional layer 5 and the second structure 8 are supported by the remaining part 3 f of the second substrate 3.

Also in the manufacturing method of this embodiment, the same effects as those of the fifteenth to eighteenth embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured.

[20th embodiment]
The twentieth embodiment of the present invention will be described below with reference to FIGS. 28A to 28F.
The basic configuration of the manufacturing method of the light emitting substrate of the present embodiment is the same as that of the nineteenth embodiment, and differs from the nineteenth embodiment in that two substrates are bonded through a bonding member.
28A to 28F are cross-sectional views showing the manufacturing process of the light-emitting substrate of this embodiment in order.
28A to 28F, the same components as those in FIGS. 27A to 27E according to the nineteenth embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

The manufacturing process of the light emitting substrate of the present embodiment includes a first structure forming step, a sacrificial layer forming step, a second structure forming step, a light emitting functional layer forming step, and a bonding member. Forming step, a bonding step between the first substrate and the second substrate, and a peeling step of the second substrate. The manufacturing process of this embodiment is a manufacturing process of the luminescent substrate of the twelfth embodiment.

In the manufacturing process of this embodiment, the steps shown in FIGS. 28A to 28C are the same as those in the nineteenth embodiment.
As shown in FIG. 28C, after the light emitting functional layer 5 is formed on the second substrate 3, the bonding member 11 is formed on the light emitting functional layer 5 of the second substrate 3 as shown in FIG. 28D.
Next, as shown in FIG. 28E, the first substrate and the second substrate are bonded to each other with the bonding member 11 so that the second structure 8 faces the first substrate. Other steps are the same as those in the nineteenth embodiment.

Also in the manufacturing method of the present embodiment, the same effects as those of the fifteenth to nineteenth embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured.

[Twenty-first embodiment]
Hereinafter, a twenty-first embodiment of the present invention will be described with reference to FIGS. 29A to 29F.
The basic configuration of the manufacturing method of the luminescent substrate of this embodiment is the same as that of the nineteenth embodiment, and is different from the nineteenth embodiment in that after the second substrate is peeled off, the third substrate is bonded to the peeled surface. .
FIG. 29A to FIG. 29F are cross-sectional views sequentially showing the manufacturing steps of the luminescent substrate of this embodiment.
29A to 29F, the same components as those in FIGS. 27A to 27E according to the nineteenth embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

The manufacturing process of the luminescent substrate of the present embodiment includes a first structure forming step, a sacrificial layer forming step, a second structure forming step, a light emitting functional layer forming step, A bonding step between the substrate and the second substrate; a peeling step of the second substrate; and a bonding step of the third substrate. The manufacturing process of this embodiment is a manufacturing process of the luminescent board | substrate of a 3rd modification.

In the manufacturing process of this embodiment, the steps shown in FIGS. 29A to 29E are the same as those in the nineteenth embodiment.
As shown in FIG. 29E, after the second substrate 3 is peeled off, as shown in FIG. 29F, a portion 3f of the second substrate 3 remaining when the second substrate 3 is peeled is added to the third substrate 3f. The substrate 58 is attached. In this embodiment, the third substrate 58 selectively transmits light in a specific wavelength range (excitation light) and selectively reflects light in another wavelength range (fluorescence emitted from the light emitting functional layer). A substrate or film having When the third substrate 58 is bonded, an adhesive may be used, or thermocompression bonding may be used.

Also in the manufacturing method of the present embodiment, the same effects as those of the fifteenth to twentieth embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured.

[Twenty-second embodiment]
Hereinafter, a twenty-second embodiment of the present invention will be described with reference to FIGS. 30A to 30F.
The basic configuration of the method for manufacturing a luminescent substrate of the present embodiment is the same as that of the twenty-first embodiment, and is different from the twenty-first embodiment in that two substrates are bonded via a bonding member.
30A to 30F are cross-sectional views showing the manufacturing process of the luminescent substrate of this embodiment step by step.
30A to 30F, the same reference numerals are given to the same components as those in FIGS. 29A to 29F of the twenty-first embodiment, and the description thereof will be omitted.

The manufacturing process of the light emitting substrate of the present embodiment includes a first structure forming step, a sacrificial layer forming step, a second structure forming step, a light emitting functional layer forming step, and a bonding member. Forming step, a bonding step between the first substrate and the second substrate, a peeling step of the second substrate, and a bonding step of the third substrate.

In the manufacturing process of this embodiment, the steps shown in FIGS. 30A to 30B are the same as those in the twenty-first embodiment.
As shown in FIG. 30C, after the light emitting functional layer 5 is formed on the second substrate 3, the bonding member 11 is formed on the light emitting functional layer 5 of the second substrate 3.
Next, as shown in FIG. 30D, the first substrate 2 and the second substrate 3 are bonded via the bonding member 11 so that the second structure 8 faces the first structure 7. to paste together.
Other steps are the same as those in the twenty-first embodiment.

Also in the manufacturing method of the present embodiment, the same effects as those of the fifteenth to twenty-first embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured.

[Twenty-third embodiment]
A twenty-third embodiment of the present invention will be described below with reference to FIGS. 31A to 31E.
The basic structure of the manufacturing method of the light emitting substrate of the present embodiment is the same as that of the fifteenth embodiment. The first structure has a two-layer structure of a light absorption layer and a light reflection layer, and the second substrate has the same structure. The point which peels one part differs from 15th Embodiment.
FIG. 31A to FIG. 31E are cross-sectional views sequentially showing the manufacturing process of the luminescent substrate of this embodiment.
31A to 31E, the same components as those in FIGS. 23A to 23D of the fifteenth embodiment are denoted by the same reference numerals, and description thereof is omitted.

The manufacturing process of the light emitting substrate of the present embodiment includes a first structure forming step, a sacrificial layer forming step, a wavelength selective reflection layer forming step, a second structure forming step, and a light emitting function. A layer forming step, a bonding member forming step, a first substrate and second substrate bonding step, and a second substrate peeling step. The manufacturing process of this embodiment is a manufacturing process of the luminescent board | substrate of a 4th modification.

As shown in FIG. 31A, a first structure 21 having a two-layer structure of a light absorption layer 22 and a light reflection layer 23 is formed on one surface of the first substrate 2. In the present embodiment, the width W4 of the light reflecting layer 23 is set wider than the width W3 of the light absorbing layer 22. When the first structure 21 is formed, a film made of the constituent material of the light absorption layer 22 is first formed. Next, the light absorbing layer 22 is formed by patterning the light absorbing material film by photolithography. Next, a film made of a constituent material of the light reflection layer 23 is formed so as to cover the light absorption layer 22. Next, the light reflecting material film is patterned by photolithography to form the light reflecting layer 23 wider than the light absorbing layer 22. Thus, the 1st structure 21 can be formed by performing patterning twice by photolithography. Note that, in place of the configuration of the present embodiment, when the width of the light reflection layer is equal to the width of the light absorption layer, the light reflection layer and the light absorption layer may be formed in a single patterning process. .

Separately, as shown in FIG. 31B, a second structure 8 is formed on one surface 3a of the second substrate 3. A specific method for forming the second structure 8 is as described in the fifteenth embodiment. However, the second substrate 3 is different from the fifteenth embodiment in that the second substrate 3 on which the sacrificial layer 57 and the wavelength selective reflection layer 59 are sequentially formed is used as the second substrate. Therefore, before the second structure 8 is formed, the sacrificial layer 57 and the wavelength selective reflection layer 59 are sequentially formed on one surface of the arbitrary substrate to form the second substrate 3.

Next, as illustrated in FIG. 31C, the bonding member 11 is formed on the one surface 3 a of the second substrate 3.
Next, as shown in FIG. 31D, the first substrate 2 and the second substrate 3 are bonded via the bonding member 11 so that the first structure 21 and the second structure 8 face each other. And paste them together.
Next, as shown in FIG. 31E, by removing the sacrificial layer 57, the second substrate 3 is peeled off at the position where the sacrificial layer 57 is formed. Thereby, the wavelength selective reflection layer 59 remains on the lower surface of the light emitting functional layer 5.

Also in the manufacturing method of the present embodiment, the same effects as those of the fifteenth to twenty-second embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured. Further, according to the manufacturing method of the present embodiment, a light-emitting substrate having excellent light extraction efficiency can be manufactured without attaching a third substrate having a wavelength selective reflection function later.

[Twenty-fourth embodiment]
A twenty-fourth embodiment of the present invention will be described below with reference to FIGS. 32A to 32E.
The basic configuration of the method for manufacturing a luminescent substrate of the present embodiment is the same as that of the twenty-third embodiment, and is different from the twenty-third embodiment in that the first structure is not formed.
FIG. 32A to FIG. 32E are cross-sectional views sequentially showing the manufacturing process of the light emitting substrate of this embodiment.
32A to 32E, the same components as those in FIGS. 31A to 31D of the twenty-third embodiment are denoted by the same reference numerals, and description thereof is omitted.

The manufacturing process of the light emitting substrate of the present embodiment includes a second structure forming step, a light emitting functional layer forming step, a bonding member forming step, and a bonding between the first substrate and the second substrate. A matching step and a second substrate peeling step.

In the manufacturing process of this embodiment, as shown in FIG. 32A, the first structure is not formed on the first substrate 2. The other steps shown in FIGS. 32B to 32E are the same as those in the twenty-third embodiment. That is, in the step shown in FIG. 32D, the first substrate 2 on which the structure is not formed and the second substrate 3 on which the second structure 8 is formed are bonded through the bonding member 11.

Also in the manufacturing method of the present embodiment, the same effects as those of the fifteenth to twenty-third embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured.

[25th Embodiment]
The twenty-fifth embodiment of the present invention will be described below with reference to FIGS. 33A to 33D.
The basic configuration of the manufacturing method of the light emitting substrate of this embodiment is the same as that of the fifteenth embodiment, and is different from the fifteenth embodiment in that the substrates are bonded together under a reduced pressure atmosphere.
33A to 33D are cross-sectional views showing the manufacturing process of the luminescent substrate of this embodiment step by step.
33A to 33D, the same components as those in FIGS. 23A to 23D of the fifteenth embodiment are denoted by the same reference numerals, and description thereof is omitted.

The manufacturing process of the luminescent substrate of the present embodiment includes a first structure forming step, a second structure forming step, a light emitting functional layer forming step, and a first substrate in a reduced-pressure atmosphere. And a bonding step with the second substrate.

33A to 33C are the same as those in the fifteenth embodiment. Next, in the fifteenth to twenty-fourth embodiments, the first substrate 2 and the second substrate 3 are bonded together under a normal pressure atmosphere. On the other hand, in this embodiment, the 1st board | substrate 2 and the 2nd board | substrate 3 are bonded together in a pressure-reduced atmosphere. Therefore, in this embodiment, as shown in FIG. 33D, a bonding apparatus including a chamber 61 whose inside can be sealed is used. The inside of the chamber 61 is made into a reduced-pressure atmosphere by a pump 62 so that the pressure can be adjusted arbitrarily. By bonding using this type of bonding apparatus, the pressure of the gas layer 6 formed between the first substrate 2 and the second substrate 3 becomes lower than atmospheric pressure.

At this time, if a gas other than air is introduced into the chamber 61, the gas layer 6 made of the introduced gas can be formed. For example, when nitrogen gas is introduced into the chamber, the gas layer 6 made of nitrogen gas is formed. When dry air is introduced into the chamber, a gas layer 6 made of dry air is formed. In that case, it is preferable at the point which can suppress the permeation of the water | moisture content to the light emission functional layer 5. FIG.

Conversely, when the inside of the chamber 61 is in a pressurized state, the pressure of the gas layer 6 formed between the first substrate 2 and the second substrate 3 becomes higher than atmospheric pressure.

Also in the manufacturing method of the present embodiment, the same effects as those of the fifteenth to twenty-fourth embodiments can be obtained, such that a light-emitting substrate having excellent light extraction efficiency can be manufactured.

[Twenty-sixth embodiment]
Hereinafter, a twenty-sixth embodiment of the present invention will be described with reference to FIG.
In the present embodiment, an example of an organic EL element is given as an example of a light emitting element provided with the light emitting substrate.
FIG. 34 is a cross-sectional view of the organic EL element of this embodiment.

As shown in FIG. 34, the organic EL element 70 of the present embodiment includes a first substrate 2, a second substrate 3, a structure 4, an organic EL light source 71, a light emitting functional layer 5, and a gas layer. 6 and a color filter 26. The organic EL element 70 of the present embodiment includes the light emitting substrate of the fifth modified example shown in FIG. That is, the structure 4 is composed of the first structure 21 and the second structure 8 joined to each other. The first structure 21 on the first substrate 2 has a two-layer structure of a light absorption layer 22 that becomes a black matrix and a light reflection layer 23. The second structure 8 on the second substrate 3 has light scattering properties.

In the present embodiment, each of the areas partitioned by the structure 4 corresponds to a sub-pixel constituting a pixel that is a minimum unit of display. Therefore, as shown in FIG. 34, the three adjacent regions correspond to a red sub-pixel 72R that displays red, a green sub-pixel 72G that displays green, and a blue sub-pixel 72B that displays blue. One pixel is composed of three sub-pixels of the red sub-pixel 72R, the green sub-pixel 72G, and the blue sub-pixel 72B.

An organic EL light source 71 is provided for each sub-pixel on the surface of the second substrate 3 facing the first substrate 2. The organic EL light source 71 includes a first electrode 73, an organic light emitting layer 74, and a second electrode 75. The first electrode 73 (lower electrode) may be a transparent electrode, and for example, ITO (Indium-tin-oxide), ZnO (Zinc oxide), or the like is used. The thickness of the first electrode 73 is, for example, about 100 nm. The first electrode 73 is normally an anode, but can be a cathode. When the first electrode 73 is a cathode, a material having a low work function is used. In addition, auxiliary wiring may be provided for the purpose of reducing wiring resistance. The auxiliary wiring can be formed of a metal material such as Al, Ag, Ta, Ti, Ni, for example. The second electrode 75 (upper electrode) is formed of a transparent electrode, like the first electrode 73. The second electrode 75 (upper electrode) can be an anode. When the second electrode 75 is an anode, a material having a high work function, such as ITO, is preferably used.

In addition to these, various known electrode materials can be used as the electrode material for forming the first electrode 73 and the second electrode 75. When the electrode is an anode, gold (Au), platinum (Pt), nickel (Ni), or the like having a work function of 4.5 eV or more from the viewpoint of more efficiently injecting holes into the organic light emitting layer 74. Metal, oxide (ITO) composed of indium (In) and tin (Sn), tin (Sn) oxide (SnO ₂ ), oxide (IZO) composed of indium (In) and zinc (Zn), etc. Is mentioned as a transparent electrode material.

As an electrode material for forming the cathode, lithium (Li), calcium (Ca), cerium (Ce), barium having a work function of 4.5 eV or less from the viewpoint of more efficiently injecting electrons into the organic light emitting layer 74. Examples thereof include metals such as (Ba) and aluminum (Al), and alloys such as Mg: Ag alloy and Li: Al alloy containing these metals.

The first electrode 73 and the second electrode 75 can be formed using the above materials by a known method such as an EB vapor deposition method, a sputtering method, an ion plating method, or a resistance heating vapor deposition method. However, this embodiment is not limited to these formation methods. If necessary, the formed electrode can be patterned by a photolithography method or a laser peeling method. In addition, a patterned electrode can be directly formed by combining with a shadow mask. The film thickness of the electrode is preferably 50 nm or more. When the film thickness is less than 50 nm, the wiring resistance is increased, which may increase the drive voltage.

The organic light emitting layer 74 emits light in a predetermined wavelength range by a voltage applied between the first electrode 73 and the second electrode 75. In the present embodiment, the organic light emitting layer 74 emits light in a blue wavelength region. The organic light emitting layer 74 may be a single layer, but is usually composed of a plurality of layers. For example, a laminated film of α-NPD and Alq3 can be used. Further, a hole injection layer, a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport are provided between the first electrode 73 (lower electrode) serving as the anode and the second electrode 75 (upper electrode) serving as the cathode. A multilayer organic light-emitting layer composed of a layer, an electron injection layer, and the like may be formed.

In addition to these layers, it has been actively studied to use various layers such as a MoO ₃ layer, a C ₆₀ layer, a fullerene-containing layer, and a quantum dot-containing layer. Any layer can be applied to this embodiment. A light-emitting element using a quantum dot-containing layer is called a QLED (Quantum-dot light emitting diode). Alternatively, a structure in which light emitting regions are stacked, a so-called tandem structure can be used. As for the film thickness of the layer arrange | positioned between the 1st electrode 73 and the 2nd electrode 75, each layer is about several tens of nm normally.

Specific examples of the layer structure of the organic light emitting layer 74 include the following configurations, but the present invention is not limited thereto.
(1) Organic light emitting layer (2) Hole transport layer / organic light emitting layer (3) Organic light emitting layer / electron transport layer (4) Hole transport layer / organic light emitting layer / electron transport layer (5) Hole injection layer / Hole transport layer / organic light emitting layer / electron transport layer (6) hole injection layer / hole transport layer / organic light emitting layer / electron transport layer / electron injection layer (7) hole injection layer / hole transport layer / organic Light emitting layer / Hole prevention layer / Electron transport layer (8) Hole injection layer / Hole transport layer / Organic light emitting layer / Hole prevention layer / Electron transport layer / Electron injection layer (9) Hole injection layer / Hole Transport layer / electron prevention layer / organic light emitting layer / hole prevention layer / electron transport layer / electron injection layer Here, organic light emission layer, hole injection layer, hole transport layer, hole prevention layer, electron prevention layer, electron Each layer of the transport layer and the electron injection layer may have a single layer structure or a multilayer structure.

The organic light emitting layer 74 may be composed only of the organic light emitting material exemplified below. Or you may be comprised from the combination of a luminescent dopant and host material. Alternatively, a hole transport material, an electron transport material, an additive (donor, acceptor, etc.) and the like may be optionally included. Alternatively, a configuration in which these materials are dispersed in a polymer material (binding resin) or an inorganic material may be used. From the viewpoint of luminous efficiency and lifetime, those in which a luminescent dopant is dispersed in a host material are preferable.

As the organic light emitting material, a known light emitting material for an organic light emitting layer can be used. Such light-emitting materials are classified into low-molecular light-emitting materials, polymer light-emitting materials, and the like, and specific compounds thereof are exemplified below. However, this embodiment is not limited to these materials. The light emitting material may be classified into a fluorescent material, a phosphorescent material, and the like. From the viewpoint of reducing power consumption, it is preferable to use a phosphorescent material having high luminous efficiency.
Here, specific compounds are exemplified below. However, the present invention is not limited to these materials.

As the light-emitting dopant optionally contained in the light-emitting layer, a known dopant material for an organic light-emitting layer can be used. As such a dopant material, for example, as an ultraviolet light emitting material, p-quaterphenyl, 3,5,3,5 tetra-t-butylsecphenyl, 3,5,3,5 tetra-t-butyl-p -Fluorescent materials such as quinckphenyl. Fluorescent light-emitting materials such as styryl derivatives, bis [(4,6-difluorophenyl) -pyridinato-N, C2 ′] picolinate iridium (III) (FIrpic), bis (4 ′, 6′-difluorophenyl) And phosphorescent organometallic complexes such as polydinato) tetrakis (1-pyrazolyl) borate iridium (III) (FIr ₆ ).

As a host material when using a dopant, a known host material for organic EL can be used. Examples of such host materials include the low-molecular light-emitting materials, the polymer light-emitting materials, 4,4′-bis (carbazole) biphenyl, 9,9-di (4-dicarbazole-benzyl) fluorene (CPF), 3 , 6-bis (triphenylsilyl) carbazole (mCP), carbazole derivatives such as (PCF), aniline derivatives such as 4- (diphenylphosphoyl) -N, N-diphenylaniline (HM-A1), 1,3- And fluorene derivatives such as bis (9-phenyl-9H-fluoren-9-yl) benzene (mDPFB) and 1,4-bis (9-phenyl-9H-fluoren-9-yl) benzene (pDPFB).

The charge injection / transport layer is used to more efficiently inject charges (holes, electrons) from the electrode and transport (injection) to the light emitting layer, and the charge injection layer (hole injection layer, electron injection layer). It is classified as a transport layer (hole transport layer, electron transport layer). The charge injecting and transporting layer may be composed only of the charge injecting and transporting material exemplified below. Alternatively, the charge injection / transport layer may optionally contain an additive (donor, acceptor, etc.) and the like. A structure in which these materials are dispersed in a polymer material (binding resin) or an inorganic material may be used.

As the charge injecting and transporting material, a known charge transporting material for the organic light emitting layer can be used.
Such charge injection transport materials are classified into hole injection transport materials and electron injection transport materials.
These specific compounds are illustrated below. However, this embodiment is not limited to these materials.

Examples of the hole injection / hole transport material include oxides such as vanadium oxide (V ₂ O ₅ ) and molybdenum oxide (MoO ₂ ), inorganic p-type semiconductor materials, porphyrin compounds, N, N′-bis (3 -Methylphenyl) -N, N′-bis (phenyl) -benzidine (TPD), N, N′-di (naphthalen-1-yl) -N, N′-diphenyl-benzidine (NPD), etc. Low molecular weight materials such as tertiary amine compounds, hydrazone compounds, quinacridone compounds, styrylamine compounds, polyaniline (PANI), polyaniline-camphor sulfonic acid (PANI-CSA), 3,4-polyethylenedioxythiophene / polystyrene sulfonate ( PEDOT / PSS), poly (triphenylamine) derivative (Poly-TPD), polyvinylcarbazole (PVC) z), polymer materials such as poly (p-phenylene vinylene) (PPV), poly (p-naphthalene vinylene) (PNV), and the like.

As the material used for the hole injection layer, the energy level of the highest occupied molecular orbital (HOMO) is higher than that of the hole injection and transport material used for the hole transport layer in that the injection and transport of holes from the anode is performed more efficiently. It is preferable to use a material having a low position. As the hole transport layer, a material having a higher hole mobility than the hole injection transport material used for the hole injection layer is preferably used.

In order to further improve the hole injection / transport property, it is preferable to dope the hole injection / transport material with an acceptor. As the acceptor, a known acceptor material for the organic light emitting layer can be used. These specific compounds are illustrated below. However, this embodiment is not limited to these materials.

Acceptor materials include Au, Pt, W, Ir, POCl ₃ , AsF ₆ , Cl, Br, I, vanadium oxide (V ₂ O ₅ ), molybdenum oxide (MoO ₂ ), and other inorganic materials, TCNQ (7, 7 , 8,8, -tetracyanoquinodimethane), TCNQF ₄ (tetrafluorotetracyanoquinodimethane), TCNE (tetracyanoethylene), HCNB (hexacyanobutadiene), DDQ (dicyclodicyanobenzoquinone), etc. And compounds having a nitro group such as TNF (trinitrofluorenone) and DNF (dinitrofluorenone), and organic materials such as fluoranyl, chloranil and bromanyl. Among these, compounds having a cyano group such as TCNQ, TCNQF ₄ , TCNE, HCNB, DDQ and the like are more preferable because they can increase the carrier concentration more effectively.

Examples of electron injection / electron transport materials include inorganic materials that are n-type semiconductors, oxadiazole derivatives, triazole derivatives, thiopyrazine dioxide derivatives, benzoquinone derivatives, naphthoquinone derivatives, anthraquinone derivatives, diphenoquinone derivatives, fluorenone derivatives, benzodifuran derivatives, etc. And low molecular weight materials; polymer materials such as poly (oxadiazole) (Poly-OXZ) and polystyrene derivatives (PSS). In particular, examples of the electron injection material include fluorides such as lithium fluoride (LiF) and barium fluoride (BaF ₂ ), and oxides such as lithium oxide (Li ₂ O).

The material used for the electron injection layer is a material having an energy level of the lowest unoccupied molecular orbital (LUMO) higher than that of the electron injection / transport material used for the electron transport layer, in order to more efficiently inject and transport electrons from the cathode. Is preferably used. As the material used for the electron transport layer, a material having higher electron mobility than the electron injection transport material used for the electron injection layer is preferably used.

In order to further improve the electron injection / transport property, it is preferable to dope the electron injection / transport material with a donor. As the donor, a known donor material for an organic light emitting layer can be used. These specific compounds are illustrated below. However, this embodiment is not limited to these materials.

Donor materials include inorganic materials such as alkali metals, alkaline earth metals, rare earth elements, Al, Ag, Cu, In, anilines, phenylenediamines, benzidines (N, N, N ′, N′-tetraphenylbenzidine N, N′-bis- (3-methylphenyl) -N, N′-bis- (phenyl) -benzidine, N, N′-di (naphthalen-1-yl) -N, N′-diphenyl-benzidine Etc.), triphenylamines (triphenylamine, 4,4′4 ″ -tris (N, N-diphenyl-amino) -triphenylamine, 4,4′4 ″ -tris (N-3-methyl) Phenyl-N-phenyl-amino) -triphenylamine, 4,4′4 ″ -tris (N- (1-naphthyl) -N-phenyl-amino) -triphenylamine, etc.), triphenyldiamine Compounds having aromatic tertiary amine skeleton such as (N, N'-di- (4-methyl-phenyl) -N, N'-diphenyl-1,4-phenylenediamine), phenanthrene, pyrene, perylene, anthracene And condensed polycyclic compounds such as tetracene and pentacene (however, the condensed polycyclic compound may have a substituent), TTF (tetrathiafulvalene) s, dibenzofuran, phenothiazine, carbazole, and other organic materials. Among these, a compound having an aromatic tertiary amine as a skeleton, a condensed polycyclic compound, and an alkali metal are more preferable because they can increase the carrier concentration more effectively.

An organic light emitting layer such as a light emitting layer, a hole transport layer, an electron transport layer, a hole injection layer and an electron injection layer is prepared by using a coating liquid for forming an organic light emitting layer in which the above materials are dissolved and dispersed in a solvent. Known coating methods such as spin coating method, dipping method, doctor blade method, discharge coating method, spray coating method, ink jet method, letterpress printing method, intaglio printing method, screen printing method, printing method such as microgravure coating method, etc. Wet processes, known dry processes such as resistance heating vapor deposition, electron beam (EB) vapor deposition, molecular beam epitaxy (MBE), sputtering, organic vapor deposition (OVPD), etc., or laser transfer It can be formed by a method or the like. When forming the organic light emitting layer by a wet process, the coating liquid for forming the organic light emitting layer may contain additives for adjusting the physical properties of the coating liquid, such as a leveling agent and a viscosity modifier. .

The thickness of each layer constituting the organic light emitting layer 74 is usually about 1 nm to 1000 nm, but preferably 10 nm to 200 nm. If the film thickness is less than 10 nm, the physical properties (charge injection characteristics, transport characteristics, confinement characteristics) that are originally required cannot be obtained. In addition, pixel defects due to foreign matters such as dust may occur. Further, when the film thickness exceeds 200 nm, there is a concern that the drive voltage increases due to the resistance component of the organic light emitting layer 74, leading to an increase in power consumption.

As the light emitting functional layer 5, the red sub-pixel 72 </ b> R is provided with a phosphor layer 5 </ b> R including a phosphor that emits red light using blue light emitted from the organic EL light source 71 as excitation light. Similarly, the green sub-pixel 72G is provided with a phosphor layer 5G including a phosphor that emits green light using blue light emitted from the organic EL light source 71 as excitation light. In contrast, the blue sub-pixel 72B is provided with a light scattering layer 27 that scatters and emits blue light emitted from the organic EL light source 71. A gas layer 6 is provided between the color filter 26 on the first substrate 2 and the light emitting functional layer 5 or the light scattering layer 27.

In the organic EL element 70 of the present embodiment, blue light emitted from the organic EL light source 71 enters the light emitting functional layer 5 or the light scattering layer 27 of each subpixel. In the red sub-pixel 72 </ b> R, red light is emitted from the light emitting functional layer 5 </ b> R using blue light as excitation light, and the red light further passes through the red color filter layer 26 </ b> R of the color filter 26 and passes through the first substrate 2 to external space. Is injected into. Similarly, in the green sub-pixel 72G, green light is emitted from the light emitting functional layer 5G using blue light as excitation light, and the green light further passes through the green color filter layer 26G of the color filter 26 and passes through the first substrate 2. And injected into the external space. On the other hand, in the blue sub-pixel 72B, blue light is scattered by the light scattering layer 27, and the blue light further passes through the blue color filter layer 26B of the color filter 26 and is emitted to the external space through the first substrate 2. The Full color display is performed by appropriately adjusting the intensity of the blue light in each of the sub-pixels 72R, 72G, and 72B.

Since the organic EL element 70 of the present embodiment includes the light-emitting substrate of the above-described embodiment that is excellent in light extraction efficiency, a high-luminance organic EL element can be realized. In addition, since power for obtaining a predetermined luminance can be reduced, an organic EL element with low power consumption can be realized.

(Modification of organic EL element)
In the organic EL element 70 of the above embodiment, the second electrode 75 is divided for each of the sub-pixels 72R, 72G, and 72B. Instead of this configuration, in the organic EL element 80 of the present modification example, as shown in FIG. 35, the second electrode 81 is provided in common over all the sub-pixels 72R, 72G, 72B. Therefore, the second electrode 81 is provided so as to get over the second structure 8 and is in contact with both the first structure 21 and the second structure 8.

In the organic EL element 80 of the present modification, it is desirable that the light reflecting layer 23 of the first structure 21 is made of a conductive metal such as aluminum. On the other hand, the second structure 8 is preferably made of a non-conductive material such as a resin material. In this case, since the light reflection layer 23 and the second electrode 81 constituting the first structure 21 are electrically connected, the light reflection layer 23 functions as an auxiliary electrode of the second electrode 81. Therefore, even if the second electrode 81 is formed in a wide area over all the subpixels, the wiring resistance of the second electrode 81 can be lowered.

[Twenty-seventh embodiment]
Hereinafter, a twenty-seventh embodiment of the present invention will be described with reference to FIG.
In the present embodiment, an example of a liquid crystal element including the light emitting substrate is given.
FIG. 36 is a cross-sectional view of the liquid crystal element of this embodiment.

As shown in FIG. 36, the liquid crystal element 90 of the present embodiment includes a first substrate 2, a second substrate 18 made of a wavelength selective reflector, a structure 4, a light emitting functional layer 5, and a gas layer 6. And a color filter 26 and a liquid crystal device 91. The liquid crystal element 90 of the present embodiment includes the light emitting substrate of the fifth modified example shown in FIG. That is, the structure 4 is composed of the first structure 21 and the second structure 8 joined to each other. The first structure 21 on the first substrate 2 has a two-layer structure of a light absorption layer 22 that becomes a black matrix and a light reflection layer 23. The second structure 8 on the second substrate 18 has light scattering properties.

The liquid crystal device 91 includes a backlight 92, a pair of polarizing plates 93 and 94, and a liquid crystal cell 95. The liquid crystal cell 95 has a configuration in which a glass substrate 96 and a second substrate 18 are bonded together with a sealing material 97 at a predetermined interval. Liquid crystal 98 is sealed in a space surrounded by the glass substrate 96, the second substrate 18, and the sealing material 97. A first electrode 99 is provided on the surface of the glass substrate 96 facing the second substrate 18. A second electrode 100 is provided on the surface of the second substrate 18 facing the glass substrate 96. An alignment film 101 is formed so as to cover the first electrode 99. An alignment film 102 is formed so as to cover the second electrode 100.

In the example of this embodiment, the first electrode 99 independent for each subpixel is provided on the glass substrate 96 side. A second electrode 100 common to all the subpixels is provided on the second substrate 18 side. A thin film transistor (Thin Film Transistor, hereinafter abbreviated as TFT) (not shown) is provided on the glass substrate 96 for each sub-pixel. On the glass substrate 96, a plurality of data lines, a plurality of scanning lines and the like for driving the TFT are provided.

The backlight 92 includes a light source 103 that emits blue light and a light guide plate 104, and irradiates the liquid crystal cell 95 with blue light. One polarizing plate 93 is disposed between the backlight 92 and the glass substrate 96. The other polarizing plate 94 is disposed between the second substrate 18 and the second electrode 100.

The transmittance of the blue light emitted from the backlight 92 is adjusted by the liquid crystal cell 95 for each of the sub-pixels 72R, 72G, and 72B. The blue light transmitted through the liquid crystal cell 95 enters the light emitting functional layer 5 of each of the subpixels 72R, 72G, 72B. In the red sub-pixel 72 </ b> R, red light is emitted from the light emitting functional layer 5 </ b> R using blue light as excitation light, and the red light further passes through the red color filter layer 26 </ b> R of the color filter 26 and passes through the first substrate 2 to external space. Is injected into. Similarly, in the green sub-pixel 72G, green light is emitted from the light emitting functional layer 5G using blue light as excitation light, and the green light further passes through the green color filter layer 26G of the color filter 26 and passes through the first substrate 2. And injected into the external space. On the other hand, in the blue sub-pixel 26 </ b> B, blue light is scattered by the light scattering layer 27, and the blue light further passes through the blue color filter layer 26 </ b> B of the color filter 26 and is emitted to the external space through the first substrate 2. The The liquid crystal cell 95 appropriately adjusts the amount of blue light in each of the sub-pixels 72R, 72G, 72B, thereby changing the hue of the pixel and performing full color display.

Since the liquid crystal element 90 of the present embodiment includes the luminescent substrate of the above-described embodiment having excellent light extraction efficiency, a high-luminance liquid crystal element can be realized. In addition, since power for obtaining a predetermined luminance can be reduced, a liquid crystal element with low power consumption can be realized.

[Twenty-eighth embodiment: display device]
Application examples of the light-emitting element and the liquid crystal element include display devices such as a mobile phone illustrated in FIG. 37A and a television receiver illustrated in FIG. 37B.
A cellular phone 1000 illustrated in FIG. 37A includes a main body 1001, a display portion 1002, a sound input portion 1003, a sound output portion 1004, an antenna 1005, an operation switch 1006, and the like. The light emitting element and the liquid crystal of the above embodiment are included in the display portion 1002. An element is used.

A television receiver 1100 illustrated in FIG. 37B includes a main body cabinet 1101, a display portion 1102, a speaker 1103, a stand 1104, and the like, and the light-emitting element and the liquid crystal element of the above embodiment are used for the display portion 1102.
In the cellular phone 1000 and the television receiver 1100, since the light emitting element and the liquid crystal element of the above embodiment are used, a display device with high luminance and excellent display quality can be realized.

[Twenty-ninth embodiment: lighting device]
As an application example of the light-emitting element, for example, a ceiling light (illumination device) illustrated in FIG. 38A can be given. A ceiling light 1400 shown in FIG. 38A includes an illumination unit 1401, a hanging tool 1402, a power cord 1403, and the like. As the illumination unit 1401, the light-emitting element of the above embodiment can be suitably applied. By applying the light-emitting element according to the embodiment of the present invention to the illumination unit 1401 of the ceiling light 1400, illumination light with a light and free color tone can be obtained with low power consumption. Therefore, it is possible to realize a lighting fixture with high light performance.

As another application example of the light emitting element, for example, there is a lighting stand shown in FIG. An illumination stand 1500 shown in FIG. 38B includes an illumination unit 1501, a stand 1502, a power switch 1503, a power cord 1504, and the like. As the illumination unit 1501, the light emitting element of the above embodiment can be suitably applied. By applying the light-emitting device according to an embodiment of the present invention to the illumination unit 1501 of the illumination stand 1500, it is possible to obtain illumination light having a flexible color tone with low power consumption. Therefore, it is possible to realize a lighting fixture with high light performance.

The present invention can be used for an optical substrate and a manufacturing method thereof, a light emitting element, a liquid crystal element, a display device, and a lighting device.

1, 10, 13, 15, 17, 20, 25, 28, 30, 32, 34, 36, 38, 40, 42, 45, 48, 50, 52, 54 ... luminous substrate (optical substrate), 2 ... First substrate 3, 18 ... second substrate 4, 43, 46 ... structure, 5, 5R, 5G, 5B ... light emitting functional layer (optical layer), 6 ... gas layer, 7, 21 ... first 8 ... second structure 11 ... bonding member (supporting member) 22 ... light absorbing layer 23 ... light reflecting layer 26 ... color filter 27 ... light scattering layer (optical layer) 57 ... Sacrificial layer, 58 ... Third substrate, 70, 80 ... Organic EL element (light emitting element), 90 ... Liquid crystal element, 1000 ... Mobile phone (display device), 1100 ... Television receiver (display device), 1400 ... Sealing Light (lighting device), 1500... Lighting stand (lighting device).

Claims (20)

A first substrate having optical transparency;
An optical layer provided at a predetermined interval from the first substrate and emitting light toward the first substrate;
A plurality of structures that are in contact with at least one of the first substrate and the optical layer, and are provided at predetermined intervals in a direction along a surface facing the optical layer of the first substrate;
An optical substrate comprising: a gas layer provided between the first substrate and the optical layer. The optical substrate according to claim 1, wherein a second substrate is provided on a surface of the optical layer opposite to the surface facing the first substrate. The structure is composed of a multi-layer structure arranged in the normal direction of the first substrate,
3. The structure according to claim 1, wherein the multi-layer structure includes a first structure in contact with the facing surface of the first substrate and a second structure in contact with the optical layer. An optical substrate according to 1. The optical substrate according to claim 3, wherein the first structure and the second structure are in contact with each other. The first structure and the second structure are separated from each other;
The optical substrate according to claim 3, wherein a support member that is in contact with the facing surface of the first substrate is provided at an outer edge portion of the first substrate. The optical substrate according to any one of claims 3 to 5, wherein at least a part of the first structure is composed of a light absorbing member made of a light absorbing material. The optical substrate according to any one of claims 3 to 6, wherein at least a part of the outer surface of the first structure is made of a light reflecting member made of a light reflective material. . The first structure is in contact with the first substrate and covers a light absorbing member made of a light-absorbing material and the remaining surface of the light absorbing member except for a surface in contact with the first substrate; The optical substrate according to any one of claims 3 to 7, comprising a light reflecting member made of a material having light reflectivity. The optical substrate according to any one of claims 3 to 8, wherein a light reflecting member made of a light-reflective material is provided on at least a part of the outer surface of the second structure. The optical substrate according to any one of claims 3 to 9, wherein a thickness of the optical layer is thinner than a thickness of the second structure. 3. The optical substrate according to claim 1, wherein the structure is configured by a single-layer structure. The optical substrate according to claim 11, wherein the structure is in contact with both the facing surface of the first substrate and the optical layer. The structure is in contact with either the opposing surface of the first substrate or the optical layer;
The support member which contacts each of the said opposing surface of the said 1st board | substrate and the said optical layer was provided in the outer edge part of the said 1st board | substrate, and the outer edge part of the said optical layer. The optical substrate as described. The optical substrate according to any one of claims 11 to 13, wherein at least a part of the structure is formed of a light absorbing member made of a light absorbing material. The optical substrate according to any one of claims 11 to 14, wherein at least a part of an outer surface of the structure is formed of a light reflecting member made of a material having light reflectivity. The structure is in contact with the first substrate and covers a light absorbing member made of a light-absorbing material and the remaining surface of the light absorbing member except the surface in contact with the first substrate, and is light-reflective. The optical substrate according to claim 11, comprising a light reflecting member made of a material having The optical substrate according to any one of claims 1 to 16, wherein the optical layer is a light emitting layer that emits light in a predetermined wavelength range. The optical layer has a characteristic of selectively reflecting light in the wavelength region and selectively transmitting light in a wavelength region other than the wavelength region on a surface opposite to the surface facing the first substrate of the optical layer. The optical substrate according to claim 17, further comprising a wavelength selective reflection member having the optical substrate. The optical substrate according to claim 18, wherein the wavelength selective reflection member is a second substrate provided on a surface of the optical layer opposite to the surface facing the first substrate. The structure penetrates the optical layer;
The surface of the structure opposite to the surface in contact with the first substrate and the surface of the optical layer opposite to the surface facing the first substrate are on substantially the same plane. The optical substrate according to claim 1, wherein the optical substrate is a substrate.

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