[go: up one dir, main page]

WO2013091584A1 - 一种检测基质内缺陷的方法及装置 - Google Patents

一种检测基质内缺陷的方法及装置 Download PDF

Info

Publication number
WO2013091584A1
WO2013091584A1 PCT/CN2013/070388 CN2013070388W WO2013091584A1 WO 2013091584 A1 WO2013091584 A1 WO 2013091584A1 CN 2013070388 W CN2013070388 W CN 2013070388W WO 2013091584 A1 WO2013091584 A1 WO 2013091584A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
optical
optical detection
defect
detection path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2013/070388
Other languages
English (en)
French (fr)
Inventor
林晓峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Glass France SAS
Compagnie de Saint Gobain SA
Original Assignee
Saint Gobain Glass France SAS
Compagnie de Saint Gobain SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Glass France SAS, Compagnie de Saint Gobain SA filed Critical Saint Gobain Glass France SAS
Publication of WO2013091584A1 publication Critical patent/WO2013091584A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens

Definitions

  • the present application claims priority to Chinese Patent Application No. 201110430121.6, entitled “A Method and Apparatus for Detecting Defects in a Substrate”, filed on December 20, 2011, the entire contents of which are incorporated herein by reference.
  • FIELD OF THE INVENTION The present invention relates to defect detection techniques, and more particularly to a method and apparatus for detecting defects in a substrate.
  • BACKGROUND OF THE INVENTION In the existing transparent substrates, especially in the production process of glass, various causes cause defects and existence, and main defects include scratches, bubbles and stains, etc. How to automatically identify defects of glass is the quality of the production process of the glass production enterprise. Problems that need to be addressed in control and product quality inspection.
  • the automatic optical inspection (AOI) technology is used to detect the defects in the glass, and the surface of the glass is scanned by detecting light (including a laser beam or an LED beam, etc.), and the light of the transmitted light or the reflected light is detected by the detector. Strong changes to detect glass defects.
  • the existing method for detecting the position of defects in the glass by detecting the light scanning glass is: using the detection light to expand into a surface beam through the cylindrical mirror, and the glass, the glass or the glass surface defects such as bubbles, scratches are incident from the side of the thickness of the glass to be inspected.
  • the camera When it becomes a scatterer, the camera performs frontal shooting on the glass to be inspected placed on the loading platform under computer control, and the clear defect image is discriminated by computer image processing and recognition software, and the defect mark and prompt are given;
  • An optical scanning mechanism consisting of a rotating mirror and an f- ⁇ lens is added between the light source generator and the cylindrical mirror, and the detecting light is first converted into a scanning beam along the axial direction of the cylindrical mirror, and then developed into a surface beam by a cylindrical mirror.
  • the defect depth position can be detected.
  • the existing automatic optical detection technology has low resolution, and the correct rate of distinguishing defect types is not high or the type of defects cannot be effectively distinguished at all.
  • the present invention provides a method of detecting defects in a substrate, the substrate having opposing first and second surfaces, the first surface having a plurality of incident points distributed, the method comprising: providing detection And a reference beam; the incident point of the detecting beam from the first surface of the substrate is incident along the optical detection path to the second surface and the incident point corresponding to the incident point, respectively, on the optical detection path through which the detecting beam passes a set of backscattered light generated at each point is used as a sample beam corresponding to the point; respectively, an interference signal formed by interference between each sample beam and the reference beam is acquired to obtain backscattered light of each point on the optical detection path Light intensity information, optical length information between points on the optical detection path; determining whether there is a defect on the optical detection path based on light intensity information of backscattered light at each
  • the optical detection path determines whether there is a defect on the optical detection path.
  • the number of physical interfaces on the optical detection path is determined according to the light intensity information of the backscattered light at each point on the optical detection path.
  • the substrate is a composite material of glass, plastic, or glass ceramic or the above materials.
  • the detecting beam and the reference beam are formed by splitting a single beam emitted by the light source.
  • the light source has coherence, the resolution of the light source is 5 micrometers to 200 micrometers, and the power source spectrum has a full width at half maximum of 10 nanometers to 100 nanometers.
  • the resolution of the light source is 100 micrometers to 200 micrometers, and the power source spectrum has a full width at half maximum of more than 10 nanometers.
  • the interference signals formed by the interference between each sample beam and the reference beam are respectively acquired to obtain the light intensity information of the backscattered light at each point on the optical detection path, and the optical length of the optical detection path
  • the step of information includes: each sample beam and the reference beam respectively collide in the coupling member and interfere with each other.
  • the step of separately acquiring the interference signals formed by the interference between the sample beams and the reference beams to obtain the optical intensity information of the backscattered light at each point on the optical detection path and the optical length information of the optical detection path is Made with photodetection components.
  • a corresponding detection surface connecting the two surfaces is defined according to at least two optical detection paths between the first surface and the second surface of the substrate.
  • the detection image of the detection surface is obtained according to the light intensity information of the backscattered light at each point on each optical detection path on the detection surface.
  • the detection beam is generated by a point source or a line source.
  • the detecting beam is a light beam emitted by the point source
  • the detecting beam is scanned along a boundary between the detecting surface to be analyzed and the first surface, and is incident on each of the incident points to the corresponding reflecting point on the second surface.
  • the detecting beam when the detecting beam is a beam emitted by the line source, the detecting beam is simultaneously incident on the second surface from each incident point on the boundary between the detecting surface to be analyzed and the first surface.
  • the detection image of each detection surface is obtained by scanning in a direction perpendicular to the boundary between the detection surface and the first surface.
  • the present invention also provides a method of detecting defects in a substrate, the substrate having opposing first and second surfaces, wherein the first surface and the second surface are respectively interfaces of the substrate and an external environment
  • the method includes: providing a detection beam and a reference beam; the detection beam is incident on at least one incident point in a detection area of the first surface, and the detection beam propagates along a corresponding optical detection path to the first
  • the two surfaces correspond to the incident point a reflection point; obtaining intensity information of backscattered light distributed at each point on the optical detection path; and determining a detection area range according to light intensity information of backscattered light at each point distributed on the optical detection path Whether there is a defect in the interior and/or surface of the inner matrix.
  • optical length information between points distributed on the optical detection path is determined according to light intensity information of backscattered light of each point distributed on the optical detection path.
  • optical length information between points distributed on the optical detection path is used to determine the type of defect.
  • the defect is a bubble.
  • the method for detecting defects in the matrix further comprises: determining optical opening and closing type of the bubble by using optical intensity information of backscattered light at various points distributed on the optical detection path.
  • the following steps are performed to determine the type of opening and closing of the bubble: determining the number of physical interfaces through which the optical detecting path passes according to the light intensity information of the backscattered light at each point distributed on the optical detecting path, and according to The number of physical interfaces determines the type of opening and closing of the bubble.
  • the air bubbles are determined to be closed bubbles; when the number of the physical interfaces is less than 4, the air bubbles are determined to be open air bubbles.
  • the defect along the optical detection path and the optical length of the substrate on both sides of the defect along the optical detection path are greater than the physical length of the optical detection path and the substrate relative to the detection beam
  • the product of the refractive index is accumulated, it is judged that the defect is a solid defect.
  • the optical length of the defect distributed over it determines the refractive index of the defect.
  • the refractive index of the defect is calculated by: dividing the optical length of the substrate along one side or both sides of the defect along the optical detection path by the refractive index of the substrate relative to the detection beam, and obtaining the distribution Along the side or sides of the defect along the optics Detecting the physical thickness of the substrate of the path; subtracting the physical thickness of the substrate along the optical detection path on one or both sides of the defect by the physical length of the optical detection path, obtaining the physical thickness of the defect; The optical length is divided by the physical thickness of the defect to obtain the refractive index of the defect.
  • the defect type is determined according to the refractive index of the defect.
  • an optical length between points distributed on the optical detection path is a distance that the detection beam propagates between points along the optical detection path and a substance distributed within the distance relative to the Detect the integral of the refractive index of the beam.
  • the substrate is a composite of glass, plastic, or glass ceramic or a combination of the above materials.
  • the first surface and the external environment on both sides of the second surface are the same medium.
  • the external environment is air or water or a non-corrosive gas or a non-corrosive liquid.
  • the first surface and the external environment on both sides of the second surface are different media.
  • the external environment on one side of the first surface is air; the second surface is in contact with the loading platform, and the external environment on one side of the second surface is a bearing platform made of metal or plastic.
  • the present invention also provides an apparatus for detecting defects in a matrix, comprising: a light source providing a single beam; a light splitting unit dividing the single beam into a detection beam and a reference beam; and a sample beam acquisition unit acquiring the detection beam from the first surface of the substrate a sample beam generated at each point on the optical detection path through which the reflection point corresponding to the incident point passes on the second surface; the signal acquisition unit separately acquires interference formed by interference between each sample beam and the reference beam a signal to obtain light intensity information of backscattered light at each point on the optical detection path, and optical length information between points on the optical detection path; a defect determining unit, according to the back of each point on the optical detection path To the light intensity information of the scattered light, it is judged whether or not there is a defect on the optical detection path.
  • the technical solution of the present invention has the following advantages: acquiring an interference signal formed by interference between each sample beam and the reference beam to obtain light intensity information of backscattered light at each point on the optical detection path, According to the light intensity information, it can be determined whether there is a defect on the optical detection path; the light intensity information of each point in the matrix is ensured, and the integrity of the defect information is ensured.
  • the optical length information between the points distributed on the optical detection path determined according to the light intensity information of the backscattered light of each point distributed on the optical detection path can effectively determine the type of the defect and improve the type of the distinguished defect. The correct rate.
  • determining the number of physical interfaces on the optical detection path based on the light intensity information of the backscattered light at each point on the optical detection path can intuitively and accurately distinguish whether the bubble is closed or open.
  • the optical length of the defect determines the refractive index of the defect, and the specific type of the defect can be determined according to the refractive index of the defect, which improves the accuracy of detecting the defect.
  • FIG. 1 is a flow chart showing the detection of defects in a substrate according to a first embodiment of the present invention
  • FIG. 2 is a flow chart showing the detection of defects in a substrate according to a second embodiment of the present invention
  • 4 is a schematic view showing the principle of detecting defects in a matrix according to the first embodiment of the present invention
  • FIG. 5 is a schematic view showing a method for detecting defects in a matrix according to the first embodiment of the present invention
  • FIG. 6 is a second embodiment of the present invention
  • FIG. 7 is a schematic view showing a method for detecting defects in a matrix according to a second embodiment of the present invention
  • FIG. 1 is a flow chart showing the detection of defects in a substrate according to a first embodiment of the present invention
  • FIG. 2 is a flow chart showing the detection of defects in a substrate according to a second embodiment of the present invention
  • 4 is a schematic view showing the principle of detecting defects in a matrix according to the first embodiment of the present invention
  • FIG. 5 is
  • FIG. 8 is a schematic diagram of detecting defects in a matrix by using a point light source according to an embodiment of the present invention
  • FIG. An embodiment uses a line light source to detect a defect in a substrate
  • 10 is a schematic view of a glass image with defects obtained by the detection method of the present invention
  • FIG. 11 is a schematic diagram of an open bubble interface distribution in a glass
  • Figure 13 is a schematic view showing the distribution of the closed bubble interface in the glass
  • Figure 15 is a schematic diagram of a time domain OCT detecting device extended by the detecting device of the present invention
  • Figure 16 is a schematic view showing a process for detecting glass by using a time domain OCT
  • Figure 17 is a schematic view of a spectral domain OCT detecting device extended by the detecting device of the present invention
  • 18 is a schematic diagram of a process for detecting glass by spectral domain OCT
  • FIG. 19 is a schematic diagram of a frequency domain OCT detecting device extended by the detecting device of the present invention
  • FIG. 20 is a schematic diagram showing a principle of detecting a glass by frequency domain OCT.
  • the inventors have discovered a method for detecting defects in a matrix having opposite first and second surfaces, and a plurality of incident points are distributed on the first surface, and the detecting step is as shown in FIG.
  • the method includes: performing step S1, providing a detection beam and a reference beam; Step S2 is performed, and the incident point of the detecting beam from the first surface of the substrate is incident along the optical detecting path to the reflecting point corresponding to the incident point on the second surface, respectively, on the optical detecting path through which the detecting beam passes.
  • a set of backscattered light generated at each point is used as a sample beam corresponding to the point; and step S3 is performed to separately acquire an interference signal formed by interference between each sample beam and the reference beam to obtain a back of each point on the optical detection path Light intensity information of the scattered light, and optical length information between points on the optical detection path; performing step S4, determining the optical light according to light intensity information of backscattered light at each point on the optical detection path Check for defects on the path.
  • the interference signal formed by the interference between the sample beam and the reference beam is acquired to obtain the light intensity information of the backscattered light at each point on the optical detection path, and according to the light intensity information, Determining whether there is a defect on the optical detection path; collecting light intensity information of the generated backscattered light at each point in the matrix to ensure the integrity of the defect information. Then, according to the optical length information between the points on the optical detection path, the type of the defect (whether a bubble or a stone) can be preliminarily distinguished, and the correct rate of distinguishing the defect type is improved.
  • the present invention also provides another method of detecting defects in a substrate having opposing first and second surfaces, wherein the first surface and the second surface are respectively the substrate and the external environment
  • the detecting step includes: performing step S11, providing a detecting beam and a reference beam; performing step S12, the detecting beam is incident on at least one incident point in the detection area of the first surface, the detecting beam edge Corresponding optical detection path is propagated to a reflection point corresponding to the incident point on the second surface; performing step S13, acquiring light intensity information of backscattered light distributed at each point on the optical detection path; Step S14, determining whether there is a defect in the interior and/or surface of the substrate within the detection area according to the light intensity information of the backscattered light at each point distributed on the optical detection path.
  • a device for detecting defects in a matrix based on the above method for detecting defects in a matrix comprising: a light source, Providing a single beam; a light splitting unit, dividing the single beam into a detecting beam and a reference beam; and a sample beam acquiring unit acquiring a reflection point of the detecting beam from the incident point of the first surface of the substrate to the second surface corresponding to the incident point a sample beam generated at each point on the optical detection path; a signal acquisition unit respectively acquiring an interference signal formed by interference between each sample beam and the reference beam to obtain backscattered light of each point on the optical detection path Strong information, optical length information between points on the optical detection path; and a defect determining unit determining whether the optical detection path exists according to light intensity information of backscattered light at each point on the optical detection path defect.
  • the detection beam is incident on the second surface from the first surface of the substrate along the optical detection path, and the light intensity information of the backscattered light at each point on the optical detection path in the detection region is obtained to determine the inside of the detected substrate and / or whether the surface is defective.
  • the light intensity information of the backscattered light generated at each point in the detection area is collected to ensure the integrity of the defect information.
  • the presence or absence of the defect is directly judged according to the light intensity information, and the accuracy is high.
  • the apparatus for detecting a substrate includes: a light source 100, a beam splitting member (coupling member) 102, a reference arm 106, a sample arm 114, a photodetecting member 110, and a display processing unit 118.
  • the principle of the above apparatus for detecting the substrate is as follows: First, it is necessary to provide a substrate 116 as shown in FIG. 4, the substrate 116 having an opposite first surface 116a and a second surface 116b, and the first surface 116a is distributed over the first surface 116a. One incident point 117a. The first surface 116a and the second surface 116b are interfaces of the substrate 116 with the external environment. Then, in combination with FIGS.
  • the light source 100 emits a single beam; the single beam enters the beam splitting member 102, and is divided into a detecting beam and a reference beam by the beam splitting unit 102; after the detecting beam and the reference beam are output from the beam splitting member 102, wherein
  • the reference beam enters the reference arm 106, and the sample beam enters the sample arm 114; the reference beam is first focused by the lens group 104 in the reference arm 106, and the focused reference beam is reflected by the original path to the reflective element 108; the detected beam is focused
  • the lens group 112 is then irradiated onto the substrate under test 116, the detection beam being incident from the incident point 117a of the first surface 116a of the substrate 116 to the second surface 116b, wherein each of the detection beams is incident along the first surface 116a.
  • Point edge corresponding optical inspection A point at which the measurement path is incident on the second surface 116b is defined as a reflection point 117b, respectively, as backscattered light generated at each point on the optical detection path through which the detection beam passes, as a sample beam corresponding to the point; samples generated at each point The beam and the reference beam merge within the coupling component 102 and interfere with one another to form an interfering light signal; the interfering light signal is acquired by the photodetecting component 110, the interfering optical signal comprising the intensity of the backscattered light at a corresponding point on the optical detection path Information, according to the light intensity information of the backscattered light at each point distributed on the optical detection path, the optical length information between the points distributed on the optical detection path may be determined, and the interference light intensity signal undergoes photoelectric conversion and signal After the amplification processing, an interference electric signal is formed; after the reception processing is performed on the interference display processing unit 118, a detection image is formed.
  • the substrate 116 may be a composite material of glass, plastic, or glass ceramic or the above materials. Wherein, the substrate 116 is transparent with respect to the detection beam because the detection beam of a predetermined wavelength can directly penetrate the substrate 116.
  • the first surface 116a and the second surface 116b of the substrate 116 are substantially parallel to each other, that is, the first surface 116a and the second surface 116b may be parallel, or may be the first surface 116a and the second surface.
  • the extension of 116b has an included angle.
  • the external environment on both sides of the first surface 116a of the substrate 116 and the second surface 116b may be the same medium or different media.
  • the external environment on both sides of the first surface 116a and the second surface 116b may be air or water or a non-corrosive gas or a non-corrosive liquid. If it is a non-identical medium, the external environment of the first surface 116a may be air or water or a non-corrosive gas or a non-corrosive liquid; the second surface 116b is in contact with the carrier, and the second surface is The external environment is a load-bearing table made of metal or plastic.
  • the light intensity and the light energy of the detection beam and the reference beam are the same.
  • the optical detection paths are also different depending on the incident angle of the light beam. As shown in FIG.
  • a corresponding detection surface connecting the two surfaces is defined according to at least two optical paths between the first surface 116a and the second surface 116b of the substrate 116.
  • the detecting beam when the detecting beam is incident perpendicularly into the substrate 116 in FIG. 4, the detecting beam is incident on the second surface 116b along the optical detecting path from the incident point 117a of the first surface 116a, the optical detecting path. Also perpendicular to the two surfaces; defining a respective detection surface connecting the two surfaces according to the at least two optical paths, the detection surface 116c connecting the first surface 116a and the second surface 116b may be defined, the detection surface 116c and The sides of the substrate 116 are parallel. As shown in FIG.
  • the detection beam when the detection beam is incident on the substrate 116 in accordance with the inclination of the detection beam, the detection beam is incident on the second surface 116b along the optical detection path from the incident point 117a of the first surface 116a, and the optical detection path is also An oblique intersection with the two surfaces; a corresponding detection surface connecting the two surfaces is defined according to the at least two optical paths, and a detection surface 116c connecting the first surface 116a and the second surface 116b may be defined, the detection surface 116c and The side of the substrate 116 has an included angle.
  • each detection surface 116c is parallel to each other in each detection mode; and the incident points 117a are distributed on a boundary line between each detection surface 116c and the first surface 116a.
  • the detected image of the detection surface 116c can be obtained by processing the light intensity information of the backscattered light at each point on each optical detection path on the detection surface 116c defined above.
  • a point at which each incident point on the first surface 116a of the substrate 116 is incident on the second surface 116b along the corresponding optical detection path is defined as a reflection point 117b, and the reflection point 117b receives the detection beam. After that, backscattering and reflection will occur at this point.
  • the light source may be a laser source or a light emitting diode; the laser source or the light emitting diode is a wide spectrum light source, and the generated light beam is a coherent light beam, and the resolution of the coherent light source is 5 micrometers to 200 Micron, the power spectrum of the light source has a full width at half maximum of 10 nm to 100 nm.
  • the laser source or the light emitting diode may be a line source or a point source.
  • the resolution of the selected coherent light source is 100 micrometers to 200 micrometers, and the power source spectrum has a full width at half maximum of more than 10 nanometers.
  • the detection device for using the point light source as the light source acquires the substrate image (for example, by defining the XZ detection surface), as shown in FIG. 8, the substrate is moved to a position where the light emitted from the point source is directly incident on the first surface.
  • the first incident point a is near an angle of the substrate; after the single beam emitted by the point source is split into the detecting beam and the reference beam, the detecting beam is incident from the first incident point a along the first optical detecting path a first reflection point corresponding to the first incident point a to the second surface; the detection beam passes from the first incident point a along the first optical detection path through the first surface of the substrate, the interior and the second surface Generating backscattering, the set of backscattered light generated at each point is taken as the first sample beam corresponding to the point; each first sample beam and the reference beam are combined in the coupling component and interfered; first photodetection The first interference light signals formed by the interference between the first sample beam and the reference beam are respectively acquired, and the first interference light signal is converted into a corresponding first interference electrical signal.
  • the detection beam Moving the substrate in the X direction such that the light beam emerging from the point source can be incident directly onto the second incident point b of the first surface, the detection beam being incident on the second surface along the second optical detection path from the second incident point b Corresponding to the second reflection point of the second incident point b; the detection beam is generated from the second incident point b along the second optical detection path through the first surface of the substrate, the interior and the second surface, and backscattering occurs.
  • the set of backscattered light generated at each point serves as a second sample beam corresponding to the point; each of the second sample beam and the reference beam merge and interfere in the coupling component; and the second photodetector separately acquires each second sample The light beam and the reference beam interfere with each other to form a second interference light signal, and convert the second interference light signal into a corresponding second interference electrical signal.
  • the substrate is continuously moved in the X direction to obtain interference light signals at various points along the optical detection path corresponding to each incident point; until the sample is moved to enable the light beam emitted from the point source to be directly incident on the first surface
  • the detection beam is incident from the Nth incident point n along the Nth optical detection path to the second reflection point of the second surface corresponding to the Nth incident point n;
  • the back beam is generated from the Nth incident point n along the Nth optical detection path through the first surface, the inner surface and the second surface of the substrate, and the set of backscattered light generated at each point is corresponding to the point.
  • the Nth sample beam; the Nth sample beam and the reference beam are combined and interfered in the coupling component; the Nth photodetector respectively acquires the Nth interference optical signal formed by the interference of each Nth sample beam and the reference beam, And converting the Nth interference optical signal into a corresponding Nth interference electrical signal.
  • the first photodetector, the second photodetector, the Nth photodetector output the electrical signal with the interfering light intensity information to the display processing unit, and the display processing unit denoises the electrical signal Zoom in and perform the first detection surface image display and analysis.
  • the first optical detection Path, second optical detection path... Nth optical detection defines a first detection surface; then the substrate moves in the Y direction to the second detection surface...
  • the first method of detecting the image of the face acquires the detected image of the second detecting surface, the Nth detecting surface (i.e., the entire substrate).
  • the detection device for using the line light source as the light source acquires the substrate image (for example, defining the XZ detection surface).
  • the substrate 116 is moved to position the light emitted from the line source directly onto the first surface.
  • Each incident point is adjacent to one side of the substrate; the multiple beams emitted by the line source (which may be composed of the fiber array) are respectively split into corresponding detection beams and reference beams, and each detection beam is simultaneously from the first incident point.
  • the second incident point b ...
  • the Nth incident point n is incident from the first surface to the second surface along the corresponding optical detection path, and the detection beam is from the first incident point a and the second incident point b
  • the incident point n generates backscattering along the first optical surface of the substrate along the corresponding optical detection path, and the backscattered light generated at each point serves as a sample beam corresponding to the point; each sample beam And the reference beam merges within the coupling component and interferes;
  • the first photodetector is collected from the first incident point a along the respective optical detection path through the first surface of the substrate, the interior and the second surface
  • the scattered sample beam and the reference beam interfere with each other to form a first interference light signal, and convert the first interference light signal into a corresponding first interference electrical signal;
  • the second photodetector collects from the second incident point b along the corresponding
  • the optical detection path passes through a second interference optical signal formed by the sample beam reflected at the first surface of the substrate, the inner surface and the second surface, and the
  • the Nth photodetector collects a sample beam reflected from the Nth incident point n along the corresponding optical detection path through the first surface of the substrate, the interior and the second surface, and the reference beam interfere with each other.
  • the Nth interference optical signal converts the Nth interference optical signal into a corresponding Nth interference electrical signal.
  • the first photodetector, the second photodetector, the Nth photodetector output the electrical signal with the interfering light intensity information to the display processing unit, and the display processing unit denoises the electrical signal Zoom in, and perform first detection surface image display and analysis.
  • the correspondence between the multiple light beams emitted by the line light source from the first incident point a of the first surface, the second incident point b, the Nth incident point n, and the corresponding reflective point of the second surface The optical detection path defines a first detection surface; then the substrate moves in the Y direction to the second detection surface ... the Nth detection surface, and the second detection surface is obtained by acquiring the first detection surface image. . Detection image of the Nth detection surface (ie the entire substrate).
  • a collimator such as a lens or a lens group.
  • the beam splitting member 102 and the coupling member 102 are the same component.
  • the beam splitting component and the coupling component can also be two separate devices.
  • the light splitting member (coupling member) 102 may be a fiber coupler or a beam splitting prism or a beam splitter group or the like.
  • the transmission path of the light beam can be realized by the optical fiber; for example, a single beam emitted by the light source 100 can be transmitted to the coupler 102 through the optical fiber; the detection beam output from the coupler 102 And the reference beam can be input to the sample arm 114 and the reference arm 106 through the optical fiber, respectively.
  • the detector 110 is a CMOS device or a CCD device, and is configured to acquire an interference light intensity signal formed by interference between a sample beam and a reference beam, and perform optical imaging. After the detector 110 collects the interference light intensity signal, the detected light intensity signal is further converted into a corresponding telecommunications.
  • the display processing unit 118 may be a computer, and may include: a signal acquisition processing unit and a display unit. After the detector outputs the electrical signal with the interference light intensity information, the signal acquisition processing unit in the display processing unit 118 performs the denoising amplification on the electrical signal, and then the processed electrical signal is output to the display unit for image display and analysis.
  • the detecting device further includes a sample stage for carrying the substrate 116. The sample stage is controlled by the display processing unit 118 to move the sample stage in the X- ⁇ direction. According to the movement of the sample stage, the detecting surface 116c in Figs. 5, 7, 8, and 9 may be in the ⁇ direction or the YZ direction.
  • the scanned image of the detecting surface includes light intensity information of backscattered light of each point distributed on the plurality of optical detecting paths;
  • the light intensity information of the backscattered light at each point on the optical detection path can determine the number of physical interfaces on each optical detection path in the detection surface, and determine whether there is a defect in the interior or surface of the substrate. As shown in Fig. 4, if there is a defect inside the substrate, it can be seen from the scanned image of the detection surface that the number of physical interfaces on the optical detection path is greater than two.
  • the intensity information of the backscattered light at each point on the optical detection path, and the optical length of the optical detection path are determined.
  • determining the type of the defect with respect to the refractive index of the substrate relative to the detection beam Specifically, a preset line is set in the scan image of the detection surface of FIG. 4, and the preset line passes the defect in the thickness direction of the glass, and the preset line only needs to pass the defect, and the position is not limited.
  • the distance between two parallel lines perpendicular to the preset line and crossing the edge of the defect is determined as the optical length of the glass a+c (a or c).
  • a+c a or c
  • One of them may be an integral of the refractive index of the substance distributed within the distance with respect to the detection beam.
  • the optical length And the sum of the optical lengths of the substrates on both sides of the defect along the optical detection path is less than the product of the physical length ( ⁇ ⁇ ) of the corresponding optical detection path of the substrate and the refractive index of the substrate relative to the detection beam: ie a+b+c ⁇ T x xn x , determining that the defect is a bubble.
  • the sum of the optical length of the defect along the optical detection path and the optical length of the substrate along the optical detection path on both sides of the defect is greater than the physical length of the optical detection path
  • the product of the matrix relative to the refractive index of the detection beam that is, a+b is trapped as a solid defect (stone).
  • glass is used as an example, according to the formula:
  • the physical length T glass of the glass is known, and the optical length is an integral of the distance of the detection beam along the broadcast and the refractive index of the substance distributed within the distance with respect to the detection beam, and the refractive index n glass of the glass is known. . Therefore, by calculating n defect by the formula, the defects can be classified more accurately.
  • the physical length of the optical detection path (the physical length of the matrix of the corresponding region) can be measured by a detection tool such as a vernier caliper or a thickness gauge.
  • the refractive index of the substrate relative to the detection beam is also known.
  • the refractive index table can be obtained according to the wavelength of the detection beam and the material of the substrate, that is, the refractive index of the substrate can be obtained.
  • Figure 11 is a schematic diagram of the open bubble interface distribution in the mass (mainly glass).
  • the open bubble is located on the surface of the glass, so the open bubble has two interfaces, namely the air-glass interface 200 and the glass-air interface 210.
  • Figure 13 is a schematic diagram of the closed-cell bubble interface distribution in the glass. The closed bubble is located in the glass, so the closed bubble has four interfaces, namely the air-glass interface 300, the glass-air interface 310, the air-glass interface 320, the glass-air Interface 330.
  • the second split beam Separating a single beam emitted from the light source into a first split beam and a second split beam, the second split beam as a reference beam; the first split beam is irradiated onto the glass surface or inside, and is optically detected on each path
  • the distributed backscattered light is used as a sample beam; the sample beam and the reference beam combine to interfere; the interference light signal is processed and displayed to form a detected image.
  • the open bubble is located on the glass surface, so the first split beam will be incident on the glass-air interface 210 along the respective optical detection path from each incident point on the air-glass interface 200 shown in FIG.
  • Point respectively, a set of backscattered light generated at each point on the optical detection path through which the detection beam passes as a sample beam corresponding to the point; the sample beams generated by the points distributed on the optical detection paths between the two interfaces are respectively Interference with the reference beam to obtain interference light information; after photoelectric conversion, the image is displayed as bright lines at the two physical interfaces.
  • a pseudo bright line having a brightness lower than the brightness of the interface bright line appears above the open bubble interface; usually, in this case, there is a bright line on the detection surface image of the open bubble.
  • the total number is also less than 4. As shown in FIG.
  • the closed bubble is located inside the glass, so the first split beam will occur at the air-glass interface 300, the glass-air interface 310, the air-glass interface 320, and the glass-air interface 330 shown in FIG.
  • the backscattered light generated by the corresponding points on the four interfaces interferes with the reference beam as the sample beam, and obtains the intensity information of the backscattered light at the points on the corresponding optical detection paths of the four interfaces; after photoelectric conversion and signal
  • the image is displayed in bright lines on the four physical interfaces. Four bright lines are usually displayed in four interfaces. Usually in this case, the total number of bright lines is equal to four.
  • the detection image of the detection surface is formed based on the interference light intensity information at each point on the detection surface. Therefore, the detection image includes the light intensity information of the detection surface.
  • OCT optical coherence tomography
  • the present invention can employ different OCT devices to acquire a detected image of the glass.
  • Figure 15 shows a time domain OCT (first generation OCT) device. As shown in FIG.
  • the time domain OCT apparatus includes: a light source 12, a spectroscopic coupling section 13, a reference mirror 14, a focus lens 15, a photodetector 16, and a display processing unit 17. The method of detecting the glass acquired image by using the time domain OCT apparatus of FIG.
  • the light source 12 emits a coherent single beam; after the single beam is collimated by a collimator (not shown), it enters the spectral coupling component 13
  • the splitting light coupling member 13 is disposed on the transmission path of the light beam, and the splitting light coupling member 13 splits the collimated single beam into the detection beam 18 and the reference beam 19 of different transmission paths
  • the focusing lens 15 is disposed on the transmission path of the detection beam 18, It receives the detection beam 18 emitted from the spectral coupling component 13 and focuses the detection beam 18 on the first surface of the glass 11, and the collected detection beam 18 is incident on the second surface from the incident point of the first surface of the glass 11,
  • the reflected light generated at the surface of the glass 11 through which the detecting beam passes and the internal points are respectively taken as the sample beam corresponding to the point
  • the reference mirror 14 is used as a part of the reference arm, and is disposed on the transmission path of the reference beam 19, by driving the reference reflection The mirror 14 moves back and forth to generate reference beams of
  • the display processing unit 17 is for analyzing the electrical signals to obtain the respective detection surface images of the glass 11.
  • the method for detecting each detection surface from the first surface incident point to the second surface along the depth direction is as shown in FIG. 16 , and the time domain OCT device mainly moves through the reference mirror 14 (ie, moving the reference arm)
  • the first distance of the reference mirror 14 from the spectroscopic coupling member 13 is ds, and the first optical path length L1 is generated, and the first optical path length L1 is compared with the first depth position of the glass 11 detecting surface.
  • the spot beam reflected by the spot interferes (ie, the optical path difference between the sample beam reflected by the point at the first depth position and the reference beam of the first optical path length L1 is smaller than the coherence length of the light source 12 Degree), and does not interfere with the sample beam reflected by the points of other depth positions (ie, the optical path difference between the reference beam reflected by the reference path of the first optical path length L1 and the detection surface of the glass 11 and other depth positions is larger than the light source
  • the reference mirror 14 is moved so that the distance between the reference mirror 14 and the spectroscopic coupling member 13 is the second distance dr, thereby generating the second optical path length L2 reference beam, and the second optical path length L2
  • the reference beam interferes with the sample beam reflected by the point at the second depth position of the detection surface of the glass 11, and does not interfere with the sample beam reflected by the point at other depth positions; and so on, the reference mirror 14 is constantly moved, changing its The distance between the light-splitting coupling members 13 causes interference between
  • the reference mirror 14 can also be replaced by a scanning device including a first wedge mirror and a second wedge mirror, the first wedge mirror and the second wedge mirror having the same structure and their oblique sides being placed in parallel.
  • the first wedge mirror is fixed, the second wedge mirror is placed on the movable end of the precision electronically controlled translation stage, and the electronically controlled translation stage is controlled by the display processing unit 17, so that the second wedge mirror moves along the oblique side to realize the moving wedge
  • the mirror changes the purpose of the reference beam path.
  • the electronically controlled translation stage in the scanning device is controlled by the display processing unit 17, and the optical path of the reference beam is changed, so that the reference beam respectively interferes with the sample beam reflected from different depths and structures in the glass 11, and the corresponding electronically controlled translation is recorded separately.
  • the displacement amount of the movement of the stage which reflects the spatial position of the different structures in the glass 11, whereby one-dimensional measurement data in the depth direction of the glass 11 can be obtained, and the longitudinal scanning of the glass 11 is completed.
  • the embodiment of the present invention can also acquire a detection image of the glass by using a frequency domain OCT device.
  • Figure 17 is a spectral domain OCT (second generation OCT) device. As shown in FIG.
  • the spectral domain OCT apparatus includes: a light source 21, a spectroscopic coupling section 22, a sample arm 23, a reference arm 24, a spectrometer 25, a photodetector 26, and a display processing unit 27.
  • the light source 21 is a wide-spectrum light source that emits a low-coherence light beam; the low-coherence light beam enters the spectral coupling component 22 through the light source arm 28; the split-light coupling component 22 divides the low-coherent light beam a detecting beam and a reference beam; the detecting beam is irradiated onto the glass through the sample arm 23, and the detecting beam is incident from the incident point of the first surface of the glass to the first The two surfaces respectively are the reflected light generated at the surface of the glass through which the detecting beam passes and the internal points are taken as the sample beam corresponding to the point; the reference beam enters the reference arm 24, and the reference arm 30 includes the adjustable optical delay line and the mirror; The reference beam reflected from the mirror inside the reference arm 23 and the combined sample beam exiting the sample arm 23 are combined in the splitting coupler 22 and interfere with each other; the interference beam is transmitted by the splitting coupling section 22 to the spectrometer 25 through the detector arm 29.
  • the interference spectrum of different wavelengths is obtained by using a spectrometer spectroscopic characteristic, wherein the interference spectrum includes light intensity information of a point at each depth position of the detecting surface; the interference spectrum is collected by the photodetector 26, and Fourier transform is performed to obtain a glass along the depth direction. Detection images of the surface and internal points.
  • the interference signal entering the spectrometer can be expressed by Equation 1-1:
  • I(k) S(k) a R Qxp(i2kr) + a(z) x exp ⁇ i2k[r + n(z) - z] ⁇ dz ( 1-1 )
  • 2r is the optical path of the reference arm 2 (r+z) is the optical path of the sample arm
  • 2z is the optical path of the sample arm, and its value is measured with the reference plane as the origin, z.
  • n is the refractive index
  • a R is the reflected light amplitude of the reference arm (which can be assumed to be 1)
  • a (z) is the reflected light amplitude of the glass, taking into account the offset z.
  • I(k) ⁇ ( ⁇ )[1 + plant a ⁇ z) cos(2knz)dz + ( J Factory ⁇ ) ⁇ ' ) Qxp[-ikn ⁇ ( ⁇ - ⁇ ' )]dzdz'
  • AC[ ⁇ (z) ] represents the autocorrelation item.
  • the light intensity information of the frequency domain OCT in the depth direction of the glass detection surface is simultaneously acquired, and the light intensity information of the one-dimensional depth direction of each detection surface of the glass can be directly obtained by the Fourier transform method;
  • the longitudinal scanning device greatly increases its imaging speed.
  • the light source 21 may be a high brightness light emitting diode (SLED) having a wavelength of about 840 nm and a bandwidth of about 50 nm.
  • the light source arm 28 can be a single mode fiber.
  • the splitting coupling component 22 can be a 2x2 3dB fiber coupler; the 3dB coupler acts as a splitting and combining.
  • the spectrometer 25 may be a grating spectrometer, specifically a diffraction grating spectrometer or a blazed grating spectrometer.
  • the basic function of the spectrometer is to determine the spectral composition of the light being studied, including its wavelength, intensity, and so on.
  • the spectrometer should have the following functions: 1. Decompose the light to be studied according to the wavelength or wave number; 2. Determine the energy of the light of each wavelength, and obtain the distribution of energy according to the wavelength; The intensity is displayed and recorded by wavelength or wave number distribution to obtain a spectrum. As shown in FIG.
  • the spectrometer includes: a light source (not shown), a grating 251, a lens 252, and a photodetector 253 (the same device as the photodetector 26).
  • the wide-spectrum light emitted by the low-coherence light source is sent to the spectrometer through the interference signal generated by the Michelson interferometer, and the intensity distribution of the interference signal with the wavelength ( ⁇ ) is obtained by using the spectroscopic characteristic of the spectrometer, and then the inverse signal is obtained after the inverse transformation.
  • the photodetector 26 of the frequency domain OCT device generally adopts a CCD (Charge Coupled Device), and a line array CCD or an area array CCD can be selected according to different situations.
  • the CCD uses charge as a signal, that is, information is represented by a charge pad (charge packet), and other devices use voltage or current as a signal.
  • FIG. 19 shows a frequency domain light source OCT (third generation OCT) device.
  • the frequency domain OCT apparatus includes: a swept source 31, a spectroscopic coupling unit 32, a reference mirror 33, a sample stage 34, a photodetector 35, and a display processing unit 36.
  • the swept source 31 is a high speed tunable laser source.
  • the Fourier domain mode locking (FDML) laser source is shown in FIG. 20, and includes an isolator 315, a signal amplifier 314, an optical fiber 313, a filter 312, and a wavelength generator 311.
  • the FDML technology uses a long fiber of several kilometers to extend the cavity so that the light travels in the cavity for exactly one turn to match the tuning time of the FFP-TF.
  • the optical fiber causes the light beams filtered by the FFP-TF to oscillate in the cavity at the same time, instead of the short cavity, the light of a certain wavelength is oscillated before the light of the next wavelength passes, so although the cavity of the cavity Long, but the speed has increased.
  • the sweep speed is no longer limited by the tuning speed of the filter and the time for the laser to oscillate in the cavity, just like the short cavity, but only limited by the tuning speed of the filter.
  • the FDML swept laser source has the greatest advantage of high speed, axial scanning speeds of several hundred kilohertz, and ultra-narrow instantaneous linewidths for deeper imaging depths.
  • the FDML swept laser has a sweep rate of 290 kHz, a center wavelength of 1300 nm, a sweep range of 105 nm, an average output power of 20 mW, and an imaging depth of 7 mm.

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

一种检测基质内缺陷的方法及装置，其中所述方法包括：提供检测光束和参考光束；将所述检测光束自所述基质（116）第一表面（116a）的入射点（117a）沿光学检测路径入射至第二表面（116b）上与入射点一一对应的反射点（117b），分别以检测光束经过的光学检测路径上各点处产生的背向散射光的集合作为该点对应的样本光束；分别采集各样本光束和所述参考光束相互干涉形成的干涉信号，以获取光学检测路径上各点的背向散射光的光强信息，与该光学检测路径上各点之间的光学长度信息；根据所述光学检测路径上各点的背向散射光的光强信息，判断所述光学检测路径上是否存在缺陷。所述方法能正确区分基质内缺陷的类型，提高了检测缺陷的正确率。

Description

一种检测基质内缺陷的方法及装置
本申请要求于 2011年 12月 20 日 提交中 国专利局、 申请号为 201110430121.6、 发明名称为"一种检测基质内缺陷的方法及装置"的中国专利 申请的优先权， 其全部内容通过引用结合在本申请中。 技术领域 本发明涉及缺陷检测技术， 尤其涉及一种检测基质内缺陷的方法及装置。 背景技术 在现有透明基质， 尤其是玻璃生产过程中，种种原因会导致缺陷产生和存 在， 主要缺陷包括划痕、 气泡和污点等等， 如何自动识别玻璃的缺陷是玻璃生 产企业进行生产过程质量控制和产品质量检验急待解决的问题。 目前， 国内许多玻璃生产企业还依靠工人通过眼睛来识别玻璃中的缺陷， 效率很低，但是人工检测玻璃内缺陷的方法容易产生误差。为了解决上述问题， 采用自动光学检测（AOI )技术对玻璃内缺陷进行检测，具体利用检测光线（包 括激光束或 LED光束等 )对玻璃表面进行扫描， 用检测器检测透射光或反射光 的光强变化来检测玻璃缺陷。现有利用检测光线扫描玻璃获取玻璃内缺陷的位 置的方法为： 利用检测光线经柱面镜扩展成面光束，从被检玻璃厚度侧面入射 玻璃， 玻璃中或玻璃表面的缺陷诸如气泡、 划痕等成为散射体， 摄像头在计算 机控制下对放置在载物平台上的被检玻璃进行正面拍摄，得到清晰的缺陷图像 由计算机图像处理及识别软件进行判别，给出缺陷标记和提示； 若在所述光源 发生器和柱面镜之间增加由转镜及 f-θ透镜构成的光学扫描机构， 检测光线先 变换成沿柱面镜轴线方向的扫描光束，再经柱面镜展开成面光束射入玻璃， 则 可进行缺陷深度位置的检测。 但是，现有自动光学检测技术分辨率低， 区分缺陷类型的正确率不高或者 根本无法有效区分缺陷的类型。 发明内容 本发明解决的问题是提供一种检测基质内缺陷的方法及装置，提高区分缺 陷类型的正确率。 为解决上述问题， 本发明提供一种检测基质内缺陷的方法， 所述基质具有 相对的第一表面和第二表面，所述第一表面上分布多个入射点，所述方法包括： 提供检测光束和参考光束； 将所述检测光束自所述基质第一表面的入射点沿光学检测路径入射至第 二表面上与入射点——对应的反射点，分别以检测光束经过的光学检测路径上 各点处产生的背向散射光的集合作为该点对应的样本光束； 分别采集各样本光束和所述参考光束相互干涉形成的干涉信号，以获取光 学检测路径上各点的背向散射光的光强信息，与该光学检测路径上各点之间的 光学长度信息； 根据所述光学检测路径上各点的背向散射光的光强信息，判断所述光学检 测路径上是否存在缺陷。 可选的，如果所述光学检测路径上存在缺陷，根据已知的所属光学检测路 径的物理长度、所述光学检测路径上各点的背向散射光的光强信息、所述光学 检测路径的光学长度以及所述光学基质相对于所述检测光束的折射率，判断所 述缺陷的类型。 可选的，根据所述光学检测路径上的各点的背向散射光的光强信息确定光 学检测路径上的物理界面的数量。
所述距离内分布的物质相对于所述检测光束的折射率的积分。 可选的， 所述基质是玻璃、 塑料， 或玻璃陶瓷或以上材料的复合材料。 可选的，所述检测光束和参考光束是光源发射的单光束通过分光部件分光 形成。 可选的， 所述光源具有相干性， 光源的分辨率为 5微米〜 200微米， 光源 功率谱半高宽为 10纳米〜 100纳米。 可选的， 所述光源的分辨率为 100微米〜 200微米， 光源功率谱半高宽大 于 10纳米。 可选的，所述分别采集各样本光束和所述参考光束相互干涉形成的干涉信 号， 以获取光学检测路径上各点的背向散射光的光强信息， 与该光学检测路径 的光学长度的信息的步骤包括：各样本光束分别和所述参考光束在耦合部件中 发生合束且相互干涉。
可选的， 分别采集各样本光束和所述参考光束相互干涉形成的干涉信号， 以获取光学检测路径上各点的背向散射光的光强信息与该光学检测路径的光 学长度信息的步骤是采用光电探测部件进行的。
可选的，根据所述基质第一表面和第二表面之间至少两个光学检测路径定 义相应的连接两个表面的检测面。
可选的，根据检测面上各光学检测路径上各点的背向散射光的光强信息获 取该检测面的检测图像。
可选的， 所述检测光束由点光源或线光源产生。
可选的， 当检测光束为点光源发出的光束时，检测光束沿待分析的检测面 与第一表面之间的界线进行扫描，通过各入射点逐个入射至第二表面上对应的 反射点。
可选的， 当检测光束为线光源发出的光束时，检测光束同时从待分析的检 测面与第一表面之间的界线上各入射点入射至第二表面。
可选的，沿与检测面和第一表面之间的界线垂直的方向扫描获得各检测面 的检测图像。 本发明还提供一种检测基质内缺陷的方法，所述基质具有相对的第一表面 和第二表面，其中所述第一表面与所述第二表面分别为所述基质与外界环境的 分界面， 所述方法包括： 提供检测光束与参考光束； 所述检测光束入射于所述第一表面的检测区域内的至少一入射点，所述检 测光束沿对应的光学检测路径传播至位于所述第二表面的对应于所述入射点 的反射点; 获取分布在所述光学检测路径上各点的背向散射光的光强信息； 以及 根据所述光学检测路径上分布的各点的背向散射光的光强信息确定检测 区域范围内的基质的内部及 /或表面是否存在缺陷。 可选的，根据所述光学检测路径上分布的各点的背向散射光的光强信息确 定的所述光学检测路径上分布的各点之间的光学长度信息。
可选的， 当所述检测区域范围内的基质的内部及 /或表面存在缺陷时， 采 用所述光学检测路径上分布的各点之间的光学长度信息来确定缺陷的类型。
可选的，当缺陷的沿光学检测路径上的光学长度和缺陷两侧基质沿光学检 测路径上的光学长度之和小于所述光学检测路径的物理长度与基质相对于检 测光束的折射率之积时， 判断所述缺陷为气泡。
可选的，检测基质内缺陷的方法还包括： 采用光学检测路径上分布的各点 的背向散射光的光学强度信息来确定气泡的开闭类型。
可选的， 采用下述步骤来确定气泡的开闭类型： 根据光学检测路径上分布 的各点的背向散射光的光强信息判断所述光学检测路径所经过的物理界面的 数量， 并根据所述物理界面的数量判断气泡的开闭类型。
可选的， 当所述物理界面的数量为 4时， 判断所述气泡为封闭气泡； 当所 述物理界面的数量小于 4时， 判断所述气泡为开口气泡。
可选的，当缺陷沿所述光学检测路径的光学长度和缺陷两侧基质的沿所述 光学检测路径的光学长度之和大于所述光学检测路径的物理长度与基质相 对于所述检测光束的折射率之积时， 判断所述缺陷为固体缺陷。
可选的， 当所述检测区域范围内的基质的内部及 /或表面存在缺陷时， 根 据所述光学路径的物理长度、所述基质相对于所述检测光束的折射率以及所述 光学检测路径上分布的所述缺陷的光学长度来确定缺陷的折射率。 可选的， 采用下述步骤计算缺陷的折射率： 根据分布在缺陷一侧或两侧的基质沿所述光学检测路径的光学长度除以 基质相对于所述检测光束的折射率，获取分布在缺陷一侧或两侧的沿所述光学 检测路径的基质的物理厚度； 以光学检测路径的物理长度减去分布在缺陷一侧或两侧的沿所述光学检 测路径的基质的物理厚度， 获取所述缺陷的物理厚度； 以及 将缺陷的光学长度除以缺陷的物理厚度， 获得缺陷的折射率。 可选的， 根据所述缺陷的折射率判断缺陷类型。
可选的，所述光学检测路径上分布的各点之间的光学长度为所述检测光束 沿所述光学检测路径在各点之间传播的距离与所述距离内分布的物质相对于 所述检测光束的折射率的积分。
可选的， 基质是玻璃、 塑料、 或玻璃陶瓷或以上材料的复合材料。
可选的， 所述第一表面与所述第二表面两侧的外界环境为相同的介质。 可选的， 所述外界环境为空气或水或非腐蚀性气体或非腐蚀性液体。 可选的， 所述第一表面与所述第二表面两侧的外界环境为非相同的介质。 可选的， 所述第一表面一侧的外界环境为空气； 第二表面与承载台接触， 第二表面一侧的外界环境是材料为金属或塑料的承载台。 本发明还提供一种检测基质内缺陷的装置， 包括： 光源， 提供单光束； 分光单元， 将单光束分为检测光束和参考光束； 样本光束获取单元 ,获取所述检测光束自基质第一表面的入射点至第二表 面上与入射点——对应的反射点经过的光学检测路径上各点处产生的样本光 束； 信号采集单元，分别采集各样本光束和所述参考光束相互干涉形成的干涉 信号， 以获取光学检测路径上各点的背向散射光的光强信息， 与该光学检测路 径上各点之间的光学长度信息； 缺陷判断单元， 根据所述光学检测路径上各点的背向散射光的光强信息， 判断所述光学检测路径上是否存在缺陷。 与现有技术相比， 本发明技术方案具有以下优点： 通过采集各样本光束和所述参考光束相互干涉形成的干涉信号，以获取光 学检测路径上各点的背向散射光的光强信息，根据所述光强信息， 即可判断出 所述光学检测路径上是否存在缺陷； 保证了基质内每个点的光强信息均被采 集， 确保了缺陷信息的完整性。 根据所述光学检测路径上分布的各点的背向散射光的光强信息确定的所 述光学检测路径上分布的各点之间的光学长度信息可有效确定缺陷的类型，提 高了区分缺陷类型的正确率。 进一步，根据所述光学检测路径上的各点的背向散射光的光强信息确定光 学检测路径上的物理界面的数量， 能直观且精确地区分气泡是封闭还是开放。 进一步， 当所述检测区域范围内的基质的内部及 /或表面存在缺陷时， 根 据所述光学路径的物理长度、所述基质相对于所述检测光束的折射率以及所述 光学检测路径上分布的所述缺陷的光学长度来确定缺陷的折射率，根据缺陷的 折射率能明确缺陷的具体类型， 提高了检测缺陷的正确率。
附图说明 图 1是本发明第一实施例检测基质内缺陷的流程示意图； 图 2是本发明第二实施例检测基质内缺陷的流程示意图； 图 3是本发明实施例检测基质内缺陷的装置示意图； 图 4是本发明第一实施例检测基质内缺陷的原理示意图； 图 5是本发明第一实施例检测基质内缺陷的方法形成检测面的示意图； 图 6是本发明第二实施例检测基质内缺陷的原理示意图； 图 7是本发明第二实施例检测基质内缺陷的方法形成检测面的示意图； 图 8是本发明实施例采用点光源检测基质内缺陷的示意图； 图 9是本发明实施例采用线光源检测基质内缺陷的示意图； 图 10是采用本发明检测方法获得的具有缺陷的玻璃图像示意图； 图 11是玻璃内开放式气泡界面分布示意图；
图； 图 13是玻璃内封闭式气泡界面分布示意图；
图； 图 15是本发明检测装置延伸的时域 OCT检测装置示意图； 图 16是采用时域 OCT对玻璃进行检测工艺的示意图； 图 17是本发明检测装置延伸的谱域 OCT检测装置示意图； 图 18是采用谱域 OCT对玻璃进行检测工艺的示意图； 图 19是本发明检测装置延伸的频域 OCT检测装置示意图； 图 20是采用频域 OCT对玻璃进行检测工艺的原理示意图。 具体实施方式 现有通常采用人眼观测以确定缺陷位于基质（尤其是玻璃）内部还是表面， 如果是位于表面可以再通过手的触摸来确定缺陷的类型；但是这种人工检测的 正确率低， 且不能分辨基质内的缺陷的类型及位置。 为了解决上述问题， 后续 又发展出自动光学检测（AOI )技术， 可以是在基质下方放置光源， 在基质上 方架设两个图像摄取装置，通过三角法来获取缺陷的位置； 但这种方法同样不 能 4艮好的确定缺陷的类型。 发明人经过研究发现一种检测基质内缺陷的方法，所述基质具有相对的第 一表面和第二表面， 所述第一表面上分布多个入射点， 所述检测步骤如图 1 所示， 包括： 执行步骤 S1 , 提供检测光束和参考光束； 执行步骤 S2, 将所述检测光束自所述基质第一表面的入射点沿光学检测 路径入射至第二表面上与入射点——对应的反射点，， 分别以检测光束经过的 光学检测路径上各点处产生的背向散射光的集合作为该点对应的样本光束； 执行步骤 S3 , 分别采集各样本光束和所述参考光束相互干涉形成的干涉 信号， 以获取光学检测路径上各点的背向散射光的光强信息， 与该光学检测路 径上各点之间的光学长度信息； 执行步骤 S4, 根据所述光学检测路径上各点的背向散射光的光强信息， 判断所述光学检测路径上是否存在缺陷。 在上述实施方式中，通过采集各样本光束和所述参考光束相互干涉形成的 干涉信号， 以获取光学检测路径上各点的背向散射光的光强信息，根据所述光 强信息， 即可判断出所述光学检测路径上是否存在缺陷； 对基质内每个点的所 产生的背向散射光的光强信息均进行采集， 确保了缺陷信息的完整性。 接着， 再根据光学检测路径上各点之间的光学长度信息可初步区分缺陷的类型（是气 泡还是结石）， 提高了区分缺陷类型的正确率。 本发明还提供了另一种检测基质内缺陷的方法，所述基质具有相对的第一 表面和第二表面，其中所述第一表面与所述第二表面分别为所述基质与外界环 境的分界面， 所述检测步骤包括： 执行步骤 S11 , 提供检测光束与参考光束； 执行步骤 S12, 所述检测光束入射于所述第一表面的检测区域内的至少一 入射点，所述检测光束沿对应的光学检测路径传播至位于所述第二表面的对应 于所述入射点的反射点； 执行步骤 S13 , 获取分布在所述光学检测路径上各点的背向散射光的光强 信息； 执行步骤 S14,根据所述光学检测路径上分布的各点的背向散射光的光强 信息确定检测区域范围内的基质的内部及 /或表面是否存在缺陷。 基于上述检测基质内缺陷的方法得到检测基质内缺陷的装置，包括：光源， 提供单光束； 分光单元， 将单光束分为检测光束和参考光束； 样本光束获取单 元 ,获取所述检测光束自基质第一表面的入射点至第二表面上与入射点一一对 应的反射点经过的光学检测路径上各点处产生的样本光束； 信号采集单元， 分 别采集各样本光束和所述参考光束相互干涉形成的干涉信号，以获取光学检测 路径上各点的背向散射光的光强信息，与该光学检测路径上各点之间的光学长 度信息； 缺陷判断单元，根据所述光学检测路径上各点的背向散射光的光强信 息， 判断所述光学检测路径上是否存在缺陷。 本实施方式中，采用检测光束沿光学检测路径自基质的第一表面入射至第 二表面，获取检测区域内光学检测路径上各点的背向散射光的光强信息以确定 被检测基质内部及 /或表面是否存在缺陷。 对检测区域范围内每个点的所产生 的背向散射光的光强信息均进行采集， 确保了缺陷信息的完整性； 另外， 根据 光强信息直接判断缺陷的存在与否， 准确性高。 为使本发明的上述目的、特征和优点能够更为明显易懂， 下面结合附图对 本发明的具体实施例 #文详细的说明。 图 3是本发明检测基质内缺陷的装置示意图。如图 3所示，检测基质的装 置包括： 光源 100、 分光部件（耦合部件） 102、 参考臂 106、 样品臂 114、 光 电探测部件 110和显示处理单元 118。 上述装置对基质进行检测的原理如下： 首先， 需要提供如图 4所示的一基 质 116, 所述基质 116具有相对的第一表面 116a和第二表面 116b, 所述第一 表面 116a上分布多个入射点 117a。其中，所述第一表面 116a和第二表面 116b 为基质 116与外界环境的分界面。 然后， 再结合图 3、 4, 光源 100发射单光束； 单光束进入分光部件 102, 被分光部件 102 分为检测光束和参考光束； 检测光束和参考光束从分光部件 102中输出后，其中所述参考光束进入参考臂 106中，样本光束进入样品臂 114 中； 参考光束先经过参考臂 106内的透镜组 104进行聚焦， 聚焦后的参考光束 至反射元件 108后被原路反射；检测光束经聚焦透镜组 112后照射到被测基质 116上， 所述检测光束自所述基质 116第一表面 116a的入射点 117a入射至第 二表面 116b, 其中所述检测光束沿第一表面 116a上的各入射点沿对应光学检 测路径入射至第二表面 116b上的点定义为反射点 117b, 分别以检测光束经过 的光学检测路径上各点处产生的背向散射光作为该点对应的样本光束；各点处 产生的样本光束和参考光束在耦合部件 102内合束且相互干涉，形成干涉光信 号； 干涉光信号被光电探测部件 110采集， 所述干涉光信号包含光学检测路径 上对应点的背向散射光的光强信息，根据所述光学检测路径上分布的各点的背 向散射光的光强信息可以确定所述光学检测路径上分布的各点之间的光学长 度信息， 干涉光强信号经过光电转换及信号放大处理后， 形成干涉电信号； 干 涉显示处理单元 118上进行接收处理后， 形成检测图像。 本实施例中， 所述基质 116可以是玻璃、 塑料、 或玻璃陶瓷或以上材料的 复合材料。 其中， 所述基质 116相对于检测光束是透明的， 因为预定波长的检 测光束可直接穿透基质 116。 本实施例中，所述基质 116的第一表面 116a和第二表面 116b大致相互平 行，即：第一表面 116a和第二表面 116b可以是平行的，也可以是第一表面 116a 和第二表面 116b的延长线具有夹角。 其中，所述基质 116的第一表面 116a与所述第二表面 116b两侧的外界环 境可以为相同的介质， 也可以是不同介质。 如果为相同介质， 第一表面 116a 与所述第二表面 116b两侧的外界环境可以为空气或水或非腐蚀性气体或非腐 蚀性液体。 如果是非相同的介质， 所述第一表面 116a—侧的外界环境可以是 为空气或水或非腐蚀性气体或非腐蚀性液体； 第二表面 116b与承载台接触， 则第二表面一侧的外界环境是材料为金属或塑料的承载台。 本实施例中， 所述检测光束和参考光束的光强、 光能量相同。 本实施例中， 根据光束入射角度的不同， 光学检测路径也不同。 如图 4 所示， 当检测光束垂直入射至所述基质 116的第一表面 116a, 则所述检测光 束自第一表面 116a的入射点 117a沿光学检测路径 118垂直入射至第二表面 116b上。 如图 6所示， 当检测光束倾斜的入射至所述基质 116的第一表面 116a, 则所述检测光束自第一表面 116a的入射点 117a沿光学检测路径 118按相应角 度入射至第二表面 116b上。 本实施例中，根据所述基质 116第一表面 116a和第二表面 116b之间至少 两个光学路径定义出相应的连接两个表面的检测面。 其中， 如图 5所示， 按图 4中检测光束垂直入射至基质 116内的话， 检测光束自第一表面 116a入射点 117a沿光学检测路径入射至第二表面 116b上时， 所述光学检测路径亦垂直于 两个表面； 根据至少两个光学路径定义出相应的连接两个表面的检测面， 则可 以定义出连接第一表面 116a和第二表面 116b的检测面 116c,所述检测面 116c 与基质 116侧面平行。 如图 7所示，按图 6中检测光束倾斜的入射至基质 116内的话，检测光束 自第一表面 116a入射点 117a沿光学检测路径入射至第二表面 116b上时， 所 述光学检测路径亦与两个表面倾斜相交；根据至少两个光学路径定义出相应的 连接两个表面的检测面，则可以定义出连接第一表面 116a和第二表面 116b的 检测面 116c, 所述检测面 116c与基质 116侧面具有夹角。 另外， 上述两种检测方式中定义的检测面 116c中， 每一检测方式中各检 测面 116c相互平行；所述入射点 117a均分布于各检测面 116c与第一表面 116a 之间的界线上。 对上述定义的检测面 116c上各光学检测路径上各点的背向散射光的光强 信息经过处理即可获取该检测面 116c的检测图像。 在本实施例中， 所述基质 116的第一表面 116a上的各入射点沿对应光学 检测路径入射至第二表面 116b上的点定义为反射点 117b, 所述反射点 117b 在接收到检测光束后， 会在该点产生背向散射及反射。 本实施例中， 所述光源可以是激光源或发光二极管； 所述的激光源或发光 二极管为宽频谱光源，产生的光束为相干性光束， 所述相干性光源的分辨率为 5微米〜 200微米， 光源功率谱半高宽为 10纳米〜 100纳米。 所述激光源或发光 二极管可以是线光源， 也可以是点光源。 另外，在检测玻璃基质过程中，所选相干性光源的分辨率为 100微米〜 200 微米， 光源功率谱半高宽大于 10纳米。 具体采用以点光源作为光源的检测装置获取基质图像（以定义 XZ检测面 为例）如图 8所示， 将基质移动位置， 至使从点光源出射的光能直接入射至的 第一表面的第一入射点 a处， 所述第一入射点 a靠近基质的一角； 点光源发出 的单光束被分光成检测光束和参考光束后，检测光束自第一入射点 a沿第一光 学检测路径入射至第二表面的对应于所述第一入射点 a的第一反射点；检测光 束从第一入射点 a沿第一光学检测路径经过基质第一表面、内部及第二表面各 点处均会产生背向散射，各点处产生的背向散射光的集合作为该点对应的第一 样本光束； 各第一样本光束和参考光束在耦合部件内合束且发生干涉； 第一光 电探测器分别采集各第一样本光束和所述参考光束相互干涉形成的第一干涉 光信号， 并将第一干涉光信号转换为对应的第一干涉电信号。 将基质沿 X方 向移动， 至使从点光源出射的光束能直接入射至第一表面的第二入射点 b处， 检测光束自第二入射点 b 沿第二光学检测路径入射至第二表面的对应于所述 第二入射点 b的第二反射点；检测光束从第二入射点 b沿第二光学检测路径经 过基质第一表面、 内部及第二表面各点处均会产生背向散射，各点处产生的背 向散射光的集合作为该点对应的第二样本光束；各第二样本光束和参考光束在 耦合部件内合束且发生干涉；第二光电探测器分别采集各第二样本光束和所述 参考光束相互干涉形成的第二干涉光信号，并将第二干涉光信号转换为对应的 第二干涉电信号。 采用上述方法， 将基质沿 X方向不断移动， 获取沿各入射 点对应的光学检测路径上各点干涉光信号； 直至，将样品移至使从点光源出射 的光束能直接入射至第一表面的第 N入射点 n处（ N和 n为自然数）， 检测光 束自第 N入射点 n沿第 N光学检测路径入射至第二表面的对应于所述第 N入 射点 n的第二反射点； 检测光束从第 N入射点 n沿第 N光学检测路径经过基 质第一表面、 内部及第二表面各点处均会产生背向散射，各点处产生的背向散 射光的集合作为该点对应的第 N样本光束； 各第 N样本光束和参考光束在耦 合部件内合束且发生干涉； 第 N光电探测器分别采集各第 N样本光束和所述 参考光束相互干涉形成的第 N干涉光信号， 并将第 N干涉光信号转换为对应 的第 N干涉电信号。 第一光电探测器、 第二光电探测器 ......第 N光电探测器 将带有干涉光强信息的电信号输出至显示处理单元后，显示处理单元会对该电 信号进行去噪放大，且进行第一检测面图像显示及分析。所述由第一光学检测 路径、 第二光学检测路径 ......第 N光学检测定义出第一检测面； 然后基质再 沿 Y方向移动至第二检测面 ......第 N检测面， 并采用获取第一检测面图像的 方法分别获取第二检测面 ......第 N检测面 （即整个基质） 的检测图像。 具体采用以线光源作为光源的检测装置获取基质图像（以定义 XZ检测面 为例）如图 9所示， 将基质 116移动位置， 使从线光源出射的光能直接入射至 第一表面上的各入射点， 所述各入射点靠近基质的一边； 线光源（可以是由光 纤阵列构成）发出的多光束分别被分光成相应的检测光束和参考光束后，各检 测光束同时自第一入射点 a、 第二入射点 b ......第 N入射点 n沿相应的光学检 测路径从第一表面入射至第二表面， 检测光束从第一入射点 a、 第二入射点 b 第 N入射点 n沿相应的光学检测路径经过基质第一表面、 内部及第二表 面各点处均会产生背向散射，各点处产生的背向散射光作为该点对应的样本光 束； 各样本光束和参考光束在耦合部件内合束且发生干涉； 第一光电探测器采 集从第一入射点 a沿相应的光学检测路径经过基质第一表面、内部及第二表面 各点处背向散射的样本光束与参考光束相互干涉形成的第一干涉光信号，并将 第一干涉光信号转换为对应的第一干涉电信号；第二光电探测器采集从第二入 射点 b沿相应的光学检测路径经过基质第一表面、内部及第二表面各点处反射 的样本光束与参考光束相互干涉形成的第二干涉光信号，并将第二干涉光信号 转换为对应的第二干涉电信号； ......第 N光电探测器采集从第 N入射点 n沿 相应的光学检测路径经过基质第一表面、内部及第二表面各点处反射的样本光 束与参考光束相互干涉形成的第 N干涉光信号， 并将第 N干涉光信号转换为 对应的第 N干涉电信号。 第一光电探测器、 第二光电探测器 ......第 N光电探 测器将带有干涉光强信息的电信号输出至显示处理单元后，显示处理单元会对 该电信号进行去噪放大， 且进行第一检测面图像显示及分析。 在此， 线光源发 出的多光束分别从第一表面的第一入射点 a、 第二入射点 b ......第 N入射点 n 入射至第二表面相应的反射点所经过的对应光学检测路径定义出第一检测面； 然后基质再沿 Y方向移动至第二检测面 ......第 N检测面， 并采用获取第一检 测面图像的方法分别获取第二检测面 ......第 N检测面 （即整个基质） 的检测 图像。 本实施例中， 光源发出单光束后通常会经过准直器（如透镜或透镜组）进 行准直。 本实施例中， 所述分光部件 102和耦合部件 102为同一部件。 除此以外， 分光部件和耦合部件也可以是两个独立的装置。 分光部件（耦合部件） 102可 以是光纤耦合器或分光棱镜或分光镜组等。 本实施例中，现有随着装置的不断小型化， 光束的传输路径可通过光纤实 现； 例如， 光源 100发出的单光束可通过光纤传输至耦合器 102中； 从耦合器 102 输出的检测光束和参考光束可通过光纤分别输入至样品臂 114 和参考臂 106。 本实施例中， 所述探测器 110为 CMOS器件或 CCD器件， 用以采集样本 光束和参考光束相互干涉形成的干涉光强信号， 并进行光学成像。 探测器 110 对干涉光强信号进行采集后，进一步会将采集到的光强信号转换为对应的电信
本实施例中， 显示处理单元 118可以是计算机， 可包括： 信号采集处理单 元和显示单元。 在探测器输出带有干涉光强信息的电信号后， 显示处理单元 118中的信号采集处理单元会对该电信号进行去噪放大， 然后经过处理的电信 号输出至显示单元进行图像显示及分析。 本实施例中， 检测装置还包括样品台， 所述样品台用于承载基质 116。 通 过显示处理单元 118对样品台进行控制， 使样品台在 X— Υ方向移动。 根据样 品台的移动， 图 5、 图 7、 图 8、 图 9中的检测面 116c可以是 ΧΖ方向， 也可 以是 YZ方向的。 采用上述检测装置获取基质内各检测面的扫描图像如图 10所示， 所述检 测面的扫描图像中包括多个光学检测路径上分布的各点的背向散射光的光强 信息；根据所述光学检测路径上的各点的背向散射光的光强信息可以确定检测 面内各光学检测路径上的物理界面的数量，进行判断出基质内部或表面是否存 在缺陷。 如图 4所示， 如果基质内部存在缺陷， 则从检测面的扫描图像上可以 看出光学检测路径上的物理界面的数量大于 2。
如果根据光学检测路径上分布的各点的背向散射光的光强信息确定所述 光学检测路径上存在缺陷， 继续参考图 4, 根据已知的所属光学检测路径的物 理长度、所述光学检测路径上各点的背向散射光的光强信息、所述光学检测路 径的光学长度以及所述基质相对于所述检测光束的折射率，判断所述缺陷的类 型。 具体的， 在图 4的检测面扫描图像中设置预设线， 所述预设线在玻璃的厚 度方向上通过缺陷， 所述预设线只要通过缺陷即可， 不限定位置。 将与预设线 垂直且交接于缺陷边缘的两平行线间的距离设定为缺陷光学长度 b; 除缺陷外 在同一预设线方向上的距离敲定为玻璃光学长度 a+c ( a或 c其中一个可以为 述距离内分布的物质相对于所述检测光束的折射率的积分。 首先，根据光学长度信息可以先粗略地区分缺陷是固体还是气泡。 当缺陷 的沿光学检测路径上的光学长度和缺陷两侧基质沿光学检测路径上的光学长 度之和小于所述基质相应光学检测路径的物理长度（ τχ )与基质相对于检测光 束的折射率之积时： 即 a+b+c<Txxnx, 判断所述缺陷为气泡。 当缺陷沿所述光学检测路径的光学长度和缺陷两侧基质的沿所述光学检 测路径的光学长度之和大于所述光学检测路径的物理长度与基质相对于所述 检测光束的折射率之积时：即 a+b 陷为固体缺陷（结石）。 具体以玻璃为例， 根据公式：
Figure imgf000017_0001
,通常玻璃的物理长度 Tglass已知，光学长度为检测光束沿 播的距离与所述距离内 分布的物质相对于所述检测光束的折射率的积分， 玻璃的折射率 nglass是已知 的。 因此， 通过公式计算出 ndefect , 能更精确地对缺陷进行分类。 例如：
Figure imgf000017_0002
说明该固体缺陷的成份是氧化钙； ndefect=2.16, 说明该固体缺陷 的成份是亚铬酸盐； 而如果 ndefeet=l , 说明缺陷内成份是空气， 为气泡。 本实施例中， 所述光学检测路径的物理长度（相应区域基质的物理长度） 是可以通过游标卡尺或测厚仪等检测工具进行测量的。 本实施例中， 所述基质相对于所述检测光束的折射率也是已知的， 可根据 检测光束的波长、 基质的材质， 查阅折射率表， 即能得到基质的折射率。 当通过检测面上各光学检测路径上分布的各点之间的光学长度信息或折 射率确定缺陷为气泡后，再可通过显示的图像上的光学检测路径上分布的各点 的背向散射光的光强信息确定气泡的开闭类型。 图 11 ^^质 （主要是玻璃） 内开放式气泡界面分布示意图，通常开放式气泡位于玻璃的表面， 因此开放式 气泡具有两个界面， 即空气-玻璃界面 200, 玻璃-空气界面 210。 图 13是玻璃 内封闭式气泡界面分布示意图，封闭式气泡位于玻璃内， 因此封闭式气泡具有 4个界面， 即空气-玻璃界面 300, 玻璃-空气界面 310, 空气-玻璃界面 320, 玻 璃-空气界面 330。 将光源发射出的单光束分光为第一分束光和第二分束光，所述第二分束光 作为参考光束； 第一分束光照射到玻璃表面或内部，被各光学检测路径上分布 的各点背向散射的光作为样本光束；所述样本光束和所述参考光束合并后发生 干涉； 干涉光信号经过处理显示， 形成检测图像。 如图 12所示， 开放式气泡 位于玻璃表面， 因此第一分束光会自图 11所示的空气-玻璃界面 200上的各入 射点沿相应光学检测路径入射至玻璃-空气界面 210的反射点， 分别以检测光 束经过的光学检测路径上各点处产生的背向散射光的集合作为该点对应的样 本光束；两个界面之间各光学检测路径上分布的点所产生的样本光束分别与参 考光束发生干涉，获得干涉光信息； 经过光电转换后成像得到在两个物理界面 成亮线显示。 但是， 在开放式气泡直径小于光束光斑的情况下， 会在开放式气 泡界面上方出现亮度小于界面亮线亮度的伪亮线； 通常这种情况下，存在开放 式气泡的检测面图像上亮线的总数也是小于 4的。 如图 14所示，封闭式气泡位于玻璃内部， 因此第一分束光会在图 13所示 的空气-玻璃界面 300, 玻璃-空气界面 310, 空气-玻璃界面 320, 玻璃-空气界 面 330发生反射，四个界面上相应点所产生的背向散射光作为样本光束与参考 光束发生干涉，获得四个界面的相应光学检测路径上点的背向散射光的光强信 息； 经过光电转换及信号放大等处理后成像得到在四个物理界面成亮线显示。 中通常会在四个界面显示四条亮线。 通常这种情况下， 亮线的总数等于 4的。 本实施例中， 基于检测面上各点的干涉光强信息形成该检测面的检测图 像， 因此， 所述检测图像具备该检测面的光强信息。 另夕卜， 发明人发现光学相干层析成像（ Optical Coherence Tomography, 筒 称 OCT )是近年发展起来的层析成像技术， 具有分辨率高、 成像速度快、 无辐 射损伤等优点， 但是此技术尚未运用于玻璃缺陷的检测中。 本发明可采用不同的 OCT装置获取玻璃的检测图像。 图 15为时域 OCT (第一代 OCT )装置。 如图 15所示， 时域 OCT装置包 括： 光源 12、 分光耦合部件 13、 参考反射镜 14、 聚焦透镜 15、 光电探测器 16及显示处理单元 17。 采用图 15的时域 OCT装置检测玻璃获取图像的方法如下： 光源 12发射 出一相干性的单光束； 单光束经过准直器（未示出）准直后， 进入分光耦合部 件 13中， 所述分光耦合部件 13配置于光束的传递路径上， 分光耦合部件 13 将准直的单光束分光成不同传递路径的检测光束 18及参考光束 19; 聚焦透镜 15配置于检测光束 18的传递路径上， 其接收自分光耦合部件 13射出的检测 光束 18, 并将检测光束 18聚焦于玻璃 11的第一表面， 聚集后的检测光束 18 自所述玻璃 11第一表面的入射点入射至第二表面， 分别以检测光束经过的玻 璃 11表面及内部各点处产生的反射光作为该点对应的样本光束； 参考反射镜 14作为参考臂的一部分， 配置于参考光束 19的传递路径上， 通过驱动参考反 射镜 14来回移动， 产生不同光程长度的参考光束； 并用以反射自分光耦合部 件 13射出的参考光束 19; 被参考反射镜 14反射后的不同光程长度的参考光 经过分光耦合部件 13 进行合束且相互干涉； 干涉光束入射到光电探测器 16 中， 并借由光电探测器 16将光信号转换成电信号； 而显示处理单元 17则是用 以分析电信号以获得玻璃 11的各检测面图像。 本实施例中对各检测面从第一表面入射点至第二表面沿深度方向各点进 行检测的方法如图 16所示， 时域 OCT装置主要通过参考反射镜 14进行移动 (即移动参考臂）； 例如参考反射镜 14起始与分光耦合部件 13的第一距离为 ds, 而产生第一光程长度 L1参考光束， 第一光程长度 L1参考光束会与玻璃 11 检测面第一深度位置的点反射的样本光束发生干涉 （即第一深度位置的点 反射的样本光束与第一光程长度 L1参考光束间的光程差小于光源 12的相干长 度）， 而与其他深度位置的点反射的样本光束不发生干涉（即第一光程长度 L1 参考光束与玻璃 11的检测面与其他深度位置的点反射的样本光束间的光程差 大于光源 12的相干长度）； 然后， 移动参考反射镜 14, 使参考反射镜 14与分 光耦合部件 13的距离为第二距离 dr, 由此产生第二光程长度 L2参考光束， 第二光程长度 L2参考光束会与玻璃 11检测面第二深度位置的点反射的样本光 束发生干涉， 而与其他深度位置的点反射的样本光束不发生干涉； 由此类推， 不断移动参考反射镜 14, 改变其与分光耦合部件 13的距离， 使产生不同光程 长度的参考光束， 与玻璃 11检测面上分布在各光学检测路径上的各点背向散 射的样本光束分别产生干涉， 以获取不同点的背向散射光的干涉光信号； 对这 些干涉光信号进行处理，组合形成各检测面的完整图像，实现层析成像的目的。 本实施例中， 参考反射镜 14还可用包括第一楔镜与第二楔镜的扫描装置 代替， 所述第一楔镜与第二楔镜结构相同且它们的斜边平行放置。 第一楔镜固 定不动， 第二楔镜放置在精密电控平移台的可移动端， 通过显示处理单元 17 控制电控平移台，使第二楔镜沿斜边移动， 以实现通过移动楔镜来改变参考光 束光程的目的。 通过显示处理单元 17控制扫描装置中的电控平移台，改变参考光束光程， 使参考光束分别与从玻璃 11 中不同深度和结构反射回来的样本光束发生干 涉， 同时分别记录相应的电控平移台移动的位移量， 这些位移量反应了玻璃 11内不同结构的空间位置， 由此可获得玻璃 11深度方向的一维测量数据， 完 成对玻璃 11的纵向扫描。 本发明实施例还可采用频域 OCT装置获取玻璃的检测图像。 图 17为谱域 OCT (第二代 OCT )装置。 如图 17所示， 谱域 OCT装置包 括： 光源 21、 分光耦合部件 22、 样品臂 23、 参考臂 24、 光谱仪 25、 光电探 测器 26和显示处理单元 27。 采用图 17的谱域 OCT装置检测玻璃获取图像的方法如下： 光源 21为宽 频谱光源，发射低相干光束；低相干光束通过光源臂 28进入分光耦合部件 22; 分光耦合部件 22将低相干光束分为检测光束和参考光束； 检测光束通过样品 臂 23照射至玻璃上， 将所述检测光束自所述玻璃第一表面的入射点入射至第 二表面，分别以检测光束经过的玻璃表面及内部各点处产生的反射光作为该点 对应的样本光束； 参考光束进入参考臂 24, 所述参考臂 30包括可调光学延迟 线、反射镜； 从参考臂 23内反射镜反射的参考光束与样品臂 23出射的合束后 的样本光束在分光耦合器 22中组合且相互干涉； 干涉光束被分光耦合部件 22 通过检测器臂 29发送至光谱仪 25中， 利用光谱仪分光特性， 获取不同波长的 干涉光谱， 所述干涉光谱包括检测面各深度位置的点的光强信息； 干涉光谱由 光电探测器 26采集后， 进行傅立叶变换得到玻璃沿深度方向检测面表面及内 部各点的检测图像。 本实施例中， 进入光谱仪的干涉信号可由公式 1-1表示：
I(k) = S(k) aR Qxp(i2kr) + a(z) x exp {i2k[r + n(z) - z] }dz ( 1-1 ) 其中， 2r为参考臂的光程， 2 (r+z) 为样品臂光程， 2z 为样品臂光程、 其值以参考面为原点测量， z。参考平面镜与物体前表面的偏置距离， n为折射 率， aR为参考臂反射光振幅（可以假设为 1 ), a (z) 为玻璃反射光振幅， 考 虑到偏置 z。， 则有当 z<z。时， a (z) 为零， s (k) 为光源的光谱密布分布。 当 a (z) 关于沿反射点从玻璃第一表面至第二表面的轴线对称时， 可以 通过干涉信号 I (k) 的傅立叶变换得到反射光振幅 a (z)。 于是， 可得到玻璃 各检测面的深度信息如下所示：
I(k) = ^(^)[1 +厂 a{z) cos(2knz)dz + ( J厂 ά{ζ)ά{ζ' ) Qxp[-ikn χ(ζ-ζ' )]dzdz'
J ) 14]
( 1-2)
( 1.3 )
Figure imgf000021_0001
其中， AC[§ (z) ]代表自相关项。 对上 傅里叶逆变换， 得到：
FOU 1 {I(k)} = FOU - 1 {S(k)} X ([SQz] +
Figure imgf000021_0002
+ AC[a(z)] /8) ( 1-4) 由上式（ 1-4)可得到对称的反射光振幅 § (z), 可推导得到 a (z), 即可 求得随深度变化的检测面内各点的反射光强度。 频域 OCT基于光谱干涉测量原理， 干涉条纹的频率中含有被测物体检测 面的深度方向上的光强信息，通过傅立叶变换就可以很容易的得到不同深度位 置处的玻璃结构信息。 也正因为这个原理， 频域 OCT在玻璃检测面深度方向 的光强信息被同时采集，且通过傅立叶变换的方法， 可以直接获得玻璃各检测 面的一维深度方向的光强信息； 而不需要纵向扫描装置，从而大大的提高了其 成像速度。 本实施例中， 光源 21可以是具有波长约 840nm和带宽约 50nm的高亮度 发光二极管 （ SLED )。 本实施例中， 光源臂 28可以是单模光纤。 本实施例中， 分光耦合部件 22可以是 2x2的 3dB光纤耦合器； 3dB耦合 器起着分束及合束的作用。 本实施例中， 光谱仪 25可以是光栅光谱仪， 具体可以是衍射光栅光谱仪 或闪耀光栅光谱仪。 光谱仪基本作用是测定被研究的光的光谱组成， 包括其波 长、 强度等等。 光谱仪应当具有的功能为： 一、 把被研究的光按波长或者波数 分解开来； 二、 测定各波长的光具有的能量， 得到能量按波长的分布； 三、 把 分解开的光波及其强度按波长或者波数的分布显示、 记录下来， 得到光谱图。 如图 18所示， 光谱仪包括： 光源 （未示出）、 光栅 251、 透镜 252、 光电 探测器 253 (与光电探测器 26为同一装置）。 将低相干光源发出的宽光谱光经 迈克尔逊干涉仪产生的干涉信号送入光谱仪， 利用光谱仪分光特性， 获取干涉 信号随波长（λ ) 变化的强度分布， 然后对其做倒数变换后得到干涉信号在频 域（V域， v=l/f )的强度分布， 即频域干涉条纹， 对该信号作逆傅立叶变换得 到被测玻璃检测面沿检测光束光轴方向的深度的光反射率分布， 即层析图。 本实施例中， 频域 OCT 装置的光电探测器 26 通常采用 CCD ( Charge Coupled Device ), 根据不同情况可以选择线阵 CCD或面阵 CCD。 CCD以电 荷作为信号， 即信息用电荷盘（电荷包）代表， 其他器件则是以电压或者电流 作为信号。 无论是线阵 CCD还是面阵 CCD, 二者都需要用光学成像系统将景 物图像成在 CCD的像敏面上。 像敏面将照在每一像敏单元上的图像照度信号 转变为少数载流子数密度信号存储于像敏单元中。 然后再转移到 CCD的移位 寄存器中， 在驱动脉沖的作用下顺序地移出器件。 图 19为频域光源 OCT (第三代 OCT )装置。 如图 19所示， 频域 OCT装 置包括： 扫频光源 31、 分光耦合部件 32、 参考反射镜 33、 样品台 34、 光电探 测器 35及显示处理单元 36。 本实施例中， 所述扫频光源 31为高速可调谐激光源。 可以分为外腔型扫 频激光光源或伸展环形腔型扫频激光光源或并联腔型扫颇激光光源或直线腔 型扫频激光光源或光纤法布里 -泊罗滤波的环形腔扫频激光光源或傅立叶域锁 模扫频激光光源等。 其中， 傅立叶域锁模（ Fourier domain mode locking, FDML )激光光源如 图 20所示， 包括隔离器 315、 信号放大器 314、 光纤 313、 滤波器 312、 波长 发生器 311。 FDML技术是利用几千米的长光纤， 延长了谐振腔， 使得光在谐 振腔内传播一圈的时间刚好和 FFP-TF 的调谐时间匹配。 光纤使得经 FFP-TF 滤出的各色光同时在谐振腔内振荡， 而不是像短腔那样，在某一个波长的光建 立起振荡后才到下一个波长的光通过， 所以虽然谐振腔的腔长长了，但速度反 而提高了。扫频速度不再像短腔那样受限于滤波器的调谐速度和腔内色光建立 激光振荡的时间的快慢， 而只受限于滤波器的调谐速度。 这种 FDML扫频激 光光源最大优点是高速， 轴向扫描速度可达到几百千赫兹， 并且可获得超窄的 瞬时线宽， 从而得到比较深的成像深度。 这种 FDML扫频激光的扫频速度可 达到 290kHz, 中心波长 1300nm, 105nm的扫频范围， 平均输出功率 20mW, 成像深度达到 7mm。 虽然本发明披露如上， 但本发明并非限定于此。 任何本领域技术人员， 在 不脱离本发明的精神和范围内， 均可作各种更动与修改， 因此本发明的保护范 围应当以权利要求所限定的范围为准。

Claims

权 利 要 求
1. 一种检测基质内缺陷的方法， 所述基质具有相对的第一表面和第二表面， 所述第一表面上分布多个入射点， 其特征在于， 所述方法包括： 提供检测光束和参考光束； 将所述检测光束自所述基质第一表面的入射点沿光学检测路径入射至 第二表面上与入射点——对应的反射点， 分别以检测光束经过的光学检测 路径上各点处产生的背向散射光的集合作为该点对应的样本光束； 分别采集各样本光束和所述参考光束相互干涉形成的干涉信号， 以获 取光学检测路径上各点的背向散射光的光强信息， 与该光学检测路径上各 点之间的光学长度信息； 根据所述光学检测路径上各点的背向散射光的光强信息， 判断所述光 学检测路径上是否存在缺陷。
2. 根据权利要求 1所述检测基质内缺陷的方法， 其特征在于， 如果所述光学 检测路径上存在缺陷， 根据已知的所属光学检测路径的物理长度、 所述光 学检测路径上各点的背向散射光的光强信息、 所述光学检测路径的光学长 度以及所述基质相对于所述检测光束的折射率， 判断所述缺陷的类型。
3. 根据权利要求 1所述检测基质内缺陷的方法， 其特征在于， 根据所述光学 检测路径上的各点的背向散射光的光强信息确定光学检测路径上的物理界 面的数量。
4. 根据权利要求 2所述检测基质内缺陷的方法， 其特征在于， 所述光学长度 为所述检测光束沿所述光学检测路径传播的距离与所述距离内分布的物质 相对于所述检测光束的折射率的积分。
5. 根据权利要求 1所述检测基质内缺陷的方法， 其特征在于， 所述基质是玻 璃、 塑料、 或玻璃陶瓷或以上材料的复合材料。
6. 根据权利要求 1所述检测基质内缺陷的方法， 其特征在于， 所述检测光束 和参考光束是光源发射的单光束通过分光部件分光形成。
7. 根据权利要求 6所述检测基质内缺陷的方法， 其特征在于， 所述光源具有 相干性， 光源的分辨率为 5微米〜 200微米， 光源功率谱半高宽为 10纳米 -100纳米。
8. 根据权利要求 7所述检测基质内缺陷的方法， 其特征在于， 所述光源的分 辨率为 100微米〜 200微米， 光源功率谱半高宽大于 10纳米。
9. 根据权利要求 1所述检测基质内缺陷的方法， 其特征在于， 所述分别采集 各样本光束和所述参考光束相互干涉形成的干涉信号 , 以获取光学检测路 径上各点的背向散射光的光强信息， 与该光学检测路径的光学长度的信息 的步骤包括： 各样本光束分别和所述参考光束在耦合部件中发生合束且相 互干涉。
10.根据权利要求 1所述检测基质内缺陷的方法， 其特征在于， 分别采集各样 本光束和所述参考光束相互干涉形成的干涉信号， 以获取光学检测路径上 各点的背向散射光的光强信息与该光学检测路径的光学长度信息的步骤是 采用光电探测部件进行的。
11.根据权利要求 1所述检测基质内缺陷的方法， 其特征在于， 根据所述基质 第一表面和第二表面之间至少两个光学检测路径定义相应的连接两个表面 的检测面。
12.根据权利要求 11所述检测基质内缺陷的方法， 其特征在于， 根据检测面上 各光学检测路径上各点的背向散射光的光强信息获取该检测面的检测图 像。
13.根据权利要求 11所述检测基质内缺陷的方法， 其特征在于， 所述检测光束 由点光源或线光源产生。
14.根据权利要求 13所述检测基质内缺陷的方法， 其特征在于， 当检测光束为 点光源发出的光束时， 检测光束沿待分析的检测面与第一表面之间的界线 进行扫描， 通过各入射点逐个入射至第二表面上对应的反射点。
15.根据权利要求 13所述检测基质内缺陷的方法， 其特征在于， 当检测光束为 线光源发出的光束时， 检测光束同时从待分析的检测面与第一表面之间的 界线上各入射点入射至第二表面。
16.根据权利要求 11所述检测基质内缺陷的方法， 其特征在于， 沿与检测面和 第一表面之间的界线垂直的方向扫描获得各检测面的检测图像。
17.一种检测基质内缺陷的方法， 所述基质具有相对的第一表面和第二表面， 其中所述第一表面与所述第二表面分别为所述基质与外界环境的分界面， 其特征在于， 所述方法包括： 提供检测光束与参考光束； 所述检测光束入射于所述第一表面的检测区域内的至少一入射点， 所 述检测光束沿对应的光学检测路径传播至位于所述第二表面的对应于所述 入射点的反射点； 获取分布在所述光学检测路径上各点的背向散射光的光强信息； 以及 根据所述光学检测路径上分布的各点的背向散射光的光强信息确定检 测区域范围内的基质的内部及 /或表面是否存在缺陷。
18.根据权利要求 17所述检测基质内缺陷的方法， 其特征在于，根据所述光学 检测路径上分布的各点的背向散射光的光强信息确定的所述光学检测路径 上分布的各点之间的光学长度信息。
19.根据权利要求 18所述检测基质内缺陷的方法， 其特征在于， 当所述检测区 域范围内的基质的内部及 /或表面存在缺陷时， 采用所述光学检测路径上分 布的各点之间的光学长度信息来确定缺陷的类型。
20.根据权利要求 19所述检测基质内缺陷的方法， 其特征在于， 当缺陷的沿光 学检测路径上的光学长度和缺陷两侧基质沿光学检测路径上的光学长度之 和小于所述光学检测路径的物理长度与基质相对于检测光束的折射率之积 时， 判断所述缺陷为气泡。
21.根据权利要求 20所述检测基质内缺陷的方法， 其特征在于， 还包括： 采用 光学检测路径上分布的各点的背向散射光的光强信息来确定气泡的开闭类 型。
22.根据权利要求 21所述检测基质内缺陷的方法， 其特征在于， 采用下述步骤 来确定气泡的开闭类型： 根据光学检测路径上分布的各点的背向散射光的 光强信息判断所述光学检测路径所经过的物理界面的数量， 并根据所述物 理界面的数量判断气泡的开闭类型。
23.根据权利要求 22所述检测基质内缺陷的方法， 其特征在于， 当所述物理界 面的数量为 4时， 判断所述气泡为封闭气泡； 当所述物理界面的数量小于 4时， 判断所述气泡为开口气泡。
24.根据权利要求 19所述检测基质内缺陷的方法， 其特征在于， 当缺陷沿所述 光学检测路径的光学长度和缺陷两侧基质的沿所述光学检测路径的光学长 度之和大于所述光学检测路径的物理长度与基质相对于所述检测光束的折 射率之积时， 判断所述缺陷为固体缺陷。
25.根据权利要求 18所述检测基质内缺陷的方法， 其特征在于， 当所述检测区 域范围内的基质的内部及 /或表面存在缺陷时， 根据所述光学路径的物理长 度、 所述基质相对于所述检测光束的折射率以及所述光学检测路径上分布 的所述缺陷的光学长度来确定缺陷的折射率。
26.根据权利要求 25所述检测基质内缺陷的方法， 其特征在于， 采用下述步骤 计算缺陷的折射率： 根据分布在缺陷一侧或两侧的基质沿所述光学检测路径的光学长度除 以基质相对于所述检测光束的折射率， 获取分布在缺陷一侧或两侧的沿所 述光学检测路径的基质的物理厚度； 以光学检测路径的物理长度减去分布在缺陷一侧或两侧的沿所述光学 检测路径的基质的物理厚度， 获取所述缺陷的物理厚度； 以及 将缺陷的光学长度除以缺陷的物理厚度， 获得缺陷的折射率。
27.根据权利要求 26所述检测基质内缺陷的方法， 其特征在于， 还包括： 根据 所述缺陷的折射率判断缺陷类型。
28.根据权利要求 18所述检测基质内缺陷的方法， 其特征在于， 所述光学检测 各点之间传播的距离与所述距离内分布的物质相对于所述检测光束的折射 率的积分。
29.根据权利要求 17所述检测基质内缺陷的方法， 其特征在于， 基质是玻璃、 塑料、 或玻璃陶瓷或以上材料的复合材料。
30.根据权利要求 17所述检测基质内缺陷的方法， 其特征在于， 所述第一表面 与所述第二表面两侧的外界环境为相同的介质。
31.根据权利要求 30所述检测基质内缺陷的方法， 其特征在于， 所述外界环境 为空气或水或非腐蚀性气体或非腐蚀性液体。
32.根据权利要求 17所述检测基质内缺陷的方法， 其特征在于， 所述第一表面 与所述第二表面两侧的外界环境为非相同的介质。
33.根据权利要求 32所述检测基质内缺陷的方法， 其特征在于， 所述第一表面 一侧的外界环境为空气； 第二表面与承载台接触， 第二表面一侧的外界环 境是材料为金属或塑料的承载台。
34.—种检测基质内缺陷的装置， 其特征在于， 包括： 光源， 提供单光束； 分光单元， 将单光束分为检测光束和参考光束； 样本光束获取单元， 获取所述检测光束自基质第一表面的入射点至第 二表面上与入射点——对应的反射点经过的光学检测路径上各点处产生的 样本光束； 信号采集单元， 分别采集各样本光束和所述参考光束相互干涉形成的 干涉信号， 以获取光学检测路径上各点的背向散射光的光强信息， 与该光 学检测路径上各点之间的光学长度信息； 缺陷判断单元， 根据所述光学检测路径上各点的背向散射光的光强信 息， 判断所述光学检测路径上是否存在缺陷。
PCT/CN2013/070388 2011-12-20 2013-01-11 一种检测基质内缺陷的方法及装置 Ceased WO2013091584A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110430121.6 2011-12-20
CN201110430121.6A CN103175837B (zh) 2011-12-20 2011-12-20 一种检测基质内缺陷的方法及装置

Publications (1)

Publication Number Publication Date
WO2013091584A1 true WO2013091584A1 (zh) 2013-06-27

Family

ID=48635839

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2013/070388 Ceased WO2013091584A1 (zh) 2011-12-20 2013-01-11 一种检测基质内缺陷的方法及装置

Country Status (2)

Country Link
CN (1) CN103175837B (zh)
WO (1) WO2013091584A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111344559A (zh) * 2018-12-26 2020-06-26 合刃科技（深圳）有限公司 缺陷检测方法及缺陷检测系统
CN116538927A (zh) * 2023-03-08 2023-08-04 上海精测半导体技术有限公司 厚度测量装置及厚度测量方法
CN117871539A (zh) * 2024-03-12 2024-04-12 光越科技(深圳)有限公司 基于光学相干层析成像的激光焊接质量检测系统和方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10241036B2 (en) * 2017-05-08 2019-03-26 Siemens Energy, Inc. Laser thermography
WO2019195955A1 (zh) * 2018-04-08 2019-10-17 雄安华讯方舟科技有限公司 包衣锅的监控系统及监控方法
CN110658196B (zh) * 2018-06-29 2022-07-08 上海微电子装备（集团）股份有限公司 一种缺陷检测装置及缺陷检测方法
CN109283684B (zh) * 2018-09-20 2021-11-19 国营芜湖机械厂 基于Light tools仿真的透明件边缘封闭区观测棱镜的设计方法及棱镜
CN111426273A (zh) * 2019-01-29 2020-07-17 法国圣戈班玻璃公司 用于测量基质的厚度的测量方法和测量装置
CN112147710B (zh) * 2019-06-26 2022-02-18 上海微电子装备（集团）股份有限公司 一种湿法光胶装置的检测方法及检测装置
CN112485261B (zh) * 2020-12-07 2024-07-05 江苏汇鼎光学眼镜有限公司 一种眼镜镜片中微小气泡的检测装置及其检测方法
CN112798628B (zh) * 2021-04-15 2021-06-29 征图新视(江苏)科技股份有限公司 利用oct成像检测工业内部缺陷的可行性验证方法
CN114088734B (zh) * 2021-11-18 2022-06-24 广东电网有限责任公司 一种复合绝缘子内部缺陷检测系统及方法
CN117206717A (zh) * 2023-09-13 2023-12-12 陕西渥特镭铯机械制造有限公司 一种水导激光加工深度检测装置及检测方法
CN120064120B (zh) * 2025-02-24 2025-11-25 武汉市莫雷光电科技有限公司 一种盲孔残胶检测装置及检测方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007171145A (ja) * 2005-12-26 2007-07-05 Canon Inc 検査装置及び方法
CN101251497A (zh) * 2008-03-19 2008-08-27 中国科学院上海光学精密机械研究所 光学玻璃均匀性测试装置及其测试方法
CN101652625A (zh) * 2007-02-21 2010-02-17 康宁股份有限公司 测量玻璃板中缺陷的装置
US20100067020A1 (en) * 2006-06-30 2010-03-18 Oti Ophthalmic Technologies Inc. Compact high resolution imaging apparatus
CN101732035A (zh) * 2009-11-26 2010-06-16 浙江大学 基于光程编码与相干合成的光学超分辨方法及系统
CN102112865A (zh) * 2008-08-05 2011-06-29 原子能与替代能源委员会 利用光学相干断层成像技术测得多孔材料的折射率对多孔材料的密度进行非接触式测量的方法
CN102778460A (zh) * 2012-07-31 2012-11-14 法国圣戈班玻璃公司 一种检测基质内缺陷的方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007171145A (ja) * 2005-12-26 2007-07-05 Canon Inc 検査装置及び方法
US20100067020A1 (en) * 2006-06-30 2010-03-18 Oti Ophthalmic Technologies Inc. Compact high resolution imaging apparatus
CN101652625A (zh) * 2007-02-21 2010-02-17 康宁股份有限公司 测量玻璃板中缺陷的装置
CN101251497A (zh) * 2008-03-19 2008-08-27 中国科学院上海光学精密机械研究所 光学玻璃均匀性测试装置及其测试方法
CN102112865A (zh) * 2008-08-05 2011-06-29 原子能与替代能源委员会 利用光学相干断层成像技术测得多孔材料的折射率对多孔材料的密度进行非接触式测量的方法
CN101732035A (zh) * 2009-11-26 2010-06-16 浙江大学 基于光程编码与相干合成的光学超分辨方法及系统
CN102778460A (zh) * 2012-07-31 2012-11-14 法国圣戈班玻璃公司 一种检测基质内缺陷的方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LIU, JIAN ET AL.: "Research Status of Subsurface Damage Detection Technology of Optical Elements", LASER & OPTOELECTRONICS PROGRESS, 21 July 2011 (2011-07-21), pages 081204 - 4 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111344559A (zh) * 2018-12-26 2020-06-26 合刃科技（深圳）有限公司 缺陷检测方法及缺陷检测系统
CN111344559B (zh) * 2018-12-26 2023-09-15 合刃科技（深圳）有限公司 缺陷检测方法及缺陷检测系统
CN116538927A (zh) * 2023-03-08 2023-08-04 上海精测半导体技术有限公司 厚度测量装置及厚度测量方法
CN117871539A (zh) * 2024-03-12 2024-04-12 光越科技(深圳)有限公司 基于光学相干层析成像的激光焊接质量检测系统和方法
CN117871539B (zh) * 2024-03-12 2024-05-17 光越科技(深圳)有限公司 基于光学相干层析成像的激光焊接质量检测系统和方法

Also Published As

Publication number Publication date
CN103175837A (zh) 2013-06-26
CN103175837B (zh) 2015-06-03

Similar Documents

Publication Publication Date Title
CN103175837B (zh) 一种检测基质内缺陷的方法及装置
US20090213386A1 (en) Apparatus and method for measuring surface topography of an object
KR101987402B1 (ko) 편광픽셀어레이를 이용한 박막과 후막의 두께 및 삼차원 표면 형상 측정 광학 장치
US20080174785A1 (en) Apparatus for the contact-less, interferometric determination of surface height profiles and depth scattering profiles
CN102425998B (zh) 光学元件抛光表面质量全参数检测装置和检测方法
JP4344829B2 (ja) 偏光感受光画像計測装置
CN107144217B (zh) 用于光学元件加工质量在线检测的光纤干涉共焦系统
JP2016521854A (ja) 距離差を取得するための光学測定装置および光学測定方法
CN105588847B (zh) 一种用于近透明矿物质的大深度oct扫描装置及方法
CN102778460A (zh) 一种检测基质内缺陷的方法
CN102494623A (zh) 镜头中光学表面中心间距的非接触式测量方法及测量装置
JP2021530677A (ja) デュアル干渉法試料厚さ計
CN109520973A (zh) 后置分光瞳激光差动共焦显微检测方法及装置
CN116840260B (zh) 晶圆表面缺陷检测方法及装置
CN114894308A (zh) 一种基于低相干干涉的光谱仪标定方法与系统
WO2013118541A1 (ja) 光断層画像測定装置
RU2654379C1 (ru) Мгновенная оптическая когерентная томография во временной области
WO2015154313A1 (zh) 高速多尺度振动和形变检测装置及方法
CN205538736U (zh) 透射双波长合成孔径全息术的光学元件表面疵病检测装置
CN110603423A (zh) 采用时频检测的低相干反射的设备和方法
CN104111243B (zh) 一种荧光比率测量系统及方法
CN118443672B (zh) 一种光学元件缺陷及面形的扫描式明暗场同步干涉测量装置及测量方法
TW201303263A (zh) 光學斷層攝影系統
CN111964580B (zh) 一种基于光杠杆的薄膜位置与角度的检测装置及方法
CN204882405U (zh) 基于oct复信号的玻璃表面真伪缺陷识别系统

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13730457

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13730457

Country of ref document: EP

Kind code of ref document: A1