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WO2013088546A1 - Dispositif à condensateurs et équipement électrique permettant de loger le dispositif à condensateurs - Google Patents

Dispositif à condensateurs et équipement électrique permettant de loger le dispositif à condensateurs Download PDF

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Publication number
WO2013088546A1
WO2013088546A1 PCT/JP2011/078994 JP2011078994W WO2013088546A1 WO 2013088546 A1 WO2013088546 A1 WO 2013088546A1 JP 2011078994 W JP2011078994 W JP 2011078994W WO 2013088546 A1 WO2013088546 A1 WO 2013088546A1
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WO
WIPO (PCT)
Prior art keywords
capacitor
electrode
capacitor device
electrodes
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/078994
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English (en)
Japanese (ja)
Inventor
勇一郎 吉武
越智　健太郎
井上　重徳
加藤　修治
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Hitachi Ltd
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Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2013549018A priority Critical patent/JP5941064B2/ja
Priority to PCT/JP2011/078994 priority patent/WO2013088546A1/fr
Publication of WO2013088546A1 publication Critical patent/WO2013088546A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

Definitions

  • the present invention relates to a capacitor device and an electric device (a power conversion panel, a power conversion unit, and a power conversion unit) that store the capacitor device, and more particularly to a capacitor device that enables high-density mounting and an electric device that stores the capacitor device.
  • capacitors are applied to rapidly supply electrical energy to the electrical circuit.
  • Capacitors are used in a wide variety of electrical equipment such as inverters, circuit breakers, transformers, and high-voltage power supplies. There are various types of capacitors depending on the internal structure. In addition, the specifications of capacitors differ depending on the voltage class and application.
  • a smoothing capacitor is arranged inside the inverter panel or inside the unit cell.
  • the smoothing capacitor an aluminum electrolytic capacitor or a film capacitor is used according to the voltage class.
  • a snubber capacitor may be disposed to reduce the jumping voltage.
  • the above-mentioned smoothing capacitor occupies a large volume ratio in the inverter.
  • the capacitor volume is proportional to the square of the electric field applied to the dielectric between the electrodes.
  • a film capacitor is mainly used because of its high insulating property, but its relative dielectric constant is 2 to 10.
  • the volume ratio is inevitably increased.
  • the capacitor size becomes a major obstacle to downsizing the inverter.
  • ceramic capacitors have a very high dielectric constant, and are used for personal computers and portable terminal devices with low voltage.
  • ceramic materials and capacitor structures for inverters in the high voltage region have been developed, and there is a tendency to reduce the inverter volume.
  • Patent Document 1 a ceramic capacitor is used as the capacitor of the power converter.
  • the ceramic capacitor is protected by a protective device such as a fuse.
  • Ceramic capacitors are limited in size per capacitor from the point of manufacturing process. Considering the DC bias voltage, the capacity of one capacitor when the rated voltage is applied is considered to be about 10 ⁇ F. Since the capacitor applied to the high-voltage inverter has a large capacity and exceeds 1 mF, when a ceramic capacitor is applied, it is necessary to connect in large quantities in parallel.
  • the high-density mounting in this case is a mounting technology including a fuse that performs a capacitor protection function.
  • an object of the present invention is to provide a capacitor device capable of integrating ceramic capacitors at a high density in a capacitor that requires a large capacity, and an electric device that houses the capacitor device. Furthermore, in this high-density mounting, high-density mounting including a protection function is realized.
  • a cube-shaped capacitor having external electrodes on a pair of opposed surfaces is arranged in a vertical and horizontal manner with the opposing surfaces aligned to form a capacitor unit, and the opposing surfaces of a plurality of capacitor units This is achieved by arranging the capacitor electrode so as to connect the common electrode adjacent to one of the shared electrodes to one external terminal.
  • the conventional smoothing capacitor can be miniaturized by the three-dimensional paralleling of ceramic capacitors, and the electrical equipment can be miniaturized.
  • Fig. 2 shows a cross-sectional view of an inverter unit as a typical example of electrical equipment.
  • the structure inside the unit will be described with reference to FIG.
  • Inside the inverter unit 30 are an IGBT 1 that is a semiconductor switching element, a cooling fin 2 that is mounted on the IGBT 1 and dissipates heat generated by the IGBT 1, and an air filter 4 that removes dust and the like from the air sucked into the unit 30.
  • parts such as the bus bar 5 and the capacitor 3 are accommodated.
  • the bus bar 5 electrically connects the positive electrode and the negative electrode of the IGBT 1 and the capacitor 3.
  • the electric device is constituted by a casing as an outer frame, main body devices (IGBT 1, cooling fins 2, air filter 4), and a capacitor device (bus bar 5, capacitor 3).
  • the capacitor 3 used here needs to have a predetermined capacity with a limited volume.
  • the IGBT 1 and the cooling fin 2 occupy the space A on the right half, so it is necessary to arrange the capacitor 3 using the space B on the left half effectively.
  • the inverter unit 30 which is a casing is a cube
  • the space B permitted for mounting the capacitor 3 is also often a cube.
  • the capacity of the capacitor mountable space B varies depending on the capacity of the inverter unit 30. Accordingly, in the present invention, when the capacitor 3 is formed into a cube having a shape matching the capacitor mounting space B, the small-capacity unit capacitor 31 is formed in a cube, and this is three-dimensionally arranged in the vertical, horizontal, and height directions. Stack up to form a capacitor group.
  • the unit capacitor 31 is a ceramic capacitor.
  • FIG. 3 shows an example of the appearance of the unit capacitor 31 configured in a cubic shape.
  • the first and second external electrodes 32 and 33 are arranged to face each other.
  • a plurality of first and second internal electrodes 34 and 35 extend from the first and second external electrodes 32 and 33 respectively in the lateral direction.
  • Each of the first and second external electrodes 32 and 33 and the first and second internal electrodes 34 and 35 has a plate shape, for example, and a cubic portion other than the electrodes is filled with a high dielectric material 36. ing.
  • the first and second external electrodes 32 and 33 are not disposed in the entire left and right regions, but are disposed in a partial region.
  • the hatched lines indicate the first and second external electrodes 32 and 33, and other portions on the left and right surfaces are made of an insulating high dielectric material 36.
  • the internal electrodes 34 and 35 extending in the lateral direction, only one of them is taken out as shown as 35, and the side a in contact with the external electrodes 32 and 33 is a narrow region, and the internal region b
  • the shape is such that a large area can be secured.
  • FIG. 4 functionally shows the positional relationship between the first and second external electrodes 32 and 33 and the first and second internal electrodes 34 and 35 by removing the high dielectric material 36 of the cubic unit capacitor 31. It is a figure. The reason why it is functionally explained is that the unit capacitor 31 is actually stacked to manufacture the unit capacitor 31, and therefore does not actually exist in the form of FIG.
  • first and second external electrodes 32 and 33 are arranged to face each other on a part of the left and right surfaces of the unit capacitor 31, and for example, three each from each of the external electrodes 32 and 33.
  • the plate-like internal electrodes 34 and 35 extend in the lateral direction.
  • Each of the three plate-like internal electrodes 34 and 35 are opposed to each other so as to be sandwiched alternately.
  • the capacitor function is obtained by arranging the layers 35a, 34a, 35b, 34b, 35c, and 34c from the top.
  • a capacitor obtained by adding the above-described characteristic configuration to the known capacitor 31 is used as a unit capacitor, and stacked in the vertical, horizontal, and height directions.
  • FIG. 1 shows an example in which a ceramic capacitor group is used as a specific structural example of the capacitor 3 mounted on the inverter unit 30.
  • the single ceramic capacitor 31 is electrically connected in parallel in the vertical, horizontal, and height directions.
  • the capacitor 3U in FIG. 1 includes four unit capacitors 31 in the direction of FIG. 3 arranged in the X direction and stacked in four stages in the height direction Z, and the capacitor units (31A, 31B). , 31C, 31D), and capacitor units (31A, 31B, 31C, 31D) are assembled in four rows in the Y direction.
  • the right side surface of the capacitor unit 31A is, for example, the second external electrode 32
  • the left side surface that is hidden in the drawing is, for example, the first external electrode 33.
  • This stacked arrangement is performed in the same way for the other capacitor units 31B, 31C, and 31D.
  • the right side surface is the first external electrode 33 and the left side surface is the second external electrode 32. It arrange
  • a shared electrode 37 is disposed between the capacitor units 31A, 31B, 31C, and 31D.
  • the shared electrodes 37AB and 37CD are the first shared electrodes 37 that are connected to the first external power supply of two adjacent sets of capacitor units
  • the shared electrodes 37BC are the two sets of adjacent capacitor units.
  • the right side surface of the finally assembled capacitor 3 has the same potential as the second shared electrode
  • the left side surface of the finally assembled capacitor 3 has the same potential as the first shared electrode. .
  • FIG. 5 is a diagram showing the connection relationship between the structure of the shared electrode and the capacitor unit.
  • the correspondence relationship of 37BC as the shared electrode and 31B as the capacitor unit will be described as an example.
  • the shared electrode 37BC is in contact with the capacitor unit 31A on the back surface, so that the back surface has the same structure as the front surface.
  • the capacitor unit 31B will be described.
  • 16 unit capacitors 31 are stacked vertically and horizontally.
  • external electrodes are arranged on the left and right surfaces of the unit capacitor 31, but the external electrodes are provided not in the entire area of the left and right surfaces but in a partial region.
  • the external electrode 33 appears on the visible side.
  • the four unit capacitor rows (31BZ1) in the height direction of the capacitor unit 31B the external electrodes 3 are arranged so as to come to the same position in the height direction (left side in the height direction in the drawing). This relationship is also maintained for four unit capacitor rows (for example, 31BZ2) in other height directions.
  • the shared electrode 37BC is actually composed of four unit shared electrodes (37BC1, 37BC2, 37BC3, 37BC4) in the height direction in a capacitor unit in which 16 unit capacitors 31 are stacked vertically and horizontally.
  • the unit shared electrode 37BC1 is disposed at a position facing the unit capacitor array 31BZ1
  • the unit shared electrode 37BC2 is disposed at a position facing the unit capacitor array 31BZ2. Since all the unit shared electrodes 37BC have the same configuration, the unit shared electrode 37BC1 will be described as an example here.
  • the unit shared electrode 37BC1 is formed by evaporating two rows of electrodes 22 and 23 on the non-deposited film 25 in the height direction. Thereby, the insulation distance between the base material 29 of the unit shared electrode and the electrodes 22 and 23 and between the electrodes 22 and 23 is secured. Among these, the vapor deposition electrode 22 is in contact with the external electrodes 33 of the four unit capacitor rows 31BZ1 in the height direction of the capacitor unit 31B and is connected. The other vapor deposition electrode 23 comes into contact with a portion of the insulating high dielectric material 36 in the height direction of the capacitor unit 31B, and there is no electrical connection between them.
  • narrow conductive portions 24 are provided between the vapor deposition electrodes 22 and 23 in two rows in the height direction. Further, one or more conducting portions 24 are provided per unit capacitor, preferably the same number.
  • This conduction part 24 fulfills the function of a fuse provided between the vapor deposition electrodes 22, 23, and fulfills the function of fusing with the overcurrent of the unit capacitor 31 to protect the capacitor.
  • the vapor deposition electrodes 22 and 23 in two rows in the height direction are extended to the upper end of the unit shared electrode 37BC1, but the other is not extended to the upper end.
  • Adjacent unit sharing electrodes are vapor deposition electrodes having the same length.
  • the vapor deposition electrodes extending to the upper end are in contact between the unit shared electrode 37BC1 and the adjacent 37BC2
  • the vapor deposition electrodes not extending to the upper end are in contact between the unit shared electrode 37BC2 and the adjacent 37BC3.
  • the vapor deposition electrodes extending to the upper end of the unit shared electrode 37BC1 can be externally connected together with the vapor deposition electrode extending to the upper end on this back surface to constitute an external connection terminal.
  • the common electrode 37AB and the common electrode 37CD are commonly connected to form a first external connection terminal
  • the common electrode 37BC is a second external connection terminal, whereby the capacitor 3 of FIG.
  • the shared electrodes 37 are connected by the bus bar 5, and the external connection is made by the bus bar 5 with the IGBT.
  • capacitors are stacked in the height direction (z direction), the external electrodes of adjacent capacitors are the same, and the potential is the same, so there is no need to secure an insulating space between the capacitors. .
  • the insulation distance increases as the voltage increases. Therefore, it is very effective to eliminate the insulation distance.
  • the insulation distance can be eliminated by making the polarities of the external electrodes of adjacent capacitors adjacent in the horizontal direction (y direction) the same.
  • the shared electrode 37 is provided between the horizontal capacitors. There is also an example in which the shared electrode 37 is not used as shown in Example 4 described later.
  • the external electrodes are assumed to be partial on the surfaces of the external electrodes 32 and 33 that are in contact with the shared electrode 37.
  • the external electrodes 32 and 33 are mainly provided on the entire outer surface of the ceramic dielectric 36.
  • the metal of the external electrodes 32 and 33 of the ceramic capacitor unit 31 silver, copper, aluminum, nickel, and alloys thereof can be considered, but any metal can be used as long as it is a conductive metal. no problem.
  • an electrode forming method a method such as paste, vapor deposition, sputtering, or plating is applied.
  • the external electrodes 32 and 33 are mainly formed of copper paste.
  • silver, copper, aluminum, nickel and alloys thereof may be used for the internal electrode of the ceramic capacitor, but any metal can be used as long as it is a conductive metal.
  • a nickel alloy is mainly used.
  • the characteristics required for the material applied to the high dielectric material 36 filled between the electrodes of the single capacitor 31 are a relative dielectric constant of 500 or more after firing and a distance between electrodes of 0.05 to 0.5 mm. .
  • BaTiO3 series, ZeO-added SiC, SrTiO3 series, ZeO-added SiC, and the like are conceivable.
  • metal is partially applied to the surface of a non-metallic substance.
  • a non-metallic material an epoxy resin, a film, a ceramic, or the like is applied.
  • the surface metal is composed of zinc, silver, copper, aluminum, nickel, and alloys thereof using means such as paste, vapor deposition, sputtering, and plating.
  • a metal is deposited on the film.
  • the material of the film polypropylene, polyethylene, polyethylene terephthalate, polyvinylidene fluoride, polyvinylidene chloride, polyethyl ether ketone, polyether imide, or the like is used, but any film can be used.
  • the vapor deposition metal may be an alloy of zinc and aluminum, or each may be used alone.
  • the electrode of the shared electrode 37 For the surface electrode of the shared electrode 37, a narrow portion is provided in the electrode. In this embodiment, the electrode is divided into two islands 22 and 23, and a thin electrode 24 is used as a bridge. The partial external electrodes 32 and 33 of the ceramic capacitor 31 described above are brought into contact with this one surface. The other is electrically connected to the electrode to the upper bus bar 5.
  • Narrow part 24 is a fuse.
  • the length of the width with respect to the direction in which the current flows determines the electrical resistance of the fuse portion, that is, the short circuit current.
  • the length of the fuse is determined by the creeping insulation distance necessary for the voltage applied between the electrode on the ceramic capacitor connection side and the electrode on the bus bar side.
  • FIG. 6 shows Example 2.
  • the shared electrode 37 is used to provide a fuse function, but the internal electrodes 34 and 35 are used here.
  • the internal region b of the internal electrode 35 is divided into two to form internal regions b1 and b2.
  • a narrow portion 24 is formed between the internal regions b1 and b2.
  • the internal regions b1 and b2 are divided into a side a that contacts the external electrode and a side that does not contact the external electrode. This division position is appropriately determined according to the capacitor capacity and the like.
  • the narrow portion 24 makes it possible to electrically separate the ceramic capacitors in which an abnormality has occurred, and to prevent the entire ceramic capacitor group having a large number of capacitors connected in parallel from being short-circuited.
  • the fuse function using the shared electrode 37 can be used as it is, or the shared electrode 37 can be prevented from having a fuse function.
  • the two vapor deposition electrodes 22 and 23 may be integrated.
  • FIG. 7 shows Example 3.
  • the ceramic capacitor group 3 is sandwiched between the bus bars 5.
  • the capacitor 3 is applied to the insulating space between the bus bars, which has been a dead space, and the space in the inverter 30 can be used effectively, contributing to the downsizing of the inverter.
  • Fig. 8 shows the structure of a ceramic capacitor group for realizing this structure.
  • electrodes connected to the bus bar 5 are arranged vertically. That is, the shared electrodes 37AB and 37CD are taken out from the upper part of the capacitor unit 3U, but the shared electrode 37BC is taken out from the lower part of the capacitor unit 3U, so that a ceramic capacitor group can be arranged in the space between the bus bars 5. become.
  • Example 3 a capacitive shared electrode 370 in which the shared electrode 37 has a capacity is shown in FIG.
  • the capacitance is secured in the ceramic capacitor portion.
  • the capacitance is secured also in the shared electrode portion in addition to this, so that the capacity can be increased.
  • the electrodes 22 and 23 are formed on one or both surfaces of the surface of the film 25 as in the first embodiment. Capacitance can be obtained by alternately stacking the polarities of the electrodes 22 and 23.
  • electrodes connected to the bus bar connected to the IGBT are provided on the upper and lower portions.
  • a technique such as plating, metallicon, or vapor deposition may be used.
  • the eyes are applied.
  • FIG. 10 shows a structure in which the shared electrode 37 including the protection function is eliminated.
  • the electrode 38 is not provided with the vapor deposition electrodes 22 and 23 in two rows in the height direction in FIG. 6 and the narrow conductive portion 24 therebetween.
  • One side is covered with one vapor deposition electrode.
  • the method of the second embodiment in which the internal electrode is provided may be used.
  • this structure can be adopted if the design tolerance of each ceramic capacitor is large and the structure does not cause failure of each capacitor. In order to increase the design margin of individual ceramic capacitors, the distance between the internal electrodes should be kept large.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'objectif de la présente invention est de produire un dispositif à condensateurs capable d'intégrer, à haute densité, des condensateurs céramiques sur un condensateur requérant une capacité importante, et de produire un dispositif électrique permettant de loger le dispositif à condensateurs. L'objectif est aussi de réaliser un montage à haute densité qui comprend une fonction protectrice. L'objet de l'invention est réalisé en configurant le dispositif à condensateurs de sorte que des condensateurs de forme cubique ayant des électrodes externes disposées en paires de surfaces se faisant mutuellement face sont agencées verticalement et horizontalement pour former une unité de condensateurs de sorte que les surfaces se faisant mutuellement face sont alignées entre elles, une pluralité de telles unités de condensateurs sont configurées en couches de sorte que des électrodes partagées sont disposées entre les surfaces se faisant face, et des électrodes partagées adjacentes qui sont séparées l'une de l'autre par une électrode partagée sont connectées à une borne externe.
PCT/JP2011/078994 2011-12-15 2011-12-15 Dispositif à condensateurs et équipement électrique permettant de loger le dispositif à condensateurs Ceased WO2013088546A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013549018A JP5941064B2 (ja) 2011-12-15 2011-12-15 コンデンサ装置及びコンデンサ装置を収納する電気機器
PCT/JP2011/078994 WO2013088546A1 (fr) 2011-12-15 2011-12-15 Dispositif à condensateurs et équipement électrique permettant de loger le dispositif à condensateurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/078994 WO2013088546A1 (fr) 2011-12-15 2011-12-15 Dispositif à condensateurs et équipement électrique permettant de loger le dispositif à condensateurs

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WO2013088546A1 true WO2013088546A1 (fr) 2013-06-20

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015041127A1 (fr) * 2013-09-20 2015-03-26 株式会社村田製作所 Module condensateur et dispositif de conversion d'énergie
JP2015138909A (ja) * 2014-01-23 2015-07-30 京セラ株式会社 複合セラミックコンデンサ、発光装置および携帯端末
KR20190121201A (ko) * 2018-10-10 2019-10-25 삼성전기주식회사 적층 세라믹 전자부품 집합체

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JP2000100654A (ja) * 1998-09-22 2000-04-07 Tokin Corp 積層セラミックコンデンサ
JP2001189233A (ja) * 1999-12-28 2001-07-10 Murata Mfg Co Ltd 積層コンデンサ
WO2007063850A1 (fr) * 2005-11-29 2007-06-07 Kyocera Corporation Composant électronique stratifié et son procédé de fabrication

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JP2006230156A (ja) * 2005-02-21 2006-08-31 Mitsubishi Electric Corp 電力変換装置
JP2008148530A (ja) * 2006-12-13 2008-06-26 Toshiba Corp インバータ装置
JP2010040832A (ja) * 2008-08-06 2010-02-18 Hitachi Aic Inc 金属化フィルムコンデンサ
JP2010123585A (ja) * 2008-11-17 2010-06-03 Maruwa Co Ltd ブロック型コンデンサ

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Publication number Priority date Publication date Assignee Title
JP2000100654A (ja) * 1998-09-22 2000-04-07 Tokin Corp 積層セラミックコンデンサ
JP2001189233A (ja) * 1999-12-28 2001-07-10 Murata Mfg Co Ltd 積層コンデンサ
WO2007063850A1 (fr) * 2005-11-29 2007-06-07 Kyocera Corporation Composant électronique stratifié et son procédé de fabrication

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015041127A1 (fr) * 2013-09-20 2015-03-26 株式会社村田製作所 Module condensateur et dispositif de conversion d'énergie
JP2015138909A (ja) * 2014-01-23 2015-07-30 京セラ株式会社 複合セラミックコンデンサ、発光装置および携帯端末
KR20190121201A (ko) * 2018-10-10 2019-10-25 삼성전기주식회사 적층 세라믹 전자부품 집합체
CN111029144A (zh) * 2018-10-10 2020-04-17 三星电机株式会社 多层陶瓷电子组件阵列
KR102150550B1 (ko) * 2018-10-10 2020-09-01 삼성전기주식회사 적층 세라믹 전자부품 집합체
US10770236B2 (en) 2018-10-10 2020-09-08 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component array
CN111029144B (zh) * 2018-10-10 2023-02-03 三星电机株式会社 多层陶瓷电子组件阵列

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