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WO2013080370A1 - Dispositif d'amortissement du son d'un piano - Google Patents

Dispositif d'amortissement du son d'un piano Download PDF

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Publication number
WO2013080370A1
WO2013080370A1 PCT/JP2011/077925 JP2011077925W WO2013080370A1 WO 2013080370 A1 WO2013080370 A1 WO 2013080370A1 JP 2011077925 W JP2011077925 W JP 2011077925W WO 2013080370 A1 WO2013080370 A1 WO 2013080370A1
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WIPO (PCT)
Prior art keywords
string
buffer
buffer member
sound
hammer head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/077925
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English (en)
Japanese (ja)
Inventor
忠之 田上
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Individual
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Individual
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Priority to PCT/JP2011/077925 priority Critical patent/WO2013080370A1/fr
Publication of WO2013080370A1 publication Critical patent/WO2013080370A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10C—PIANOS, HARPSICHORDS, SPINETS OR SIMILAR STRINGED MUSICAL INSTRUMENTS WITH ONE OR MORE KEYBOARDS
    • G10C3/00—Details or accessories
    • G10C3/16—Actions
    • G10C3/166—Actions for damping the strings

Definitions

  • the present invention relates to a piano weak sound device.
  • a buffer member provided on a muffler rail is interposed between a hammer head and a string and the string is hit by the hammer head via the buffer member when playing a weak sound.
  • the volume at the time of stringing is reduced.
  • a single buffer member is provided so as to be able to contact a string in a specific sound range.
  • one buffer member 1120 provided on the muffler rail 1110 is provided between a plurality of hammers 1220 and a plurality of strings (not shown).
  • the buffer member 1120 is not only the string of the sounds C and E, It also comes into contact with the strings of the notes C #, D, E ⁇ between the strings of the notes C, E.
  • the sounds C #, D, and E ⁇ sound a little at the same time as the sounds C and E, and thus there is a problem that a dissonance is generated.
  • the buffer member formed of felt or the like.
  • the strength of the buffer member increases as the thickness of the buffer member increases. Therefore, when a plurality of sounds are played simultaneously, there is a problem that the strength of contact between the sound string and the buffer member between the sounds increases, and the volume of the dissonance generated thereby increases.
  • the present invention has been made in view of the above-described circumstances, and an object thereof is to provide a piano sound attenuation device capable of preventing the sound of strings other than a desired string from sounding during performance of weak sounds. To do.
  • a piano sound attenuation apparatus is: A piano sound reduction device including a plurality of buffer portions provided so as to be parallel to each of a plurality of hammer heads in a one-to-one correspondence, The hammer head strikes a string through the corresponding buffer; It is characterized by that.
  • An additional buffer member provided in the buffer section may strike a string through the corresponding buffer portion and the additional buffer member provided in the buffer portion.
  • a part of the additional buffer member may be fixed to the buffer member.
  • the additional buffer member is: When viewed from the axial direction perpendicular to the surface on which the string is stretched, the corresponding hammerhead strikes the string that is hit and the string adjacent to the string, A notch provided on a surface facing the adjacent string and capable of receiving at least a part of the adjacent string in a non-contact state when the corresponding hammerhead is in contact with the string; You may have.
  • the additional buffer member may be made of a felt material, and may have a fiber cutting portion in which a fiber constituting the felt material is cut on a surface that comes into contact with the string when the string is hit.
  • the additional buffer member provided in the buffer portion corresponding to the hammer head that strikes a low-frequency string is the additional buffer member provided in the buffer portion corresponding to the hammer head that strikes a high-frequency string. It may be thicker.
  • the buffer unit includes a first buffer unit provided with the additional buffer member and a second buffer unit provided with no additional buffer member, and the hammer head includes the first buffer unit and the additional buffer unit. It may be possible to move between a position where the hammer head strikes via the part and a position where the hammer head strikes via the second buffer part.
  • the additional buffer member includes a first additional buffer part having a predetermined thickness and a second additional buffer part thicker than the predetermined thickness, and the hammer head includes the buffer part and the first additional buffer part. You may move between the position which hits via a buffer part, and the position where the hammer head hits via the buffer part and the 2nd additional buffer part.
  • the piano weak sound device is a weak sound device provided in a grand piano, You may further provide the core material provided in the said buffer part so that it may extend in parallel with the longitudinal direction of a keyboard.
  • the buffer portion may be able to bend and stretch along the longitudinal direction of the keyboard.
  • a piano weak sound device that can prevent a string striking sound other than a desired string from sounding during a weak sound performance.
  • FIG. 1 is a perspective view of a main part of a sound attenuation device according to Embodiment 1.
  • FIG. It is a schematic diagram showing the positional relationship between a string and a single sound buffer member in a state before a hammer head strikes the string during a weak sound performance. It is a schematic diagram showing the positional relationship between a string and a single sound buffer member in a state where a hammer head strikes the string during a weak sound performance. It is a figure showing the positional relationship of three adjacent single sound buffer members and a string seen from the front.
  • FIG. 7B is a cross-sectional view taken along line AA in FIG. 7A. It is a figure showing the positional relationship of the buffer member which concerns on the modification 1 of Embodiment 2, an additional buffer member, and a string.
  • FIG. 8B is a cross-sectional view of a main part taken along a cutting line BB in FIG. 8A when the hammer head strikes a string. It is a perspective view of an additional buffer member.
  • FIG. 11B is a sectional view taken along the section line CC in FIG. 11A. It is principal part sectional drawing of the action mechanism and damper mechanism of a grand piano with which the low sound apparatus which concerns on Embodiment 3 and the low sound apparatus were provided.
  • FIG. 6 is a top view of a main part of a buffer unit according to Embodiment 3.
  • FIG. 13B is a cross-sectional view taken along the cutting line DD in FIG. 13A. It is a figure which shows an example of the manufacturing method of a buffer part provided with the core material which concerns on the modification 1 of Embodiment 3.
  • FIG. It is a figure which shows an example of the manufacturing method of a buffer part provided with the core material which concerns on the modification 1 of Embodiment 3.
  • FIG. It is a figure which shows the state at the time of the normal performance of the buffer part which concerns on the modification 2 of Embodiment 3.
  • FIG. It is a figure which shows the state at the time of the weak sound performance of the buffer part which concerns on the modification 2 of Embodiment 3.
  • FIG. 1 is a cross-sectional view of a main part of a weak sound device 1 according to the first embodiment and an action mechanism 2 and a damper mechanism 3 of an upright piano provided with the weak sound device 1.
  • FIG. 2 is a perspective view of main parts of the sound attenuation device 1 according to the first embodiment.
  • the action mechanism 2 operates in conjunction with the keyboard 4 and strikes the corresponding string 5.
  • the action mechanism 2 is provided on an action rail 6 that extends along the direction in which the keyboards 4 are arranged side by side.
  • the action mechanism 2 is configured in a known manner from the wiper 21, the hammer 22, the jack 23, and the like.
  • the wipen 21 rises, and the jack 23 raised together with the wipen 21 pushes up the hammer bat 24 provided at the lower end of the hammer 22.
  • the hammer 22 rotates in the direction of arrow A1 (counterclockwise) in FIG. 1, and the hammer 5 provided at the upper end of the hammer 22 strikes the string 5 corresponding to the keyboard 4 on which the key is pressed. To do.
  • the damper mechanism 3 includes a damper lever 31, a damper wire 32, a damper head 33, and the like as is well known.
  • the damper lever 31 is pivotally supported by the action rail 6 at its intermediate portion. Further, since the damper lever 31 is urged counterclockwise by the damper spring 34, the damper head 33 abuts on the string 5 and suppresses free vibration of the string 5. In this state, when the keyboard 4 is pressed down, the damper spoon 35 provided on the wiper 21 presses the lower end portion of the damper lever 31. The damper lever 31 rotates against the urging force of the damper spring 34, and the damper head 33 is temporarily separated from the string 5. Since the hammer head 25 strikes the string 5 while the damper head 33 is away from the string 5, the string 5 can emit sound without being restrained from free vibration.
  • the above-described action mechanism 2 and damper mechanism 3 have the same configuration as the action mechanism and damper mechanism of a conventional upright piano.
  • the weak sound device 1 When the hammer head 25 strikes the string 5, the weak sound device 1 is interposed between the hammer head 25 and the string 5, thereby attenuating the impact force applied to the string 5 by the hammer head 25, and the sound generated by the string 5. Is weakening.
  • the weak sound device 1 includes a normal performance in which the hammer head 25 operating in conjunction with the key pressing operation of the keyboard 4 directly strikes the string 5 and a buffer member interposed between the hammer head 25 and the string 5.
  • the hammer head 25 is configured to be able to selectively switch between the weak sound performance of hitting the string 5.
  • the direction from the action mechanism 2 toward the string 5 left side in FIG. 1) is the rear, and the opposite direction (right side in FIG. 1) is the front.
  • the sound attenuation device 1 includes a muffler rail 110, a plurality of single sound absorbing members 120, and a moving device (not shown).
  • the muffler rail 110 is a rail for supporting a plurality of single sound absorbing members 120, and is an L-shaped cross section that extends in the direction in which the keyboards 4 are juxtaposed as shown in FIG.
  • the muffler rail 110 can be moved by a moving device between a position during normal performance (a position indicated by a two-dot chain line in FIG. 1) and a position during a weak sound performance (a position indicated by a solid line in FIG. 1).
  • the single-tone buffer member 120 is interposed between the hammer head 25 and the string 5 during a weak sound performance, and functions as a buffer unit that weakens the sound emitted by the string 5 by alleviating the collision between the hammer head 25 and the string 5.
  • the single sound absorbing member 120 is formed in a strip shape from a cushioning sheet material such as a felt material.
  • FIG. 3A and 3B are schematic views showing the positional relationship between the string 5 and the single-tone buffer member 120 in FIG.
  • FIG. 3A shows a state before the hammer head 25 strikes the string 5
  • FIG. 3B shows a state where the hammer head 25 strikes the string 5 via the single sound absorbing member 120.
  • the single sound buffer member 120 is located at a predetermined distance x (for example, 15 mm) away from the string 5 during the performance of a weak sound.
  • x for example, 15 mm
  • the single sound buffer member 120 is bent as shown in FIG. 3B and comes into contact with the string 5 from the state where it hangs downward as shown in FIG. 3A.
  • the operation of returning to the state shown in FIG. 3A is repeated again. Therefore, it is preferable that the single sound absorbing member 120 has a thickness that has durability against such a repeated bending operation and has a flexibility that can be easily returned from the bent state to the state before the bending.
  • the thickness of the single sound absorbing member 120 may be changed according to the sound range of the string 5 hit by the corresponding hammer head 25. Specifically, the thickness of the single sound buffer member 120 corresponding to the hammer head 25 that strikes the string 5 on the high sound side is equal to the thickness of the single sound buffer member 120 corresponding to the hammer head 25 that strikes the string 5 on the low sound side. The thinner one is preferable. For example, when the strings 5 stretched on the piano are divided into three groups, a high range group, a mid range group, and a low range group, according to the range of the sound to be emitted, the hammer head 25 that strikes the strings 5 of each group.
  • the single sound-absorbing members 120 corresponding to 1 have thicknesses of 1 mm, 2 mm, and 2 mm, respectively.
  • the single sound buffer member 120 is provided on the muffler rail 110 so as to be parallel to each of the plurality of hammer heads 25 in a one-to-one correspondence.
  • 88 muffler rails 110 are provided on the muffler rail 110 in correspondence with 88 hammerheads 25.
  • the single sound buffer member 120 is fixed to the surface of the muffler rail 110 facing the string 5 at one end thereof with an adhesive, a double-sided tape, or the like.
  • FIG. 4 is a diagram showing the positional relationship between the three adjacent single sound absorbing members 120a to 120c and the strings 5a to 5c as viewed from the front.
  • the strings 5a to 5c are each composed of three strings that emit the same sound.
  • the three strings constituting the strings 5a to 5c are simultaneously hit by the corresponding hammer head 25 (see FIG. 1) to emit one sound.
  • the sound emitted from the string 5b is half a tone lower than the sound emitted from the string 5a, and the sound emitted from the string 5c is higher than the sound emitted from the string 5a.
  • the single sound buffer member 120a is between the corresponding hammer head 25 and the string 5a
  • the single sound buffer member 120b is between the corresponding hammer head 25 and the string 5b
  • the single sound buffer member 120c is Are respectively interposed between the corresponding hammerhead 25 and the string 5c.
  • the single sound buffer members 120a to 120c are provided with a gap having a predetermined width d (for example, 1 mm) in the parallel direction of the keyboard 4 (see FIG. 1).
  • the single sound absorbing members 120a to 120c overlap with the strings 5a to 5c hit by the corresponding hammer head 25 and are adjacent to the strings 5a to 5c hit by the corresponding hammer head 25 when viewed from the front. It has a width that does not overlap with 5c.
  • the single sound absorbing member 120a overlaps with all three strings constituting the string 5a when viewed from the front.
  • the single sound absorbing member 120a does not overlap any of the strings constituting the adjacent strings 5b and 5c when viewed from the front. Therefore, when the hammer head 25 strikes the string 5a via the single sound buffer member 120a, the single sound buffer member 120a is pressed by the hammer head 25 and moves rearward to contact the string 5a, but the strings 5b, 5c Does not touch.
  • the moving device moves the muffler rail 110 in the direction of arrow B1 in FIG. 1, that is, in the vertical direction in accordance with a user operation.
  • the moving device is realized by a known mechanism that moves the muffler rail 110 in the vertical direction by operating a pedal. For example, when the pedal is not operated, the muffler rail 110 is located at a position indicated by a two-dot chain line in FIG. Further, in a state where the pedal is operated, the muffler rail 110 moves downward and is located at a position indicated by a solid line.
  • the muffler rail 110 and the single sound buffer member are arranged so that the single sound buffer member 120 is interposed between the hammer head 25 and the string 5 when the hammer head 25 strikes the string 5.
  • 120 is located (see the position of the solid line in FIG. 1).
  • the keyboard 4 is depressed, the hammer head 25 corresponding to the depressed keyboard 4 is rotated toward the string 5 by the known action mechanism 2. Then, the hammer head 25 strikes the string 5 via the corresponding single sound buffer member 120. Therefore, the sound emitted from the struck string 5 is weakened by the single sound buffer member 120.
  • the muffler rail 110 and the single sound buffer member are arranged so that the single sound buffer member 120 is not interposed between the hammer head 25 and the string 5 when the hammer head 25 strikes the string 5.
  • 120 is located (see the position of the two-dot chain line in FIG. 1).
  • the keyboard 4 is depressed, the hammer head 25 corresponding to the depressed keyboard 4 is rotated toward the string 5 by the known action mechanism 2.
  • the hammer head 25 strikes the string 5 without using the corresponding single sound buffer member 120. Therefore, the struck string emits a sound without being weakened by the single sound buffer member 120.
  • the sound attenuation device 1 includes the plurality of single sound absorbing members 120 provided so as to be parallel to each of the plurality of hammer heads 25 in a one-to-one correspondence.
  • the hammer head 25 strikes the string 5 via the corresponding single sound buffer member 120.
  • the single sound absorbing member 120 does not contact the adjacent string 5 hit by the corresponding hammer head 25, it is possible to prevent the generation of dissonance.
  • the structure of the single sound buffer member 120 is not restricted to this.
  • the single sound absorbing member 120 may be formed by superposing a plurality of sheet materials. Thereby, compared with the case where it forms from one sheet
  • the entire thickness of the single sound absorbing member 120 formed of a plurality of sheet materials as described above satisfies the durability and flexibility conditions described in the first embodiment.
  • FIG. 5 shows a perspective view of a main part of a sound attenuator 1a according to this modification.
  • the sound attenuation device 1 a according to the present modification is implemented in that a buffer member 130 integrally including a plurality of single sound buffer portions 132 is provided instead of the plurality of single sound buffer members 120 in the first embodiment. It differs from the weak sound device 1 according to the first embodiment.
  • the shock-absorbing member 130 has a base 131 and a plurality of single-tone shock-absorbing parts 132, and is integrally formed from, for example, a cushioning sheet material such as a felt material.
  • the base 131 is provided along the muffler rail 110 and is fixed to the surface of the muffler rail 110 facing the string 5 with an adhesive, a double-sided tape, or the like.
  • the single sound buffer 132 is formed so as to extend downward from the base 131 so as to be parallel to each of the plurality of hammer heads 25 in a one-to-one correspondence.
  • the single sound buffer 132 is interposed between the hammer head 25 and the string 5 when the hammer head 25 strikes the string 5 during the performance of a weak sound, and alleviates the collision between the hammer head 25 and the string 5. It functions as a buffer unit that weakens the sound emitted by the string 5.
  • the single sound buffer 132 is formed to have the same function as the single sound buffer member 120 in the first embodiment. That is, the single sound buffer 132 is formed with a gap of a predetermined width (for example, 1 mm) from each other in the parallel arrangement direction of the keyboard 4. Further, each of the single sound buffer portions 132 has a width so as to overlap the string 5 hit by the corresponding hammer head 25 and not overlap the adjacent string 5 hit by the corresponding hammer head 25 when viewed from the front. Have. Accordingly, when the hammer head 25 strikes the string 5 through the single sound buffer 132, the single sound buffer 132 is pressed by the hammer head 25 and moves backward, and the hammer head 25 contacts the string 5 to be hit. The string 5 and the adjacent string 5 do not contact each other.
  • a predetermined width for example, 1 mm
  • the sound attenuator 1a includes the plurality of single sound buffer portions 132 having the same functions as the single sound buffer member 120 in the first embodiment. Therefore, when playing the weak sound, when the hammer head 25 strikes the string 5 via the corresponding single sound buffer 132, the single sound buffer 132 is placed on the string 5 adjacent to the string 5 hit by the corresponding hammer head 25. Since there is no contact, the generation of dissonance can be prevented.
  • the sound attenuator 1a includes a buffer member 130 in which a plurality of single sound buffer portions 132 are integrally formed. Accordingly, the positions of the plurality of single sound buffer portions 132 are finely adjusted (specifically, so that the plurality of single sound buffer portions 132 are interposed between the corresponding hammerheads 25 and the strings 5 during the weak sound performance, respectively. (Adjustment of 1 mm or less) The position where the base 131 of the buffer member 130 is fixed to the muffler rail 110 may be finely adjusted. Therefore, as in the first embodiment, the positions of the plurality of single sound buffer portions 132 can be finely adjusted at a time more easily than when the plurality of single sound buffer members are not integrally formed.
  • Embodiment 2 of the present invention will be described.
  • the buffer member 130 of the sound attenuator 1a according to the modification of the first embodiment further includes another buffer member
  • the same reference numerals are used for configurations having the same functions as those in the first embodiment and the modifications thereof, and detailed description thereof is omitted.
  • FIG. 6 shows a perspective view of main parts viewed from the rear side of the sound attenuation device 1b according to the second embodiment.
  • the sound attenuation device 1 b according to the second embodiment includes a plurality of additional buffer members provided at lower ends of the surfaces of the plurality of single sound buffer units 132 facing the strings 5 in the modification of the first embodiment. 140.
  • FIG. 7A is a plan view of one single sound buffer 132 and the additional buffer member 140 viewed from the rear
  • FIG. 7B is a cross-sectional view taken along the cutting line AA in FIG. 7A.
  • the additional buffer member 140 is formed in a strip shape from a cushioning sheet material such as a felt material, for example.
  • the width of the additional buffer member 140 is a width that does not contact the adjacent additional buffer member 140, and specifically, is the same as the width of the single sound buffer portion 132 or narrower than the single sound buffer portion 132.
  • the additional buffer member 140 is formed from a material having a thickness greater than that of the buffer member 130.
  • the upper surface of the additional buffer member 140 facing the single sound buffer portion 132 is fixed to the single sound buffer portion 132 by an adhesive portion 141 made of an adhesive, double-sided tape, or the like. Is done. Therefore, as shown in FIG. 7B, a gap 142 is formed at a portion where the adhesive portion 141 between the buffer member 130 and the additional buffer member 140 is not interposed.
  • the sound attenuation device 1b includes the plurality of additional buffer members 140 provided at the lower ends of the surfaces of the plurality of single sound buffer units 132 facing the strings 5 respectively. Therefore, the hammer head 25 strikes the string 5 via the additional buffer member 140 in addition to the buffer member 130. At this time, since not only the buffer member 130 but also the additional buffer member 140 absorbs the energy of the hammer head 25, the sound effect is further reduced as compared with the case where only the buffer member 130 is interposed between the string 5 and the hammer head 25. Can be increased.
  • a gap 142 is formed between the surfaces of the additional buffer member 140 and the buffer member 130 that are not fixed to each other. Therefore, since the air layer formed in the gap 142 absorbs the energy of the hammer head 25, the sound-damping effect is further enhanced as compared with the case where only the buffer member 130 is interposed between the string 5 and the hammer head 25. Can do.
  • the additional buffer member 140 fixed to the single sound buffer portion 132 acts as a weight, when the hammer head 25 strikes the string 5 via the single sound buffer portion 132 and the additional buffer member 140 during a weak sound performance, The buffer part 132 can be easily returned to the original position after being bent by being pressed by the hammer head 25.
  • attached with the buffer member 130 by the adhesion part 141 of the additional buffer member 140 is so preferable that it is small.
  • one additional buffer member 140 is provided in the single sound buffer unit 132.
  • a plurality of additional buffer members may be stacked and provided in the single sound buffer unit 132.
  • the plurality of additional cushioning members that are overlaid may be fixed to each other in part.
  • FIG. 8A is a diagram showing the positional relationship between the buffer member 130 and the additional buffer member 150 according to this modification and the strings 5d and 5e, as viewed from the rear
  • FIG. 8B is a diagram when the hammer head 25 strikes the string 5d
  • FIG. 9 is a cross-sectional view of the main part taken along the cutting line BB of 8A
  • FIG. 9 is a perspective view of the additional buffer member 150.
  • some strings are slanted from the vertical direction as shown in FIG. 8A. Therefore, when viewed from the front, the single sound buffer 132 overlaps not only the string 5d hit by the corresponding hammer head 25 but also the string 5e adjacent to the string 5d.
  • the additional buffer member 150 in the present modification is a cut-off for preventing contact between the additional buffer member 150 and the string 5e that has been moved backward by being pressed by the hammer head 25 when the hammer head 25 strikes the string 5d. It has a notch 151.
  • the notch 151 is formed to be recessed forward from the surface 152 with which the string 5d contacts and over the entire width direction of the additional buffer member 150.
  • the lower surface 153 constituting the notch 151 is inclined in the vertical direction along the direction in which the strings 5d and 5e are stretched.
  • the depth of the notch 151 is such a depth that the additional cushioning member 150 that has been pressed backward by the hammer head 25 and moved rearward does not come into contact with the string 5e.
  • the additional buffer member 150 in this modification has the notch 151, as shown in FIG. 8B, when the hammer head 25 strikes the string 5d, the hammer head 25 is adjacent to the string 5d to strike.
  • the string 5e and the additional buffer member 150 are not in contact with each other, and dissonance can be prevented.
  • the additional buffer member 150 may be configured by stacking a plurality of felt materials, but is preferably configured of a single felt material. Thereby, the fall of the cushioning property by hardening of the adhesive agent required when piled and fixing a some felt material can be prevented.
  • the additional cushioning member 140 according to the second embodiment may have a fiber cutting portion in which a fiber constituting the felt material is cut on a surface in contact with the string 5.
  • 10A and 10B are plan views of the additional cushioning member having an example of the fiber cutting portion as seen from the rear.
  • a mesh-like slit 161 is formed on the surface in contact with the string 5 as an example of a fiber cutting part.
  • the direction in which the slit 161 is formed is preferably inclined with respect to the direction in which the string 5 is stretched.
  • the additional buffer member 160 when the additional buffer member 160 is pressed by the hammer head 25 and comes into contact with the string 5 during the performance of a weak sound, the string 5 bites into the slit 161, and the buffer member 130 and the additional buffer member 160 are in their original positions. Can be prevented from returning to.
  • the additional buffer member 170 shown in FIG. 10B has a plurality of small holes 171 formed by needling or the like on the surface in contact with the string 5 as an example of a fiber cutting portion. Thereby, the cushioning properties of the additional buffer members 160 and 170 can be further enhanced.
  • the strings 5 stretched on the piano are divided into three groups, a high range group, a mid range group, and a low range group, according to the range of the sound to be emitted, the hammer head 25 that strikes the strings 5 of each group.
  • the thickness of the cushioning member 130 and the additional cushioning member corresponding to the above may be made thinner as the sound range is higher. Further, in each sound range group, groups may be further divided according to the sound range, and the higher the sound range, the thinner the group.
  • Table 1 shows an example of the thickness of the buffer member 130 and the additional buffer member 140 when the strings 5 are divided into a plurality of groups according to the sound range.
  • the strings 5 are grouped into first to fourth high sound range groups obtained by dividing the high sound range group into four groups according to the sound range, a middle sound range group, and a low sound range group.
  • the additional buffer member 140 having a thickness of 1 mm and the additional buffer member 140 having a thickness of 4 mm are overlapped.
  • the thickness of the buffer member 130 and the additional buffer member 140 of each group is set so that the total thickness becomes thinner as the sound range is higher. Is selected.
  • the thickness of the additional buffer member 14 corresponding to the hammer head 25 that strikes the string 5 on the high sound range side is greater than the thickness of the additional buffer member 14 corresponding to the hammer head 25 that strikes the string 5 on the low sound side.
  • the weak sound effect by the additional buffer member 140 in the high sound region is made smaller than the weak sound effect by the additional buffer member 140 in the low sound region. As a result, it is possible to reduce the volume difference between the sound emitted by the high-frequency string after the weak sound and the sound emitted by the low-frequency string.
  • the weak sound device 1b is configured to be able to switch between the two performance states of the normal performance and the weak sound performance by the moving device.
  • the switchable performance state is not limited to this.
  • a plurality of weak sound performances having different weak sound effects may be switched.
  • FIG. 11A and FIG. 11B show an example of a buffer member and an additional buffer part that can switch the sound effect.
  • FIG. 11A is a plan view of the buffer member and the additional buffer member according to this modification as seen from the rear
  • FIG. 11B is a cross-sectional view taken along the section line CC of FIG. 11A.
  • the additional buffer member 180 is located above the single sound buffer 132.
  • the moving device includes the positions of the buffer member 130 and the additional buffer member 180, (1) the position where the buffer member 130 and the additional buffer member 180 are interposed between the hammer head 25 and the string 5, and (2) the buffer member. It is possible to switch between three positions: a position where 130 is interposed between the hammer head 25 and the string 5, and a position where the buffer member 130 and the additional buffer member 180 are not interposed between the hammer head 25 and the string 5. It is configured.
  • the weak sound device can perform the weak sound performance with the weak sound effect smaller than the position (1) and the position (1) where the weak sound performance with the predetermined weak sound effect is possible.
  • the position and the position (3) where normal performance is possible it is possible to switch a plurality of weak performances having different weak effects.
  • a plurality of additional buffer members 180 having different thicknesses are arranged side by side in the moving direction of the moving device.
  • the moving device includes the buffer member 130 and the additional buffer member 180, and each additional buffer portion 180 includes the hammer head 25 and the string 5. It may be configured to be movable to a position interposed between the two. Thereby, it is possible to switch a plurality of weak sound performances having different weak sound effects.
  • FIG. 12 is a cross-sectional view of main parts of the sound attenuation device 1d according to the third embodiment and the action mechanism 2d and the damper mechanism 3d of the grand piano provided with the sound attenuation device 1d.
  • symbol is used. Detailed description thereof will be omitted.
  • the action mechanism 2 a operates in conjunction with the keyboard 4 and strikes the corresponding string 5.
  • the action mechanism 2a is provided on an action rail 6 that extends along the direction in which the keyboards 4 are arranged side by side.
  • the action mechanism 2a is configured in a known manner from the wiper 21, the hammer 22, the jack 23, and the like.
  • the wipen 21 rises, and the jack 23 raised together with the wipen 21 pushes up the hammer roller 26 of the hammer 22.
  • the hammer 22 rotates in the direction of arrow A2 (clockwise) in FIG. 12, and the hammer head 25 provided at the end of the hammer 22 strikes the string 5 corresponding to the keyboard 4 on which the key is pressed. .
  • the damper mechanism 3a is configured in a known manner from a damper lever 31, a damper wire 32, a damper head 33, and the like.
  • the damper lever 31 is pivotally supported by the damper rail 7 so as to be rotatable in the vertical direction.
  • the damper head 33 normally presses the string 5 from above and suppresses free vibration of the string 5. In this state, when the keyboard 4 is pushed down, the damper lever 31 is rotated counterclockwise by the keyboard 4 via the damper spoon 35. Then, the damper head 33 rises and temporarily leaves the string 5. Since the hammer head 25 strikes the string 5 while the damper head 33 is away from the string 5, the string 5 can emit sound without being restrained from free vibration.
  • the action mechanism 2a and the damper mechanism 3a described above have the same configuration as the action mechanism and the damper mechanism of the conventional grand piano.
  • the weak sound device 1 d When the hammer head 25 strikes the string 5, the weak sound device 1 d is interposed between the hammer head 25 and the string 5, so that the impact force applied to the string 5 by the hammer head 25 is attenuated, and the sound generated by the string 5 Is weakening.
  • the weak sound device 1d is configured to be able to selectively switch between the normal performance and the weak sound performance as in the first and second embodiments and the modifications thereof.
  • the direction from the action mechanism 2a toward the string 5 left side in FIG. 12
  • the opposite direction right side in FIG. 12
  • the sound attenuating device 1 includes a muffler rail 110, a buffer 190, and a moving device (not shown).
  • the moving device rotates the muffler rail 110 in the arrow B2 direction. Therefore, the muffler rail 110 can be moved between a position during normal performance (a position indicated by a two-dot chain line in FIG. 12) and a position during a weak sound performance (a position indicated by a solid line in FIG. 12). is there.
  • the moving apparatus is configured in the same manner as in the first and second embodiments and the modifications thereof.
  • FIG. 13A is a top view of the main part of the buffer portion 190 according to the present embodiment
  • FIG. 13B is a cross-sectional view taken along the section line DD in FIG. 13A
  • the buffer portion 190 includes a buffer member 191, an additional buffer member 192, and a core material 193.
  • the buffer member 191 and the additional buffer member 192 are the same as the buffer member 130 and the additional buffer member 140 in the second embodiment except that the string 5 extends in a substantially horizontal plane in accordance with the string 5 being stretched in a substantially horizontal plane. It is comprised similarly.
  • the core material 193 is formed in a rod shape from, for example, a cardboard, a resin plate such as a plastic plate, a wire, or the like.
  • the core material 193 is fixed to the buffer member 191 so as to be positioned along the approximate center in the longitudinal direction of the plurality of single sound buffer portions 191a.
  • the buffer portion 190 includes a core material so that the buffer member 191 can be maintained in a substantially horizontal state (longitudinal direction of the keyboard 4). Therefore, it is possible to prevent the buffer member 191 from hanging down due to its own weight and coming off from between the hammer head 25 and the string 5 during a weak sound performance.
  • the buffer portion 190 is formed by providing the rod-shaped core member 193 along the approximate center in the longitudinal direction of the center of the single sound buffer portion 191a. It is not limited to this.
  • FIG. 14A and FIG. 14B show an example of a method for manufacturing the buffer portion including the core material according to this modification. First, as shown in FIG. 14A, the felt material 191a constituting the buffer member 191 and the thick paper 194b constituting the core material 194 having the same size are bonded together with an adhesive, a double-sided tape or the like. And as shown to FIG.
  • the buffer part 190 provided integrally with the buffer member 191 and the core material 194 is formed by forming a slit by predetermined spacing.
  • the thickness of the thick paper 194b is preferably about 0.1 to 0.2 mm.
  • the buffer 190 moves between a position extending downward and a position extending horizontally as the muffler rail 110 rotates, as shown in FIG.
  • the operation of the buffer portion 190 accompanying the rotation of the muffler rail 110 is not limited to this.
  • an example of a buffer portion that performs a bending / extending operation as the muffler rail 110 rotates will be described.
  • FIG. 15A is a diagram illustrating a state of the buffer unit 200 according to the present modification example during a normal performance
  • FIG. 15B is a diagram illustrating a state of the buffer unit 200 according to this variation example during a weak sound performance.
  • the buffer unit 200 includes a buffer member 210 and an additional buffer member 220.
  • the buffer member 210 and the additional buffer member 220 are the same as the buffer member 191 and the additional buffer member 192 in Embodiment 3 except that the buffer member 210 is bent during normal performance. It is comprised similarly.
  • the buffer member 210 moves from the bent state so as to extend in the direction of arrow C2.
  • the buffer member 210 is positioned so as to extend in the horizontal direction (longitudinal direction of the keyboard 4).
  • the buffer member 210 moves in the direction opposite to the arrow C2 from the state extending in the horizontal direction. Bend as shown at 15A.
  • the buffer unit 200 may not include a core material.
  • the buffer unit 200 may include a spring member that can be deformed into a bent state and a stretched state as a core material.
  • the buffer unit 200 is bent as shown in FIG. 15A during normal performance.
  • the hammer head 25 may come into contact with the additional buffer member 192 depending on the thickness of the additional buffer member.
  • the buffer portion 200 is bent as shown in FIG. 15A during normal performance, so the hammer head 25 can move without contacting the additional buffer member 220. it can.
  • the present invention is not limited to the above Embodiments 1 to 3 and their modifications.
  • the above-described configurations of the sound attenuation devices 1, 1a to 1d are merely examples, and can be arbitrarily changed and modified within the scope of the technical idea of the present invention.
  • the material of the single sound buffer member 120, the buffer members 130 and 191 and the additional buffer members 140 to 180 has been described as the felt material, but is not limited thereto. These may be materials such as paper, resin, rubber, urethane, etc. that can be interposed between the hammer head 25 and the string 5 and can mitigate the collision between the hammer head 25 and the string 5.
  • the present invention is preferably applied to an application for weakening an acoustic piano such as an upright piano or a grand piano.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Electrophonic Musical Instruments (AREA)

Abstract

L'invention concerne un dispositif d'amortissement de son de piano (1) qui a un rail atténuateur acoustique (110) et des membres d'amortissement de son unique (120) et est construit afin d'être apte à se déplacer entre une position de jeu normal et une position d'amortissement du son. Les membres d'amortissement de son unique (120) sont prévus de façon à être disposés un à un en parallèle avec de multiples têtes de marteau (25). En jeu normal, les têtes de marteau (25) frappent directement les cordes (5). En jeu avec amortissement du son, les têtes de marteau (25) frappent les cordes (5) avec les membres d'amortissement de son unique (120) interposés entre les têtes de marteau (25) et les cordes (5).
PCT/JP2011/077925 2011-12-02 2011-12-02 Dispositif d'amortissement du son d'un piano Ceased WO2013080370A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/077925 WO2013080370A1 (fr) 2011-12-02 2011-12-02 Dispositif d'amortissement du son d'un piano

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/077925 WO2013080370A1 (fr) 2011-12-02 2011-12-02 Dispositif d'amortissement du son d'un piano

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WO2013080370A1 true WO2013080370A1 (fr) 2013-06-06

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105719620A (zh) * 2016-03-21 2016-06-29 浙江乐韵钢琴有限公司 一种钢琴制音器头结构
WO2018129729A1 (fr) * 2017-01-16 2018-07-19 Sunland Information Technology Co., Ltd. Système de piano et son procédé
US11087729B2 (en) 2016-11-17 2021-08-10 Sunland Information Technology Co., Ltd. System and method for recording user performance of keyboard instrument

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JPS62135197U (fr) * 1986-02-19 1987-08-25
JPH0217791U (fr) * 1988-07-18 1990-02-06
JPH05263345A (ja) * 1991-09-12 1993-10-12 Nippon Felt Kogyo Kk 繊維層材及びその製造方法
JPH0741590U (ja) * 1993-12-28 1995-07-21 株式会社河合楽器製作所 ピアノの弱音装置
JPH07230279A (ja) * 1994-02-18 1995-08-29 Kawai Musical Instr Mfg Co Ltd グランドピアノの止音装置
JPH07261745A (ja) * 1994-03-22 1995-10-13 Kawai Musical Instr Mfg Co Ltd ピアノの止音装置
JP2000037578A (ja) * 1998-07-23 2000-02-08 Mizushima Rinkai Soko Kk クッション材とその製造方法
JP2010271678A (ja) * 2009-05-25 2010-12-02 Tadayuki Tagami ピアノの弱音装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135197U (fr) * 1986-02-19 1987-08-25
JPH0217791U (fr) * 1988-07-18 1990-02-06
JPH05263345A (ja) * 1991-09-12 1993-10-12 Nippon Felt Kogyo Kk 繊維層材及びその製造方法
JPH0741590U (ja) * 1993-12-28 1995-07-21 株式会社河合楽器製作所 ピアノの弱音装置
JPH07230279A (ja) * 1994-02-18 1995-08-29 Kawai Musical Instr Mfg Co Ltd グランドピアノの止音装置
JPH07261745A (ja) * 1994-03-22 1995-10-13 Kawai Musical Instr Mfg Co Ltd ピアノの止音装置
JP2000037578A (ja) * 1998-07-23 2000-02-08 Mizushima Rinkai Soko Kk クッション材とその製造方法
JP2010271678A (ja) * 2009-05-25 2010-12-02 Tadayuki Tagami ピアノの弱音装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105719620A (zh) * 2016-03-21 2016-06-29 浙江乐韵钢琴有限公司 一种钢琴制音器头结构
US11087729B2 (en) 2016-11-17 2021-08-10 Sunland Information Technology Co., Ltd. System and method for recording user performance of keyboard instrument
WO2018129729A1 (fr) * 2017-01-16 2018-07-19 Sunland Information Technology Co., Ltd. Système de piano et son procédé
CN110036438A (zh) * 2017-01-16 2019-07-19 森兰信息科技（上海）有限公司 钢琴系统及其方法
US10762879B2 (en) 2017-01-16 2020-09-01 Sunland Information Technology Co., Ltd. Piano system and method thereof

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