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WO2013079705A1 - Appareil et procédé - Google Patents

Appareil et procédé Download PDF

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Publication number
WO2013079705A1
WO2013079705A1 PCT/EP2012/074169 EP2012074169W WO2013079705A1 WO 2013079705 A1 WO2013079705 A1 WO 2013079705A1 EP 2012074169 W EP2012074169 W EP 2012074169W WO 2013079705 A1 WO2013079705 A1 WO 2013079705A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens
module
pick
parts
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/074169
Other languages
English (en)
Inventor
Edwin Wolterink
Henri VAN EGMOND
Erik VERHOEVEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anteryon International BV
Original Assignee
Anteryon International BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anteryon International BV filed Critical Anteryon International BV
Publication of WO2013079705A1 publication Critical patent/WO2013079705A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
    • G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to apparatus for and a method of operating a pick and place machine for assembling modules.
  • the apparatus and method relate to assembling multi-part modules such as for forming a lens module comprising a lens assembly and one or more spacer substrates.
  • Compact camera modules have become a standard component in mobile devices such as mobile phones.
  • a Camera Module consists of PCB board, an Imaging Sensor Module and a Lens Module.
  • the Lens Module consists of a lens assembly and a housing shielding it from unwanted light and environmental influences.
  • the housing may also be shared with the housing of the complete Camera module.
  • the outer contours of a compact camera module are in many cases designed as drop-in component into mobile devices.
  • the aim of packaging is to integrate the several optical, mechanical, environmental and electronic functions of a Compact Camera Module and a Lens Module.
  • the functional elements consist of a CMOS or CCD image capturing device, the imaging lenses together with optical functions such as IR filters, AR coats and light blocking structures such as baffles etc. In most cases, micro lenses and color filters are positioned on the image sensor surface.
  • the traditional process consists of assembling single lens elements into a lens holder.
  • the lens elements are usually formed by injection moulding or glass pressing. Integrated Lens Stacks relating to lens assemblies based on wafer level manufacturing have been disclosed in WO2004027880. In this process, lens elements, spacers and other optical functions are manufactured at the wafer level. After singulation (i.e. separation of the wafer into individual modules) integrated lens modules are obtained.
  • Chip-on-Board COB
  • Chip Scale Packaging CSP
  • the latter integrates a sensor cover plate before assembling the optics.
  • the image sensor substrate comprises the image sensing area including the pixel map.
  • the bottom spacer may either be part of the lens stack or is part of the surrounding housing.
  • US2005077458 discloses a CSP packaging which is typical for wafer level manufacturing of Image Sensor Modules.
  • US20100052192 discloses a method for manufacturing an encapsulated Compact Camera Module obtained by wafer level packaging of the Image Sensor Module and Integrated Lens Stack elements.
  • Wafer level manufacturing of opto-electronic components in general assumes a wafer to wafer assembly of the optics wafer with the image sensor wafer.
  • the aim is to reduce costs through maximizing the simultaneous processing of components followed by a singulation, usually dicing, step.
  • This assumption is based on the very high yields using state-of-art manufacturing front end processes for electronic components on silicon wafers. These processes benefit from a decades track record of process development using silicon as a substrate.
  • the processes for manufacturing optical components on wafer level are based on different materials (glass, polymer) and processes (injection moulding, UV, thermal replication, glass pressing).
  • refractive optical structures require extreme, i.e. high, shape accuracies with comparably high aspect ratios.
  • the yield involving manufacturing of optics on wafer level is lower than may be obtainable for electronic components.
  • an Image Sensor Module wafer with good yield may be assembled on an optical wafer with a lower yield.
  • Reject optics may therefore be combined with good image sensors, resulting in reject Compact Camera Module despite the presence of good electronic components.
  • Another disadvantage or feature of a wafer to wafer approach is the possible or inherent footprint mismatch between the optics and the image sensor.
  • the footprint of the active area of the image sensor, matching the imaging area of the optics is typically 40 % of the total footprint of the Image Sensor Module.
  • the pitch of the lens modules has to be matched with the pitch of the Image Sensor Modules.
  • the pitch of optical elements on a lens wafer cannot be optimized to closest packaging. This results in increasing manufacturing costs for the optics and resulting Compact Camera Module.
  • BFL Back Focal length
  • the distance between the bottom optical surface of the lens module and the image plane has to be very accurately controlled. This can be performed through active alignment assembly methods l.e: The image is projected on an image sensor and the quality of the resulting focal postion is measured. According to the result, the lens module is vertically displaced to a position where a optimal image quality is obtained.
  • the whole procedure of measuring and adjusting is time consuming and requires expensive assembly with in line focus length measurement..
  • US8013289 discloses a method where single lens elements are mounted on a carrier frame substrate.
  • US7813043 requires dedicated tools for aligning single lens elements in the trough hole of the carrier substrate. It also requires a 'saddle structure' as support to enable dicing.
  • a new generation of Compact Camera Module involves compound eye cameras.
  • the image is obtained from at least two lens apertures assigned to one imaging detecting system.
  • the sensor system may be either at least two separate sensors or a single sensor sharing at least two lens apertures.
  • Another aspect, or possibly object, of the present invention is to provide a method for manufacturing camera modules wherein the aforementioned problems of the prior art are minimized.
  • an embodiment of the present invention relates to a method of forming a lens module, comprising a lens assembly and one or more spacer substrates, the method comprising: a) Providing a spacer substrate comprising at least one aperture, having dimensions of at least the cross section of the optical path of a lens module,
  • the present method optimizes yield through exclusively combining Known Good Dies with Known Good Lenses.
  • the present method allows using a single or limited set of spacer substrates. The same spacer substrate design can be used for Integrated Lens Stacks with different outer dimensions.
  • the present method enables the combination of Integrated Lens Stack, i.e. lens assemblies, with different footprints within one frame.
  • the spacer substrate as such is a substrate in which several apertures are present, and each aperture functions as a spacer element for each individual lens assembly.
  • a spacer substrate may also be a semiconductor substrate or a semiconductor substrate with integrated spacer structures.
  • the spacer structures can be provides by adhesion, an additive process or as an integrated part of the semiconductor substrate.
  • the optical properties of each lens assembly are known, so the height, or the amount, of adhesive to be applied on the substrate, i.e. around the circumference of each individual aperture, is known. Therefore, according to the present method, it is possible to manufacture individual lens modules which meet the required optical properties, especially with regards to the focal length.
  • step e) comprises pressing the lens assembly according to a reference level preset by an assembly machine.
  • the reference level is determined, inter alia, by the optical properties of the individual lens assemblies.
  • the pressing level can be different for each lens assembly.
  • the adhesive according to step c) is applied in a thickness range of 5- 100 urn, especially in the range of 10-80, more especially in the range 20-60 and yet more especially in the range 30-40 urn.
  • the singulated lens module obtained from step h) is aligned on an image sensor for obtaining a camera module, wherein an additional step of overmoulding can be carried out.
  • Such a lens assembly may comprise a micro spacer plate, a cover plate and a lens substrate provided with a lens.
  • the micro spacer plate is provided with a hole for passing image forming light rays from the lens element, i.e. object side, to the image side.
  • An infra-red reflection coating can be provided between the lens substrate and the cover plate, and an anti- reflex coating can be provided over the lens substrate and the lens element.
  • An adhesive layer is present between the cover plate and the micro spacer plate and another adhesive layer can be present between the lens substrate and the cover plate.
  • the adhesive layers are rim-shaped, the adhesive material being present outside an area coinciding with the projection of the circumference of the lens element on the surfaces of the micro-spacer plate and the cover plate.
  • an anti-reflection layer on the side wall of the micro-spacer plate, thereby by preventing unwanted reflections of light.
  • Such an anti- reflection layer can be provided for instance by coating the side wall of the micro- spacer plate with a low reflecting material, for instance with black resist. The coating may be applied by means of spraying.
  • a lens assembly may comprise several lens substrates, lens elements, anti- reflex layers, and spacer plates.
  • the lenses present on the lens substrates are preferably manufactured by a replication process.
  • the replication process for making polymer lenses is known per se from U.S. Pat. Nos. 4,756,972 and 4,890,905, which disclose the possibility of manufacturing a high-quality optical component by means of a replication process.
  • Such a replication process is considered to be a quick and inexpensive manner of manufacturing optical components in large numbers.
  • a mould having a precisely defined surface for example an aspherical surface
  • a radiation curable resin for example a UV curable resin
  • the resin is spread over the mould surface, so that the cavities in the mould are filled with the resin, after which the whole is irradiated so as to cure the resin and the thus cured product is removed from the mould.
  • the cured product is a negative of the mould surface.
  • the replica layer used in the present optical system is may be, or even preferably, composed of a UV curable polymer, selected from the group of polycarbonates, polystyrenes, poly(meth)acrylates, polyurethanes, polyamids, polyimids, polyethers, polyepoxides and polyesters.
  • a UV curable polymer selected from the group of polycarbonates, polystyrenes, poly(meth)acrylates, polyurethanes, polyamids, polyimids, polyethers, polyepoxides and polyesters.
  • Suitable replication technologies are disclosed in U.S. patents Nos. 6,773,638 and 4,890,905, which may be considered to be fully incorporated herein.
  • the outermost lens element of said lens assembly comprises a conical flange that is sloped at an angle for anchoring the overmoulding resin with said lens assemblies.
  • a sloped outermost lens element provides additional grip for the material used for the overmoulding step.
  • the overmoulding step forms an outer layer around the lens assembly and functions not only as "packaging material” but as a moisture and dust barrier as well. And by overmoulding the obtained assembly is less susceptible for mechanical forces and impact from the environment.
  • a method for manufacturing lens stacks, or lens assemblies comprises a step of assembling Known Good Lens stacks using assembly machines (step E1 ) upon a spacer substrate functioning as a carrier or frame.
  • the spacer substrate can be of any stable material, but preferably a material that is frequently used in mounting electronic components such as composite material (FR4) and metals. These materials are cheap and readily available even on very thin thicknesses far below 250 microns.
  • FR4 composite material
  • the lens stack is positioned against an absolute reference plane, compensating variations in the layer thickness of the adhesive.
  • the overmoulding step is performed using foil moulding equipment, wherein a liquid or liquefied compound material is injected in a cavity with tightly controlled height gap between the top and bottom surface of the mold.
  • the moulding material is opaque and may contain metal particles for EMI shielding.
  • the moulding material may either only surround the side walls of the lens stacks.
  • Top light shielding layer around the aperture of the lens can be present as an opaque top layer on the lens stack.
  • the top layer can also be provided by the overmoulding process using a mould shielding the aperture of the lens. Another possibility is to separately provide a top cap on either the lens module or the camera module.
  • the step of singulation (usually dicing) and sorting results in Known Good lens modules.
  • the materials in the dicing lane allow a fast throughput with considerable lower risk in chipping and cracks, compared to existing processes dicing to brittle materials such as glass.
  • the smooth edged packaging also ensures sufficient robustness against reliability failures such as delamination and pop corning.
  • the spacer substrate functioning as assembly carrier has now become an integral part of the resulting lens module.
  • the next phase involves the manufacturing of Camera Modules, where the Known Good lens Modules are assembled on Known Good Image Sensor Modules, packaged and singulated.
  • image sensor modules are assembled on a moulding substrate.
  • lens modules are assembled using similar assembly technology as described above.
  • a similar foil moulding process is performed, followed by a singulation step.
  • the moulding substrate may be any rigid material to fix the attached image sensor modules, or assemblies of lens module with image sensor modules.
  • the material can be for temporary use or may be the printed circuit board where upon a ball grid array or wire bond are attached
  • the moulding substrate can be rigid or a foil (e.g. dice tape or release foil)
  • the moulding substrate may be detached at any step starting from the step of foil moulding.
  • the moulding substrate may also function as a protective cover over the ball grid array prior to final assembly on a PCB board. Dicing may be partially performed, i.e. only through moulding material and partially in the moulding substrate.
  • PCB materials may be rigid FR4 or flexible.
  • the thus obtained camera module has a housing consisting of moulding material resulting from the lens module process, spacer substrate material and moulding material.
  • the foil moulding technology allows creating a large variety of shapes of walls. By using such a method it is possible to create a lens module and a camera module with tightly controlled Back Focal length within a robust packaging.
  • the related production platform according to this invention accommodates a large variety of lens modules, single / multiaperture camera modules using materials, substrates, moulding processes and assembly machines with a proven track record in the electronic component manufacturing industry.
  • the height tolerance z of the lens module is now predominantly determined by the capability of assembly only, instead of the sum of tolerances of the process for manufacturing the spacer substrate + (plus) the capability of the machine assembling lens housing + (plus) the tolerance of the prefabricated lens housings according to the prior art.
  • the height tolerance of the present camera module is now determined by the capability of the assembly machines.
  • the claimed method enables the combination of Integrated Lens Stack, i.e. lens assemblies, with different footprints within one frame.
  • the claimed method avoids tolerances resulting from misalignment of assembled lens in the housing.
  • the overmoulding process in step upon a moulding substrate provides a camera module where the moulding material is filling all space between the ball grid array except the contact surface of the ball grid array, which is protected by the moulding substrate.
  • the moulding substrate provides several functions as array based carrier and/or protective cover.
  • the claimed method enables the light shielding and cross talk barriers of compound eye cameras in one step.
  • One or more embodiments of the present invention benefit from proven machine technology based concepts in positioning and assembly of electronic components in general.
  • the claimed method allows or may allow using very thin, non brittle, spacer substrates that can or may be manufactured at low costs. Yield losses resulting from chipping on spacer substrate are or may be reduced. The overall production costs decrease and the production line is or may be more flexible towards variations in designs and allows or may allow fast ramp up to volume after design in.
  • the present method allows or may allow combining easily different types of lens modules of different sizes, different MxN array configurations on either a shared or separate image sensor modules.
  • Figure 1 illustrates a typical lens stack as provided by a replication method.
  • Figure 2 schematically shows an embodiment of a lens module according to the method of the present invention
  • Figure 3 schematically shows an embodiment of a single aperture camera module according to the method of the invention
  • Figure 4 shows a multi- aperture camera module according to the method of the invention.
  • Figure 5 shows an embodiment of the present method for manufacturing a lens module.
  • Figure 6 shows an embodiment of the present method for manufacturing a single aperture camera module.
  • Figure 7 shows an embodiment of the present method for manufacturing a multi aperture camera module.
  • Figure 8 shows an embodiment of the present method for manufacturing a lens module.
  • Figure 9 shows an embodiment of the present invention for packaging a lens module.
  • the image sensors mentioned in the present application included all known CSP, COB, Flip Chip packaging technologies and related interconnection technologies for CCD and front end and back end CMOS technologies.
  • the packaging solutions according to embodiments of the invention are also applicable for light emitting and projecting devices where image sensor is replaced by light emitting element such as LED, VCSEL, laser diode.
  • As the material for sensor cover plate any transparent optical material can be used.
  • the cavity can be made by dicing, etching, powder blasting.
  • lens stack lens assemblies provided by alternative technologies, single and wafer level, can be processed.
  • These technologies include: injection moulding, glass moulding and any hybrid technology based on assembling optical elements manufactured by UV thermal replication and one or more of these technologies.
  • Any lens shape, substrate thickness, dimension, buffer layer typically 0- 100 micron, lens sags typically ⁇ 300 micron ( ⁇ 1000 micron) can be used.
  • Optical components may be refractive, diffractive, holographic, or focusable based nematic liquid crystal, piezoelectric or voice coil or mechanical principles.
  • An array camera has
  • N x M apertures with N ⁇ 1 and M>N.
  • Multi aperture camera's consist of assemblies of single lens stacks in an array or include a stack of layers having multiple lens elements. Footprints of each sub camera may differ in size and shape (e.g. hexagonal). Lens contours may vary in diameter, shape and may be intersecting. Spacer substrate material comprises any stable and polymeric, composite, glass, ceramic, metals material but preferably. Dimensions thickness 20-1000 micron. Hole profile: different pitch, hole shapes and dimensions, even within the same substrate. Singulation: dicing, cutting, laser cutting..lens modules may also be diced in groups resulting in an arrayed lens module. Lens placement: lens stacks with different designs, footprint may be combined.
  • moulding materials moulding materials: ,
  • Light shielding on the object side can be provided using several methods:
  • Assembled lens module can be any combination of lens modules. Singulating: dicing, cutting, laser cutting...camera modules may also be diced in groups resulting in an arrayed lens module.
  • Suitable wafer level optics technologies are disclosed in WO2004027880A2 which may be considered to be fully incorporated herein.
  • Suitable replication technologies are disclosed in U.S. patents Nos. 6,773,638 and 4,890,905, which may be considered to be fully incorporated herein.
  • Spacers mentioned in the Figures are made of a rigid material, for example glass, silicon or a composite material such as FR4.
  • the spacer plate is so configured that it will not interfere with the light path through the two separate lens elements.
  • the spacer plate comprises an opening which is positioned coaxially with a main optical axis of the lens element in question, whilst in a special embodiment the side of said opening is provided with an anti- reflective coating.
  • Suitable technologies regarding a multi- aperture camera through assembling discrete optical elements, lens housing and optical blocking structures are disclosed in US2010/0127157, and US2010/0039713. These documents are incorporated here by reference.
  • the optical elements can be manufactured through injection moulding or glass moulding of a thermoplast or pressing a glass preshape in a single cavity or plural cavity mould.
  • Suitable technologies for manufacturing present cover plate and present lens holder for wafer level optics camera are disclosed in US2010/0052192, US2009/0321861 and US2010/01 17176. These documents are incorporated here by reference.
  • lens holder, cover plate can be provided through assembling injection molded, ceramic or metal housing.
  • Typical sizes for the present camera module height is about 4-10mm, for camera module foot print; 4x4mm to 20x20 mm.
  • the dimension is not necessarily square, but in special embodiments also constructions of different sizes are possible, e.g. 4x10mm.
  • the image sensor package is within the range of 0.4 -0,8mm.
  • Dimensions of lens diameters are within a range of 2-4 mm, glass substrates within a range of 0.200-1 mm.
  • For the replicated lenses one may apply a sag height in a range of 20 ⁇ - 250 ⁇ , or even in a range of 500 -1000 ⁇ .
  • Typical dimensions for a buffer layer are 30 ⁇ - 100 ⁇ .
  • Figure 1 illustrates a typical lens stack 204, comprising lens elements 201 , a buffer layer 203, lens substrates 200.
  • This stack 204 shows a combination of two lens substrates 200, but embodiments of the present invention are not restricted to the number of lens substrates, nor to the number of lens elements 201.
  • the buffer layer 203 can be omitted.
  • the lens stack 204 may have one or more anti-reflex layers, diaphragms (not shown).
  • FIG. 2 schematically shows an embodiment of a lens module or lens stack fabricated according to the method of an embodiment of the present invention.
  • the lens module 300 comprises a lens stack 204, present in a spacer substrate 301 , wherein a lens moulding resin 303 encapsulates the lens stack 204.
  • Spacer substrate 301 may comprise two separate spacer substrate layers, each comprising apertures. The dimension of the aperture of the one spacer substrate is greater than the dimension of the aperture of the other spacer, wherein the lens stack 204 fits accurately in the aperture of the largest dimension.
  • Such a construction can be completed by the provision of an adhesive in the narrow gap created by the lens stack 204 and the inner diameter of the aperture of the one spacer plate.
  • Figure 3 schematically shows an embodiment of a single aperture camera module 410 according to a method in accordance with an embodiment of the invention.
  • image sensor module 400 On top of image sensor module 400 lens stack 204 is present.
  • Image sensor 400 is provided with an overmoulding substrate 401 and lens module 204 is encapsulated with lens moulding resin 403.
  • Figure 4 shows a multi- aperture camera module according to a method in accordance with an embodiment of the invention.
  • Figure 4 clearly shows the presence of two lens modules 204a, 204b on top of image sensor module 400.
  • Image sensor module 400 may consist of several individual image sensor modules (not shown).
  • the lens modules 204a, 204b are encapsulated by camera moulding resin 403.
  • Image sensor module 400 is positioned on top of overmoulding substrate 401.
  • Light shielding walls 405 may be present between lens modules 204, 204.
  • FIG. 5 shows an embodiment of the present method for manufacturing a lens module.
  • This figure 5 does not show the individual steps for manufacturing the lens modules but only refers to the singulation step A in which individual lens modules are obtained through, for example, a dicing line according to reference number 501.
  • Step B of Figure 5 comprises the positioning of the individual lens modules 204 in a spacer substrate 301 provided with apertures for accurate positioning. The circumference of the apertures is provided with an adhesive (not shown) for adhering the lens modules 204a, 204b and 204c to the spacer substrate 301.
  • an overmoulding resin 303 is applied in the spaces between the lens modules 204 positioned on the spacer substrate 301.
  • Step D shows an additional of step of singulation the individual lens modules.
  • Figure 6 shows an embodiment of the present method for manufacturing a single aperture camera module.
  • Image sensor modules 400 are placed on top of overmoulding substrate 401 in step A.
  • resin encapsulated single aperture camera modules 410 are positioned on top of the image sensor modules 400.
  • step C a resin is applied in the spaces between the resin encapsulated camera modules resulting in completely encapsulated camera modules.
  • step D singulating of the individual a single aperture camera module is carried out.
  • Figure 7 shows an embodiment of the present method for manufacturing a multi aperture camera module and comprises basically the same steps as discussed in Figure 6.
  • Several image sensor modules 400 are provided on top of overmoulding substrate 401 in step A.
  • resin encapsulated multi aperture camera modules 500 comprising lens modules 204, 204 are positioned on top of each of the image sensor modules.
  • step C a resin 403 is applied in the spaces between the resin encapsulated multi aperture camera modules resulting in completely encapsulated camera modules.
  • step D singulating of the individual multi aperture camera module is carried out.
  • FIG. 8 shows an embodiment of the present method for manufacturing a lens module.
  • carrier or substrate 800 comprising apertures 801 is provided with adhesive for adhering lens module or die 802.
  • the adhesive can be applied directly to the die 802 as well. Bonding of the dies 802 is shown in step B.
  • the step of overmoulding the thus adhered dies 6802 to the carrier 800 is shown in step C. Singulating of the individual elements, through dicing, is shown in step D.
  • Step E clearly shows the thus obtained products 804, in which the carrier 800 forms an integral part of the thus obtained lens module 804.
  • the cross section of a stack of lenses is schematically shown in step F.
  • the thus obtained lens module 804 is ready to be used in a method for manufacturing a camera module as discussed before.
  • Figure 9 shows an embodiment of the present invention for packaging a lens module.
  • Step A shows the positioning of a lens stack, comprising substrates 903, 901 , lens elements 902, 904, 905, 907, on a substrate or carrier 910 by an adhesive 91 1.
  • Outermost lens element 902 shows a conical flange 906 that is sloped at an angle for anchoring the overmoulding resin 91 1 (see step B) with said lens assemblies.
  • the height of the die is indicated with arrow 912.
  • the singulation takes place according to step C.
  • the presence of such a flange 906 can be omitted, in special embodiments.
  • a method of forming a lens module comprising a lens assembly and one or more spacer substrates, the method comprising: i) Providing a spacer substrate comprising several apertures having dimensions of at least the cross section of the optical path of a lens module,
  • step e) comprises pressing the lens assembly according to a reference level preset by an assembly machine. 3. A method according to clause 1 , wherein step c) the adhesive is applied in a thickness range of 5-100 micron.
  • a method according to clause 1 further comprising aligning the lens module obtained from step h) to an image sensor fitting within a sensor cavity of said lens.
  • said lens assembly comprises one or more lenses, separated by one or more spacers, wherein said one or more spacers are adhered to said one or more lenses by one or more adhesives.
  • a method of forming a camera module comprising: q) Providing an image sensor module on a PCB substrate,
  • Embodiments of the present invention provide a method for manufacturing lens modules allowing the use of a single or limited set of spacer substrates. Another embodiment of the present invention provides a method for manufacturing lens modules in which height tolerances and production platform flexibility are improved towards design and resulting reduced costs.
  • the related production platform according to an embodiment of this invention accommodates a large variety of lens modules, single / multiaperture camera modules using materials, substrates, moulding processes and assembly machines with a proven track record in the electronic component manufacturing industry.
  • embodiments in accordance with the present invention may provide an apparatus and method for placing components spaced apart from each other or from a substrate at a predetermined distance the thickness of a bonding medium such as a glue, epoxy or adhesive, in a bond direction being such as to establish the predetermined distance.
  • the predetermined distance maybe a distance which is an operational parameter for the components when they are joined together or supported on the substrate.
  • a pick and place assembly machine for assembling a first part and a second part to form a module, the machine operable to: align a first part with a second part in relative position with respect to each other in accordance with an assembled module configuration; space apart the first and second parts at a distance from each other in accordance with the assembled module configuration; and provide a bond medium disposed between the first and second parts for bonding the first and second parts in the assembled configuration.
  • a method for assembling a first part and a second part to form a module comprising: aligning a first part with a second part in relative position with respect to each other in accordance with an assembled module configuration; spacing apart the first and second parts at a distance from each other in accordance with the assembled module configuration; and providing a bond medium disposed between the first and second parts for bonding the first and second parts in the assembled configuration.
  • a module comprising a first part and a second part bonded together by a bond medium, wherein the spacing of the first part from the second part is an operational parameter of the module and the thickness of the bond medium in the bond direction is in accordance with the spacing desired for the operational parameter.
  • a module may be fabricated by a pick and place machine as set out in the one aspect above and/or in accordance with a method as set out in the another aspect above.
  • a pick and place assembly machine and method in accordance with the one and further aspects provide for flexible automated fabrication of multipart modules where the spatial separation of respective parts are important.
  • manufacturing tolerances may be taken into account.
  • the amount of bond medium such as a glue, adhesive or epoxy, may be selected for each individual module based upon the manufacturing tolerances measured for each of the components making up the multicomponent module. This may lead to a greater yield since devices which fall outside acceptable limits may be compensated for by appropriate configuration of bond medium thickness.
  • individual modules may be fabricated independently of each other in dependence upon manufacturing tolerances of their component parts being taken into consideration in evaluating the distance information which is then used by the pick and place assembly machine to determine the spacing apart of the respective parts.
  • Figures 10 (a) & (b) schematically illustrate the effect of manufacturing tolerances for an optical module
  • Figure 1 1 schematically illustrates adjusting the height of a lens to bring the focal plane to a desired location on another component
  • Figure 12 illustrates a first stage of mounting a lens in order to reduce the defocus distance
  • Figure 13 illustrates an arrangement in which a lens assembly is mounted to a light emitting device
  • Figure 14 illustrates the arrangement of component elements and their assembly in a pick and place machine to form a lens assembly
  • Figure 15 illustrates a lens assembly arrangement showing the various dimension used in calculating adhesive thickness
  • Figure 16 is a depiction of a Dataconn EVO 2200 pick and place machine.
  • FIG 17 is a depiction of a gripper mechanism over a substrate.
  • a component having relative position as an important operational parameter is illustrated by way of a lens component 1002.
  • Light passes through the lens 1002 and is focussed over its focal length 1006 to a target focal plane 1008.
  • lens components are mounted on a spacer substrate of some kind incorporating a flange to space the lens away from the subject upon which the spacer and lens combination is eventually mounted. Consequently, distance 1006 is often termed the Flange Back Focal Length (FBFL).
  • FBFL Flange Back Focal Length
  • Figure 10(b) illustrates a lens 1002' which due to manufacturing tolerances has a focal plane 1012 different from the desired or target focal plane 1008.
  • Lens 1002' may be considered to be defocused by an amount 1010 due to the manufacturing tolerances compared to the target arrangement illustrated in figure 10(a). Consequently, it cannot be used in the same
  • defocus distance 1010 is greater than a few microns for imaging applications and greater than a few tens of microns for any the applications the FBFL variation due to defocus 10 10 should be compensated for.
  • FIG. 11 A particular example for an LED configuration is illustrated in figure 11.
  • a lens 1002' having manufacturing tolerances resulting in a defocus and variation in FBFL relative to design reference lens 1002 is combined with an LED 1012 mounted on a substrate 1016.
  • the target focal plane is the top of the LED 1014.
  • the defocus distance 1010 from the top of the LED 1014 it is desirable for the defocus distance 1010 from the top of the LED 1014 to be or be close to zero so that the top of the LED 1014 is at or close to the focal plane of the lens 1002'.
  • the lens 1002' should be positioned above the LED 1012 so that the distance 1006 is to the top of the LED 1014.
  • Figure 12 illustrates a first stage in accordance with an embodiment of the present invention in which a lens 1002' having an FBFL variation due to manufacturing tolerances is mounted in order to reduce the defocus distance 1010 to or close to zero.
  • the lens 1002' is mounted on a spacer element 1018, i.e. a substrate material with a hole or aperture in it.
  • a first amount of glue 1020 is placed between the spacer element 1018 and the lens 1002' in order to create a lens assembly 1022.
  • the thickness of the glue 1020 is selected so as to reduce the defocus distance 1010.
  • the defocus distance may be reduced to its minimum acceptable value.
  • the thickness of the glue 1020 is not so important but merely must not be so thick so that the focal plane 1008 is not withdrawn upwards relative to the spacer element 1018 and amounts greater than a device with which the lens assembly 1022 is to interact when mounted to something else.
  • Figure 13 illustrates an arrangement in which the lens assembly 1022 figure 12 is mounted to a light emitting device, for example an LED 1028 itself mounted on a substrate 1024.
  • the focal plane 1008 of the lens assembly 1022 should be at the active region, active optical region or focal plane of the LED 1030.
  • Configuring the arrangement so that the focal plane 1008 falls on the active region, active optical region or focal plane of the LED 1030 may be achieved by ensuring that the thickness of glue 1026 corresponds to the distance the assembly illustrated in figure 12 needs to be raised to ensure that focal plane 1008 falls on the active region, active optical region or focal plane LED 1030.
  • the thickness of glue 1026 needs to be maintained to an accuracy determined by the application to which the lens assembly 1022 is put.
  • lens assembly 1022 include a receiving device, for example an image sensor, it may be used in an imaging application and then the accuracy will be to a few microns.
  • a receiving device for example an image sensor
  • the accuracy will be to a few microns.
  • the target focal plane or target Z distance from a second component or part should be used for the determination of overall Z direction displacement.
  • FIG. 14 A mechanism for arranging a component such as a lens or other position dependent component onto a substrate, whether the final substrate or an intermediate substrate spacer, is illustrated with reference to the respective diagrams in figure 14.
  • Figure 14 describes pick and place equipment and the various steps in using that it and place equipment to mount a lens 1002 onto a spacer element 1018.
  • FIG 14(a) A detail of pick and place equipment is illustrated in figure 14(a) and shows a gripper 1030 spaced above a work surface for the machine such as a table 1032 providing a reference level or datum position.
  • the direction perpendicular to the table 1032 is generally referred to as the "Z" direction 1034.
  • gripper 1030 picks lens element 1002 and places it on glue 1036 disposed on spacer element 1038.
  • spacer 1038 is picked and placed on table 1032.
  • the pick and place equipment then applies an amount of glue 1036 to the spacer element 1038, figure 14(d).
  • glue 1036 applied to the spacer 1038 is sufficient to place the focal plane of the lens at the target focal plane.
  • the thickness of the glue may be determined from the following equations and with reference to figure 15. First of all a target distance in the said direction is determined (Z target) viz:
  • the target focal distance 1040 is the distance between the surface of the table 1032 and the focal plane of the lens 1002 determined by optical design.
  • the glue thickness is determined as follows:
  • Glue thickness Z target - lens height (1039)-spacer thickness(1041 ) + cure
  • glue 1036 has a thickness corresponding to DGT.
  • the pick and place equipment then positions the lens 1002 on the glue 1036, figure 14(e).
  • the gripper 1030 is connected to a force feedback sensor so that the equipment may determine the amount of force experienced by the gripper 1030 when placing the lens 1002 on the glue 1036.
  • the pick and place equipment determines that sufficient contact has been made with the glue 1036 and releases the lens 1002. It is usually the case that the force necessary to determine sufficient contact has been made sufficiently low so as not to compress the glue 1036 by a significant amount.
  • the glue may then be cured, figure 14(f) and the lens assembly 1022 removed from the pick and place machine, figure 14(g).
  • the Z target distance is achieved by modifying the thickness of glue 1036 whilst in situ.
  • the amount of glue 1037 placed on spacer element 1038 as illustrated in figure 14(d) is not an exact thickness DGT but slightly over the DGT amount to allow for an amount of compression. Thus, the amount of glue provided on the spacer element 1038 does not need to fall within such precise limits as for the previously described embodiment.
  • the pick and place equipment is operated to push the lens 1002 down onto "over thickness" glue 1037 until the Z target distance calculated in accordance with equation (1 ) above is achieved.
  • certain key parameters relating to the lens 1002 should be determined and provided to the pick and place equipment utilisation in evaluating equations (1 ) and (2).
  • these parameters are the lens height, the FBFL (also distance to the lens focal plane), spacer thickness and the target focal distance.
  • These parameters are either known for the manufacturing process since devices are being manufactured to certain size and in the case of the FBFL (distance to focal plane) can be measured when the lens is still on its fabrication wafer, i.e. before singulation, or when it has been singulated and is placed on a tape ready for use in a pick and place machine.
  • Z- control results from using previously measured individual z- values (FBFL, thicknesses) for each part and reference plane in the machine framework.
  • Adhesive(bond) thickness target Z target distance -Top Component(e.g Lens) height - Bottom part (e.g spacer substrate) height + curing shrink factor.
  • Z target lens height (1039)+ FBFL(1043) target focal distanced 040) + thickness of substrate 1024 (4)
  • Glue thickness 1026 Z target - lens height (1039)-spacer thickness(1038) + cure
  • substrate 1024 Another example uses the top surface of substrate 1024 as a reference level. This surface effectively takes over the role of surface 1032 .
  • the thickness of substrate 1024 does not have to be known. In this approach:
  • Z target lens height (1039)+ FBFL(1043) target focal distanced 040) (6)
  • Glue thickness Z target - lens height (1039)-spacer thickness(1038) + cure shrink/expand factor. (7) Control and achievement of required qlue(bond) thickness
  • a predetermined amount of adhesive is applied to a bond surface of at least one of the components (parts) to be bonded.
  • the adhesive height after applying is higher than the target adhesive thickness.
  • the adhesive "excess" height should be in the region of at least the total tolerance budget and preferably twice the total tolerance budget of the parts to be assembled.
  • an initial 70 micron adhesive thickness is used for a target of 50 microns thickness. So compression is 20 microns.
  • the volume of adhesive is determined by the width of the surfaces to be adhered.
  • a typical width is 100-200 micron, but may be up to 500 microns.
  • the machine may be considered to determine the plane of the reference level 1032.
  • the movement of the pick and place machine is used to control a distance separation between the components.
  • the final distance between the components is set and determined by the thickness of the cured adhesive height.
  • the machine moves the components to be joined to a XY position using known means, such as a vision system.
  • Adhesive is applied on the bottom (a bonding surface) of the part to be placed.
  • Adhesive is applied on the bottom (a bonding surface) of the part to be placed.
  • needle currently used
  • ink jet no spacer balls
  • screen print screen print
  • dipping dipping
  • tampon stamp printing
  • the machine brings the two parts (eg lens and spacer) towards the target Z point.
  • Using pure position control requires Direct Z- translation towards Z-target using linear motors.
  • the motors can be adjusted at 0.1 micron level.
  • Force measurement is not necessary to set the target adhesive distance, although detecting contact with a glue surface through force response is an option.
  • the purpose of the force response is to ensure that there is contact with the adhesive, but not too much further translation in the Z direction which could result in the adhesive being displaced and partially blocking the aperture in the spacer.
  • the use of spacer balls with diameter coinciding with target adhesive thickness means that the machine may be moved to bring parts together till a force response signals the contact with the spacer ball.
  • Another variation is to dispose adhesive droplets on top and bottom component parts. By making contact, the droplets merge and are pulled out, causing possible waist in the junction of the adhesive droplets.
  • any shrink values should be determined, and are generally known for adhesives, and are incorporated in the formula to determine the target adhesive thickness.
  • Collapse of adhesive through viscosity drop during curing should be avoided.
  • One way to avoid such collapse is to conduct UV curing within the machine, for example whilst parts are held in place for a machine enabled for line UV curing.
  • Offline post curing thermo glues may also be used.
  • Another approach is to form a stable adhesive. This requires a minimum viscosity at assembly temperature and is very dependent on adhesive width. The greater the aspect ratio of the adhesive, the greater the risk of collapse.
  • Viscosity of adhesives should be engineered to conform to the above design
  • grooves or specific features with sharp edges can be applied on the surfaces as flow stops. They prevent adhesive from spreading out.
  • Overmoulding occurs in a very precisely confined mould cavity. Overmoulding yield is to a large extent determined by the distribution in heights of the components to be
  • overmoulded Failure modes are bleeding, incomplete overmoulding or even cracks.
  • the forces in the overmoulding machine are concentrated on the highest spot within an array of components to be overmoulded.
  • the change in the value of Z target (figure 15) by lens relative to the assembly reference (figure 14) accounts for variations in the measured optical focal lengths of the lens and the calculated absolute height of the focal plane of the imager/LED.
  • the absolute height of the imager/LED will vary dependent on the position of the imager/LED within the wafer.
  • the assembly reference may be measured at, for example 6, positions across the wafer. From these 6 positions it is possible to calculate the assembly reference by individual imager/LED position and thus the absolute height of the focal plane of the imager/CCD above the assembly reference.
  • the knowledge of the absolute height allows setting the correct value of Z target.
  • any reference to "one embodiment” or “an embodiment” means that a particular element, feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment.
  • the appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.
  • the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having” or any other variation thereof, are intended to cover a non-exclusive inclusion.
  • a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
  • “or” refers to an inclusive or and not to an exclusive or. For example, a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
  • a lens including but not limited to a lens, sensor, capacitor, microphone, wave guides, interferometric devices, Fabry Perot filters, microfluidic devices; light sources , laser diode, LED, VCSEL, illumination module, projection module and camera module may also be fabricated using embodiments of the invention.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Lens Barrels (AREA)

Abstract

L'invention concerne une machine d'assemblage à collecte et placement pour assembler une première pièce et une seconde pièce afin de former un module, laquelle machine va : aligner une première pièce et une seconde pièce en position relative l'une par rapport à l'autre en fonction d'une configuration de module assemblé; espacer la première pièce et la seconde pièce selon une certaine distance en fonction de la configuration de module assemblé; et fournir un milieu de liaison disposé entre les première et seconde pièces afin de coller les première et seconde pièces dans la configuration assemblée. L'invention concerne également un procédé pour assembler des première et seconde pièces afin de former un module, lequel procédé consiste à : aligner une première pièce et une seconde pièce en position relative l'une par rapport à l'autre en fonction d'une configuration de module assemblé; espacer la première pièce et la seconde pièce selon une certaine distance en fonction de la configuration de module assemblé; et fournir un milieu de liaison disposé entre les première et seconde pièces afin de coller les première et seconde pièces dans la configuration assemblée.
PCT/EP2012/074169 2011-11-30 2012-11-30 Appareil et procédé Ceased WO2013079705A1 (fr)

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US9973669B2 (en) 2015-08-28 2018-05-15 Apple Inc. Dual overmolded reconstructed camera module
CN113009788A (zh) * 2021-02-24 2021-06-22 上海华力微电子有限公司 光刻装置
CN113805406A (zh) * 2017-01-12 2021-12-17 核心光电有限公司 紧凑型折叠式摄影机及其组装方法

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TWI846530B (zh) * 2023-06-30 2024-06-21 晉弘科技股份有限公司 影像感測模組製作方法

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CN113009788A (zh) * 2021-02-24 2021-06-22 上海华力微电子有限公司 光刻装置

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