WO2013069865A1

WO2013069865A1 - Hybrid acoustic/electric signal converting device which is reverse type

Info

Publication number: WO2013069865A1
Application number: PCT/KR2012/004981
Authority: WO
Inventors: Gap Ryul Jung
Original assignee: PILKOR CST CO Ltd
Current assignee: PILKOR CST CO Ltd
Priority date: 2011-11-07
Filing date: 2012-06-25
Publication date: 2013-05-16
Anticipated expiration: 2014-05-07
Also published as: KR20130050089A

Abstract

The present disclosure relates to a reverse-type hybrid acoustic/electric converting device, and an overall product structure of a general reverse-type acoustic/electric converting package is improved to <a monolithic acoustic capsule capable of forming an independent self-standing fixing structure (namely, a self-standing fixing structure independent of curling of the case) of a-excellent sound-detecting mechanisms (a vibration plate, a fixing plate, the dielectric plate or the like) just by a simple coupling operation of a partial block structure (for example, a conductive/compression metal block and a insulation/compression base block) without any separate complex procedure and capable of performing the function of the acoustic/electric converting element instead> and <a structure supporting the monolithic acoustic capsule and including a sound inlet, an acoustic sealing pattern, a circuit chip or the like>.

Description

HYBRID ACOUSTIC/ELECTRIC SIGNAL CONVERTING DEVICE WHICH IS REVERSE TYPE

This disclosure relates to an acoustic/electric converting device which is a reverse type (namely, a type where a sound inlet is formed in a lower portion), and more particularly, to a reverse-type hybrid acoustic/electric converting device which allows simplifying an overall product manufacturing process, lowering a production cost, utilizing parts (for example, a monolithic acoustic capsule) independently, and maximizing a hybrid function of the product to an optimal status.

Recently, as the technologies relating to various electronic devices such as information communication devices and acoustic devices rapidly develop, the demand of acoustic/electric converting devices which convert acoustic signals to electric signals also tends to rapidly increase, and according to the increase of the demand of such acoustic/electric converting devices, a new-conceptual acoustic/electric converting package which can substitute a traditional case-type microphone has been developed and spread widely.

Generally, such an acoustic/electric converting package, for example a reverse-type acoustic/electric converting package 70, includes a substrate 40 on which an acoustic/electric converting element 10, a signal processing circuit set 30 or the like is loaded, and a cover case 60 placed on the substrate 40 to cover the acoustic/electric converting element 10 and the signal processing circuit set 30, which are tightly combined, in a state where a sound inlet 41 is formed in its lower portion (namely, in a state where a reverse type is implemented) as shown in Fig. 1.

The acoustic/electric converting package 70 is surface-mounted to a circuit board 300 included in an electronic device (an information communication device, a acoustic device, or the like) later to configure an electric relation with the corresponding circuit board 300 so as to normally perform its own acoustic/electric converting role. In this case, the substrate 40 at the side of the acoustic/electric converting package 70 is surface-mounted to the corresponding circuit board 300 while corresponding the sound inlet 41 to the sound inlet hole 301 of the circuit board 300 (namely, in a state where the reverse type is implemented).

Here, the acoustic/electric converting element 10 loaded on the substrate 40 is configured so that a vibration plate manufactured by the microelectromechanical systems (MMES) technique, a back plate covering the vibration plate and having/forming a sound hole and an air gap, a base plate supporting the vibration plate, the back plate or the like and forming/defining a back chamber, or the like are organically combined. In this situation, in the case where a sound flows in through a sound inlet hole 301 formed at the circuit board 300 of an electronic device and the sound inlet 41 formed in the substrate 40, the acoustic/electric converting element 10 plays a role of converting the corresponding sound to an electric signal or generating an electric signal.

In addition, the signal processing circuit set 30 disposed near the acoustic/electric converting element 10 forms an electric connection relation with the acoustic/electric converting element 10 through an electric connection wire 21, and plays a role of supplying an operating power to the acoustic/electric converting element 10. In addition, after the follow-up process is performed to the electric signal converted or generated by the acoustic/electric converting element 10, the signal processing circuit set 30 also plays a role of transmitting the electric signal, to which the follow-up process is performed, through the electric connection wire 22 and the substrate 40 to the circuit board 300 of the electronic device on which the acoustic/electric converting package 70 is mounted.

Under the above system, as described above, since the reverse-type acoustic/electric converting package 70 is configured so that the substrate 40, the acoustic/electric converting element 10, the signal processing circuit set 30, the

wires

21 and 22, the cover case 60 or the like are very complicatedly set, in order to manufacture the acoustic/electric converting package 70, extremely complicated procedures such as a chip pick-up and place process, a chip wire bonding process, a dispensing process, a surface mounting process, a reflow process or the like should be performed for a long time by using various materials such as gold wire, epoxy resin, cream solder or the like. As a result, producers should endure the problems such as deteriorated production efficiency, increased production costs, complicated quality management, difficult yield management or the like, unless a special measure is taken.

In addition, the acoustic/electric converting element 10, which is an essential part of the reverse-type acoustic/electric converting package 70, is manufactured by the MEMS technique, which is a semiconductor fine processing technique, and thus inevitably has very weak fragility and easily crumbles even by a small impact therearound. As a result, in this circumstance, producers should endure the problem in that handing the acoustic/electric converting element 10 is very difficult.

In addition, since the acoustic/electric converting element 10 is manufactured by the MEMS technique which requisitely accompanies high costs and complicated processes, in the case a producer adopts the acoustic/electric converting element 10 as an essential part of the acoustic/electric converting package 70 without any special measure, the producer should endure the problem of deteriorated price competitiveness in addition to the above problems.

In particular, since the acoustic/electric converting element 10 does not have an independent protection cover in itself, the acoustic/electric converting element 10 is very weak against various external impacts (for example, a physical impact, an electronic wave impact, or the like), and as a result, a producer may use the acoustic/electric converting element 10 just as a subordinate part of the acoustic/electric converting package 70 and is not able to utilize the acoustic/electric converting element 10 widely in an independent way.

Meanwhile, under the above system, if the acoustic/electric converting package 70 is surface-mounted to the circuit board 300 included in an electronic device (an information communication device, a acoustic device, or the like), the substrate 40 of the acoustic/electric converting package 70 is surface-mounted to the circuit board 300 while corresponding the sound inlet 41 to the sound inlet hole 301 of the circuit board 300.

Under this mounting structure, since the substrate 40 and the circuit board 300 may not form a perfect adhesion, a gap is inevitably created between them. In this circumstance, unless a separate reinforcing structure is additionally disposed, the sound flowing into the sound inlet hole 301 and the sound inlet 41 leaks out through the gaps, which is a serious problem.

In the above configuration, it is considered that an acoustic sealing pattern 50 is additionally disposed at one side of the substrate 40 where the substrate 40 contacts the circuit board 300, as shown in Figs. 1 and 2.

At this time, in the case where the acoustic sealing pattern 50 is surface-mounted to the corresponding circuit board 300 while the substrate 40 of the acoustic/electric converting package 70 corresponds the sound inlet 41 to the sound inlet hole 301 of the circuit board 300, securely reinforcing the interface of the substrate 40 and the circuit board 300 leads the sound inlet hole 301 and the sound inlet 41 to form an acoustic sealing structure. As a result, if the acoustic sealing pattern 50 functions as above, the leakage of sound may be naturally prevented at the sound inlet hole 301 and the sound inlet 41.

However, in the above system, since the acoustic sealing pattern 50 forms a closed ring structure which does not allow a gap as shown in Fig. 2, in the case where the substrate 40 and the circuit board 300 are coupled by a predetermined mounting process, the acoustic/electric converting package 70 may face a situation where the sound inlet 41 in the acoustic sealing pattern 50 is inevitably isolated from the surrounding.

In the case where the sound inlet 41 in the acoustic sealing pattern 50 is perfectly isolated from the surrounding due to the closed structure of the acoustic sealing pattern 50 as described above, the static pressure equilibrium between the pressure of air surrounding the corresponding sound inlet 41 and the atmospheric pressure out of the acoustic sealing pattern 50 may be greatly broken inevitably.

In the state where the static pressure equilibrium between the pressure of air surrounding the corresponding sound inlet 41 and the atmospheric pressure is seriously broken, if the process of surface-mounting the acoustic/electric converting package 70 to the circuit board 300 included in an electronic device (an information communication device, an acoustic device, or the like) is enforced under a severe condition of high temperature and high pressure without any additional measure, it cannot to be avoided that a strong internal air pressure as well as a gas created by dissolution of a cream solder used for bonding the circuit board are excessively applied to the acoustic/electric converting element 10 located above the sound inlet 41, which results in inevitable serious functional damage of the acoustic/electric converting element 10.

Since the acoustic/electric converting element 10 is a very essential part among components of the acoustic/electric converting package 70, if the acoustic/electric converting element 10 is damaged by a strong internal air pressure, a cream solder dissolution gas, or the like, the acoustic/electric converting package 70 is absolutely not able to perform its own sound/acoustic converting function. As a result, a producer (a producer of the acoustic/electric converting package, the electronic device, or the like) should endure the problem of seriously deteriorated product competitiveness.

Meanwhile, under the above system, since the acoustic/electric converting package 70 demands surrounding circumstances to be precisely set in agreement with its inherent characteristics (for example, electric characteristics, design characteristics or the like) in order to perform a normal acoustic/electric converting function, the acoustic/electric converting package 70 may perform an acoustic/electric converting function normally on the circuit board 300 which satisfies the surrounding circumstances. However, on other circuit boards (for example, a circuit board for an ECM microphone) not satisfying the above surrounding circumstances, the acoustic/electric converting package 70 is unable to perform its acoustic/electric converting function normally (namely, the acoustic/electric converting package 70 has a critical defect in that it may be installed/operated only on circuit boards of some electronic devices).

For example, since the conventional acoustic/electric converting package 70 demands a power supply terminal for supplying power as a requisite element inevitable for performing its operations, the acoustic/electric converting package 70 may perform its acoustic/electric converting function normally on the circuit board 300 (namely, a circuit board for a package) having the power supply terminal normally. However, the acoustic/electric converting package 70 is unable to normally perform the acoustic/electric converting function on other circuit boards (for example, a circuit board for an ECM microphone) having only a ground terminal and an output signal receiving terminal without a power supply terminal, and as a result, the acoustic/electric converting package 70 has a critical defect in that it may be installed/operated only on circuit boards 300 (namely, a circuit board for a package) of specific electronic devices.

Under a fussy circumstance where the acoustic/electric converting package 70 is selectively operated only on circuit boards of specific electronic devices, producers (for example, producers of acoustic/electric converting packages, electronic devices or the like) may feel great difficulty in flexible management of products, and as a result, great deterioration of product competitiveness is inevitable.

The present disclosure is directed to greatly improving an overall product structure of a general reverse-type acoustic/electric converting package to <a monolithic acoustic capsule capable of forming an independent self-standing fixing structure (namely, a self-standing fixing structure independent of curling of the case) of a-excellent sound-detecting mechanisms (a vibration plate, a fixing plate, the dielectric plate or the like) just by a simple coupling operation of a partial block structure (for example, a conductive/compression metal block and a insulation/compression base block) without any separate complex procedure and capable of performing the function of the acoustic/electric converting element instead> and <a structure supporting the monolithic acoustic capsule and including a sound inlet, an acoustic sealing pattern, a circuit chip or the like>. By doing so, it is possible to simplify the product manufacturing process, lower a production cost, and maximize independent utilization of parts (for example, the monolithic acoustic capsule) to an optimal status. Therefore, the present disclosure may guide a producer to effectively solve various problems (for example, deteriorated production efficiency, increased production costs, complicated quality management, difficult yield management, deteriorated price competitiveness, difficult independent utilization of parts or the like).

The present disclosure is also directed to additionally forming <a sound inlet opening passage (for example, a spiral separating sound inlet opening passage)> at a part of the acoustic sealing pattern of the substrate so that the acoustic sealing pattern forms an open structure having a gap (namely, a sound inlet opening passage), different from general cases. By doing so, even when the substrate is surface-mounted to a circuit board of an electronic device, the surrounding air pressure of the sound inlet located in the acoustic sealing pattern may be in static pressure equilibrium with the atmospheric pressure out of the acoustic sealing pattern through the sound inlet opening passage. Therefore, producers (producers of acoustic/electric converting packages, electronic devices or the like) may easily avoid the damage of the product caused by corresponding process circumstances (for example, introduction of internal air pressure, introduction of cream solder dissolution gas or the like) while performing <the process of surface-mounting the product to the circuit board included in an electronic device (an information communication device, an acoustic device, or the like) under a severe condition of high temperature and high pressure>.

The present disclosure is also directed to flexibly applying and implementing <a measure of additionally including/installing a load register electrically connecting to the circuit chip in the printed circuit substrate so that the corresponding circuit chip may normally obtain/adjust an operating power by utilizing the load register in the printed circuit substrate even under a circumstance where a load register is not installed at the circuit board of the electronic device> and <a measure of additionally installing the ground terminal, the signal output terminal, and the power receiving terminal at a joint portion of the printed circuit substrate joined to the circuit board of the electronic device, and electrically connecting both of the signal output terminal and the power receiving terminal to the load register and the circuit chip in the printed circuit substrate so that the load register and the circuit chip may indirectly utilizing the output signal receiving terminal and the signal output terminal to normally obtain an operating power supplied from the electronic device even under a circumstance where only the ground terminal and the output signal receiving terminal are provided at the circuit board of the electronic device (namely, under a circumstance where a separate power supply terminal is not provided)>. By doing so, a final product may perform stable hybrid-type operations at both the circuit board for an ECM microphone (namely, a circuit board having no power supply terminal) and the circuit board for a package (namely, a circuit board where a load register is not provided). As a result, producers (for example, producers of acoustic/electric converting devices, electronic devices or the like) may greatly improve price competitiveness of their products without difficulty.

Other objects of the present disclosure will be more apparent from the following detailed description and the accompanying drawings.

In one general aspect, there is provided a reverse-type hybrid acoustic/electric converting device, which includes: a cover container; mechanisms fixedly received in the cover container and vibrating by the sound flowing into the cover container; and a printed circuit substrate which supports the cover container, has a circuit clip for electrically processing a static capacity change according to vibration of the mechanisms and a sound inlet for flowing in a sound, and is mounted to a circuit board of an electronic device while corresponding the sound inlet to a sound inlet hole of the circuit board of the corresponding electronic device, wherein each of the mechanisms includes: a vibration plate received in the cover container and vibrating by a sound wave input through the cover container; a fixing plate for fixing the vibration plate; a dielectric plate supporting the fixing plate and maintaining a gap with the vibration plate; an insulation/compression base block closely received in the cover container in a state of compressing and surrounding outer portions of the vibration plate, the fixing plate, and the dielectric plate to fix the vibration plate, the fixing plate, and the dielectric plate at the inside of the cover container, and electrically insulating the vibration plate, the fixing plate, and the dielectric plate from the cover container; and a conductive/compression metal block closely received in the insulation/compression base block in a state where the insulation/compression base block is closely received in the cover container, to compress and fix the vibration plate, the fixing plate, and the dielectric plate into the cover container, and electrically connecting the dielectric plate and the printed circuit substrate.

When the substrate is surface-mounted to the circuit board of the electronic device, an acoustic sealing pattern for sealing the sound inlet and the sound inlet hole so that a sound flowing through the sound inlet and the sound inlet hole does not leak out may be disposed around the sound inlet by reinforcing an interface of the substrate and the circuit board, and a sound inlet opening passage for exposing the sound inlet out of the acoustic sealing pattern may be formed at a part of the acoustic sealing pattern.

A load register for driving the circuit chip may be disposed at a part of the printed circuit substrate; a ground terminal, a signal output terminal, and a power receiving terminal, electrically connecting to the circuit board of the electronic device, may be disposed at another part of the printed circuit substrate; and the load register may electrically connect to the signal output terminal and the power receiving terminal.

In the present disclosure, since an overall product structure of a general reverse-type acoustic/electric converting package is greatly improved to <a monolithic acoustic capsule capable of forming an independent self-standing fixing structure (namely, a self-standing fixing structure independent of curling of the case) of a-excellent sound-detecting mechanisms (a vibration plate, a fixing plate, the dielectric plate or the like) just by a simple coupling operation of a partial block structure (for example, a conductive/compression metal block and a insulation/compression base block) without any separate complex procedure and capable of performing the function of the acoustic/electric converting element instead> and <a structure supporting the monolithic acoustic capsule and including a sound inlet, an acoustic sealing pattern, a circuit chip or the like>, under the implementation circumstance of the present disclosure, it is possible to simplify the product manufacturing process, lower a production cost, and maximize independent utilization of parts (for example, the monolithic acoustic capsule) to an optimal status. Therefore, the present disclosure may effectively solve various problems (for example, deteriorated production efficiency, increased production costs, complicated quality management, difficult yield management, deteriorated price competitiveness, difficult independent utilization of parts or the like).

In addition, in the present disclosure, <a sound inlet opening passage (for example, a spiral separating sound inlet opening passage)> is additionally formed at a part of the acoustic sealing pattern of the substrate so that the acoustic sealing pattern forms an open structure having a gap (namely, a sound inlet opening passage), different from general cases. By doing so, even when the substrate is surface-mounted to a circuit board of an electronic device, the surrounding air pressure of the sound inlet located in the acoustic sealing pattern may be in static pressure equilibrium with the atmospheric pressure out of the acoustic sealing pattern through the sound inlet opening passage. Therefore, producers (producers of acoustic/electric converting packages, electronic devices or the like) may easily avoid the damage of the product caused by corresponding process circumstances (for example, introduction of internal air pressure, introduction of cream solder dissolution gas or the like) while performing <the process of surface-mounting the product to the circuit board included in an electronic device (an information communication device, an acoustic device, or the like) under a severe condition of high temperature and high pressure>.

Further, in the present disclosure, <a measure of additionally including/installing a load register electrically connecting to the circuit chip in the printed circuit substrate so that the corresponding circuit chip may normally obtain/adjust an operating power by utilizing the load register in the printed circuit substrate even under a circumstance where a load register is not installed at the circuit board of the electronic device>, <a measure of additionally installing the ground terminal, the signal output terminal, and the power receiving terminal at a joint portion of the printed circuit substrate joined to the circuit board of the electronic device, and electrically connecting both of the signal output terminal and the power receiving terminal to the load register and the circuit chip in the printed circuit substrate so that the load register and the circuit chip may indirectly utilize the output signal receiving terminal and the signal output terminal to normally obtain an operating power supplied from the electronic device even under a circumstance where only the ground terminal and the output signal receiving terminal are provided at the circuit board of the electronic device (namely, under a circumstance where a separate power supply terminal is not provided)> or the like are flexibly applied and implemented. By doing so, under the implementation of the present disclosure, a final product may perform stable hybrid-type operations at both the circuit board for an ECM microphone (namely, a circuit board having no power supply terminal) and the circuit board for a package (namely, a circuit board where a load register is not provided). As a result, producers (for example, producers of acoustic/electric converting devices, electronic devices or the like) may greatly improve price competitiveness of their products without difficulty.

Fig. 1 is a schematic view exemplarily showing a general reverse-type acoustic/electric converting package.

Fig. 2 is a perspective view of Fig. 1 where the package is reversed.

Fig. 3 is an exploded perspective view exemplarily showing a reverse-type hybrid acoustic/electric converting device according to the present disclosure.

Fig. 4 is a perspective view of Fig. 3 where the device is reversed.

Fig. 5 is an exploded perspective view exemplarily showing the reverse-type hybrid acoustic/electric converting device according to the present disclosure which is surface-mounted to a circuit board of an electronic device.

Fig. 6 is a perspective view showing an acoustic capsule and a printed circuit substrate of the reverse-type hybrid acoustic/electric converting device according to the present disclosure, separately.

Fig. 7 is a perspective view of Fig. 6 where the device is reversed.

Fig. 8 is a schematic view exemplarily showing a reverse-type hybrid acoustic/electric converting device according to another embodiment of the present disclosure, which is surface-mounted to a circuit board of an electronic device.

Fig. 9 is a perspective view of Fig. 8 where the device is reversed.

Figs. 10 and 11 are diagrams conceptually showing a process of mounting the reverse-type hybrid acoustic/electric converting device according to the present disclosure to a circuit board for an ECM microphone and a circuit connection relation thereof.

Figs. 12 and 13 are diagrams conceptually showing a process of mounting the reverse-type hybrid acoustic/electric converting device according to the present disclosure to a circuit board for a package and a circuit connection relation thereof.

Fig. 14 is a diagram conceptually showing a circuit connection relation of a circuit chip (J-FET) and a load register attached to the reverse-type hybrid acoustic/electric converting device according to the present disclosure.

Hereinafter, a reverse-type hybrid acoustic/electric converting device according to the present disclosure will be described in more detail with reference to the drawings.

As shown in Figs. 3 and 4, the reverse-type hybrid acoustic/electric converting device 100 according to the present disclosure includes a cover container 110, mechanisms 150 received in the inner space of the cover container 110 and vibrating by the sound input trough a sound inlet 191 of the substrate 190, a printed circuit substrate 190 supporting the cover container 110 and, in a state where a sound inlet 191 is provided in a lower portion thereof (namely, in a state where a reverse type is implemented), including <a circuit chip 192 (for example, a FET chip, an analog ASIC chip, a digital ASIC chip, an analog ASIC Die, and a digital ASI Die) for electrically processing static capacity changes of the mechanisms 150 according to vibration (here, in the case where the circuit chip is a FET chip, a load register described later is disposed separately from the circuit chip) (also, in the state where the circuit chip is an analog ASIC chip, a digital ASIC chip, an analog ASIC Die, a digital ASI Die or the like, the function of the load register is disposed separately from the ASIC element, and the FET function is integrated with the ASIC element)>, <a noise reduction element 194 (for example, a capacitor element, an inductor element, a resistance element or the like) for reducing external RF noise>, which are systematically combined.

Here, the printed circuit substrate 190 has a greater size than the cover container 110 and is configured to support the corresponding cover container 110, and in this case, an adhesive body (for example, a cream solder, an adhesive film, an adhesive or the like) for adhering the cover container 110 is disposed in advance on the surface of the printed circuit substrate 190 which corresponds to the rim of the cover container 110.

The reverse-type hybrid acoustic/electric converting device 100 according to the present disclosure is surface-mounted to a circuit board 300 included in an electronic device (an information communication device, an acoustic device, or the like) later, as shown in Fig. 5, to form an electric connection relation with the corresponding circuit board 300, thereby normally performing its acoustic/electric converting role. In this case, the substrate 190 of the acoustic/electric converting device 100 is surface-mounted to the circuit board 300 while corresponding the sound inlet 191 to the sound inlet hole 301 of the corresponding circuit board 300 (in other words, in a state where the reverse type is implemented).

At this time, the mechanisms 150 may be configured so that a vibration plate assembly 120, a spacer plate 123, an insulation/compression base block 130, a conductive/compression metal block 170, a dielectric plate 140, a back chamber expansion fence 124 or the like, which are placed on the upper portion of the cover container 110 and loaded in the inner receiving space of the cover container 110, are combined (the kind and arrangement of the mechanisms 150 may be flexibly changed depending on the situation). In this case, the back chamber expansion fence 124 is made of conductive metal material, and in this situation, the back chamber expansion fence 124 is configured to contact the lower surface thereof with the bottom surface of the cover container 110 electrically/physically and plays a role of expansively defining the region of the back chamber S of the device 100.

At this time, the vibration plate assembly 120 is configured so that a fixing plate 122 and a vibration plate 121 are combined, and the dielectric plate 140 may be selectively made of, for example, polymer material or Si material depending on the situation.

Here, the cover container 110 is made of, for example, aluminum (Al) or copper (Cu), the fixing plate 122 is made of, for example, a nickel (Ni)-plated brass plate, the spacer plate 123 is made of, for example, a polyethylene terephthalate (PET) film, a polyimide (PI) film or the like, and the vibration plate 121 is made of a gold- or nickel-coated PET film, a gold- or nickel-coated polyphenylene sulfide (PPS) film or the like (the material, shape or the like of each component may be variously changed depending on the situation).

At this time, when the mechanisms 150 are coupled, the insulation/compression base block 130 is configured to compress and surround the outer portions of the back chamber expansion fence 124, the dielectric plate 140, and the spacer plate 123 to be closely received in the cover container 110, thereby performing <a role of fixing the back chamber expansion fence 124, the dielectric plate 140, the spacer plate 123 or the like in the cover container 110>, <a role of electrically connecting the back chamber expansion fence 124, the dielectric plate 140 or the like to the cover container 110> or the like.

In addition, in the case where the insulation/compression base block 130 is closely received in the cover container 110, as shown in Fig. 6, the conductive/compression metal block 170 is configured to be closely received in the insulation/compression base block 130, thereby performing <a role of helping the vibration plate 121 and the fixing plate 122 surrounded by the insulation/compression base block 130 and placed on the upper portion of the spacer plate 123 to be pressed and fixed into the cover container 110> and <a role of electrically connecting the vibration plate 121 and the fixing plate 122 to a gate terminal of the circuit chip 192 (for example, FET) on the printed circuit substrate 190>.

In this case, the insulation/compression base block 130 and the conductive/compression metal block 170 are integrally received in the cover container 110 to form a monolithic acoustic capsule 100a according to the present disclosure <namely, a monolithic acoustic capsule capable of forming an independent self-standing fixing structure (namely, a self-standing fixing structure independent of curling of the case) of fragility-excellent sound-detecting mechanisms (the vibration plate, the fixing plate, the dielectric plate or the like) just by a simple coupling operation of a partial block structure (for example, the conductive/compression metal block and the insulation/compression base block) without any separate complex procedure and capable of performing the function of the acoustic/electric converting element instead>.

When the insulation/compression base block 130 and the conductive/compression metal block 170 perform the roles, the reverse-type hybrid acoustic/electric converting device 100 according to the present disclosure may stably fix the mechanisms 150 in the cover container 110 without the curling of the cover container 110.

In addition, when the mechanisms 150 are coupled, the conductive/compression metal block 170 is configured to be closely received in the insulation/compression base block 130 and to be capable of contacting the upper portion 170a and the lower portion 170b thereof with the dielectric plate 140 and the printed circuit substrate 190, respectively, so that the dielectric plate 140 and the printed circuit substrate 190 are electrically connected.

When the conductive/compression metal block 170 plays the role, the gap between the vibration plate 121 and the dielectric plate 140 (for reference, the gap is formed as the spacer plate 123 plays the role) is changed due to the external sound passing through the sound inlet hole 301 of the circuit board 300 of the electronic device and the sound inlet 191 of the substrate 190, and if a current signal modification occurs due to the change of the gap, the corresponding current signal modification may be rapidly transmitted to the circuit chip 192 of the printed circuit substrate 190 via the conductive/compression metal block 170. As a result, the acoustic/electric converting device 100 may normally perform its acoustic/electric converting role without any difficulty.

The reverse-type hybrid acoustic/electric converting device 100 according to the present disclosure is completely manufactured by simply assembling mechanisms (for example, the vibration plate assembly 120, the spacer plate 123, the insulation/compression base block 130, the conductive/compression metal block 170, the dielectric plate 140, the back chamber expansion fence 124 or the like), different from the general reverse-type acoustic/electric converting package 70. Therefore, under the implementation circumstance of the present disclosure, producers may easily simplify overall product manufacturing processes and lower production costs. As a result, various problems (for example, deteriorated production efficiency, increased production costs, complicated quality management, difficult yield management, deteriorated price competitiveness or the like) may be effectively solved.

Further, since the monolithic acoustic capsule 100a according to the present disclosure includes various inexpensive and fragility-excellent sound-detecting mechanisms (for example, the vibration plate, fixing plate, the dielectric plate or the like) as main components, different from the general acoustic/electric converting element 10, under the implementation circumstance of the present disclosure, producers may effectively solve various problems caused by the adoption of the acoustic/electric converting element 10 (for examples, complicated product handling, deteriorated price competitiveness or the like).

In particular, since the monolithic acoustic capsule 100a according to the present disclosure includes <the cover container 110 having no separate hole and receiving the mechanisms 150 therein> as its sheath element (a protective cover element), different from the general acoustic/electric converting element 10, even though various impacts (for example, physical impacts, electromagnetic wave impacts or the like) are applied from the outside, it may show an ability to cope with the impacts. As a result, under the implementation circumstance of the present disclosure, producers may widely utilize the monolithic acoustic capsule 100a as not only an auxiliary part of the device 100 but also an independent part in various applications.

Meanwhile, as shown in Fig. 5, under the system of the present disclosure, if the reverse-type hybrid acoustic/electric converting device 100 is configured to be surface-mounted to the circuit board 300 included in an electronic device (an information communication device, an acoustic device, or the like), the substrate 190 of the acoustic/electric converting device 100 is surface-mounted to the corresponding circuit board 300 while corresponding the sound inlet 191 thereof to the sound inlet hole 301 of the circuit board 300.

Under the mounting structure, since the substrate 190 and the circuit board 300 are not able to be perfectly united, a gap is inevitably created between them. In this circumstance, if a separate reinforcing structure is not additionally disposed, the sound flowing to the sound inlet hole 301 and the sound inlet 191 resultantly leaks out through the gap, which is a serious problem.

Therefore, in the present disclosure, as shown in Fig. 7, it is considered to additionally dispose an acoustic sealing pattern 180 at one surface of the substrate 190 where the substrate 190 and the circuit board 300 contact, to surround the vicinity of the sound inlet 191.

At this time, in the case where the substrate 190 of the acoustic/electric converting device 100 is surface-mounted to the circuit board 300 while corresponding its sound inlet 191 to the sound inlet hole 301 of the circuit board 300, the acoustic sealing pattern 180 securely reinforces the interface between the substrate 190 and the circuit board 300, thereby leading the sound inlet hole 301 and the sound inlet 191 to form an acoustic sealing structure. As a result, when the acoustic sealing pattern 180 functions as above, the leakage of sound may be naturally prevented at the sound inlet hole 301 and the sound inlet 191.

At this time, as described above, in the case where the acoustic sealing pattern 180 forms a closed ring structure which does not allow a gap, when the substrate 190 and the circuit board 300 are coupled, the sound inlet 191 in the acoustic sealing pattern 180 may face a situation where it is inevitably isolated from the surrounding. As a result, the static pressure equilibrium between the pressure of its surrounding air and the atmospheric pressure out of the acoustic sealing pattern 180 may be greatly broken inevitably.

In the state where the static pressure equilibrium between the pressure of surrounding air around the sound inlet 191 and the atmospheric pressure is seriously broken, if the process of surface-mounting the device 100 to the circuit board 300 included in an electronic device (an information communication device, an acoustic device, or the like) is enforced without any additional measure, it cannot to be avoided that a strong internal air pressure as well as a gas created by dissolution of a cream solder used for bonding the circuit board are excessively applied to the circuit chip 192 and the mechanism 150 located above the sound inlet 191, which results in inevitable serious functional damage of the circuit chip 192, the mechanism 150 or the like.

In this situation, as shown in Fig. 7, in the present disclosure, <a sound inlet opening passage 181> is additionally formed at a part of the acoustic sealing pattern 180, so that the acoustic sealing pattern 180 may flexibly form an open structure having a gap (namely, the sound inlet opening passage 181), different from the general case. In this case, the number of sound inlet opening passages 181 disposed in the present disclosure may be variously changed depending on the situation.

In the case where the acoustic sealing pattern 180 forms an open structure with a gap (namely, the sound inlet opening passage 181), different from the general case, even when the substrate 190 and the circuit board 300 are coupled, the sound inlet 191 in the acoustic sealing pattern 180 may easily communicate with the surrounding through the sound inlet opening passage 181.

In this situation, even when the substrate 190 is surface-mounted to the circuit board 300 of an electronic device, the pressure of the air around the sound inlet 191 located in the acoustic sealing pattern 180 may be in equilibrium with the atmospheric pressure out of the acoustic sealing pattern 180 through the sound inlet opening passage 181. As a result, producers (producers of acoustic/electric converting packages, electronic devices or the like) may easily avoid the damage of the circuit chip 192, the mechanism 150 or the like caused by corresponding process circumstances (for example, introduction of internal air pressure, introduction of cream solder dissolution gas or the like) while performing <the process of surface-mounting the device 100 to the circuit board 300 included in an electronic device (an information communication device, an acoustic device, or the like) under a severe condition of high temperature and high pressure>.

Meanwhile, when the substrate 190 of the device 100 is surface-mounted to the circuit board 300, the acoustic sealing pattern 180 according to the present disclosure securely reinforces the interface so that the sound inlet hole 301 and the sound inlet 191 may form an acoustic sealing structure. Therefore, in the case where the sound inlet opening passage 181 is additionally formed at a part of the acoustic sealing pattern 180 without any measure, the acoustic sealing structure may be weakened.

Therefore, in the present disclosure, as shown in Fig. 7, the measure of forming the sound inlet opening passage 181 with a spiral separable structure is considered.

In the case where the sound inlet opening passage 181 according to the present disclosure has a spiral separable structure, the entire length of the sound inlet opening passage 181 increases to an optimal value under the given condition.

Generally, when sound leaks through a certain passage, the resistance against sound leakage is defined as an equation <R?L (here, R is the resistance against sound leakage, and L is the length of the passage where sound leaks)>. In other words, when sound leaks through a certain passage, if the length of the passage increases, the resistance against sound leakage increases, and so it is impossible to cause unnecessary sound leakage.

At this time, since the sound inlet opening passage 181 forms the spiral separable structure so that the entire passage length is maintained long at an optimal value under the given condition as described above, under the implementation circumstance of the present disclosure, the sound flowing to the device 100 is impossible to cause an unnecessary sound leakage due to the increase of the resistance against sound leakage. As a result, even though the sound inlet opening passage 181 is additionally formed, the acoustic sealing pattern 180 according to the present disclosure may normally maintain an optimal acoustic sealing structure.

Meanwhile, as shown in Figs. 8 and 9, according to the acoustic/electric converting device according to another embodiment of the present disclosure, a measure of additionally forming/defining a placing groove 193, which may function as a placing portion at an entrance of the sound inlet 191, by processing the entrance of the sound inlet 191 of the substrate 190 is considered, and also a measure of inserting/disposing a sound sealing seat 182 of the present disclosure in the placing structure of the placing groove 193 is considered (at this time, on occasions, a fixing adhesive for stably fixing the sound sealing seat 182 may be additionally disposed in the placing groove 193).

In this case, the material of the sound sealing seat 182 according to the present disclosure may be made of, for example, a net-type metallic non-woven fabric (for example, a net-type nickel non-woven fabric, a net-type nickel-plated non-woven fabric or the like), a net-type insulative non-woven fabric (for example, a net-type fibrous non-woven fabric) or the like.

When the sound sealing seat 182 is disposed as above, in the case where the substrate 190 of the device is surface-mounted to the circuit board 300 while corresponding the sound inlet 191 thereof to the sound inlet hole 301 of the circuit board 300, the sound sealing seat 182 securely reinforces the interface between the substrate 190 and the circuit board 300 as shown in Fig. 8, which leads the sound inlet hole 301 and the sound inlet 191 to stably form an acoustic sealing structure. As a result, when the sound sealing seat 182 functions as above, the sound inlet hole 301 and the sound inlet 191 may naturally prevent leakage of sound.

Even in this situation, as described above, in the case where the sound sealing seat 182 forms a closed ring structure which does not allow a gap, when the substrate 190 and the circuit board 300 are coupled, the sound inlet 191 in the sound sealing seat 182 has no choice but to face an inevitable situation where it is perfectly isolated from the surrounding. As a result, the static pressure equilibrium between the surrounding air pressure and the atmosphere out of the sound sealing seat 182 may be greatly broken inevitably.

In this sensitive situation, since the sound sealing seat 182 according to the present disclosure is made of, for example, a net-type metallic non-woven fabric (for example, a net-type nickel non-woven fabric, a net-type nickel-plated non-woven fabric or the like), a net-type insulative non-woven fabric (for example, a net-type fibrous non-woven fabric) or the like so that a plurality of sound inlet micro opening holes 183 are formed therein, even though the implementation circumstance of the present disclosure varies, even when the substrate 190 and the circuit board 300 are coupled, the sound inlet 191 in the sound sealing seat 182 may easily communicate with the surrounding through the sound inlet micro opening hole 183.

Even in this situation, even when the substrate 190 is surface-mounted to the circuit board 300 of an electronic device, the air pressure around the sound inlet 191 located in the sound sealing seat 182 may be in static pressure equilibrium with the atmospheric pressure of the sound sealing seat 182 through the sound inlet micro opening hole 183. As a result, producers (producers of acoustic/electric converting packages, electronic devices or the like) may easily avoid the damage of the circuit chip 192, the mechanisms 150 or the like, caused by corresponding process circumstances (for example, the introduction of an internal air pressure, the introduction of a cream solder dissolution gas or the like), while performing <the process of surface-mounting the device 100 to the circuit board 300 included in an electronic device (an information communication device, an acoustic device, or the like) under a severe condition of high pressure and high temperature>.

At this time, since the sound inlet micro opening hole 183 according to the present disclosure has numerous arrangements, under another implementation circumstance of the present disclosure, the sound flowing into the device 100 may not cause an unnecessary sound leakage phenomenon due to the increase of the resistance against sound leakage (see the relation between the sound and the resistance against sound leakage described above). As a result, even though the sound inlet micro opening hole 183 is formed, the sound sealing seat 182 according to the present disclosure may normally maintain an optimal acoustic sealing structure.

Meanwhile, under the implementation circumstance of the present disclosure as described above, producers (for example, producers of acoustic/electric converting devices, electronic devices or the like) frequently feel the necessity in that <how about if a final product 100 may be stably operated at both a circuit board 300a for an ECM microphone (for example, a circuit board having no power supply terminal) (see Fig. 10) and a circuit board 300b for a package (namely, a circuit board having no load register) (see Fig. 12)>.

In this sensitive situation, as shown in Figs. 10 and 12, in the present disclosure, <a measure of additionally including/installing a load register 195 which performs circuit processes of a supply power (for example, a process of adjusting a supply power suitable for an output voltage of the circuit chip 192) for operating the circuit chip 192 while electrically connecting the circuit chip 192 to a part (for example, an inner surface) of the printed circuit substrate 190> (in this case, the load register 195 may be configured to be embedded in the printed circuit substrate 190), <a measure of additionally installing a ground terminal 196 for grounding the acoustic/electric converting device 100 to another part (for example, a circuit board contact surface) of the printed circuit substrate 190, a signal output terminal 197 for outputting an electric signal of the acoustic/electric converting device 100 to the outside, a power receiving terminal 198 for receiving the power of the electronic device, or the like> or the like are taken. In addition, as shown in Figs. 11 and 13, <a measure for electrically connecting all of the signal output terminal 197 and the power receiving terminal 198 to the load register 195 of the printed circuit substrate 190 > is flexibly taken.

At this time, as shown in Fig. 14, if an FET is selected as the circuit chip 192 according to the present disclosure, the corresponding FET is preferably a junction field effect transistor (J-FET), and in this case, the load register 195 connects to a drain terminal of the J-FET (for reference, an MOS FET or the like cannot be adopted as the acoustic/electric converting device for an electronic device (a mobile device) due to its noise characteristic).

Under the situation where the above measures are taken, as shown in Fig. 10, in the case where the reverse-type hybrid acoustic/electric converting device 100 according to the present disclosure is loaded on a circuit board 300a for an ECM microphone (namely, a circuit board having no power supply terminal), as shown in Fig. 11, the reverse-type hybrid acoustic/electric converting device 100 may be stably configured to electrically connect the ground terminal 196 to the ground terminal 91 of the circuit board and to electrically connect the signal output terminal 197, which has electrically connected to the load register 195, to an output signal receiving terminal 92 of the circuit board 300a, instead of the power receiving terminal 198. As a result, even in the circumstance where only the ground terminal 91 and the output signal receiving terminal 92 are provided in the circuit board 300a of the electronic device (namely, in a circumstance where a separate power supply terminal is not provided), the hybrid acoustic/electric converting device 100 according to the present disclosure indirectly utilizes the output signal receiving terminal 92 and the signal output terminal 197 so that the operating power supplied from the electronic device may be normally obtained.

In addition, under the situation where the above measures are taken, as shown in Fig. 12, in the case where the reverse-type hybrid acoustic/electric converting device 100 according to the present disclosure is loaded on a circuit board 300b for a package (namely, a circuit board having no load register), as shown in Fig. 13, the hybrid acoustic/electric converting device 100 electrically connects the ground terminal 196, the signal output terminal 197, the power receiving terminal 198 or the like to a ground terminal 91, an output signal receiving terminal 92, a power supply terminal 93 or the like of the circuit board 300b, and utilizes the load register 195 included therein so that an operating power outputting from the power supply terminal 93 is normally obtained/adjusted. As a result, even under a circumstance where a separate load register is not installed to the circuit board 300b, the hybrid acoustic/electric converting device 100 according to the present disclosure may normally perform an acoustic/electric converting function.

As described above, in the present disclosure, <a measure of additionally including/installing a load register 195 electrically connected to the circuit chip 192 at the inside of the printed circuit substrate 190 so that, even though a separate load register is not installed at the circuit board 300a of an electronic device, the corresponding circuit chip 192 may utilize the load register 195 in the printed circuit substrate 190 to normally obtain/adjust an operating power>, <a measure of additionally installing the ground terminal 196, the signal output terminal 197, and the power receiving terminal 198 at a joint portion of the printed circuit substrate 190 joined to the circuit board 300a, 300b of the electronic device, and electrically connecting both of the signal output terminal 197 and the power receiving terminal 198 to the load register 195 and the circuit chip 192 in the printed circuit substrate 190 so that the load register 195 and the circuit chip 192 may indirectly utilize the output signal receiving terminal 92 and the signal output terminal 197 to normally obtain an operating power supplied from the electronic device even under a circumstance where only the ground terminal 91 and the output signal receiving terminal 92 are provided at the circuit board 300b of the electronic device (namely, under a circumstance where a separate power supply terminal is not provided)> or the like are flexibly applied and implemented. Therefore, under the real implementing circumstance of the present disclosure, the final product 100 may perform stable hybrid-type operations at both the circuit board 300a for an ECM microphone (namely, a circuit board having no power supply terminal) and the circuit board 300b for a package (namely, a circuit board where a load register is not provided). As a result, producers (for example, producers of acoustic/electric converting devices, electronic devices or the like) may greatly improve price competitiveness without difficulty.

The present disclosure described above generally exhibits useful effects at various kinds of electronic/electric devices which need an acoustic/electric converting device.

While the exemplary embodiments have been shown and described, it will be understood by those skilled in the art that various changes in form and details may be made thereto without departing from the spirit and scope of this disclosure as defined by the appended claims.

Claims

A reverse-type hybrid acoustic/electric converting device, comprising:

a cover container;

mechanisms fixedly received in the cover container and vibrating by the sound flowing into the cover container; and

a printed circuit substrate which supports the cover container, has a circuit clip for electrically processing a static capacity change according to vibration of the mechanisms and a sound inlet for flowing in a sound, and is mounted to a circuit board of an electronic device while corresponding the sound inlet to a sound inlet hole of the circuit board of the corresponding electronic device,

wherein each of the mechanisms includes:

a vibration plate received in the cover container and vibrating by a sound wave input through the cover container;

a fixing plate for fixing the vibration plate;

a dielectric plate supporting the fixing plate and maintaining a gap with the vibration plate;

an insulation/compression base block closely received in the cover container in a state of compressing and surrounding outer portions of the vibration plate, the fixing plate, and the dielectric plate to fix the vibration plate, the fixing plate, and the dielectric plate at the inside of the cover container, and electrically insulating the vibration plate, the fixing plate, and the dielectric plate from the cover container; and

a conductive/compression metal block closely received in the insulation/compression base block in a state where the insulation/compression base block is closely received in the cover container, to compress and fix the vibration plate, the fixing plate, and the dielectric plate into the cover container, and electrically connecting the dielectric plate and the printed circuit substrate.
The reverse-type hybrid acoustic/electric converting device according to claim 1, wherein, when the substrate is surface-mounted to the circuit board of the electronic device, an acoustic sealing pattern for sealing the sound inlet and the sound inlet hole so that a sound flowing through the sound inlet and the sound inlet hole does not leak out is disposed around the sound inlet by reinforcing an interface of the substrate and the circuit board, and a sound inlet opening passage for exposing the sound inlet out of the acoustic sealing pattern is formed at a part of the acoustic sealing pattern.
The reverse-type hybrid acoustic/electric converting device according to claim 2, wherein the sound inlet opening passage formed at the acoustic sealing pattern has a spiral separable structure.
The reverse-type hybrid acoustic/electric converting device according to claim 1, wherein a placing groove functioning as a placing portion is defined at an entrance of the sound inlet, and a sound sealing seat for sealing the sound inlet and the sound inlet hole so that a sound flowing through the sound inlet and the sound inlet hole does not leak out and for exposing the sound inlet to the outside through a sound inlet micro opening hole is inserted into and disposed in the placing groove by reinforcing an interface of the substrate and the circuit board when the substrate is surface-mounted to the circuit board of the electronic device.
The reverse-type hybrid acoustic/electric converting device according to claim 1, wherein the conductive/compression metal block is made of brass material or plated brass material.
The reverse-type hybrid acoustic/electric converting device according to claim 5, wherein the conductive/compression metal block is made of gold-, silver-, or nickel-plated brass material.
The reverse-type hybrid acoustic/electric converting device according to claim 1,

wherein a load register for driving the circuit chip is disposed at a part of the printed circuit substrate,

wherein a ground terminal, a signal output terminal, and a power receiving terminal, electrically connecting to the circuit board of the electronic device, are disposed at another part of the printed circuit substrate, and

wherein the load register electrically connects to the signal output terminal and the power receiving terminal.
The reverse-type hybrid acoustic/electric converting device according to claim 7, wherein the circuit chip is a junction field effect transistor (JFET), and the load register connects to a drain terminal of the JFET.