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WO2013058506A2 - Composition de résine sensible à la lumière de polyimide pour une diode électroluminescente organique (oled) - Google Patents

Composition de résine sensible à la lumière de polyimide pour une diode électroluminescente organique (oled) Download PDF

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Publication number
WO2013058506A2
WO2013058506A2 PCT/KR2012/008362 KR2012008362W WO2013058506A2 WO 2013058506 A2 WO2013058506 A2 WO 2013058506A2 KR 2012008362 W KR2012008362 W KR 2012008362W WO 2013058506 A2 WO2013058506 A2 WO 2013058506A2
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WIPO (PCT)
Prior art keywords
resin composition
oled
photosensitive resin
bis
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/KR2012/008362
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English (en)
Korean (ko)
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WO2013058506A3 (fr
Inventor
김동명
김병욱
윤혁민
김진우
황치용
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Dongjin Semichem Co Ltd
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Dongjin Semichem Co Ltd
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Priority to CN201280051559.6A priority Critical patent/CN103917916B/zh
Publication of WO2013058506A2 publication Critical patent/WO2013058506A2/fr
Publication of WO2013058506A3 publication Critical patent/WO2013058506A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins

Definitions

  • the present invention relates to a polyimide photosensitive resin composition for OLED, and more particularly, to a polyimide photosensitive resin, which is suitable for forming an organic insulating film of an OLED by using a polyimide precursor that is easy to control molecular weight and solubility, and particularly a sensitivity is remarkably improved.
  • a polyimide photosensitive resin composition for OLED and more particularly, to a polyimide photosensitive resin, which is suitable for forming an organic insulating film of an OLED by using a polyimide precursor that is easy to control molecular weight and solubility, and particularly a sensitivity is remarkably improved.
  • OLEDs organic light emitting diodes
  • AMOLEDs active matrix OLEDs
  • an OLED element typically includes an organic insulating film, and a polyimide photosensitive resin composition is generally used for forming the organic insulating film.
  • the polyimide precursor used in the conventional polyimide photosensitive resin composition was applied with GMA protecting technology, but the polyimide precursor protected with GMA was difficult to control the molecular weight and solubility, and the yield reduction due to gelation was a problem. Because of the low level, there was an urgent need for improvement.
  • the present invention is suitable for forming an organic insulating film of the OLED using a polyimide precursor that is easy to control the molecular weight and solubility, in particular a polyimide photosensitive resin composition that can significantly improve the sensitivity, It is an object of the present invention to provide an OLED substrate including a pattern forming method of an OLED using the same and a cured product of the polyimide photosensitive resin composition.
  • the present invention in the photosensitive resin composition for OLED,
  • a resin comprising i) a polyimide precursor represented by Formula 1 below, and ii) poly hydroxy styrene;
  • polyimide photosensitive resin composition for OLED comprising:
  • X is a tetravalent organic group
  • Y is a divalent organic group
  • R is independently epoxy cyclohexyl methyl methacrylate (ECMMA) or methylglycidyl methacrylate (MGMA)
  • n is an integer of 3-100000.
  • a resin comprising i) 40-90% by weight of polyimide precursor represented by Formula 1, ii) 10-60% by weight of poly hydroxy styrene;
  • the polyimide photosensitive resin composition for OLED containing the solvent so that solid content of the whole polyimide photosensitive resin composition may be 5 to 50 weight%.
  • the present invention also provides an OLED substrate comprising a cured product of the polyimide photosensitive resin composition for OLED.
  • the present invention provides a pattern forming method of an OLED substrate using the polyimide photosensitive resin composition for OLED.
  • the polyimide photosensitive resin composition for OLEDs according to the present invention is suitable for forming an organic insulating film of an OLED by using a polyimide precursor that is easy to control molecular weight and solubility, and in particular, can significantly improve sensitivity.
  • Polyimide photosensitive resin composition for an OLED of the present invention is a resin comprising a) i) a polyimide precursor represented by the general formula (1), ii) polyhydroxy styrene; b) 1,2-quinonediazide compounds; c) crosslinking agents; And d) a solvent.
  • X is a tetravalent organic group
  • Y is a divalent organic group
  • R is independently epoxy cyclohexyl methyl methacrylate (ECMMA) or methylglycidyl methacrylate (MGMA)
  • n is an integer of 3-100000.
  • the polyimide precursor represented by Chemical Formula 1 used in the present invention may be prepared through the process of Scheme 1 below. More preferably, in Scheme 1, X is 2,2-bis (3,4-anhydrodicarboxyphenyl) Hexafluoropropane (6FDA, Formula 2), 5- (2,5-Dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1, A tetravalent organic group derived from 2-dicarboxylic Anhydride (DOCDA, Formula 3), or 2,3,3 ', 4'-Biphenyl tetracarboxylic dianhydride (a-BPDA, Formula 4), Y is a 4,4'-diamino -3,3'-dimethyl-diphenylmethane (DADM, formula 5), 2,2-Bis (3-amino-4-hydroxyphenyl) -hexafluoropropane (Bis-APAF, formula 6), or 1,3-Bis (3- A di
  • the polyimide precursor converts the protecting portion from conventional GMA to epoxy cyclohexyl methyl methacrylate (ECMMA) or methylglycidyl methacrylate (MGMA) to facilitate the control of molecular weight and solubility, and to reduce the yield decrease due to gelation, It improves the sensitivity of the mid photosensitive resin composition.
  • the molecular weight of the polyimide precursor is preferably 3000-10000, preferably 3500-7000. If it is in the above range, solubility control, yield and sensitivity can be further enhanced.
  • the content of the polyimide precursor is preferably used in 40-90% by weight of a) resin used in the present invention. When in the above range, it is possible to further improve the developability, heat resistance and sensitivity.
  • polyhydroxystyrene used as the resin of the present invention is preferably used with a molecular weight of 4000 to 20000, the content is preferably used in 10-60% by weight of the resin used in the present invention.
  • a molecular weight of 4000 to 20000 the content is preferably used in 10-60% by weight of the resin used in the present invention.
  • a) resin of the present invention may further include a novolak resin in addition to the polyimide precursor and polyhydroxy styrene. It is preferable to use a novolak resin prepared through the step polymerization.
  • the novolak resin prepared through the step polymerization may be prepared by condensing an aldehyde and a substituted phenol.
  • the aldehyde is formaldehyde, etc.
  • substituted phenols are ortho-, meta-, para-cresol, 2,4-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5- Xylenol, 2,3,5-trimethylphenol, or mixtures thereof.
  • the polystyrene reduced weight average molecular weight of the novolak resin prepared through the step polymerization is preferably 3,000 to 30,000, more preferably 3,000 to 20,000.
  • a) resin of the present invention comprises a novolak resin
  • the a) resin contains 40-85 wt% of polyimide precursor, 10-55 wt% of polyhydroxystyrene, and 1-20 wt% of novolak resin. good.
  • the 1,2-quinonediazide compound of b) used in the present invention is used as a photosensitive compound.
  • the 1,2-quinonediazide compound may be used as long as it can be applied to a photosensitive composition used for forming an organic insulating film of a known OLED, and is obtained by, for example, reacting a phenol compound with a naphthoquinone diazide sulfonic acid halogen compound. Can be used.
  • the 1,2-quinonediazide compound is 1,2-quinonediazide 4-sulfonic acid ester, 1,2-quinonediazide 5-sulfonic acid ester, 1,2-quinonediazide 6-sulfonic acid ester, or the like. Can be used.
  • the b) 1,2-quinonediazide compound is preferably included 5 to 50 parts by weight based on 100 parts by weight of the resin of a). If the content is less than 5 parts by weight, the difference in solubility of the exposed and non-exposed parts may be difficult to form. If the content exceeds 50 parts by weight, unreacted 1,2-quinonediazide compound may be used when irradiated with light for a short time. It may be difficult to develop due to the excessively low solubility in the aqueous alkali solution being a developer.
  • the crosslinking agent of c) used in the present invention functions to form a crosslinked structure with the resin of a), and preferably, the crosslinking agent is a melanin crosslinking agent.
  • condensation products of urea and formaldehyde condensation products of melamine and formaldehyde, methylol urea alkyl ethers and methylol melamine alkyl ethers obtained from alcohols, and the like can be used.
  • monomethylol urea, dimethylol urea, or the like may be used as a condensation product of the urea and formaldehyde.
  • Hexamethylol melamine may be used as the condensation product of melamine and formaldehyde, and other condensation products of melamine and formaldehyde may be used.
  • the methylol urea alkyl ethers are obtained by reacting a condensation product of urea with formaldehyde with alcohols in part or all of the methylol groups, and specific examples thereof include monomethyl urea methyl ether, dimethyl urea methyl ether, and the like. Can be used.
  • the methylol melamine alkyl ethers are obtained by reacting a condensation product of melamine and formaldehyde with alcohols in part or all of methylol groups, and specific examples thereof include hexamethylolmelamine hexamethyl ether and hexamethylolmelamine hexabutyl ether. Etc. can be used.
  • the compound of the structure where the hydrogen atom of the amino group of melamine was substituted by the hydroxy methyl group and the methoxy methyl group the compound of the structure where the hydrogen atom of the amino group of melamine was substituted by the butoxy methyl group and the methoxy methyl group, etc. can also be used, Especially methylol Preference is given to using melamine alkyl ethers.
  • the melamine-based crosslinking agent is preferably included in an amount of 1 to 30 parts by weight, more preferably 1 to 20 parts by weight, based on 100 parts by weight of the resin of a). If the content is less than 1 part by weight, there is a problem that the photospeed is lowered, and if it exceeds 30 parts by weight, there is a problem that the storage stability is lowered.
  • the solvent of d) used in the present invention serves to form a uniform pattern profile by preventing the flatness and coating stain of the polyimide photosensitive resin composition.
  • the solvent may be alcohol such as methanol, ethanol, benzyl alcohol, hexyl alcohol; Ethylene glycol alkyl ether acetates such as ethylene glycol methyl ether acetate and ethylene glycol ethyl ether acetate; Ethylene glycol alkyl ether propionates such as ethylene glycol methyl ether propionate and ethylene glycol ethyl ether propionate; Ethylene glycol monoalkyl ethers such as ethylene glycol methyl ether and ethylene glycol ethyl ether; Diethylene glycol alkyl ethers such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and prop
  • the solvent is a solvent in which gamma butyrolactone and propylene glycol methyl ether acetate (PGMEA) are mixed in a weight ratio of 10-90: 10-90, respectively.
  • PMEA propylene glycol methyl ether acetate
  • the solvent is preferably included so that the solid content of the entire photosensitive resin composition is 5 to 50% by weight, more preferably 15 to 40% by weight. If the solid content of the total composition is less than 10% by weight, there is a problem that the coating thickness is thin, coating flatness is lowered, and when the content of the solid content exceeds 50% by weight, the coating thickness becomes thick, and the coating equipment is impaired during coating. There is a problem that can be.
  • the photosensitive resin composition of this invention can also be applied also as a negative photosensitive resin composition which contains a positive photosensitive resin composition and a photo-acid generator fundamentally.
  • the photoacid generator is not particularly limited as long as it is a photoacid generator used in the conventional photosensitive resin composition, and preferably, an ionic photoacid generator such as a sulfonium salt and an iodonium salt, a sulfonydiazomethane series, and an N-sulfonyloxyimide series , Benzoin sulfonate type, nitrobenzyl sulfonate type, sulfone type, glyoxime type, triazine type or the like can be used.
  • the sulfonium salt is a salt of a sulfonium cation and a sulfonate (sulfoic acid anion), and the sulfonium cation includes triphenolsulfonium, (4-tert-butoxyphenyl) diphenylsulfonium, and bis (4 -tert-butoxyphenyl) phenylsulfonium, 4-methylphenyldiphenylsulfonium, tris (4-methylphenylsulfonium), 4-tert-butylphenyldiphenylsulfonium, tris (4-tert-butylphenyl) sulfonium , Tris (4-tert-butoxyphenyl) sulfonium, (3-tert-butoxyphenyl) diphenylsulfonium, bis (3-tert-butoxyphenyl) phenylsulfonium, tris (3-tert-butoxy Ph
  • the sulfonate is trifluoromethanesulfonate.
  • the iodonium salt is a salt of an iodonium cation and a sulfonate (sulfoic acid anion), and the iodonium cation is diphenyl iodonium, bis (4-tert-butylphenyl) iodonium, and 4-tert-butoxyphenylphenyl.
  • Iodonium or 4-methoxyphenylphenyl iodonium and the like and the sulfonate is trifluoromethanesulfonate nonafluorobutasulfonate heptadecafluorooctanesulfonate, 2,2,2-trifluoro Roethanesulfonate, pentafluorobenzenesulfonate, 4-trifluoromethylbenzenesulfonate, 4-fluorobenzenesulfonate, toluenesulfonate benzenesulfonate, naphthalenesulfonate, camphorsulfonate, octanesulfonate, dode Silbenzenesulfonate, butanesulfonate, or methanesulfonate.
  • sulfonyl diazomethane-based photoacid generators examples include bis (ethylsulfonyl) diazomethane, bis (1-methylpropylsulfonyl) diazomethane, bis (2-methylpropofylsulfonyl) diazomethane and bis (1).
  • 1-dimethylethylsulfonyl) diazomethane bis (cyclohexylsulfonyl) diazomethane, bis (perfluroloisopropylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (4 -Methylphenylsulfonyl) diazo methane, bis (2,4-dimethylphenylsulfonyl) diazomethane, bis (2-naphthylsulfonyl) diazomethane, 4-methylphenylsulfonylbenzoyldiazomethane, tert-butylcar Bonyl-4-methylphenylsulfonyldiazomethane, 2-naphthylsulfonylbenzoyldiazomethane, 4-methylphenylsulfonyl-2-naphthoyl
  • N-sulfonyloxyimide-based photoacid generator examples include succinic acid imide, naphthalenedicarboxylic acid imide, phthalic acid imide, cyclohexyldicarboxylic acid imide, 5-norbornene-2,3-dicarboxyl Imide skeletons such as acid imides or 7-oxabicyclo [2,2,1] -5-heptene-2,3-dicarboxylic acid imides, trifluoromethanesulfonate, and nonafluorobutanesulfo Nate, Heptadecafluorooctanesulfonate, 2,2,2-trifluoroethanesulfonate, pentafluorobenzenesulfonate, 4-trifluorofluoromethylbenzenesulfonate, 4-fluorobenzenesulfonate, toluene Sulfonates, benzenesulfonates, na
  • benzoin sulfonate-based photoacid generator examples include benzointosylate, benzoin mesylate, or benzoin butanesulfonate.
  • the nitrobenzylsulfonate-based photoacid generator includes 2,4-dinitrobenzylsulfonate, 2-nitrobenzylsulfonate, or 2,6-dinitrobenzylsulfonate, and the like.
  • the sulfone-based photoacid generators include bis (phenylsulfonyl) methane, bis (4-methylphenylsulfonyl) methane, bis (2-naphthylsulfonyl) methane, 2,2-bis (phenylsulfonyl) propane, 2,2 -Bis (4-methylphenylsulfonyl) propane, 2,2-bis (2-naphthylsulfonyl) propane, 2-methyl-2- (p-toluenesulfonyl) propiononeone, 2- (cyclohexylcarbonyl) -2- (p-toluenesulfonyl) propane or 2,4-dimethyl-2- (p-toluenesulfonyl) pentan-3-one and the like.
  • Examples of the glyoxime-based photoacid generators include bis-o- (p-toluenesulfonyl) - ⁇ -dimethylglyoxime, bis-o- (p-toluenesulfonyl) - ⁇ -dimethylglyoxime and bis-o- (p -Toluenesulfonyl) - ⁇ -disotlohexylglyoxime, bis-o- (p-toluenesulfonyl) -2,3-pentanedioneglyoxime, bis-o- (p-toluenesulfonyl) -2- Methyl-3,4-pentanedioneglyoxime, bis-o- (n-butanesulfonyl) - ⁇ -dimethylglyoxime, bis-o- (n-butanesulfonyl) - ⁇ -dimethylglyoxime, bis-o
  • the triazine-based photoacid generator includes PDM-Triazine, WS-Triazine, PDM-Triazine, Dimethoxy-Triazine, MP-Triazine, TFE-Triazine, or TME-Triazine (Sam Chemical).
  • the photoacid generator is preferably included in 1 to 20 parts by weight, more preferably 1 to 10 parts by weight with respect to 100 parts by weight of the resin of a). If the content is less than 1 part by weight, there is a problem that the photospeed is reduced, and if it exceeds 20 parts by weight, outgassing and storage stability may be reduced.
  • the photosensitive resin composition of this invention which consists of such components can further contain surfactant as needed.
  • the said surfactant functions to improve the adhesiveness, applicability
  • the surfactant may be polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, F171, F172, F173 (trade name: Japan Nippon Ink Company), FC430, FC431 (trade name: Sumitomo Triem, Inc.), or KP341 (trade name: Shinwol) Chemical industry) and the like.
  • the surfactant is preferably included in an amount of 0.0001 to 2 parts by weight based on 100 parts by weight of the resin of a), and when the content is in the above range, it is more preferable in improving the coating property and developability of the photosensitive composition.
  • the solid content concentration of the polyimide photosensitive resin composition for OLEDs of the present invention comprising the above components is preferably 10 to 50 parts by weight, and the composition having a solid content in the above range is filtered through a 0.1-0.2 ⁇ m Millipore filter or the like. It is good to use.
  • the present invention also provides an OLED substrate comprising a cured product of the polyimide photosensitive resin composition for OLED and a pattern forming method of the OLED substrate using the polyimide photosensitive resin composition for OLED.
  • the pattern formation method of the OLED substrate of this invention is a method of forming the pattern of an OLED substrate using the photosensitive resin composition, It is characterized by using the said polyimide photosensitive resin composition for OLED.
  • the substrate is an AMOLED substrate.
  • a method of forming a pattern of an OLED substrate using the polyimide photosensitive resin composition for OLED is as follows.
  • the polyimide photosensitive resin composition for OLED of this invention is apply
  • the prebaking is preferably carried out for 1-15 minutes at a temperature of 80-120 °C.
  • the developer is preferably an aqueous alkali solution, specifically, inorganic alkalis such as sodium hydroxide, potassium hydroxide and sodium carbonate; Primary amines such as ethylamine and n-propylamine; Secondary amines such as diethylamine and n-propylamine; Tertiary amines such as trimethylamine, methyldiethylamine, dimethylethylamine and triethylamine; Alcohol amines such as dimethylethanolamine, methyl diethanolamine and triethanolamine; Or an aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide or tetraethylammonium hydroxide can be used.
  • the developer is used by dissolving the alkaline compound at a concentration of 0.1-10% by weight, and an appropriate amount of a water-soluble organic solvent such as methanol and ethanol and a surfactant may be added.
  • the pattern is 30-90 minutes at a temperature of 130-250 °C by a heating apparatus such as an oven The heat treatment can give a final pattern.
  • the polyimide photosensitive resin composition for OLEDs according to the present invention is suitable for forming an organic insulating film of an OLED by using a polyimide precursor having easy solubility control, and is particularly suitable for application to an OLED manufacturing process by remarkably improving sensitivity.
  • the prepared polyimide precursor 20 parts by weight of polyhydroxystyrene, 20 parts by weight of 1,2-quinonediazide compound and 5 parts by weight of hexamethylolmelamine were mixed with a melamine crosslinking agent.
  • the mixture was dissolved in a solvent in which gamma butyrolactone and PGMEA were mixed at a weight ratio of 50:50 so that the solid content of the mixture was 20% by weight, and then filtered through a 0.2 ⁇ m millipore filter for polyimide photosensitive resin for OLED.
  • the composition was prepared.
  • the polyimide photosensitive resin composition for OLED was prepared in the same manner as in Example 1, except that 10 g of ECMMA was used to prepare the polyimide precursor in Example 1.
  • Example 1 Except for using MGMA 10 g instead of ECMMA in Example 1 was prepared in the same manner as in Example 1 polyimide photosensitive resin composition for OLED.
  • the polyimide photosensitive resin composition for OLED was manufactured in the same manner as in Example 1, except that 3 parts by weight of triazine-based TME-Triazine was further used as a photoacid generator in Example 1.
  • the polyimide photosensitive resin composition for OLED was manufactured in the same manner as in Example 1, except that 8 g of GMA was used instead of ECMMA in Example 1.
  • the polyimide photosensitive resin composition for OLED was manufactured in the same manner as in Example 1, except that 10 g of GMA was used instead of ECMMA in Example 1.
  • the polyimide photosensitive resin composition for OLED of Examples 1 to 4 prepared according to the present invention was excellent in both solubility and sensitivity at the same time, from the above results, polyimide photosensitive for OLED according to the present invention It was found that the resin composition can obtain more excellent results when applied to the OLED manufacturing process, especially the AMOLED manufacturing process.
  • the polyimide photosensitive resin composition for OLEDs according to the present invention is suitable for forming an organic insulating film of an OLED by using a polyimide precursor that is easy to control molecular weight and solubility, and in particular, can significantly improve sensitivity.

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

La présente invention porte sur une composition de résine sensible à la lumière de polyimide pour une OLED, et, plus particulièrement, porte sur une composition de résine sensible à la lumière de polyimide pour une OLED, comprenant : a) une résine comprenant i) un précurseur de polyamide et ii) du poly(hydroxy styrène) (poly hydroxy styrène) ; b) un composé 1,2-quinone diazide ; c) un agent réticulant ; et d) un solvant. La composition de résine sensible à la lumière de polyimide conformément à la présente invention est appropriée pour former un film isolant organique d'une OLED par l'utilisation d'un précurseur de polyimide dont la masse moléculaire et la solubilité sont facilement ajustées.
PCT/KR2012/008362 2011-10-18 2012-10-15 Composition de résine sensible à la lumière de polyimide pour une diode électroluminescente organique (oled) Ceased WO2013058506A2 (fr)

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CN201280051559.6A CN103917916B (zh) 2011-10-18 2012-10-15 有机发光二极管用聚酰亚胺感光性树脂组合物

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KR1020110106383A KR101882217B1 (ko) 2011-10-18 2011-10-18 오엘이디용 폴리이미드 감광성 수지 조성물
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KR101840416B1 (ko) * 2011-12-06 2018-03-20 주식회사 동진쎄미켐 레이저 열전사용 폴리이미드 감광성 조성물
KR102242869B1 (ko) * 2014-02-28 2021-04-21 주식회사 동진쎄미켐 감광성 폴리이미드 수지, 이를 포함하는 조성물 및 이를 이용한 고분자막 형성방법
KR102433079B1 (ko) * 2017-04-28 2022-08-17 주식회사 동진쎄미켐 감광성 수지 조성물
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JPWO2016035593A1 (ja) * 2014-09-02 2017-06-15 東レ株式会社 樹脂および感光性樹脂組成物

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TWI585525B (zh) 2017-06-01
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KR20130042212A (ko) 2013-04-26
KR101882217B1 (ko) 2018-07-26
CN103917916B (zh) 2017-11-07
WO2013058506A3 (fr) 2013-07-04

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