[go: up one dir, main page]

WO2013058004A1 - Appareil de remise en circulation de fluide actif usagé - Google Patents

Appareil de remise en circulation de fluide actif usagé Download PDF

Info

Publication number
WO2013058004A1
WO2013058004A1 PCT/JP2012/069805 JP2012069805W WO2013058004A1 WO 2013058004 A1 WO2013058004 A1 WO 2013058004A1 JP 2012069805 W JP2012069805 W JP 2012069805W WO 2013058004 A1 WO2013058004 A1 WO 2013058004A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
supply
fluid
working fluid
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/069805
Other languages
English (en)
Japanese (ja)
Inventor
努 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2013058004A1 publication Critical patent/WO2013058004A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/04—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of solid grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Definitions

  • the present invention relates to a processing waste liquid circulating device that is regenerated as the processing waste liquid circulates in the apparatus and reused as the processing liquid.
  • devices such as ICs and LSIs are formed in a plurality of regions on the surface of a substantially disk-shaped semiconductor wafer divided in a grid pattern by division lines.
  • Each semiconductor device is manufactured by cutting the semiconductor wafer with a dicer or the like along the planned dividing line.
  • a cutting fluid pump that supplies cutting fluid (machining fluid), a pump motor that drives the cutting fluid pump, and a pump motor control unit that controls the operation of the pump motor are provided.
  • a cutting fluid amount control device that controls the amount of cutting fluid supplied according to a cutting object. In the case of a material that requires a small amount of cutting, the rotational speed of the pump motor is controlled to be low, and a small amount of cutting fluid is supplied.
  • Patent Document 2 a machining fluid circulation path is separately provided, and even when the flow rate of the machining fluid is smaller than the minimum allowable flow rate value of the pump, the pump can ensure a flow rate corresponding to the minimum allowable flow rate value.
  • a working fluid supply apparatus is disclosed.
  • Patent Document 1 the amount of cutting fluid supplied is controlled in accordance with the object to be cut.
  • the pump motor since the pump motor is started from the stopped state at the start of cutting, a considerable time is required until the pump motor reaches the target rotational speed. For this reason, there is a problem in that the supply amount may not be able to catch up when the object to be cut changes frequently.
  • Patent Document 2 since the pump is started from a stopped state at the start of cutting, there is a problem that it takes a considerable time for the amount of machining fluid to reach the target flow rate and stabilize. .
  • the present invention has been made in view of the above circumstances, and provides a processing waste liquid circulating apparatus that can circulate a processing liquid without supplying it to the processing apparatus and can achieve homogenization of the quality and temperature of the processing liquid.
  • the purpose is to provide.
  • a processing waste liquid circulation apparatus is a processing waste liquid circulation apparatus that supplies a processing liquid to a processing apparatus, regenerates the used processing liquid, and supplies the processed liquid again to the processing apparatus.
  • a return pipe for returning the machining liquid to the tank from the middle, and the supply amount of the machining liquid of the supply pump can be changed by inverter control.
  • the return pipe is And a control means for guiding the processing liquid to the tank.
  • the amount of machining fluid supplied from the supply pump can be changed by inverter control. When the amount of machining fluid supplied is less than the specified amount, the machining fluid is guided to the tank via the return pipe. It is possible to circulate without supplying, and it is not necessary to stop the supply pump even when the processing apparatus is stopped.
  • the working fluid is returned to the tank by the return pipe, there is no temperature difference between the circulating working fluid and the working fluid stored in the tank, and the inside of the tank can be stirred. It is also possible to homogenize the quality and temperature of the working fluid.
  • the processing waste liquid circulation device is provided with an electromagnetic on-off valve that opens and closes a path to the return pipe, and the control means is configured to switch the electromagnetic on-off valve when the amount of processing liquid supplied is less than a predetermined amount. Is preferably opened.
  • an electromagnetic on-off valve that opens and closes the path to the return pipe is provided, and the electromagnetic on-off valve opens when the amount of machining fluid supplied is less than a predetermined amount.
  • the supply pump is not stopped, the machining liquid can be stably supplied with the start of the operation of the machining apparatus.
  • control unit receives a processing liquid supply request from the processing apparatus, and varies the processing liquid supply amount according to the received supply request.
  • the machining fluid supply amount can be adjusted according to the number of processing devices operating. it can.
  • the processing waste liquid circulation apparatus is provided with a pressure gauge and a flow meter in front of the return pipe, and the control means is configured to control the processing liquid based on the measured values of the pressure gauge and the flow meter. It is preferable to vary the supply amount.
  • a pressure gauge and a flow meter are provided in front of the return pipe, and the supply amount of the machining fluid is varied based on the measured values of the pressure gauge and the flow meter. Therefore, it is possible to appropriately adjust the supply amount of the machining fluid according to the number of operating units.
  • the supply amount of the machining fluid of the supply pump can be changed by the inverter control, and when the supply amount of the machining fluid is less than a predetermined amount, the machining fluid is guided to the tank via the return pipe.
  • the machining liquid can be circulated without being supplied to the machining apparatus, and even if the machining apparatus is stopped, there is no need to stop the supply pump.
  • the working fluid is returned to the tank by the return pipe, there is no temperature difference between the circulating working fluid and the working fluid stored in the tank, and the inside of the tank can be stirred. It is also possible to homogenize the quality and temperature of the working fluid.
  • FIG. 7 is a schematic diagram showing the configuration of a conventional processing waste liquid circulation device.
  • the conventional processing waste liquid circulation device includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing devices (processing devices) 1.
  • the working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced.
  • a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
  • the semiconductor wafer is cut by a dicer or the like.
  • the used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13.
  • the used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. .
  • the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17.
  • a filter such as a hollow fiber membrane as the filter device 17
  • impurities such as cutting waste contained in the used machining fluid can be eliminated.
  • the used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19.
  • the buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range.
  • the ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter.
  • the pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
  • the used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21.
  • a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed.
  • the control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value.
  • the neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
  • the neutralizing agent is preferably an aqueous solution containing inorganic phosphoric acid.
  • the neutralizing agent By supplying the neutralizing agent, the pH value of the processing liquid stored in the mixing tank 21 is adjusted, and the pH value can be brought close to the neutral value “7”. Specifically, by supplying the neutralizing agent, the ratio of the neutralizing agent in the solvent of the processing liquid increases, so the degree of the influence of the acidic component or alkaline component eluted in the processing liquid on the entire solvent is reduced. The pH value approaches the neutral value.
  • the used processing liquid whose conductivity and pH value are adjusted is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank 15.
  • the machining liquid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
  • each dicing device 1 is provided with a valve 111.
  • the valve 111 is closed from the dicing device 1 side to supply the processing liquid. Therefore, there was no means other than stopping the supply pump 12. Therefore, the number of stopped dicing apparatuses 1 cannot be grasped by the control apparatus 30, and the supply amount of the machining fluid cannot be adjusted appropriately according to the number of operating dicing apparatuses 1. Therefore, in the present invention, even if any of the dicing apparatuses 1 is stopped, the number of operating dicing apparatuses 1 is estimated without stopping the supply pump 12, and the amount required according to the estimated operating number. Supply the machining fluid.
  • FIG. 1 is a schematic diagram showing a configuration of a processing waste liquid circulation apparatus according to Embodiment 1 of the present invention.
  • the processing waste liquid circulation apparatus according to the first embodiment includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing apparatuses (processing apparatuses) 1.
  • the working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced.
  • a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
  • the semiconductor wafer is cut by a dicer or the like.
  • the used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13.
  • the used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank (tank) 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. May be.
  • the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17.
  • a filter such as a hollow fiber membrane as the filter device 17
  • impurities such as cutting waste contained in the used machining fluid can be eliminated.
  • the used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19.
  • the buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range.
  • the ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter.
  • the pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
  • the used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21.
  • a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed.
  • a conductivity meter may be provided in the mixing tank 21. This is because when the neutralizing agent is added to the working fluid stored in the mixing tank 21, the conductivity of the working fluid mixed with the neutralizing agent can be measured.
  • the control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value.
  • the neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
  • the neutralizing agent is preferably an aqueous solution containing inorganic phosphoric acid.
  • the neutralizing agent By supplying the neutralizing agent, the pH value of the processing liquid stored in the mixing tank 21 is adjusted, and the pH value can be brought close to the neutral value “7”. Specifically, by supplying the neutralizing agent, the ratio of the neutralizing agent in the solvent of the processing liquid increases, so the degree of the influence of the acidic component or alkaline component eluted in the processing liquid on the entire solvent is reduced. The pH value approaches the neutral value.
  • the used processing liquid with adjusted conductivity and pH value is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank (tank) 15.
  • the regenerated processing fluid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
  • the valve 111 for supplying the machining liquid provided for each dicing apparatus 1 is opened, and a supply request signal for the machining liquid is transmitted from the dicing apparatus 1 to the control device. 30.
  • the control device 30 that has received the supply request signal transmits an instruction signal to the inverter 40 in accordance with the number of operating dicing devices 1 and the like, and controls the operation of the supply pump 12 by inverter.
  • the valve 111 is closed and the machining liquid supply request signal is not transmitted from the dicing apparatus 1 to the control apparatus 30.
  • the return piping 41 which returns a process liquid to the supply tank 15 without supplying a process liquid from the supply path 11 to the dicing apparatus 1 is provided in the middle of the supply path 11.
  • FIG. 1 In front of the return pipe 41, an electromagnetic on-off valve 44 for opening and closing the path to the return pipe 41 is provided, and the electromagnetic on-off valve 44 is open when the supply pump 12 is driven.
  • the conventional processing waste liquid circulation apparatus has no means other than stopping the supply pump 12 in order to stop the supply of the processing liquid. Since the supply pump 12 is started from a stopped state, a considerable time is required from the start of operation of the dicing apparatus 1 until the machining liquid can be stably supplied.
  • the return pipe 41 since the return pipe 41 is provided, the machining fluid can be circulated without passing through the dicing apparatus 1, so there is no need to stop the supply pump 12. Therefore, it becomes possible to supply the machining liquid stably with the start of operation of the dicing apparatus 1.
  • FIG. 2 is a block diagram showing the configuration of the control device 30 of the processing waste liquid circulation device according to Embodiment 1 of the present invention.
  • the control device 30 is configured by a computer, and includes at least a CPU 31 that performs arithmetic processing according to a control program, a memory 32 that stores a control program, a storage device 33, an input interface 34, and an output interface 35. ing.
  • the input interface 34 receives a detection signal from a not-shown conductivity meter, pH meter, etc., an input signal from the input device 36, and a supply request signal from the dicing device 1. From the output interface 35, the supply pump 12, the raw water pump 16, the pump 51 that supplies the working fluid to the ion exchange device 18, the electromagnetic on-off valve 52 that opens and closes the path to the ion exchange device 18, and the neutralizing agent to the mixing tank 21. In addition to the electromagnetic on-off valve 24 that opens and closes the supply path, a control signal is output to the inverter 40 that controls the operation of the supply pump 12 and the electromagnetic on-off valve 44 that opens and closes the path to the return pipe 41.
  • FIG. 3 is a flowchart showing a processing procedure of the CPU 31 of the control device 30 of the processing waste liquid circulation device according to the first embodiment of the present invention.
  • the CPU 31 of the control device 30 resets the counter to 0 (step S301), selects one dicing device 1 (step S302), and has received a supply request signal from the selected dicing device 1 or not. Is determined (step S303).
  • step S303: YES When the CPU 31 determines that the supply request signal has been received (step S303: YES), the CPU 31 increments the counter by “1” (step S304). When the CPU 31 determines that the supply request signal has not been received (step S303: NO), the CPU 31 determines whether there is an unselected dicing apparatus 1 (step S305).
  • step S305: YES When the CPU 31 determines that there is an unselected dicing device 1 (step S305: YES), the CPU 31 selects the next dicing device 1 (step S306), returns the processing to step S303, and performs the above-described processing. repeat.
  • step S305: NO When the CPU 31 determines that all the dicing apparatuses 1 have been selected (step S305: NO), the CPU 31 determines whether or not the counter is 0 (step S307).
  • step S307 NO
  • the CPU 31 determines that at least one dicing apparatus 1 is in operation, and supplies the necessary amount of machining liquid according to the counter. Calculation is performed (step S308), and an instruction signal for driving the supply pump 12 is transmitted to the inverter 40 (step S309). As a result, the supply pump 12 is driven at a rotational speed corresponding to the number of operating dicing apparatuses 1.
  • step S307: YES the CPU 31 determines that the counter is 0 (step S307: YES) and drives the supply pump 12 at the set minimum rotational speed. Then, the working fluid is guided to the supply tank 15 through the return pipe 41. As a result, the machining liquid can be circulated between the supply tank 15 and the supply pump 12 without going through the dicing apparatus 1, and the supply pump 12 is stopped even when the dicing apparatus 1 is stopped. There is no need to let them.
  • CPU31 judges whether processing in all the dicing devices 1 was completed (Step S310), and when CPU31 judges that there is dicing device 1 which has not finished processing yet (Step S310: NO), CPU31 returns a process to step S302, and repeats the process mentioned above.
  • CPU31 judges that the process in all the dicing apparatuses 1 was complete
  • the supply amount of the machining fluid of the supply pump 12 can be changed by the inverter control, and when the number of operating dicing apparatuses 1 is small, that is, the necessary supply amount of the machining fluid. Is less than a predetermined amount, the machining liquid is guided to the supply tank 15 via the return pipe 41, so that the machining liquid can be circulated without being supplied to the dicing apparatus 1, and the dicing apparatus 1 is stopped. Even in this case, it is not necessary to stop the supply pump 12. Further, since the machining fluid is returned to the supply tank 15 by the return pipe 41, there is no temperature difference between the circulating machining fluid and the machining fluid stored in the supply tank 15, and the inside of the supply tank 15 is maintained. Since the agitation can be performed, the quality and temperature of the working fluid can be homogenized.
  • FIG. 4 is a schematic diagram showing a configuration of a processing waste liquid circulation apparatus according to Embodiment 2 of the present invention.
  • the processing waste liquid circulation apparatus according to the second embodiment includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing apparatuses (processing apparatuses) 1.
  • the working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced.
  • a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
  • the semiconductor wafer is cut by a dicer or the like.
  • the used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13.
  • the used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank (tank) 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. May be.
  • the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17.
  • a filter such as a hollow fiber membrane as the filter device 17
  • impurities such as cutting waste contained in the used machining fluid can be eliminated.
  • the used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19.
  • the buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range.
  • the ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter.
  • the pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
  • the used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21.
  • a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed.
  • a conductivity meter may be provided in the mixing tank 21. This is because when the neutralizing agent is added to the working fluid stored in the mixing tank 21, the conductivity of the working fluid mixed with the neutralizing agent can be measured.
  • the control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value.
  • the neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
  • the used processing liquid with adjusted conductivity and pH value is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank (tank) 15.
  • the regenerated processing fluid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
  • a return pipe 41 for returning the processing liquid to the supply tank 15 is provided in the middle of the supply path 11.
  • a pressure gauge 42 and a flow meter 43 for measuring the pressure and flow rate of the working fluid circulating between the supply tank 15 and the supply pump 12 via the return pipe 41 are provided in front of the return pipe 41.
  • the number of operating dicing apparatuses 1 can be estimated from the relationship between the number of operating dicing apparatuses 1 and the pressure or flow rate of the working fluid, which have been grasped in advance, and the measured pressure and flow rate of the working liquid.
  • control device 30 acquires pressure and flow measurement values from the pressure gauge 42 and the flow meter 43, estimates the number of operating dicing devices 1 based on the acquired measurement values, and inverters according to the estimated operation number An instruction signal is transmitted to 40 to control the operation of the supply pump 12.
  • FIG. 5 is a block diagram showing the configuration of the control device 30 of the processing waste liquid circulation device according to the second embodiment of the present invention.
  • the control device 30 is configured by a computer, and includes at least a CPU 31 that performs arithmetic processing according to a control program, a memory 32 that stores a control program, a storage device 33, an input interface 34, and an output interface 35. ing.
  • the detection signal from the conductivity meter, pH meter, etc., the input signal from the input device 36, the detection signal from the pressure gauge 42 and the flow meter 43 are input to the input interface 34. From the output interface 35, the supply pump 12, the raw water pump 16, the pump 51 that supplies the working fluid to the ion exchange device 18, the electromagnetic on-off valve 52 that opens and closes the path to the ion exchange device 18, and the neutralizing agent to the mixing tank 21. In addition to the electromagnetic on-off valve 24 that opens and closes the supply path, a control signal is output to the inverter 40 that controls the operation of the supply pump 12.
  • FIG. 6 is a flowchart showing a processing procedure of the CPU 31 of the control device 30 of the processing waste liquid circulation device according to Embodiment 2 of the present invention.
  • the CPU 31 of the control device 30 acquires pressure and flow measurement values from the pressure gauge 42 and the flow meter 43 (step S ⁇ b> 601), and knows in advance the number of operating dicing devices 1 and the machining fluid.
  • the number of operating dicing apparatuses 1 is estimated on the basis of the relationship between the pressure and the flow rate and the measured values of the acquired pressure and flow rate (step S602). If the machining fluid is supplied to the dicing device 1, the flow rate of the machining fluid circulating through the return pipe 41 is reduced and the pressure is lowered. Therefore, the number of dicing devices 1 that are operated can be easily determined by the measured pressure and flow rate of the machining fluid. Can be estimated.
  • step S603 judges whether the estimated operation number is 0 (step S603).
  • step S603: NO the CPU 31 determines that at least one dicing apparatus 1 is operating, and is necessary depending on the estimated operating number.
  • a supply amount of the machining fluid is calculated (step S604), and an instruction signal for driving the supply pump 12 is transmitted to the inverter 40 (step S605). As a result, the supply pump 12 is driven at a rotational speed corresponding to the number of operating dicing apparatuses 1.
  • step S603 When the CPU 31 determines that the estimated number of operating units is 0 (step S603: YES), the CPU 31 determines that no dicing device 1 is operating, and the supply pump 12 is set to the minimum rotation. The machining liquid is guided to the supply tank 15 through the return pipe 41.
  • the CPU 31 determines whether or not the processing in all the dicing apparatuses 1 has been completed (step S606), and when the CPU 31 determines that there is a dicing apparatus 1 that has not yet completed processing (step S606: NO), CPU31 returns a process to step S601, and repeats the process mentioned above.
  • CPU31 judges that the process in all the dicing apparatuses 1 was complete
  • the amount of the processing fluid supplied from the supply pump 12 can be varied by inverter control, and is circulated between the supply tank 15 and the supply pump 12 via the return pipe 41. Since the number of operating dicing devices 1 is estimated based on the measured values of the pressure and flow rate of the working fluid to be calculated, and the required amount of working fluid is calculated, the supply pump regardless of whether the dicing device 1 is operating 12 can continue to move, and a required amount of machining fluid can be supplied to the dicing apparatus 1 according to the estimated number of operating units.
  • the machining fluid is returned to the supply tank 15 by the return pipe 41, there is no temperature difference between the circulating machining fluid and the machining fluid stored in the supply tank 15, and the inside of the supply tank 15 is maintained. Since the agitation can be performed, the quality and temperature of the working fluid can be homogenized.
  • the processing apparatus is not limited to a dicing apparatus, and can be applied to a grinder that thins a wafer or the like, or a machine tool such as a milling machine, a lathe, a surface grinding machine, or a lapping machine.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

L'invention concerne un appareil de remise en circulation de fluide actif usagé permettant de remettre en circulation le fluide actif sans fournir le fluide actif à un appareil de traitement et permettant d'uniformiser la qualité et la température du fluide actif. Le fluide actif est fourni à un dispositif de découpage en dés (1), puis le fluide actif utilisé est recyclé et est de nouveau fourni au dispositif de découpage en dés (1). L'appareil de remise en circulation de fluide actif usagé comprend : un réservoir d'alimentation (15) permettant de stocker le fluide actif recyclé ; une pompe d'alimentation (12) permettant de fournir de nouveau le fluide actif recyclé au dispositif de découpage en dés (1) ; un canal d'alimentation (11) permettant de fournir le fluide actif à un appareil de traitement ; et une conduite de retour (41) permettant de retourner le fluide actif vers le réservoir d'alimentation (15) depuis une position située à mi-chemin le long du canal d'alimentation (11). Une commande d'inverseur permet d'ajuster la quantité de fluide actif fournie par la pompe d'alimentation (12). Lorsque la quantité de fluide actif fournie est inférieure à une quantité prédéterminée, le fluide actif est guidé vers le réservoir d'alimentation (15) par le biais de la conduite de retour (41).
PCT/JP2012/069805 2011-10-20 2012-08-03 Appareil de remise en circulation de fluide actif usagé Ceased WO2013058004A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-230845 2011-10-20
JP2011230845 2011-10-20

Publications (1)

Publication Number Publication Date
WO2013058004A1 true WO2013058004A1 (fr) 2013-04-25

Family

ID=48140661

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/069805 Ceased WO2013058004A1 (fr) 2011-10-20 2012-08-03 Appareil de remise en circulation de fluide actif usagé

Country Status (1)

Country Link
WO (1) WO2013058004A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015077673A (ja) * 2013-10-18 2015-04-23 株式会社ノリタケカンパニーリミテド クーラント循環装置。
JP2016149403A (ja) * 2015-02-10 2016-08-18 株式会社ディスコ 切削装置
CN111805775A (zh) * 2020-06-09 2020-10-23 徐州鑫晶半导体科技有限公司 砂浆供应方法、砂浆供应设备及晶棒切割系统
WO2022004538A1 (fr) * 2020-06-30 2022-01-06 ファナック株式会社 Machine-outil
JP2022038627A (ja) * 2020-08-27 2022-03-10 株式会社ティーシーイーエム ハイブリッド切削液自動補給装置
JP7052126B1 (ja) 2021-06-29 2022-04-11 Dmg森精機株式会社 工作機械のクーラント予熱装置及び工作機械のクーラント予熱方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07127565A (ja) * 1993-10-29 1995-05-16 Toyooki Kogyo Co Ltd クーラント用ポンプ装置
JPH105512A (ja) * 1996-06-20 1998-01-13 Nisshin Koki Kk 濾過器及び濾過システム
JPH11138051A (ja) * 1997-11-11 1999-05-25 Nikuni:Kk 液処理装置
JPH11254266A (ja) * 1998-03-05 1999-09-21 Fanuc Ltd 主軸貫通給油装置を備えた工作機械
JP2002224931A (ja) * 2001-01-29 2002-08-13 Disco Abrasive Syst Ltd 加工液供給装置
US20060053026A1 (en) * 2004-09-07 2006-03-09 Unist, Inc. Machine lubricant and coolant distribution system
JP2011031342A (ja) * 2009-08-03 2011-02-17 Honda Motor Co Ltd クーラント供給装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07127565A (ja) * 1993-10-29 1995-05-16 Toyooki Kogyo Co Ltd クーラント用ポンプ装置
JPH105512A (ja) * 1996-06-20 1998-01-13 Nisshin Koki Kk 濾過器及び濾過システム
JPH11138051A (ja) * 1997-11-11 1999-05-25 Nikuni:Kk 液処理装置
JPH11254266A (ja) * 1998-03-05 1999-09-21 Fanuc Ltd 主軸貫通給油装置を備えた工作機械
JP2002224931A (ja) * 2001-01-29 2002-08-13 Disco Abrasive Syst Ltd 加工液供給装置
US20060053026A1 (en) * 2004-09-07 2006-03-09 Unist, Inc. Machine lubricant and coolant distribution system
JP2011031342A (ja) * 2009-08-03 2011-02-17 Honda Motor Co Ltd クーラント供給装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015077673A (ja) * 2013-10-18 2015-04-23 株式会社ノリタケカンパニーリミテド クーラント循環装置。
JP2016149403A (ja) * 2015-02-10 2016-08-18 株式会社ディスコ 切削装置
CN111805775A (zh) * 2020-06-09 2020-10-23 徐州鑫晶半导体科技有限公司 砂浆供应方法、砂浆供应设备及晶棒切割系统
WO2022004538A1 (fr) * 2020-06-30 2022-01-06 ファナック株式会社 Machine-outil
JPWO2022004538A1 (fr) * 2020-06-30 2022-01-06
JP7381754B2 (ja) 2020-06-30 2023-11-15 ファナック株式会社 工作機械
JP2022038627A (ja) * 2020-08-27 2022-03-10 株式会社ティーシーイーエム ハイブリッド切削液自動補給装置
JP7567099B2 (ja) 2020-08-27 2024-10-16 株式会社ティーシーイーエム ハイブリッド切削液自動補給装置
JP7052126B1 (ja) 2021-06-29 2022-04-11 Dmg森精機株式会社 工作機械のクーラント予熱装置及び工作機械のクーラント予熱方法
WO2023276859A1 (fr) * 2021-06-29 2023-01-05 Dmg森精機株式会社 Dispositif de préchauffage de fluide de refroidissement pour machine-outil et procédé de préchauffage de fluide de refroidissement pour machine-outil
JP2023005859A (ja) * 2021-06-29 2023-01-18 Dmg森精機株式会社 工作機械のクーラント予熱装置及び工作機械のクーラント予熱方法

Similar Documents

Publication Publication Date Title
WO2013058004A1 (fr) Appareil de remise en circulation de fluide actif usagé
TWI686466B (zh) 先進流體處理方法及系統
US6183352B1 (en) Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique
KR102289796B1 (ko) 기판 액처리 장치 및 기판 액처리 방법
US20030104959A1 (en) Chemical solution feeding apparatus and method for preparing slurry
US20160233106A1 (en) Etching method, etching apparatus, and storage medium
WO2015064657A1 (fr) Mécanisme d'ajustement de flux, mécanisme d'alimentation de solution médicamenteuse diluée, dispositif de traitement de liquide et procédé de fonctionnement correspondant
CN105629887A (zh) 控制具有切削条件变更功能的机床的控制装置
CN104793559A (zh) 考虑省电的nc程序产生装置
JP2013175592A (ja) 液処理装置、液処理方法および液処理方法を実行するためのコンピュータプログラムが記録された記録媒体
CN205497822U (zh) 液体补充装置以及具备该液体补充装置的冷却剂再生装置
JP6318074B2 (ja) クーラント液の補充方法および装置
WO2013054576A1 (fr) Dispositif de traitement de fluide d'usinage usé et procédé de traitement de fluide d'usinage usé
US20240009803A1 (en) Slurry dispersion system with real time control
KR100639710B1 (ko) 약액 혼합 공급 방법
GB2547056A (en) A system for determining the condition of a fluid in a tank, an apparatus including the system and a method for managing the condition of the fluid
KR20190005376A (ko) 소독제 희석액 공급장치
JP7605005B2 (ja) クーラント供給装置
TWI777097B (zh) 基板處理裝置及基板處理方法
CN111696889A (zh) 混合装置、混合方法以及基板处理系统
JP2009510556A (ja) ユースポイントでのプロセス制御ブレンダーシステムおよび対応する方法
WO2013054577A1 (fr) Dispositif de circulation de fluide d'usinage usé et procédé de circulation de fluide d'usinage usé
JP5317531B2 (ja) スラリー供給装置の洗浄方法およびスラリー供給装置
WO2013057992A1 (fr) Appareil de remise en circulation de fluide actif usagé
JP2012192512A (ja) 放電加工機

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12842074

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12842074

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP