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WO2013051756A1 - Plaque conductrice transparente et son procédé de fabrication - Google Patents

Plaque conductrice transparente et son procédé de fabrication Download PDF

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Publication number
WO2013051756A1
WO2013051756A1 PCT/KR2011/009024 KR2011009024W WO2013051756A1 WO 2013051756 A1 WO2013051756 A1 WO 2013051756A1 KR 2011009024 W KR2011009024 W KR 2011009024W WO 2013051756 A1 WO2013051756 A1 WO 2013051756A1
Authority
WO
WIPO (PCT)
Prior art keywords
elastic insulator
conductive pattern
substrate
protruding conductive
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/009024
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English (en)
Korean (ko)
Inventor
성낙훈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2013051756A1 publication Critical patent/WO2013051756A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a transparent conductor plate and a method for manufacturing the same, and more particularly, to a transparent conductor plate having excellent transparency and excellent transmittance for light transmission.
  • a transparent conductor refers to a thin conductive film coated on a high-transmittance insulating surface or substrate.
  • Transparent conductors can be made to have surface conductivity while maintaining adequate optical transparency.
  • Such surface conducting transparent conductors are widely used as transparent electrodes in flat liquid crystal displays, touch panels, electroluminescent devices, thin film photovoltaic cells, etc. It is widely used as an anti-static layer and an electromagnetic wave shielding layer.
  • vacuum deposited metal oxides such as indium tin oxide (ITO)
  • ITO indium tin oxide
  • dielectric surfaces such as glass and polymeric films.
  • metal oxide films are weak and susceptible to damage due to warpage or other physical stresses. They also require high deposition temperatures and / or high annealing temperatures to achieve high conductivity levels.
  • the adhesion of metal oxide films can also be a problem for substrates that are susceptible to moisture, such as plastic and organic substrates, for example polycarbonates. Therefore, the application of metal oxide films on flexible substrates is very limited.
  • vacuum deposition is an expensive process and requires special equipment.
  • Conductive polymers have also been used as optically transparent electrical conductors. However, they generally have low conductivity values and high optical absorption (especially at visible wavelengths) compared to metal oxide films, and lack chemical and long term stability.
  • an object of the present invention is to provide a transparent conductor plate which is easy to manufacture, has excellent light transmittance, and excellent transparency.
  • a transparent conductor plate of the present invention for achieving the above object, forming a projecting conductive pattern on a flat substrate or a roll-shaped substrate; An elastic insulator is applied over the protruding conductive pattern and the upper portion of the substrate, and is sequentially applied through two processes, an adhesive part applying step and a flat part applying step; Electroforming the protruding conductive pattern on which the elastic insulator is applied to form a metal pattern on the protruding conductive pattern; Applying transparent resin in a fluid state over the metal pattern and the upper part of the elastic insulator; When the flowable transparent resin is hardened, the transparent resin bonded to the metal pattern is separated from the metal pattern and the elastic insulator, thereby manufacturing a transparent conductor plate.
  • the adhesive thin elastic insulator is applied, and after drying, the bottom portion is preferably formed.
  • the transparent conductor plate of the present invention for achieving the above object, forming a projecting conductive pattern on a flat substrate or a roll-shaped substrate;
  • An elastic insulator is applied over the protruding conductive pattern and the upper portion of the substrate, and is sequentially applied through two processes, an adhesive part applying step and a flat part applying step;
  • the flowable transparent resin is hardened, it is characterized in that it is made through a process of separating the transparent resin that is bonded to the metal pattern from the metal pattern and the elastic insulator.
  • the adhesive part applying process is applied with a thin thin elastic insulator, and after drying, the bottom portion is formed.
  • the elastic insulator is applied to the entirety of the protruding conductive pattern and the upper portion of the substrate. It is preferable to perform the process of eggplant sequentially and apply
  • molding silicone for the flat part coating process.
  • a metal pattern is formed on the surface of the transparent resin, and the surface of the transparent resin is smooth as the plane of silicon is transferred as it is, thereby producing an excellent transparency effect.
  • the transparent conductive plate of the present invention is excellent in transmittance of light is transmitted, accordingly, by applying the elastic insulator, but is realized by the technique of sequentially applying through two processes, such as the adhesive portion coating step and the planar part coating step Has characteristics.
  • 1 to 9 are cross-sectional views showing the manufacturing process of the transparent conductor according to the present invention.
  • FIGS. 1 to 3 are diagrams for explaining an embodiment of forming a protruding conductive pattern on a flat substrate or a roll-shaped substrate according to the present invention.
  • the protruding conductive pattern means that a conductive material such as metal is formed on a flat substrate or a roll-shaped substrate in a protruding form.
  • a pattern form various patterns can be formed by independent patterns including a pattern of connected shapes such as a honeycomb shape or a square shape.
  • a thin metal thin film is generally formed on a substrate, and then the protruding conductive pattern can be directly formed by etching or laser processing the metal thin film. After the formation of the structure, the protrusion conductive pattern may be formed through several processing steps. 1 to 3 illustrate an embodiment in which a protruding conductive pattern is formed on a flat substrate or a roll-shaped substrate by an intaglio method.
  • FIG. 1 is explanatory drawing explaining formation of the intaglio 2 in the planar board
  • an intaglio corresponding to the protrusion of the mold can be formed on the substrate by pressing the mold having the protrusion formed on the substrate. Or it can form by apply
  • the indentation corresponding to the protrusion of the mold can be formed on the substrate by pressing the protrusion on the molten surface of the substrate by using the mold having the protrusion.
  • FIG. 2 is an explanatory diagram of a state in which the conductive material 3 is filled in the intaglio 2.
  • FIG. 3 is an explanatory diagram for explaining the formation of the protruding conductive pattern 4 by subjecting the conductive material 3 filled in the intaglio 2 to electroforming.
  • the electroplating process is performed in the plating tank to fill the intaglio 2 of the flat substrate or the roll-shaped substrate 1 with the conductive material 3 to form the protruding conductive pattern 4.
  • the step of applying the elastic insulator is sequentially applied through two processes, an adhesive part coating step and a flat part coating step.
  • FIG. 4 is an explanatory view of a step of applying an adhesive elastic insulator 5 over the protruding conductive pattern 4 and the upper portion of the substrate 1 as an adhesion part applying step.
  • the elastic insulator 5 refers to a material having elasticity and electric insulation.
  • the purpose of the electrical insulation is to make the area that is not conducting electricity during pole casting.
  • the purpose of applying the insulating material having elasticity is to apply with elastic insulating material so that the object that has been poled can easily be separated during the pole pole processing.
  • the adhesive elastic insulator (5) silicon is a representative material.
  • the adhesive silicon of RTB is used.
  • the pitch of the protruding conductive pattern 4 is an extremely fine pattern of several microns or several tens of microns, the viscosity of the elastic insulator 5 must be thin.
  • toluene is mixed and diluted with the adhesive silicon of the RTB, and the coating is applied over the protruding conductive pattern 4 and the upper part of the substrate 1. After application, the upper portion of the protruding conductive pattern 4 is scraped with a squeeze to remove the silicon deposited on the upper portion of the protruding conductive pattern 4 and to uniformize the coating layer.
  • the thickness becomes thinner between the protruding conductive patterns 4. This thinned portion is referred to as silicon bottom 7 in the present invention.
  • the surface of the silicon is in the shape of having the silicon bottom 7 rather than in a planar state. Even if the surface is not planar, only the vertex 6 of the protruding conductive pattern 4 is accurately exposed.
  • the presence of the silicon bottom 7 makes the surface of the silicon non-planar.
  • This planar part coating process is for planarizing the surface of silicon.
  • the surface can be provided with a smooth flat surface like a mirror surface.
  • Silicon used in the planar coating process is ideally used to have silicone adhesive on the surface of the silicon, but not on the surface of the silicon, for example, the metal surface.
  • such silicon is defined as non-adhesive silicon.
  • molding silicone may be mentioned.
  • the upper part of the protruding conductive pattern 4 is planarized to remove the silicon deposited on the upper part of the protruding conductive pattern 4 and to planarize the coating layer of the non-adhesive silicon 8. .
  • An exemplary embodiment of the planarization process is scraping with a squeeze.
  • the surface of the silicon has a smooth plane as shown in FIG. Only the vertices of the protruding conductive pattern 4 are exposed without being applied to the silicon.
  • FIG. 6 illustrates that the metal pattern 9 is formed on the protruding conductive pattern 4 by performing electro-perforation on the protruding conductive pattern 4 coated with the elastic insulator 5.
  • FIG. 7 illustrates the application of the transparent resin 10 in a fluid state over the metal pattern 9 and the upper portion of the elastic insulator 4.
  • Representative examples of the transparent resin 10 include UV resins.
  • FIG. 8 illustrates the separation of the transparent resin 10, which couples the metal pattern 9 from the metal pattern 9 and the elastic insulator 4, when the transparent transparent resin 10 is hardened.
  • FIG. 9 illustrates a transparent conductor plate 11 composed of a transparent resin 10 in which a metal pattern 12 is bonded.
  • the metal pattern 12 is formed on the transparent resin surface 13.
  • the surface of the transparent resin 10 is transferred to the plane of silicon as it is made smoothly to obtain a product having excellent transparency.
  • the transparent conductor plate of the present invention has two great features.
  • the transmittance through which light is transmitted is excellent. This is realized by a technique of applying an elastic insulator and applying it sequentially through two processes, an adhesive part applying step and a flat part applying step. Second, minimization of electrical resistance can be achieved.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

La présente invention concerne une plaque conductrice transparente et son procédé de fabrication, et plus particulièrement une plaque conductrice transparente ayant une excellente transparence et une excellente transmittance, et son procédé de fabrication. Le procédé de fabrication est caractérisé en ce qu'il comprend la formation d'un motif conducteur en saillie sur un substrat plan ou un substrat en rouleau, le dépôt d'un isolant élastique sur le motif conducteur en saillie et le substrat séquentiellement au moyen de deux procédés de dépôt de parties adhésives et de dépôt de partie de plan, l'électroformation du motif conducteur en saillie déposé avec l'isolant élastique pour former un motif métallique sur le motif conducteur en saillie, le revêtement d'une résine transparente fluide sur le motif métallique et l'isolant élastique, et la séparation de la résine transparente couplée au motif métallique et à l'isolant élastique quand la résine transparente fluide est solidifiée, ce qui permet ainsi de farbiquer une plaque conductrice transparente.
PCT/KR2011/009024 2011-10-07 2011-11-24 Plaque conductrice transparente et son procédé de fabrication Ceased WO2013051756A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0102556 2011-10-07
KR1020110102556A KR20130037967A (ko) 2011-10-07 2011-10-07 투명 도전체판 및 이의 제조방법

Publications (1)

Publication Number Publication Date
WO2013051756A1 true WO2013051756A1 (fr) 2013-04-11

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Application Number Title Priority Date Filing Date
PCT/KR2011/009024 Ceased WO2013051756A1 (fr) 2011-10-07 2011-11-24 Plaque conductrice transparente et son procédé de fabrication

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KR (1) KR20130037967A (fr)
WO (1) WO2013051756A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102238023B1 (ko) * 2019-04-25 2021-04-08 한국화학연구원 평면 방향으로 연신이 가능한 연신 전극 및 이의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100857613B1 (ko) * 2007-05-29 2008-09-09 (주)이모트 극미세패턴을 원하는 형상과 크기로 형성할 수 있는전주마스터 및 그의 제조 방법과 이를 이용한 전자파차폐메쉬 및 스트라이프 전극이 부가된 필름 및 그의 제조 방법
KR100957487B1 (ko) * 2009-10-07 2010-05-14 주식회사 엔엔피 플라스틱 전극필름 제조방법
KR20110000886A (ko) * 2009-06-29 2011-01-06 성낙훈 미세회로 필름기판 및 제조방법
KR101051448B1 (ko) * 2010-10-26 2011-07-22 한국기계연구원 인쇄기반 금속 배선을 이용한 투명전극 제조 방법 및 그 투명전극

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100857613B1 (ko) * 2007-05-29 2008-09-09 (주)이모트 극미세패턴을 원하는 형상과 크기로 형성할 수 있는전주마스터 및 그의 제조 방법과 이를 이용한 전자파차폐메쉬 및 스트라이프 전극이 부가된 필름 및 그의 제조 방법
KR20110000886A (ko) * 2009-06-29 2011-01-06 성낙훈 미세회로 필름기판 및 제조방법
KR100957487B1 (ko) * 2009-10-07 2010-05-14 주식회사 엔엔피 플라스틱 전극필름 제조방법
KR101051448B1 (ko) * 2010-10-26 2011-07-22 한국기계연구원 인쇄기반 금속 배선을 이용한 투명전극 제조 방법 및 그 투명전극

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