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WO2013051260A1 - Dispositif d'application de résine et procédé d'application de résine - Google Patents

Dispositif d'application de résine et procédé d'application de résine Download PDF

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Publication number
WO2013051260A1
WO2013051260A1 PCT/JP2012/006354 JP2012006354W WO2013051260A1 WO 2013051260 A1 WO2013051260 A1 WO 2013051260A1 JP 2012006354 W JP2012006354 W JP 2012006354W WO 2013051260 A1 WO2013051260 A1 WO 2013051260A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
application
coating
light emission
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/006354
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English (en)
Japanese (ja)
Inventor
勝 野々村
真司 梅田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011221628A external-priority patent/JP5879508B2/ja
Priority claimed from JP2011221630A external-priority patent/JP2013084651A/ja
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of WO2013051260A1 publication Critical patent/WO2013051260A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

Definitions

  • the present invention relates to a resin coating apparatus and a resin coating method used in an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor.
  • LEDs light emitting diodes having excellent characteristics of low power consumption and long life have been widely used as light sources for various lighting devices. Since the basic light emitted from the LED element is currently limited to three colors of red, green, and blue, in order to obtain white light suitable for general lighting applications, the above three basic lights are added.
  • a method of obtaining white light by color mixing, a method of obtaining pseudo white light by combining a blue LED and a phosphor emitting yellow fluorescence having a complementary color relationship with blue are used.
  • the latter method has been widely used, and an illumination device using an LED package in which a blue LED and a YAG phosphor are combined has been used for a backlight of a liquid crystal panel (for example, a patent). Reference 1).
  • YAG phosphor particles are placed in a mounting portion in which YAG phosphor particles are dispersed in the mounting portion.
  • An LED package is configured by injecting dispersed silicone resin, epoxy resin, or the like to form a resin packaging portion. And, for the purpose of uniforming the height of the resin packaging part in the mounting part after the resin injection, a residual resin storage part for discharging and storing the surplus resin injected more than a specified amount from the mounting part is formed.
  • An example is given. As a result, even when the discharge amount from the dispenser varies at the time of resin injection, a resin packaging portion having a certain resin amount and a specified height is formed on the LED element.
  • the LED element has undergone a manufacturing process in which a plurality of elements are formed on the wafer at the same time, and due to various error factors in this manufacturing process, such as non-uniform composition during film formation on the wafer, the wafer state Inevitably, variations in emission wavelength occur in the LED elements divided into individual pieces. And in the above-mentioned example, since the height of the resin wrapping part covering the LED element is set uniformly, the variation in the emission wavelength in the individual LED element is directly reflected in the variation in the emission characteristic of the LED package as a product.
  • the conventional LED package manufacturing technology has a problem in that the emission characteristics of the LED package as a product vary due to variations in the emission wavelength of the individual LED elements, leading to a decrease in production yield. .
  • the present invention provides a resin coating apparatus and a resin coating that can make the light emission characteristics of the LED package uniform and improve the production yield even when the light emission wavelength of the individual LED elements varies in the LED package manufacturing system. It aims to provide a method.
  • the resin coating apparatus of the present invention is used in an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and covers the LED element mounted on the substrate.
  • a resin coating apparatus that coats the resin, wherein a resin coating unit that discharges the resin in a variable amount and coats the resin to an arbitrary coating target position, and controls the resin coating unit to emit light.
  • a coating control unit that executes a coating process for measurement that is applied to a translucent member for characteristic measurement, and a production coating process that is applied to the LED element for actual production, and a light source that emits excitation light that excites the phosphor.
  • a production execution processing unit that executes a production application process for applying the resin application amount of the resin to the LED element and records an execution result of the production application process, and the application control unit includes the production application unit.
  • the resin coating apparatus of the present invention is used in an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and covers the LED element mounted on the substrate.
  • a resin coating apparatus that coats the resin, wherein a resin coating unit that discharges the resin in a variable amount and coats the resin to an arbitrary coating target position, and controls the resin coating unit to emit light.
  • a coating control unit that executes a coating process for measurement that is applied to a translucent member for characteristic measurement, and a production coating process that is applied to the LED element for actual production, and a light source that emits excitation light that excites the phosphor.
  • a production execution processing unit that executes a production application process for applying the resin application amount of the resin to the LED element, and the application control unit changes the application execution condition in the production application process, The trial application, the measurement of the light emission characteristics, and the derivation of the appropriate resin application amount of the resin are executed.
  • the resin coating method of the present invention is used in an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and covers the LED element mounted on the substrate.
  • a resin application method for applying the resin wherein the resin is applied to a translucent member as a light emission characteristic measurement by a resin application part that discharges the resin in a variable amount, and the resin
  • a light emission characteristic measurement step for measuring the light emission characteristic of light emitted from the resin by irradiating the resin applied to the translucent member;
  • An application amount derivation process for deriving an appropriate resin application amount of the resin to be applied to the LED element for actual production based on the light emission characteristics;
  • a production execution step for executing a production coating process for coating the LED element with the appropriate amount of resin applied to the LED element by instructing the application control unit to be controlled, and recording the performance of the production coating process;
  • the measurement application step, the light emission characteristic measurement step, and the application amount derivation step are executed each time a predetermined interval in which the execution result of the production application process is preset.
  • the resin coating method of the present invention is used in an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and covers the LED element mounted on the substrate.
  • a resin application method for applying the resin wherein the resin is applied to a translucent member as a light emission characteristic measurement by a resin application part that discharges the resin in a variable amount, and the resin
  • a light emission characteristic measurement step for measuring the light emission characteristic of light emitted from the resin by irradiating the resin applied to the translucent member;
  • An application amount derivation process for deriving an appropriate resin application amount of the resin to be applied to the LED element for actual production based on the light emission characteristics;
  • a translucent member on which a resin is trial-applied for light emission characteristic measurement is used as the translucent member mounting portion.
  • a process for obtaining a deviation from a predetermined light emission characteristic and deriving an appropriate amount of resin to be applied to the LED element for actual production based on this deviation is executed in the production execution process. Even if the emission wavelength variation of individual LED elements and the application conditions vary, the LED package is executed by executing the results every time a predetermined interval has passed. And uniform light emission characteristics, it is possible to improve the production yield.
  • a translucent member on which a resin is trial-applied for light emission characteristic measurement is used as the translucent member mounting portion.
  • the application execution condition in the production execution process is changed to obtain the deviation from the light emission characteristics defined in advance and derive the appropriate resin application amount of the resin to be applied to the LED element for actual production based on this deviation.
  • the block diagram which shows the structure of the LED package manufacturing system of one embodiment of this invention is a configuration explanatory view of an LED package manufactured by the LED package manufacturing system of one embodiment of the present invention.
  • (A)-(d) is explanatory drawing of the supply form of LED element used in the LED package manufacturing system of one embodiment of this invention, and element characteristic information Explanatory drawing of the resin application
  • coating information used in the LED package manufacturing system of one embodiment of this invention is explanatory drawing of a structure and function of the component mounting apparatus in the LED package manufacturing system of one embodiment of this invention
  • (A)-(b) is explanatory drawing of the map data used in the LED package manufacturing system of one embodiment of this invention
  • (A)-(b) is explanatory drawing of a structure and function of the resin coating apparatus in the LED package manufacturing system of one embodiment of this invention
  • (A)-(c) is explanatory drawing of the light emission characteristic test
  • (A)-(b) is explanatory drawing of a structure and function of the resin coating apparatus in the LED package manufacturing system of one embodiment of this invention
  • (A)-(b) is explanatory drawing of the light emission characteristic test
  • the block diagram which shows the structure of the control system of the LED package manufacturing system of one embodiment of this invention Flowchart of LED package manufacturing by LED package manufacturing system of one embodiment of the present invention Flow chart of threshold data creation processing for non-defective product determination in LED package manufacturing system of one embodiment of the present invention (A)-(c) is explanatory drawing of the threshold value data for the quality determination in the LED package manufacturing system of one embodiment of this invention Chromaticity diagram for explaining threshold data for non-defective product determination in the LED package manufacturing system of one embodiment of the present invention
  • coating operation process in the LED package manufacturing process by the LED package manufacturing system of one embodiment of this invention (A)-(d) is explanatory drawing of the resin application
  • the LED package manufacturing system 1 has a function of manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor.
  • the component mounting apparatus M1, the curing apparatus M2, the wire bonding apparatus M3, the resin coating apparatus M4, the curing apparatus M5, and the piece cutting apparatus M6 are connected by the LAN system 2. These devices are connected and controlled by the management computer 3 in an integrated manner.
  • the component mounting apparatus M1 mounts the LED element 5 on the substrate 4 (see FIGS. 2A to 2B) serving as the base of the LED package by bonding with a resin adhesive.
  • the curing device M2 cures the resin adhesive used for bonding at the time of mounting by heating the substrate 4 after the LED element 5 is mounted.
  • the wire bonding apparatus M3 connects the electrode of the substrate 4 and the electrode of the LED element 5 with a bonding wire.
  • the resin coating device M4 applies a resin containing a phosphor to each LED element 5 on the substrate 4 after wire bonding.
  • the curing device M5 cures the resin applied so as to cover the LED elements 5 by heating the substrate 4 after the resin application.
  • the piece cutting device M6 cuts the substrate 4 after the resin is cured into each individual LED element 5 and divides it into individual LED packages. Thereby, the LED package divided
  • FIG. 1 shows an example in which a production line is configured by arranging each of the component mounting device M1 to the piece cutting device M6 in series.
  • the LED package manufacturing system 1 does not necessarily have such a line configuration.
  • each process work may be sequentially executed by each of the distributed devices.
  • a plasma processing apparatus that performs plasma treatment for electrode cleaning prior to wire bonding before and after the wire bonding apparatus M3, and a surface modification for improving resin adhesion before resin application after wire bonding. You may make it interpose the plasma processing apparatus which performs the plasma processing for the purpose of quality.
  • the substrate 4 is a multiple-type substrate in which a plurality of individual substrates 4a serving as a base of one LED package 50 in a finished product are formed.
  • Each individual substrate 4a includes Each LED mounting portion 4b on which the LED element 5 is mounted is formed.
  • the LED element 5 is mounted in the LED mounting portion 4b for each individual substrate 4a, and then the resin 8 is applied to cover the LED element 5 in the LED mounting portion 4b. Is cut for each individual substrate 4a to complete the LED package 50 shown in FIG.
  • the LED package 50 has a function of irradiating white light used as a light source of various lighting devices, and includes a phosphor that emits yellow fluorescence that is complementary to the blue LED element 5 and blue. By combining with the resin 8, pseudo white light is obtained.
  • the individual substrate 4a is provided with a cavity-shaped reflecting portion 4c having, for example, a circular or elliptical annular bank that forms the LED mounting portion 4b.
  • the N-type part electrode 6a and the P-type part electrode 6b of the LED element 5 mounted inside the reflection part 4c are connected to the wiring layers 4e and 4d formed on the upper surface of the individual substrate 4a by bonding wires 7, respectively.
  • the resin 8 covers the LED element 5 in this state and is applied to the inside of the reflecting portion 4c with a predetermined thickness.
  • the resin 8 The phosphor contained in is mixed with yellow light to emit light and irradiated as white light.
  • the LED element 5 is configured by stacking an N-type semiconductor 5b and a P-type semiconductor 5c on a sapphire substrate 5a, and further covering the surface of the P-type semiconductor 5c with a transparent electrode 5d.
  • An N-type part electrode 6a and a P-type part electrode 6b for external connection are formed on the N-type semiconductor 5b and the P-type semiconductor 5c, respectively.
  • the LED elements 5 are taken out from the LED wafer 10 that is stuck and held on the holding sheet 10a in a state where a plurality of LED elements 5 are formed in a lump and then divided into pieces.
  • the LED element 5 is divided into individual pieces from the wafer state due to various error factors in the manufacturing process, for example, non-uniform composition during film formation on the wafer. It is inevitable that variations occur in the case. If such an LED element 5 is mounted on the substrate 4 as it is, the emission characteristics of the LED package 50 as a product will vary.
  • the light emission characteristics of a plurality of LED elements 5 manufactured in the same manufacturing process are measured in advance, Element characteristic information corresponding to data indicating the light emission characteristics of the LED elements 5 is created, and an appropriate amount of the resin 8 corresponding to the light emission characteristics of each LED element 5 is applied in the application of the resin 8. .
  • resin application information to be described later is prepared in advance.
  • the LED elements 5 taken out from the LED wafer 10 are individually identified by element IDs (in this case, the individual LED elements 5 with the serial number (i) in the LED wafer 10). Are given sequentially to the light emission characteristic measuring device 11.
  • element ID if it is the information which can specify the LED element 5 separately, you may make it use the matrix coordinate which shows the arrangement
  • the LED element 5 can be supplied in the state of the LED wafer 10 in the component mounting apparatus M1 described later.
  • the light emission characteristic measuring device 11 power is actually supplied to each LED element 5 through a probe to actually emit light, and the light is spectrally analyzed to measure predetermined items such as a light emission wavelength and light emission intensity.
  • a standard distribution of emission wavelengths is prepared as reference data in advance, and the wavelength range corresponding to the standard range in the distribution is further divided into a plurality of wavelength ranges.
  • the plurality of target LED elements 5 are ranked according to the emission wavelength.
  • Bin codes [1], [2], [3], [4], [5] are assigned in order from the low wavelength side corresponding to each of the ranks set by dividing the wavelength range into five. ] Is given.
  • element characteristic information 12 having a data structure in which the Bin code 12b is associated with the element ID 12a is created.
  • the element characteristic information 12 is information obtained by individually measuring the light emission characteristics including the light emission wavelengths of the plurality of LED elements 5 in advance.
  • the element characteristic information 12 is prepared in advance by an LED element manufacturer or the like and is used for the LED package manufacturing system 1. Is transmitted.
  • the element characteristic information 12 may be transmitted in a form recorded on a single storage medium, or may be transmitted to the management computer 3 via the LAN system 2. In any case, the transmitted element characteristic information 12 is stored in the management computer 3 and provided to the component mounting apparatus M1 as necessary.
  • the plurality of LED elements 5 for which the light emission characteristic measurement is completed in this way are sorted for each characteristic rank as shown in FIG. 3D, and are distributed into five types according to each characteristic rank. Attached individually to 13a. Thereby, the three types of LED sheets 13A, 13B in which the LED elements 5 corresponding to the Bin codes [1], [2], [3], [4], and [5] are adhered and held on the adhesive sheet 13a, respectively. 13C, 13D, and 13E are created, and when these LED elements 5 are mounted on the individual substrate 4a of the substrate 4, the LED elements 5 are already classified into LED sheets 13A, 13B, 13C, and 13D. , 13E in the form of the component mounting apparatus M1.
  • the LED elements 5 corresponding to any of the Bin codes [1], [2], [3], [4], and [5] are held in the LED sheets 13A, 13B, 13C, 13D, and 13E, respectively.
  • the element characteristic information 12 is provided from the management computer 3 in a form indicating whether or not it has been.
  • the LED package 50 configured to obtain white light by combining a blue LED and a YAG phosphor
  • the blue light emitted from the LED element 5 and the yellow light emitted from the phosphor excited by the blue light are emitted. Since mixing is performed, the amount of the phosphor particles in the concave LED mounting portion 4b on which the LED element 5 is mounted is an important factor in securing the normal light emission characteristics of the LED package 50 of the product.
  • the appropriate amount of the phosphor particles in the resin 8 applied to cover the LED element 5 differs depending on the Bin codes [1], [2], [3], [4], and [5]. It will be a thing.
  • the appropriate resin application amount for each Bin classification of the resin 8 containing YAG-based phosphor particles in a silicone resin, an epoxy resin, or the like It is defined in advance according to the Bin code section 17 in units of nl (nanoliter).
  • the amount of the phosphor particles in the resin covering the LED element 5 is an appropriate amount of supplying phosphor particles. This ensures the normal emission wavelength required for the finished product after the resin is thermally cured.
  • the appropriate resin coating amount of the resin 8 is also set to an appropriate value (uncomfortable expression) according to the phosphor concentration of the resin 8 to be used. That is, when the resin having the phosphor concentration D1 is applied, the appropriate resin application amounts VA0, VB0, VC0, and Bin codes [1], [2], [3], [4], and [5] are applied. Resin 8 of VD0, VE0 (appropriate resin application amount 15 (1)) is applied.
  • the appropriate resin application amounts VF0, VG0, VH0 for the Bin codes [1], [2], [3], [4], and [5], respectively.
  • VJ0, VK0 appropriate resin coating amount 15 (2) of resin 8 is applied.
  • the appropriate resin application amounts VL0, VM0, VN0, and VP0 for the Bin codes [1], [2], [3], [4], and [5], respectively.
  • VR0 appropriate resin application amount 15 (3) of resin 8 is applied.
  • the appropriate resin coating amount is set for each of a plurality of different phosphor concentrations as described above, in order to ensure quality by applying the resin 8 having the optimum phosphor concentration according to the degree of variation in the emission wavelength. This is because it is more preferable.
  • the component mounting apparatus M1 includes a substrate transport mechanism 21 that transports the work target substrate 4 supplied from the upstream side in the substrate transport direction (arrow a).
  • the substrate transport mechanism 21 is provided with an adhesive application part A shown in section AA in FIG. 5B and a component mounting part B shown in section BB in FIG. 5C. It is installed.
  • the adhesive application unit A is disposed on the side of the substrate transport mechanism 21 and supplies the resin adhesive 23 in the form of a coating film having a predetermined film thickness, and the substrate transport mechanism 21 and the adhesive supply unit 22.
  • the component mounting part B is disposed on the side of the board transport mechanism 21 and has the parts supply mechanism 25 and the board transport mechanism 21 that hold the LED sheets 13A, 13B, 13C, 13D, and 13E shown in FIG.
  • a component mounting mechanism 26 that is movable in the horizontal direction (arrow c) above the supply mechanism 25 is provided.
  • the substrate 4 carried into the substrate transport mechanism 21 is positioned by the adhesive application portion A, and is bonded to the LED mounting portion 4b formed on each individual substrate 4a.
  • the agent 23 is applied. That is, first, the adhesive transfer mechanism 24 is moved above the adhesive supply unit 22 so that the transfer pin 24a is brought into contact with the coating film of the resin adhesive 23 formed on the transfer surface 22a, and the resin adhesive 23 is adhered. Next, the adhesive transfer mechanism 24 is moved above the substrate 4 and the transfer pin 24a is lowered to the LED mounting portion 4b (arrow d), whereby the resin adhesive 23 attached to the transfer pin 24a is moved into the LED mounting portion 4b. It is supplied by transfer to the element mounting position.
  • the substrate 4 after application of the adhesive is conveyed to the downstream side, positioned at the component mounting portion B as shown in FIG. 5 (c), and the LED elements are targeted for each LED mounting portion 4b after the adhesive is supplied.
  • 5 is implemented. That is, first, the component mounting mechanism 26 is moved above the component supply mechanism 25, and the mounting nozzle 26a is lowered with respect to any of the LED sheets 13A, 13B, 13C, 13D, and 13E held by the component supply mechanism 25, and mounted. The LED element 5 is held and taken out by the nozzle 26a.
  • the component mounting mechanism 26 is moved above the LED mounting portion 4b of the substrate 4 to lower the mounting nozzle 26a (arrow e), whereby the LED element 5 held by the mounting nozzle 26a is bonded to the adhesive in the LED mounting portion 4b. It is mounted at the element mounting position where is applied.
  • any one of the LED sheets 13A, 13B, 13C, 13D, and 13E can be used in an individual mounting operation by the component mounting program 26, that is, the component mounting mechanism 26.
  • the order in which the LED elements 5 are taken out and mounted on the plurality of individual boards 4a of the board 4 is set in advance, and the component mounting work is executed according to this element mounting program.
  • mounting position information 71a (see FIG. 11) indicating which of the plurality of individual boards 4a of the board 4 is mounted from the work execution history is extracted. Record.
  • the mounting position information 71a and the LED element 5 mounted on each individual substrate 4a correspond to any characteristic rank (Bin code [1], [2], [3], [4], [5]).
  • Data associated with the element characteristic information 12 indicating whether or not to be created is created as map data 18 shown in FIG. 6B by the map creation processing unit 74 (see FIG. 11).
  • the individual positions of the plurality of individual substrates 4a of the substrate 4 are specified by combinations of matrix coordinates 19X and 19Y indicating the positions in the X direction and the Y direction, respectively. Then, by making the Bin code to which the LED element 5 mounted at the position belongs correspond to the individual cell of the matrix constituted by the matrix coordinates 19X and 19Y, the LED element 5 mounted by the component mounting apparatus M1 on the substrate 4 Map data 18 (see FIG. 6B) is created in which the mounting position information 71a indicating the position and the element characteristic information 12 on the LED element 5 are associated with each other.
  • the component mounting apparatus M1 displays the map data 18 in which the mounting position information indicating the position of the LED element 5 mounted by the apparatus on the board 4 and the element characteristic information 12 on the LED element 5 are associated with the board 4
  • a map creation processing unit 74 is provided as map data creation means to be created every time.
  • the created map data 18 is transmitted as feedforward data to the resin coating apparatus M4 described below via the LAN system 2.
  • the resin coating device M4 has a function of coating the resin 8 so as to cover the plurality of LED elements 5 mounted on the substrate 4 by the component mounting device M1.
  • the resin coating apparatus M4 transfers the work target substrate 4 supplied from the upstream side to the substrate transport mechanism 31 that transports the substrate 4 in the substrate transport direction (arrow f).
  • the resin application part C is provided with a resin discharge head 32 configured to discharge the resin 8 from the discharge nozzle 33a attached to the lower end.
  • the resin discharge head 32 is driven by the nozzle moving mechanism 34, and the nozzle moving mechanism 34 is controlled by the application control unit 36, whereby the horizontal direction (arrow g shown in FIG. 7A). ) Move and lift operations.
  • the resin discharge head 32 is supplied with the resin 8 stored in a syringe attached to the dispenser 33, and the resin discharge mechanism 35 discharges the resin 8 in the dispenser 33 by applying air pressure into the dispenser 33. It is discharged through the nozzle 33 a and applied to the LED mounting portion 4 b formed on the substrate 4. At this time, by controlling the resin discharge mechanism 35 by the application control unit 36, the discharge amount of the resin 8 can be arbitrarily controlled.
  • the resin application part C has a function of discharging the resin 8 in a variable amount and applying it to any application target position.
  • various liquid discharge methods such as a plunger method using a mechanical cylinder and a screw pump method can be employed for the resin discharge mechanism 35.
  • a test hitting / measurement unit 40 is disposed on the side of the substrate transport mechanism 31 so as to be located within the movement range of the resin discharge head 32.
  • the test hitting / measurement unit 40 determines whether or not the application amount of the resin 8 is appropriate. It has a function of determining by measuring the light emission characteristics. That is, the light emission characteristics when the light emitted from the measurement light source unit 45 is irradiated onto the translucent member 43 on which the resin 8 has been trial-applied by the resin application unit C, and the light emission characteristics including the spectroscope 42 and the light emission characteristic measurement processing unit 39. By measuring by the characteristic measuring unit and comparing the measurement result with a preset threshold value, the suitability of the preset resin coating amount defined by the resin coating information 14 shown in FIG. 4 is determined.
  • composition and properties of the resin 8 containing the phosphor particles are not necessarily stable, and even if an appropriate resin application amount is set in advance in the resin application information 14, the concentration of the phosphor and the resin viscosity over time. Inevitable fluctuations. For this reason, even if the resin 8 is discharged with the discharge parameters corresponding to the preset appropriate resin application amount, the resin application amount itself varies from the preset appropriate value, or the resin application amount itself is appropriate. However, the amount of the phosphor particles to be originally supplied varies depending on the concentration change.
  • a test coating for inspecting whether or not an appropriate supply amount of phosphor particles is supplied at a predetermined interval is executed by the resin coating apparatus M4.
  • the resin coating unit C provided in the resin coating apparatus M4 shown in the present embodiment includes a measurement coating process for applying the resin 8 to the light-transmitting member 43 for the above-described light emission characteristic measurement, and a substrate for actual production. 4 has a function of executing a production coating process to be applied to the LED element 5 mounted in the state 4. Both the coating process for measurement and the coating process for production are executed when the coating control unit 36 controls the resin coating unit C.
  • the translucent member 43 is wound and supplied on the supply reel 47 and fed along the upper surface of the trial hitting stage 40a, and then irradiated with the translucent member mounting portion 41. It is wound around a collection reel 48 driven by a take-up motor 49 via a portion 46.
  • a mechanism for collecting the translucent member 43 various methods such as a method of feeding the translucent member 43 into the collection box by a feeding mechanism in addition to the method of collecting the translucent member by winding it on the collection reel 48 are adopted. Can do.
  • the irradiation unit 46 has a function of irradiating the translucent member 43 with measurement light emitted from the light source unit 45, and the measurement light emitted from the light source unit 45 is contained in a light shielding box 46a having a simple dark box function.
  • a light focusing tool 46b guided by a fiber cable is provided.
  • the light source unit 45 has a function of emitting excitation light that excites the phosphor contained in the resin 8.
  • the light source unit 45 is disposed above the translucent member mounting unit 41 and transmits measurement light.
  • the light member 43 is irradiated from above via the light focusing tool 46b.
  • the translucent member 43 a flat sheet-like member made of transparent resin is used as a tape material having a predetermined width, or an embossed portion 43a corresponding to the concave shape of the LED package 50 is provided on the lower surface of the same tape material.
  • the embossed type etc. which were made are used (refer FIG.8 (b)).
  • the resin 8 is trial-applied to the translucent member 43 by the resin ejection head 32.
  • a prescribed amount of resin 8 is applied to the translucent member 43 by the discharge nozzle 33a, as shown in FIG. 8B, with respect to the translucent member 43 whose lower surface is supported by the trial hitting stage 40a. This is done by discharging.
  • (B-1) of FIG. 8B shows a state in which the preset appropriate discharge amount of the resin 8 defined by the resin application information 14 is applied to the light transmitting member 43 made of the tape material.
  • (b-2) of FIG. 8B shows a state in which the resin 8 having a preset appropriate discharge amount is similarly applied to the embossed portion 43a of the above-described embossed type translucent member 43.
  • the resin 8 applied in the test hitting stage 40a is a test application for empirically determining whether or not the phosphor supply amount is appropriate for the target LED element 5.
  • the resin 8 is continuously applied to the plurality of points on the translucent member 43 by the same trial application operation by the resin discharge head 32. Therefore, when the resin 8 is continuously applied to the plurality of points on the translucent member 43 by the same trial application operation by the resin discharge head 32, the correlation between the measured light emission characteristic value and the application amount is known. Based on the data, the application amount is varied in stages and applied.
  • FIG. 8C shows the structure of the translucent member mounting portion 41 and the integrating sphere 44.
  • the translucent member mounting portion 41 has a structure in which an upper guide member 41 c having a function of guiding both end surfaces of the translucent member 43 is mounted on the upper surface of the lower support member 41 b that supports the lower surface of the translucent member 43. Yes.
  • the translucent member placement section 41 guides the translucent member 43 during conveyance in the test hitting / measurement unit 40, and places the translucent member 43 on which the resin 8 has been trial-applied in the measurement coating process to hold the position. It has a function to do.
  • the integrating sphere 44 has a function of collecting the transmitted light that has been irradiated from the light focusing tool 46 b (arrow h) and transmitted through the resin 8 and led to the spectroscope 42. That is, the integrating sphere 44 has a spherical spherical reflecting surface 44 c inside, and transmitted light (arrow i) incident from the opening 44 a located immediately below the light transmitting opening 41 a is the top of the integrating sphere 44.
  • the white light emitted by the LED package used for the light source unit 45 is applied to the resin 8 that has been trial-applied to the translucent member 43.
  • the blue light component contained in the white light excites the phosphor in the resin 8 to emit yellow light.
  • White light obtained by adding and mixing yellow light and blue light is irradiated upward from the resin 8 and is received by the spectroscope 42 via the integrating sphere 44 described above.
  • the received white light is analyzed by the light emission characteristic measurement processing unit 39 to measure the light emission characteristic, as shown in FIG. 7B.
  • the light emission characteristics such as the color tone rank of white light and the luminous flux are inspected, and a deviation from the prescribed light emission characteristics is detected as the inspection result.
  • the integrating sphere 44, the spectroscope 42, and the light emission characteristic measurement processing unit 39 emit excitation light emitted from the light source unit 45 onto the resin 8 coated with the light transmitting member 43 (here, white light emitted from the white LED). )
  • the light emitted from the resin 8 is received from below the translucent member 43, and a light emission characteristic measuring unit for measuring the light emission characteristic of the light emitted from the resin 8 is configured.
  • the light emission characteristic measuring unit is configured by disposing the integrating sphere 44 below the translucent member 43, and configured to receive light emitted from the resin 8 through the opening 44a of the integrating sphere 44. Has been.
  • the following effects can be obtained by configuring the light emission characteristic measuring unit as described above. That is, in the application shape of the resin 8 to be applied to the translucent member 43 shown in FIG. 8B, the lower surface side is always in contact with the upper surface of the translucent member 43 or the bottom surface of the embossed portion 43a.
  • the lower surface of 8 is always at a reference height defined by the translucent member 43. Therefore, the height difference between the lower surface of the resin 8 and the opening 44a of the integrating sphere 44 is always kept constant.
  • the upper surface of the resin 8 is not necessarily realized to have the same liquid surface shape and height due to disturbances such as application conditions by the discharge nozzle 33a, and between the upper surface of the resin 8 and the light focusing tool 46b. The interval of will vary.
  • the irradiation light irradiated on the resin 8 is the light focusing tool 46b. Therefore, the degree of focusing is high, and the influence of the variation in the distance between the upper surface of the resin 8 and the light focusing tool 46b on the light transmission can be ignored.
  • the transmitted light that has passed through the resin 8 is excitation light in which the phosphor is excited inside the resin 8, so that the degree of scattering is high, and the distance between the lower surface of the resin 8 and the opening 44 a varies. Has an influence on the degree of light being taken in by the integrating sphere 44.
  • the light emitted from the resin 8 is transmitted by irradiating the resin 8 with the excitation light emitted from the light source unit 45 as described above. Since the configuration in which light is received by the integrating sphere 44 from below the optical member 43 is employed, it is possible to determine stable light emission characteristics. Further, by using the integrating sphere 44, it is not necessary to separately provide a dark room structure in the light receiving portion, so that the apparatus can be made compact and the equipment cost can be reduced.
  • the measurement result of the light emission characteristic measurement processing unit 39 is sent to the application amount derivation processing unit 38, and the application amount derivation processing unit 38 defines the measurement result of the light emission characteristic measurement processing unit 39 in advance.
  • a deviation from the emitted light emission characteristic is obtained, and a process for deriving an appropriate resin application amount of the resin 8 to be applied to the LED element 5 for actual production is performed based on the deviation.
  • the new appropriate discharge amount derived by the application amount derivation processing unit 38 is sent to the production execution processing unit 37, and the production execution processing unit 37 commands the newly derived appropriate resin application amount to the application control unit 36.
  • the application control unit 36 controls the nozzle moving mechanism 34 and the resin discharge mechanism 35 to perform a production application process for applying an appropriate resin application amount of the resin 8 to the LED elements 5 mounted on the substrate 4. 32.
  • a resin 8 having an appropriate resin coating amount specified in the resin coating information 14 is actually applied, and light emission characteristics are measured while the resin 8 is uncured. Then, based on the obtained measurement results, a non-defective range of emission characteristic measurement values when the emission characteristics are measured for the resin 8 applied in the production coating is set, and the non-defective range is determined for the quality determination in the production coating. It is used as a threshold value (see threshold value data 81a shown in FIG. 11).
  • a white LED is used as the light source unit 45 for measuring the light emission characteristics, and is prescribed in advance as a basis for setting a threshold value for quality determination in production coating.
  • the regular emission characteristics required for the finished product in which the resin 8 applied to the LED element 5 is cured are biased by the difference in emission characteristics due to the resin 8 being in an uncured state. Emission characteristics are used. Thereby, control of the resin application amount in the resin application process to the LED element 5 can be performed based on the normal light emission characteristics of the finished product.
  • the LED package 50 that emits white light is used as the light source unit 45.
  • the light emission characteristic measurement of the resin 8 applied by trial can be performed by the light having the same characteristic as the excitation light emitted in the finished LED package 50, and a more reliable test result can be obtained.
  • a light source device that can stably emit blue light having a constant wavelength for example, a blue LED that emits blue light or a blue laser light source
  • a light source unit for inspection for example, a blue LED that emits blue light or a blue laser light source
  • blue light having a predetermined wavelength may be extracted using a band-pass filter.
  • a trial hit / measure unit 140 having the configuration shown in FIGS. 9A to 9B and FIGS. 10A to 10B may be used.
  • the test hitting / measuring unit 140 has an external structure in which a cover portion 140b is disposed above an elongated horizontal base portion 140a. It has become.
  • the cover part 140b is provided with an opening part 140c, and the opening part 140c can be freely opened and closed by a sliding slide window 140d for application (arrow l).
  • a trial hitting stage 145a for supporting the translucent member 43 from the lower surface side, a translucent member mounting portion 141 on which the translucent member 43 is placed, and a translucent member mounting portion 141.
  • a spectroscope 42 is provided above.
  • the translucent member mounting unit 141 includes a light source device that emits excitation light that excites the phosphor, and the resin 8 is trial-coated in the measurement coating process.
  • the light transmissive member 43 is irradiated with excitation light from the lower surface side of the light source device.
  • the translucent member 43 is wound and supplied on the supply reel 47 in the same manner as in the examples shown in FIGS. 8A to 8C, and is sent along the upper surface of the test strike stage 145a (arrow m). Then, the light is wound around a collection reel 48 driven by a winding motor 49 via a space between the translucent member mounting portion 141 and the spectroscope 42.
  • the resin discharge head 32 applies the resin 8 to the light transmitting member 43 placed on the upper surface. Is possible.
  • the resin 8 having a prescribed application amount is applied to the translucent member 43 by the discharge nozzle 33a with respect to the translucent member 43 whose lower surface is supported by the test strike stage 145a. This is done by discharging.
  • FIG. 10B the translucent member 43 on which the resin 8 has been trial-applied is moved by the trial hitting stage 145a so that the resin 8 is positioned above the translucent member mounting portion 141, and the cover portion 140b is further moved.
  • a state in which a darkroom for measuring light emission characteristics is formed between the base 140a and the base 140a is shown.
  • An LED package 50 that emits white light is used as the light source device for the translucent member mounting portion 141.
  • the wiring layers 4e and 4d connected to the LED element 5 are connected to the power supply device 142.
  • the power supply device 142 When the power supply device 142 is turned on, the LED element 5 is supplied with power for light emission.
  • the LED package 50 emits white light.
  • the yellow light emitted from the phosphor in the resin 8 is excited by the blue light contained in the white light.
  • White light in which light and blue light are added and mixed is irradiated upward from the resin 8.
  • a spectroscope 42 is disposed above the trial hitting / measurement unit 140, and the white light emitted from the resin 8 is received by the spectroscope 42, and the received white light is analyzed by the light emission characteristic measurement processing unit 39. The emission characteristics are measured.
  • the light emission characteristic measurement processing unit 39 measures the light emission characteristic of the light emitted by the resin 8 by irradiating the resin 8 applied to the light transmitting member 43 with the excitation light emitted from the LED element 5 as the light source part. . Then, the measurement result of the light emission characteristic measurement processing unit 39 is sent to the coating amount derivation processing unit 38, and the same processing as the example shown in FIGS. 7A to 7B is executed.
  • the configuration of the control system of the LED package manufacturing system 1 will be described with reference to FIG.
  • the component mounting device M1 and the resin coating device M4 the element characteristic information 12, the resin coating information 14, the map data 18, and the above-mentioned
  • the components related to the transmission / reception and update processing of the threshold data 81a are shown.
  • the management computer 3 includes a system control unit 60, a storage unit 61, and a communication unit 62.
  • the system control unit 60 controls the LED package manufacturing work by the LED package manufacturing system 1 in an integrated manner.
  • the storage unit 61 stores element characteristic information 12, resin application information 14, and map data 18 and threshold data 81a as necessary. ing.
  • the communication unit 62 is connected to other devices via the LAN system 2 and exchanges control signals and data.
  • the element characteristic information 12 and the resin application information 14 are transmitted from the outside via the LAN system 2 and the communication unit 62 or via a single storage medium such as a CD ROM, USB memory storage, SD card, and stored in the storage unit 61. Is done.
  • the component mounting apparatus M1 includes a mounting control unit 70, a storage unit 71, a communication unit 72, a mechanism driving unit 73, and a map creation processing unit 74.
  • the mounting control unit 70 controls each unit described below based on various programs and data stored in the storage unit 71 in order to execute a component mounting operation by the component mounting apparatus M1.
  • the storage unit 71 stores mounting position information 71 a and element characteristic information 12 in addition to programs and data necessary for control processing by the mounting control unit 70.
  • the mounting position information 71 a is created from execution history data of mounting operation control by the mounting control unit 70.
  • the element characteristic information 12 is transmitted from the management computer 3 via the LAN system 2.
  • the communication unit 72 is connected to other devices via the LAN system 2 and exchanges control signals and data.
  • the mechanism driving unit 73 is controlled by the mounting control unit 70 to drive the component supply mechanism 25 and the component mounting mechanism 26.
  • the map creation processing unit 74 includes mounting position information 71a indicating the position of the LED element 5 on the substrate 4 stored in the storage unit 71 and mounted by the component mounting apparatus M1, and an element for the LED element 5 A process of creating the map data 18 associated with the characteristic information 12 for each substrate 4 is performed. That is, the map data creating means is provided in the component mounting apparatus M1, and the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4. The map data 18 may be transmitted from the component mounting apparatus M1 to the resin coating apparatus M4 via the management computer 3. In this case, the map data 18 is also stored in the storage unit 61 of the management computer 3 as shown in FIG.
  • the resin coating apparatus M4 includes a coating control unit 36, a storage unit 81, a communication unit 82, a production execution processing unit 37, a coating amount derivation processing unit 38, and a light emission characteristic measurement processing unit 39.
  • the application control unit 36 controls the nozzle moving mechanism 34, the resin discharge mechanism 35, and the test hitting / measurement unit 40 constituting the resin application unit C, so that the resin 8 is applied to the translucent member 43 for light emission characteristic measurement.
  • the measurement coating process to be performed and the production coating process to be applied to the LED element 5 for actual production are performed.
  • the application control unit 36 is provided with a light emission color correction processing unit 36a as an accompanying function.
  • the light emission color correction processing unit 36a performs a light emission color correction process, that is, a series of work processes (trial application, measurement of light emission characteristics, and resin for the purpose of determining an appropriate resin coating amount for obtaining specified light emission characteristics. Derivation of the appropriate resin coating amount). This processing is executed by the light emission color correction processing unit 36a controlling the resin coating unit C, the light emission characteristic measurement processing unit 39, and the coating amount derivation processing unit 38.
  • the storage unit 81 includes resin application information 14, map data 18, threshold data 81a, actual production application amount 81b, and correction execution condition data 83.
  • the resin application information 14 is transmitted from the management computer 3 via the LAN system 2, and the map data 18 is similarly transmitted from the component mounting apparatus M1 via the LAN system 2.
  • the communication unit 82 is connected to other devices via the LAN system 2 and exchanges control signals and data.
  • the correction execution condition data 83 stores conditions for executing the above-described emission color correction processing, for example, data on execution specified by the execution interval and execution timing (see FIGS. 20A to 20B).
  • the light emission characteristic measurement processing unit 39 performs a process of measuring the light emission characteristic of the light emitted from the resin by irradiating the resin 8 applied to the light transmitting member 43 with the excitation light emitted from the light source unit 45.
  • the application amount derivation processing unit 38 obtains a deviation between the measurement result of the light emission characteristic measurement processing unit 39 and a predetermined light emission characteristic, and based on this deviation, the resin 8 to be applied to the LED element 5 for actual production. An arithmetic process for deriving an appropriate resin application amount is performed.
  • the production execution processing unit 37 instructs the application control unit 36 to specify the appropriate resin application amount derived by the application amount derivation processing unit 38, thereby applying the appropriate resin application amount of resin to the LED element 5.
  • the process is executed, and the performance of the production coating process is recorded in real time.
  • the application control unit 36 including the light emission color correction processing unit 36a performs test application and light emission every time the recorded production application execution result passes a predetermined interval.
  • a light emission color correction process including measurement of characteristics and derivation of an appropriate resin application amount of the resin is executed.
  • the application control unit 36 may record the execution results of the production application process.
  • processing functions other than the function for executing work operations unique to each apparatus for example, the function of the map creation processing unit 74 provided in the component mounting apparatus M1, and provided in the resin coating apparatus M4.
  • the function of the applied amount derivation processing unit 38 is not necessarily attached to the apparatus.
  • the functions of the map creation processing unit 74 and the coating amount derivation processing unit 38 are covered by the arithmetic processing function of the system control unit 60 of the management computer 3 and necessary signal exchange is performed via the LAN system 2. It may be configured.
  • both the component mounting apparatus M1 and the resin coating apparatus M4 are connected to the LAN system 2.
  • the management computer 3 and the LAN system 2 in which the element characteristic information 12 is stored in the storage unit 61 uses the information obtained by separately measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance as the element characteristic information. 12 is element characteristic information providing means provided to the component mounting apparatus M1.
  • the element characteristic information providing means for providing the element characteristic information 12 to the component mounting apparatus M1 and the resin information providing means for providing the resin coating information 14 to the resin coating apparatus M4 are the storage unit 61 of the management computer 3 which is an external storage means.
  • the element characteristic information and the resin application information read out are transmitted to the component mounting apparatus M1 and the resin application apparatus M4 via the LAN system 2, respectively.
  • element characteristic information 12 and resin application information 14 are acquired (ST1). That is, the appropriate resin application amount of the resin 8 for obtaining the LED package 50 having the element characteristic information 12 obtained by separately measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance and the prescribed emission characteristics.
  • the resin application information 14 in which the element characteristic information 12 is associated is acquired from an external device via the LAN system 2 or via a storage medium.
  • the board 4 to be mounted is carried into the component mounting apparatus M1 (ST2).
  • the resin adhesive 23 is supplied to the element mounting position in the LED mounting portion 4b by raising and lowering the transfer pin 24a of the adhesive transfer mechanism 24 (arrow n).
  • the LED element 5 held by the mounting nozzle 26a of the component mounting mechanism 26 is lowered (arrow o) and mounted in the LED mounting portion 4b of the substrate 4 via the resin adhesive 23 ( ST3).
  • the map creation processing unit 74 creates map data 18 that associates the mounting position information 71a with the element characteristic information 12 of each LED element 5 for the board 4 from the execution data of the component mounting work (ST4). ).
  • the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4, and the resin coating information 14 is transmitted from the management computer 3 to the resin coating apparatus M4 (ST5). Thereby, it will be in the state which can perform the resin coating operation
  • the substrate 4 after component mounting is sent to the curing device M2, where it is heated, whereby as shown in FIG. 18 (c), the resin adhesive 23 is thermally cured to become a resin adhesive 23 *.
  • the LED element 5 is fixed to the individual substrate 4a.
  • the substrate 4 after resin curing is sent to the wire bonding apparatus M3, and as shown in FIG. 18 (d), the wiring layers 4e and 4d of the individual substrate 4a are respectively connected to the N-type portion electrodes 6a and P of the LED element 5.
  • the mold part electrode 6 b is connected to the bonding wire 7.
  • threshold data creation processing for non-defective product determination is executed (ST6). This process is executed in order to set a pass / fail judgment threshold value in production coating (see threshold value data 81a shown in FIG. 11). Bin codes [1], [2], [3 ], [4], and [5] are repeatedly executed for each of the production coatings. Details of the threshold data creation processing will be described with reference to FIGS. 13, 14A to 14C, and FIG. In FIG. 13, first, a resin 8 containing a phosphor specified in the resin application information 14 at a genuine concentration is prepared (ST11).
  • the resin discharge head 32 is moved to the test hitting stage 40 a of the test hitting / measurement unit 40, and the resin 8 is applied to the specified application amount (appropriate resin application) indicated in the resin application information 14.
  • the amount is applied to the translucent member 43 (ST12).
  • the resin 8 applied to the translucent member 43 is moved onto the translucent member mounting portion 41, the LED element 5 is caused to emit light, and the light emission characteristics in an uncured state of the resin 8 are measured by the light emission characteristic measuring section having the above-described configuration. Measure (ST13). Then, based on the light emission characteristic measurement value 39a which is the measurement result of the light emission characteristic measured by the light emission characteristic measurement unit, a non-defective product determination range of the measurement value for determining the light emission characteristic to be non-defective is set (ST14). The non-defective product determination range is stored as threshold data 81a in the storage unit 81, transferred to the management computer 3, and stored in the storage unit 61 (ST15).
  • FIGS. 14A to 14C show threshold data created in this way, that is, measurement of light emission characteristics obtained in the uncured state of resin after applying resin 8 containing a genuine phosphor content.
  • the non-defective product determination range (threshold value) of the measured value for determining that the value and the light emission characteristic are good products is shown.
  • the phosphor concentration in the resin 8 is 5%, respectively.
  • the threshold values corresponding to the Bin codes [1], [2], [3], [4], and [5] in the case of 10% and 15% are shown.
  • each of the Bin codes 12b corresponds to the application amount shown in each of the appropriate resin application amounts 15 (1).
  • the measurement result obtained by measuring the light emission characteristics of the light emitted from the resin 8 by irradiating the resin 8 coated with the respective coating amounts with the blue light of the LED element 5 is the light emission characteristic measured value 39a (1 ).
  • threshold data 81a (1) is set based on the respective emission characteristic measurement values 39a (1).
  • the measurement result of measuring the light emission characteristics of the resin 8 applied with the appropriate resin application amount VA0 corresponding to the Bin code [1] is the chromaticity coordinate ZA0 (X A0 , Y A0 on the chromaticity table shown in FIG. ).
  • a predetermined range for example, ⁇ 10%
  • a non-defective product determination range for the appropriate resin coating amounts corresponding to the other Bin codes [2] to [5]
  • a non-defective product determination range is set based on the light emission characteristic measurement results (chromaticity table shown in FIG. 15).
  • the predetermined range set as the threshold is appropriately set according to the accuracy level of the light emission characteristics required for the LED package 50 as a product.
  • 14 (b) and 14 (c) show the emission characteristic measurement value and the non-defective product determination range (threshold value) when the phosphor concentration of the resin 8 is 10% and 15%, respectively.
  • the appropriate resin application amount 15 (2) and the appropriate resin application amount 15 (3) are the appropriate resin application amounts when the phosphor concentrations are 10% and 15%, respectively.
  • the emission characteristic measurement value 39a (2) and the emission characteristic measurement value 39a (3) are emission specific measurement values when the phosphor concentrations are 10% and 15%, respectively, and threshold data.
  • 81a (2) and threshold value data 81a (3) indicate a non-defective product determination range (threshold value) in each case.
  • Threshold data created in this way is used properly in accordance with the Bin code 12b to which the target LED element 5 belongs in the production coating operation.
  • the threshold value data creation process shown in (ST6) is executed as an off-line operation by a single inspection device provided separately from the LED package manufacturing system 1, and is previously stored in the management computer 3 as threshold value data 81a. It is also possible to transmit the received data to the resin coating apparatus M4 via the LAN system 2.
  • the substrate 4 after wire bonding is transported to the resin coating device M4 (ST7), and as shown in FIG. 19A, the resin is discharged from the discharge nozzle 33a into the LED mounting portion 4b surrounded by the reflecting portion 4c. 8 is discharged.
  • the resin application information 14 based on the map data 18, the threshold value data 81a, and the resin application information 14, an operation of applying a prescribed amount of the resin 8 shown in FIG. 19B covering the LED element 5 is performed (ST8). Details of this resin coating operation processing will be described with reference to FIGS. 14 (a) to 14 (c) and FIG.
  • the resin container is exchanged as necessary (ST21). That is, the dispenser 33 attached to the resin discharge head 32 is replaced with one containing a resin 8 having a phosphor concentration selected according to the characteristics of the LED element 5.
  • the resin application portion C is used to test-apply the resin 8 to the translucent member 43 for measurement of light emission characteristics (measurement application step) (ST22). That is, the resin 8 having an appropriate resin application amount (VA0 to VE0) for each of the Bin cords 12b defined in FIG. 4 is formed on the light transmitting member 43 drawn out to the trial placement stage 40a by the trial placement / measurement unit 40. Apply. At this time, even if the discharge operation parameter corresponding to the appropriate resin application amount (VA0 to VE0) is commanded to the resin discharge mechanism 35, the actual resin application amount discharged from the discharge nozzle 33a and applied to the translucent member 43 is the resin.
  • the proper resin coating amount does not necessarily become the above-mentioned appropriate resin coating amount due to the change in the property of 8 over time, and the actual resin coating amount is VA1 to VE1 somewhat different from VA0 to VE0, as shown in FIG.
  • the translucent member 43 on which the resin 8 has been trial-applied is sent and placed on the translucent member mounting portion 41 (translucent member mounting step).
  • the excitation light which excites a fluorescent substance is light-emitted from the light source part 45 arrange
  • the light emission characteristic measurement processing unit 39 measures the light emission characteristic (light emission characteristic measurement step) (ST23).
  • a light emission characteristic measurement value represented by the chromaticity coordinate Z (see FIG. 15) is obtained.
  • This measurement result is not necessarily based on the above-described error in the coating amount and the change in the concentration of the phosphor particles in the resin 8, and so on, and the standard color at the time of application of the appropriate resin shown in FIG.
  • the degree coordinates ZA0 to ZE0 do not match.
  • the deviation ( ⁇ X A) indicating the separation in the X and Y coordinates between the obtained chromaticity coordinates ZA1 to ZE1 and the standard chromaticity coordinates ZA0 to ZE0 at the time of proper resin application shown in FIG. , ⁇ Y A ) to ( ⁇ X E , ⁇ Y E ) are determined to determine whether correction is necessary to obtain desired light emission characteristics.
  • the measurement result is within the threshold value (ST24), and as shown in FIG. 17C, the deviation obtained in (ST23) is compared with the threshold value.
  • the deviations ( ⁇ X A , ⁇ Y A ) to ( ⁇ X E , ⁇ Y E ) are within ⁇ 10% of ZA0 to ZE0.
  • the application amount is corrected (ST25). That is, the deviation between the measurement result in the light emission characteristic measurement step and the predetermined light emission characteristic is obtained, and as shown in FIG. 17 (d), the actual production to be applied to the LED element 5 based on the obtained deviation.
  • the process of deriving the new appropriate resin application amount (VA2 to VE2) is executed by the application amount deriving processing unit 38 (application amount deriving process step).
  • the corrected appropriate resin coating amount (VA2 to VE2) is an updated value obtained by adding a correction amount corresponding to each deviation to the preset appropriate resin coating amount VA0 to VE0.
  • the relationship between the deviation and the correction amount is recorded in the resin application information 14 as known accompanying data in advance.
  • the processes of (ST22), (ST23), (ST24), and (ST25) are repeatedly executed, and the measurement result is defined in advance in (ST24).
  • the proper resin coating amount for actual production is determined.
  • an appropriate resin is obtained by repeatedly performing a light emission color correction process including a measurement coating process, a translucent member placement process, an excitation light emission process, a light emission characteristic measurement process, and a coating amount derivation process.
  • the application amount is deterministically derived.
  • the determined proper resin application amount is stored in the storage unit 81 as the actual production application amount 81b.
  • the production coating is executed (ST31). That is, when the production execution processing unit 37 instructs the application control unit 36 that controls the resin discharge mechanism 35, the appropriate resin application amount derived by the application amount derivation processing unit 38 and stored as the actual production application amount 81b.
  • the production application process for applying the appropriate amount of resin 8 to the LED element 5 mounted on the substrate 4 is executed, and the execution result of the production application process is recorded (production execution process).
  • the light emission color correction processing unit 36a performs the resin coating unit C and the light emission characteristic measurement process based on the correction execution condition data 83 set in advance and stored in the storage unit 81. By controlling the unit 39 and the coating amount derivation processing unit 38, the light emission color correction process described above is repeatedly executed.
  • the emission color correction processing is executed prior to the start of the production application work, and the appropriate resin application amount is set, but the emission characteristics of the product in the actual production process depend on various factors. fluctuate. For example, the phosphor concentration in the resin 8 tends to change over time due to fluctuation factors such as sedimentation of phosphor particles in the resin, and the viscosity of the resin 8 is not necessarily constant. Further, regarding the resin discharge characteristics of the dispenser 33 to which the resin 8 is applied, even if the same discharge parameter is commanded, variations in the discharge amount are unavoidable due to the clogged state of the discharge nozzle 33a, inherent nozzle device differences, and the like. Therefore, in the process of repeatedly performing the production coating process, it is desirable to monitor the light emission characteristics of the product at an appropriate interval timing and execute the light emission color correction process to correct the appropriate resin coating amount as necessary.
  • the execution timing of the light emission color correction process is determined based on the execution performance of the production coating process recorded by the production execution processing unit 37 and the correction execution condition data 83 stored in the storage unit 81.
  • the correction execution condition data 83 the execution performance standard 84 and the application execution condition standard 85 are divided into two standards to determine the execution timing of the emission color correction process. ing.
  • a predefined execution result that is, a work duration 84a indicating a series of durations from the start of work in the resin coating apparatus M4, and a number of boards indicating the number of substrates 4 produced in the series of works.
  • the number of times of application operation 84c indicating the number of times the dispenser 33 has applied the resin 8 by applying the resin 8 in the application work is used as a specific numerical parameter indicating the execution performance.
  • These numerical parameters recorded in real time correspond to predetermined intervals that are set in advance, that is, the interval time for the operation duration 84a, the interval number for the substrate number 84b, and the number of intervals for the coating operation count 84c. Every time elapses, the emission color correction process is executed.
  • the emission color correction processing may always be executed at the same interval using a preset fixed value, and the product state transition is performed by the emission characteristic processing function provided in the resin coating apparatus M4.
  • the tendency may be determined, and the specified interval may be dynamically optimally set according to the apparatus state.
  • the application execution condition standard 85 operations / events that are presumed to be related to variations in the amount of resin application that causes the light emission characteristics to fluctuate are defined in advance, and these operations / events are executed. It is considered that the application execution condition for the substrate 4 by the dispenser 33 has been changed. Examples of such operations / events in the work include a resin replenishment 85a for replacing the syringe containing the resin 8 in the dispenser 33, a nozzle replacement 85b for cleaning or replacing the discharge nozzle 33a of the dispenser 33, and the dispenser 33.
  • the air pressure adjustment 85c for changing the air pressure for resin discharge supplied to the is listed.
  • FIG. 20B shows the timing of the emission color correction process executed based on such correction execution condition data 83.
  • a method is shown in which the above-mentioned specified interval is set using the light emission characteristic processing function of the resin coating apparatus M4. That is, in the graph of FIG. 20B, the horizontal axis represents the operation duration as a numerical parameter indicating the performance of execution, and the vertical axis represents the measured light emission characteristic value.
  • the ⁇ mark shown at the bottom of the graph indicates the correction execution timing at which the emission color correction process is executed.
  • the light emission characteristics of the product are measured at an appropriately set monitoring pitch. Then, the elapsed time until the timing when the value of the measurement result reaches the threshold limit (upper limit or lower limit) set as the non-defective product determination range is determined as the reference interval T1, and the emission color correction processing is performed at this timing. Is executed. If the operation / event such as resin replenishment 85a, nozzle replacement 85b,... Corresponding to the change of the application execution condition is executed after the production application process is started, the application control unit 36 sets the application execution condition. The light emission color correction process is executed for each change.
  • the intervals T2 and T3 that define the execution timing of the next light emission color correction process may be set to the same value following the interval T1, but in order to eliminate the loss time due to the execution of the light emission color correction process as much as possible.
  • the intervals T2 and T3 may be set to be longer than the interval T1 by a time increment determined by a predetermined algorithm.
  • the operation duration 84a is used as a numerical parameter indicating the execution result has been described, but the interval is similarly set even when the number of substrates 84b and the number of application operations 84c are used as numerical parameters indicating the execution result. .
  • the interval is based on the number of sheets and the number of times.
  • a light emission color correction process for correcting the appropriate resin coating amount based on the measurement of the light emission characteristics and the measurement result is executed.
  • the monitoring of (ST32) is always performed, and the emission color correction is repeatedly executed according to the monitoring result to finish the resin application for a predetermined number of LED mounting portions 4b.
  • the coating operation by the resin coating apparatus M4 is completed (ST33).
  • the substrate 4 is sent to the curing device M5, and the resin 8 is cured by heating by the curing device M5 (ST9).
  • the resin 8 applied so as to cover the LED element 5 is thermally cured to become the resin 8 *, and is fixed in the LED mounting portion 4b.
  • the substrate 4 after the resin curing is sent to the individual piece cutting device M6, where the substrate 4 is cut into the individual piece substrates 4a, and as shown in FIG. (ST10). Thereby, the LED package 50 is completed.
  • the LED package manufacturing system 1 shown in the present embodiment individually measures in advance the component mounting apparatus M1 for mounting the plurality of LED elements 5 on the substrate 4 and the emission wavelengths of the plurality of LED elements 5.
  • the element characteristic information providing means for providing the obtained information as element characteristic information 12 is associated with the appropriate resin application amount of the resin 8 for obtaining the LED package 50 having the prescribed light emission characteristic and the element characteristic information 12.
  • Resin information providing means for providing the information as resin coating information 14, mounting position information 71a indicating the position of the LED element 5 mounted on the substrate 4 by the component mounting apparatus M1, and element characteristic information 12 on the LED element 5; , Based on the map data creation means for creating the map data 18 for each substrate 4, the map data 18 and the resin application information 14, The appropriate resin coating amount of the resin 8 for having a constant emission characteristics, has a configuration that includes a resin coating device M4 to be applied to each LED element mounted on the substrate 4.
  • the resin coating apparatus M4 controls the resin coating unit C that discharges the resin 8 in a variable amount and applies the resin 8 to an arbitrary coating target position, and the resin coating unit C.
  • a coating control unit 36 that executes a coating process for measurement that is trial-coated on the translucent member 43 and a production coating process that is applied to the LED element 5 for actual production, and a light source unit 45 that emits excitation light that excites the phosphor.
  • the light transmitting member mounting portion 41 on which the light transmitting member 43 on which the resin 8 is trial-coated is placed, and the resin in which the excitation light emitted from the light source portion 45 is applied to the light transmitting member 43
  • the application control unit 36 By instructing the application control unit 36 to apply the derived appropriate resin application amount to the application amount derivation processing unit 38 for deriving the appropriate resin application amount for actual production to be applied to the element 5, It is configured to include a production execution processing unit 37 that executes a production application process for applying resin to the LED elements 5 and records the execution results of the production application process.
  • the control function of the application control unit 36 makes a trial application in which the resin 8 is applied to the translucent member 43 for light emission characteristic measurement.
  • Execute the coating process for production by performing a process for coating the emission color, which includes a series of processes for deriving the appropriate resin coating amount of the resin to be applied to the LED element 5 for actual production based on the measurement of the light emission characteristics and the measurement result. It is executed every time when the actual result passes a predetermined interval or when the application execution condition by the dispenser 33 is changed.
  • the emission characteristics of the LED package 50 are made uniform by the emission color correction process to improve the production yield and the execution timing of the emission color correction process. Can be set rationally, and the number of required emission color correction processes can be reduced to improve productivity.
  • the resin coating apparatus and resin coating method of the present invention can improve the production yield by making the light emission characteristics of the LED package uniform by the light emission color correction processing even when the light emission wavelength of the individual LED elements varies. Field of manufacturing an LED package having an effect that the productivity can be improved by reducing the number of required emission color correction processes, and the LED element is covered with a resin containing a phosphor. Is available in

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Abstract

Cette invention concerne un dispositif et un procédé d'application de résine pour la production d'un boîtier de DEL formé par encapsulation d'un élément de DEL (5) au moyen d'une résine (8) comprenant une substance luminescente. Ledit procédé comprend l'étape consistant à exécuter un traitement de correction de couleur d'émission lumineuse chaque fois qu'un laps de temps prédéterminé s'est écoulé après obtention des résultats d'exécution d'une application de revêtement réalisée préalablement en vue de la production. Ledit traitement de correction de couleur d'émission lumineuse comprend la déduction d'une quantité appropriée de résine à appliquer sur l'élément de DEL (5) en vue de la production proprement dite sur la base des résultats d'une mesure des caractéristiques d'émission lumineuse de la lumière émise par la résine (8) suite à l'application d'une lumière par le dessus sur la résine appliquée en revêtement d'essai (8) en vue de la mesure des caractéristiques d'émission lumineuse.
PCT/JP2012/006354 2011-10-06 2012-10-03 Dispositif d'application de résine et procédé d'application de résine Ceased WO2013051260A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011221628A JP5879508B2 (ja) 2011-10-06 2011-10-06 樹脂塗布装置および樹脂塗布方法
JP2011221630A JP2013084651A (ja) 2011-10-06 2011-10-06 樹脂塗布装置および樹脂塗布方法
JP2011-221630 2011-10-06
JP2011-221628 2011-10-06

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WO2013051260A1 true WO2013051260A1 (fr) 2013-04-11

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007066969A (ja) * 2005-08-29 2007-03-15 Toshiba Lighting & Technology Corp 白色発光ダイオード装置とその製造方法
JP2008130279A (ja) * 2006-11-17 2008-06-05 Nichia Chem Ind Ltd 面状発光装置及びその製造方法
JP2010103349A (ja) * 2008-10-24 2010-05-06 Toshiba Corp 発光装置の製造方法
JP2010177620A (ja) * 2009-02-02 2010-08-12 Showa Denko Kk 発光装置の製造方法
JP2011096936A (ja) * 2009-10-30 2011-05-12 Alpha- Design Kk 半導体発光ディバイス製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007066969A (ja) * 2005-08-29 2007-03-15 Toshiba Lighting & Technology Corp 白色発光ダイオード装置とその製造方法
JP2008130279A (ja) * 2006-11-17 2008-06-05 Nichia Chem Ind Ltd 面状発光装置及びその製造方法
JP2010103349A (ja) * 2008-10-24 2010-05-06 Toshiba Corp 発光装置の製造方法
JP2010177620A (ja) * 2009-02-02 2010-08-12 Showa Denko Kk 発光装置の製造方法
JP2011096936A (ja) * 2009-10-30 2011-05-12 Alpha- Design Kk 半導体発光ディバイス製造装置

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