WO2013049419A3 - Light emitting devices having light coupling layers - Google Patents
Light emitting devices having light coupling layers Download PDFInfo
- Publication number
- WO2013049419A3 WO2013049419A3 PCT/US2012/057666 US2012057666W WO2013049419A3 WO 2013049419 A3 WO2013049419 A3 WO 2013049419A3 US 2012057666 W US2012057666 W US 2012057666W WO 2013049419 A3 WO2013049419 A3 WO 2013049419A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- light emitting
- light
- emitting devices
- coupling layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
Landscapes
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A light emitting device comprises a first layer of an n-type semiconductor material, a second layer of a p-type semiconductor material, and an active layer between the first layer and the second layer. A light coupling layer is disposed adjacent to one of the first layer and the second layer. In some cases, the light coupling layer is formed by roughening a buffer layer of the light emitting device. The light emitting device includes an electrode in electrical communication with one of the first layer and the second layer through a portion of the light coupling layer.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201280028463.8A CN103636008B (en) | 2011-09-29 | 2012-09-27 | Light emitting device with light coupling layer |
| KR20137032170A KR20140019442A (en) | 2011-09-29 | 2012-09-27 | Light emitting devices having light coupling layers |
| JP2014527368A JP2014524676A (en) | 2011-09-29 | 2012-09-27 | Light emitting device having an optical coupling layer |
| KR1020157031399A KR20150127743A (en) | 2011-09-29 | 2012-09-27 | Light emitting devices having light coupling layers |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/249,184 US9012921B2 (en) | 2011-09-29 | 2011-09-29 | Light emitting devices having light coupling layers |
| US13/249,184 | 2011-09-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2013049419A2 WO2013049419A2 (en) | 2013-04-04 |
| WO2013049419A3 true WO2013049419A3 (en) | 2013-07-11 |
Family
ID=47991737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2012/057666 Ceased WO2013049419A2 (en) | 2011-09-29 | 2012-09-27 | Light emitting devices having light coupling layers |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9012921B2 (en) |
| JP (2) | JP2014524676A (en) |
| KR (2) | KR20150127743A (en) |
| CN (1) | CN103636008B (en) |
| TW (1) | TWI520375B (en) |
| WO (1) | WO2013049419A2 (en) |
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| US8698163B2 (en) | 2011-09-29 | 2014-04-15 | Toshiba Techno Center Inc. | P-type doping layers for use with light emitting devices |
| US20130082274A1 (en) | 2011-09-29 | 2013-04-04 | Bridgelux, Inc. | Light emitting devices having dislocation density maintaining buffer layers |
| DE102011114671A1 (en) | 2011-09-30 | 2013-04-04 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip |
| KR101286211B1 (en) * | 2012-02-16 | 2013-07-15 | 고려대학교 산학협력단 | Method of fabricating light emitting device and light emitting device fabricated by using the same |
| US9917004B2 (en) | 2012-10-12 | 2018-03-13 | Sumitomo Electric Industries, Ltd. | Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor device |
| JP6322890B2 (en) * | 2013-02-18 | 2018-05-16 | 住友電気工業株式会社 | Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor device |
| WO2014125688A1 (en) | 2013-02-18 | 2014-08-21 | 住友電気工業株式会社 | Group iii-nitride composite substrate and method of producing same, layered group iii-nitride composite substrate, as well as group iii-nitride semiconductor device and method of producing same |
| GB2531453A (en) * | 2013-07-02 | 2016-04-20 | Ultratech Inc | Formation of heteroepitaxial layers with rapid thermal processing to remove lattice dislocations |
| CN105579613B (en) * | 2013-09-23 | 2018-06-05 | 雅达公司 | Method and apparatus for forming device-quality gallium nitride layers on silicon substrates |
| CN106663720A (en) * | 2014-01-29 | 2017-05-10 | 光电子株式会社 | Aluminum-gallium-indium-phosphorus-based light emitting diode having gallium nitride layer of uneven type and method for manufacuturing same |
| JP2015177025A (en) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | Optical semiconductor device |
| DE102014105192A1 (en) * | 2014-04-11 | 2015-10-15 | Osram Opto Semiconductors Gmbh | Method for detaching a layer to be detached from a substrate |
| EP2988339B1 (en) * | 2014-08-20 | 2019-03-27 | LG Innotek Co., Ltd. | Light emitting device |
| TWI577046B (en) * | 2014-12-23 | 2017-04-01 | 錼創科技股份有限公司 | Semiconductor light emitting element and manufacturing method thereof |
| CN104810446B (en) * | 2015-03-03 | 2018-10-09 | 华灿光电股份有限公司 | A kind of GaN base light emitting epitaxial wafer and preparation method thereof |
| CN105140357A (en) * | 2015-09-18 | 2015-12-09 | 华灿光电股份有限公司 | Epitaxial wafer with high light-emitting efficiency quantum barrier and preparation method thereof |
| JP2017135283A (en) | 2016-01-28 | 2017-08-03 | ローム株式会社 | Semiconductor device and method for manufacturing semiconductor device |
| US10862002B2 (en) * | 2018-04-27 | 2020-12-08 | Facebook Technologies, Llc | LED surface modification with ultraviolet laser |
| TWI796046B (en) * | 2021-12-13 | 2023-03-11 | 國立中山大學 | Manufacturing method of ingan quantum wells |
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| KR20150127743A (en) | 2015-11-17 |
| TW201332146A (en) | 2013-08-01 |
| TWI520375B (en) | 2016-02-01 |
| CN103636008B (en) | 2016-08-17 |
| US9012921B2 (en) | 2015-04-21 |
| US20150171264A1 (en) | 2015-06-18 |
| US9299881B2 (en) | 2016-03-29 |
| JP2014524676A (en) | 2014-09-22 |
| JP2016006886A (en) | 2016-01-14 |
| JP6049152B2 (en) | 2016-12-21 |
| US20130082280A1 (en) | 2013-04-04 |
| KR20140019442A (en) | 2014-02-14 |
| WO2013049419A2 (en) | 2013-04-04 |
| CN103636008A (en) | 2014-03-12 |
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