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WO2012126803A1 - Groupement de miroirs pouvant être commandés - Google Patents

Groupement de miroirs pouvant être commandés Download PDF

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Publication number
WO2012126803A1
WO2012126803A1 PCT/EP2012/054572 EP2012054572W WO2012126803A1 WO 2012126803 A1 WO2012126803 A1 WO 2012126803A1 EP 2012054572 W EP2012054572 W EP 2012054572W WO 2012126803 A1 WO2012126803 A1 WO 2012126803A1
Authority
WO
WIPO (PCT)
Prior art keywords
mirror
temperature
substrate
front surface
mirror array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/054572
Other languages
English (en)
Inventor
Adrian Staicu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Publication of WO2012126803A1 publication Critical patent/WO2012126803A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0866—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by thermal means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems

Definitions

  • the invention relates to a controllable multi-mirror array in accordance with the preamble of claim 1 , an optical system comprising a controllable multi-mirror array in accordance with the preamble of claim 12, and to a method for operating a controllable multi-mirror array in accordance with the preamble of claim 14.
  • microlithographic projection exposure methods are used for producing semiconductor components and other finely structured components.
  • the pattern is positioned in a projection exposure apparatus between an illumination system and a projection lens in the region of the object surface of the projection lens and illuminated with an illumination radiation provided by the illumination system.
  • the radiation altered by the pattern passes as projection radiation through the projection lens, - - which images the pattern onto the substrate to be exposed, which is coated with a radiation-sensitive layer.
  • the pattern is illuminated with the aid of an illumination system, which, from the radiation, a primary radiation source, forms an illumination radiation which is directed onto the pattern and which is characterized by specific illumination parameters and impinges on the pattern within an illumination field of defined form and size.
  • an illumination system which, from the radiation, a primary radiation source, forms an illumination radiation which is directed onto the pattern and which is characterized by specific illumination parameters and impinges on the pattern within an illumination field of defined form and size.
  • illumination setting different illumination modes
  • an illumination system has a pupil shaping unit for receiving radiation from a primary radiation source and for generating a two-dimensional intensity distribution that can be set in a variable fashion in the pupil surface of the illumination system.
  • Some concepts provide for using in the pupil shaping unit a controllable mirror array in the form of a multi-mirror array (MMA) having a multiplicity of individual mirror elements which are carried by a common carrier structure and which can be tilted independently of one another in order to alter the angular distribution of the radiation incident on the totality of the mirror elements in a targeted manner such that the desired spatial illumination intensity distribution arises in the pupil surface.
  • MMA multi-mirror array
  • a controllable mirror array - - In order to be able to set the geometrical reflection properties of a controllable mirror array in a targeted manner, a controllable mirror array - - generally has for each mirror element an actuator arrangement coupled to the mirror element and serving for controllably altering the position of the mirror element relative to the carrier structure carrying the mirror elements. Furthermore, provision is made of a control device for controlling actuating movements of the actuator arrangement. I n the absence of control signals, the mirror elements assume their respective zero position. Under the supervision of the control device, the orientation and/or the position of the mirror surface of the mirror element can be altered in a targeted manner proceeding from the zero position.
  • An actuator arrangement has one or a plurality of actuator elements which can be activated in a targeted manner and the actuation or activation of which leads to the actuating movement of the actuator arrangement.
  • WO 2009/100856 A1 discloses multi-mirror arrays having a multiplicity of individual mirror elements which are in each case connected to an actuator in such a way that they can be tilted separately from one another about at least one tilting axis.
  • the actuators are embodied as electrically drivable piezo-actuators.
  • the patent US 6,977,71 8 B1 discloses multi-mirror arrays whose individual mirror elements can be tilted with the aid of piezoelectric actuators.
  • the patent US 6,428, 173 B1 discloses microelectromechanical structures (MEMS), designed such that an individual mirror element or many mirror elements of a mirror array can be moved in a targeted manner as a reaction to a selective thermal actuation or activation by thermally activatable actuator elements.
  • MEMS microelectromechanical structures
  • an electric current can be conducted through at least part of the actuator element in order to directly electrically heat the latter.
  • An indirect thermal activation with the aid of an external heating device is mentioned as an alternative.
  • the patent application WO 201 0/003527 A1 discloses multi-mirror arrays comprising individually tiltable mirror elements which are carried by a carrier structure divided into two or more partial regions that can be tilted relative to one another. As a result, at least two of the mirror elements have a different orientation of their mirror surface in their zero position.
  • US 2007/0165202 A1 (corresponding to WO 2005/026843 A2) and WO 2008/131 928 A1 or EP 1 262 836 A1 disclose examples of the use of multi-mirror arrays in illumination systems for microlithographic projection exposure apparatuses which operate in the deep ultraviolet range (DUV range).
  • DUV range deep ultraviolet range
  • multi-mirror arrays in illumination systems for radiation from the extreme ultraviolet range (EUV) is disclosed for example in the patent US 6,977,71 8 B1 or in the patent applications DE 2007 041 004 A1 and DE 1 0 2008 009 600 A1 .
  • DE 1 0 2008 009 600 A1 proposes using two controllable multi-mirror arrays in an illumination system, of which multi-mirror arrays one serves as a field facet mirror and the other as a pupil facet mirror. - -
  • the requirements made of the accuracy of the orientation of the individual mirror surfaces of a mirror array are very stringent particularly in the case of applications in the field of microlithography.
  • This angular accuracy corresponds to typically required positioning accuracies in the range of a few nanometers, wherein these accuracies should preferably also be complied with under the influence of temperature variations such as can be generated by the electromagnetic radiation used during projection exposure for example during the operation of a projection exposure apparatus.
  • a misorientation of individual or a plurality of mirror surfaces of a mirror array can have various causes.
  • Misorientations can for example already occur during the mounting of a mirror array within an optical system. Over the lifetime of the optical system, relaxation effects that bring about an irreversible alternation of the orientation can additionally occur on account of repeated thermal cycling stress. During operation, reversible misorientations can occur on account of temperature changes, for example. Misorientations of the mirror surfaces influence the geometrical reflection behavior of the mirror array and can e.g. disadvantageously affect the angular distribution of the radiation in the beam reflected by the mirror array.
  • controllable mirror arrays which permanently allow the geometrical-optical properties of a beam influenced by the mirror array to be set as exactly as possible.
  • a problem addressed by the invention is that of providing a controllable multi-mirror array wherein the problems described above can be reduced or avoided.
  • disadvantages which can result from incorrect positions of mirror elements are intended to be avoided or reduced.
  • the invention provides a controllable multi- mirror array comprising the features of claim 1 . Furthermore, an optical system comprising a controllable multi-mirror array comprising the features of claim 12 and a method for operating a controllable multi- mirror array comprising the features of claim 14 are provided.
  • a comparable multi-mirror array according to the claimed invention has a carrier structure, which carries a multiplicity of individual mirror elements.
  • a mirror element has a mirror substrate, which has a front surface coated with a reflection coating and a rear surface situated opposite the front surface at a distance and facing the carrier structure.
  • the front surface coated with reflection coating forms the (reflective) mirror surface of the individual mirror element.
  • the front surface or mirror surface can be flat, such that the mirror element forms a plane mirror.
  • the front surface can also be curved convexly or concavely in one or a plurality of directions.
  • the front surface is prepared with optical quality and carries the reflection coating, the material or material combination and construction of which determine the optical reflection properties of the mirror element, in particular the reflectance thereof.
  • the reflection coating can be constructed, for example, such that it has a high reflectance for radiation from the extreme ultraviolet range (EUV).
  • EUV extreme ultraviolet range
  • a reflection coating having a reflective effect in the deep ultraviolet range (DUV) can also be
  • the mirror array includes a temperature-regulating device for generating a lateral steady-state temperature gradient in a temperature-regulatable zone of the substrate, said zone lying between the front surface and the rear surface, as a response to signals of a control device.
  • lateral temperature gradient denotes a temperature gradient whose essential component or whose temperature gradient vector is directed at least approximately perpendicularly to a normal to the front surface.
  • the temperature gradient can be generated and/or maintained by a heat flow whose flow direction runs substantially parallel to the front surface.
  • the temperature-regulating device is designed such that within the mirror substrate it is possible to actively maintain a thermal imbalance in a lateral direction (transverse direction).
  • one side of the mirror substrate can be greatly heated, while the opposite side is heated only weakly or is not heated at all, or is even cooled.
  • a temperature gradient from the warmer to the colder side is established.
  • a greater thermal expansion results on the warmer side than on the colder side, wherein the extent of thermal expansion decreases continuously from the warmer to the colder side without abrupt changes.
  • the non-uniform thermal expansion in the region of the temperature- regulatable zone has the effect that the shape of the mirror substrate varies in a manner that can be defined by predefinition of the temperature gradient, wherein to a first approximation a global tilting of the front surface of the mirror substrate relative to the rear surface about a (virtual) tilting axis arises which runs substantially perpendicularly to the direction of the heat flow and more or less perpendicularly to a normal to the front surface.
  • This thermally induced change in shape of the mirror substrate is fully reversible and, in principle, can be repeated as often as desired with a reproducible result.
  • the mirror substrate at least in the region of the temperature-regulatable zone, consists of a substrate material having a coefficient of thermal expansion of at least 1 * 10 "6 K "1 at room temperature (20°C). Materials having good thermal conductivity and a coefficient of thermal expansion of at least 1 0 * 10 "6 K "1 are preferably used.
  • a semiconductor material such as e.g. silicon, or silicon carbide, or a metallic material, such as e.g. aluminum, tungsten or copper, can be used as substrate material.
  • the substrate dimensions, the substrate material and the temperature-regulating device are coordinated with one another in such a way that for the thermally induced tilting a sensitivity S of the order of magnitude of 1 prad/K is obtained.
  • a sensitivity S of the order of magnitude of 1 prad/K
  • the sensitivity S is in the range of between 0.3 ⁇ rad/K and 90 ⁇ / ⁇ , in particular between 1 ⁇ / ⁇ and 30 ⁇ / ⁇ .
  • an intermediate region that is substantially not temperature- regulatable by the temperature-regulating device lies between the temperature-regulatable zone and the front surface.
  • the heat flow generated by the temperature-regulating device runs, in the absence of further heat sources or heat sinks, substantially within the temperature- regulatable zone, such that hardly any heat flows away into adjacent zones. If a sufficiently large intermediate region lies between the temperature-regulatable zone and the front surface, the side surfaces of which intermediate region are not heated, what can be achieved is that the form of the front surface is practically not altered by the temperature regulation. Therefore, thermally induced deformations of the front surface serving as mirror surface do not occur, such that the alteration of the effect of the heated mirror element results exclusively from the change in the orientation of the reflectively coated front surface.
  • the temperature-regulatable zone can lie e.g. centrally between the front surface and the rear surface, if appropriate also closer to the rear surface than to the front surface.
  • a cooling device for actively cooling the carrier structure.
  • the carrier structure can contain coolant channels, for example, through which a liquid or gaseous cooling fluid is conducted in order to dissipate heat from the carrier structure. Electrical cooling by means of Peltier elements or the like is also possible. Given sufficiently good heat conduction contact between the mirror substrate and the carrier structure, the carrier structure thus acts as a heat sink and heat is dissipated from the mirror substrate away from the front surface in the direction of the rear surface.
  • the cooling device in - - interaction with the temperature-regulating device has the effect that the heat introduced, if appropriate, by the temperature-regulating device flows away predominantly in the direction of the rear surface of the mirror substrate, such that the asymmetrical deformation of the front surface by the temperature-regulating device is negligible.
  • the cooling device contributes to extracting from the mirror substrate heat which can result on account of absorption of the radiation impinging on the reflection coating in the region of the mirroring front side of the mirror element. This can contribute to the long-term stability of the optical properties of the mirror element.
  • the mirror substrate can be directly connected to the carrier structure, preferably areally. It can consist of the same material as the carrier structure and, if appropriate, be embodied in one piece (integrally) with the latter. An integral configuration allows a particularly good heat transfer between mirror substrate and carrier structure.
  • the mirror array can be produced by a lithography process, for example.
  • a thermally conductive intermediate structure is arranged between the carrier structure and the mirror substrate. Said intermediate structure can serve as a thermal/mechanical interface between the material of the carrier structure and the material of the mirror substrate, which possibly deviates from the material of the carrier structure.
  • the intermediate structure should allow the best possible heat transfer between mirror substrate and carrier structure; it is therefore preferably areally extended.
  • an alignment of the orientation of the mirror substrate relative to the carrier structure is possible before the mirror substrate is fixed to the carrier structure.
  • the intermediate structure can e.g. contain an adhesive layer or a solder layer or be formed by such.
  • a mechanical fixing structure can also be provided, which maximizes the contact area with respect to the carrier - - structure.
  • the intermediate structure can have an alignable mechanical articulation arrangement.
  • the temperature-regulating device can be constructed in various ways.
  • the mirror substrate has side surfaces and an electrothermal transducer is provided on at least one of the side surfaces in the region of the temperature-regulatable zone.
  • electrothermal transducer denotes a temperature-regulating element which can be heated or cooled with the aid of electric current.
  • This can be, for example, a resistance heating element or a Peltier element.
  • a resistance heating element a DC or AC current conducted through leads to heating (temperature increase)
  • a Peltier element depending on the polarity of the voltage present, can optionally serve as a heating element (for increasing temperature) or as a cooling element (for decreasing temperature).
  • there is an areal contact between the electrothermal transducer and the side surface of the mirror substrate such that via the contact area per unit time large quantities of heat can be introduced into the mirror substrate or extracted from the mirror substrate.
  • electrothermal transducers are fitted in pairs on the mirror substrate, wherein a first electrothermal transducer of a first pair is arranged on a first side surface and a second electrothermal transducer of the first pair is arranged on a second side surface situated opposite in a first direction.
  • the flow of heat can be controlled particularly well in the region between the electrothermal transducers and, by targeted heating and/or cooling of the electrothermal transducers of a pair, it is possible to set temperature gradients of different magnitudes along the first direction.
  • At least one second pair of electrothermal transducers is provided, which are arranged on opposite side surfaces of the mirror - - substrate in a second direction running transversely, in particular perpendicularly, with respect to the first direction defined by the first pair of electrothermal transducers.
  • the transducers of the pairs can be driven independently of one another.
  • two or more differently oriented virtual tilting axes are possible, such that the front surface can be inclined practically in any desired directions relative to the rear surface.
  • the effect of the cooling device of the carrier structure is sufficient to enable the orientation of the mirror substrate exclusively by the use of electrothermal transducers without heat sink functionality.
  • a pairwise arrangement of the transducers is not necessary.
  • the temperature-regulating device can be the sole manipulator device for influencing the orientation of the reflective front surfaces of the mirror elements of the mirror array.
  • the orientation thereof can be set with high accuracy in the range. This enables, for example, a fine alignment of the individual mirror surfaces of the mirror array relative to one another. In this way, by way of example, a desired reflection geometry of the entire mirror array can be set and permanently maintained. It is also possible to dynamically alter the relative orientations of the mirror surfaces of the mirror elements with the aid of the temperature-regulating device.
  • relaxation times or switching times of between 1 sec and 1 0 sec can readily be realized as necessary.
  • the multi-mirror array is incorporated into a closed loop control system by which the setting of the desired orientation for individual mirror surfaces of the mirror elements can be monitored and regulated.
  • a measuring device connected to the control device and serving for determining the orientation of the front surface and for generating measurement signals representing the orientation of the front surface, wherein the control device is configured for controlling the temperature- regulating device on the basis of the measurement signals. This enables an exact orientation of the individual mirror elements even under changing operating conditions.
  • the multi-mirror array can be designed overall as a plane mirror. In this case, the mirror surfaces of all the mirror elements, with the temperature-regulating device switched off, lie as precisely as possible in a common plane.
  • the carrier structure can have a plane surface for carrying the mirror elements. It is also possible to design the multi-mirror array overall as a curved mirror wherein the totality of all the mirror surfaces nominally lies on a common concavely or convexly curved surface. Misalignments from the desired orientation can be corrected by means of the temperature-regulating device in any case.
  • the invention also relates to an optical system comprising a multiplicity of optical elements, which is characterized in that the optical system contains at least one multi-mirror array of the type described in this application.
  • the optical system can be e.g. an optical system for a projection exposure apparatus for microlithography.
  • the illumination system of a projection exposure apparatus can be involved.
  • the mirror array can contribute, as an element of a pupil shaping unit as - - a spatially resolving light modulation device, to setting a predefinable local illumination intensity distribution in a pupil surface of the illumination system.
  • the mirror array can e.g. also be used as facet mirrors having nominally invariable relative orientation of the individual mirrors.
  • the invention also relates to a method for operating a controllable mirror array comprising a carrier structure, which carries a multiplicity of individual mirror elements, wherein a mirror element has a mirror substrate, which has a front surface coated with a reflection coating and a rear surface situated opposite the front surface at a distance and facing the carrier structure.
  • the method is characterized by generating a lateral steady-state temperature gradient in a temperature-regulatable zone of the substrate, said zone lying between the front surface and rear surface, as a response to signals of a control device.
  • Fig. 1 shows an excerpt from an embodiment of a controllable multi- mirror array
  • Fig. 2 shows a schematic vertical section through two mirror elements of a multi-mirror array, wherein the left mirror element is shown in a thermally non-activated neutral position and the right mirror - - element is shown in a thermally activated position with a tilted mirror surface;
  • Fig. 3 shows an experimentally determined diagram concerning the time dependence of the tilting of a mirror surface with the mirror substrate being asymmetrically heated to different extents;
  • Fig. 4 shows an experimentally determined diagram concerning the dependence of the tilting of a mirror surface on the electrical heating power
  • FIG. 5 schematically shows an EUV microlithography projection exposure apparatus comprising a controllable mirror array in accordance with one embodiment.
  • Fig. 1 illustrates, in schematic, obliquely perspective illustration, an excerpt from an embodiment of a controllable multi-mirror array (MMA) 100.
  • the multi-mirror array has a multiplicity of individual mirror elements 1 10, which are fixed to the front side of a common carrier structure 120 and are carried by the latter.
  • the carrier structure consists of a torsionally stiff material having high thermal conductivity, such as e.g. silicon, silicon carbide (SiC), or a metal, such as aluminum.
  • Each of the mirror elements has a parallelepipedal mirror substrate 1 12, which, in the case of the example, respectively as a monolithic block consists of a substrate material having relatively good thermal conductivity and having a coefficient of thermal expansion a of more than 1 * 10 "6 K 1 .
  • the mirror substrate consists of a metallic material (a > 20 * 10 6 K _1 ); it can also consist of a - - semiconductor material, such as e.g. silicon.
  • the mirror substrate has a flat front surface 1 14 on its side facing away from the carrier structure 120, and a likewise flat rear surface 1 16 at the opposite side facing the carrier structure. The vertical distance between front surface and rear surface determines the substrate thickness, which can be e.g.
  • the front surface and the rear surface each have a rectangular, in particular substantially square, form having edge lengths of the order of magnitude of the substrate thickness.
  • the front surface is processed with optical quality, i .e. with very low surface roughness, and coated with a multilayer reflection coating 1 18, which, in the case of the example, has a reflective effect for radiation from the extreme ultraviolet range (EUV) and can comprise, for example, alternating layer pairs of molybdenum/silicon or ruthenium/silicon and, if appropriate, additional layers.
  • EUV extreme ultraviolet range
  • the mirror substrates are not directly fixed to the carrier structure 120, but rather are carried by an intermediate structure 1 30, which is arranged between the carrier structure and the mirror substrate and forms a thermal/mechanical interface.
  • the intermediate structure can comprise a layer (e.g. adhesive layer or solder material layer) or a block composed of a material which has good thermal conductivity and which differs from the material of the mirror substrate and/or from the material of the carrier structure.
  • the carrier structure 120 which has a, for example flat, front side serving as a fixing surface for the mirror elements, can be actively cooled with the aid of a cooling device.
  • coolant channels 122 are provided in the carrier structure 120, which coolant channels, in the mounted state of the mirror array, are connected to a coolant source 125 (Fig. 2) and through which coolant channels, during - - the operation of the mirror array, cooling liquid or some other cooling fluid can flow.
  • the front surfaces of the mirror substrates form the respectively square mirror surfaces of the mirror array.
  • Said mirror surfaces are distributed in the manner of a two-dimensional matrix in the form of rows and columns substantially in an area-filling fashion over a larger surface, wherein small distances of the order of magnitude of a few micrometers can remain in each case between adjacent mirror surfaces.
  • the reflectively coated front surfaces form in their totality a faceted mirror surface or a facet mirror, the geometrical reflection properties of which are determined by the orientation of the individual mirror surfaces.
  • the number of mirror elements can vary depending on the application. It is possible to provide e.g. between 1000 and 1 0 000 individual mirror elements, but if appropriate also significantly more, e.g. between 50 000 and 1 million or more, or less than 1000, e.g. between 100 and 1 000.
  • the orientation of the individual flat mirror surfaces can be described by the orientation of their respective surface normals 1 13 in the case of the example.
  • the orientation of the surface normals is the same at all locations of the mirror surface in the case of a flat mirror surface.
  • the orientation can be described for example by the orientation of the surface normal in the mirror center or by the average orientation of the surface normals for the curved mirror surface.
  • the orientation of the reflective front surface relative to the rear surface 1 16 facing the carrier structure 120 can be changed in a continuously variable manner and in different tilting - - directions in a targeted manner by tilting.
  • a temperature-regulating device is provided, which will now be explained in greater detail primarily in connection with the mirror element shown at the front on the right in Fig. 1 and in association with Fig. 2.
  • Fig. 2 shows a schematic vertical section through two mirror elements 1 1 0, 1 1 0' of a multi-mirror array, wherein the left mirror element 1 10' is shown in a thermally non-activated neutral position and the right mirror element 1 10 is shown in a thermally activated position with a tilted mirror surface.
  • the temperature-regulating device is a thermoelectric device that is able, in a temperature-regulatable zone 1 50 lying between the front surface 1 14 and the rear surface 1 16, to establish a lateral temperature gradient running between opposite side surfaces of the mirror substrate and to maintain it in a steady state as necessary over a predefinable time duration.
  • the upper and lower boundaries of the temperature- regulatable zone are indicated by dashed lines in Fig. 2.
  • electrothermal transducers WX1 , WX2, WY1 and WY2 in the form of areally applied resistance heating elements are provided on the side surfaces of the mirror substrate.
  • the transducers are all electrically connected via electrical lines to a common control device 160 of the temperature-regulating device and can be supplied with electrical energy in each case independently of one another by the control device 160.
  • resistance heating elements WX1 and WX2 are respectively applied, which form a first pair of electrothermal transducers.
  • WX1 and WX2 are respectively applied, which form a first pair of electrothermal transducers.
  • WY1 and WY2 are respectively applied, which jointly form a second pair of electrothermal transducers.
  • the resistance heating elements applied over a large area on the side surfaces each have a flat rectangular shape and each extend substantially over the entire width of the side surfaces, while the height of the electrothermal transducers (measured parallel to the z-direction) corresponds only to a fraction of the height of the mirror substrate, for example a maximum of 50% or a maximum of 30%.
  • the electrothermal transducers are fitted approximately centrally between the front surface and the rear surface.
  • the temperature-regulatable zone 150 substantially corresponds to that partial volume of the mirror substrate which is enclosed by the electrothermal transducers.
  • This intermediate region 155 lies outside the temperature-regulatable zone and, during the heating of the resistance heating elements, is not heated or only very slightly heated by the latter.
  • the distance from the front surface is dimensioned with a magnitude such that the front surface remains practically uninfluenced by possible temperature changes in the temperature-regulatable zone.
  • Fig. 2 shows a section in the x-z plane through two mirror elements which are applied on the common carrier structure 120 and which are situated in the beam path of an optical system, for example of an illumination system for a projection exposure - - apparatus.
  • the used light radiation incident on the mirror surfaces within the optical system is symbolized by arrows 21 0.
  • the electrothermal transducers on all four sides of the substrate do not have current applied to them, with the result that substantially the same temperature T-i prevails in the entire temperature-regulatable zone 1 50.
  • the used light 210 impinges on the reflective mirror surface and is reflected there. Part of the impinging radiation is generally absorbed into the reflection coating, as a result of which heat arises in the region of the front surface. Said heat is substantially dissipated through the substrate in the direction of the cooled carrier structure. Consequently, a temperature gradient substantially perpendicular to the front surface (approximately parallel to the surface normal) can be present in the substrate, and leads to a first heat flow W1 in the direction of the carrier structure.
  • the mirror substrate of said mirror element is heated asymmetrically with the aid of the assigned temperature-regulating device.
  • a heating current is conducted for example through the electrothermal transducer WX1 shown on the right, as a result of which the latter heats up.
  • the electrothermal transducer WX2 situated opposite in the first direction (x-direction) is not supplied with current, and so no electrical heat arises there.
  • the electrical heating in the region of the right heating element WX1 generates, within the adjoining partial volume of the substrate, a temperature increase ⁇ relative to the opposite side, such that the increased temperature ⁇ - ⁇ + ⁇ is established there.
  • This temperature difference between the mutually opposite sides of the mirror substrate generates a temperature gradient transversely through the mirror - - substrate and leads to a second heat flow W2 from the side of the relatively higher temperature to the side having the relatively lower temperature. In this case, the heat flow runs predominantly within the temperature-regulatable zone 1 50.
  • the lateral temperature gradient within the temperature-regulatable zone leads to an asymmetrical thermal expansion of the substrate material in the region of the temperature-regulatable zone.
  • the extent of thermal expansion in the vicinity of the hotter electrothermal transducer WX1 is particularly great and decreases continuously in the direction of the opposite side.
  • that side of the reflective mirror surface which is assigned to the warmer side (near WX1 ) is raised relative to the opposite side, such that a tilting of the mirroring front surface relative to the rear surface that remains stationary is established.
  • the virtual tilting axis associated with this tilting runs substantially perpendicular to the temperature gradient generated, i .e.
  • Each of the transducers fitted to a mirror substrate can be driven independently of the other transducers fitted to the mirror substrate, with the aid of the control device 160.
  • the heating powers of all the transducers can be set independently from one another. This in turn makes it possible that the front surface can be tilted practically in any desired directions, i.e. about virtual tilting axes oriented in any desired manner. If, by way of example, the transducers WX1 and WY1 discernible on the visible front sides in Fig. 1 are heated, while the transducers WX2, WY2 respectively situated opposite remain free of current, then a lateral temperature gradient will be established within the mirror substrate, the main direction of said temperature gradient lying between the x-direction and the y-direction.
  • the temperature-regulating device is incorporated into a closed loop control system which allows the desired tilting position of the individual mirror surfaces to be set very exactly and maintained independently of ambient conditions.
  • the closed loop control system comprises an optical measuring device 170 operating according to the autocollimation principle, which measuring device directs a measurement array 172 onto each of the monitored mirror elements, which measurement array, after reflection at the monitored mirror surface, returns to the measuring device and carries information about the present orientation of the reflective mirror surface. From this information, measurement signals representing the orientation of the front surface are generated and are fed back to the control device 140, - - which controls the temperature-regulating device on the basis of said measurement signals (closed loop control).
  • the actuation principle explained here by way of example makes it possible to set the orientation of the mirror surfaces with an accuracy in the range of 1 microrad ⁇ rad) or less, wherein actuation times in the range of a few seconds, e.g. of less than 1 0 s, can be obtained.
  • the substrate dimensions, the substrate material and the temperature-regulating device are coordinated with one another in such a way that, for the thermally induced tilting, a sensitivity S of the order of magnitude of 1 ⁇ rad/K is obtained.
  • a sensitivity S 1 ⁇ rad/K
  • the sensitivity S is in the range of between 0.3 ⁇ / ⁇ and 90 ⁇ / ⁇ , in particular between 1 ⁇ / ⁇ and 30 ⁇ / ⁇ .
  • the multi-mirror array had a coolable carrier structure, on which approximately cubic mirror substrates having edge lengths of approximately 5 mm were applied.
  • resistance heating elements were applied areally on two mirror surfaces situated opposite one another in the x-direction.
  • the orientation of the mirroring front surface was determined by means of an autocollimation system. Ever higher electrical powers step by step were progressively applied to one of the resistance heating elements situated opposite one another. The resultant tiltings of the mirroring front surface about the virtual tilting axis running parallel to the y-direction were measured optically. The results of this calibration are illustrated in Fig. 3 and 4.
  • Fig. 3 shows a diagram in which the time t [s] is indicated on the abscissa and the tilting angle of the mirror surface (in ⁇ ) is indicated on the ordinate. Both the tilting in the x-direction (about a virtual tilting axis running parallel to the y-direction, tilting angle TY) and the tilting perpendicular thereto (about a virtual tilting axis running parallel to the x-direction, tilting angle TX) were measured.
  • Fig. 4 shows a diagram representing the tilting angles TY (in ⁇ ) obtained as a function of the electrical heating power P [W] in these experiments. Five different heating powers (namely approximately 0.5 W, approximately 1 .5 W, approximately 2.5 W, approximately 4 W and approximately 5.5 W) were set successively. Between the individual heating phases, the temperature-regulating device was switched off again in each case. - -
  • the temporal profile of the tilting positions can be gathered from Fig. 3.
  • a tilting angle of approximately 5 was established after distinctly less than 10 s, which tilting angle then remained substantially constant as long as the heating power remained switched on.
  • the mirror substrate assumed the original shape again likewise within a few seconds, in the case of which shape the reference tilting angle (0 ⁇ ) was present.
  • the next higher heating power of 1 .5 W was introduced.
  • the tilting angle Ty of approximately 12 associated with this was established within less than 1 0 s, and said tilting angle remained more or less constant with small fluctuations until the heating power was switched off again. This procedure was repeated for the next higher heating powers.
  • the tilting position associated with a heating power was in each case established very rapidly (after less than 1 0 s) and then remained at a more or less constant level, wherein the measured fluctuations of the tilting position were within the scope of the measurement accuracy of the measuring system (approximately 1 ⁇ ).
  • the heating power was switched off, the tilting was in each case completely reset, thereby showing that the process is fully reversible.
  • a heating power of approximately 4 W up to a heating power of approximately 4 W, a more or less linear relationship between the heating power introduced and the extent of tilting obtained as a result was found. Toward higher heating powers, a deviation from linearity then arises.
  • the actuation principle illustrated here by way of example and based on a change in shape of the mirror substrate that can be set in a targeted manner enables settings of the orientation of a mirror surface relative to the rear surface of a mirror substrate with extremely high accuracy in the range of ⁇ .
  • the obtainable tilting angles were of the order of magnitude of a few tens of ⁇ , e.g. up to approximately 40 ⁇ .
  • a set tilting position was able to be set with an accuracy of less than 1 5%, in particular of less than 10%, of the set tilting angle and permanently maintained.
  • the setting accuracy was typically less than 1 0 ⁇ (at the highest absolute tilting angles), in general even less than 5 ⁇ or even less than 2 ⁇ . This accuracy of the setting is in this case also designated as the resolution capability of the multi-mirror array in the angle space.
  • a multi-mirror array of the type described here by way of example can be used in various ways.
  • the setting possibility is used exclusively for alignment purposes.
  • One aim of this use possibility is to set and maintain, for each of the individual mirrors of a mirror array at any time, the zero position desired for the individual mirror, i.e. its desired orientation, with extremely high accuracy.
  • This can be used in the case of a facet mirror, for example, which is intended to have a defined relative orientation of its individual mirror facets that is invariable (in the ideal case) during operation. If such a facet mirror is incorporated into an optical system, misalignments of individual mirror elements can occur as - - a result of incorporation.
  • Said misalignments can be corrected with the aid of the temperature-regulating device presented here, by tilting individual mirrors relative to other mirrors by means of non-uniform heating of the corresponding mirror substrates such that they assume their desired orientation (zero position) again.
  • the temperature-regulating device serves as a control system for the variable setting of the reference position or zero position of each individual mirror element.
  • the thermally set tiltings can be maintained practically in a temporally unlimited manner over large time intervals and corrected further as necessary.
  • a mirror array with temperature-regulating device can also be used for dynamically changing the geometrical reflection properties of a multi-mirror array.
  • Fig. 5 shows the essential optical components of a microlithography projection exposure apparatus 500.
  • the apparatus comprises an illumination system 51 0 and a projection lens 530 and is operated with the radiation from a light source 514.
  • the light source 514 can be, inter alia, a laser plasma source or a discharge source.
  • Such light sources generate a radiation 520 in the EUV range, that is to say having wavelengths of between 5 nm and 1 5 nm. I n order that the illumination system and the projection lines can operate in this wavelength range, they are constructed with components reflective to UV radiation.
  • the radiation 520 emerging from the light source 514 is collected by means of a collector 51 5 and directed into the illumination system 510.
  • the illumination system here comprises a mixing unit 512, a telescope optical unit 516 and a field shaping mirror 518.
  • the projection lens 530 serves for imaging an object field 552 in the object plane 550 of the - - projection lens onto an image field 562 in the image plane 560 of the projection lens.
  • the projection lens here has six mirrors.
  • the mixing unit substantially consists of two facet mirrors 570, 580.
  • the first facet mirror 570 is arranged in a plane of the illumination system that is optically conjugate with respect to the object plane 550. It is therefore also designated as a field facet mirror.
  • the second facet mirror 580 is arranged in a pupil plane of the illumination system that is optically conjugate with respect to a pupil plane of the projection lens. It is therefore also designated as a pupil facet mirror.
  • the individual mirroring facets (individual mirrors) of the first facet mirror 570 are imaged into the object field 552.
  • Each of the facet mirrors has a carrier structure that carries a multiplicity of individual mirror elements, that is to say individual mirrors.
  • the mirroring front surfaces thereof form the facets (mirror surfaces) of the facet mirror.
  • At least one of the facet mirrors 570, 580 can have a temperature- regulating device of the type described here in order to ensure the accuracy of the orientation of the individual mirrors under different operating conditions and over the lifetime of the apparatus. I n the case of the example, only the pupil facet mirror 580 is equipped with a temperature-regulating device.
  • the latter is connected to a control device 582, which controls the thermally induced tilting of the individual - - mirrors.
  • the orientation of the individual mirrors is optically monitored contactlessly by a measuring device 584 connected to the control device.
  • the pupil facet mirror is intended to have a temporally invariable reflection geometry or emission characteristic. If the wanted desired orientation of individual or all facets of the pupil mirror changes in the course of operation, compensation or alignment can be carried out with the aid of the temperature-regulating device incorporated in a closed loop control system by the tilting of mirror surfaces, in order to keep the desired orientation of each of the individual mirrors with a setting accuracy of ⁇ 1 or less permanently within the tolerance ranges.
  • only the field facet mirror is equipped with a temperature-regulating device.
  • both the field facet mirror and the pupil facet mirror is equipped with a temperature-regulating device.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
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  • Engineering & Computer Science (AREA)
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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Abstract

L'invention porte sur un groupement de miroirs multiples, lequel groupement comprend une structure porteuse (120), qui porte une multiplicité d'élément de miroir individuels (110). Un élément de miroir comprend un substrat de miroir (112), qui présente une surface avant (114) revêtue par un revêtement de réflexion (118) et une surface arrière (116) située à l'opposé de la surface avant à une certaine distance et faisant face à la structure porteuse. Il est disposé un dispositif de régulation de température pour générer un gradient de température à l'état stable latéral dans une zone pouvant être régulée en température (150) du substrat, ladite zone se trouvant entre la surface avant et la surface arrière, en réponse à des signaux d'un dispositif de commande.
PCT/EP2012/054572 2011-03-21 2012-03-15 Groupement de miroirs pouvant être commandés Ceased WO2012126803A1 (fr)

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US201161454617P 2011-03-21 2011-03-21
DE102011005840.0 2011-03-21
DE201110005840 DE102011005840A1 (de) 2011-03-21 2011-03-21 Steuerbare Mehrfachspiegelanordnung, optisches System mit einer steuerbaren Mehrfachspiegelanordnung sowie Verfahren zum Betreiben einer steuerbaren Mehrfachspiegelanordnung
US61/454,617 2011-03-21

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Cited By (2)

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US9798254B2 (en) 2013-03-14 2017-10-24 Carl Zeiss Smt Gmbh Arrangement for the thermal actuation of a mirror, in particular in a microlithographic projection exposure apparatus
CN115494702A (zh) * 2022-08-03 2022-12-20 南方科技大学 用于极紫外光刻机的反射镜及极紫外光线收集方法

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DE102013215091A1 (de) * 2013-08-01 2014-08-07 Carl Zeiss Smt Gmbh Optisches modul
DE102014206765A1 (de) * 2014-04-08 2015-10-08 Carl Zeiss Smt Gmbh Spiegelanordnung, Projektionsobjektiv und EUV-Lithographieanlage

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Publication number Priority date Publication date Assignee Title
US9798254B2 (en) 2013-03-14 2017-10-24 Carl Zeiss Smt Gmbh Arrangement for the thermal actuation of a mirror, in particular in a microlithographic projection exposure apparatus
CN115494702A (zh) * 2022-08-03 2022-12-20 南方科技大学 用于极紫外光刻机的反射镜及极紫外光线收集方法

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