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WO2012120911A1 - Structure de dissipation de chaleur, circuit de traitement équipé de la structure de dissipation de chaleur, et appareil électronique - Google Patents

Structure de dissipation de chaleur, circuit de traitement équipé de la structure de dissipation de chaleur, et appareil électronique Download PDF

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Publication number
WO2012120911A1
WO2012120911A1 PCT/JP2012/001673 JP2012001673W WO2012120911A1 WO 2012120911 A1 WO2012120911 A1 WO 2012120911A1 JP 2012001673 W JP2012001673 W JP 2012001673W WO 2012120911 A1 WO2012120911 A1 WO 2012120911A1
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WIPO (PCT)
Prior art keywords
heat
substrate
heat dissipation
slit
locking
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Ceased
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PCT/JP2012/001673
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English (en)
Japanese (ja)
Inventor
計行 高橋
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Panasonic Corp
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Panasonic Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipating structure, and more particularly to a heat dissipating structure that is installed around a heat generating component such as a semiconductor device and transmits heat of the heat generating component to the outside.
  • heat radiating structure for radiating heat of an electronic component
  • a thermal structure in which a heat sink (heat radiating plate) is attached to the electronic component has been disclosed (see, for example, Japanese Patent Laid-Open No. 2006-19403).
  • FIG. 14 is a front view showing a conventional heat dissipation structure 50.
  • FIG. 15A is a cross-sectional view taken along line AA of the heat dissipation structure 50 shown in FIG. 15B is a cross-sectional view taken along line BB of the heat dissipation structure 50 shown in FIG. 15C is a cross-sectional view taken along line CC of the heat dissipation structure 50 shown in FIG.
  • FIG. 15D is a cross-sectional view taken along line DD of the heat dissipation structure 50 shown in FIG.
  • FIG. 15E is an enlarged view of a portion E of the heat dissipation structure 50 shown in FIG. 15A.
  • FIG. 16 is a front view showing the outer shape of the front heat dissipation plate 60 attached to the front side (front side) of the substrate 30 in the heat dissipation structure 50.
  • FIG. 17 is a front view showing the outer shape of the substrate 30 on which the heat generating component 3, the heat generating component 4, and the heat generating component 5, which are electronic components that generate heat, are installed.
  • FIG. 18 is a schematic block diagram showing an outer shape of a conventional claw spacer 40 as an example of a locking member for attaching the front heat sink 60 to the substrate.
  • FIG. 18A is a front view showing the outer shape of the claw spacer 40.
  • FIG. 18B is a bottom view showing the shape of the bottom surface of the claw spacer 40.
  • FIG. 18C is a top view showing the shape of the top surface of the claw spacer 40.
  • FIG. 18D is a side view showing the shape of the side surface of the claw spacer 40.
  • FIG. 19A is a cross-sectional view taken along the line AA in FIG.
  • FIG. 19B is a cross-sectional view taken along the line BB in FIG.
  • the heat dissipation structure 50 includes a substrate 30, a heat transfer sheet 6, a heat transfer sheet 7, and a heat transfer sheet 8 that are attached to the heat generating component 3, the heat generating component 4, and the heat generating component 5 mounted on the substrate 30,
  • the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 are in contact with each other, and includes a front side heat radiating plate 60 that is locked to the front side (front side) of the substrate 30 by the four claw spacers 40.
  • the heat radiating structure 50 adheres the substrate 30, the heat transfer sheet 6, the heat transfer sheet 7, the heat transfer sheet 8, and the front side heat radiating plate 60, so
  • the plate 60 is structured to dissipate heat.
  • the heat generating component 3 is mounted on the front side of the substrate 30, the heat generating component 4 is mounted on the left side of the heat generating component 3 on the front side, and the heat generating component 3 on the front side is mounted.
  • Heat generating components 5 are mounted on the adjacent sides.
  • the heat generating component 3 is an electronic component such as a CPU (Central Processing Unit) or an arithmetic processor, and the component height Tp1 is about 2 [mm] (see FIG. 15B).
  • the heat generating component 4 and the heat generating component 5 are configured by storage elements such as memory chips, and the component heights Tp2 and Tp3 are about 1 [mm] (see FIGS. 15B and 15D).
  • the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 have a rectangular parallelepiped shape whose outer shape is smaller than that of the heat generating component 3, the heat generating component 4, and the heat generating component 5, respectively.
  • the front heat sink 60 is made of an aluminum plate having a thickness Th of 1.6 [mm] (see FIG. 15E). As shown in FIG. 16, locking holes 62a, 62b, 62c, and 62d having a diameter Dk (about 4 [mm]) are formed in the vicinity of the outer periphery of the front side heat radiating plate 60.
  • the position of the locking hole 62a of the front side heat sink 60 corresponds to the locking hole 12a of the substrate 30, the position of the locking hole 62b corresponds to the locking hole 12b of the substrate 30, and the position of the locking hole 62c is The position of the locking hole 62d corresponds to the locking hole 12d of the substrate 30.
  • the front heat radiating plate 60 is in contact with the heat transfer sheet 6 attached to the heat generating component 3 while being engaged with the substrate 30, and the region in contact with the heat transfer sheet 7 attached to the heat generating component 4.
  • a region where the heat transfer sheet 6 affixed to the heat generating component 3 and a region where the heat transfer sheet 8 affixed to the heat generating component 5 are in contact with each other.
  • a slit 63b that divides the gap.
  • the claw spacer 40 includes a cylindrical portion 15 having a diameter Dh and a height Hh, and an arrowhead portion 16a and an arrowhead portion 16b having the same shape provided at both ends of the cylindrical portion 15. And is configured.
  • the claw spacer 40 is formed of an elastically deformable resin material such as nylon 66.
  • the barbed portion 16a of the claw spacer 40 includes a central column 17c and a pair of first and second fitting claw portions 17a and 17b formed in a C shape on both sides from the tip of the central column 17c. It is prepared for.
  • the arrowhead portion 16b includes a central column 18c, and a pair of first fitting claw portions 18a and second fitting claw portions 18b formed in a C shape on both sides from the tip of the central column 18c. It is configured.
  • the thickness of the heat transfer sheets 6, 7, and 8 it is desirable to reduce the thickness of the heat transfer sheets 6, 7, and 8 for cost reduction. Thinning the heat transfer sheets 6, 7, 8 also reduces the thermal resistance of the heat transfer sheets 6, 7, 8. That is, it is desirable from the viewpoint of thermal conductivity to make the heat transfer sheets 6, 7, and 8 thinner. If the heat transfer sheets 6, 7, and 8 can be eliminated, it is considered to be more preferable.
  • the reaction force of the heat generating component to the front heat sink 60 is different between adjacent heat generating components having different heights.
  • the reaction force of the heat generating component having a large reaction force on the front heat sink 60 affects the pressing force from the front heat sink 60 of the adjacent heat generating component. Therefore, in the substrate 30 on which the heat generating components having different heights are mounted, it is difficult to ensure the adhesion between the heat dissipation plate, the heat transfer sheet, and the heat generating components with one front side heat dissipation plate 60.
  • a heat dissipation structure includes a substrate, a plurality of heat generating components mounted on the surface of the substrate, and a first surface that is attached to the surface side of the substrate and presses the top surface of the heat generating components.
  • a first slit is formed that divides between the center of the pressing area and the center of the second pressing area that presses another heat-generating component, and one end of which extends to the vicinity of the locking component. .
  • FIG. 4 is a cross-sectional view corresponding to the line AA of the front side heat sink 9 shown in FIG. 3.
  • FIG. 4 is a cross-sectional view corresponding to the line AA of the front side heat sink 9 shown in FIG. 3.
  • FIG. 4 is a cross-sectional view corresponding to line BB of the front side heat sink 9 shown in FIG. 3.
  • FIG. 4 is a cross-sectional view corresponding to line CC of the front side heat sink 9 shown in FIG. 3.
  • FIG. 4 is a cross-sectional view corresponding to line DD of the front side heat sink 9 shown in FIG. 3.
  • It is an expanded sectional view of the E section of front side heat sink 9 shown in Drawing 4A.
  • It is a schematic front view which shows the schematic structural example of the thermal radiation structure 1B.
  • FIG. 6 is a cross-sectional view corresponding to line AA of the heat dissipation structure 1B shown in FIG. FIG.
  • FIG. 6 is a cross-sectional view corresponding to the line BB of the heat dissipation structure 1B shown in FIG.
  • FIG. 6 is a cross-sectional view corresponding to line CC of the heat dissipation structure 1B shown in FIG.
  • FIG. 6 is a cross-sectional view corresponding to the line DD of the heat dissipation structure 1B shown in FIG. It is an expanded sectional view of F section of heat dissipation structure 1B shown in Drawing 6A.
  • FIG. 6 is a cross-sectional view corresponding to the line EE of the heat dissipation structure 1B shown in FIG. It is a schematic block diagram which shows the external shape of the spacer 14 with a nail
  • FIG. 8 is a cross-sectional view corresponding to line BB of the claw spacer 14 shown in FIG. 7. It is a front view of the back side heat sink 20 used with the thermal radiation structure 1B. It is sectional drawing corresponding to the AA line of the back side heat sink 20 shown to FIG. 9A. It is a schematic block diagram showing the external shape of the front side heat sink 10 which comprises the heat radiating structure concerning Embodiment 3 of this invention. It is sectional drawing corresponding to the AA line of the front side heat sink 10 shown in FIG. It is sectional drawing corresponding to the BB line of the front side heat sink 10 shown in FIG.
  • FIG. 15A It is a front view of the conventional front side heat sink 60.
  • FIG. It is a schematic front view which shows the example of schematic structure of the conventional board
  • FIG. It is a schematic block diagram which shows the external shape of the spacer 40 with a nail
  • FIG. FIG. 19 is a cross-sectional view corresponding to the line AA of the claw spacer 40 shown in FIG. 18. It is sectional drawing corresponding to the BB line of the claw spacer 40 shown in FIG. It is an external view which shows the external appearance of the television as an example of an electronic device provided with a thermal radiation structure.
  • FIGS. 1 to 4E A heat dissipation structure 1A for an electronic component according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 4E.
  • the heat dissipating structure 1A is mounted on, for example, a signal processing circuit (so-called main board) of a television shown in FIG. 20, and dissipates heat generated from a CPU (Central Processing Unit), an LSI (Large Scale Integration), a memory, and the like. Used for.
  • the present invention can also be applied to electronic devices other than televisions, such as digital cameras, mobile phones, car navigation devices, and the like.
  • FIG. 1 is a front view showing a heat dissipation structure 1A.
  • FIG. 2A is a cross-sectional view taken along line AA of the heat dissipation structure 1A shown in FIG. 2B is a cross-sectional view taken along line BB of the heat dissipation structure 1A shown in FIG. 2C is a cross-sectional view taken along line CC of the heat dissipation structure 1A shown in FIG. 2D is a cross-sectional view taken along the line DD of the heat dissipation structure 1A shown in FIG. 2E is an enlarged view of a portion E of the heat dissipation structure 1A shown in FIG. 2A.
  • FIG. 3 is a front view showing the front side heat radiating plate 9 constituting the heat radiating structure 1A.
  • FIG. 4A is a cross-sectional view taken along line AA of the front side heat sink 9 shown in FIG. 4B is a cross-sectional view taken along the line BB of the front side heat sink 9 shown in FIG. 4C is a cross-sectional view taken along the line CC of the front-side heat sink 9 shown in FIG.
  • FIG. 4D is a cross-sectional view taken along the line DD of the front side heat sink 9 shown in FIG.
  • FIG. 4E is an enlarged view of a portion E of the front side heat sink 9 shown in FIG. 4A.
  • the heat dissipating structure 1 ⁇ / b> A dissipates heat from the heat generating components 3, 4, 5 that are heat generating electronic components mounted on the substrate 30.
  • the heat transfer sheets 6, 7, and 8 shown in FIG. 1 are attached to the heat generating components 3, 4, and 5, and the front side heat radiating plate 9 is provided with four claw spacers 40 (see FIG. 18) from the upper side. ),
  • the substrate 30, the heat transfer sheet, and the heat radiating plate are brought into close contact with each other, and heat is radiated from the heat generating component to the heat radiating plate.
  • the heat dissipating structure 1A is attached to the surface side of the substrate 30, the heat generating components 3, 4 and 5 mounted on the surface of the substrate 30, and the heat transfer sheet 6 , 7, 8, the front heat sink 9 that presses the top surface of the heat generating components 3, 4, 5, and the claw spacer 40 (locking component) that locks the front heat sink 9 on the surface side of the substrate 30. It has.
  • the heat dissipating structure 1A is characterized by the shape of the heat dissipating plate, and the conventional substrate 30 and claw spacer 40 can be appropriately applied to the substrate 30 and claw spacer 40. Therefore, the following description will be made with reference to FIGS. 13 and 14 as necessary.
  • the substrate 30 is a substrate having a plate thickness Tk of 1.6 [mm] as shown in FIGS. 1 and 2E.
  • the configuration of the substrate 30 is the same as that of the conventional substrate 30 shown in FIG.
  • the substrate 30 has locking holes 12a, 12b, 12c, and 12d having a diameter Dk (about 4 [mm]).
  • the heat generating component 3 is mounted on the substrate 30 at a substantially central portion of the front side surface
  • the heat generating component 4 is mounted on the left side of the heat generating component 3 on the front side surface
  • the heat generation on the front side surface The heat generating components 5 are mounted next to the components 3 in the drawing.
  • the heat generating component 3 is an electronic component such as a CPU or an arithmetic processor. In the present embodiment, description will be made assuming that the heat generating component 3 is an arithmetic processor with a relatively large amount of heat generation.
  • the component height Tp1 of the heat generating component 3 is about 2 [mm].
  • the heat generating component 4 and the heat generating component 5 are storage elements such as memory chips. In the present embodiment, description will be made assuming that the heat generation amount of the heat generating component 4 and the heat generating component 5 is smaller than that of the heat generating component 3.
  • the component height Tp2 of the heat generating component 4 and the component height Tp3 of the heat generating component 5 are about 1 [mm].
  • the front-side heat sink 9 is made by press-molding an aluminum plate having a thermal conductivity of 100 to 200 [W / (m ⁇ K)] with a thickness Th of about 1 [mm]. .
  • the front-side heat radiating plate 9 is formed with circular locking holes 13a, 13b, 13c, and 13d having a diameter Do (about 4 [mm]) in the vicinity of the outer periphery.
  • a burring is formed around the hole so as to be wound on the side opposite to the substrate 30.
  • Burring is a flange formed on a plate-like member by pressing the plate-like member.
  • the burring height Hb including the thickness of the front-side heat sink 9 is set to be substantially equal to the thickness 1.6 [mm] of the substrate 30.
  • the front side heat sink 9 has a spherical convex portion 33 at a position facing the heat generating component 3 in a state of being attached to the substrate 30. More preferably, the convex portion 33 of the front side heat radiating plate 9 is formed at a position closest to the heat generation center of the top surface of the heat generating component 3.
  • the convex portion 33 is formed so as to be convex on the opposite side to the burring of the locking holes 13a, 13b, 13c, and 13d, and as shown in FIG.
  • the height from the back surface of the region other than 33, 34, and 35) is Hc.
  • the center part of the convex part 33 becomes the press area
  • the front-side heat sink 9 has a quadrangular frustum-shaped convex portion 34 (a diaphragm portion) at a position facing the heat-generating component 4 when attached to the substrate 30. ing.
  • the front-side heat sink 9 has a quadrangular frustum-shaped convex portion 35 (throttle portion) at a position facing the heat generating component 5 when attached to the substrate 30. is doing.
  • the convex portion 34 and the convex portion 35 are formed so as to be convex on the opposite side to the burring of the locking holes 13a, 13b, 13c, and 13d, and as shown in FIGS.
  • the front side heat sink 9 The height from the back surface of the main body to the back surface side of the bottom surface is Ho.
  • the bottom surface of the convex portion 34 is a pressing region for applying pressure to the heat generating component 4
  • the bottom surface of the convex portion 35 is a pressing region for applying pressure to the heat generating component 5.
  • the center height Hc of the convex portion 33 and the height Ho of the convex portion 34 and the convex portion 35 are preferably set in consideration of the height differences of the heat generating component 3, the heat generating component 4, and the heat generating component 5. By constituting in this way, it can respond to the difference in height of the heat generating component 3, the heat generating component 4, and the heat generating component 5, and the gap between the convex portion 33 and the heat generating component 3, the gap between the convex portion 34 and the heat generating component 4, And the clearance gap between the convex part 35 and the heat-emitting component 5 can be made small.
  • the front heat sink 9 is divided between the centers of the two pressing regions, and one end extends to the vicinity of the locking part, a slit 11a (first slit), a slit 11b (first slit). ), Slits 11c and 11d, and slits 36a (second slits), slits 36b (second slits), slits 36c (second slits) and slits 36d (for reducing the rigidity of the front heat sink 9 A second slit).
  • the vicinity of the locking component indicates the vicinity of the claw spacer 40 in the assembled state, in other words, the vicinity of the locking hole for locking the claw spacer 40.
  • the size of the locking hole and the size of the columnar portion 15 of the claw spacer 40 are substantially the same, and the claw spacer 40 is attached to the locking hole. That is, the description will be made assuming that it is in the vicinity of the locking hole.
  • the slit 11 a passes from the vicinity of the locking hole 13 a through the boundary between the convex portion 34 and the main body radiator plate 9 (region other than the convex portion 34), The shape extends to the vicinity, and the convex portion 33 and the convex portion 34 are divided. More specifically, as shown in FIG. 1 and FIG. 3, the slit 11 a has one end with a circle centered on the locking hole 13 a and a radius 1.2 times the diameter of the locking hole 13 a, and a radius Is formed so as to be located inside a region surrounded by a circle three times the diameter of the locking hole 13a.
  • the slit 11 a is formed to include a step portion on one side located between the heat generating component 3 among the four steps forming the boundary between the convex portion 34 and the front heat sink 9 body. Furthermore, the slit 11a has the other end centered on the locking hole 13b, a radius of 1.2 times the diameter of the locking hole 13b, and a radius of 3 times the diameter of the locking hole 13b. It is formed so as to be located inside the region surrounded by.
  • the slit 11 b extends from the vicinity of the locking hole 12 a to the vicinity of the locking hole 13 d through the boundary between the convex portion 35 and the front heat sink 9 body (a region other than the convex portion 35).
  • the convex part 33 and the convex part 35 are divided. More specifically, as shown in FIG. 1 and FIG. 3, the slit 11 b has one end at a center of the locking hole 13 a and a radius of 1.2 times the diameter of the locking hole 13 a and a radius. Is formed so as to be located inside a region surrounded by a circle three times the diameter of the locking hole 13a.
  • the slit 11 b is formed to include a step portion on one side located between the heat generating component 3 among the four steps forming the boundary between the convex portion 35 and the front heat sink 9 body. Further, the slit 11b has the other end centered on the locking hole 13d and a radius of 1.2 times the diameter of the locking hole 13d, and a radius of 3 times the diameter of the locking hole 13d. It is formed so as to be located inside the region surrounded by.
  • the slit 11c has one end positioned in the vicinity of the locking hole 13a, extends toward the outside (the left side of the drawing in FIG. 1), and is formed so as to divide the outer peripheral end portion of the front side heat radiating plate 9.
  • the slit 11d has one end positioned in the vicinity of the locking hole 13d, extends toward the outside (the right side of the drawing in FIG. 1), and is formed so as to divide the outer peripheral end of the front-side heat radiating plate 9. The transmission of the reaction force generated by 33 and the convex portion 35 is divided.
  • each of the slit 36a and the slit 36b is located in the vicinity of the convex portion 33, passes through between the locking hole 13b and the locking hole 13c from the center of the convex portion 33, and divides the outer peripheral end portion of the front side radiator plate 9. It is formed as follows.
  • one end of each of the slit 36c and the slit 36d is located in the vicinity of the convex portion 33, passes from the center of the heat generating component 3 between the locking hole 13c and the locking hole 13d, and passes through the outer peripheral end portion of the front side heat radiating plate 9. It is formed so as to be divided.
  • the slits 36 a, 36 b, 36 c, and 36 d are formed radially around the heat generating center of the heat generating component 3 in a state where the front heat sink 9 is attached to the substrate 30.
  • the slits 36a, 36b, 36c, and 36d are located in a range where the starting point of the slit is directed from the end point of the slit toward the center of the pressure received by the front heat sink 9 from the heat generating component.
  • the rigidity of the front heat sink 9 can be reduced to less than half of the rigidity of the substrate 30, so that the front heat sink 9 is easily bent, and the warpage of the substrate 30 is suppressed accordingly. Thus, disconnection of the wiring pattern of the substrate 30 can be prevented.
  • the claw spacer 40 is the same as the conventional claw spacer 40, and is provided at the cylindrical portion 15 having a diameter Dh and a height Hh and both ends of the cylindrical portion 15 as shown in FIGS. 18, 19A, and 19B.
  • the same shape of the arrowhead 16a and the arrowhead 16b are provided.
  • the claw spacer 40 is formed of an elastically deformable resin material such as nylon 66.
  • the arrowhead portion 16a includes a central column 17c and a pair of first and second fitting claws 17a and 17b formed in a C shape on both sides from the tip of the central column 17c. Yes.
  • the arrowhead portion 16b includes a central column 18c, and a pair of first fitting claw portions 18a and second fitting claw portions 18b formed in a C shape on both sides from the tip of the central column 18c. It is configured. Since the barbed portions 16a and 16b of the claw spacer 40 are formed of an elastically deformable resin material, the width Wt1 between the first fitting claw portion 17a and the second fitting claw portion 17b of the arrowhead portion 16a. And the width Wt2 of the 1st fitting claw part 18a and the 2nd fitting claw part 18b of the arrowhead part 16b is elastic.
  • the width Wt2 between the claw portion 18a and the second fitting claw portion 18b is set to be larger than the diameter Dk of the locking holes 12a, 12b, 12c, and 12d of the substrate 30.
  • the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 have rectangular parallelepiped shapes that are smaller than the heat generating component 3, the heat generating component 4, and the heat generating component 5, respectively, as in the prior art (see FIG. 13).
  • the thickness of the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 is designed to be in the range of 0.5 to 3 [mm].
  • the thickness of the heat transfer sheet 7 is determined from the distance Ht1 between the fitting claws of the claw spacer 40, the burring height Hb of the front heat sink 9, the plate thickness Tk of the substrate 30, and the step Ho of the convex portion 34.
  • the thickness is set to 1.2 to 2 times thicker than the value obtained by subtracting the height Tp2 of the heat generating component 4 (Ht1-Hb-Tk-Ho-Tp2).
  • the thickness of the heat transfer sheet 8 is the same as that of the heat transfer sheet 7 from the distance Ht1 between the engaging claws of the claw spacer 40, the burring height Hb of the front heat sink 9, the plate thickness Tk of the substrate 30, and the convex portion.
  • the thickness is set to be 1.2 to 2 times thicker than the value obtained by subtracting 35 steps Ho and the height Tp3 of the heat generating component 5 (Ht1-Hb-Tk-Ho-Tp3).
  • the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 are JIS K 7312 (type C), which is a soft cushioning material of 3 to 40 degrees as in the conventional case.
  • the heat conductivity of the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 is 1 to 10 [W / (m ⁇ K)] as in the conventional case.
  • the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 are respectively attached to the top surfaces of the heat generating component 3, the heat generating component 4, and the heat generating component 5 mounted on the substrate 30.
  • the barbed portion 16a of the claw spacer 40 is inserted into the locking hole 12a of the substrate 30, and pressed down until the first fitting claw portion 17a and the second fitting claw portion 17b protrude from the locking hole 12a and are locked.
  • the claw spacer 40 is locked to the substrate 30 by the arrowhead 16a.
  • the width Wt1 between the first fitting claw portion 17a and the second fitting claw portion 17b of the arrowhead portion 16a is larger than the diameter Dk of the locking hole 12a of the substrate 30 before being attached to the substrate 30. .
  • the first fitting claw portion 17a and the second fitting claw portion 17b are elastically deformed to reduce the width Wt1 to the diameter Dk.
  • the width Wt1 has a diameter due to the restoring force of the first fitting claw portion 17a and the second fitting claw portion 17b. It becomes larger than Dk.
  • the claw spacer 40 is locked by the barbed portion 16 a and is locked in the locking hole 12 a of the substrate 30.
  • the barbed portion 16a of the claw spacer 40 is inserted into the locking hole 12b, the locking hole 12c, and the locking hole 12d of the substrate 30, and the first fitting claw portion 17a and the second fitting claw portion 17b are inserted.
  • the nail spacers 40 are locked to the substrate 30 by the arrowheads 16a by pressing out from the locking holes 12b, 12c and 12d until they are locked.
  • the front-side heat sink 9 is locked to the locking holes 13a, 13b, 13c, and 13d from the front surface side of the substrate 30 to the locking holes 12a, 12b, 12c, and 12d of the substrate 30, respectively.
  • the arrowhead 16b of the claw spacer 40 is inserted.
  • claw are hooked on the inner periphery of the locking holes 13a, 13b, 13c, 13d of the front side heat sink 9.
  • the front side heat sink 9 is locked to the claw spacer 40 by pressing until it is locked.
  • the locking holes 13a, 13b, 13c, 13d of the front side heat sink 9 are burring processed and have an R on the insertion side of the barbed portion 16b of the claw spacer 40.
  • the force required to insert 16b is reduced, and the arrowhead portion 16b can be smoothly attached to the locking holes 13a, 13b, 13c, and 13d.
  • the heat generated by the heat generating component 3, the heat generating component 4, and the heat generating component 5 mounted on the surface of the substrate 30 is radiated to the air through the following two paths.
  • the first path is from the top surface of the heat generating component 3, the heat generating component 4, and the heat generating component 5 (the surface facing the mounting surface of the substrate 30) through the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8. This is a path that is transmitted to the heat radiating plate 9 and radiates heat to the air.
  • the second path is a path that is transmitted from the mounting surface of the heat generating component 3, the heat generating component 4, and the heat generating component 5 to the substrate 30 and radiates heat from the substrate 30 to the air.
  • the slit 11a that divides the convex portion 33 and the convex portion 34 is extended from the vicinity of the locking hole 13a to the vicinity of the locking hole 13b. Is formed. That is, since the slit 11a extends to the vicinity of the claw spacer 40 (locking component) that locks the front heat sink 9, the reaction force that the heat generating component 3 applies to the front heat sink 9 is the convex portion 34.
  • the spacer with the claw which is a latching part is installed in the transmission path until reaching. Since the locking part is a fixed point, transmission of reaction force is suppressed.
  • the slit 63a corresponds to the portion corresponding to the space between the convex portion 33 and the convex portion 34 in the slit 11a of the heat dissipation structure 1A of the present invention. And only the straight line portion closest to the convex portion 33 is formed. That is, the slit 63a of the conventional heat dissipation structure 50 is considerably shorter than the slit 11a of the heat dissipation structure 1A of the present invention shown in FIG.
  • the reaction force that the heat generating component 3 applies to the front heat radiating plate 9 reaches the region where the heat transfer sheet 7 attached to the heat generating component 4 contacts with the end portion of the slit 63a.
  • the reaction force applied to the front heat dissipation plate 9 by the heat generating component 3 by the slit 11a reaches the convex portion 34 through the claw spacer 40 of the locking hole 13a.
  • the transmission path toward the convex portion 34 of the reaction force that the heat generating component 3 applies to the front heat dissipation plate 9 is longer than the conventional heat dissipation structure 50 due to the slit 11a. The influence of reaction force is suppressed.
  • the same effect as the slit 11a can be obtained for the slit 11b that divides the convex portion 33 and the convex portion 35.
  • the reaction force applied to the front side heat sink 9 by each of the heat generating parts has an influence on the pressing force of the front side heat sink 9 against other heat generating parts compared to the conventional heat dissipation structure 50. It is possible to do or prevent. Therefore, a plurality of heat generating components can be simultaneously and satisfactorily pressed by one front side heat sink 9.
  • the thickness of the heat transfer sheet which is a heat conductive member provided between the heat generating component and the front heat sink 9. That is, it is possible to improve heat dissipation from the heat generating component to the heat radiating plate and simultaneously reduce the cost of the heat transfer sheet (heat conducting member). Furthermore, since the hardness and thickness of the heat transfer sheet of each heat generating component can be set independently, optimization of the heat transfer sheet is facilitated.
  • the front side heat sink 9 is provided with a convex portion that protrudes toward the heat generating component corresponding to each of the heat generating components, so the thickness of the convex portion depends on the component height of the heat generating component. If adjusted, the interval between the heat generating component and the convex portion can be made constant to some extent. Thereby, it becomes possible to make thin the heat conductive member provided between the convex part of the front side heat sink 9, and the heat-emitting component.
  • the convex part of the front side heat sink 9 is formed on a spherical surface, even if the positions of the plurality of claw spacers 40 for fixing the front side heat sink 9 are not located at the target position with respect to the heat generation center, the convex part is formed. Due to the spherical surface, the minimum gap is located at the heat generation center of the heat generating component. Therefore, heat dissipation in the central part which is high temperature can be efficiently performed.
  • the surface side heat sink 9 is set so that the area of the heat dissipation region of the heat generating component 3 surrounded by the slits 11a, 11b, and 11d is larger than the area of the heat dissipation region of the heat generating component 4 surrounded by the slits 11a and 11c.
  • the slit 11a is formed at a position as far as possible from the convex portion 33, that is, formed so as to pass through a stepped portion between the convex portion 34 and the front side heat radiating plate 9, so that the heat radiating region of the heat generating component 3 is formed. The area is increased.
  • the area of the heat dissipation area of the heat generating component 3 is set to be larger than the area of the heat dissipation area of the heat generating component 5 surrounded by the slits 11b, 11c, and 11d.
  • the slit 11 b is formed so as to pass through the stepped portion between the convex portion 35 and the front heat sink 9.
  • the heat dissipation area of the heat generating component 3 having a larger heat generation amount can be made larger. Can be optimized.
  • the front side heat radiating plate 9 of the heat radiating structure 1A has slits 36a to 36d extending radially from the heat generating center of the heat generating component 3 toward the outside. Since the rigidity of the front heat sink 9 can be reduced by the slits 36a to 36d, the front heat sink 9 can be bent to press the heat transfer sheet and the heat generating component. Since the front side heat sink 9 can be bent, it is possible to prevent the substrate 30 from being bent satisfactorily, to prevent the substrate 30 from being excessively stressed, and to prevent disconnection failure of the circuit of the substrate 30.
  • the front side heat radiating plate 9 of the heat radiating structure 1A is formed with a flange protruding from the outer side of the locking holes 13a to 13d on the side opposite to the substrate 30.
  • the flange can reduce the play when the claw spacer 40 is locked in the locking holes 13a to 13d. As a result, it is possible to reduce the thickness of the front heat sink 9 and reduce the cost of the front heat sink 9.
  • Embodiment 2 An electronic component heat dissipation structure 1B according to Embodiment 2 of the present invention will be described with reference to FIGS. 5 to 9B.
  • the heat dissipating structure 1B of the present embodiment is different from the heat dissipating structure 1A of the first embodiment in that the back surface of the substrate 30 is provided with the back heat dissipating plate 20 and the shape of the claw spacer is different. .
  • FIG. 5 is a front view showing the heat dissipation structure 1B.
  • FIG. 6A is a cross-sectional view taken along line AA of the heat dissipation structure 1B shown in FIG. 6B is a cross-sectional view taken along line BB of the heat dissipation structure 1B shown in FIG. 6C is a cross-sectional view taken along the line CC of the heat dissipation structure 1B shown in FIG. 6D is a cross-sectional view taken along line DD of the heat dissipation structure 1B shown in FIG. 6E is an enlarged view of a portion F of the heat dissipation structure 1B shown in FIG. 6A.
  • FIG. 6F is a cross-sectional view taken along line EE of the heat dissipation structure 1B shown in FIG.
  • FIG. 7 is a schematic block diagram showing the outer shape of the claw spacer 14 used in the heat dissipation structure 1B.
  • FIG. 7A is a front view showing the outer shape of the claw spacer 14.
  • FIG. 7B is a bottom view of the claw spacer 14.
  • FIG. 7C is a top view of the claw spacer 14.
  • FIG. 7D is a side view of the claw spacer 14.
  • FIG. 8A is a cross-sectional view taken along line AA of the claw spacer 14 shown in FIG.
  • FIG. 8B is a cross-sectional view taken along line BB of the claw spacer 14 shown in FIG.
  • FIG. 9A is a front view showing the back side heat sink 20 used in the heat dissipation structure 1B.
  • FIG. 9B is a cross-sectional view taken along line AA of the backside heat sink 20 of FIG. 9A.
  • the heat dissipating structure 1B dissipates heat from the heat generating components 3, 4, and 5, which are heat generating electronic components mounted on the substrate 30, similarly to the heat dissipating structure 1A of the first embodiment.
  • the heat transfer sheets 6, 7, and 8 shown in FIG. The attached spacer 14 is engaged with the substrate 30, the heat transfer sheet 51 is attached to a position corresponding to the heat generating component 3 of the substrate 30, and the back side heat sink 20 is attached to the four claws from the upper side (the back side of the substrate 30).
  • the substrate 30, the heat transfer sheet, and the heat radiating plate are brought into close contact with each other, and heat is radiated from the heat generating component to the heat radiating plate.
  • it can respond by the increase in the emitted-heat amount of a heat-emitting component by providing the back side heat sink 20.
  • the heat dissipating structure 1B is attached to the surface of the substrate 30, the heat generating components 3, 4, and 5 mounted on the surface of the substrate 30, and the heat transfer sheet 6 , 7, 8, the front heat sink 9 that presses the top surfaces of the heat generating components 3, 4, 5, and the claw spacer 14 (locking component) that locks the front heat sink 9 on the surface side of the substrate 30.
  • the rear side heat sink 20 is attached to the back side of the substrate 30 and presses the heat transfer sheet 51.
  • the substrate 30, the heat generating component 3, the heat generating component 4, the heat generating component 5, the front heat radiating plate 9, the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 are the same as the heat dissipation structure 1A of the first embodiment. is there.
  • the claw spacer 14 used in the present embodiment is configured to include an arrowhead portion 16c in addition to the constituent elements of the claw spacer 40, using the claw spacer 40 as a base.
  • the arrowhead portion 16c has a central column 19c erected at the tip of the central column 18c of the arrowhead portion 16b, and a pair of first fitting claws 19a formed in a C shape on both sides from the tip of the center column 19c. And a second fitting claw portion 19b.
  • the arrowhead portions 16a, 16b, and 16c are formed of an elastically deformable resin material.
  • the width Wt2 of the fitting claw part between the part 18b and the width Wt3 of the fitting claw part between the first fitting claw part 19a and the second fitting claw part 19b of the arrowhead part 16c are both It is stretchable. Note that, in a normal state before installation (a state where no force is applied), the width Wt3 of the fitting claw portion of the arrowhead portion 16c is set smaller than the width Wt2 of the fitting claw portion of the arrowhead portion 16b.
  • the thickness of the heat transfer sheet 51 is set in a range of 1.2 to 2 times the distance Ht2 between the fitting claws of the barbed portion 16b and the barbed portion 16c (see FIG. 7A).
  • the backside heat sink 20 is made by press-molding an aluminum plate designed so that the plate thickness falls within the range of 0.5 [mm] to 1 [mm].
  • locking holes 21a, 21b, 21c, and 21d having a diameter Du are opened in the vicinity of the outer periphery of the back side heat sink 20.
  • the positions of the locking holes 21a, 21b, 21c, and 21d of the back-side heat sink 20 correspond to the locking holes 12a, 12b, 12c, and 12d of the substrate 30, respectively.
  • the diameter Du of the locking holes 21 a, 21 b, 21 c, 21 d of the back side heat sink 20 is set smaller than the diameter Dk of the locking holes 12 a, 12 b, 12 c, 12 d of the substrate 30.
  • the width Wt5 of the central column 18c of the claw spacer 14 (see FIG. 7D) is set smaller.
  • the rear heat sink 20 has a truncated cone-shaped throttle portion 24a centered on the locking hole 21a, a truncated cone-shaped throttle portion 24b centered on the locking hole 21b, and a cone centered on the locking hole 21c.
  • a trapezoidal constricted portion 24c and a truncated conical constricted portion 24d centering on the locking hole 21d are formed.
  • the throttle portions 24a, 24b, 24c, and 24d of the back side heat sink 20 have the same shape here, and are formed so as to protrude toward the substrate 30 as shown in FIG. 9B.
  • the height from the surface on the substrate 30 side in the other region) to the surface on the substrate 30 side on the bottom surface is Hs.
  • the back side heat sink 20 is formed with a truncated cone-shaped throttle part 24e in the center.
  • the narrowed portion 24e is formed so as to protrude to the substrate 30 side, and the height from the substrate 30 side surface of the backside heat sink 20 main body to the substrate 30 side surface of the bottom surface is Hs.
  • the rear side heat radiating plate 20 has a throttle portion 24 e formed at a position corresponding to the installation position of the heat generating component 3 of the substrate 30, and a heat transfer sheet between the throttle portion 24 e and the substrate 30. 51 is sandwiched.
  • a U-shaped slit 22 is formed in the back side heat radiating plate 20 around the locking hole 21c and the throttle portion 24c. More specifically, the slit 22 is formed so that both ends thereof are outside the circle passing through the locking hole 21c with the throttle portion 24e as the center.
  • the locking hole 21c is closer to the throttle portion 24e (position where the heat transfer sheet 51 is attached) than the other locking holes 21a, 21b and 21d. For this reason, when the slit 22 is not provided, the reaction force applied to the claw spacer 14 inserted into the locking hole 21c is applied to the claw spacer 14 inserted into the other locking holes 21a, 21b, 21d. It becomes larger than the reaction force that is generated.
  • the barbed portion of the claw spacer 14 may be destroyed.
  • the reaction force applied to the claw spacer 14 inserted into the locking hole 21c exceeds the lock strength of the barbed portion 16c of the claw spacer 14, the barbed portion of the claw spacer 14 may be destroyed.
  • the reaction force from the heat transfer sheet 51 is evenly applied to the claw spacers of the locking holes 21a, 21b, 21c, and 21d. Adjustments are made in this way. Thereby, destruction of the arrowhead part of the spacer 14 with a nail
  • the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 are respectively attached to the top surfaces of the heat generating component 3, the heat generating component 4, and the heat generating component 5 mounted on the substrate 30. .
  • the barbed portion 16c side of the claw spacer 14 is inserted into the locking hole 12a of the substrate 30, and the first fitting claw portion 18a and the second fitting claw portion 18b of the arrowhead portion 16b pass through the locking hole 12a. Then, the first fitting claw portion 18a and the second fitting claw portion 18b of the arrowhead portion 16b are pressed down until the substrate 30 is locked and cannot be removed, and the claw spacer 14 is held by the arrowhead portion 16b at the locking hole 12a of the substrate 30. To fix.
  • the width Wt3 of the fitting claw portion of the barbed portion 16c of the claw spacer 14 is smaller than the diameter Dk of the locking hole 12a of the substrate 30, and the width Wt2 of the fitting claw portion of the arrowhead portion 16b is equal to the substrate 30.
  • the diameter is larger than the diameter Dk of the locking hole 12a.
  • the width is set by the restoring force of the fitting claw portions of the first fitting claw portion 18a and the second fitting claw portion 18b.
  • Wt2 becomes larger than the diameter Dk.
  • the barbed portion 16c and the barbed portion 16b of the claw spacer 14 are inserted into the locking hole 12b, the locking hole 12c and the locking hole 12d of the substrate 30, and the first fitting claw portion 18a of the barbed portion 16b and The second fitting claw portion 18b is pushed out from the locking hole 12b, the locking hole 12c and the locking hole 12d until it is locked, and the claw spacer 14 is locked to the substrate 30 by the arrow 16b.
  • the front-side heat sink 9 is locked to the locking holes 13a, 13b, 13c, and 13d from the front surface side of the substrate 30 to the locking holes 12a, 12b, 12c, and 12d of the substrate 30, respectively.
  • claw are hooked by the inner periphery of the locking holes 13a, 13b, 13c, 13d of the front side heat sink 9.
  • the front heat radiating plate 9 is engaged with the claw spacer 14 by pressing until the locked state.
  • the front side heat radiating plate 9 and the heat transfer sheet 6, the heat transfer sheet 7, the heat transfer sheet 8 and the substrate 30 are brought into close contact with each other.
  • the locking holes 13a, 13b, 13c, 13d of the front side heat sink 9 are burring processed and the insertion side of the arrowhead portion 16a of the claw spacer 14 is inserted. Therefore, the force required for inserting the barbed portion 16a is reduced, and the arrowhead portion 16a can be smoothly mounted in the locking holes 13a, 13b, 13c, and 13d.
  • the heat transfer sheet 51 is pasted on the back side of the substrate 30 at a position facing the heat generating component 3 mounted on the front side.
  • the arrowhead part 16c of the attached spacer 14 is inserted.
  • claw are hooked on the inner periphery of the locking holes 21a, 21b, 21c, and 21d, and it will be in a locked state. Until the rear heat sink 20 is locked to the claw spacer 14.
  • the claw spacer 14 is locked to the substrate 30, the front-side heat sink 9 is locked, and the back-side heat sink 20 is locked, but this is not restrictive. After the claw spacer 14 is locked to the substrate 30, the back side heat sink 20 may be locked first.
  • the heat generated by the heat generating component 3, the heat generating component 4, and the heat generating component 5 mounted on the surface of the substrate 30 is radiated to the air through the following three paths.
  • the first path is transmitted from the top surface of the heat generating component 3, the heat generating component 4, and the heat generating component 5 through the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 to the front side heat sink 9, and radiates heat to the air. Is a route to be done.
  • the second path is a path through which the heat generating component 3, the heat generating component 4, and the heat generating component 5 are transmitted from the mounting surface of the substrate 30 to the substrate 30 and radiated from the substrate 30 to the air.
  • the third path is a path for the heat generating component 3, and is a path that is transmitted from the back side position of the heat generating component 3 to the back side heat radiating plate 20 through the heat transfer sheet 37 and radiated to the air.
  • the heat dissipating structure 1B of the present embodiment is configured to mount two heat dissipating plates, a front heat dissipating plate 9 and a back heat dissipating plate 20, on the front and back surfaces.
  • an electronic component having a larger amount of heat generation can be used as the heat generating component 3.
  • the claw spacer 14 has a claw spacer 40 as a base, and a barbed portion 16c having a diameter smaller than that of the barbed portion 16b is provided at the tip of the barbed portion 16b.
  • the two heat sinks of the plate 9 and the back side heat sink 20 can be locked. That is, if the claw spacer 14 is used, it is not necessary to provide a dedicated locking hole for the back side heat sink 20 in the substrate 30, and there is no restriction on the design of the wiring pattern of the substrate 30. Further, a new claw spacer is not added. That is, it is possible to suppress the number of parts of the claw spacer and the accompanying cost increase.
  • the difference between the heat dissipation structure of the present embodiment and the heat dissipation structure 1A of the first embodiment is that the shape of the slit of the front heat dissipation plate 10 is different.
  • FIG. 10 is a front view showing the front side heat radiating plate 10 constituting the heat radiating structure according to the present embodiment.
  • FIG. 11A is a cross-sectional view taken along line AA of the front side heat sink 10 shown in FIG.
  • FIG. 11B is a cross-sectional view taken along the line BB of the front side heat sink 10 shown in FIG.
  • FIG. 11C is a cross-sectional view taken along the line CC of the front-side heat sink 10 shown in FIG.
  • FIG. 11D is a cross-sectional view taken along line DD of the front-side heat sink 10 shown in FIG.
  • FIG. 12 is a perspective view showing the surface (front side) of the front heat sink 10 shown in FIG.
  • FIG. 13 is a perspective view showing the back surface of the front heat sink 10 shown in FIG.
  • the heat dissipating structure of the present embodiment is the same as the heat dissipating structure 1A of the first embodiment except that the configuration of the front heat dissipating plate 10 is different, and therefore will be described with reference to FIGS. 1 to 2E as appropriate.
  • the heat dissipating structure according to the present embodiment dissipates heat from the heat generating components 3, 4, and 5 which are electronic components that generate heat mounted on the substrate 30, similarly to the heat dissipating structure 1 ⁇ / b> A of the first embodiment. .
  • the heat transfer sheets 6, 7, and 8 shown in FIG. 1 are attached to the heat generating components 3, 4, and 5, and the front heat sink 10 is attached to the four claw spacers 40 from above (see FIG. 18). ), The substrate 30, the heat transfer sheet, and the heat radiating plate are brought into close contact with each other, and heat is radiated from the heat generating component to the heat radiating plate.
  • the heat dissipation structure according to the present embodiment is attached to the substrate 30, the heat generating components 3, 4, and 5 mounted on the surface of the substrate 30, and the surface side of the substrate 30.
  • Front-side heat radiating plate 10 that presses the top surfaces of the heat-generating components 3, 4, 5 through 6, 7, 8, and a claw spacer 40 that locks the front-side heat radiating plate 9 on the surface side of the substrate 30 (locking component) And.
  • the substrate 30, the heat generating component 3, the heat generating component 4, the heat generating component 5, the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8 are the same as the heat dissipation structure 1A of the first embodiment.
  • the front side heat sink 10 of the present embodiment has a thermal conductivity of 100 to 200 [W / (m) with a plate thickness of about 1 [mm] as shown in FIG. ⁇ K)] aluminum plate is press-molded.
  • the front-side heat radiating plate 10 is formed with circular locking holes 25a, 25b, 25c, and 25d having a diameter Do (about 4 [mm]) in the vicinity of the outer periphery.
  • a burring is formed around the hole so as to be wound on the opposite side of the substrate 30 in the same manner as the front heat sink 9 of the first embodiment. (See FIG. 4E).
  • Burring is a flange formed on a plate-like member by pressing the plate-like member.
  • the burring height Hb including the thickness of the front-side heat sink 9 is set to be substantially equal to the thickness 1.6 [mm] of the substrate 30.
  • the upper base is about twice as large as the diameter of the locking holes 25a, 25b, 25c, 25d with the locking holes 25a, 25b, 25c, 25d as the center.
  • a frustoconical protrusion is formed.
  • the protruding portion protrudes toward the substrate 30 in a state where the front side heat sink 10 is attached to the substrate 30.
  • the locking holes 25a, 25b, 25c, and 25d are formed in the bottom portion of this protrusion (upper bottom portion of the truncated cone).
  • the main body part area
  • the substrate 30 the air flow between the main body portion of the front-side heat radiating plate 10 and the substrate 30 can be made better, and the heat dissipation can be made better.
  • the front side heat sink 10 has the spherical convex part 33 in the position facing the heat-emitting component 3 in the state attached to the board
  • FIG. The convex portion 33 is formed at a position that is closest to the heat generation center on the top surface of the heat generating component 3 and is formed so as to protrude toward the substrate 30, similarly to the front side heat sink 9 of the first embodiment. Yes.
  • the center part of the convex part 33 becomes the press area
  • the front side heat sink 10 has a substantially square frustum-shaped convex portion 34 (a diaphragm portion) at a position facing the heat generating component 4 when attached to the substrate 30. )have.
  • the shape of the upper base (pressing region) is a shape in which two corners on the convex portion 33 side are missing.
  • the front side heat sink 10 has a substantially quadrangular pyramid-shaped convex portion 35 (aperture stop) at a position facing the heat-generating component 5 when attached to the substrate 30 in the same manner as the front side heat sink 9 of the first embodiment. Part).
  • the shape of the upper base is a shape in which two corners on the convex portion 33 side are missing.
  • the convex portion 34 and the convex portion 35 are formed to be convex toward the substrate 30 side.
  • the bottom surface of the convex portion 34 is a pressing region for applying pressure to the heat generating component 4
  • the bottom surface of the convex portion 35 is a pressing region for applying pressure to the heat generating component 5.
  • the center height of the convex portion 33 and the heights of the convex portion 34 and the convex portion 35 are preferably set in consideration of the height differences of the heat generating component 3, the heat generating component 4, and the heat generating component 5. By constituting in this way, it can respond to the difference in height of the heat generating component 3, the heat generating component 4, and the heat generating component 5, and the gap between the convex portion 33 and the heat generating component 3, the gap between the convex portion 34 and the heat generating component 4, And the clearance gap between the convex part 35 and the heat-emitting component 5 can be made small.
  • the front-side heat radiating plate 10 of the present embodiment has a slit 26a (first slit) and a slit 26b (first slit) that divide between the two pressing regions and whose one end extends to the vicinity of the locking component. ), A slit 26c, and a slit 27a (second slit), a slit 27b (second slit), and a slit 27c (second slit) for reducing the rigidity of the front heat sink 10. .
  • the slit 26 a has a shape that passes through the boundary between the convex portion 34 and the main body of the front side heat sink 10 from the vicinity of the locking hole 25 a, and divides the convex portion 33 and the convex portion 34. To do. More specifically, as shown in FIG. 10, the slit 26 a has one end centered on the locking hole 25 a and a radius that is 1.2 times the diameter of the locking hole 25 a and the radius is locked. The hole 25a is formed so as to be located inside a region surrounded by a circle three times the diameter of the hole 25a.
  • the slit 26a includes a step located on one side located between the heat generating component 3 and two steps on both sides of the step on the four sides constituting the boundary between the convex portion 34 and the front heat sink 10 body. Is formed.
  • the slits 26a is formed so as to surround the three sides around the convex portion 34, but this is because the convex portion 34 is partially connected to a region other than the convex portion 34. It means that. That is, when the convex part 34 is circular, for example, the slit 26a is not completely circular but arcuate.
  • the slit 26 b has a shape that passes through the boundary between the convex portion 35 and the main body of the heat-radiating plate 10 from the vicinity of the locking hole 25 a, and divides the convex portion 33 and the convex portion 35. To do. More specifically, as shown in FIG. 10, the slit 26b has one end at a center of the locking hole 25a and a radius 1.2 times the diameter of the locking hole 25a. The hole 25a is formed so as to be located inside a region surrounded by a circle three times the diameter of the hole 25a.
  • the slit 26b includes one side located between the heat generating component 3 and two side steps on both sides of the four side steps constituting the boundary between the convex portion 35 and the front heat sink 10 body. Is formed.
  • the slit 26c is formed in the vicinity of the step where the slit 26a of the convex portion 34 is not formed and in parallel with the step.
  • the slit 27a is formed so that one end thereof is positioned in the vicinity of the convex portion 33, passes through between the locking hole 25b and the locking hole 25c from the center of the convex portion 33, and divides the outer peripheral end portion of the front side radiator plate 10.
  • one end of each of the slit 27 b and the slit 27 c is located in the vicinity of the convex portion 33, and passes from the center of the convex portion 33 between the locking hole 25 c and the locking hole 25 d, and passes through the outer peripheral end portion of the front side radiator plate 10. It is formed so as to be divided.
  • the slits 27 a, 27 b, 27 c are formed radially with the center of heat generation of the heat generating component 3 in the state where the front side heat sink 9 is attached to the substrate 30.
  • the rigidity of the front heat sink 10 can be made lower than the rigidity of the substrate 30, so that the front heat sink 10 can be easily bent, and the warpage of the substrate 30 is suppressed accordingly.
  • disconnection of the wiring pattern of the substrate 30 can be prevented.
  • the assembly method is the same as in the first embodiment.
  • the heat generated by the heat generating component 3, the heat generating component 4, and the heat generating component 5 mounted on the surface of the substrate 30 is dissipated to the air through the following two paths as in the heat dissipation structure 1A of the first embodiment. .
  • the first path is from the top surface of the heat generating component 3, the heat generating component 4, and the heat generating component 5 (the surface facing the mounting surface of the substrate 30) through the heat transfer sheet 6, the heat transfer sheet 7, and the heat transfer sheet 8. This is a path that is transmitted to the heat radiating plate 9 and radiates heat to the air.
  • the second path is a path that is transmitted from the mounting surface of the heat generating component 3, the heat generating component 4, and the heat generating component 5 to the substrate 30 and radiates heat from the substrate 30 to the air.
  • the slit 26a and the slit 26b are located in the vicinity of the locking hole 25a, similarly to the front-side heat radiating plate 9 of the first embodiment.
  • the locking component is installed in the transmission path until the reaction force applied by the heat generating component 3 to the front heat sink 10 reaches the convex portions 34 and 35 corresponding to the other heat generating components. Yes. Since the locking part is a fixed point, transmission of reaction force is suppressed.
  • the heat dissipation structure of the present embodiment has a slit 26 a and a slit 26 b, and a transmission path from the conventional heat dissipation structure 50 toward the convex portion 34 and the convex portion 35 of the reaction force that the heat-generating component 3 applies to the front heat sink 10. Is longer and the influence of reaction force is suppressed.
  • the slit 26a is formed at a three-sided step among the four-sided steps constituting the boundary between the protruding portion 34 and the main body portion of the front-side heat radiating plate 10. Processing of the front side heat sink 10 at the time of formation becomes easy. Furthermore, since it is connected with the main body of the front side heat sink 10 only at one side away from the heat generating component 3, the transmission of force can be suppressed better.
  • the front-side heat radiating plate 10 is provided with a protruding portion that protrudes toward the heat generating component corresponding to each of the heat generating components.
  • the interval can be made constant and narrow to some extent, and the heat conducting member can be made thin.
  • the area of the heat dissipation region of the heat generating component 3 surrounded by the slit 26a and the slit 26b is the area of the heat dissipation region of the heat generating component 4 surrounded by the slit 26a and the slit 26c, and It is set so as to be larger than the area of the heat radiation area of the heat generating component 5 surrounded by the slit 26b and the outer periphery of the front side heat sink 10.
  • the heat dissipation area of the heat generating component 3 having a larger heat generation amount can be made larger. Can be optimized.
  • slits 27a to 27c extending radially outward from the heat generation center of the heat generating component 3 are formed to reduce the rigidity of the front heat radiating plate 10. Therefore, it is possible to satisfactorily prevent the substrate 30 from being bent and causing a disconnection failure in the circuit of the substrate 30.
  • a flange is formed on the outer peripheral portion of the locking holes 25a to 25d of the front side radiator plate 10 so as to protrude on the side opposite to the substrate 30. The backlash when the claw spacer 40 is locked in the holes 13a to 13d can be reduced.
  • the other end of the slit 26b of the front-side heat radiating plate 10 may be set to divide the end portion of the front-side heat radiating plate 10. In this case, since the convex portion 35 is supported by the nail spacer 40 of the locking hole 25a, the influence of the reaction force from the convex portion 33 can be further reduced.
  • a protruding portion may be provided, and locking holes 13a, 13b, 13c, and 13d may be provided in the upper bottom portion.
  • the slits 11a and 11b of the front side heat sink 9 and the slits 26a and 26b of the front side heat sink 10 may be mixed.
  • the heat transfer member has been described assuming a heat transfer sheet, but other members such as heat transfer grease may be used.
  • the present invention can also be applied to heat dissipation for a plurality of components having different operation compensation temperatures.
  • the heat dissipating structure of the present invention may be intended to dissipate heat from the first component having an operation compensation temperature of 100 degrees and the second component having an operation compensation temperature of 80 degrees.
  • the materials and sizes of the heat transfer sheets 6, 7, and 8 are appropriately selected according to the operation compensation temperature of the parts.
  • a heat transfer sheet having better heat dissipation characteristics than the first component having an operation compensation temperature of 100 degrees may be employed. .
  • the amount of heat transfer to the front side heat radiating plate is different between components, and therefore effective heat radiation is possible by the heat radiating structure of the present invention.
  • the heat dissipating structure of the present invention is useful as an example of a heat dissipating structure that dissipates heat from electronic components in electronic devices such as televisions and cameras.

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  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne une structure de dissipation de chaleur, dont une feuille de transfert de chaleur présente une épaisseur réduite, ou dont la feuille de transfert de chaleur peut être éliminée. La structure de dissipation de chaleur (1A) comprend : un substrat (30) ; des composants de dégagement de chaleur (3, 4, 5), installés sur le côté endroit du substrat (30) ; une plaque de dissipation de chaleur (9), qui est fixée sur le côté endroit du substrat (30), et qui appuie sur la surface supérieure des composants de dégagement de chaleur (3, 4, 5) ; et un composant de verrouillage (40). La plaque de dissipation de chaleur (9) comporte des premières encoches (11a, 11b), dont une extrémité s'étend au voisinage du composant de verrouillage (40), et qui réalisent une séparation entre le centre d'une première région d'appui qui appuie sur le composant de dégagement de chaleur (3) et le centre d'une seconde région d'appui qui appuie sur les autres composants de dégagement de chaleur (4, 5).
PCT/JP2012/001673 2011-03-10 2012-03-09 Structure de dissipation de chaleur, circuit de traitement équipé de la structure de dissipation de chaleur, et appareil électronique Ceased WO2012120911A1 (fr)

Applications Claiming Priority (2)

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JP2011052681A JP2014103134A (ja) 2011-03-10 2011-03-10 放熱構造
JP2011-052681 2011-03-10

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WO2012120911A1 true WO2012120911A1 (fr) 2012-09-13

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2018173103A1 (fr) * 2017-03-21 2018-09-27 三菱電機株式会社 Carte de circuit imprimé
CN110785000A (zh) * 2019-10-30 2020-02-11 江苏上达电子有限公司 一种柔性线路板散热的方法

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
JP6416420B2 (ja) * 2017-02-23 2018-10-31 因幡電機産業株式会社 放熱構造
JP7301600B2 (ja) * 2019-05-23 2023-07-03 キヤノン株式会社 電源装置及び画像形成装置

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JP2001358482A (ja) * 2000-04-14 2001-12-26 Matsushita Refrig Co Ltd 放熱モジュール
JP2004186294A (ja) * 2002-12-02 2004-07-02 Denso Corp 電子装置
JP2006019403A (ja) * 2004-06-30 2006-01-19 Kitagawa Ind Co Ltd 熱伝導スペーサ
JP2006054230A (ja) * 2004-08-10 2006-02-23 Fujitsu Ltd 半導体パッケージ、それを搭載したプリント基板、並びに、かかるプリント基板を有する電子機器
JP2009070999A (ja) * 2007-09-12 2009-04-02 Denso Corp 電子回路部品実装構造

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Publication number Priority date Publication date Assignee Title
JP2001358482A (ja) * 2000-04-14 2001-12-26 Matsushita Refrig Co Ltd 放熱モジュール
JP2004186294A (ja) * 2002-12-02 2004-07-02 Denso Corp 電子装置
JP2006019403A (ja) * 2004-06-30 2006-01-19 Kitagawa Ind Co Ltd 熱伝導スペーサ
JP2006054230A (ja) * 2004-08-10 2006-02-23 Fujitsu Ltd 半導体パッケージ、それを搭載したプリント基板、並びに、かかるプリント基板を有する電子機器
JP2009070999A (ja) * 2007-09-12 2009-04-02 Denso Corp 電子回路部品実装構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018173103A1 (fr) * 2017-03-21 2018-09-27 三菱電機株式会社 Carte de circuit imprimé
CN110785000A (zh) * 2019-10-30 2020-02-11 江苏上达电子有限公司 一种柔性线路板散热的方法

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