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WO2012102200A1 - Dispositif d'éclairage, dispositif d'affichage et dispositif de réception de télévision - Google Patents

Dispositif d'éclairage, dispositif d'affichage et dispositif de réception de télévision Download PDF

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Publication number
WO2012102200A1
WO2012102200A1 PCT/JP2012/051188 JP2012051188W WO2012102200A1 WO 2012102200 A1 WO2012102200 A1 WO 2012102200A1 JP 2012051188 W JP2012051188 W JP 2012051188W WO 2012102200 A1 WO2012102200 A1 WO 2012102200A1
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WO
WIPO (PCT)
Prior art keywords
chassis
heat radiating
heat
light source
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/051188
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English (en)
Japanese (ja)
Inventor
良武 石元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
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Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2012102200A1 publication Critical patent/WO2012102200A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package

Definitions

  • the present invention relates to a lighting device, a display device, and a television receiver.
  • the liquid crystal display device requires a backlight device as a separate lighting device because the liquid crystal panel used for this does not emit light.
  • This backlight device is installed on the back surface opposite to the display surface of the display panel, and includes, for example, a light source, a light guide plate that converts a light beam from the light source into surface light emission, and a metal chassis that accommodates these.
  • the backlight device is mainly divided into a direct type and an edge light type. Of these, the edge light type is more advantageous in reducing the thickness than the direct type.
  • the edge-light type backlight device has a light incident surface on the side of the light exit surface of the light guide plate facing the display panel, and a light source is disposed so as to face the light incident surface.
  • An LED is preferably used as the light source.
  • the thing of patent document 1 is known as what solved this subject.
  • the backlight device described in Patent Document 1 has a plurality of light guide plates arranged in tandem in a chassis, and LEDs corresponding to the respective light guide plates are mounted on an LED substrate having an L-shaped cross section.
  • the bottom surface of the LED substrate is bonded to the chassis, and the back surface is bonded to the heat sink.
  • the heat radiating plate has an L-shaped cross section and is bonded to the entire back surface of the LED substrate, and its extended end is fixed to the chassis with screws.
  • the present invention has been completed based on the above situation, and aims to improve the heat radiation efficiency.
  • the present invention includes a light source, a light source substrate on which the light source is mounted, a light incident surface that faces the light source and receives light from the light source, and a light guide member that has a light emission surface that emits the light.
  • the light source board and the chassis for housing the light guide member, and the light source board and the chassis are in close contact with each other by filling a liquid heat dissipation material between the light source board and the chassis. It has the characteristics.
  • the liquid heat dissipation material is filled between the light source board and the chassis, the light source board and the chassis can be brought into close contact regardless of the surface shape of the light source board or the chassis. It is possible to improve the heat radiation efficiency of radiating the heat from the light source to the external space through the chassis.
  • the chassis and the light source substrate are only overlapped and fixed with screws or the like, if there are uneven shapes or undulations on the contact surfaces of the chassis or the light source substrate, the parts that do not contact each other As a result, the actual contact area was smaller than the assumed contact area, and there was a concern about a decrease in heat dissipation efficiency.
  • the configuration of the present invention even if irregularities and undulations exist on the surface of the chassis and the light source substrate, by filling the gap with the liquid heat dissipation material, the heat dissipation material from the light source substrate.
  • a concave portion is formed in at least one of contact surfaces where the chassis and the light source substrate are in contact, and the concave portion is filled with the heat dissipation material.
  • Such a configuration makes it possible to hold the heat radiating material in the recess, so that it becomes easy to handle one or both of the heat radiating material and the light source board and the chassis filled with the heat radiating material.
  • a recess is formed in the light source substrate, if the structure is assembled in the chassis after the heat sink is filled in advance in the recess of the light source substrate, a special change may occur in the existing assembly process. Absent. Therefore, the present invention can be easily applied to a lighting device that has already been implemented, and is excellent in versatility.
  • the amount of the heat sink used per lighting device can be made constant.
  • the amount of the required heat sink depends on the volume of the gap, and the amount of heat sink injected is determined each time. Therefore, it is inferior in productivity and easily produces defective products.
  • the amount of the required heat sink can be determined in advance by the internal volume of the recesses, so that the productivity can be improved.
  • the light source board includes a main board on which the light source is mounted, and a heat radiating plate that holds the main board in a heat transferable manner and is fixed to the chassis.
  • the main board may be a flat plate on which a light source can be easily mounted, and the heat radiating plate may have a shape with a large contact surface with respect to the chassis.
  • At least one end of the recess is an open end that reaches the outer edge of the contact surface where the recess is formed, and the heat dissipation material is in the open end in a state where the recess is closed by the contact surface facing the recess. Can be injected from.
  • the heat radiation material can be injected and filled from the open end, so that the workability is excellent. Further, if one open end is provided for one recess, it is possible to suppress leakage of the heat radiating material filled from the open end. That is, if both ends of the recess are open ends, the heat radiation material injected from one side may leak from the other, and therefore the other open end must be blocked by some means. On the other hand, by setting only one end of the recess as an open end, the heat dissipation material can be filled in the recess without leaking.
  • the space filled with the contact surface is filled with the heat radiation material without deviation. Therefore, a larger contact area between the light source substrate and the chassis via the heat dissipating material can be ensured, and an improvement in heat dissipation efficiency can be expected.
  • the concave portion includes a plurality of linear grooves. If the concave portion is linear, it is easy to fill the heat dissipation material. Further, if the concave portion is a linear groove, after forming one or both of the light source substrate and the chassis, the concave portion can be easily formed by scratching the surface or the like.
  • the recess is formed in the light source substrate. If the concave portion is formed on the light source substrate, the surface area is increased by the amount of the concave portion. By further ensuring the contact area of the light source substrate holding the heat source (light source) to be radiated with respect to the chassis and the heat radiating material, further improvement in heat radiation efficiency can be expected. Further, since the chassis accommodates the light source substrate and the light guide member, at least the light source substrate is smaller than the chassis. Therefore, it is easier to form the recesses in the light source substrate.
  • the heat radiating plate includes a heat radiating portion facing the chassis, and a board mounting portion that can rise from one end of the heat radiating portion and to which the main board can be attached, and has a substantially L shape in cross section.
  • the chassis and the heat sink are made of the same material. If at least the chassis and the heat dissipation plate are made of the same material in the heat transfer path between the light source and the chassis, the thermal resistance can be suppressed and the heat dissipation efficiency can be improved.
  • the heat sink is made of metal. If at least the heat radiating plate is made of metal in the heat transfer path between the light source and the chassis, it is excellent in thermal conductivity, which can contribute to improvement in heat radiation efficiency.
  • the light guide member has a flat plate shape, the plate surface is the light emitting surface, and the side surface facing the light source is the light incident surface, and the chassis is parallel to the light emitting surface. And a side plate that rises from the periphery of the bottom plate and is arranged in parallel with the light incident surface.
  • the light source is mounted on the light source substrate at a high density in order to obtain a necessary light amount, and the heat generation amount per unit area of the light source substrate tends to be high. Therefore, it is particularly useful to apply a structure in close contact by filling a heat dissipation material between the chassis and the light source substrate of the present invention.
  • the light source is an LED. If the present invention is applied to an LED having a light source, it is possible to further extend the life of the light source and reduce power consumption.
  • the heat dissipation material is cured after being filled in a liquid state.
  • the heat radiating material in which the liquid state is maintained for example, it is difficult to hold the heat radiating material on the contact surface of the light source substrate or the chassis and then assemble both members. It also takes time to dispose of the product.
  • a heat-dissipating material that hardens it can be held on the light source substrate or the chassis, and can be handled as a solid even when discarded.
  • the heat radiating material is cured, it is not necessary to configure the portion filled with the heat radiating material so that the heat radiating material does not leak, and the cost can be reduced.
  • the heat dissipation material is silicone rubber. If silicone rubber having a relatively fast curing speed is used, the time required for curing can be shortened and the manufacturing cost can be reduced.
  • a display device of the present invention includes the above-described illumination device and a display panel that performs display using light from the illumination device.
  • the illuminating device that supplies light to the display panel can improve the heat dissipation efficiency of the heat emitted from the light source. Therefore, the display device is also excellent in heat dissipation efficiency. can do.
  • a liquid crystal panel can be exemplified as the display panel.
  • Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.
  • FIG. 1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention.
  • the exploded perspective view which shows schematic structure of the liquid crystal display device with which a television receiver is equipped Sectional drawing which shows the cross-sectional structure along the short side direction of a liquid crystal display device
  • the top view which shows the arrangement structure seen from the front side of the backlight apparatus
  • Partial enlarged plan view of LED unit Schematic showing a cross-section of the contact surface between the LED unit and the chassis when the chassis has undulations
  • the expanded sectional view of the LED unit and chassis which concern on the modification 1 of Embodiment 1.
  • Partial enlarged plan view of LED unit The expanded sectional view of the LED unit and chassis which concern on the modification 2 of Embodiment 1.
  • Partial enlarged plan view of LED unit The expanded sectional view of the LED unit which concerns on the modification 3 of Embodiment 1, and a chassis Partial enlarged plan view of LED unit The partial enlarged plan view of the LED unit which concerns on the modification 4 of Embodiment 1.
  • FIG. The expanded sectional view of the LED unit and chassis concerning Embodiment 2
  • FIG. 1 is an exploded perspective view showing a schematic configuration of a television receiver according to the present embodiment
  • FIG. 2 is an exploded perspective view showing a schematic configuration of a liquid crystal display device 10
  • FIG. 3 is along the short side direction of the liquid crystal display device 10.
  • 4 is a plan view showing an arrangement configuration viewed from the front side of the backlight device 12
  • FIG. 5 is a partially enlarged plan view of the LED unit 30,
  • FIG. 6 is a case where undulation is present in the chassis 14.
  • FIG. 2 is a schematic view showing a cross section of a contact surface between an LED unit 30 and a chassis 14.
  • FIG. 2 Each drawing shows an X axis, a Y axis, and a Z axis, and the directions of the axes are drawn in the same direction in the drawings. Also, the upper side shown in FIG. 2 is the front side (front side, light emission side), and the lower side is the back side (back side, opposite to the light emission side).
  • the television receiver TV includes a liquid crystal display device 10 (display device), front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, and a power source P.
  • a tuner T and a stand S are provided.
  • the liquid crystal display device 10 has a horizontally long rectangular shape (rectangular shape) as a whole and is accommodated in a vertically placed state.
  • the liquid crystal display device 10 includes a liquid crystal panel 11 that is a display panel and a backlight device 12 (illumination device) that is an external light source, which are integrated by a frame-like bezel 13 or the like. Is supposed to be retained.
  • the liquid crystal panel 11 has a rectangular shape in plan view, and a pair of glass substrates are bonded together with a predetermined gap therebetween, and liquid crystal is sealed between the glass substrates. It is said.
  • One glass substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like.
  • the substrate is provided with a color filter and counter electrodes in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, and an alignment film.
  • a polarizing plate (not shown) is disposed outside both substrates.
  • the driving of the liquid crystal panel 11 is controlled by a liquid crystal panel control unit (not shown).
  • the liquid crystal panel control unit can output a control signal toward the liquid crystal panel 11 and control driving of the liquid crystal panel 11 based on an output signal output from an image signal processing unit (not shown).
  • an image signal such as a television broadcast signal input to the tuner T via the antenna is input to the image signal processing unit.
  • the input signal is subjected to image processing and the processed signal is processed. Output to a liquid crystal panel control unit or the like is possible.
  • the backlight device 12 is disposed so as to cover a substantially box-shaped chassis 14 having an opening on the light emitting surface side (the liquid crystal panel 11 side), and the opening of the chassis 14.
  • Optical member 15 group (diffusion sheet 15 a, lens sheet 15 b, reflective polarizing sheet 15 c), a frame disposed along the outer edge portion of the chassis 14 and holding the outer edge portion of the optical member 15 group sandwiched between the chassis 14 16.
  • the backlight device 12 includes an LED unit 30 having LEDs 17 at both ends on the long side, and a so-called edge light type (side-light type) in which a light guide plate 18 is interposed between the LED units 30. Light type).
  • edge light type side-light type
  • Light type each component of the backlight device 12 will be described in detail.
  • the chassis 14 is made of a metal such as an aluminum-based material, and has a rectangular bottom plate 14a similar to the liquid crystal panel 11 and a pair of the bottom plate 14a that rises from the outer end of the long side.
  • the long side direction of the chassis 14 coincides with the X-axis direction (horizontal direction), and the short side direction coincides with the Y-axis direction (vertical direction).
  • the bottom plate 14a is arranged in an opposing manner so as to cover the back side of the light guide plate 18 described later, that is, the surface opposite to the light emitting surface 18a.
  • a power supply circuit board that supplies power to the liquid crystal panel 11 and the LED 17 and an LED control circuit board that controls driving of the LED are not shown on the back side of the bottom plate 14a of the chassis 14, that is, the back side of the backlight device 12.
  • a liquid crystal control circuit board having the above-described liquid crystal panel control unit is attached.
  • the optical member 15 has a rectangular shape in plan view, like the liquid crystal panel 11 and the chassis 14.
  • the optical member 15 is configured by laminating a diffusion sheet 15a, a lens sheet 15b, and a reflective polarizing sheet 15c in this order from the light guide plate 18 side, and is disposed between the liquid crystal panel 11 and the light guide plate 18. Yes.
  • Such an optical member 15 has a function of converting light emitted from the LED 17 and passing through the light guide plate 18 into planar light.
  • the frame 16 arranged on the optical member 15 has a frame shape like the bezel 13 and is fixed to the long side of the chassis 14 and receives the outer peripheral edge of the liquid crystal panel 11 from the back side. It is supposed to be possible.
  • the light guide plate 18 is made of a synthetic resin material (for example, acrylic) having a refractive index sufficiently higher than air and substantially transparent (exceeding translucency), has a rectangular shape in plan view, and has a predetermined thickness. It is formed in a plate shape. As shown in FIG. 2, the light guide plate 18 is disposed in the chassis 14 immediately below the liquid crystal panel 11 and the optical member 15, and is sandwiched between a pair of LED units 30 disposed at both ends in the long side direction of the chassis 14. It is arranged in a form. Specifically, the main plate surface of the light guide plate 18 is directed to the front side (optical member 15 side), and is arranged along the display surface of the liquid crystal panel 11 in parallel.
  • a synthetic resin material for example, acrylic
  • the light guide plate 18 is disposed in the chassis 14 immediately below the liquid crystal panel 11 and the optical member 15, and is sandwiched between a pair of LED units 30 disposed at both ends in the long side direction of the chassis 14. It is arranged in a form. Specifically, the
  • both side surfaces on the long side disposed facing the LED 17 are light incident surfaces 18 a on which light from the LED 17 is incident.
  • the main plate surface arranged on the front side (optical member 15 side) of the light guide plate 18 is a light emitting surface 18b that emits light from the LED 17 (see FIGS. 2 and 3).
  • the light guide plate 18 introduces light emitted from the LED 17 in the Y-axis direction from the light incident surface 18a and directs the light toward the optical member 15 side (Z-axis direction) while propagating the light inside. And has a function of emitting from the light exit surface 18b.
  • the reflection sheet 19 is made of synthetic resin (for example, made of foamed PET), and its surface is white with excellent light reflectivity.
  • the reflection sheet 19 is disposed so as to cover the entire back surface of the light guide plate 18, that is, the surface opposite to the light emitting surface 18b.
  • the reflection sheet 19 allows the light in the light guide plate 18 to be reflected and raised to the light exit surface 18b side.
  • the LED unit 30 includes an LED 17, a main board 31 on which the LED 17 is mounted, and a heat dissipation plate 40 that fixes the main board 31. 2 to 4, the LED 17 is fixed on the main substrate 31 constituting the LED unit 30 and the LED chip is sealed with a resin material.
  • the LED chip mounted on the mounting surface 32 of the main substrate 31 has a single main emission wavelength, and specifically, one that emits blue in a single color.
  • the resin material that seals the LED chip is dispersed and blended with a phosphor that emits a predetermined color when excited by the blue light emitted from the LED chip, and generally emits white light as a whole. It is said.
  • the phosphor for example, a yellow phosphor that emits yellow light, a green phosphor that emits green light, and a red phosphor that emits red light are used in appropriate combination, or any one of them is used. It can be used alone. As a result, the LED 17 can emit white light.
  • the LED 17 is a so-called top type in which a surface opposite to the mounting surface 32 to be mounted is a light emitting surface.
  • the main board 31 on which the LED 17 is mounted has an elongated plate shape extending along the long side plate 14 b of the chassis 14, and the main board surface extends in the X axis direction and the Z axis. It is accommodated in the chassis 14 in a posture parallel to the direction, that is, a posture orthogonal to the plate surfaces of the liquid crystal panel 11 and the optical member 15.
  • a pair of main substrates 31 are arranged corresponding to both ends on the long side in the chassis 14, that is, arranged so as to face the light incident surfaces 18 a that are both side surfaces on the long side of the light guide plate 18. Become.
  • the main substrate 31 has a mounting surface 32 that faces the light incident surface 18 a of the light guide plate 18, and the LEDs 17 are surface-mounted on the mounting surface 32.
  • a plurality of LEDs 17 are intermittently arranged in parallel along the longitudinal direction (X-axis direction) on the mounting surface 32.
  • the base material of the main board 31 is made of the same metal as the chassis 14 such as an aluminum-based material.
  • the mounting surface 32 has an insulating layer formed by applying an insulating material, and an insulating layer on the insulating layer. And patterned circuit wiring.
  • the circuit wiring is made of a metal film such as copper foil, and adjacent LEDs 17 are connected in series by this circuit wiring.
  • the heat radiating plate 40 is made of a metal such as the same aluminum material as the chassis 14, and the overall shape thereof is in the long side direction (X-axis direction) of the chassis 14 (light guide plate 18) as shown in FIGS. 2 to 4.
  • the elongated thin flat plate is bent so as to have an L-shaped cross section.
  • a portion disposed along the long side plate 14 b of the chassis 14 is a board mounting portion 41
  • a portion disposed along the bottom plate 14 a of the chassis 14 is a heat radiating portion 45. That is, the board mounting portion 41 is configured to rise substantially vertically from the end of the heat radiating portion 45 to the front side.
  • the substrate mounting portion 41 is parallel to the light incident surface 18a of the light guide plate 18 and faces the light incident surface 18a.
  • the substrate mounting portion 42 is a substrate mounting surface 42 to which the main substrate 31 is mounted, and the opposite surface, which is a chassis. 14 and a chassis attachment surface 43 attached in contact with the inner surface of the long side plate 14b.
  • the entire surface opposite to the mounting surface 32 of the main substrate 31 is attached to the substrate mounting surface 42 in close contact with the light mounting surface 18a of the light guide plate 18 and the main substrate 31. The distance from the LED 17 is kept constant.
  • the heat radiation part 45 is configured to extend along the bottom plate 14 a in parallel with the bottom plate 14 a of the chassis 14, and the extending direction is a direction from the substrate mounting part 41 toward the light guide plate 18.
  • the extending edge of the heat radiating portion 45 has an extending length that exceeds the light incident surface 18 a of the light guide plate 18, that is, is arranged so as to partially overlap the light guide plate 18.
  • the extending length of the heat dissipating part 45 is longer than the length of the board mounting part 41 in the Z-axis direction, and ensures a wider contact area with the bottom plate 14a of the chassis 14.
  • the heat radiation portion 45 has a heat radiation surface 46 facing the bottom plate 14a of the chassis 14.
  • the heat radiating surface 46 has a groove 47 extending linearly along the long side direction thereof, that is, the long side direction (X-axis direction) of the chassis 14 and along the parallel direction of the LEDs 17.
  • a plurality of recesses are provided.
  • the grooves 47 are parallel to each other, and the cross section in the Y-axis direction is rectangular. Both ends of each groove 47 are open ends 48 that reach both ends in the long side direction of the heat radiating surface 46, that is, each groove 47 is configured to penetrate the heat radiating surface 46 in the long side direction.
  • the depth of the groove 47 from the surface of the heat radiating surface 46 is preferably about 1 mm to 5 mm.
  • the heat radiating surface 46 in which the groove 47 is formed is fixed with screws or the like so as to contact the bottom plate 14a over the entire surface. And the clearance gap between the groove
  • the heat radiating material 50 may be at least a heat conductive material that is in a liquid state at the time of filling.
  • a liquid silicone material before polymerization as silicone rubber is used.
  • the silicone material a thermosetting type that cures (polymerizes) by heating, a room temperature curing type that absorbs moisture in the air and cures, a photocuring type that cures by UV irradiation, and the like can be selected as appropriate.
  • both members are in contact with each other and a slight gap is filled with the heat radiating material 50. That is, the entire surface of the heat radiating surface 46 is in contact with the bottom plate 14 a of the chassis 14 facing directly or through the heat radiating material 50. Therefore, the heat generated from the LED 17 is conducted from the main board 31 to the heat radiating plate 40, and is conducted from the heat radiating surface 46 of the heat radiating portion 45 directly or through the heat radiating material 50 to the bottom plate 14 a of the chassis 14. Heat is radiated to the external space. There is also a route in which heat is transferred from the chassis mounting surface 43 of the board mounting portion 41 to the long side plate 14b of the chassis 14 and radiated to the external space.
  • the liquid crystal display device 10 having the above-described configuration is manufactured by assembling a separately manufactured liquid crystal panel 11 and backlight device 12 with a bezel 13 or the like.
  • the LED unit 30 which is a component of the backlight device 12 is housed in the chassis 14 when assembled, as shown in FIG. Specifically, screws or the like are used so that the chassis mounting surface 43 of the board mounting portion 41 of the heat radiating plate 40 contacts the long side plate 14b, and the heat radiating surface 46 of the heat radiating portion 45 contacts the bottom plate 14a. To fix.
  • the heat radiating material 50 is injected into the groove 47 by injecting the heat radiating material 50 from the open ends 48 of the grooves 47 opened at both ends in the long side direction of the heat radiating plate 40. Filled. At this time, if there are irregularities or undulations on the surface of the bottom plate 14a of the chassis 14 facing the heat radiating surface 46 of the heat radiating plate 40, the heat radiating material 50 injected into the groove 47 as shown in FIG. By flowing out into the gap, the heat radiation material 50 is also filled in the gap between the heat radiation surface 46 and the bottom plate 14a of the chassis 14.
  • the heat radiating surface 46 is in direct contact with the bottom plate 14a of the chassis 14 without a gap or in contact with the heat radiating member 50. As will be described in detail later, the heat generated from the LED 17 is generated by the heat radiating plate 40. Heat is transferred to the bottom plate 14 a of the chassis 14 through the entire heat radiating surface 46.
  • the drive of the liquid crystal panel 11 is controlled by a liquid crystal panel control unit (not shown), and the drive of each LED 17 in the backlight device 12 is controlled by the LED control circuit board.
  • illumination light is applied to the liquid crystal panel 11, and a predetermined image is displayed on the liquid crystal panel 11.
  • each LED 17 is turned on, the light emitted from each LED 17 enters the light incident surface 18 a of the light guide plate 18.
  • the light taken in from the light incident surface 18a propagates through the light guide plate 18 by being reflected by the reflection sheet 19, and is emitted as substantially planar light from the light emitting surface 18b.
  • the heat radiation action in the LED unit 30 will be described.
  • the heat generated from each LED 17 is transferred from the main board 31 to the heat radiating plate 40 through the board mounting surface 42.
  • the heat conducted to the heat radiating plate 40 is transferred from the chassis mounting surface 43 to the long side plate 14 b of the chassis 14.
  • heat is transferred from the heat radiation surface 46 of the heat radiation portion 45 to the bottom plate 14 a of the chassis 14.
  • the heat conducted to the chassis 14 is radiated to an external space outside the liquid crystal display device 10.
  • it is set as the structure excellent in the heat dissipation effect by ensuring the contact area to the chassis 14 used as the heat medium of LED unit 30 with which LED17 which is a heat source was mounted.
  • a plurality of grooves 47 are formed in the heat dissipation surface 46 having the largest area, and at least the grooves 47 are filled with the heat dissipation material 50. ing. If the surface of the chassis 14 has irregularities or undulations, the heat radiation material 50 is also filled in the gap formed between the heat radiation surface 46 and the chassis 14 due to the surface shape in addition to the grooves 47. (See FIG. 6). With this heat radiating material 50, the heat radiating surface 46 can transfer heat over the entire surface of the bottom plate 14 a of the chassis 14, so that the heat radiating efficiency can be improved.
  • the efficiency is inferior to the theoretical heat radiating efficiency in which the entire heat radiating surface 46 is in close contact with the chassis 14 due to this gap.
  • a heat insulation effect is generated by sandwiching air in the gap between the heat dissipation surface 46 and the chassis 14, and This is because the heat transfer efficiency is lowered.
  • a plurality of grooves 47 are provided in the heat dissipation surface 46 having the widest contact area, and the surface area is increased.
  • the heat transfer surface 46 can be used directly or via the heat dissipation material 50 as a path for transferring heat to the bottom plate 14a. Therefore, the heat dissipation efficiency can be improved. Further, by filling the heat dissipation material 50 in the groove 47 and the gap between the chassis 14 and the LED unit 30, a contact area can be ensured and a stable thermal design can be performed.
  • the backlight device 12 of the present embodiment includes the LED 17, the LED unit 30 on which the LED 17 is mounted, the light incident surface 18a that faces the LED 17 and the light from the LED 17 is incident thereon, and the light.
  • the LED unit 30 and the chassis 14 are disposed between the LED unit 30 and the chassis 14. It is intimately contacted by filling the liquid heat dissipation material 50.
  • the liquid heat radiation material 50 is filled between the heat radiation surface 46 of the heat radiation plate 40 and the bottom plate 14 a of the chassis 14. Regardless of the surface shape of the bottom plate 14a, the heat radiation surface 46 and the bottom plate 14a of the chassis 14 can be brought into close contact with each other, and the heat radiation efficiency for radiating the heat from the LED 17 to the external space through the chassis 14 can be improved. It is.
  • a groove 47 is formed in the heat dissipation surface 46 on the LED unit 30 side, and at least the groove 47 is filled with the heat dissipation material 50.
  • the surface area of the heat radiating surface 46 can be increased by forming the groove 47, and heat can be transferred to the bottom plate 14a of the chassis 14 via the heat radiating member 50 without leaving the increased surface area. By doing so, the heat dissipation efficiency can be further improved.
  • the LED unit 30 includes a main board 31 on which the LEDs 17 are mounted, and a heat radiating plate 40 that is fixed to the chassis 14 by fixing the main board 31 so that heat can be transferred.
  • the main board 31 is a flat plate on which the LED 17 can be easily mounted, and the heat radiating plate 40 has a shape that ensures a large contact surface with the chassis 14 (in this embodiment, the chassis mounting surface 43 and the heat radiating surface 46). it can.
  • both ends of the groove 47 are open ends 48 that reach both ends in the long side direction of the heat radiating surface 46 in which the groove 47 is formed, and the heat radiating material in a state in which the groove 47 is blocked by the bottom plate 14a of the chassis 14 facing the groove 47. 50 can be injected from the open end 48. With such a configuration, since the heat dissipation material 50 can be injected and filled from the open end 48 after the LED unit 30 is attached to the chassis 14, the workability is excellent. Further, since the groove 47 is linear, it is easy to fill the heat dissipation material 50.
  • the groove 47 is formed in the heat radiating surface 46 of the LED unit 30. Since the LED unit 30 is smaller than the chassis 14, it is easier to form the LED unit 30 than to form the groove 47 in the bottom plate 14 a of the chassis 14.
  • the heat radiating plate 40 includes a heat radiating portion 45 facing the chassis 14 and a substrate mounting portion 41 that can be raised from one end of the heat radiating portion 45 and to which the main substrate 31 can be attached, and has a substantially L shape in sectional view.
  • chassis 14, the heat sink 40, and the main board 31 are all made of a metal such as an aluminum material and are made of the same material. As described above, if the same material is used in the heat transfer path between the LED 17 and the chassis 14, the thermal resistance can be suppressed and the heat radiation efficiency can be improved. Moreover, by making it metal, it shall be excellent in thermal conductivity and the improvement of the thermal radiation efficiency can be anticipated further.
  • the light guide plate 18 has a flat plate shape, the plate surface is a light emitting surface 18b, and the side surface facing the LED 17 is a light incident surface 18a.
  • the chassis 14 is arranged in parallel to the light emitting surface 18b.
  • a long side plate 14b that rises from the periphery of the bottom plate 14a and is arranged in parallel to the light incident surface 18a.
  • the LEDs 17 are mounted on the main board 31 with a high density in order to obtain a necessary light amount, and the amount of heat generated per unit area on the main board 31 tends to increase. Therefore, it is particularly useful to apply a configuration in which the chassis 14 and the LED unit 30 of the present embodiment are in close contact with each other by filling the heat dissipation material 50.
  • the LED 17 as the light source, it is possible to extend the life of the light source and reduce power consumption.
  • the heat dissipation material 50 is excellent in handling because it can be treated as a solid when discarded by using a material that is hardened after being filled in a liquid state. Moreover, if it is the sclerosing
  • the heat dissipation material 50 is preferably silicone rubber. If a liquid silicone material having a high curing rate is used, the time required for curing can be shortened and the manufacturing cost can be reduced.
  • FIG. 7 is an enlarged cross-sectional view of the LED unit 60 and the chassis 14 according to this modification
  • FIG. 8 is an enlarged plan view of the LED unit 60.
  • the LED unit 60 includes a main board 31 on which the LEDs 17 are mounted, and a heat radiating plate 61 that attaches the main board 31 to the board mounting portion 62.
  • the heat radiating plate 61 is formed by bending an elongated flat plate extending in the long side direction (X-axis direction) of the chassis 14 so as to have an L-shaped cross section.
  • the board attaching part 62 which faces the inner surface of 14b, and the thermal radiation part 63 distribute
  • the surface of the heat radiating portion 63 that faces the bottom plate 14 a of the chassis 14 is a heat radiating surface 64, and a plurality of grooves 65 are formed in the heat radiating surface 64.
  • Each groove 65 is recessed in the heat radiation surface 64 so as to form a straight line extending in the short side direction (Y-axis direction) of the chassis 14, that is, in the direction orthogonal to the parallel direction of the LEDs 17.
  • the grooves 65 are parallel to each other, and the cross section in the X-axis direction is rectangular. Both ends of each groove 65 are open ends 66 that reach both ends of the heat radiating surface 64 in the short side direction, that is, each groove 65 is configured to penetrate the heat radiating surface 64 in the short side direction.
  • a liquid heat dissipating material (not shown) is assumed to be the same as in the first embodiment. Inject from open end 66. At this time, the open end 66 opened on the board mounting portion 62 is in a state of being blocked by the long side plate 14b of the chassis 14 that abuts. Therefore, if the heat radiating material is injected from the other open end 66, the injected heat radiating material can be filled in the groove 65 without leaking.
  • the two may not be in close contact with each other and a gap may be formed.
  • the heat radiating material injected into the groove 65 flows into the gap, so that the heat radiating material is filled with no gap between the two members.
  • the heat radiating surface 64 of the heat radiating plate 61 of the LED unit 60 it is possible to secure a larger contact area of the heat radiating surface 64 of the heat radiating plate 61 of the LED unit 60 with the bottom plate 14a of the chassis 14, so that the heat radiating efficiency is improved.
  • a plurality of grooves 65 are formed in the heat radiation surface 64, and the heat radiation material is filled by filling the gaps formed in the grooves 65 and between the heat radiation surface 64 and the bottom plate 14a of the chassis 14 so that the heat radiation. Since the surface 64 can conduct heat over the entire surface of the bottom plate 14a of the chassis 14, the heat radiation efficiency can be improved. Further, by increasing the surface area by forming the groove 65 in the heat radiating surface 64, it is possible to expect an improvement in heat radiating efficiency by ensuring a large surface area for radiating heat.
  • one end of the open end 66 of the groove 65 is the length of the chassis 14 when the extending direction of the groove 65 is the short side direction (Y-axis direction) of the chassis 14. It will be blocked by the side plate 14b. Thereby, the heat radiating material injected from the other open end 66 can be filled without leaking from the other open end 66. Further, since the extension length of each groove 65 is shorter than that of the first embodiment, it is possible to fill the groove 65 with the heat dissipation material evenly without increasing the injection pressure when injecting the heat dissipation material. .
  • FIG. 9 is an enlarged cross-sectional view of the LED unit 70 and the chassis 14 according to this modification
  • FIG. 10 is an enlarged plan view of the LED unit 70.
  • the LED unit 70 includes a main board 31 on which the LEDs 17 are mounted, and a heat radiating plate 71 in which the main board 31 is attached to the board attaching portion 72.
  • the heat radiating plate 71 is formed by bending an elongated flat plate extending in the long side direction (X-axis direction) of the chassis 14 so as to have an L-shaped cross section.
  • a board mounting portion 72 facing the inner surface of the long side plate 14b of the chassis 14 and a heat radiating portion 73 disposed along the bottom plate 14a of the chassis 14 are provided.
  • a surface of the heat radiating portion 73 facing the bottom plate 14 a of the chassis 14 is a heat radiating surface 74, and a groove 75 is formed in the heat radiating surface 74.
  • the grooves 75 are formed in a lattice shape on the heat dissipation surface 74. Specifically, linear grooves extending along the long side direction (X-axis direction) of the chassis 14 are formed in parallel at predetermined intervals, and the short side direction (Y-axis direction) of the chassis 14 is formed. Are formed in parallel with each other at predetermined intervals, and the grooves extending in the X-axis direction and the grooves extending in the Y-axis direction intersect to form a lattice-like groove 75. ing.
  • the groove 75 has a square cross section, and the end of the groove 75 reaches the outer edge of the heat radiating surface 74, that is, both ends in the short side direction and both ends in the long side direction of the heat radiating surface 74.
  • the open end 76 is open to the front.
  • the liquid heat radiating material 77 (same as in the first embodiment) is used as the open end of the groove 75. Inject from 76. At this time, the open end 76 opened on the board mounting portion 72 is closed by the long side plate 14b of the chassis 14 that abuts, but the other open end 76 opened to the other is open. Therefore, from which open end 76 the heat radiating material 77 is injected at the same time from each open end 76, or selected from a plurality of open ends 76 and the heat radiating material 77 is injected, it can be appropriately selected. Yes.
  • the heat radiating material 77 injected into the groove 75 flows into the gap, so that the heat radiating material 77 is filled with no gap between the two members.
  • the contact area of the heat dissipation surface 74 of the heat dissipation plate 71 of the LED unit 70 with the bottom plate 14a of the chassis 14 can be ensured as in the first embodiment and the first modification of the first embodiment.
  • the heat radiation efficiency can be improved. That is, a grid-like groove 75 is formed in the heat radiating surface 74, and the heat radiating material 77 is filled in the gap 75 formed between the groove 75 and the heat radiating surface 74 and the bottom plate 14 a of the chassis 14. Since the heat radiating surface 74 can transfer heat to the bottom plate 14a of the chassis 14 over the entire surface, the heat radiating efficiency can be improved. Further, by increasing the surface area by forming the groove 75 in the heat radiating surface 74, it is possible to expect improvement in heat radiating efficiency by ensuring a large surface area for radiating heat.
  • the grooves 75 are not formed in one direction as in the first embodiment or the first modification of the first embodiment, but are formed in a lattice shape so as to intersect the two directions, thereby forming the grooves 75. Not only can the surface area of the heat dissipation surface 74 be increased, but also more heat dissipation material 77 can be filled.
  • the heat radiating material 77 injected into the groove 75 is similarly formed in the gap.
  • the gap is filled by flowing out.
  • the grooves 75 are formed in a lattice shape as in the present modification, the grooves 75 are arranged closer to each gap, so that the heat radiating material 77 passes through the grooves 75. Easy to fill inside. In other words, it is easy to avoid a situation in which the gap between the chassis 14 and the heat radiation surface 74 is not filled with the heat radiation material 77. Therefore, the heat radiation material 77 is more evenly filled in the groove 75 and the gap between the chassis 14 and the heat radiation surface 74, so that the heat radiation efficiency in the heat transfer path via the heat radiation material 77 can be improved.
  • FIG. 11 is an enlarged cross-sectional view of the LED unit 80 and the chassis 14 according to this modification
  • FIG. 12 is an enlarged plan view of the LED unit 80.
  • the LED unit 80 includes a main board 31 on which the LEDs 17 are mounted, and a heat radiating plate 81 that attaches the main board 31 to the board mounting portion 82.
  • the heat radiating plate 81 is formed by bending an elongated flat plate extending in the long side direction (X-axis direction) of the chassis 14 so as to have an L-shaped cross section.
  • the board attaching part 82 which faces the inner surface of the long side plate 14b of the chassis 14 and the heat radiating part 83 arranged along the bottom plate 14a of the chassis 14 are provided.
  • the surface of the heat radiating portion 83 that faces the bottom plate 14 a of the chassis 14 is a heat radiating surface 84, and a plurality of grooves 85 are formed in the heat radiating surface 84.
  • Each groove 85 extends along the Y-axis direction from the long side on the chassis 14 center side toward the long side plate 14 b on the outer edge of the heat radiating surface 84, and the tip thereof is at the substantially central portion in the short side direction of the heat radiating surface 84. Has reached.
  • the grooves 85 are parallel to each other, and the cross section in the X-axis direction is rectangular.
  • the edge that opens toward the center of the chassis 14 is an open end 86, that is, only one end of the groove 85 reaches the outer edge of the heat dissipation surface 84.
  • a liquid heat radiating material (not shown) is assumed to be the same as in the first embodiment. Inject from the open end 86. At this time, since there is one open end 86 for each groove 85, it is possible to fill the groove 85 with the heat radiating material without the heat radiating material filled from the open end 86 leaking out. Moreover, between the bottom plate 14a of the chassis 14 and the heat radiating surface 84, if there are uneven shapes or undulations on the mutual contact surfaces, they may not be in close contact with each other and a gap may be formed. In this case, the heat radiating material injected into the groove 85 flows into the gap, so that the heat radiating material is filled with no gap between the two members.
  • the surface area is increased by forming the groove 85 on the heat radiating surface 84 and the heat radiating member is formed in the groove 85 and the same as in the first and second modifications of the first embodiment and the first embodiment.
  • channel 85 in the thermal radiation surface 84 is not made into the open end 86, but the possibility that the thermal radiation material to inject
  • the region close to the light guide plate 18 not only transfers heat from the LED 17 through the main substrate 31, but also absorbs heat from the atmosphere that has been heated by the light source light emitted from the LED 17. Therefore, it is necessary to increase the heat radiation efficiency compared to other parts. By disposing the groove 85 and the heat radiating material in this region, it is possible to improve the heat radiating efficiency while reducing the use amount of the heat radiating material and reducing the cost.
  • FIG. 13 is an enlarged plan view of an LED unit 90 according to this modification.
  • the LED unit 90 includes a main board 31 on which the LEDs 17 are mounted and a heat radiating plate 91 to which the main board 31 is attached.
  • the heat radiating plate 91 includes a board mounting portion 92 facing the inner surface of the long side plate 14 b of the chassis 14, and a heat radiating portion 93 disposed along the bottom plate 14 a of the chassis 14.
  • a surface of the heat radiating portion 93 that faces the bottom plate 14a of the chassis 14 is a heat radiating surface, and a plurality of grooves 94 are formed on the heat radiating surface.
  • Each groove 94 extends from the long side of the outer side of the heat radiating surface toward the long side plate 14b toward the long side plate 14b with a slight inclination in the X-axis direction. Has reached the department.
  • the grooves 94 are parallel to each other, and an edge that opens toward the center of the chassis 14 is an open end 95.
  • the groove 94 is formed on the heat radiating surface to increase the surface area, and the heat radiating material is formed on the groove 94 and the heat radiating surface. And filling the gap between the bottom plate 14a of the chassis 14 facing the heat dissipation efficiency in the heat transfer path for dissipating the heat from the LED 17 to the external space.
  • FIG. 14 is an enlarged cross-sectional view of the LED unit 100 and the chassis 14 according to the present embodiment.
  • the shape of the heat radiating plate 101 is a mode in which an elongated flat plate extending in the long side direction (X-axis direction) of the chassis 14 is bent so as to have an L-shaped cross section, and the main board on which the LEDs 17 are mounted.
  • the board attaching part 102 to which 31 is fixed and the heat radiating part 103 in contact with the bottom plate 14a of the chassis 14 are formed.
  • the extending direction of the heat dissipating part 103 with respect to the substrate mounting part 102 extends to the long side plate 14b side, that is, the side opposite to the light guide plate 18.
  • the surface of the heat radiating portion 103 facing the bottom plate 14a of the chassis 14 is a heat radiating surface 104.
  • a plurality of linear grooves 105 are provided in the heat radiating surface 104 as in the first embodiment.
  • the extending direction of each groove 105 is the long side direction (X-axis direction) of the chassis 14 and is parallel to each other. Both ends of each groove 105 reach both ends in the long side direction of the heat radiating surface 104, that is, each groove 105 is configured to penetrate the heat radiating surface 104 in the short side direction.
  • a heat radiating material 106 is injected into each groove 105, and a gap formed between the groove 105 and the bottom plate 14 a of the chassis 14 facing the heat radiating surface 104 is filled with the heat radiating material 106.
  • the heat radiating part 103 is arranged on the outer peripheral edge side of the chassis 14 on the opposite side of the light guide plate 18 with respect to the board mounting part 102, the heat radiating efficiency can be further improved.
  • the heat dissipating part 103 when the heat dissipating part 103 is disposed on the light guide plate 18 side with respect to the substrate mounting part 102 and covers the region for mixing the light source light from the LED 17 to the light incident surface 18a of the light guide plate 18, the heat dissipating part 103 is the main substrate.
  • the heat is absorbed not only from the heat transfer from 31 but also from the atmosphere that is higher in temperature than the other parts by the light source light, and the heat radiation efficiency of the heat radiation unit 103 is lowered.
  • the heat radiation efficiency can be improved by arranging the heat radiation part 103 on the outer peripheral edge side of the chassis 14 having a low ambient temperature.
  • the heat radiating part 103 is arranged on the light guide plate 18 side with respect to the substrate mounting part 102, there is a possibility that a part of the light guide plate 18 and the heat radiating part 103 overlap to increase the thickness of the backlight device 12. is there.
  • the heat radiating portion 103 is formed on the opposite side of the light guide plate 18 with respect to the substrate mounting portion 102, the backlight device 12 is made thinner, and the heat radiating efficiency is further improved. be able to.
  • FIG. 15 is an enlarged cross-sectional view of the LED unit 110 and the chassis 14 according to the present embodiment.
  • the LED unit 110 includes a main board 31 on which the LEDs 17 are mounted, and a heat sink 111 that fixes the main board 31 to the board mounting portion 112.
  • the heat radiating plate 111 is formed by bending an elongated flat plate extending in the long side direction (X-axis direction) of the chassis 14 so as to have an L-shaped cross section.
  • arranged along the bottom plate 14a of the chassis 14 are provided.
  • a surface of the heat radiating portion 113 facing the bottom plate 14 a of the chassis 14 is a heat radiating surface 114.
  • a plurality of linear grooves 115 are formed in a portion of the bottom plate 14 a of the chassis 14 that faces the heat radiating surface 114. Each groove 115 extends along the long side plate 14b of the chassis 14 and is parallel to each other. The groove 115 is filled with a heat dissipation material 116 (similar to the first embodiment).
  • the present invention is not limited to forming the groove 115 on the LED unit 110 side and filling the heat dissipation material, but forming the groove 115 on the chassis 14 side and filling the groove 115 with the heat dissipation material 116.
  • the effect of can be obtained. That is, when the heat dissipation surface 114 and the surface of the bottom plate 14a of the chassis 14 opposite to the heat dissipation surface 114 have uneven shapes and undulations, the entire heat dissipation surface 114 cannot be brought into close contact with the chassis 14, and the heat is released by the amount of the gap. There is a risk that the efficiency may decrease.
  • the groove 115 is formed in the bottom plate 14a of the chassis 14 facing the heat radiating surface 114, and the heat radiating material 116 is filled therein, so that at least the heat radiating material 116 has the heat radiating surface 114 and the inner surface of the groove 115 of the chassis 14. Therefore, a heat transfer path through the heat dissipating material 116 can be established.
  • heat dissipation efficiency can be improved.
  • stable thermal design is possible.
  • FIG. 16 is an enlarged cross-sectional view of the LED unit 120 and the chassis 14 according to the present embodiment.
  • the LED unit 120 includes an LED 17 and a heat radiating plate 121 on which the LED 17 is mounted and fixed to the chassis 14.
  • the shape of the heat sink 121 is a mode in which an elongated flat plate extending in the long side direction (X-axis direction) of the chassis 14 is bent so as to have an L-shaped cross section.
  • a mounting portion 122 facing the inner surface of the side plate 14b and a heat radiating portion 123 disposed along the bottom plate 14a of the chassis 14 are provided.
  • a surface of the heat radiating portion 123 that faces the bottom plate 14 a of the chassis 14 is a heat radiating surface 124.
  • a plurality of linear grooves 125 are formed on the heat radiating surface 124, and the grooves 125 extend in the long side direction (X-axis direction) of the chassis 14 and are parallel to each other. Both ends of each groove 125 reach both ends in the long side direction of the heat radiating surface 124, that is, each groove 125 is configured to penetrate the heat radiating surface 124 in the long side direction.
  • the gaps formed in the grooves 125 and between the heat sink surface 124 and the bottom plate 14a of the chassis 14 facing each other are filled with a heat dissipation material 126.
  • the mounting part 122 has a mounting surface 122a facing the light incident surface 18a of the light guide plate 18, and the LED 17 is surface-mounted on the mounting surface 122a.
  • the mounting form is the same as the mounting form of the LED 17 on the main board 31 of the first embodiment.
  • the mounting surface 122a has an insulating layer formed by applying an insulating material, and an insulating layer on the insulating layer. Patterned circuit wiring is arranged.
  • the circuit wiring is made of a metal film such as copper foil, and adjacent LEDs 17 are connected in series by this circuit wiring.
  • the heat radiating surface 124 is provided with a plurality of grooves 125, and a heat radiating material 126 is filled in the gap 125 and between the heat radiating surface 124 and the bottom plate 14 a of the chassis 14 facing the heat radiating surface 124.
  • the heat dissipation surface 124 can be used as a heat transfer path that leads to the chassis 14 without leaving any excess, and the heat dissipation efficiency can be further improved. Further, by eliminating the main substrate 31, it is possible to save space, which is advantageous in reducing the size of the backlight device 12, particularly the narrow frame around the light guide plate 18.
  • the present invention is not limited to the above-described embodiment, and for example, the following modifications may be included.
  • the same members as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and description thereof may be omitted.
  • FIG. 17 is an enlarged cross-sectional view of the LED unit 130 and the chassis 14 according to the present embodiment.
  • the LED unit 130 includes an LED 17 and a heat radiating plate 131 on which the LED 17 is mounted and fixed to the chassis 14.
  • the shape of the heat radiating plate 131 is an elongated flat plate extending in the long side direction (X-axis direction) of the chassis 14, and the mounting surface 132 facing the light incident surface 18 a of the light guide plate 18, and It is provided with a heat radiating surface 133 which is the opposite surface and faces the long side plate 14 b of the chassis 14.
  • the LED 17 is surface-mounted on the mounting surface 132.
  • the mounting form is the same as that of the fourth embodiment.
  • a plurality of linear grooves 134 are formed on the heat radiation surface 133, and each groove 134 extends in the long side direction (X-axis direction) of the chassis 14 and is parallel to each other. Both ends of each groove 134 reach both ends in the long side direction of the heat radiating surface 133, that is, each groove 134 is configured to penetrate the heat radiating surface 133 in the long side direction.
  • the main board 31 is not interposed.
  • the number of interfaces can be reduced to reduce the thermal resistance, thereby improving the heat dissipation efficiency.
  • space-saving can be achieved by using a flat plate shape instead of the heat radiating plate 131 bent in an L-shaped cross section as in the first to fourth embodiments. That is, although the contact area of the heat sink 131 with respect to the chassis 14 is reduced as compared with the first to fourth embodiments, a part of the heat radiating portion 45 does not overlap the light guide plate 18 as in the first embodiment.
  • the backlight device 12 can be thinned.
  • the heat radiating surface 133 is provided with a plurality of grooves 134, and a heat radiating material 135 is formed in the gap formed between the groove 134 and the long side plate 14 b of the chassis 14 facing the heat radiating surface 133. Therefore, even if the contact area with respect to the chassis 14 is reduced, it can be expected to improve the heat dissipation efficiency.
  • silicone rubber is exemplified as the heat radiating material.
  • the present invention is not limited to this, and any heat conductive material that is liquid at the time of filling may be used. It may be a material that can be cured or a material that cures over time. Moreover, it is not limited to filling, and a heat radiating material that maintains a liquid state may be used, or a material that is liquid at room temperature and is cured by a temperature increase caused by lighting of the LED 17 may be used.
  • the groove formed in the heat radiating surface or the chassis 14 has a depth direction perpendicular to the forming surface.
  • the groove may be cut obliquely.
  • the heat dissipation material is injected from the open end of the groove.
  • the present invention is not limited to this.
  • the heat dissipation material is previously injected into the groove. It may be cured. With such a configuration, it is possible to assemble in the same assembling process as before, so that no special change occurs and the versatility can be improved.
  • a groove is formed as a recess, and the groove is exemplified as a linear or grid-like one.
  • the present invention is not limited to this.
  • a single recess having a square shape or a circular shape is provided. It may be formed, or a so-called zigzag-shaped recess having continuous peaks and valleys may be formed.
  • the substrate holding part and the heat radiating part of the heat radiating plate are exemplified in which the surface area of the heat radiating part is larger than the surface area of the substrate holding part.
  • the substrate holding unit and the heat radiating unit may have substantially the same surface area, or the substrate holding unit may have a surface area larger than that of the heat radiating unit.
  • the recess (groove) is provided only in the heat radiating portion.
  • the present invention is not limited to this.
  • the heat radiating portion not only the heat radiating portion but also the substrate holding portion or the mounting portion is mounted with the LED 17.
  • a configuration may also be adopted in which a concave portion is formed on the surface opposite to the surface on which the heat sink is provided and the heat dissipation material is filled.
  • a configuration may be employed in which a recess is formed in only the substrate holding portion or the mounting portion and the heat dissipation material is filled without forming the recess in the heat dissipation portion.
  • the LED units are disposed at both ends on the long side of the backlight device 12.
  • the present invention is not limited to this, and either one of the long sides of the backlight device 12 is used.
  • the LED unit is disposed on the both ends of the short side, or the LED unit is disposed on either one of the both sides.
  • the edge light type backlight device 12 using the LED 17 as the light source is adopted.
  • the present invention is not limited to this.
  • the edge light type backlight device 12 using a linear light source such as a discharge tube is used.
  • a backlight device may be employed.
  • the LED 17 including the LED chip that emits blue monochromatic light is used.
  • an LED including the LED chip that emits purple monochromatic light is used.
  • an LED incorporating three types of LED chips each emitting R, G, and B in a single color is also possible.
  • the TFT is used as the switching element of the liquid crystal display device 10, but the present invention can also be applied to a liquid crystal display device using a switching element other than the TFT (for example, a thin film diode (TFD)).
  • a switching element other than the TFT for example, a thin film diode (TFD)
  • the present invention can also be applied to a liquid crystal display device for monochrome display.
  • liquid crystal display device 10 using the liquid crystal panel 11 as the display panel has been illustrated, but the present invention can also be applied to display devices using other types of display panels.
  • the television receiver 10 including the tuner T is illustrated, but the present invention can also be applied to a display device that does not include the tuner.
  • SYMBOLS 10 Liquid crystal display device (display device), 11 ... Liquid crystal panel (display panel), 12 ... Backlight device (illumination device), 14 ... Chassis, 14a ... Bottom plate, 14b ... Long side side plate, 14c ... Short side side plate DESCRIPTION OF SYMBOLS 15 ... Optical member, 17 ... LED (light source), 18 ... Light guide plate (light guide member), 18a ... Light incident surface, 18b ... Light emission surface, 30 ... LED unit (light source substrate), 31 ... Main substrate, 32 DESCRIPTION OF SYMBOLS ... Mounting surface, 40 ... Heat sink, 41 ... Substrate attachment part, 45 ... Heat sink, 46 ... Heat sink, 47 ... Groove (concave part), 48 ... Open end, 50 ... Heat sink, TV ... Television receiver

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)

Abstract

Ce dispositif d'éclairage est doté : d'une source de lumière (17) ; d'un substrat (30) à source de lumière sur lequel est montée la source de lumière (17) ; un élément de guidage de lumière (18) ayant une surface d'entrée de lumière (18a), qui fait face à la source de lumière (17) et dans laquelle entre la lumière provenant de la source de lumière (17), et une surface de sortie de lumière (18b), par laquelle sort la lumière ; et un châssis (14) qui loge le substrat (30) à source de lumière et l'élément de guidage de lumière (18). Le substrat (30) à source de lumière et le châssis (14) sont amenés à venir en contact étroit grâce au remplissage de l'espace situé entre le substrat (30) à source de lumière et le châssis (14) à l'aide d'un matériau à dissipation de chaleur liquide (50). De plus, une concavité (47) est formée sur au moins une des surfaces de contact du contact entre le châssis (14) et le substrat (30) à source de lumière, et le matériau à dissipation de chaleur (50) remplit la concavité (47).
PCT/JP2012/051188 2011-01-27 2012-01-20 Dispositif d'éclairage, dispositif d'affichage et dispositif de réception de télévision Ceased WO2012102200A1 (fr)

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JP2011-015608 2011-01-27
JP2011015608 2011-01-27

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006058481A (ja) * 2004-08-18 2006-03-02 Sony Corp バックライト装置及び透過型液晶表示装置
JP2006286347A (ja) * 2005-03-31 2006-10-19 Minebea Co Ltd 面状照明装置
JP2007042552A (ja) * 2005-08-05 2007-02-15 Matsushita Electric Ind Co Ltd 照明光源装置
JP2010177076A (ja) * 2009-01-30 2010-08-12 Hitachi Ltd タンデム型面光源装置及びそれを用いた液晶表示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006058481A (ja) * 2004-08-18 2006-03-02 Sony Corp バックライト装置及び透過型液晶表示装置
JP2006286347A (ja) * 2005-03-31 2006-10-19 Minebea Co Ltd 面状照明装置
JP2007042552A (ja) * 2005-08-05 2007-02-15 Matsushita Electric Ind Co Ltd 照明光源装置
JP2010177076A (ja) * 2009-01-30 2010-08-12 Hitachi Ltd タンデム型面光源装置及びそれを用いた液晶表示装置

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