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WO2012176420A1 - Haut-parleur - Google Patents

Haut-parleur Download PDF

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Publication number
WO2012176420A1
WO2012176420A1 PCT/JP2012/003950 JP2012003950W WO2012176420A1 WO 2012176420 A1 WO2012176420 A1 WO 2012176420A1 JP 2012003950 W JP2012003950 W JP 2012003950W WO 2012176420 A1 WO2012176420 A1 WO 2012176420A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover
front cover
speaker according
back cover
speaker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/003950
Other languages
English (en)
Japanese (ja)
Inventor
順三 池山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of WO2012176420A1 publication Critical patent/WO2012176420A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/13—Acoustic transducers and sound field adaptation in vehicles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • H04R7/127—Non-planar diaphragms or cones dome-shaped
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details

Definitions

  • the present invention relates to a speaker used for various kinds of audio equipment and video equipment for in-vehicle use and AV use.
  • FIGS. 10 and 11 are an exploded perspective view and a cross-sectional view showing a configuration of a conventional speaker.
  • This speaker includes a magnetic circuit 38, a frame 40, a diaphragm 32, a voice coil 33, a front cover 31, and a back cover 37.
  • the magnetic circuit 38 includes a magnet 35, a plate 34, and a yoke 36.
  • Frame 40 is coupled to magnetic circuit 38.
  • the diaphragm 32 is coupled to the frame 40.
  • the voice coil 33 is coupled to the diaphragm 32.
  • One end of the voice coil 33 is disposed in the magnetic gap 38 ⁇ / b> A of the magnetic circuit 38.
  • the front cover 31 is disposed on the front surface of the frame 40.
  • the back cover 37 is disposed on the back surface of the frame 40.
  • Metal terminals 39 are provided on the frame 40. A lead wire (not shown) of the voice coil 33 is connected to the metal terminal 39.
  • a terminal 41 having a connector function is provided on the back cover 37.
  • the metal terminal 39 and the terminal 41 are connected by another lead wire via a network capacitor 42.
  • the present invention is a speaker in which the number of components is reduced.
  • the speaker of the present invention has a magnetic circuit, a diaphragm, a voice coil, a front cover, and a back cover.
  • the voice coil is coupled to the back surface of the diaphragm.
  • One end of the voice coil is disposed in the magnetic gap of the magnetic circuit.
  • the front cover is coupled to the front surface of the diaphragm so as to cover the diaphragm.
  • the back cover is coupled to the back surface of the magnetic circuit so as to cover the magnetic circuit.
  • the outer peripheral portion of the diaphragm is sandwiched between the front cover and the back cover. The front cover and the back cover are fitted. There is no frame.
  • the number of components can be reduced by eliminating the frame. Furthermore, it is possible to reduce the weight and price of the speaker.
  • FIG. 1 is an exploded perspective view of a speaker according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the speaker shown in FIG.
  • FIG. 3 is a cross-sectional view showing a method of manufacturing the speaker shown in FIG.
  • FIG. 4 is a perspective view showing a manufacturing method of the speaker shown in FIG.
  • FIG. 5 is a cross-sectional view showing a method of manufacturing the speaker shown in FIG.
  • FIG. 6 is a perspective view showing a manufacturing method of the speaker shown in FIG.
  • FIG. 7 is a cross-sectional view showing a method of manufacturing the speaker shown in FIG.
  • FIG. 8 is a cross-sectional view showing a method of manufacturing the speaker shown in FIG.
  • FIG. 9 is a rear perspective view of the speaker shown in FIG.
  • FIG. 10 is an exploded perspective view of a conventional speaker.
  • FIG. 11 is a cross-sectional view of the speaker shown in FIG.
  • FIG. 1 is an exploded perspective view of a speaker 50 according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view of the speaker 50.
  • FIG. 3 to 8 are a cross-sectional view and a perspective view showing a method of manufacturing the speaker 50
  • FIG. 9 is a perspective view of the speaker 50.
  • the speaker 50 includes a magnetic circuit 8, a diaphragm 2, a voice coil 3, a front cover 1, and a back cover 7.
  • the voice coil 3 is coupled to the back surface of the diaphragm 2.
  • One end of the voice coil 3 is disposed in the magnetic gap 8 ⁇ / b> A of the magnetic circuit 8.
  • the front cover 1 is coupled to the front surface of the diaphragm 2 so as to cover the diaphragm 2.
  • the back cover 7 is coupled to the back surface of the magnetic circuit 8 so as to cover the magnetic circuit 8.
  • the outer periphery of the diaphragm 2 is sandwiched between the front cover 1 and the back cover 7.
  • the front cover 1 and the back cover 7 are fitted. There is no frame.
  • the lead wire 9 of the voice coil 3 is directly soldered to the metal terminal 17 of the terminal 11 without relay connection as shown in FIG.
  • a simple input signal transmission path can be realized, it is possible to reduce defects due to adhesive displacement at the time of assembly and coupling, disconnection at the time of wiring, and the like. Furthermore, it is possible to reduce the weight and price of the speaker.
  • the front cover 1 is made of resin. By configuring the front cover 1 with resin, the degree of freedom in shape can be improved. Moreover, the resin front cover 1 can be formed in a short production time by injection molding. For this reason, the front cover 1 having a complicated shape can be obtained at low cost.
  • an equalizer 1A may be integrated with the upper portion of the front cover 1.
  • the front cover 1 can equalize the phase of the sound radiated from the diaphragm 2 in addition to protecting the diaphragm 2. Thereby, the frequency characteristic of the speaker 50 can be flattened.
  • the front cover 1 may be made of a metal material. In this case, the strength and heat resistance of the front cover 1 can be improved. Thereby, quality and reliability can be improved.
  • the back cover 7 is made of resin. By configuring the back cover 7 with resin, the degree of freedom in shape can be improved.
  • the resin back cover 7 can be formed in a short production time by injection molding. For this reason, the back cover 7 having a complicated shape can be realized at low cost.
  • a terminal 11 having a connector function may be provided integrally with the back cover 7.
  • Productivity can be improved by providing the terminal 11 integrally with the back cover 7.
  • productivity can be further improved by simultaneously injection molding the back cover 7 and the terminal 11 with the same resin.
  • by integrating the back cover 7 and the terminal 11 and performing injection molding it is possible to eliminate backlash and to eliminate abnormal noise such as flickering as compared with the case where they are individually joined.
  • the metal terminal 17 of the terminal 11 may be insert-molded on the back cover 7. With this configuration, the productivity can be further improved and the terminal 17 can be prevented from coming off or coming off.
  • the back cover 7 may be formed with a claw-like protrusion 7a having a spring property as a holding part of the magnetic circuit.
  • the protrusion 7a is provided so as to protrude from the upper end of the back cover 7 to the inner periphery. With this configuration, the magnetic circuit 8 can be easily and reliably held by the back cover 7.
  • the protrusions 7a are preferably formed at least at three locations on the back cover 7. It is preferable that the projections 7a formed at the three locations are formed at an equal angle from the center of the speaker, that is, at an angle of 120 degrees. With this configuration, the magnetic circuit 8 can be stably held without inclination or rattling. Furthermore, since the magnetic circuit 8 can be stably held without tilting or rattling with the minimum protrusion 7a, productivity can be improved and the speaker 50 can be made inexpensive.
  • a holding portion 7 b may be formed on the back cover 7.
  • the capacitor 16 can be stably held. Further, productivity can be further improved by simultaneously injection molding the back cover 7 and the holding portion 7b with the same resin.
  • the front cover 1 is formed so as to cover the diaphragm 2. And it has the crossover part 1c (FIG. 1) fitted with the back cover 7. As shown in FIG.
  • the back cover 7 also has a similar crossover portion 7c (FIG. 1).
  • the crossover portion 1 c is formed so as to cover the side surface portion of the magnetic circuit 8. Therefore, the front cover 1 can protect the diaphragm 2 and the magnetic circuit 8 in addition to holding the diaphragm 2 and the magnetic circuit 8. Therefore, the strength and quality of the speaker 50 can be improved.
  • the front cover 1 is formed with a fixing portion 1d
  • the back cover 7 is formed with a fixing portion 7e.
  • the adhering portion 1 d is a concave portion such as a through hole or a depression formed in the front cover 1
  • the adhering portion 7 e is a convex portion such as a protrusion formed in the rear cover 7.
  • the front cover 1 and the back cover 7 are couple
  • the adhering portion 1d and the adhering portion 7e are preferably formed at three locations on the front cover 1 and the rear cover 7, respectively. By setting it as this structure, the front cover 1 and the back cover 7 can be stabilized and combined without inclination.
  • the fixing part 1d and the fixing part 7e may be formed in more places such as four or five. By adopting this configuration, it is possible to further stabilize and bond without inclination, and to realize a strong bond.
  • the front cover 1 may be formed with protrusions such as protrusions
  • the back cover 7 may be formed with recesses such as through holes and depressions. Then, the convex portion of the front cover 1 and the concave portion of the back cover 7 may be fitted and combined.
  • the fixing part of the front cover 1 and the back cover 7 may have any configuration.
  • a notched guide 1f and a protruding guide 7g which are positioning guides for positioning the front cover 1 and the back cover 7 in the rotational direction are provided.
  • the rotation direction is a direction in which the center of the speaker 50 is rotated about a central axis that penetrates in the vertical direction. That is, the outer periphery of the diaphragm 2 is circular, and the rotation direction is a direction along the outer periphery of the diaphragm 2.
  • the guide 1 f is provided in the crossover portion 1 c of the front cover 1
  • the guide 7 g is provided in the crossover portion 7 c of the back cover 7.
  • the front cover 1 and the rear cover 7 are positioned in the rotational direction with respect to each other by fitting the guide 1f and the guide 7g. Thereafter, the back cover 7 is inserted into the front cover 1, and the back cover 7 and the front cover 1 are slid and press-fitted until the fixing portions 1d and 7e are fitted.
  • the front cover 1 may be provided with a protruding guide and the back cover 7 may be provided with a notched guide.
  • the guide 1f and the guide 7g may have any shape as long as they can be positioned in the rotational direction.
  • the voice coil 3 has lead wires 9 drawn from the voice coil 3 as shown in FIG. Further, the front cover 1 is provided with a groove 10. A lead wire 9 is inserted into the groove 10 of the front cover 1.
  • This configuration facilitates the routing of the lead wire 9 and the soldering of the terminal 11 to the metal terminal 17. And productivity can be improved.
  • the lead wire 9 is not disconnected by being sandwiched between the front cover 1 and the back cover 7, so that the quality can be stabilized.
  • the back cover 7 is also provided with a groove 18 (FIG. 1).
  • the lead wire 9 is inserted through the groove 18.
  • This configuration facilitates the routing of the lead wire 9 and the soldering of the terminal 11 to the metal terminal 17. And productivity can be improved.
  • the lead wire 9 is not disconnected by being sandwiched between the front cover 1 and the back cover 7, so that the quality can be stabilized.
  • a concave forming guide 12 for forming the lead wire 9 is provided in the vicinity of these grooves, and the lead wire 9 is formed by the forming jig 13.
  • the lead wire 9 is formed with an appropriate margin so as not to be pulled even if it is pulled during operation of the speaker. For this reason, it is possible to prevent the lead wire 9 from being pulled and disconnected during the operation of the speaker.
  • a partition 14 for protecting the lead wire 9 is provided on the outer peripheral portion of the groove 18 of the back cover 7.
  • the partition 14 is provided in a protruding shape on the outer periphery of the metal terminal 17 integrally with the back cover 7. With this configuration, it is possible to prevent the lead wire 9 from being disconnected by contact from the outside.
  • the shape of the grooves 10 and 18 may be a hollow shape or a notch shape, and can protect the lead wire 9 drawn from the voice coil 3 and prevent disconnection. Any shape can be used. That is, the shapes of the grooves 10 and 18 are designed in consideration of protection of the lead wires 9 drawn from the voice coil 3 and productivity.
  • the lead wire 9 is pulled out from the voice coil 3 and formed with an appropriate margin.
  • the lead wire 9 is directly connected to the metal terminal 17 of the terminal 11 by soldering or the like.
  • the capacitor 16 is held by a capacitor holding portion 7b (FIG. 2).
  • the capacitor 16 is connected to the metal terminal 17 of the terminal 11 by soldering. That is, the capacitor 16 is connected to the voice coil 3 via the metal terminal 17 and the lead wire 9.
  • the number of component parts can be reduced by eliminating the frame.
  • the lead wire 9 of the voice coil 3 is directly pulled out without relay connection and soldered to the metal terminal 17 of the terminal 11 by the configuration without the frame.
  • the number of component parts can be reduced. Therefore, since a simple input signal transmission path can be realized, it is possible to reduce defects due to adhesive displacement during assembly and connection, disconnection during wiring, and the like. Furthermore, weight reduction and price reduction can be achieved by reducing the number of speaker components and simplifying the configuration.
  • the method of manufacturing the speaker 50 includes a step of assembling the magnetic circuit 8, a step of coupling the diaphragm 2 and the voice coil 3, a step of holding the magnetic circuit 8 on the back cover 7, and a front cover covering the outer periphery of the diaphragm 2. 1 and the back cover 7, a step of forming the lead wire 9 of the voice coil 3, and a step of fitting the front cover 1 and the back cover 7 together.
  • the yoke 6, the magnet 5 and the plate 4 are assembled. That is, the magnetic circuit 8 is assembled by bonding the yoke 6, the magnet 5 and the plate 4 with an adhesive.
  • the magnetic circuit 8 is inserted into the back cover 7 and held.
  • the protrusion 7 a provided on the back cover 7 holds the magnetic circuit 8.
  • the diaphragm 2 and the voice coil 3 are joined using an adhesive while using the jig 15 in another process. Then, after assembling the diaphragm 2 and the voice coil 3, the front cover 1 is coupled to the diaphragm 2 using an adhesive.
  • the lead wire 9 of the voice coil 3 is inserted into the groove 10 of the front cover 1 and formed.
  • the assembly of the diaphragm 2 and the voice coil 3 is joined to the assembly of the back cover 7 and the magnetic circuit 8.
  • the front cover 1 and the back cover 7 are fitted together, and the outer peripheral portion of the diaphragm 2 is sandwiched between the front cover 1 and the back cover 7 to be coupled.
  • the forming jig 13 is pressed against the forming guide 12 provided in the groove of the front cover 1 to form the lead wire 9 of the voice coil 3 with an appropriate margin. Then, the lead wire 9 of the voice coil 3 is soldered to the metal terminal 17 of the terminal 11.
  • a capacitor 16 is coupled to the back cover 7. Then, the lead wire of the capacitor 16 is soldered to the metal terminal 17 of the terminal 11.
  • the number of components such as a frame can be reduced. Therefore, a simple input signal transmission path can be realized. For this reason, it is possible to reduce defects due to adhesive displacement at the time of assembly and connection, disconnection at the time of wiring, and the like, and it is possible to realize a speaker manufacturing method with high productivity.
  • the speaker can be reduced in weight.
  • the present invention is useful for speakers for in-vehicle use and AV use and a method for manufacturing the same.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

La présente invention se rapporte à un haut-parleur qui comprend : un circuit magnétique ; une membrane ; une bobine acoustique ; une partie de boîtier avant ; et une partie de boîtier arrière. Le haut-parleur a une structure caractérisée en ce que : la partie de boîtier avant est formée de sorte à couvrir la membrane ; la partie de boîtier arrière est formée de sorte à couvrir le circuit magnétique ; la membrane est prise en sandwich au niveau de sa périphérie extérieure par la partie de boîtier avant et la partie de boîtier arrière ; et la partie de boîtier avant et la partie de boîtier arrière sont assemblées l'une à l'autre.
PCT/JP2012/003950 2011-06-21 2012-06-18 Haut-parleur Ceased WO2012176420A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011136902A JP2013005360A (ja) 2011-06-21 2011-06-21 スピーカおよびその製造方法
JP2011-136902 2011-06-21

Publications (1)

Publication Number Publication Date
WO2012176420A1 true WO2012176420A1 (fr) 2012-12-27

Family

ID=47422278

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/003950 Ceased WO2012176420A1 (fr) 2011-06-21 2012-06-18 Haut-parleur

Country Status (2)

Country Link
JP (1) JP2013005360A (fr)
WO (1) WO2012176420A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014103278A1 (fr) * 2012-12-28 2014-07-03 パナソニック株式会社 Haut-parleur, appareil électronique utilisant le haut-parleur, et appareil mobile

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102070848B1 (ko) * 2018-11-21 2020-01-29 박만금 스피커부재연결구조

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121571U (fr) * 1979-02-20 1980-08-28
JPS61116495U (fr) * 1984-12-28 1986-07-23
JP2001333498A (ja) * 2000-05-22 2001-11-30 Meisei Sangyo:Kk スピーカ及びその製造方法
JP2002027590A (ja) * 2000-07-11 2002-01-25 Foster Electric Co Ltd ダイナミックスピーカの磁気回路
JP2004266424A (ja) * 2003-02-28 2004-09-24 Citizen Electronics Co Ltd マイクロスピーカ
JP2006324967A (ja) * 2005-05-19 2006-11-30 Yen-Shan Chen 音声調整モジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121571U (fr) * 1979-02-20 1980-08-28
JPS61116495U (fr) * 1984-12-28 1986-07-23
JP2001333498A (ja) * 2000-05-22 2001-11-30 Meisei Sangyo:Kk スピーカ及びその製造方法
JP2002027590A (ja) * 2000-07-11 2002-01-25 Foster Electric Co Ltd ダイナミックスピーカの磁気回路
JP2004266424A (ja) * 2003-02-28 2004-09-24 Citizen Electronics Co Ltd マイクロスピーカ
JP2006324967A (ja) * 2005-05-19 2006-11-30 Yen-Shan Chen 音声調整モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014103278A1 (fr) * 2012-12-28 2014-07-03 パナソニック株式会社 Haut-parleur, appareil électronique utilisant le haut-parleur, et appareil mobile

Also Published As

Publication number Publication date
JP2013005360A (ja) 2013-01-07

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