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WO2012175627A3 - Thermal management system with variable-volume material - Google Patents

Thermal management system with variable-volume material Download PDF

Info

Publication number
WO2012175627A3
WO2012175627A3 PCT/EP2012/062001 EP2012062001W WO2012175627A3 WO 2012175627 A3 WO2012175627 A3 WO 2012175627A3 EP 2012062001 W EP2012062001 W EP 2012062001W WO 2012175627 A3 WO2012175627 A3 WO 2012175627A3
Authority
WO
WIPO (PCT)
Prior art keywords
management system
thermal management
connect
heat
variable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/062001
Other languages
French (fr)
Other versions
WO2012175627A2 (en
Inventor
Olivier Dellea
Philippe Coronel
Jérôme GAVILLET
Emmanuel OLLIER
Helga SZAMBOLICS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to US14/128,266 priority Critical patent/US20140158334A1/en
Priority to EP12728606.0A priority patent/EP2724108A2/en
Publication of WO2012175627A2 publication Critical patent/WO2012175627A2/en
Publication of WO2012175627A3 publication Critical patent/WO2012175627A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/02—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature
    • G05D23/028—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature with fusing sensing element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/008—Variable conductance materials; Thermal switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Resistance Heating (AREA)

Abstract

Thermal management system intended to be fitted between a hot source (SC) and a cold source (SF), comprising a first (2) and a second (4) conductor of heat, a thermal switch (6) able to connect thermally, or not connect, the first (2) and second (4) conductors of heat, said thermal switch (6) comprising at least one phase-change material (12), said material (12) being able to connect the first (2) and second (4) conductor by varying its volume, said thermal switch (6) comprising control means intended to supply heat energy to the phase-change material (12) in order to change the connection status. Connection is made when the hot source (SC) exceeds a critical temperature, connection allowing a heat flux to be established between the hot source (SC) and the cold source (SF).
PCT/EP2012/062001 2011-06-22 2012-06-21 Thermal management system with variable-volume material Ceased WO2012175627A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US14/128,266 US20140158334A1 (en) 2011-06-22 2012-06-21 Thermal management system with variable-volume material
EP12728606.0A EP2724108A2 (en) 2011-06-22 2012-06-21 Thermal management system with variable-volume material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1155511 2011-06-22
FR1155511A FR2977121B1 (en) 2011-06-22 2011-06-22 THERMAL MANAGEMENT SYSTEM WITH VARIABLE VOLUME MATERIAL

Publications (2)

Publication Number Publication Date
WO2012175627A2 WO2012175627A2 (en) 2012-12-27
WO2012175627A3 true WO2012175627A3 (en) 2013-02-21

Family

ID=46321044

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/062001 Ceased WO2012175627A2 (en) 2011-06-22 2012-06-21 Thermal management system with variable-volume material

Country Status (4)

Country Link
US (1) US20140158334A1 (en)
EP (1) EP2724108A2 (en)
FR (1) FR2977121B1 (en)
WO (1) WO2012175627A2 (en)

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FR2934709B1 (en) * 2008-08-01 2010-09-10 Commissariat Energie Atomique THERMAL EXCHANGE STRUCTURE AND COOLING DEVICE HAVING SUCH A STRUCTURE.
FR2961956B1 (en) 2010-06-23 2012-08-17 Commissariat Energie Atomique THERMOGENERATOR HAVING PHASE CHANGE MATERIALS
FR2985249B1 (en) 2012-01-02 2014-03-07 Commissariat Energie Atomique METHOD OF TRANSFERRING OBJECTS TO A SUBSTRATE USING A COMPACT PARTICLE FILM
FR2986721B1 (en) 2012-02-10 2014-06-27 Commissariat Energie Atomique METHOD FOR DEPOSITING A PARTICLE FILM ON A SUBSTRATE VIA A LIQUID CONVEYER, COMPRISING A STRUCTURING STEP OF THE FILM ON THE SUBSTRATE
FR2986722B1 (en) 2012-02-10 2014-03-28 Commissariat Energie Atomique METHOD FOR TRANSFERRING OBJECTS TO A SUBSTRATE USING A COMPACT PARTICLE FILM, WITH A CONNECTER IMPLEMENTATION STEP ON THE OBJECTS
FR2986720B1 (en) 2012-02-10 2014-03-28 Commissariat Energie Atomique METHOD FOR DEPOSITING PARTICLES ON A SUBSTRATE, COMPRISING A STEP FOR STRUCTURING A PARTICLE FILM ON A LIQUID CONVEYOR
FR2986908B1 (en) 2012-02-14 2014-03-28 Commissariat Energie Atomique DEVICE FOR RECOVERING AND CONVERTING THERMAL ENERGY IN ELECTRICAL ENERGY
FR2995228B1 (en) 2012-09-10 2014-09-05 Commissariat Energie Atomique METHOD FOR FORMING A PARTICLE FILM ON A CARRIER LIQUID, WITH DISPLACEMENT OF AN INCLINED PARTICLE COMPRESSION RAMP
FR3005432B1 (en) 2013-05-13 2015-06-05 Commissariat Energie Atomique METHOD FOR DEPOSITING A COMPACT PARTICLE FILM ON THE INNER SURFACE OF A WORKPIECE HAVING A HOLLOW DEDICATED BY THIS INTERNAL SURFACE
FR3006111B1 (en) 2013-05-24 2016-11-25 Commissariat Energie Atomique DEVICE FOR CONVERTING THERMAL ENERGY IN ELECTRICAL ENERGY WITH THERMO-SENSITIVE MOLECULES
FR3008690B1 (en) 2013-07-22 2016-12-23 Commissariat Energie Atomique DEVICE COMPRISING A FLUID CHANNEL PROVIDED WITH AT LEAST ONE MICRO OR NANOELECTRONIC SYSTEM AND METHOD OF MAKING SUCH A DEVICE
FR3008691B1 (en) 2013-07-22 2016-12-23 Commissariat Energie Atomique DEVICE COMPRISING A FLUID CHANNEL PROVIDED WITH AT LEAST ONE MICRO OR NANOELECTRONIC SYSTEM AND METHOD OF MAKING SUCH A DEVICE
FR3011752B1 (en) 2013-10-11 2015-12-25 Commissariat Energie Atomique INSTALLATION AND METHOD WITH IMPROVED EFFICIENCY OF FORMING COMPACT PARTICLE FILM AT THE SURFACE OF A CARRIER LIQUID
JP6392015B2 (en) * 2014-07-18 2018-09-19 株式会社東芝 Electronics
FR3026288B1 (en) * 2014-09-30 2017-02-24 Seb Sa HANDLE COMPRISING A THERMOELECTRIC GENERATOR
FR3026287B1 (en) * 2014-09-30 2017-02-24 Seb Sa REMOVABLE HANDLE COMPRISING A THERMOELECTRIC GENERATOR
FR3027449B1 (en) 2014-10-21 2017-10-20 Commissariat Energie Atomique IMPROVED METHOD OF MAKING INTERCONNECTIONS FOR A 3D INTEGRATED CIRCUIT
US10386127B2 (en) 2015-09-09 2019-08-20 General Electric Company Thermal management system
US10209009B2 (en) 2016-06-21 2019-02-19 General Electric Company Heat exchanger including passageways
JP6662239B2 (en) * 2016-08-08 2020-03-11 株式会社デンソー Thermal switch device
FR3059152B1 (en) * 2016-11-21 2019-01-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives THERMAL TRANSFER DEVICE, ELECTRICAL CONNECTION DEVICE AND ELECTRONIC DEVICE
KR102701849B1 (en) * 2017-01-26 2024-09-02 삼성전자주식회사 Apparatus and method of thermal management using adaptive thermal resistance and thermal capacity
CN107168415B (en) * 2017-06-01 2020-03-31 西南电子技术研究所（中国电子科技集团公司第十研究所） Quick response phase change temperature control device
US10375855B2 (en) * 2017-11-08 2019-08-06 Honeywell International Inc. Systems and methods for zero power automatic thermal regulation
JP7133020B2 (en) * 2017-12-29 2022-09-07 エアバス ディフェンス アンド スペース，エス．エー． High conductance thermal link
US10292307B1 (en) * 2018-01-04 2019-05-14 Juniper Networks, Inc. Thermal heatsink
CN108777927B (en) * 2018-06-26 2019-11-26 联想(北京)有限公司 A kind of radiator, method and electronic equipment
CN109060495B (en) * 2018-09-11 2024-03-15 四川省机械研究设计院(集团)有限公司 Device capable of adjusting thermal resistance
US11519643B2 (en) * 2019-07-15 2022-12-06 Kiutra Gmbh Thermal switch
DE102019123908A1 (en) * 2019-09-05 2021-03-11 Karl Storz Se & Co. Kg Device for heat dissipation and use of such a device
DE102019216924A1 (en) * 2019-11-04 2021-05-06 Robert Bosch Gmbh Laser emitter arrangement and LiDAR system
US11352120B2 (en) 2019-11-15 2022-06-07 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260976B2 (en) 2019-11-15 2022-03-01 General Electric Company System for reducing thermal stresses in a leading edge of a high speed vehicle
US11427330B2 (en) 2019-11-15 2022-08-30 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11267551B2 (en) 2019-11-15 2022-03-08 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260953B2 (en) 2019-11-15 2022-03-01 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US10866036B1 (en) 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch
US11745847B2 (en) 2020-12-08 2023-09-05 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11407488B2 (en) 2020-12-14 2022-08-09 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11577817B2 (en) 2021-02-11 2023-02-14 General Electric Company System and method for cooling a leading edge of a high speed vehicle
CN113097599B (en) * 2021-04-07 2022-07-01 华北电力大学 Passive battery thermal regulator, method and management system based on supercooled phase change material
US12001228B2 (en) * 2021-04-07 2024-06-04 Alliance For Sustainable Energy, Llc Thermal diode and thermal switch for bi-directional heat transfer in building envelopes

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FR2392348A1 (en) * 1977-05-28 1978-12-22 Dornier System Gmbh Regulated heat transfer thermal tube with capillary - utilises thermal resistor keeping tube temp. below heat source temp.
US4858678A (en) * 1988-06-02 1989-08-22 The Boeing Company Variable heat conductance heat exchanger
US5379601A (en) * 1993-09-15 1995-01-10 International Business Machines Corporation Temperature actuated switch for cryo-coolers
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Also Published As

Publication number Publication date
FR2977121A1 (en) 2012-12-28
US20140158334A1 (en) 2014-06-12
WO2012175627A2 (en) 2012-12-27
FR2977121B1 (en) 2014-04-25
EP2724108A2 (en) 2014-04-30

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