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WO2012165125A1 - Lampe à diodes électroluminescentes (led) et cuiseur la comportant - Google Patents

Lampe à diodes électroluminescentes (led) et cuiseur la comportant Download PDF

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Publication number
WO2012165125A1
WO2012165125A1 PCT/JP2012/062220 JP2012062220W WO2012165125A1 WO 2012165125 A1 WO2012165125 A1 WO 2012165125A1 JP 2012062220 W JP2012062220 W JP 2012062220W WO 2012165125 A1 WO2012165125 A1 WO 2012165125A1
Authority
WO
WIPO (PCT)
Prior art keywords
led lamp
heating chamber
substrate
emitting diode
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/062220
Other languages
English (en)
Japanese (ja)
Inventor
直紀 杉村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011125419A external-priority patent/JP2012253232A/ja
Priority claimed from JP2011125426A external-priority patent/JP2012251738A/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2012165125A1 publication Critical patent/WO2012165125A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/008—Illumination for oven cavities
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/6444—Aspects relating to lighting devices in the microwave cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/30—Lighting for domestic or personal use
    • F21W2131/307—Lighting for domestic or personal use for ovens
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling

Definitions

  • the present invention relates to an LED (light emitting diode) lamp and a cooking device provided with the same.
  • JP 2010-56059 A Patent Document 1
  • This LED lamp includes a substrate on which a light emitting diode element is mounted, and a heat sink on which the substrate is mounted.
  • the upper surface of the substrate and the heat sink, that is, the substrate side is covered with a substantially hemispherical transparent member, and the space between the transparent member and the heat sink is sealed.
  • a connection terminal is attached to the lower surface of the heat sink, that is, the side opposite to the substrate side via an insulating portion made of synthetic resin.
  • the heat sink has a shape in which the upper surface is a flat surface, the lower surface is a concave surface, the contour of the side surface is a part of a rotating hyperboloid, and the heat radiation fins project radially.
  • an insertion hole is provided in the center of the heat sink, and the light emitting diode element and the connection terminal are electrically connected by a wiring inserted through the insertion hole.
  • heat generated from the light emitting diode element is radiated into the air from the radial heat radiation fins of the heat sink.
  • an object of the present invention is to provide an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life, and a cooking device equipped with the LED lamp.
  • the present inventors pay attention to the presence of metal plates such as housings and cases in devices that generate high-temperature atmospheres such as heating cookers, video equipment, welding devices, heat treatment devices, and furnaces. We have intensively studied whether it can be used effectively for heat dissipation without interfering with the lamp illumination ability.
  • the inventor of the present invention invented an LED lamp that can use the metal plate very effectively for heat dissipation without impeding the illumination capability.
  • the LED lamp of the present invention is A substrate, A light-emitting diode element mounted on the first surface of the substrate; A transparent or translucent member covering the light emitting diode element and the first surface side of the substrate; A heat sink having a flat adhesion plane in close contact with the second surface opposite to the first surface of the substrate, and a flat heat radiation plane provided on the opposite side of the adhesion plane;
  • the heat sink includes an extension direction of the heat radiation plane of the heat sink or an oblique direction with respect to the extension direction and a connection terminal electrically connected to the light emitting diode element.
  • the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the adhesion plane of the heat sink.
  • the contact flat surface of the heat sink is a flat surface in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the heat sink can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the heat sink through the substrate.
  • the heat dissipation plane of the heat sink is flat, and thus the high temperature atmosphere is generated.
  • the heat sink flat surface of the heat sink can be easily brought into close contact with the surface of the metal plate of the device, and the heat sink is a simple flat plate on the second surface side, that is, the back surface side of the substrate and on the light emitting diode element emission side. Therefore, the contact area between the heat radiation flat surface of the heat sink and the surface of the metal plate can be increased with a simple and compact structure without impeding the illumination capability.
  • the heat sink can efficiently dissipate heat from the light emitting diode element by heat conduction to the metal plate that directly contacts the heat sink.
  • the metal plate is, for example, a casing or a housing, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, this LED lamp can be used in a high temperature atmosphere and has a long life.
  • connection terminal since the connection terminal extends in the extending direction of the heat radiation plane of the heat sink or in an oblique direction with respect to the extension direction, the connection terminal should not be interposed between the surface of the metal plate and the heat radiation plane of the heat sink. it can.
  • the connecting terminal extends in an oblique direction with respect to the extending direction of the heat radiation plane of the heat sink where the connecting terminal is in close contact with the metal plate or the extending direction, the connecting terminal is not easily detached by a reaction force from the metal plate.
  • the LED lamp of the present invention has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
  • a thickness which is a dimension between the adhesion plane of the heat sink and the heat radiation plane, is smaller than the vertical and horizontal dimensions of the heat sink.
  • the “vertical dimension” refers to the long side of the outline with the outline of the heat radiation plane being substantially rectangular, and the “lateral dimension” refers to the short side of the outline.
  • the heat radiation plane and the contact plane are parallel because the structure becomes simple.
  • the contact plane 1021 and the heat radiation plane may not be parallel to 1022 but may be inclined.
  • the thickness dimension between the contact plane 1021 and the heat radiation plane 1022 refers to the dimension D between the central points in the tilt direction.
  • the inclination angle of the contact flat surface 1021 is exaggerated and increased.
  • the thickness which is the dimension between the adhesion plane and the heat radiation plane of the heat sink, is smaller than the vertical and horizontal dimensions of the heat sink, the heat radiation path between the adhesion plane and the heat radiation plane is Shorter. Therefore, the heat sink can quickly dissipate heat by quickly transferring heat from the light emitting diode element to the heat radiation plane.
  • the light emitting diode element and the connection terminal are connected by wiring on the substrate that passes outside without passing through the inside of the heat sink.
  • the light emitting diode element and the connection terminal are connected by the wiring on the substrate that passes outside without passing through the inside of the heat sink, it is possible to prevent the heat dissipation path of the heat sink from being reduced. it can.
  • the heat sink is provided with an insertion hole as in the conventional example, and the light emitting diode element and the connection terminal are electrically connected by the wiring inserted through the insertion hole, the heat dissipation path of the heat sink is equivalent to the insertion hole. It will be less.
  • the LED lamp of one embodiment is An attachment member insulated from the connection terminal is provided.
  • the LED lamp can be fixed by the mounting member so that the heat radiation plane is in close contact with the metal plate.
  • the attachment destination of the attachment member is a metal
  • the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
  • the mounting member is a mounting plate that extends in a direction intersecting the extending direction of the connection terminal in the vicinity of the connection terminal and has a mounting hole.
  • the mounting plate when, for example, a screw inserted into the mounting hole of the mounting plate is tightened and the mounting plate is mounted to the mounting destination, the mounting plate intersects the direction in which the connection terminal extends in the vicinity of the connection terminal.
  • the connection terminal is fixed to the connection destination by tightening a screw
  • the LED lamp is fixed in two directions, that is, the fixing direction by the connection terminal and the fixing direction by the mounting plate. It has the advantage of being difficult.
  • the heating cooker of the present invention is A casing, A heating chamber provided in the casing and containing an object to be heated;
  • the LED lamp of the present invention that is disposed between the casing and the heating chamber and illuminates the heating chamber,
  • the heat radiation plane of the heat sink of the LED lamp is in close contact with a metal plate.
  • the cooking device of the present invention is A casing, A heating chamber provided in the casing and containing an object to be heated; An LED lamp disposed between the casing and the heating chamber and illuminating the heating chamber; A metal attached portion to which the LED lamp is attached;
  • the LED lamp is A substrate having a first surface on the heating chamber side and a flat second surface on the opposite side of the heating chamber;
  • a light emitting diode element mounted on the first surface of the substrate;
  • a transparent or translucent member covering the light emitting diode element and the first surface side of the substrate;
  • the attached portion has a flat contact plane that is in close contact with the second surface of the substrate.
  • the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the contact flat surface of the mounted portion.
  • the contact flat surface of the attached portion is a flat surface that is in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the attached portion can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the mounted portion through the substrate.
  • the mounted portion is on the second surface side, that is, the back surface side of the substrate, and not on the light emitting diode element emission side. Therefore, the illumination capability of the LED lamp does not decrease.
  • the LED lamp does not have a reduced illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
  • the life of the LED lamp can be extended, the number of replacement of the LED lamp is reduced, and the running cost can be reduced.
  • connection terminal extends in the extending direction of the second surface of the substrate or in an oblique direction with respect to the extending direction, the connection terminal does not enter between the second surface of the substrate and the contact flat surface of the attached portion.
  • the substrate receives a reaction force in a direction perpendicular to the extending direction of the second surface from the mounted portion, but the connection terminal is inclined with respect to the extending direction of the second surface of the substrate or the extending direction thereof. Therefore, the connection terminal is difficult to come off due to the reaction force.
  • the LED lamp includes a mounting member that is insulated from the connection terminal.
  • the LED lamp since the LED lamp includes an attachment member, the LED lamp can be attached to the attachment portion so that the second surface of the substrate is in close contact with the contact flat surface of the attachment portion.
  • the attachment destination of the attachment member is a metal
  • the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
  • the attachment member is an attachment plate extending in the extending direction of the second surface of the substrate and having an attachment hole.
  • the second surface of the substrate extends in the extending direction. Can be pressed against the mounted portion. Therefore, the adhesion force between the second surface of the substrate and the adhesion plane of the attached portion can be increased.
  • the mounting plate is a part of the substrate.
  • the mounting member is a part of the substrate, the number of parts can be reduced.
  • the mounted portion is a part of the mounting bracket of the LED lamp.
  • the mounted portion is a part of the mounting bracket of the LED lamp, the surface area of the mounting bracket is large, and the cooling capacity of the LED lamp can be increased.
  • the attached portion is a part of the casing.
  • the attached portion is a part of the casing, the surface area of the casing is further increased, and the cooling capacity of the LED lamp can be increased.
  • the light emitting diode element can be sufficiently cooled, and an LED lamp having a long life, simple, inexpensive and compact structure can be provided.
  • the cooking device of the present invention includes the LED lamp of the present invention, so that the number of replacement of the LED lamp is reduced, so that the running cost can be reduced.
  • the present invention it is possible to provide a cooking device equipped with an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life.
  • FIG. 1 is a schematic side view of an LED lamp according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view seen from the direction of the arrow in FIG.
  • FIG. 3 is a schematic diagram for explaining the mounting state of the LED lamp of the first embodiment.
  • FIG. 4 is the perspective view seen from the front diagonally upper direction of the heating cooker of 2nd Embodiment of this invention.
  • FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker.
  • FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • FIG. 7 is a control block diagram of the cooking device.
  • FIG. 8 is a perspective view of the heating cooker with the door and the casing removed, as viewed from the rear and diagonally above.
  • FIG. 9 is a perspective view of the heating cooker with the door and casing removed, as viewed from the front and diagonally above.
  • FIG. 10 is a schematic view of an upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above.
  • FIG. 11 is a schematic diagram of a longitudinal section viewed from the line XI-XI in FIG.
  • FIG. 12 is a schematic diagram of a main part of an LED lamp according to an embodiment of the present invention.
  • FIG. 13 is a schematic side view of an LED lamp according to a third embodiment of the present invention.
  • FIG. 14 is the perspective view seen from the front diagonally upper direction of the heating cooker of the said 3rd Embodiment.
  • FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker according to the third embodiment.
  • FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the heating cooker according to the third embodiment.
  • FIG. 17 is a control block diagram of the cooking device.
  • FIG. 18 is a perspective view of the heating cooker with the door and casing removed, as viewed from the upper rear side.
  • FIG. 19 is a perspective view of the heating cooker with the door and casing removed, as seen from the front and obliquely above.
  • FIG. 20 is a schematic view of the upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above.
  • FIG. 21 is a schematic view taken along line XXI-XXI in FIG. FIG.
  • FIG. 22 is a schematic view of the LED lamp attached to the frame as viewed from the connection terminal side.
  • FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
  • FIG. 1 is a schematic view of an LED lamp 1 according to a first embodiment of the present invention as viewed from the side.
  • the LED lamp 1 includes a substantially rectangular aluminum heat sink 2 as an example of a heat sink, a glass epoxy substrate 3 as an example of a substrate, and two light emitting diode elements 4 (only one is visible in FIG. 1). ) Of substantially rectangular plate-like connection terminals 5, 5, a substantially rectangular plate-like attachment plate 6 as an example of an attachment member, a cover glass 7 as an example of a transparent or translucent member, and a metal base 8. And.
  • the aluminum heat sink 2 has a flat adhesion plane 21 and a flat heat radiation plane 22 on the opposite side of the adhesion plane 21.
  • the thickness of the aluminum heat sink 2 (the dimension between the contact plane 21 and the heat radiation plane 22) is smaller than the vertical and horizontal dimensions of the aluminum heat sink 2.
  • the heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed. Further, the contact plane 21 and the heat radiation plane 22 are substantially parallel to each other.
  • the vertical dimension of the aluminum heat sink 2 corresponds to the horizontal dimension in FIG.
  • the horizontal dimension of the aluminum heat sink 2 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
  • the light emitting diode element 4 is mounted on the first surface 31 of the glass epoxy substrate 3.
  • the flat contact surface 21 of the heat sink 2 is in close contact with the second surface 32 opposite to the first surface 31 of the glass epoxy substrate 3.
  • the glass epoxy substrate 3 is provided with wiring 33 for supplying current from the connection terminals 5 and 5 to the light emitting diode element 4. That is, the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes outside without passing through the inside of the aluminum heat sink 2. Further, the connection terminal 5, 5 side portion of the glass epoxy substrate 3 is inserted into the base 8. The remaining part of the glass epoxy substrate 3 is covered with a cover glass 7.
  • the light emitting diode element 4 is attached to the first surface 31 of the glass epoxy substrate 3.
  • the light emitting diode element 4 is hermetically sealed with a phosphor 9. This phosphor 9 converts the wavelength of the light emitted from the light emitting diode element 4.
  • the cover glass 7 covers the light emitting diode element 4 and a part of the first surface 31 side of the glass epoxy substrate 3.
  • the space in the cover glass 7 is a sealed space so that outside gas does not enter the cover glass 7.
  • the cover glass 7 is made of a material that transmits the light whose wavelength is converted by the phosphor 9.
  • connection terminals 5 and 5 are provided behind the aluminum heat sink 2 and extend in the extending direction of the heat radiation plane 22.
  • a through hole 13 is provided at the tip of each of the connection terminals 5 and 5.
  • the base 8 is provided between the cover glass 7 and the connection terminals 5 and 5. A space between the base 8 and the connection terminals 5 and 5 is sealed with a heat-resistant sealing resin 10.
  • FIG. 2 is a schematic view seen from the direction of the arrow in FIG.
  • the mounting plate 6 is insulated from the connection terminals 5 and 5 by the sealing resin 10. Further, the mounting plate 6 extends in a direction intersecting the extending direction of the connection terminals 5 and 5 in the vicinity of the connection terminals 5 and 5. The extending direction of the mounting plate 6 is substantially parallel to the heat radiation plane 22. Further, a mounting hole 14 penetrating the mounting plate 6 is provided at the tip of the mounting plate 6, and a screw (not shown) for fixing the position of the LED lamp 1 is inserted into the mounting hole 14.
  • the heat generated from the light emitting diode element 4 is transmitted to the first surface 31 of the glass epoxy substrate 3, and the adhesion plane of the aluminum heat sink 2 from the second surface 32 of the glass epoxy substrate 3. It is transmitted to 21.
  • the contact flat surface 21 of the aluminum heat sink 2 is a flat surface that is in close contact with the second surface 32 of the glass epoxy substrate 3, the second surface 32 of the glass epoxy substrate 3 and the contact flat surface 21 of the aluminum heat sink 2 are The contact area can be increased. Therefore, the heat of the light emitting diode element 4 can be efficiently transferred to the aluminum heat sink 2 through the glass epoxy substrate 3.
  • the heat radiation plane 22 of the aluminum heat sink 2 is flat as shown in FIG. 22 can be easily adhered, and the aluminum heat sink 2 has a simple flat plate shape on the second surface 32 side, that is, the back surface side of the glass epoxy substrate 3, and is not on the light emission side of the light emitting diode element 4.
  • the contact area between the heat radiation plane 22 of the aluminum heat sink 2 and the surface 51 of the metal plate 15 can be increased with a simple and compact structure without impeding the ability. Therefore, the aluminum heat sink 2 can efficiently release the heat from the light emitting diode element 4 to the metal plate 15 in direct contact with the aluminum heat sink 2 by heat conduction.
  • the metal plate 15 is, for example, a casing or a housing of the video equipment, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, the LED lamp 1 can be used in a high temperature atmosphere and has a long life.
  • connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2, the connection terminals 5 and 5 are interposed between the surface 51 of the metal plate 15 and the heat radiation plane 22 of the aluminum heat sink 2. You can avoid it.
  • connection terminals 5, 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2 that is in close contact with the metal plate 15. , 5 can be prevented from coming off.
  • the LED lamp 1 has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element 4 even in a high temperature atmosphere of the video equipment, and can extend the life. .
  • the aluminum heat sink 2 has a smaller dimension between the contact plane 21 and the heat radiation plane 22 than the vertical and horizontal dimensions, the heat radiation path between the contact plane 21 and the heat radiation plane 22 is shortened. Therefore, the aluminum heat sink 2 can quickly dissipate heat by quickly transferring the heat from the light emitting diode element 4 to the heat radiation plane 22.
  • the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes through the outside without passing through the inside of the aluminum heat sink 2, the heat dissipation path of the aluminum heat sink 2 is It can be prevented from becoming less.
  • the aluminum heat sink 2 is provided with an insertion hole and the light emitting diode element 4 and the connection terminals 5 and 5 are electrically connected by the wiring inserted into the insertion hole as in the conventional example, The heat radiation path is reduced by the amount of the insertion hole.
  • the LED lamp 1 when attaching the heat radiation plane 22 of the aluminum heat sink 2 to the metal plate 15, the LED lamp 1 can be fixed in a state where the heat radiation plane 22 of the aluminum heat sink 2 is in close contact with the metal plate 15.
  • connection terminals 5 and 5 can be pressed against the connection destination by tightening the screws. Therefore, it is possible to make it difficult for the connection terminals 5 and 5 to be disconnected from the connection destination.
  • the LED lamp 1 when, for example, a screw inserted through the mounting hole of the mounting plate 6 is tightened and the mounting plate 6 is mounted to the mounting destination, the mounting plate 6 extends in the vicinity of the connection terminals 5 and 5 in the direction in which the connection terminals 5 and 5 extend.
  • the LED lamp 1 has two directions: a fixing direction by the connection terminals 5 and 5 and a fixing direction by the mounting plate 6. Fixed to. Therefore, the LED lamp 1 has an advantage that it is difficult to drop off.
  • the mounting plate 6 is insulated from the connection terminals 5 and 5, so that adverse effects on the energization of the connection terminals 5 and 5 can be prevented. Can do.
  • the cover glass 7 transmits the light whose wavelength is converted by the phosphor 9, the light can be taken out from the cover glass 7.
  • the heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed, it is possible to prevent the heat radiation performance of the aluminum heat sink 2 from being deteriorated.
  • the base 8 is provided between the cover glass 7 and the connection terminals 5 and 5, the mechanical strength can be increased.
  • the metal plate 15 may be a metal plate such as a housing or a case of a device that generates a high-temperature atmosphere such as a heating cooker, a washing / drying machine, a welding device, a heat treatment device, and a furnace.
  • a heat sink made of a metal other than aluminum for example, copper
  • a heat sink made of a material may be used.
  • the said material has a heat resistant thing.
  • connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2.
  • connection terminals 5 and 5 extend in the extending direction of the heat dissipation plane 22 of the aluminum heat sink 2. May extend in an oblique direction.
  • the contact plane 21 is substantially parallel to the heat dissipation plane 22, but the contact plane 21 may be an inclined surface that is inclined with respect to the heat dissipation plane 22.
  • the glass epoxy substrate 3 may be in direct contact with the adhesion plane 21 of the aluminum heat sink 2 or the glass epoxy substrate 3 may be in indirect contact with the adhesion plane 21 of the aluminum heat sink 2.
  • the glass epoxy substrate 3 may be attached to the adhesion flat surface 21 of the aluminum heat sink 2 via a thin adhesive film.
  • the rear end portion of the mounting plate 6 may be thermally connected to both the aluminum heat sink 2 and the glass epoxy substrate 3 or may be thermally connected only to the aluminum heat sink 2. Alternatively, it may be thermally connected only to the glass epoxy substrate 3.
  • a semiconductor substrate for example, a semiconductor substrate, a ceramic substrate, a metal substrate, or the like may be used instead of the glass epoxy substrate 3 of the first embodiment.
  • FIG. 4 is the figure which looked at the front of the heating cooker of 2nd Embodiment of this invention from diagonally upward.
  • the said heating cooker is provided with the LED lamp 1 of the said 1st Embodiment
  • “left” indicates the left when the cooking device is viewed from the front (door 102) side
  • “right” indicates the right when the cooking device is viewed from the front (door 102) side. Point to.
  • a door 102 is attached to the front surface of the rectangular parallelepiped casing 101 so as to rotate about the lower end side.
  • a handle 103 is attached to the upper part of the door 102, and a heat resistant glass 104 is attached to the approximate center of the door 102.
  • An operation panel 105 is provided on the right side of the door 102.
  • the operation panel 105 includes a liquid crystal display unit 106 and an operation button group 107 operated by a user.
  • An exhaust port cover 108 having an exhaust port 108a is provided on the upper side of the casing 101 and on the right rear side.
  • a dew receiving device 109 is detachably attached to a lower portion of the front surface of the casing 101 (a portion below the door 102).
  • FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker.
  • FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • a heating chamber 110 in which the object to be heated 123 can be accommodated together with the tray 190.
  • a water supply tank 111 that is detachably inserted from the front side is disposed on the right side of the heating chamber 110.
  • a steam generator 112 connected to the water supply tank 111 is disposed on the rear surface side of the water supply tank 111.
  • One end of a steam supply passage 113 is connected to the steam generator 112, and the other end of the steam supply passage 113 is connected to the circulation unit 114.
  • the steam generator 112 has a heater (not shown), and the water supplied from the water supply tank 111 is heated by the heater to generate saturated steam.
  • the saturated steam generated by the steam generator 112 is supplied from the steam supply port 113 a to the downstream side of the suction port 128 in the circulation unit 114 through the steam supply passage 113.
  • the steam supply port 113 a of the steam supply passage 113 is disposed in the vicinity of the suction port 128 in the circulation unit 114. Further, a circulation fan 118 is disposed in the circulation unit 114 so as to face the suction port 128. The circulation fan 118 is driven by a circulation fan motor 119.
  • a steam duct 180 bent in an L shape is attached to the upper and left sides of the heating chamber 110.
  • the steam duct 180 is fixed to the first duct portion 181 fixed to the upper wall of the heating chamber 110, the bent portion 182 bent from the left side to the lower side of the first duct portion 181, and the left wall of the heating chamber 110.
  • a second duct portion 183 connected to the first duct portion 181 through the bent portion 182.
  • a heater 121 made of a sheathed heater or the like is housed in the first duct portion 181 of the steam duct 180.
  • the first duct portion 181 and the heater 121 constitute a superheated steam generator.
  • the superheated steam generator may be provided separately from the steam duct.
  • a steam supply port 114 a provided on the upper portion of the circulation unit 114 is connected to the right end of the first duct portion 181, and the inside of the first duct portion 181 communicates with the circulation unit 114.
  • a plurality of first steam outlets 124 are provided on the top surface of the heating chamber 110, and the space in the first duct portion 181 of the steam duct 180 is inside the heating chamber 110 via the first steam outlet 124.
  • the second duct portion 183 of the steam duct 180 communicates with the inside of the heating chamber 110 via a plurality of second steam outlets 125 provided on the left side surface of the heating chamber 110.
  • the gap between the heating chamber 110 and the steam duct 180 is sealed with a heat resistant resin or the like.
  • the heating chamber 110 and the steam duct 180 are covered with a heat insulating material except for the front opening of the heating chamber 110.
  • the circulation path of the heat medium is formed by the circulation unit 114, the steam duct 180, the heating chamber 110, and the connection member connecting them. Then, saturated steam generated by the steam generator 112 is supplied to the boundary portion of the circulation unit 114 with the heating chamber 110 in this circulation path.
  • the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
  • a magnetron 120 is disposed in the space below the heating chamber 110.
  • the microwave generated in the magnetron 120 is guided to the lower center of the heating chamber 110 by a waveguide (not shown), and radiates upward in the heating chamber 110 while being stirred by a rotating antenna (not shown).
  • a rotating antenna not shown.
  • the article to be heated 123 is heated.
  • the article to be heated 123 is placed on the bottom of the heating chamber 110.
  • a suction port 128 is provided in the center of the right side wall of the heating chamber 110.
  • the right side wall of the heating chamber 110 is provided with an air supply port 133 (shown in FIG. 9) located on the front side of the suction port 128 and a first exhaust port 136 located on the rear side of the suction port 128. ing.
  • the air supply port 133 is located in the vicinity of the door 102, and the outside air blown into the heating chamber 110 from the air supply port 133 flows along the door 102.
  • a second exhaust port 137 having an opening area smaller than that of the first exhaust port 136 is provided on the lower right side of the rear side wall surface of the heating chamber 110.
  • a circulation fan motor 119 for driving the circulation fan 118 is attached to the circulation unit 114 disposed on the right side surface of the heating chamber 110. Steam and air in the heating chamber 110 are sucked from the suction port 128 by the circulation fan 118 and blown into the heating chamber 110 from the first and second steam outlets 124 and 125 through the steam duct 180. Further, an indoor temperature sensor 129 for detecting the temperature of the heat medium (air containing steam) in the heating chamber 110 is disposed in the vicinity of the suction port 128 of the circulation unit 114.
  • the object 123 to be heated in the heating chamber 110 is heated by the radiant heat of the heater 121 disposed in the first duct portion 181 of the steam duct 180. Moreover, the heating medium (air containing steam) passing through the steam duct 180 is heated by the heater 121, and the heated heating medium is blown out from the first and second steam outlets 124 and 125. Thereby, the heat medium in the heating chamber 110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 110 can be further heated by the heater 121 to generate superheated steam at 100 ° C. or higher.
  • the cooling fan part 122, the electrical component 117, and the magnetron 120 are disposed below the casing 101.
  • an air duct 131 is disposed on the right side of the heating chamber 110 in the casing 101.
  • the blower duct 131 houses therein a dilution fan 130 and a dilution fan motor 138 that drives the dilution fan 130.
  • the cooling fan unit 122 includes a cooling fan 115 and a cooling fan motor 116 that drives the cooling fan 115.
  • the electrical component 117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like.
  • the cooling fan 115 takes outside air into the casing 101 and cools the electrical component 117 and the magnetron 120 that generate heat. A part of the outside air that has flowed into the casing 101 by the cooling fan 115 is guided into the air duct 131 by the dilution fan 130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 101 and the like. ) To the outside.
  • a first exhaust duct 134 connected to the right side wall of the heating chamber 110 from a first exhaust port 136 via an exhaust damper (not shown) is disposed.
  • the first exhaust duct 134 has a lateral passage 134a extending in the lateral direction and a longitudinal passage 134b bent upward from the lateral passage 134a.
  • An exhaust port cover 108 is detachably attached to the upper end of the vertical passage 134b.
  • a suction port (not shown) for sucking outside air through a suction duct 127 is provided on the back side of the lateral passage 134a of the first exhaust duct 134.
  • the exhaust damper is controlled so that either one of the suction port or the first exhaust port 136 is alternatively selected and connected to the first exhaust duct 134.
  • the exhaust damper is driven by an exhaust damper motor 160 (shown in FIG. 7).
  • the vertical passage 134b of the first exhaust duct 134 is connected to the exhaust port cover 108 with the flow passage area enlarged toward the upper side.
  • An exhaust port 108 a that opens forward is formed in the upper portion of the exhaust port cover 108.
  • the lower end of the second exhaust duct 135 is connected to the second exhaust port 137, and the upper end of the second exhaust duct 135 is connected to the lower side of the vertical passage 134b of the first exhaust duct 134.
  • the distribution area of the second exhaust duct 135 is smaller than that of the first exhaust duct 134.
  • the exhaust from the second exhaust port 137 flows into the first exhaust duct 134 via the second exhaust duct 135 and is discharged to the outside from the exhaust port 108 a of the exhaust port cover 108.
  • the air duct 131 on the side of the heating chamber 110 includes a dilution fan housing part 131a, a vertical passage 131b extending upward from the dilution fan 130, a horizontal passage 131c bent from the vertical passage 131b to the rear side, and a horizontal passage 131b.
  • the nozzle portion 131d is bent upward from the passage 131c.
  • the lateral passage 131c and the nozzle portion 131d are inserted into the first exhaust duct 134.
  • An opening 131e is provided at the upper end of the nozzle portion 131d of the air duct 131.
  • an ejector is formed in the first exhaust duct 134, and the dilution fan 130 generates an air flow from the first exhaust port 136 toward the exhaust port 108a.
  • a recess is formed in the horizontal passage 131c of the blower duct 131 so as to be recessed below the lower end of the connection portion with the vertical passage 131b, and a sub nozzle portion that opens into the first exhaust duct 134 at one end of the recess. 131f is formed.
  • one end of the air supply passage 132 is connected to the upper part of the vertical passage 131b of the air duct 131, and the other end of the air supply passage 132 is connected to the air supply damper 140.
  • the air supply passage 132 and the air supply damper 140 are part of an air supply mechanism for supplying air to the heating chamber 110 via the air supply port 133 by the dilution fan 130.
  • a thawing sensor 150 is disposed near and below the air inlet 133 of the heating chamber 110.
  • the air supply damper 140 has a heat-resistant resin damper body 141 for opening and closing the air supply port 133 and a heat-resistant resin housing 142 covering the damper body 141.
  • FIG. 7 is a control block diagram of the heating cooker.
  • the heating cooker includes a control unit 200 including a microcomputer and an input / output circuit in the electrical component 17 (shown in FIGS. 5 and 6).
  • the control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, an air supply damper motor 144, an exhaust damper motor 160, an operation panel 105, an indoor temperature sensor 129, and thawing.
  • the sensor 150, the feed water pump 170, the steam generator 112, and the magnetron 120 are connected.
  • the control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, It controls the air damper motor 144, the exhaust damper motor 160, the operation panel 105, the water supply pump 170, the steam generator 112, the magnetron 120, and the like.
  • FIG. 8 is a perspective view of the rear surface of the cooking device in a state where the door 102 and the casing 101 are removed as viewed obliquely from above.
  • FIG. 9 is the perspective view which looked at the front of the heating cooker in the state which removed the said door 102 and the casing 101 from diagonally upward.
  • a front panel 126 is provided on the front side of the heating chamber 110.
  • the front panel 126 has an insertion port 126a for inserting a water supply tank 111 (shown in FIG. 6) on the right side.
  • upper tray receiving portions 151 a and 151 b, middle tray receiving portions 152 a, 152 b and 152 c and a lower tray receiving portion 153 are provided on the inner surface of the right side wall of the heating chamber 110.
  • a sensor unit 150a of the thawing sensor 150 is disposed between the middle tray receiving units 152a and 152b.
  • FIG. 10 is a schematic view of the upper portion of the front panel 126 and a portion in the vicinity thereof as viewed obliquely from above.
  • a frame body 16 formed of a steel plate is disposed between the first duct part 181 of the steam duct 180 and the upper part of the front panel 126.
  • a mounted portion 17 is provided on the right side of the frame body 16, and the mounting plate 6 of the LED lamp 1 is fixed to the mounted portion 17 with screws 19.
  • the flange portions 18 and 18 provided at the lower portion of the frame body 16 are fixed to the upper wall of the heating chamber 110 with screws (not shown).
  • FIG. 11 is a schematic view taken along line XI-XI in FIG.
  • the heat radiation plane 22 of the aluminum heat sink 2 of the LED lamp 1 is in close contact with the upper portion of the frame body 16. Further, a plurality of punching holes 20, 20,... Facing the LED lamp 1 are provided on the upper wall of the heating chamber 110. The light emitted from the LED lamp 1 enters the heating chamber 110 through a plurality of punching holes 20, 20,. Moreover, the glass plate 24 is arrange
  • the heating cooker having the above configuration heats the article to be heated 123 with superheated steam
  • superheated steam at 100 ° C. or higher generated by the heater 121 is heated from the plurality of first steam outlets 124 and second steam outlets 125. 110 is supplied. Therefore, the ambient temperature of the first duct portion 181 that houses the heater 121 is 80 ° C. to 100 ° C.
  • the LED lamp 1 is arranged in such a high temperature environment, the heat of the light emitting diode element 4 can be released to the frame body 16 through the aluminum heat sink 2 with very high efficiency. Can be suppressed. Therefore, since the lifetime of the light emitting diode element 4 can be extended, it is not necessary to frequently replace the LED lamp 1. As a result, the running cost of the cooking device can be reduced.
  • a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 16 of the second embodiment.
  • Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
  • healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like.
  • superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food.
  • the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation.
  • the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
  • FIG. 13 is the schematic diagram which looked at the LED lamp 2001 with which the heating cooker of 3rd Embodiment of this invention is provided from the side.
  • the LED lamp 2001 includes a glass epoxy substrate 2002 as an example of a substrate, a light emitting diode element 2003, two (only one is visible in FIG. 13) connection terminals 2004 and 2004, and a transparent terminal.
  • a cover glass 2005 as an example of a translucent member and a metal base 2006 are provided.
  • the glass epoxy substrate 2002 has a first surface 2021 directed to the heating chamber 2110 described later, and a flat second surface 2022 directed to the opposite side of the heating chamber 2110, and the vertical dimension is horizontal. It is longer than the dimensions. Further, the thickness of the glass epoxy substrate 2002 (the dimension between the first surface 2021 and the second surface 2022) is substantially constant, and is smaller than the vertical and horizontal dimensions of the glass epoxy substrate 2002.
  • the glass epoxy substrate 2002 is provided with wiring 2023 for supplying current from the connection terminals 2004 and 2004 to the light emitting diode element 2003. That is, the light emitting diode element 2003 and the connection terminals 2004 and 2004 are connected via the wiring 2023 on the glass epoxy substrate 2002.
  • a part of the glass epoxy board 2002 on the side of the connection terminals 2004 and 2004 is inserted into the base 2006. On the other hand, most of the remaining part of the glass epoxy substrate 2002 is covered with a cover glass 2005. Note that the vertical dimension of the glass epoxy substrate 2002 corresponds to the horizontal dimension in FIG. Further, the horizontal dimension of the glass epoxy substrate 2002 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
  • a part of the glass epoxy substrate 2002 opposite to the base 2006 is a mounting portion 2024 having a substantially rectangular plate shape as an example of a mounting plate.
  • the attachment portion 2024 protrudes from the cover glass 2005 and extends in the extending direction of the second surface 2022 of the glass epoxy substrate 2002.
  • the mounting portion 2024 is provided with a mounting hole 2025 through which a screw 2010 (shown in FIG. 21) is inserted. Further, the mounting portion 2024 is insulated from the connection terminals 2004 and 2004.
  • the light emitting diode element 2003 is attached to the first surface 2021 of the glass epoxy substrate 2002.
  • the light emitting diode element 2003 is hermetically sealed with a phosphor 2007.
  • the phosphor 2007 is for converting the wavelength of light emitted from the light emitting diode element 2003.
  • the cover glass 2005 covers a part of the first surface 2021 side of the glass epoxy substrate 2002 and the light emitting diode element 2003.
  • the space in the cover glass 2005 is a sealed space so that external gas does not enter the cover glass 2005.
  • the cover glass 2005 transmits light whose wavelength has been converted by the phosphor 2007.
  • connection terminals 2004 and 2004 are provided behind the glass epoxy substrate 2002 and extend in the extending direction of the heat radiation plane 2022.
  • a through hole 2041 is provided at the tip of each of the connection terminals 2004 and 2004.
  • the base 2006 is provided between the cover glass 2005 and the connection terminals 2004 and 2004. A space between the base 2006 and the connection terminals 2004 and 2004 is sealed with a heat-resistant sealing resin 8.
  • FIG. 14 is a view of the front surface of the heating cooker as viewed obliquely from above.
  • “left” indicates the left when the cooking device is viewed from the front (door 2102) side
  • “right” indicates the right when the cooking device is viewed from the front (door 2102). Point to.
  • the heating cooker has a rectangular parallelepiped shape, and a door 2102 that rotates about the lower end side is attached to the front surface of a casing 2101 made of metal such as iron.
  • a handle 2103 is attached to the upper part of the door 2102, and a heat resistant glass 104 is attached to the approximate center of the door 2102.
  • An operation panel 2105 is provided on the right side of the door 2102.
  • the operation panel 2105 includes a liquid crystal display unit 106 and an operation button group 2107 operated by the user.
  • an exhaust port cover 2108 having an exhaust port 2108a is provided on the upper side of the casing 2101 and on the right rear side.
  • a dew receptacle 2109 is detachably attached to a lower part of the front surface of the casing 2101 (a part below the door 2102).
  • FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the cooking device.
  • FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • a heating chamber 2110 that can accommodate the object to be heated 2123 together with the tray 190.
  • This heating chamber 2110 has an opening on the front side, and the side, bottom and top surfaces are made of stainless steel plates.
  • a water supply tank 2111 is detachably inserted from the front side.
  • a steam generator 2112 connected to the water supply tank 2111 is disposed on the rear surface side of the water supply tank 2111.
  • One end of a steam supply passage 2113 is connected to the steam generator 2112, and the other end of the steam supply passage 2113 is connected to the circulation unit 2114.
  • the steam generator 2112 has a heater (not shown), and heats the water supplied from the water supply tank 2111 with the heater to generate saturated steam.
  • the saturated steam generated by the steam generator 2112 is supplied from the steam supply port 2113a to the downstream side of the suction port 2128 in the circulation unit 2114 via the steam supply passage 2113.
  • the steam supply port 2113 a of the steam supply passage 2113 is disposed in the vicinity of the suction port 2128 in the circulation unit 2114. Further, a circulation fan 2118 is disposed in the circulation unit 2114 so as to face the suction port 2128.
  • a steam duct 2180 bent in an L shape is attached to the upper surface and the left side surface of the heating chamber 2110.
  • the steam duct 2180 is fixed to the first duct portion 2181 fixed to the upper wall of the heating chamber 2110, the bent portion 182 bent from the left side of the first duct portion 2181 to the lower side, and the left wall of the heating chamber 2110.
  • a second duct portion 2183 connected to the first duct portion 2181 via the bent portion 182.
  • a heater 2121 made of a sheathed heater or the like is housed in the first duct portion 2181 of the steam duct 2180.
  • the first duct portion 2181 and the heater 2121 constitute a superheated steam generator.
  • the superheated steam generator may be provided separately from the steam duct.
  • a steam supply port 2114 a provided at the upper portion of the circulation unit 2114 is connected to the right end of the first duct portion 2181, and the inside of the first duct portion 2181 communicates with the circulation unit 2114.
  • a plurality of first steam outlets 2124 are provided on the top surface of the heating chamber 2110, and the space in the first duct portion 2181 of the steam duct 2180 is inside the heating chamber 2110 via the first steam outlet 2124.
  • the second duct portion 2183 of the steam duct 2180 communicates with the inside of the heating chamber 2110 through a plurality of second steam outlets 2125 provided on the left side surface of the heating chamber 2110.
  • the gap between the heating chamber 2110 and the steam duct 2180 is sealed with a heat resistant resin or the like.
  • the heating chamber 2110 and the steam duct 2180 are covered with a heat insulating material except for the opening on the front side of the heating chamber 2110.
  • the circulation path of the heat medium is formed by the circulation unit 2114, the steam duct 2180, the heating chamber 2110, and the connecting member that connects them. Then, saturated steam generated by the steam generator 2112 is supplied to a boundary portion of the circulation unit 2114 with the heating chamber 2110 in this circulation path.
  • the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
  • a magnetron 2120 is disposed in the space below the heating chamber 2110.
  • the microwave generated by the magnetron 2120 is guided to the lower center of the heating chamber 2110 by a waveguide (not shown), and radiates upward in the heating chamber 2110 while being stirred by a rotating antenna (not shown).
  • a rotating antenna not shown
  • the article to be heated 2123 is heated.
  • the object to be heated 2123 is placed on the bottom in the heating chamber 2110.
  • a suction port 2128 is provided at the center of the right side wall of the heating chamber 2110.
  • the right side wall of the heating chamber 2110 is provided with an air supply port 2133 (shown in FIG. 19) located on the front side of the suction port 2128 and a first exhaust port 2136 located on the rear side of the suction port 2128. ing.
  • the air supply port 2133 is located in the vicinity of the door 2102, and outside air blown out from the air supply port 2133 into the heating chamber 2110 flows along the door 2102.
  • a second exhaust port 2137 having an opening area smaller than that of the first exhaust port 2136 is provided on the lower right side of the rear side wall surface of the heating chamber 2110.
  • a circulation fan motor 2119 for driving the circulation fan 2118 is attached to the circulation unit 2114 disposed on the right side surface of the heating chamber 2110. Steam or air in the heating chamber 2110 is sucked from the suction port 2128 by the circulation fan 2118 and blown out from the first and second steam outlets 2124 and 2125 into the heating chamber 2110 via the steam duct 2180.
  • an indoor temperature sensor 2129 that detects the temperature of the heat medium (air containing steam) in the heating chamber 2110 is disposed in the vicinity of the suction port 2128 of the circulation unit 2114.
  • the object to be heated 2123 in the heating chamber 2110 is heated by the radiant heat of the heater 2121 disposed in the first duct portion 2181 of the steam duct 2180. Further, the heating medium (air containing steam) passing through the steam duct 2180 is heated by the heater 2121, and the heated heating medium is blown out from the first and second steam outlets 2124 and 2125. Thereby, the heat medium in the heating chamber 2110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 2110 can be further heated by the heater 2121 to generate superheated steam at 100 ° C. or higher.
  • the cooling fan portion 2122, the electrical component 2117, and the magnetron 2120 are disposed on the lower side of the casing 2101. Further, an air duct 2131 is disposed on the right side of the heating chamber 2110 in the casing 2101. The air duct 2131 houses therein a dilution fan 2130 and a dilution fan motor 2138 that drives the dilution fan 2130.
  • the cooling fan unit 2122 includes a cooling fan 2115 and a cooling fan motor 2116 that drives the cooling fan 2115.
  • the electrical component 2117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like. Further, the cooling fan 2115 takes outside air into the casing 2101 and cools the electrical component 2117 and the magnetron 2120 that generate heat. Further, a part of the outside air flowing into the casing 2101 by the cooling fan 2115 is guided into the air duct 2131 by the dilution fan 2130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 2101 or the like. ) To the outside.
  • a first exhaust duct 2134 connected to the right side wall of the heating chamber 2110 from the first exhaust port 2136 via an exhaust damper (not shown) is disposed.
  • the first exhaust duct 2134 has a lateral passage 2134a extending in the lateral direction and a longitudinal passage 2134b bent upward from the lateral passage 2134a.
  • An exhaust port cover 2108 is detachably attached to the upper end of the vertical passage 2134b.
  • a suction port (not shown) for sucking outside air through a suction duct 2127 is provided on the back side of the lateral passage 2134a of the first exhaust duct 2134.
  • the exhaust damper is controlled so that either one of the suction port or the first exhaust port 2136 is alternatively selected and connected to the first exhaust duct 2134.
  • the exhaust damper is driven by an exhaust damper motor 2160 (shown in FIG. 17).
  • the vertical passage 2134b of the first exhaust duct 2134 is connected to the exhaust port cover 2108 with the flow passage area enlarged toward the upper side.
  • An exhaust port 2108 a that opens forward is formed in the upper portion of the exhaust port cover 2108.
  • the lower end of the second exhaust duct 2135 is connected to the second exhaust port 2137, and the upper end of the second exhaust duct 2135 is connected to the lower side of the vertical passage 2134b of the first exhaust duct 2134.
  • the distribution area of the second exhaust duct 2135 is smaller than that of the first exhaust duct 2134.
  • the exhaust from the second exhaust port 2137 flows into the first exhaust duct 2134 via the second exhaust duct 2135 and is discharged to the outside from the exhaust port 2108a of the exhaust port cover 2108.
  • the air duct 2131 on the side of the heating chamber 2110 includes a dilution fan housing part 131a, a vertical passage 2131b extending upward from the dilution fan 2130, a horizontal passage 2131c bent from the vertical passage 2131b to the rear side, and a horizontal passage.
  • the nozzle portion 2131d is bent upward from the passage 2131c.
  • the lateral passage 2131c and the nozzle portion 2131d are inserted into the first exhaust duct 2134.
  • An opening 2131e is provided at the upper end of the nozzle portion 2131d of the air duct 2131.
  • an ejector is formed in the first exhaust duct 2134, and an air flow from the first exhaust port 2136 toward the exhaust port 2108 a is generated by the dilution fan 2130.
  • a concave portion is formed in the horizontal passage 2131c of the air duct 2131 so as to be recessed below the lower end of the connecting portion with the vertical passage 2131b, and a sub nozzle portion that opens into the first exhaust duct 2134 at one end of the concave portion. 2131f is formed.
  • one end of the air supply passage 2132 is connected to the upper part of the vertical passage 2131b of the air duct 2131, and the other end of the air supply passage 2132 is connected to the air supply damper 2140.
  • the air supply passage 2132 and the air supply damper 2140 are part of an air supply mechanism for supplying air to the heating chamber 2110 via the air supply port 2133 by the dilution fan 2130.
  • a thawing sensor 2150 is disposed near and below the air inlet 2133 of the heating chamber 2110.
  • the air supply damper 2140 includes a heat-resistant resin damper body 2141 for opening and closing the air supply opening 2133 and a heat-resistant resin housing 2142 for covering the damper body 2141.
  • FIG. 17 is a control block diagram of the heating cooker.
  • the heating cooker includes a control unit 2200 including a microcomputer and an input / output circuit in an electrical component 2117 (shown in FIGS. 15 and 16).
  • the control unit 2200 includes a heater 2121, a circulation fan motor 2119, a cooling fan motor 2116, a dilution fan motor 2138, a supply damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, an indoor temperature sensor 2129, and thawing.
  • a sensor 2150, a feed water pump 2170, a steam generator 2112 and a magnetron 2120 are connected.
  • control unit 2200 Based on signals from operation panel 2105 and detection signals from room temperature sensor 2129 and thawing sensor 2150, control unit 2200 includes heater 2121, circulation fan motor 2119, cooling fan motor 2119, dilution fan motor 2138, It controls an air damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, a water supply pump 2170, a steam generator 2112, a magnetron 2120, and the like.
  • FIG. 18 is a perspective view of the rear surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above.
  • FIG. 19 is a perspective view of the front surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above.
  • a front panel 2126 is provided on the front side of the heating chamber 2110.
  • the front panel 2126 has an insertion port 2126a for inserting a water supply tank 2111 (shown in FIG. 16) on the right side.
  • upper tray receiving portions 2151 a and 2151 b, middle tray receiving portions 2152 a, 2152 b and 2152 c, and a lower tray receiving portion 2153 are provided on the inner surface of the right side wall of the heating chamber 2110.
  • a sensor unit 2150a of the thawing sensor 2150 is disposed between the middle tray receiving units 2152a and 2152b.
  • FIG. 20 is a schematic view of the upper part of the front panel 2126 and the vicinity thereof as seen obliquely from above.
  • a steel frame 2009 as an example of a mounting bracket is disposed between the first duct portion 2181 of the steam duct 2180 and the upper part of the front panel 2126.
  • a thick part 2091 that is thicker than the other parts is provided as an example of an attached part on the upper part of the frame 2009.
  • flange portions 2092 and 2092 are provided in the lower portion of the frame body 2009.
  • the heating chamber 2110 has a gap between the thick portion 2091 and the upper wall of the heating chamber 2110 and is positioned above the plurality of punching holes 20111, 2011, ... and the glass plate 2012.
  • Flange portions 2092 and 2092 are fixed to the upper wall with screws (not shown).
  • FIG. 21 is a schematic diagram of a longitudinal section viewed from the XXI-XXI line of FIG.
  • FIG. 22 is a schematic view of the LED lamp 2001 attached to the frame 2009 as viewed from the connection terminals 2004 and 2004 side.
  • the LED lamp 2001 is attached to a frame 2009 as shown in FIGS. More specifically, the thick portion 2091 of the frame 2009 has a flat contact plane 2093 on the heating chamber 2110 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2093. . Further, the LED lamp 2001 is fixed to the frame body 2009 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply
  • a plurality of punching holes 2011, 2011,... Facing the LED lamp 2001 are provided on the upper wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2001 enters the heating chamber 2110 through the plurality of punching holes 20111, 2011,.
  • the glass plate 2012 is arrange
  • the light emitting diode element 2003 when the inside of the heating chamber 2110 is illuminated with the LED lamp 2001, the light emitting diode element 2003 generates heat.
  • the heat generated by the light emitting diode element 2003 is transmitted to the first surface 2021 of the glass epoxy substrate 2002, and is transmitted from the second surface 2022 of the glass epoxy substrate 2002 to the adhesion plane 2093 of the thick portion 2091 of the frame body 2009.
  • the second surface 2022 and the contact flat surface 2093 are both flat surfaces and are in close contact with each other, the contact area of the second surface 2022 with the contact flat surface 2093 is large. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the thick portion 2091 of the frame body 2009 through the glass epoxy substrate 2002.
  • the thick portion 2091 of the frame body 2009 is positioned on the LED lamp 2001. Then, since there is no space between the LED lamp 2001 and the upper wall of the heating chamber 2110, the light emitted from the LED lamp 2001 is not blocked by a part of the thick portion 2091 of the frame body 2009. That is, both high heat dissipation and high luminance of the LED lamp 2001 can be achieved.
  • the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
  • the life of the LED lamp 2001 can be extended, the number of replacements of the LED lamp 2001 is reduced, and the running cost can be reduced.
  • connection terminals 2004 and 2004 extend in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, the connection terminals 2004 and 2004 can be prevented from being interposed between the second surface 2022 and the contact plane 2093.
  • the glass epoxy substrate 2002 receives a reaction force in the direction perpendicular to the extending direction of the second surface 2022 from the thick portion 2091, but the connection terminals 2004 and 2004 extend from the second surface 2022 of the glass epoxy substrate 2002. Since it extends in the present direction, the connection terminals 2004 and 2004 are not easily detached by the reaction force.
  • the LED lamp 2001 includes the mounting portion 2024, the LED lamp 2001 is thickened so that the second surface 2022 of the glass epoxy substrate 2002 is in close contact with the contact flat surface 2093 of the thick portion 2091 of the frame body 2009. It can be attached to the part 2091.
  • the thick portion 2091 is made of steel
  • the attachment portion 2024 is insulated from the connection terminals 2004 and 2004, so that the energization of the connection terminals 2004 and 2004 is not adversely affected.
  • the glass epoxy substrate 2002 can be pressed against the thick portion 2091 of the frame body 2009, so that the second surface 2022 of the glass epoxy substrate 2002 and The adhesion force between the thick portion 2091 of the frame 2009 and the adhesion plane 2093 can be increased.
  • the mounting portion 2024 is a part of the glass epoxy substrate 2002, the number of parts can be reduced.
  • the thick portion 2091 is a part of the frame body 2009, the thick portion 2091 can release heat using a wide surface of the frame body 2009. Therefore, the cooling capacity of the light emitting diode element can be increased.
  • the LED lamp 2001 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002.
  • a connection terminal extending obliquely with respect to the direction may be provided.
  • the LED lamp 2001 includes the glass epoxy substrate 2002.
  • a metal substrate such as an aluminum substrate, a semiconductor substrate, or a ceramic substrate may be included.
  • a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 2009 of the third embodiment.
  • one attachment portion 2024 is provided on the glass epoxy substrate 2002, but a plurality of attachment portions may be provided.
  • FIG. 23 is the schematic diagram which looked at the front of the principal part of the heating cooker of 4th Embodiment of this invention from diagonally upward.
  • the same reference numerals as those of the third embodiment are assigned to the same components as those of the third embodiment.
  • “left” refers to the left when the cooking device is viewed from the front side
  • “right” is when the cooking device is viewed from the front side. Point to the right.
  • the heating cooker includes a casing 2301 made of metal such as iron, a heating chamber 2310 provided in the casing 2301, and an LED lamp 2201 that illuminates the heating chamber 2310.
  • a steam generator, electrical components, a magnetron, a heater, a cooling fan unit, an air duct, and the like are installed in the casing 2301 as in the third embodiment.
  • the air blown out by the cooling fan portion flows between the right side portion of the casing 2301 and the right wall of the heating chamber 2310.
  • FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
  • a concave portion 2302 as an example of a mounted portion is provided on the right side surface of the casing 2301.
  • the concave portion 2302 includes a bottom portion 2321 substantially parallel to the extending direction of the right wall of the heating chamber 2310, and four peripheral walls provided around the bottom portion 2321 and inclined with respect to the extending direction of the right wall of the heating chamber 2310. It consists of parts 2322, 2323, 2324. Further, the bottom portion 2321 is located on the side of the plurality of punching holes 2211, 2111,... And the glass plate 2212.
  • the LED lamp 2201 is attached to the recess 2302 of the casing 2301. More specifically, the bottom 2321 of the recess 2302 has a flat contact plane 2325 on the heating chamber 2310 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2325. Further, the LED lamp 2001 is fixed to the casing 2301 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply
  • the LED lamp 2201 includes a metal base 306 having a shape different from that of the base 2006 of the LED lamp 2001 lamp 2001 of the third embodiment.
  • An inclined surface 2261 having an inclination angle substantially the same as the inclination angle of the peripheral wall 2323 of the recess 2302 is provided on the recess 2302 side of the base 306. Further, the inclined surface 2261 is designed so that the second surface 2022 of the glass epoxy substrate 2002 contacts the contact flat surface 2325 of the bottom portion 2321 when the inclined surface 2261 is brought into contact with the peripheral wall portion 2323 of the concave portion 2302.
  • a plurality of punching holes 2211, 2111,... Facing the LED lamp 2001 are provided on the right wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2201 enters the heating chamber 2310 through the plurality of punching holes 2211, 2111,. Further, the punching holes 2211, 2111,... Are covered with a glass plate 2212 so that steam in the heating chamber 2310 does not leak out of the heating chamber 2310 from the punching holes 2211, 2111,.
  • the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat close contact plane 325 of the bottom 2321 of the recess 2302, so the second surface 2022 with respect to the close contact flat surface 2325 The contact area is increased. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the bottom 2321 of the recess 2302 through the glass epoxy substrate 2002.
  • the bottom 2321 of the recess 2302 is not on the light emission side of the LED lamp 2201. It is possible to prevent the illumination capability of the LED lamp 2201 from being lowered.
  • the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
  • the heat radiation area is larger than that of the third embodiment, and the light emitting diode element 2003 can be made high.
  • the LED lamp 2201 can be air-cooled.
  • the LED lamp 2201 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002.
  • a connection terminal extending obliquely with respect to the direction may be provided.
  • the LED lamp 2201 includes the glass epoxy substrate 2002.
  • an aluminum substrate may be included.
  • Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
  • healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like.
  • superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food.
  • the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation.
  • the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
  • Glass plate 2021 ... First surface 2022 ... Second surface 2034 ... Mounting portion 2035 ... Mounting hole 2091 ... Thick part 2092 ... Flange part 093,2325 ... contact plane 2101,2301 ... casing 2110,2310 ... heating chamber 2302 ... recess 2321 ... bottom 2322,2323,2324 ... wall portion 2123 ... object to be heated

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention porte sur une lampe à diodes électroluminescentes (1), laquelle lampe comporte un substrat de verre époxy (3), un élément de diode électroluminescente (4) montée sur une première face (31) du substrat de verre époxy (3), un verre de revêtement (7) recouvrant l'élément de diode électroluminescente (4) et le substrat de verre époxy (3) à partir du côté de la première face (31) de celui-ci, un dissipateur de chaleur en aluminium (2), et une borne de connexion (5) électriquement connectée à l'élément de diode électroluminescente (4). Le dissipateur de chaleur en aluminium (2) présente une face plane adhérente plate (11) qui adhère à une seconde face (32) sur le côté opposé vis-à-vis de la première face (31) du substrat de verre époxy (3), et une face plane de dissipation de chaleur plate (22) située sur le côté opposé vis-à-vis de la face plane adhérente (11). La borne de connexion (5) s'étend dans la direction d'étendue de la face plane de dissipation de chaleur (22) du dissipateur de chaleur en aluminium (2).
PCT/JP2012/062220 2011-06-03 2012-05-11 Lampe à diodes électroluminescentes (led) et cuiseur la comportant Ceased WO2012165125A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011-125419 2011-06-03
JP2011125419A JP2012253232A (ja) 2011-06-03 2011-06-03 加熱調理器
JP2011-125426 2011-06-03
JP2011125426A JP2012251738A (ja) 2011-06-03 2011-06-03 加熱調理器

Publications (1)

Publication Number Publication Date
WO2012165125A1 true WO2012165125A1 (fr) 2012-12-06

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PCT/JP2012/062220 Ceased WO2012165125A1 (fr) 2011-06-03 2012-05-11 Lampe à diodes électroluminescentes (led) et cuiseur la comportant

Country Status (2)

Country Link
CN (1) CN202691769U (fr)
WO (1) WO2012165125A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11241103B2 (en) 2018-10-26 2022-02-08 Giles Enterprises, Inc. LED lighting system for heated enclosure

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2966360B1 (fr) * 2013-03-07 2020-04-08 Panasonic Intellectual Property Management Co., Ltd. Dispositif de cuisson par chauffage
CN108095567B (zh) * 2017-12-08 2020-01-31 广东美的厨房电器制造有限公司 烹饪器具
JP7029706B2 (ja) * 2018-02-28 2022-03-04 パナソニックＩｐマネジメント株式会社 加熱調理器

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JPS49118845U (fr) * 1973-02-09 1974-10-11
JPS58102107U (ja) * 1981-12-28 1983-07-12 松下冷機株式会社 オ−ブンのランプ取付装置
JPH08327071A (ja) * 1995-04-07 1996-12-10 Samsung Electronics Co Ltd 電子レンジの照明装置およびその制御方法
JP2000156112A (ja) * 1998-11-18 2000-06-06 Metro Denki Kogyo Kk 電 球
JP2003124528A (ja) * 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源
JP2004253364A (ja) * 2003-01-27 2004-09-09 Matsushita Electric Ind Co Ltd 照明装置
JP2006186197A (ja) * 2004-12-28 2006-07-13 Stanley Electric Co Ltd 発光装置
JP2006242420A (ja) * 2005-03-01 2006-09-14 Toshiba Corp 加熱調理器
JP3128244U (ja) * 2006-10-20 2006-12-28 東貝光電科技股▲ふん▼有限公司 バックライトモジュール構造
JP2007194172A (ja) * 2006-01-23 2007-08-02 Koito Mfg Co Ltd 光源モジュール
JP2009289751A (ja) * 2008-05-28 2009-12-10 Osram Sylvania Inc 自動車のリヤコンビネーションランプ用の後方取付け型発光ダイオードモジュール

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49118845U (fr) * 1973-02-09 1974-10-11
JPS58102107U (ja) * 1981-12-28 1983-07-12 松下冷機株式会社 オ−ブンのランプ取付装置
JPH08327071A (ja) * 1995-04-07 1996-12-10 Samsung Electronics Co Ltd 電子レンジの照明装置およびその制御方法
JP2000156112A (ja) * 1998-11-18 2000-06-06 Metro Denki Kogyo Kk 電 球
JP2003124528A (ja) * 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源
JP2004253364A (ja) * 2003-01-27 2004-09-09 Matsushita Electric Ind Co Ltd 照明装置
JP2006186197A (ja) * 2004-12-28 2006-07-13 Stanley Electric Co Ltd 発光装置
JP2006242420A (ja) * 2005-03-01 2006-09-14 Toshiba Corp 加熱調理器
JP2007194172A (ja) * 2006-01-23 2007-08-02 Koito Mfg Co Ltd 光源モジュール
JP3128244U (ja) * 2006-10-20 2006-12-28 東貝光電科技股▲ふん▼有限公司 バックライトモジュール構造
JP2009289751A (ja) * 2008-05-28 2009-12-10 Osram Sylvania Inc 自動車のリヤコンビネーションランプ用の後方取付け型発光ダイオードモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11241103B2 (en) 2018-10-26 2022-02-08 Giles Enterprises, Inc. LED lighting system for heated enclosure

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