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WO2012162021A1 - Apport de chaleur radiante à système d'outil de moule - Google Patents

Apport de chaleur radiante à système d'outil de moule Download PDF

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Publication number
WO2012162021A1
WO2012162021A1 PCT/US2012/037891 US2012037891W WO2012162021A1 WO 2012162021 A1 WO2012162021 A1 WO 2012162021A1 US 2012037891 W US2012037891 W US 2012037891W WO 2012162021 A1 WO2012162021 A1 WO 2012162021A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
mold
assembly
tool system
heating assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2012/037891
Other languages
English (en)
Inventor
Paul R. Blais
Angelo Mier
Brian Esser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Husky Injection Molding Systems Ltd
Husky Injection Molding Systems SA
Original Assignee
Husky Injection Molding Systems Ltd
Husky Injection Molding Systems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Husky Injection Molding Systems Ltd, Husky Injection Molding Systems SA filed Critical Husky Injection Molding Systems Ltd
Publication of WO2012162021A1 publication Critical patent/WO2012162021A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation

Definitions

  • An aspect generally relates to (but is not limited to) a mold-tool system and/or a molding system having the mold-tool system.
  • the inventors have researched a problem associated with known molding systems that inadvertently manufacture bad-quality molded articles or parts. After much study, the inventors believe they have arrived at an understanding of the problem and its solution, which are stated below, and the inventors believe the public does not know this understanding.
  • the current problem is that electrical resistive heater assemblies supply a fixed wattage per linear length of the heater assembly.
  • Known installation method depends on installing the heater assembly to have good thermal conductance to a component of a runner assembly. This arrangement may improve heat transfer.
  • heat transfer is a two way street, not only does the above arrangement improve heat going out to the manifold from the heater assembly, but the above arrangement may also improve cooling of the heater assembly at the location of heat losses.
  • the temperature of the electric heater is independent of the temperature of the component.
  • the next best case may be to limit the effect of the component's temperature on the temperature of the heater assembly.
  • the solution may reduce, at least in part, heat transfer by conduction and/or may improve heat transfer by radiation.
  • a mold- tool system comprising: a heating assembly (102) being configured to deliver heat to a heatable component (101 ), the heat being delivered to the heatable component (101 ) by the heating assembly (102) is substantially radiative heat, and the balance of the heat being delivered to the heatable component (101 ) by the heating assembly (102) is a combination of conductive heat and convective heat.
  • Radiative heat transfer is a function of the fourth power of temperature difference between two bodies (using an absolute scale), and thus is much higher for larger differences in temperature. This then acts as a partially self regulating heat transfer mode, as the amount of heat transferred increases dramatically as the temperature differential increases, and correspondingly decreases as the temperature differential decreases.
  • a mold-tool system comprising: a heatable component (101 ); and a heating assembly (102) being configured to deliver heat to the heatable component (101 ), the heat being delivered to the heatable component (101 ) by the heating assembly (102) is substantially radiative heat, and the balance of the heat being delivered to the heatable component (101 ) by the heating assembly (102) is a combination of conductive heat and convective heat.
  • a molding system having any one of the mold-tool system (100) as described above.
  • a runner assembly (916) having the mold-tool system (100) as described above.
  • a method of operating the mold-tool system (100) as described above comprising: delivering heat to a heatable component (101 ) of the mold-tool system (100), the heat being delivered to the heatable component (101 ) is substantially radiative heat, and the balance of the heat being delivered to the heatable component (101 ) is a combination of conductive heat and convective heat.
  • FIGS. 1 to 7 depict schematic representations of a mold-tool system (100).
  • FIGS. 1 to 7 depict the schematic representations of the mold-tool system (100).
  • the mold- tool system (100) may include components that are known to persons skilled in the art, and these known components will not be described here; these known components are described, at least in part, in the following reference books (for example): (i) "Injection Molding Handbook' authored by OSSWALD/TURNG/GRAMANN (ISBN: 3-446-21669-2), (ii) "Injection Molding Handbook' authored by ROSATO AND ROSATO (ISBN: 0-412- 99381 -3), (iii) "Injection Molding Systems” 3 rd Edition authored by JOHANNABER (ISBN 3- 446-17733-7) and/or (iv) "Runner and Gating Design Handbook' authored by BEAUMONT (ISBN 1 -446-22672-9).
  • the phrase “includes (and is not limited to)” is equivalent to the word “comprising”.
  • the word “comprising” is a transitional phrase or word that links the preamble of a patent claim to the specific elements set forth in the claim that define what the invention itself actually is.
  • the transitional phrase acts as a limitation on the claim, indicating whether a similar device, method, or composition infringes the patent if the accused device (etc) contains more or fewer elements than the claim in the patent.
  • the word “comprising” is to be treated as an open transition, which is the broadest form of transition, as it does not limit the preamble to whatever elements are identified in the claim.
  • FIG. 1 depicts a schematic representation of a molding system (900) having the mold-tool system (100).
  • the molding system (900) may also be called an injection-molding system for example.
  • the molding system (900) includes (and is not limited to): (i) an extruder assembly (902), (ii) a clamp assembly (904), (iii) a runner assembly (916), and (iv) a mold assembly (918).
  • the extruder assembly (902) is configured, to prepare, in use, a heated, flowable resin, and is also configured to inject or to move the resin from the extruder assembly (902) toward the runner assembly (916).
  • the clamp assembly (904) includes (and is not limited to): (i) a stationary platen (906), (ii) a movable platen (908), (iii) a rod assembly (910), (iv) a clamping assembly (912), and (v) a lock assembly (914).
  • the stationary platen (906) does not move.
  • the stationary platen (906) may be fixedly positioned relative to the ground or floor.
  • the movable platen (908) is configured to be movable relative to the stationary platen (906).
  • a platen-moving mechanism (not depicted but known) is connected to the movable platen (908); the platen-moving mechanism is configured to move, in use, the movable platen (908).
  • the rod assembly (910) extends between the movable platen (908) and the stationary platen (906).
  • the rod assembly (910) is configured to guide movement of the movable platen (908) relative to the stationary platen (906).
  • a clamping assembly (912) is connected to the rod assembly (910).
  • the stationary platen (906) supports the clamping assembly (912).
  • the lock assembly (914) is connected to the rod assembly (910).
  • the movable platen (908) supports the lock assembly (914).
  • the runner assembly (916) is attached to or supported by the stationary platen (906).
  • the runner assembly (916) includes (and is not limited to) a mold- tool system (100).
  • the definition of the mold-tool system (100) is as follows: a system that may be positioned and/or may be used in an envelope defined by the stationary platen (906) and the movable platen (908) of the molding system (900).
  • the molding system (900) may include (and is not limited to) the mold-tool system (100).
  • the runner assembly (916) is configured to receive the resin from the extruder assembly (902).
  • the mold assembly (918) includes (and is not limited to): (i) a stationary-mold assembly (920), and (ii) a movable-mold assembly (922) that is movable relative to the stationary-mold assembly (920).
  • the movable-mold assembly (922) is attached to or supported by the movable platen (908).
  • the stationary-mold assembly (920) is attached to or supported by the runner assembly (916), so that the movable-mold assembly (922) faces the stationary- mold assembly (920).
  • the runner assembly (916) is configured to distribute the resin from the extruder assembly (902) to the mold assembly (918).
  • the movable platen (908) is moved toward the stationary platen (906) so that the stationary-mold assembly (920) is closed against the movable-mold assembly (922), so that the mold assembly (918) may define a mold cavity structure that is configured to receive the resin from the runner assembly (916).
  • the lock assembly (914) is engaged so as to lock the position of the movable platen (908) so that the movable platen (908) no longer moves relative to the stationary platen (906).
  • the clamping assembly (912) is then engaged to apply a camping pressure, in use, to the rod assembly (910), so that the clamping pressure then may be transferred to the mold assembly (918).
  • the extruder assembly (902) pushes or injects, in use, the resin to the runner assembly (916), which then the runner assembly (916) distributes the resin to the mold cavity structure defined by the mold assembly (918).
  • the clamping assembly (912) is deactivated so as to remove the clamping force from the mold assembly (918)
  • the lock assembly (914) is deactivated to permit movement of the movable platen (908) away from the stationary platen (906), and then a molded article may be removed from the mold assembly (918).
  • all of the above components, assemblies, etc may: (i) all be sold separately or provided by a combination of multiple vendors, (ii) some vendors may provide a combination of a limited selection of the above components, assemblies, etc, or, (iii) a single vendor may provide all of the above of the above components, assemblies, etc.
  • the mold-tool system (100) includes (and s not limited to) a heating assembly (102).
  • the heating assembly (102) is configured to deliver heat to a heatable component (101 ).
  • the heat delivered to the heatable component (101 ) by the heating assembly (102) is substantially radiative heat, and the balance of the heat being delivered to the heatable component (101 ) by the heating assembly (102) is a combination of conductive heat and convective heat.
  • FIGS. 2 to 7 there is depicted a second example of the mold- tool system (100), in which the mold-tool system (100) includes (and is not limited to): (i) the heatable component (101 ), and (ii) the heating assembly (102).
  • the heating assembly (102) is configured to deliver heat to the heatable component (101 ).
  • the heat being delivered to the heatable component (101 ) by the heating assembly (102) is substantially radiative heat, and the balance of the heat being delivered to the heatable component (101 ) by the heating assembly (102) is a combination of conductive heat and convective heat.
  • FIGS. 2 to 7 there is depicted a third example of the mold-tool system (100), in which the molding system (900) has or includes the mold-tool system (100).
  • FIGS. 2 to 7 there is depicted a fourth example of the mold-tool system (100), in which a method is associated with operating the mold-tool system (100).
  • the method includes (and is not limited to): delivering heat to the heatable component (101 ) of the mold-tool system (100), in which the heat being delivered to the heatable component
  • the heating assembly (102) includes (and is not limited to): an infrared assembly (104) configured to provide infrared-radiative heat to the heatable component (101 ).
  • the heating assembly (102) such as an infrared heaters (by way of example), are non-contact heaters that provide heat to an object receiving the heat primarily through radiative-heat transfer across a gap; the gap exists between the heating assembly (102) and the heatable component (101 ) this is to receive the heat from the heating assembly (102).
  • a heater support mechanism configured to support and position the heating assembly (102)
  • no contact of the heating assembly (102) to either the heatable component (101 ) or to the component supporting the heating assembly (102) is required (these may be, in fact, the same component).
  • the support components may transfer some amount of heat (heat conduction) as a consequence of the mechanical coupling with the heating assembly (102), but the coupling mechanism is not intended to be a primary source of heat transfer between the heating assembly (102) and the heatable component (101 ) but rather heat transfer through the mechanical coupling is simply a result of the mechanical coupling, and may be minimized as much as possible.
  • FIG. 4 depicts an option of the mold-tool system (100), wherein the heating assembly (102) is partially connected to and partially decoupled from the heatable component (101 ).
  • This partial coupling is a consequence of supporting the heating assembly (102) and not intended to be a primary source of heat transfer from the heating assembly
  • the primary source of heat transfer from the heating assembly (102) that is to be received by the object or item is radiatve heat.
  • FIG. 5 depicts an option of the mold-tool system (100), wherein the heating assembly (102) is positioned, at least in part, in a void (106) being defined by the heatable component (101 ).
  • the heating assembly (102) such as an infrared heater
  • all (or at least most) of the radiation emitted from the heating assembly (102) is directed, via the void (106), towards the heatable component (101 ).
  • the support structure configured to maintain the heating assembly (102) in position in the void (106) may be minimized so as to reduce heat transfer along the support structure to the heatable component (101 ).
  • This arrangement provides the advantage of improved heating efficiency.
  • the support structure may provide a degree of mechanical coupling, and so heat transfer along the support structure may be minimized as much as possible.
  • FIG. 6 depicts an option of the mold-tool system (100), wherein the heating assembly (102) is connected to another component (110) that is located adjacent to the heatable component (101 ).
  • This configuration reduces an amount of mechanical coupling between the heating assembly (102) and the heatable component (101 ), and any associated localized heat transfer to the heatable component (101 ) through the mechanical coupling, and then this arrangement provides for improved consistency of temperature associated with the heatable component (101 ).
  • FIG. 7 depicts an option of the mold-tool system (100), in which the mold-tool system (100) further includes (and is not limited to) a reflector assembly (112) .
  • the reflector assembly (112) is for reflecting an amount of heat imparted from the heating assembly (102) to the heatable component (101 ).
  • the reflector assembly (112) may be set apart from the heating assembly (102).
  • the reflector assembly (112) improves heating efficiency by increasing amount of heat to be transfered from the heating assembly (102) to the heatable component (101 ).
  • the reflector assembly (112) may be used in the arrangements depicted in the other FIGS, such as FIGS. 4 and 6.
  • the reflector assembly (112) may also include a mechanism (not depicted) that is configured to support position of the heating assembly (102) relative to the heatable component (101 ).
  • a mold-tool system (100) comprising: a heating assembly (102) being configured to deliver heat to a heatable component (101 ), the heat being delivered to the heatable component (101 ) by the heating assembly (102) is substantially radiative heat, and the balance of the heat being delivered to the heatable component (101 ) by the heating assembly (102) is a combination of conductive heat and convective heat.
  • a mold-tool system (100) comprising: a heatable component (101 ); and a heating assembly (102) being configured to deliver heat to the heatable component (101 ), the heat being delivered to the heatable component (101 ) by the heating assembly (102) is substantially radiative heat, and the balance of the heat being delivered to the heatable component (101 ) by the heating assembly (102) is a combination of conductive heat and convective heat.
  • the heating assembly (102) includes: an infrared assembly (104) configured to provide infrared-radiative heat to the heatable component (101 ).
  • Clause (4) the mold-tool system (100) of any clause described in this paragraph, wherein: the heating assembly (102) is partially connected to and partially decoupled from the heatable component (101 ).
  • Clause (5) the mold-tool system (100) of any clause described in this paragraph, wherein: the heating assembly (102) is positioned, at least in part, in a void (106) being defined by the heatable component (101 ).
  • Clause (6) the mold-tool system (100) of any clause described in this paragraph, wherein: the heating assembly (102) is connected to another component (110) that is located adjacent to the heatable component (101 ).
  • Clause (7) the mold-tool system (100) of any clause described in this paragraph, further comprising: a reflector assembly (112) for reflecting an amount of heat imparted from the heating assembly (102) to the heatable component (101 ).
  • Clause (8) the mold-tool system (100) of any clause described in this paragraph, wherein: the reflector assembly (112) is set apart from the heating assembly (102).
  • Clause (9) a molding system (900) having the mold-tool system (100) of any clause described in this paragraph.
  • Clause (11 ) a method of operating the mold-tool system (100) of any clause described in this paragraph, comprising: delivering heat to a heatable component (101 ) of the mold-tool system (100), the heat being delivered to the heatable component (101 ) is substantially radiative heat, and the balance of the heat being delivered to the heatable component (101 ) is a combination of conductive heat and convective heat.
  • FIGS. 1 to 7 depict examples of the mold-tool system (100). It will be appreciated that the examples depicted in FIGS. 1 to 7 may be combined in any suitable permutation and combination well within the skill of persons of skill in the art. It will be appreciated that the assemblies and modules described above may be connected with each other as may be required to perform desired functions and tasks that are within the scope of persons of skill in the art to make such combinations and permutations without having to describe each and every one of them in explicit terms. There is no particular assembly, components, or software code that is superior to any of the equivalents available to the art. There is no particular mode of practicing the inventions and/or examples of the invention that is superior to others, so long as the functions may be performed.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention porte sur un système d'outil de moule (100) qui comporte : un ensemble de chauffage (102) conçu pour apporter de la chaleur à un élément pouvant être chauffé (101). La chaleur qui est apportée à l'élément pouvant être chauffé (101) par l'ensemble de chauffage (102) est essentiellement une chaleur radiante, et le reste de la chaleur qui est apportée à l'élément pouvant être chauffé (101) par l'ensemble de chauffage (102) est une combinaison de chaleur transmise par conduction et de chaleur transmise par convection.
PCT/US2012/037891 2011-05-20 2012-05-15 Apport de chaleur radiante à système d'outil de moule Ceased WO2012162021A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161488426P 2011-05-20 2011-05-20
US61/488,426 2011-05-20

Publications (1)

Publication Number Publication Date
WO2012162021A1 true WO2012162021A1 (fr) 2012-11-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/037891 Ceased WO2012162021A1 (fr) 2011-05-20 2012-05-15 Apport de chaleur radiante à système d'outil de moule

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WO (1) WO2012162021A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3491170A (en) * 1964-09-14 1970-01-20 Owens Illinois Inc Production of molded containers
US3675905A (en) * 1970-09-17 1972-07-11 Dorn Co V Method and apparatus for infrared heating
US20040046290A1 (en) * 2002-09-06 2004-03-11 Byung Kim Microchannel fabrication
US7824165B2 (en) * 2006-07-06 2010-11-02 Comtek Advanced Structures Limited System for resin curing
US20110006460A1 (en) * 2009-07-07 2011-01-13 The Boeing Company Curing system and method using electromagnetic force and conductive heat transfer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3491170A (en) * 1964-09-14 1970-01-20 Owens Illinois Inc Production of molded containers
US3675905A (en) * 1970-09-17 1972-07-11 Dorn Co V Method and apparatus for infrared heating
US20040046290A1 (en) * 2002-09-06 2004-03-11 Byung Kim Microchannel fabrication
US7824165B2 (en) * 2006-07-06 2010-11-02 Comtek Advanced Structures Limited System for resin curing
US20110006460A1 (en) * 2009-07-07 2011-01-13 The Boeing Company Curing system and method using electromagnetic force and conductive heat transfer

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