WO2012148313A1 - Modular light-emitting diode luminaire - Google Patents

Abstract

The modular light-emitting diode luminaire relates to tubeless lighting engineering devices based on light-emitting diodes. Said luminaire comprises a base, a printed circuit board, at least one light-emitting diode arranged on the printed circuit board, an optical element, a heat-dissipating device, and a box with a power supply unit, a control circuit unit and electrical connecting elements, wherein the heat-dissipating device consists of a substrate, which simultaneously acts as the base of the heat-dissipating device, wherein the printed circuit board and the optical element are positioned on one side of the substrate, and heat-dissipating radiators with a special shape are positioned on the opposite side, wherein the central heat-dissipating radiator and the outermost heat-dissipating radiators are formed integrally with the substrate, wherein the base is in the form of a rectangle and has projections around the edges of each lateral side, wherein the lower part of the projections is intended for fixing the printed circuit board and the optical element, the upper part of the projections is formed by the outermost heat-dissipating radiators, and the lateral parts of the projections are equipped with longitudinal irregularly shaped grooves, wherein the central heat-dissipating radiator has, at the end and on the side opposite the substrate, a widened portion with an open longitudinal irregularly shaped groove provided in the center thereof.

Description

 MODULAR LED LIGHT

Technical field

Modular LED luminaire refers to lampless lighting devices based on LEDs and can be used as a lighting device in industrial and domestic conditions, both indoors and outdoors to provide lighting.

BACKGROUND OF THE INVENTION A “lampless lighting device based on LEDs” is known, patent for a utility model of the Russian Federation N ° 100178, F21 S4 / 00, patent holder UNISTAR OPTO CORPORATION (TW), prototype. According to this patent, an LED-based lighting device comprises at least one base, which has an upper part forming at least one connecting section, at least one LED lighting module attached to the connecting section of the base, and at least one a control circuit that provides selective on / off functions of the LED lighting module and conversion alternating current and direct current, and this control circuit is connected to the base and electrically connected to the LED lighting module, and is also designed to be connected to an external power source, while in the lighting device based on LEDs, the base contains a heat sink, in addition, the base has a hollow the inner region forming the enclosing channel, while in the enclosing channel is at least one layer of a waterproof substance and it has opposite ends, to which The end caps are respectively attached, and each of the end caps has a lower portion forming connecting tabs that are inserted into the containing channel, and also have an opening that is closed by a sealing plug, the base having a lower part to which at least one mounting element, in addition to the lower section to which at least one suspension arm is connected and the connecting section of the base forms an inclined surface; options: the base has a triangular cross section, the base has a chevron cross section, the base contains at least one cap attached to the top of the base, while the cap has inner edges forming at least one mounting flange attached to the top parts of this foundation; LED lighting module contains at least one layer of waterproof substance deposited on its surface, the LED lighting module contains one multi-chip integrated circuit in the housing; LED lighting module contains at least one circuit board mounted on the connecting section of the base, and this circuit board has a surface forming a wiring diagram for connecting the power supply of the LEDs, many individual single-crystal LEDs, each of which is attached to the circuit board for connection with the circuit electrical wiring for connecting the power supply of the LEDs, providing a power supply for emitting light, while the control circuit contains at least at least one power cable and a control cable, and the power cable is designed to be connected to an external power source, and the control cable is electrically connected to the LED lighting module. Disclosure of invention

However, when using the lighting device according to the prototype, it is impossible to create a given light spot, because there is no possibility of assembling a multi-module design. The heat sink device is made in the form of a closed structure, which complicates the heat sink during operation of the device. The technical problem solved by the claimed utility model is the creation of a modular LED lamp with a reliable heat sink and the ability to form a given light spot.

The technical problem is solved due to the fact that a modular LED lamp based on LEDs contains, a base, a printed circuit board, at least one LED located on a printed circuit board, an optical element, a heat sink, a box with a power supply, a control circuit unit and electric connecting elements, wherein the heat sink device consists of a substrate, which is also the base of the heat sink device, with a printed circuit board and an optical element located on one side of the substrate t, and on the opposite side there are heat sinks of a special shape, the central heat sink and the extreme heat sinks made in one piece with the substrate, while the base is made in the form of a rectangle and has protrusions along the edges of each side, and the lower part of the protrusions is for mounting a printed circuit board and an optical element, the upper part of the protrusions is formed by extreme heat sinks, and the side parts of the protrusions are provided with longitudinal curly grooves, the central heat sink radiator has at the end, on the side opposite the substrate, a thickening in the center which provides an open longitudinal figured groove. The lower part of the protrusions has rectangular longitudinal grooves made from the inside, with the possibility of placing and fixing an optical element in them, and a printed circuit board is placed in the opening between the substrate and the optical element. In another embodiment, an opening is provided on the inner side of the lower part of the protrusions for accommodating a printed circuit board, and the optical element is made in the form of a box with thickenings in each inner corner for fastening to the outside of the lower part of the protrusions. The central heat sink is made profile. Extreme heat sink radiators are also made profile. In one design, all heat sink radiators are made profile. Profile heat sinks may have a varying thickness value. Heat sink radiators are made different in height, while in the central part of the heat sink device, the heat sink radiators have a greater height than at the edges. In another embodiment, the substrate has independent heat sink elements. Independent heat sink elements are made with periodically alternating radius value. In another design, independent heat sink elements are made in the form of a spiral. In another design, independent heat sink elements are made in the form of an Archimedean screw. The printed circuit board with LEDs is made typed from individual elements, each of which contains one LED. In another embodiment, the printed circuit board with LEDs is made up of individual elements, each of which contains three LEDs. A printed circuit board with LEDs can be made up of individual longitudinal elements, each of which contains LEDs in series. A printed circuit board with LEDs can also be made in one piece with LEDs sequentially arranged along two plane coordinates. In another design, the printed circuit board can be <made integrally with randomly arranged LEDs, while the average distance between individual LEDs is in the range Xl <d <X2, where Xi and X2 are the minimum and maximum distances between the centers of the LEDs, respectively, and the value Xi does not exceed the size of the LED. In addition, the modular LED lamp contains at least two devices for attaching the modular LED lamps to each other to form a multi-module system. The device for attaching the modular LED luminaires to each other is made in the form, for example, of a rocker arm, which has protruding elements on the long side directed downward in the form of reeds in cross section, and on the middle side downward, has elements also made at the edges on both sides as reeds in cross section. When mounting modular LED luminaires located on the same horizontal line, with each other, on the middle side down, the tabs are perpendicular to the middle side. When modular LED fixtures are fastened together at an angle of descent directed upward on the middle side downward, the tabs are directed at an angle upward with respect to the middle side. In another design, when mounting the modular LED fixtures to each other at a vanishing angle directed downward, on the middle side downward, the tabs are directed at an angle downward with respect to the middle side.

Brief description of figures and drawings

The inventive device is illustrated by drawings, where,

 In FIG. 1 - schematically shows a modular LED lamp assembly;

 In FIG. 2 is a bottom view of the device of FIG. 1.

 In FIG. 3 - shows a top view of the modular LED lamp of figure 1.

 Fig. 4 is a view A of Fig. 1 in section.

In FIG. 5 is an enlarged front view of a box with a power supply, a control circuit unit and electrical connecting elements of the power supply. In FIG. 6 - schematically shows a modular LED lamp.

 In FIG. 7 - shows a side view of the modular LED lamp of Fig.6.

 In FIG. 8 - schematically shows a modular LED lamp with an optical element made in the form of a box.

 In FIG. 9 - a perspective view of an optical element made in the form of a box.

 Figure 10 - shows a front view of the heat sink element of a modular LED lamp with heat sink radiators, made in one piece with the substrate.

 In FIG. 1 1 - shows a front view of the heat sink element of a modular LED lamp with heat sinks made as separate heat sink elements fixed on the substrate.

 On Fig - shows a top view of the heat sink element of a modular LED lamp with heat sinks made as separate heat sink elements fixed to the substrate.

In FIG. 13 is a bottom view of a printed circuit board with LEDs, recruited from individual elements consisting of one LED each. In FIG. 14 is a bottom view of a printed circuit board with LEDs composed of individual elements consisting of three LEDs each.

 In FIG. 15 is a bottom view of a printed circuit board with LEDs recruited from individual longitudinal elements consisting of several LEDs each arranged in series.

 In FIG. 16 is a bottom view of a printed circuit board with sequentially arranged LEDs.

 In FIG. 17 is a bottom view of a printed circuit board with randomly arranged LEDs on it.

 In FIG. 18 is a schematic front view of a heat sink with a varying thickness value, an enlarged size.

 In FIG. 19 is a plan view of a heat sink radiator of FIG. 18 with a break on both sides.

 In FIG. 20 is a schematic illustration of a heat sink element with a periodically alternating radius value.

 In FIG. 21 is a plan view of a heat sink element with a periodically alternating radius value.

 In FIG. 22 is a schematic front view of a heat sink element made in the form of a spiral.

In FIG. 23 is a plan view of a heat sink element made in the form of a spiral. In FIG. 24 is a schematic front view of a heat sink element made in the form of an Archimedean screw.

 In FIG. 25 - shows a top view of the element of the heat sink, made in the form of an Archimedean screw.

 On Fig - two modular LED lamps are shown assembled with boxes with a power supply, a control circuit unit and electrical connecting elements each and with devices for attaching to the internal surfaces of the building, when fastening the modular LED lamps located on the same horizontal, with each other.

 FIG. 27 is a plan view of FIG. 26.

 On Fig - shows a front view of the mounting element of the modular fixtures among themselves.

 On Fig - shows a bottom view of the mounting element of the modular fixtures among themselves.

 On fig.ZO - two modular LED luminaires are assembled, when mounting modular LED luminaires located at an angle of descent, directed upwards, between each other.

 On Fig - shows a front view of the mounting element of the modular fixtures among themselves in Fig.Z.

On Fig - shows two modular LED lamp assembly, when mounting a modular LED luminaires located at an angle of descent directed downwards between themselves.

 On Fig.ZZ - shows a front view of the mounting element of the modular fixtures among themselves in Fig.32.

Options for the execution of the claimed device

The inventive modular LED lamp contains a base 1 of the device, a printed circuit board 2, at least one LED 3 located on the printed circuit board 2, an optical element 4, a heat sink device 5 with high thermal conductivity, while the base 1 is a substrate 6 of the heat sink device 5, box 7 with a power supply unit, a control circuit unit and electrical connecting elements (not shown in Fig.), a device for attaching to the internal surfaces of a building 8, a device for attaching modular LED lamps m 9 is forward.

 The heat sink device 5 consists of a substrate 6, on one side of which, on the opposite side with a LED 3 or a set of LEDs 3, heat sinks 10 are arranged in a special shape.

The heat sink radiators 10 can be made integrally with the substrate 6 (see Fig. 1, 4, 6, 8, 10), in this case they are made profile, and can also be performed as separate heat sink elements 11 (see Fig. eleven, 12, 20, 21, 22, 23, 24, 25) with their subsequent fixation on the substrate 6, for example, due to the fact that such independent heat-removing elements 1 1 have, at the end, from the side of the substrate 6, a helical thread and, accordingly, the substrate 6 in this case has screw-shaped holes (not shown in FIG.). Heat sink radiators 10 and independent heat sink elements 1 1 are made at a distance from each other to form convective flows. They are made different in height, while in the Central part of the heat sink device 5, heat sinks 10 and independent heat sink elements 1 1 have a greater height than at the edges. The heat sink device 5 has a central heat sink radiator 12, which has a thickening at the end, from the side opposite to the substrate 6

13, on the outside of which there is provided a longitudinal figured groove 14, which is necessary for fastening the fasteners 15 of the box 7 with a power supply, a control circuit unit and electric connecting elements and fasteners 16 of the fastening device to the internal surfaces of the building 8, as well as the fastening of modular LED lamps between themselves with a multi-module design by means of a fastening device for modular LED fixtures between themselves 9, namely, the protruding elements 17. The central heat sink radiator 12 is made only profile and only integrally with the substrate 6. The extreme heat sink radiators 18 are made integrally with the substrate 6 in any embodiment of the heat-conducting radiators 10 or independent heat-removing elements 11.

 The base 1 of the device, which is simultaneously the substrate 6, is made in the form of a rectangle (see Figs. 1, 2) and has protrusions 19 along the edges of each side of the rectangle, while the lower part 20 of the protrusions 19 is made with a rectangular longitudinal groove 21 made with an inner the side of the lower part 20, designed to accommodate and fix the optical element 4. In the formed space between the lower part of the substrate 6 and the optical element 4 is a printed circuit board 2, which is attached to the lower part of the substrate, for example, screws. Thus, a gap is formed between the printed circuit board 2 and the optical element 3, which can be filled with a layer of heat-removing material, for example, heat-conducting paste G751, or G765, or X23-7762. With this design, the optical element 4 is latched in the lower part of the protrusions, and the printed circuit board 2 is fixed on the lower side of the substrate 6 by fastening, for example, with screws (not shown in FIG.).

Another option for mounting the optical element 4 is to mount it to the outer sides of the lower part protrusion 20, in this case, the optical element 4 is made in the form of a box 22 (see Fig. 9) with thickenings in each inner corner for fastening to the outer part of the protrusions, for example, with screws (not shown in Fig.).

 The upper part of the protrusions 19 is formed by extreme heat sink radiators 18, while the lateral parts of the protrusions 19 are provided with longitudinal figured grooves 23, intended for fastening the modular LED fixtures to each other by means of the fastening device for the modular LED fixtures to each other 9 (with a multi-module design of a modular LED fixture). The device is designed in such a way that provides the creation of multi-module systems. For attaching two modular LED lamps to each other, at least two devices for attaching the modular LED lamps to each other are used 9. The number of devices for attaching the modular LED lamps to each other 9 depends on the weight of the structure and is determined by calculation. For fastening three modular LED luminaires to each other, at least four devices for attaching modular LED luminaires to each other 9 are used (not shown in Fig.). Their mutual arrangement is determined by calculation and is not the subject of the claimed device.

The mounting device of the modular LED fixtures among themselves 9 can be made in the form of, for example, the beam (Fig. 28, 29, 31, 33) and has on the long side protruding elements 17 located at some distance from the edges of the long side and directed downward. The protruding elements 17 are made in the form of reeds in cross section. The middle downward side has elements 24 at the edges on both sides, also made in the form of reeds in cross section. In the central part of the device for attaching the modular LED luminaires to each other 9, a through rectangular groove 25 is provided, passing into the slotted hole in the center of the middle downward side to facilitate construction. When mounting modular LED lights located on the same horizontal, between themselves, use the design of the horizontal rocker 26, while the long sides of the horizontal rocker 26 are made horizontally (see Fig.28). The assembly of modular LED lights in this design is made, as shown in Fig.26. When mounting modular LED lamps located at an angle of descent directed upwards between themselves, use the design of an arcuate rocker arm 27, the long sides can have an arcuate upper contour (see Fig.30, 31). The assembly of modular LED lamps in this design is performed, as shown in Fig.30. When mounting modular LED lamps located at an angle of descent, directed downward, between themselves, use

h the rocker structure 28, the long sides can have an arched upper contour (see Fig. 32, 33). The assembly of modular LED luminaires in this design is carried out as shown in FIG. 32.

 The use of the various assembly designs of the modular LED luminaires described above among themselves allows one to form a predetermined level of illumination and directivity of the light spot on the illuminated object, allows to increase or decrease the light spot, which is determined by the needs of the work and the level of the specified lighting. When using one modular LED lamp, the level of preset lighting is controlled by the electrical parameters of the device, and the directivity of the light spot by the method of attaching the modular LED lamp to the bearing surfaces (not shown in Fig.).

The box 7 with a power supply unit, a control circuit block and electrical connecting elements has fasteners 15 outside the lower central part, made as longitudinal protrusions and made in the form of tongues in section for fitting into the longitudinal figured groove 14 of the central heat sink 12 (for mechanical connection of the box 7 with a power supply, a control circuit unit and electrical connectors). Box 7 with a power supply, a control circuit block and electrical connectors at the bottom part has a longitudinal groove 29 along the entire length, designed to lead the wires of the control circuit and the power supply outward in order to ensure their contact with the board 2 and the power supply network (electrical connection, not shown in FIG.). The fastening elements to the internal surfaces of the building 8 (mounting elements) are also provided with tabs in the form of tongues 16. The fastening devices to the internal surfaces of the building 8 are made in the form of pendants connecting to the ceiling of buildings, or in the form of pendants connecting to brackets located directly on the walls of buildings (not shown in FIG.).

 At least one LED 3, or a set of LEDs 3 (see Fig. 13, 14, 15, 16, 17) is mounted on a printed circuit board 2, connected, in turn, to the control circuit and the power supply (not shown in Fig.) .

A printed circuit board 2 with LEDs 3 can be made up of individual elements, each of which contains one LED 3 (FIG. 13), composed of individual elements consisting of three LEDs 3 each (FIG. 14), composed of separate longitudinal elements consisting of of several LEDs 3 arranged in series each (Fig. 15). The printed circuit board can be made in one piece with the LEDs 3 arranged in series on it (Fig. 16). Circuit board 2 may be made in one piece with randomly arranged LEDs 3 (Fig.17).

The calculation of the minimum distance Xi and the maximum distance x ₂ between the centers of the LEDs can be performed as follows.

 The average distance between two adjacent LEDs is d = (S = (LW / N), where,

Ν - the number of LEDs on the circuit board,

L is the length and W is the width of the area occupied by all the LEDs,

S i. area per LED, however,

Si = LW / N

XI is the minimum distance between the centers of the LEDs, Xl ⁼ 0.5d.

 X2 ~ the maximum distance between the centers of the LEDs, l, 5d.

не должна превышать размера светодиода. Такое расположение светодиодов, особенно в сочетании с диффузным оптическим элементом обеспечивает однородное освещение. In option 4, the LEDs are arranged randomly, but with an average distance between individual LEDs in the interval

should not exceed the size of the LED. This arrangement of LEDs, especially in combination with a diffuse optical element, provides uniform illumination.

 Independent heat-removing elements 11 can be made: with a periodically alternating radius value (see Fig. 20, 21), in the form of a spiral (see Fig. 22, 23), in the form of an Archimedean screw (see Fig. 24, 25) and other

 We present the calculation of the effective heat sink for independent heat sink elements 1 1 with a periodically alternating radius value.

 The surface shape of the independent heat sink element 1 1 is chosen to provide better heat dissipation from the printed circuit board and the heat sink element. For this purpose, the three-dimensional surface of the independent heat sink element 1 1 is selected from the criterion of the largest surface area S for the same volume V of the independent heat sink element 11. For the lighting device, the shapes of the independent heat sink elements 1 1 are calculated, finding the largest possible S / V ratio.

To do this, first calculate the S / V ratio for an independent heat sink element 1 1, made in the form of a cylinder of diameter D and height H. A simple cylindrical independent heat sink element 1 1 has the following parameters: the area of the heat-emitting surface (without the lower base of the independent heat-removing element 11)

S _mJl = πΌ ^2/4 + πΌΗ = πΌ (Ό / 4 + Η),

 · Volume of an independent heat-removing element

W _mn = O ² W4,

/ У_цил = 4(D/4 + H)/DH = 1/Н + 4/D. Then calculate the ratio of area to volume for a cylindrical independent heat sink element 1 1:

/ _Cyl = 4 (D / 4 + H) / DH = 1 / H + 4 / D.

Then, the ratio & hell I ^ rad is calculated for an independent heat-removing element 11 of complex shape, where,

^ rad "the surface area of the independent heat sink element 11 of complex shape,

^ hell "volume of an independent heat-removing element 1 1 of complex shape.

Then, the ratio $ r _a d / ^ p ^ d for an independent heat sink element 1 1 of complex shape is compared with the value of 3s _IL / \ ^ c _IL and find the dimensions of the independent heat-removing element 11 of complex shape or aspect ratio at which S _paa / Y _rad > 8 _CYL / U _cyl .

For example, an independent heat sink element 11 with a surface having a cylindrical shape with a periodically alternating radius value (ΙΪ1 alternating pairs with a height of \ And h ₂ and a diameter of Dj and D ₂ , respectively) (see Fig. 20, 21). Then the volume of the independent heat sink element U _dv, cyl ^and the surface area of the independent heat sink element 8d _V c _IL are described by the relations:

Y _dvil = m (Vi + V ₂ ) = Dj ² + D2 ² ) H / 8m, where,

(Όχ ^2/4 - D ₂ ^2/4) + πΌ ₂ ^2/4 = π [mH / 8 (Ό _χ + D ₂₎ + ^ (m- ^ CD ^ - D ^ + D ^],

 Where,

^ dv.tsil "surface area of an independent heat-removing element 11 without taking into account the bottom a cylinder that is in contact with the surface of the substrate 6 of the heat sink device 5,

 W - the number of pairs of cylinders with periodically alternating radius value

 Vj is the volume of the cylinder with a height b. \ And a diameter Dj,

высота меньшего цилиндра. V2 is the volume of the cylinder with a height ll2 and diameter D2, DI is the diameter of the larger cylinder, D2 is the diameter of the smaller cylinder, b. \ is the height of the larger cylinder,

height of the smaller cylinder.

Set the dimensions of the cylinders with a periodically alternating radius value

D ₂ = D _{1/3, h!} = h ₂ = H / 2m, m = 4

and the condition for the equality of masses (volumes) Vqji _j! ^{= G} d _V c _IL at the same height,

And when calculating according to the above formulas get

8_дв.цил У_дв._цил = (4,5D + 1,8H)/4DH = l,125/H + 0,45/D.

8 _dv .tsil have _{bits. cyl} = (4.5D + 1.8H) / 4DH = 1, 125 / H + 0.45 / D.

 Next, the heat sink ability of the independent heat sink element 1 1 of a cylindrical shape is compared with a periodically alternating radius value and the cylindrical independent heat sink element 11, it is necessary to find the ratio

- ^ ~ (^ CYL _4Iin ) / (S dv.tsil / V dv.tsil) '

A more efficient heat sink means the fulfillment of the condition R <1. For the considered independent heat sink element 11 from cylindrical pairs R ⁼

16 (D / 4 + H) / (4.5D + 1.8H).

Let D / H— be the form factor of the cylinder. Then R is 0.91 [1 + 3.6 / (p + 0.4)]. Condition R <1 will be satisfied at> 22.7. Consequently, an effective heat sink occurs when the diameter of the cylinder D is compared to the height of the cylinder H, if the diameter of the smaller cylinder in the independent heat sink element 1 1 is cylindrical with a periodically alternating radius value three times smaller than the diameter of the larger cylinder. A similar order of magnitude result is obtained for spherical or ellipsoidal surfaces.

 Consider an independent heat sink element 11, made in the form of a spiral. Let a spiral independent heat sink element be formed from

"Wire" with a diameter of d and a length of 1 (Fig. 22, 23).

 Then the volume of the independent heat sink element

Vfoelix and the surface area of the radiator Sh _e } i _x are described by the relations:

Vheiix = πά ² 1/4,

Shelix = πά ^2/4 + zh11 = πά (ά / 4 + 1)

 Where

 d is the diameter of the cylinder from which the spiral is twisted,

1 - the length of the cylinder from which the spiral is twisted.

If the spiral occupies a space corresponding to a cylinder of diameter D and height H, then these dimensions are related to the length of the cylinder from which the spiral is twisted, 1 and the number of turns of the spiral N by the relations H ⁼ l SIH X, D ⁼ l COSCfc /

N (ANGLE α - see Fig.) Then (Acyl psh) = [4 (D / 4 + H) / DH] = N [(1

 2

cosa / 4N + 1 sina) / 41 sina cosa],

 Where

 D is the cylinder diameter, H is the height of the cylinder,

N is the number of turns of the spiral, a is the angle of inclination of the coil of the spiral with respect to the surface of the heat-conducting substrate.

 For a spiral independent heat sink element, the parameter

R = (S ™ ™ u) I (Shelix Vhelix) = N d

(cosa / 4N + sina) / 16 (d / 4 + 1) sina cosa. If 1 d = 4 and a = 0, l is glad, then R = N (1/4) (1 / 4N + 0,1) / 16 (1/16 + 1) 0,1 = N (N + 0, 4) / 6.784. The condition of effective heat removal R <1 means the execution of a spiral with the number of turns N> 2.4.

The material for the printed circuit board 2 and for the heat sink device 5 must have a high thermal conductivity value to provide the heat sink necessary for operation of the lighting device. Can be used for this an alloy containing aluminum, for example, an aluminum-magnesium alloy. Board 2 can also be made of sheet heat-conducting material, for example, Normacon KPDT-2.

 The device for attaching to the internal "surfaces of the building 8, as well as the device for attaching the modular LED luminaires to each other 9 with a multi-module design of the luminaire, have a design that provides convenient and reliable assembly of the device and its fastening, which also makes it easy to carry out repair and maintenance work.

 The optical element 4 is a plate with a given profile of the external and internal surfaces and a given level of light transmission or can be made in the form of a set of lenses to form the desired level of illumination inside an industrial building, as well as for outdoor lighting. The optical element 4 can be made in the form of a box with thickenings in each inner corner for fastening to the outer part of the protrusions, for example, with screws (not shown in FIG.).

 The material of the optical element 4 may be glass or transparent plastic, for example, acrylic polymer.

The best versions of the claimed device Assembly of a modular LED lamp

carried out as follows.

At least one LED 3 or a set of LEDs 3 is placed on the printed circuit board 2. The printed circuit board 2 with LEDs 3 is attached to the underside of the substrate 6, for example by screws. Then, in the longitudinal rectangular groove 21 of the lower part 20 of the protrusions 19 of the substrate 6, an optical element 4 is installed. With this design, the optical element 4 is latched in the lower part of the protrusions 19. In another embodiment, the optical element 4 is fastened to the outer sides of the lower part of the protrusion 20, for example, with screws, in this case, the optical element is made in the form of a box (see Fig. 9). Then, fasteners 15 of the box 7 with the power supply unit, the control circuit block and electrical connecting elements are inserted into the longitudinal figured groove 14 of the central heat sink radiator 12 and the box is moved approximately to the middle of the longitudinal figured groove 14. After that, the modular LED lamp is attached to the walls of the building using the device fastening to the internal surfaces of the building 8 (not shown in Fig.). The fastening elements 16 of the fastening device to the inner surfaces of the building 8 are inserted into the longitudinal figured groove 14 of the central heat sink radiator 12 from two sides. Fixing of individual parts in a longitudinal figured groove 14 can be implemented, for example, with screws, studs, etc.

 When assembling multimodular systems from modular LED fixtures, the elements 24 are inserted into longitudinal figured grooves 23, fixing the LED modular fixtures to each other at the level of the base 1. At the same time, the protruding elements 17 are inserted into the grooves 14 of the central heat sink radiators 12 of two two modular LED lamps, providing a rigid spatial orientation modular LED luminaires, as well as their reliable mounting between themselves.

Industrial applicability The device operates as follows.

A modular LED lamp assembled using fasteners from various parts of the device and attached to the internal surfaces of the building using fasteners 8 is turned on by a power supply connected to the electrical circuit of an industrial building. The electric current flowing through the LEDs 3, causes their glow, the brightness of which depends on the amplitude of the control signals. The light emitted by the light emitting diodes 3 passes through the optical element 4, forming a predetermined level of illumination on the illuminated object, which is determined by the needs of the work and the level of the set lighting. Thus, when using a single modular LED lamp, the level of the specified lighting is controlled by the electrical parameters of the device, and the direction of the light spot is controlled by the method of attaching the modular LED lamp to the bearing surfaces.

 The use of different versions of the assembly of modular LED lamps among themselves allows you to create a given level of illumination and directivity of the light spot on the illuminated object, which is also determined by the needs of the work and the level of the specified lighting.

 Thus, the technical task posed, namely, the creation of a modular LED lamp with a reliable heat sink and with the possibility of forming a given light spot, is fully implemented in the claimed utility model.

List of items

Base 1

 Circuit board 2

 LED 3

 Optical Element 4

 Substrate 6

Box 7 The internal surfaces of the building 8

Mounting device for modular LED lights 9.

Heat sinks 10

Independent heat sink elements 1 1 Central heat sink heat sink 12 Thickening 13

 Longitudinal groove 14

 Fastener 15

 Fastener 16

 The protruding element 17

 Extreme heat sinks 18

 Projection 19

 The lower part of the ledge 19 19

Rectangular longitudinal groove 21

Box 22

Figured groove 23

Elements 24

 Through rectangular groove 25

Horizontal Rocker 26

Arc-shaped rocker 27

Rocker 28

Longitudinal groove 29

Claims

CLAIM 1. A modular LED lamp based on LEDs, comprising, a base, a printed circuit board, at least one LED placed on a printed circuit board, an optical element, a heat sink, a box with a power supply, a control unit and electrical connecting elements,  characterized in that the heat sink device consists of a substrate, which is also the base of the heat sink, with a printed circuit board and an optical element located on one side of the substrate, and heat sinks of a special shape located on the opposite side, the central heat sink and the extreme heat sinks made in one piece with the substrate, and the base is made in the form of a rectangle and has projections at the edges of each side, while the lower part of the protrusions is intended for the heat of the printed circuit board and the optical element, the upper part of the protrusions is formed by extreme heat sinks, and the side parts of the protrusions are provided with longitudinal figured grooves, while the central heat sink radiator has a thickening at the end opposite the substrate, in the center of which there is an open longitudinal figured groove . 2. The device according to claim 1, characterized in that the lower part of the protrusions has rectangular longitudinal grooves made on the inside, with the possibility of placing and fixing the optical element in them, and in the opening between the substrate and the optical element by placing a printed circuit board.  3. The device according to p. 1, characterized in that on the inner side of the lower part of the protrusions there is an opening for placing the printed circuit board, and the optical element is made in the form of a box with thickenings in each inner corner for fastening to the outer side of the lower part of the protrusions.  4. The device according to p. 1, characterized in that the central heat sink is made profile.  5. The device according to p. 1, characterized in that the extreme heat sink radiators are made profile.  6. The device according to p. 1, characterized in that all heat sink radiators are made profile.  7. The device according to p. 1, characterized in that the heat sink radiators made profile, have a varying thickness value. 8. The device according to claim 1, characterized in that the heat sink radiators are made different in height, while in the central part of the heat sink device the heat sink radiators have a greater height than at the edges. 9. The device according to p. 1, characterized in that on the substrate there are independent heat-removing elements.  10. The device according to p. 9, characterized in that the independent heat-removing elements are made with periodically alternating radius values.  1 1. The device according to p. 9, characterized in that the independent heat-removing elements are made in the form of a spiral.  12. The device according to p. 9, characterized in that the independent heat sink elements are made in the form of an Archimedean screw.  13. The device according to claim 1, characterized in that the printed circuit board with LEDs is made up of individual elements, each of which contains one LED.  14. The device according to p. 1, characterized in that the printed circuit board with LEDs is made up of individual elements, each of which contains three LEDs.  15. The device according to claim 1, characterized in that the printed circuit board with LEDs is made up of individual elements, each of which contains LEDs arranged in series. 16. The device according to claim 1, characterized in that the printed circuit board with LEDs is made in one piece with the LEDs sequentially arranged along two plane coordinates. 17. The device according to claim 1, characterized in that the printed circuit board is made in one piece with randomly arranged LEDs, while the average distance between the individual LEDs is in the interval Xl _d <: X2 _> where X \ and X2 are the minimum and maximum distances between LED centers, respectively, and the value xj does not exceed the size of the LED.  18. The device according to claim 1, characterized in that it contains at least two devices for attaching the modular LED luminaire to each other to form a multi-module system.  19. The device according to p. 18, characterized in that the device for attaching the modular LED fixtures to each other is made in the form of a rocker arm, which has protruding elements on the long side directed downward in the form of tongues in cross section, and on the middle side directed downwards, along the edges on both sides of the elements, also made in the form of reeds in cross section.  20. The device according to p. 19, characterized in that on the middle side, downward, the tabs are perpendicular to the middle side. 21. The device according to p. 19, characterized in that on the middle side, downward, the tabs are directed at an angle upward relative to the middle side. 22. The device according to p. 19, characterized in that on the middle side downward, the tabs are directed at an angle downward relative to the middle side.