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WO2012035627A1 - Élément support pour carte de circuits imprimés, unité de carte de circuits imprimés et dispositif électronique - Google Patents

Élément support pour carte de circuits imprimés, unité de carte de circuits imprimés et dispositif électronique Download PDF

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Publication number
WO2012035627A1
WO2012035627A1 PCT/JP2010/065974 JP2010065974W WO2012035627A1 WO 2012035627 A1 WO2012035627 A1 WO 2012035627A1 JP 2010065974 W JP2010065974 W JP 2010065974W WO 2012035627 A1 WO2012035627 A1 WO 2012035627A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
support member
mounting plate
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2010/065974
Other languages
English (en)
Japanese (ja)
Inventor
西川晃正
藤川英之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2010/065974 priority Critical patent/WO2012035627A1/fr
Priority to JP2012533782A priority patent/JP5348331B2/ja
Publication of WO2012035627A1 publication Critical patent/WO2012035627A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Definitions

  • the present invention relates to a printed circuit board support member, a printed circuit board unit, and an electronic device.
  • a technology for cooling a heat generating component of a printed circuit board used in an electronic device is known.
  • a heat sink that contacts the heat generating component.
  • the heat sink is held by the holding member and is disposed on the surface side of the printed board on which the heat generating component is provided.
  • a support member that supports the printed circuit board is disposed on the side of the printed circuit board on which the heat generating components are not provided.
  • the support member is coupled to the holding member, and is assembled so that the printed board is sandwiched between the support member and the holding member.
  • Patent Documents 1 and 2 disclose techniques for attaching components to a substrate.
  • the printed circuit board support member disclosed in the present specification is sandwiched between a back surface of a printed circuit board on which a heat generating component is mounted and a mounting plate to which the printed circuit board can be attached, and supports the back surface.
  • a connecting portion connectable to a holding member that holds a heat sink that receives heat from the heat-generating component, a protrusion that fits into a positioning hole of the mounting plate and positions the support portion, and the protrusion
  • the elastic portion is elastically deformable, and the elastic portion is elastically deformed by pressing the support portion against the mounting plate in a state where the protrusion and the hole are not fitted.
  • the support portion follows the mounting plate.
  • a printed circuit board unit disclosed in the present specification includes the above-described printed circuit board support member, the heat sink, the holding member, and the printed circuit board.
  • An electronic device disclosed in this specification includes the above-described printed circuit board unit and the mounting plate.
  • FIG. 1 is an explanatory diagram of an electronic apparatus according to the present embodiment.
  • FIG. 2 is an exploded perspective view of the printed circuit board unit.
  • FIG. 3 is an explanatory view of a support member.
  • FIG. 4 is an explanatory diagram of the support member.
  • FIG. 5 is an explanatory diagram of the support member.
  • FIG. 6 is an explanatory diagram of a state in which the printed circuit board unit is assembled to the mounting plate.
  • FIG. 7 is an explanatory diagram of a state in which the printed circuit board unit is assembled to the mounting plate.
  • 8A to 8C are explanatory views when the printed circuit board unit is assembled to the mounting plate in a state where the support member is not properly positioned on the mounting plate.
  • FIG. 9 is an explanatory diagram of the ease of fitting the protrusion into the hole.
  • FIG. 10 is an enlarged view of a cross section of the protrusion.
  • FIG. 1 is an explanatory diagram of the electronic apparatus 1 of the present embodiment.
  • the electronic device 1 is a personal computer.
  • the electronic device 1 includes a main body housing 2 and a support base 4 that supports the main body housing 2.
  • the main body housing 2 is provided with a display 3 capable of displaying an image.
  • Hardware for realizing a function as a personal computer is built in the main body housing 2.
  • FIG. 2 is an exploded perspective view of the printed circuit board unit U.
  • FIG. A printed circuit board unit U is accommodated in the main body housing 2.
  • the printed circuit board unit U includes a printed circuit board 10, a holding member 40 assembled to the printed circuit board 10, and a support member 50.
  • the printed circuit board 10 is a printed circuit board 10 on which electronic components for controlling the operation of the entire electronic device 1 are mounted.
  • the printed circuit board 10 functions as a mother board.
  • the printed circuit board 10 has a first surface 11 and a second surface 12, and a heat generating component 15 is mounted on the first surface 11.
  • the second surface 12 is not shown in FIG. 2, but is shown in FIG.
  • the heat generating component 15 is an electronic component that generates heat when power is supplied.
  • the heat generating component 15 is, for example, a CPU, but is not limited thereto, and may be, for example, a graphic chip.
  • a memory M is mounted on the first surface 11 of the printed circuit board 10.
  • the heat sink 30 is made of a metal having good thermal conductivity such as copper or aluminum alloy.
  • the heat sink 30 is held by a holding member 40.
  • the holding member 40 is a metal thin plate shape.
  • the holding member 40 holds a fan (not shown) that is cooled by blowing the heat sink 30.
  • the holding member 40 has a hole for allowing air to pass to the fan.
  • the mounting plate 90 is accommodated in the main body housing 2.
  • the mounting plate 90 is made of metal.
  • the mounting plate 90 is provided with a plurality of support pins 94 for supporting the printed circuit board 10.
  • a support member 50 is disposed between the printed board 10 and the mounting plate 90.
  • the support member 50 is coupled to the holding member 40 so as to sandwich the printed circuit board 10.
  • the attachment plate 90 is provided with two holes 96 for positioning the support member 50.
  • FIG. 5 is a cross-sectional view of the support member 50.
  • the support member 50 is made of synthetic resin.
  • the support member 50 is formed in a support part 51, three connecting holes 52 provided in the support part 51, a plate-like part 54 continuous to the support part 51, an elastic part 55 formed in the plate-like part 54, and an elastic part 55.
  • Projecting portion 56 The support surface 51 s of the support portion 51 abuts on and supports the second surface 12 of the printed circuit board 10.
  • the protrusion 56 protrudes toward the mounting plate 90.
  • the support member 50 is positioned with respect to the mounting plate 90 by fitting the protrusions 56 into the holes 96 of the mounting plate 90.
  • the elastic portion 55 is determined by the cutout portion C.
  • the elastic part 55 is elastically deformable.
  • the support portion 51 is provided with an opening OP.
  • the support portion 51 includes a frame-shaped portion and three extending portions extending outward from the frame-shaped portion.
  • the shape of the support part 51 is not limited to such a shape.
  • FIGS. 6 and 7 are explanatory views showing a state in which the printed circuit board unit U is assembled to the mounting plate 90.
  • the holding member 40 and the supporting member 50 are assembled to the printed circuit board 10 so as to sandwich the printed circuit board 10 by screws S that are fitted in the screw holes 42 of the holding member 40 and the connection holes 52 of the supporting member 50 in common.
  • the screw S is not shown in FIGS. 6 and 7, but is shown in FIG.
  • the holding member 40 to which the heat sink 30 is previously attached may be assembled to the printed circuit board 10 by the support member 50, or the holding member 40 to which the heat sink 30 is not attached is assembled to the printed circuit board 10 by the support member 50. After attaching, the heat sink 30 may be attached to the holding member 40.
  • the connecting hole 52 of the support member 50 functions as a connecting portion that can be connected to the holding member 40.
  • a thread groove is formed inside the connection hole 52.
  • the protrusion 56 of the support member 50 is fitted into the hole 96 of the attachment plate 90, and the support pin 94 of the attachment plate 90 and the printed board 10 are fixed with screws.
  • the printed board 10, the holding member 40, and the support member 50 are assembled to the mounting plate 90.
  • a heat receiving plate P is disposed on the lower surface of the heat sink 30. Heat of the heat generating component 15 is transmitted to the heat sink 30 through the heat receiving plate P.
  • the heat receiving plate P is made of a metal having good thermal conductivity.
  • FIGS. 8A to 8C are explanatory views when the printed circuit board unit U is assembled to the mounting plate 90 in a state where the support member 50 is not properly positioned on the mounting plate 90.
  • FIGS. 8A to 8C are based on the assumption that the protrusion 56 is not fitted into the hole 96, and the printed circuit board unit U is always attached to the mounting plate 90 in such a state. It cannot be assembled.
  • the support member 50 is disposed on the mounting plate 90 in a state where one of the two protrusions 56 is not fitted in the hole 96.
  • the support surface 51 s of the support portion 51 is inclined with respect to the attachment plate 90 with respect to the attachment plate 90, and the support member 50 is shifted from a desired posture.
  • the elastic portion 55 provided with the projection 56 not fitted in the hole 96 is elastically deformed so as to bend. To do. Accordingly, the support member 50 follows the mounting plate 90, and the support member 50 assumes a desired posture.
  • the printed circuit board 10 is appropriately supported by the support member 50 by connecting the support pins 94 and the printed circuit board 10.
  • the elastic part 55 when the elastic part 55 is not elastically deformable, when the printed board 10 is fixed to the support pins 94 from the state of FIG. 8A, the printed board 10 is assembled to the mounting plate 90 while the support member 50 is tilted. Become. For this reason, since the printed circuit board 10 is supported by the inclined support member 50, the printed circuit board 10 bends. As a result, the printed circuit board 10 may be damaged. Further, the support member may be damaged.
  • the support member 50 can support the printed circuit board 10 in a desired posture, and can suppress the bending and breakage of the printed circuit board 10. Therefore, when the printed circuit board unit U is assembled to the mounting plate 90, the support member 50 does not necessarily have to be properly positioned with respect to the mounting plate 90. Therefore, the workability of assembling the printed circuit board unit U to the mounting plate 90 is improved.
  • the holding member 40, and the support member 50 when the printed circuit board unit U is assembled to the mounting plate 90, the protrusion 56 fits into the hole 96 appropriately. There are cases where it is impossible. Even in such a case, the printed circuit board unit U can be assembled to the mounting plate 90 while suppressing the printed circuit board 10 from being bent.
  • the elastic portion 55 is elastically deformed, it is possible to prevent the elastic portion 55 from being damaged when the printed board unit U is assembled to the mounting plate 90 in a state where the support member 50 is not positioned on the mounting plate 90.
  • the support member 50 and the mounting plate 90 are not directly fixed, and the support member 50 is only pressed against the mounting plate 90 by fixing the printed circuit board 10 to the mounting plate 90 to the last. It is. That is, the support member 50 is assembled to the printed circuit board 10. Therefore, in a state where the printed circuit board unit U is assembled to the mounting plate 90, the printed circuit board 10, the holding member 40, and the support member 50 can be separated from the mounting plate 90 as a unit. For this reason, the printed circuit board unit U can be employed as a maintenance part. For example, a printed circuit board unit U in which the printed circuit board 10, the holding member 40, and the support member 50 are integrated can be adopted as a maintenance part for replacement when the electronic apparatus 1 fails.
  • the printed circuit board 10, the holding member 40, the support member 50, and the mounting plate 90 are integrated.
  • the manufacturer needs to hold a unit in which the printed circuit board 10, the holding member 40, the support member 50, and the mounting plate 90 are integrated as a maintenance part.
  • the size of the maintenance part increases, and the manufacturing cost of the maintenance part also increases.
  • the size of the maintenance part can be reduced, and the manufacturing cost of the maintenance part can be suppressed.
  • the elastic portion 55 has a cantilever shape extending from the support portion 51 along the mounting plate 90. For this reason, the elastic part 55 is easily elastically deformed. Further, the elastic portion 55 is formed by notching a plate-like portion 54 that is thinner than the thickness of the support portion 51 in the direction perpendicular to the mounting plate 90. This also facilitates elastic deformation of the elastic portion 55.
  • FIG. 9 is an explanatory diagram of the ease of fitting of the protrusion 56 into the hole 96
  • FIG. 10 is an enlarged view of the cross section of the protrusion 56.
  • the protrusion 56 has a substantially frustoconical shape whose diameter decreases toward the mounting plate 90.
  • the protrusion 56 has an inclined surface 56s that defines a substantially frustoconical shape.
  • the inclined surface 56s is inclined so as to approach the mounting plate 90 with respect to an axial center that passes through the center of the protrusion 56 and extends in the protruding direction in a sectional view.
  • the length A of the inclined surface 56 s in the direction parallel to the printed circuit board 10 is the length of the play between the holding member 40 and the support member 50 in the above direction and the direction of the play between the printed circuit board 10 and the mounting plate 90. Greater than the sum of the length of As a result, even when the protrusion 56 is not properly fitted in the hole 96, the inclined surface 56 s comes into contact with the edge of the hole 96 as shown in FIG. 9. Thereby, fitting of the protrusion 56 to the hole 96 can be promoted, and the amount of elastic deformation of the elastic portion 55 can be suppressed.
  • the length A of the inclined surface 56s is the sum of the variation in the size of the support member 50, the variation in the size of the mounting plate 90, and the variation in the size of the printed circuit board 10 in addition to the above-described play. It may be larger than the length.
  • the length B of the inclined surface 56 s in the direction perpendicular to the printed circuit board 10, in other words, the direction perpendicular to the mounting plate 90 is the elastic restoration of the elastic portion 55 when the inclined surface 56 s abuts the edge of the hole 96.
  • the projection 56 may be set so as to be properly fitted in the hole 96 by force.
  • a personal computer has been described as an example of an electronic apparatus, but the present invention is not limited to this.
  • the electronic device may be, for example, a portable device or a stationary device.
  • portable devices include notebook computers, tablet computers, portable game machines, and stationary devices such as desktop computers, television devices, magnetic disk reproducing devices that can read and reproduce magnetic disks, audio devices, It may be.
  • the CPU is described as an example of the heat generating component, but any component that generates heat when power is supplied may be used.
  • the heat generating component may be a graphic chip.
  • the support member 50 is made of synthetic resin, but may be made of metal. In that case, an insulating sheet is attached to the surface of the support member 50 on the heat sink 30 side.
  • the protrusion 56 may have a substantially hemispherical shape, a substantially conical shape, a substantially pyramid shape, or a substantially truncated pyramid shape.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

L'invention concerne un élément support pour une carte de circuits imprimés, comprenant : une pièce de support qui est interposée entre la surface postérieure d'une carte de circuits imprimés sur la surface de laquelle est monté un composant producteur de chaleur et une plaque de fixation qui peut être fixée sur la carte de circuits imprimés, la pièce de support supportant cette surface postérieure ; des pièces de connexion qui peuvent connecter à l'élément de support un puits thermique qui reçoit la chaleur du composant producteur de chaleur ; des pièces en saillie qui s'engagent avec des trous utilisés pour déterminer la position de la plaque de fixation et déterminer la position de la pièce de support ; et une pièce élastique apte à une déformation élastique. En pressant la pièce de support sur la plaque de fixation dans un état où les pièces en saillie et les trous ne sont pas engagés, les pièces élastiques subissent une déformation élastique et la pièce de support s'adapte à la plaque de fixation.
PCT/JP2010/065974 2010-09-15 2010-09-15 Élément support pour carte de circuits imprimés, unité de carte de circuits imprimés et dispositif électronique Ceased WO2012035627A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2010/065974 WO2012035627A1 (fr) 2010-09-15 2010-09-15 Élément support pour carte de circuits imprimés, unité de carte de circuits imprimés et dispositif électronique
JP2012533782A JP5348331B2 (ja) 2010-09-15 2010-09-15 プリント基板の支持部材、プリント基板ユニット、及び電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/065974 WO2012035627A1 (fr) 2010-09-15 2010-09-15 Élément support pour carte de circuits imprimés, unité de carte de circuits imprimés et dispositif électronique

Publications (1)

Publication Number Publication Date
WO2012035627A1 true WO2012035627A1 (fr) 2012-03-22

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ID=45831127

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Application Number Title Priority Date Filing Date
PCT/JP2010/065974 Ceased WO2012035627A1 (fr) 2010-09-15 2010-09-15 Élément support pour carte de circuits imprimés, unité de carte de circuits imprimés et dispositif électronique

Country Status (2)

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JP (1) JP5348331B2 (fr)
WO (1) WO2012035627A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6650548B1 (ja) * 2018-03-13 2020-02-19 新電元工業株式会社 電源装置
US11773278B2 (en) 2017-07-03 2023-10-03 Kao Corporation Aqueous ink

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251198A (ja) * 1989-03-24 1990-10-08 Mitsubishi Electric Corp 電子部品固定装置
JP2000010665A (ja) * 1998-06-25 2000-01-14 Toshiba Corp 電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6542366B2 (en) * 2000-12-28 2003-04-01 Gateway, Inc. Circuit board support
JP5007680B2 (ja) * 2008-02-05 2012-08-22 ソニー株式会社 電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251198A (ja) * 1989-03-24 1990-10-08 Mitsubishi Electric Corp 電子部品固定装置
JP2000010665A (ja) * 1998-06-25 2000-01-14 Toshiba Corp 電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11773278B2 (en) 2017-07-03 2023-10-03 Kao Corporation Aqueous ink
JP6650548B1 (ja) * 2018-03-13 2020-02-19 新電元工業株式会社 電源装置

Also Published As

Publication number Publication date
JP5348331B2 (ja) 2013-11-20
JPWO2012035627A1 (ja) 2014-01-20

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