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WO2012027936A1 - Structure intégrée de del avec dispositif de refroidissement - Google Patents

Structure intégrée de del avec dispositif de refroidissement Download PDF

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Publication number
WO2012027936A1
WO2012027936A1 PCT/CN2010/079705 CN2010079705W WO2012027936A1 WO 2012027936 A1 WO2012027936 A1 WO 2012027936A1 CN 2010079705 W CN2010079705 W CN 2010079705W WO 2012027936 A1 WO2012027936 A1 WO 2012027936A1
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WO
WIPO (PCT)
Prior art keywords
cooling
flow path
plate
flow
cooling medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2010/079705
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English (en)
Chinese (zh)
Inventor
杨东佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2012027936A1 publication Critical patent/WO2012027936A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the utility model relates to an LED integrated structure with a cooling device for illumination, a backlight module, a television set, an LED dot matrix display screen, a projection device, etc., in particular to a cooling of a high-power LED integrated structure. Device.
  • LED light source especially high-power LED light source
  • the heat is concentrated when the light is emitted. If the heat generated by the LED chip is not released in time, the temperature of the LED light source is too high, which will lead to the LED light reduction and low life, so how to The heat generated by the LED chip is quickly and effectively dissipated and becomes a bottleneck for popularizing LED light sources. How to improve the light efficiency of LED light sources and how to improve the heat dissipation performance of LED light sources to prolong the service life is an important technical problem in the industry.
  • the existing solution to the problem of heat dissipation of the LED light source is to improve the LED integrated structure and make the heat generated by the LED light source more easily dissipated. Another solution is to increase the cooling device.
  • a heat dissipation structure and an LED lamp having the heat dissipation structure are disclosed.
  • the heat dissipation structure of the utility model comprises a cavity, a cooling solution is accommodated therebetween, and is provided with An even number of baffles are formed to form a channel, the channels being connected in an S-shape and having at least one row of hot zones, at least one heated zone, and at least one buffer zone.
  • the utility model is provided with a cooling flow channel, neither the cooling medium flow device is driven to quickly exchange the cooling medium in the flow channel, and the cooling medium in the flow channel cannot be cooled by the heat removal zone on both sides of the cavity.
  • the different specific gravity of the medium is used for rapid exchange of cold and hot cooling medium.
  • the cold and heat exchange of the cooling medium is exchanged by the heat conduction of the cooling medium, and the heat dissipation area of the heat removal area placed on both sides of the cavity is small, when the heat generated by the LED chip is generated.
  • the cold and heat exchange of the cooling medium is slow, so the cooling effect on the LED chip is not good.
  • a conventional heat sink for cooling an LED chip by using a semiconductor cooling device generally has a semiconductor cooling fin completely covering the back surface of the LED chip. Since the power of the LED chip is small and the power of the semiconductor cooling device is large, the existing semiconductor is used.
  • the cooling device uses a high-power semiconductor cooling device to cool a low-power LED chip, which is uneconomical.
  • Utility model in 200920009830. 5 a LED lamp with controllable temperature of the lamp body is disclosed, which comprises an LED lamp body and a driving power source for supplying DC power to the LED lamp body, and the LED lamp body is attached with one or more cooling or heating elements.
  • a semiconductor wafer that functions and maintains a constant temperature of the LED lamp body.
  • the utility model solves the problem of cooling of the LED lamp body by using one or more semiconductor sheets, since the semiconductor wafer is directly attached to the lamp body without a cooling flow channel, heat exchange between the LED chip and the semiconductor wafer can only pass through the solid medium. Conductive exchange, because of the slow conduction of solid conduction heat, the cooling effect of such a semiconductor wafer on the LED chip is not good.
  • the technical problem to be solved by the utility model is to provide a cooling device with rapid heat exchange, high cooling efficiency and cooling effect. Good LED integrated structure with cooling device.
  • An LED integrated structure with a cooling device comprising a heat dissipating substrate, an LED chip, and an LED chip fixed on the heat dissipating substrate, wherein: the cooling device comprises a flow channel plate disposed on a side of the heat dissipating substrate facing away from the LED chip, and a driving cooling medium flowing device Forming a cooling flow channel for accommodating the cooling medium between the flow channel plate and the heat dissipation substrate, and the cooling flow channel and the heat dissipation substrate are hermetically sealed or liquid sealed; the back surface of the LED chip is completely covered by the cooling flow channel; and the side of the heat dissipation substrate facing away from the LED chip Direct contact with the cooling medium.
  • the cooling flow path includes a groove disposed on the flow path plate to circulate the cooling medium, and the side of the groove and the heat dissipation substrate facing away from the LED chip forms the cooling flow channel;
  • the medium flow device includes two intermeshing first gears and second gears mounted on the bottom of the groove, and a driving motor disposed on a side facing away from the groove to drive the first gear and the second gear to rotate, the gear shaft of the first gear And the gear shaft of the second gear is sealed or liquid-tight with the bottom of the groove.
  • the cooling flow path includes a groove disposed on the flow path plate to circulate the cooling medium, and the side of the groove and the heat dissipation substrate facing away from the LED chip forms the cooling flow channel;
  • the medium flow device includes two intermeshing first gears and a second gear mounted on the bottom of the groove, and a driving motor disposed on a side facing away from the groove to drive the first gear and the second gear to rotate, in the driving motor and the first A magnet for rotating the first gear or the second gear is disposed between the gear or the second gear;
  • the flow passage plate is a non-magnetic material.
  • the driving cooling medium flow device includes a stirring impeller installed in the cooling flow passage, a driving motor disposed on a side away from the cooling flow passage to drive the stirring impeller to rotate, and an impeller shaft and a cooling flow passage of the stirring impeller Hermetic or liquid sealed.
  • the driving cooling medium flow device comprises a stirring impeller installed in the cooling flow passage, a driving motor disposed on a side away from the cooling flow passage to drive the stirring impeller to rotate, and a driving motor and a stirring impeller. There is a magnet for rotating the stirring impeller, and the flow path plate is made of a non-magnetic material.
  • a cooling fan is disposed on a side of the flow channel plate facing away from the cooling flow channel, the cooling medium is an uncooled cooling medium, the flow channel plate is a heat dissipation plate, and the flow channel plate faces away from the cooling flow channel. The side is in direct contact with the air.
  • the position of the corresponding groove on the side of the flow channel plate facing away from the groove is a heat dissipation ridge protruding from the flow channel plate, and the cooling flow channel is a cooling passage having a high and low unevenness;
  • An air deflector is further disposed on one side of the back discrete thermal substrate, and the air deflector and the flow channel plate form a wind channel parallel to the groove;
  • a cooling fan is installed on one side of the air duct;
  • the cooling medium is a cooling medium that is not cooled, and the flow
  • the land plate is a heat sink, and the side of the flow channel plate facing away from the groove is in direct contact with the air.
  • the cooling flow path includes a groove disposed on the flow path plate to circulate the cooling medium, and the side of the groove and the heat dissipation substrate facing away from the LED chip forms the cooling flow channel;
  • the utility model further comprises a refrigerating device, wherein the refrigerating device is installed on one side of the discrete hot substrate of the flow channel plate, and the heat absorbing end of the refrigerating device is heat-conductively attached to the flow channel plate and placed at a set position on the back side of the circulating flow channel, wherein the cooling medium is liquid.
  • the refrigerating device comprises a semiconductor refrigerating device or a magnetic refrigerating device; and a heat sink is further disposed on a side of the discrete hot substrate of the flow channel back, and the heat absorbing end of the refrigerating device is heatably adhered to the concave of the flow channel plate On the back side of the slot, the heat dissipating end of the refrigerating device can be thermally conductively attached to the heat sink.
  • the refrigerating device comprises a semiconductor refrigerating device or a magnetic refrigerating device; a heat dissipating plate is further disposed on a side of the flow plate back of the discrete thermal substrate, and a cooling groove is further disposed on a side of the heat dissipating plate facing away from the flow channel plate A sealing plate sealing the cooling groove is further disposed on a side of the heat dissipation plate facing away from the flow channel plate, and the heat absorption end of the refrigeration device is heat-conductively attached to the back surface of the cooling flow channel of the flow channel plate, and the heat dissipation end of the refrigeration device can conduct heat The ground is attached to the heat sink.
  • a cooling medium inlet and a cooling medium outlet communicating with the cooling flow passage are also provided, and the cooling medium inlet and the cooling medium outlet are in communication with the external cooling medium.
  • a cooling flow channel is arranged on a side of the heat dissipation substrate facing away from the LED chip, and a cooling medium is filled in the cooling flow channel. Since the temperature of the cooling medium is easily controlled, the cooling medium flowing device can quickly flow the cooling medium in the cooling flow channel, and the heat exchange is performed. Faster, faster and more take away by LED chips The heat generated is therefore in direct contact with the air than the heat sink substrate, and the cooling effect is better. In particular, when the heat dissipating substrate is horizontally placed, the driving cooling medium flowing device can make the temperature of the cooling medium in the cooling flow channel substantially uniform, so that the temperature of the entire heat dissipating substrate is nearly uniform, and the heat is not concentrated.
  • the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the driving cooling medium flow device is two gears and a driving motor that mesh with each other, the structure is simple, and the cooling medium in the cooling flow channel can pass The rapid circulation of the cooling medium exchanges heat and has a good cooling effect.
  • the driving cooling medium flowing device is a stirring impeller and a driving motor, and the structure is simple, and the cooling medium in the cooling flow channel exchanges heat through the rapid circulating flow of the cooling medium, and the cooling effect is good.
  • the stirring impeller or the two gears meshing with each other are driven by magnetic force.
  • the magnet drives the two gears or the stirring impeller through the flow channel plate.
  • the flow channel plate is a whole, no opening and sealing structure is required, and the structure is simple and the sealing effect is good. , and has a long service life.
  • the flow plate between the magnet and the stirring impeller or gear is made of non-magnetic material such as copper, aluminum, stainless steel, ceramics, etc.
  • a cooling fan is arranged on a side of the flow path housing facing away from the cooling flow channel.
  • the cooling fan can be installed on the back side of the flow path housing or on the side of the flow path housing, and the cooling fan can heat the cooling medium. It is quickly dissipated into the air through the flow path shell, so that the cooling medium is always kept at a lower temperature, so that the cooling medium can quickly remove more heat generated by the LED chip.
  • the position of the corresponding groove on the side of the flow channel plate facing away from the groove is such that the heat dissipation rib of the convex flow channel plate forms a high and low uneven cooling flow path, thereby increasing the contact area between the cooling flow channel plate and the air as much as possible, thereby Increasing the heat dissipation area, adding cooling fans and heat dissipation ribs, the heat of the cooling medium can be quickly dissipated into the air through the flow channel plate, so that the cooling medium is always kept at a lower temperature, so that the cooling medium can be taken away more quickly.
  • the heat generated by the LED chip is such that the heat dissipation rib of the convex flow channel plate forms a high and low uneven cooling flow path, thereby increasing the contact area between the cooling flow channel plate and the air as much as possible, thereby Increasing the heat dissipation area, adding cooling fans and heat dissipation ribs, the heat of the cooling medium can be quickly dissipated into the air through the flow
  • the refrigerating device is installed at the position corresponding to the groove.
  • the refrigerating device only needs to cool a small amount of cooling medium and drive the cooling medium flowing device to make the cooling medium flow rapidly in the groove, so that the cooling medium can reach the required temperature, thereby cooling
  • the medium can take away the heat generated by the LED chip more quickly, so that the LED chip and the entire heat dissipation substrate reach the required temperature, and the temperatures of the respective LED chips and the entire heat dissipation substrate are substantially consistent.
  • Adopting semiconductor semiconductor refrigeration device the structure is simple, the cost is low, and the refrigeration effect is good; the magnetic refrigeration device is adopted, the refrigeration effect is good; the heat absorption end of the refrigeration device can be thermally conductively attached to the back surface of the cooling flow channel of the flow channel housing, The heat on the heat dissipating substrate can be quickly taken away, and the heat dissipating end of the refrigerating device can be thermally conductively attached to the heat sink, and the heat of the refrigerating device can be quickly dissipated into the air. 9.
  • the heat absorbing end of the refrigerating device can be thermally conductively attached to the back surface of the cooling flow channel of the flow path housing, and the heat on the heat dissipating substrate can be quickly taken away, and the heat dissipating end of the refrigerating device can be thermally conductively attached to the heat dissipating plate.
  • the heat of the refrigeration unit can be quickly dissipated into the cooling tank for better cooling.
  • the external cooling medium continuously flows in the cooling flow path to remove the heat of the heat dissipation substrate and the LED chip, so that a good cooling effect can be achieved.
  • the cooling medium of the refrigeration device communicates with the cooling flow passage through the cooling medium port, and directly cools the cooling flow passage through the cooling medium of the refrigeration device, and has less heat loss and good cooling effect.
  • FIG. 1 is a perspective exploded view of Embodiment 1 of the present invention.
  • Figure 2 is a perspective exploded view of Embodiment 2 of the present invention.
  • Embodiment 3 is a perspective exploded view of Embodiment 3 of the present invention.
  • Fig. 4 is a perspective exploded view showing only a partial structure of Embodiment 3 of the present invention.
  • Fig. 5 is an enlarged view of a portion I of Fig. 4.
  • Figure 6 is a perspective exploded view of Embodiment 4 of the present invention.
  • Fig. 7 is a perspective exploded view showing only a partial structure of Embodiment 4 of the present invention.
  • Figure 8 is a perspective exploded view of Embodiment 5 of the present invention.
  • Figure 9 is a perspective exploded view of Embodiment 6 of the present invention.
  • Figure 10 is a perspective view of Embodiment 7 of the present invention.
  • Figure 11 is a perspective exploded view of Embodiment 7 of the present invention.
  • Figure 12 is a perspective exploded view of Embodiment 8 of the present invention.
  • Figure 13 is a perspective exploded view showing only a partial structure of Embodiment 8 of the present invention.
  • Figure 14 is a perspective exploded view of Embodiment 9 of the present invention.
  • Figure 15 is a perspective exploded view of Embodiment 10 of the present invention.
  • Figure 16 is a perspective exploded view of Embodiment 11 of the present invention.
  • Figure 17 is a perspective exploded view of Embodiment 12 of the present invention.
  • an LED integrated structure with a cooling device includes a cover plate 1 , a reflector 2 , a heat dissipation substrate 3 , an LED chip 4 , a lens 5 , a lens positioning ring 6 , and an electrode electrically connected to the LED chip 4 .
  • the gold wire 7 and the patterned circuit conductive layer 8 electrically connecting the gold wire 7 and the encapsulant 9 for encapsulating the LED chip 4 and the gold wire 7.
  • the cooling device includes a flow path plate 10 disposed on a side of the heat dissipation substrate 3 facing away from the LED chip 4, a groove 11 provided on the flow path plate 10, and a groove 11 on the flow path plate 10 and A cooling flow path for accommodating cooling water is formed between the heat dissipation substrates 3, a cooling water flow device (not shown) is driven, and the cooling water flow device is driven as a water pump.
  • a cooling water inlet 12 and a cooling water outlet (not shown) communicating with the cooling flow passage are provided on the flow passage plate 10, and the flow passage plate passes through the cooling water inlet 12 and the cooling water outlet and the external cooling water storage tank (not The water in the connection is shown).
  • the back surface of the LED chip 4 is completely covered by the cooling flow path; the side of the heat dissipation substrate 3 facing away from the LED chip 4 is in direct contact with the cooling water, and the cooling flow path is filled with cooling water.
  • the reflecting plate 2 is mounted on the heat radiating substrate 3, and the cover plate 1 is mounted on the flow path plate 10, and the cover plate 1 and the flow path plate 10 seal other structures of the LED integrated structure.
  • the reflector 2 is provided with a through hole 13 corresponding to the lens 5, and a reflector 14 corresponding to the lens 5 on the cover 1.
  • the flow channel plate 10 is a heat-conducting heat dissipation plate, and the side of the flow channel plate 10 facing away from the groove 11 is in direct contact with the air.
  • the drive cooling water flow device is installed outside the cooling flow passage.
  • the lens positioning ring 6 is made of high temperature resistant PPA plastic.
  • a positioning lens 5 and a first through hole 15 covering the encapsulating body 9 are disposed on the lens positioning ring 6.
  • the fixing post 16 is extended on the lens positioning ring 6, and the heat dissipating substrate 3 is placed at the end of the fixing post 16.
  • the mold portion of the molded lens positioning ring 6 is formed with a resisting portion 17 when the plastic positioning ring is formed, and the fixing post 16 and the heat dissipating substrate 3 are fluidly sealed.
  • a glue injection channel 18 for injecting the encapsulant 9 is disposed on the lens positioning ring 6.
  • the glue port 19 of the glue injection channel 18 is placed on the end surface of the lens positioning ring 6 away from the resisting portion, and the glue port 19 and the glue injection channel 18 are The side walls of the first through holes 15 are in communication.
  • the heat dissipating substrate 3 is stamped from a sheet metal or a metal alloy of a high thermal conductivity material, and may be made of stainless steel, copper, tungsten, aluminum, aluminum nitride, chromium or the like or an alloy thereof.
  • the heat dissipating substrate 3 includes a flat bottom plate, and a plurality of chip fixing bosses 20 protruding from the heat dissipating substrate 3, and corresponding to each of the chip fixing bosses 20, a second through hole that is matched with the fixing post 16 twenty one.
  • the chip fixing boss 20 has a circular cross section, and the cross-sectional area of the bottom plate is much larger than the cross-sectional area of the chip fixing boss 20, at least three times or three times the area of the cross section of the chip fixing boss 20. the above.
  • a recess portion 22 for arranging the LED chip 4 concentrically with the chip fixing boss 20 is provided, and the bottom surface of the recess portion 22 is a plane on which the LED chip 4 is placed.
  • a heat dissipation blind hole (not shown) disposed in the chip fixing boss 20 concentric with the chip fixing boss 20 is provided. The side of the heat dissipation substrate 3 facing away from the chip fixing boss 20 is in direct contact with the cooling water.
  • the fixing post 16 of the lens positioning ring 6 passes through the second through hole 21 of the heat dissipation substrate 3, and is fixed to the heat dissipation substrate 3 through the resisting portion 17 of the end portion of the fixing post 16, so that the heat dissipation substrate 3 and the lens positioning ring 6 are fixed together.
  • the chip fixing boss 20 is placed in the first through hole 15 of the corresponding lens positioning ring 6
  • the conductive layer 8 of the layout circuit is directly disposed on a side of the heat dissipation substrate 3 facing the boss 20, and the conductive layer 8 of the layout circuit extends between the inner sidewall of the first through hole 15 and the outer sidewall of the chip fixing boss 20, and the LED chip 4 Directly fixed on the end surface of the chip fixing boss 20 by a die bonding process, the gold wire 7 is placed in the lens positioning ring 6, and the gold wire 7-end is electrically connected to the electrode of the LED chip 4, and the other end of the gold wire 7 is extended.
  • the patterned circuit conductive layer 8 in the lens positioning ring 6 is electrically connected; the lens 5 is mounted on the lens positioning ring 6 and is tightly coupled to the lens positioning ring 6. The lens 5 is further fixed by the encapsulant 9 injected through the glue port 19 and the glue injection channel 18.
  • an LED integrated structure with a cooling device further includes a PCB board 51.
  • the flow path plate 52 only the cooling medium inlet 53 communicating with the cooling flow path is provided.
  • the groove 56 on the flow path plate 52 forms a closed circulating cooling flow path with the heat dissipation substrate 66, and the cooling medium circulates in the cooling flow path.
  • the driving cooling medium flow device includes two intermeshing first gears 54 and second gears 55 mounted at the bottom of the recess 56, and driving on the side facing away from the recess 56 to drive the rotation of the first gear 54 and the second gear 55
  • the motor 57 is a gear 58 mounted coaxially with the drive motor 57, a gear 59 meshing with the gear 58, and a magnet 60 fixed to the gear 59.
  • the first gear 54 is turned by the magnetic force between the magnet and the magnet.
  • the gear shafts of the first gear 54 and the second gear 55 extend from the bottom of the groove 56.
  • the lens positioning ring 61 is made of high temperature resistant PP0+GF plastic.
  • the heat dissipation substrate 66 is die-cast from a ceramic of high thermal conductivity.
  • the patterned circuit conductive layer 62 is disposed directly on the PCB board 51, and the patterned circuit conductive layers 62 are distributed on the same plane.
  • Each of the chip fixing bosses 63 is provided with a fourth through hole 64 that cooperates with the chip fixing boss 63 and a third through hole 65 that cooperates with the fixing post 68 on the PCB board 51.
  • the PCB board 51 is disposed on the heat dissipation substrate 66.
  • One side of the chip fixing boss 63 is in direct contact with the heat dissipation substrate 66, and the PCB board 51 is provided with a contact surface on which the conductive layer 62 of the layout circuit faces away from the contact heat dissipation substrate 66.
  • the chip fixing boss 63 of the heat dissipation substrate 66 passes through the fourth through hole 64 of the PCB board 51.
  • the fixing post 68 of the lens positioning ring 61 passes through the third through hole 65 of the PCB board 51 and the second through hole of the heat dissipation substrate 66.
  • 67 is liquid-tightly sealed with the second through hole 67, and the resisting portion 69 is formed by the end portion of the heat-fusible fixing post 68 and fixed to the PCB board 51 and the heat dissipation substrate 66.
  • the driving cooling medium flow device includes two intermeshing first gears (not shown) and a second gear mounted at the bottom of the groove (not shown). (not shown), a drive motor 126 disposed to rotate the first gear and the second gear on a side facing away from the groove, a gear 130 mounted coaxially with the drive motor 126, and a gear 125 meshing with the gear 130, mounted in the flow
  • the track plate 127 faces away from the fan 128 on one side of the groove, and the fan 128 is fixed to the flow path plate 127 via the bracket 129.
  • the first gear and the gear 125 are coaxially fixed to their fixed shafts through the flow passage plate 127.
  • the gear shaft of the first gear and the gear shaft of the second gear are sealed from the groove bottom.
  • the plastic lens positioning ring 101 is joined as a unit by the connecting ribs 102.
  • An R color LED chip 108, a G color LED chip 109, and a B color LED chip 110 are fixed in the top depressed portion 104 of the chip fixing boss 103 by a die bonding process.
  • the chip fixing boss 103 is placed in the first through hole 124 corresponding to the plastic lens positioning ring 101, and the layout circuit is disposed on the PCB board 123.
  • the conductive layers 112, 114, 116, 118, 120, 122 extend between the inner sidewall of the first through hole 124 and the outer sidewall of the chip fixing boss 103, and are independent of each other, the gold wires 111, 113, 115, 117, 119, 121 is placed in the first through hole 124.
  • the anode of the R color LED chip 108 is electrically connected to the first patterned circuit conductive layer 112 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 111, and the R color LED
  • the negative electrode of the chip 108 is electrically connected to the patterned circuit conductive layer 114 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 113.
  • the positive electrode of the G-color LED chip 109 is electrically connected to the patterned circuit conductive layer 116 extending between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 115.
  • the G color LED chip 109 The negative electrode is electrically connected to the patterned circuit conductive layer 118 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 117.
  • the positive electrode of the B color LED chip 110 is electrically connected to the patterned circuit conductive layer 120 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 119, and the B color LED chip 110
  • the negative electrode is electrically connected to the patterned circuit conductive layer 122 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 121.
  • the cooling device further includes a semiconductor refrigerating device 162 mounted on a side of the flow channel plate 163 opposite to the discrete thermal substrate 151, and the heat absorbing end of the semiconductor refrigerating device 162 can be
  • the heat-dissipating surface is attached to the flow path plate 163 and placed at a set position on the back surface of the circulation flow path, and the heat-dissipating end of the semiconductor refrigeration device 162 is thermally conductively attached to the heat sink 164, and the semiconductor refrigeration device is attached to the flow path plate 163.
  • a heat insulating layer (not shown) is provided at a portion other than the heat absorbing end of the 162 and on the side of the back discrete heat substrate 151.
  • the plastic lens positioning member is a lens positioning plastic plate 150, and the number of the lens positioning plastic plates 150 is one.
  • the lens positioning plastic plate 150 is provided with six first through holes 153 for positioning the lens 154 and covering the encapsulant 158, which are matched with the chip fixing bosses 152 of the heat dissipation substrate 151.
  • the lens 154 is fixed in the first through hole 153 by a tight fit.
  • a fixing post 155 is extended on the end surface of the lens positioning plastic plate 150.
  • the lens positioning plastic plate 150 is provided with a glue injection channel 159 for injecting the encapsulant 158.
  • the glue port 160 of the glue injection channel 159 is placed on the end surface of the lens positioning plastic plate 150 away from the resisting portion, the glue port 160 and the glue injection channel. 159 is in communication with the side wall of the first through hole 153.
  • the cooling device further includes a heat conductive sheet 201 mounted on one side of the flow channel plate 202 on the back of the discrete thermal substrate 200, and one end of the heat conductive sheet 201 is thermally conductively attached thereto.
  • the flow path plate 202 is placed at a set position on the back surface of the circulation flow path, and the other end of the heat conductive sheet 201 is thermally conductively attached to the heat sink 203, and the flow path plate 202 is attached to the place outside the heat conductive sheet 201 and is separated from the heat.
  • One side of the substrate 200 is provided with a heat insulating layer (not shown).
  • the cooling device further includes a magnetic refrigerating device 251 and a heat dissipating plate 253 disposed on a side of the flow path plate 252 opposite to the discrete thermal substrate, the heat dissipating plate 253 facing away from the flow path plate 252.
  • a cooling groove 254 is further disposed on one side, and a sealing plate 255 sealing the cooling groove 254 is further disposed on a side of the heat dissipation plate 253 facing away from the flow channel plate 252, and the heat absorbing end of the magnetic refrigeration device 251 is thermally conductively attached to the flow channel plate.
  • the heat radiating end of the magnetic refrigerating device 251 is thermally coupled to the back surface of the cooling groove 254 of the heat radiating plate.
  • a heat insulating layer is provided on a side of the flow path plate 252 that is attached to the outside of the heat absorbing end of the magnetic refrigerating device 251 and on the side opposite to the discrete heat substrate.
  • the position of the corresponding groove 302 on the side of the flow path plate 301 facing away from the groove 302 is the heat dissipation ridge 303 of the flow channel plate 301, in the flow path.
  • a blocking wall 304 is defined on two sides of the vertical groove 302 of the plate 301.
  • a stopper 305 parallel to the groove 302 is defined on a side of the flow plate 301 facing the groove 302.
  • the two sides of the heat dissipation substrate 300 are disposed on the two sides of the heat dissipation substrate 300.
  • the wall 306 and the sealing member 307 form a rugged cooling flow passage for circulating the cooling medium.
  • a wind deflecting plate 308, a wind deflecting plate 308 and a flow channel plate 301 are further disposed.
  • a duct parallel to the recess 302 is formed; a cooling fan 309 is mounted on one side of the duct; the cooling medium is a non-refrigerated cooling medium, the runner plate 301 is a heat sink, and the side of the runner plate 301 faces away from the recess 302 Directly in contact with air.
  • an LED integrated structure with a cooling device includes a heat dissipation substrate 350, an LED chip 351, a lens 352, a plastic lens molding ring 353, and an LED chip 351 electrically connected.
  • the heat dissipation substrate 350 is die-cast from a ceramic of high thermal conductivity.
  • the heat dissipating substrate 350 includes a flat bottom plate 361, and a plurality of bosses 362 of the protruding bottom plate 361 formed integrally with the heat dissipating substrate 350.
  • Each of the bosses 362 is provided with a second through hole 363 that cooperates with the fixing post 357.
  • the layout circuit conductive layer 355 is directly disposed on the heat dissipation substrate 350, and the layout circuit conductive layers 355 are distributed on the same plane.
  • the cooling device also includes a refrigeration unit 364 and a heat sink 365.
  • the cooling flow path is disposed at a horizontal plane, the heat absorbing end of the refrigerating unit 364 is placed at the top of the cooling flow path, and the heat generating end is attached to the heat sink 365.
  • the LED integrated structure includes a cover 409, a heat dissipation substrate 400, a cooling device, an LED chip mounted between the cover 409 and the heat dissipation substrate 400, a conductive layer, a conductive layer of the layout circuit, and the like.
  • the conductive layer of the wire and the layout circuit is electrically connected through the metal pin.
  • the heat dissipation substrate 400 is a circular plate.
  • the cooling device includes a sleeve 401 disposed on a side of the heat dissipation substrate facing away from the LED chip, a sleeve 401 and a flow path cover 406 disposed at an end of the sleeve 401 away from the heat dissipation substrate 400, the heat dissipation substrate 400, the sleeve 401 and the flow path cover
  • the plate 406 forms a sealed cooling flow path that drives the cooling medium flow device.
  • the back side of the LED chip is completely covered by the cooling flow path.
  • the side of the heat dissipation substrate 400 facing away from the LED chip is in direct contact with the cooling medium.
  • the driving cooling medium flow device includes a stirring impeller 402 installed in the sealed cooling flow passage, a driving motor 403 disposed on a side facing away from the sealing flow passage to drive the stirring impeller 402 to rotate, and a cooling fan 404 is coaxially fixed on the driving motor 403.
  • the magnet 405 is provided with an impeller shaft 407 on a side of the flow passage cover 406 facing away from the fan, and the agitating impeller 402 is fixed on the impeller shaft 407.
  • the impeller shaft 407 is rotatable relative to the flow passage cover 406 and is adsorbed on the magnet 405 in synchronization with the magnet 405.
  • a fan cover 408 is also provided outside the fan.
  • the driving cooling medium flow device includes a stirring impeller 452 installed in the sealed cooling flow passage, and a driving motor 453 disposed on the side facing away from the sealing flow passage to drive the stirring impeller 452 to rotate.
  • a cooling fan 454 is coaxially fixed to the driving motor 453.
  • the shaft 455 of the fixed cooling fan 454 passes through the flow path cover 456, and the stirring impeller 452 is fixed to the end of the shaft 455.
  • the shaft 455 passes through the flow path cover 456 and Sealed with the flow channel cover 456 liquid.
  • the LED integrated structure includes a cover 504, a heat dissipation substrate 500, a cooling device, an LED chip mounted between the cover 504 and the heat dissipation substrate 500, a conductive layer, a conductive layer of the layout circuit, and the like.
  • the heat dissipation substrate 500 is a circular plate.
  • the cooling device includes a fan 501 disposed on a side of the heat dissipation substrate 500 facing away from the LED chip, and a fan cover 502 disposed outside the fan 501.
  • a motor 503 is fixed in the fan cover 502, a fan 501 is mounted on the motor 503, and a heat dissipation substrate 500 is fixed to the fan cover 502.
  • the side of the heat sink substrate 500 facing away from the LED chip is in direct contact with the air.
  • the LED integrated structure includes a cover 553, a heat dissipation substrate 550, a cooling device, an LED chip mounted between the cover 553 and the heat dissipation substrate 550, a conductive layer, a conductive layer of the layout circuit, and the like.
  • the cooling device includes a flow path housing 552 disposed on a side of the heat dissipation substrate facing away from the LED chip, a cooling flow path formed between the flow path housing 552 and the heat dissipation substrate 550, a refrigerating device 551, and a cooling cooling flow path installed in the cooling device 551.
  • cooling medium flowing device for rapidly flowing the cooling medium
  • a cooling medium port 554 disposed on the flow path housing and communicating with the cooling flow path
  • a cooling medium of the cooling device 551 communicating with the cooling flow path through the cooling medium port 554
  • the cooling medium is driven to drive a cooling medium flow device to circulate between the cooling flow path and the refrigeration device.
  • the invention is not limited to the above embodiments.
  • the shape of the heat dissipating substrate of the utility model can be designed according to the needs of various shapes, and can even be designed as a product appearance piece.
  • the utility model only illustrates a part of the LED chip unit.
  • the number of chip fixing bosses in the utility model can be from one to many, and the utility model only exemplifies several LED integrated structural units with cooling devices.
  • the conductive layer of the layout circuit in the present invention is only illustrative. On one chip fixing boss, one LED chip can be fixed, and two LED chips of different colors can be fixed, three chips of different colors of R, G, B, or more than three chips.
  • the PCB board may also be provided with a conductive layer of the layout circuit on both sides, as long as the surface of the patterned conductive layer on the side in contact with the heat dissipation substrate is insulated from the heat dissipation substrate.
  • the LED chip can be directly fixed on the heat dissipation substrate, or fixed in a recess formed integrally with the heat dissipation substrate, or fixed on the heat dissipation substrate by other means, that is, the cooling device of the present invention is applicable to all LED integration.
  • the structure is not a detailed description of the utility model, and therefore will not be discussed in detail in the present invention.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une structure intégrée de DEL avec un dispositif de refroidissement, laquelle comprend un substrat rayonnant (3; 66; 100; 151; 200; 300; 350; 400; 500; 550), et une puce à DEL (4; 351) fixée sur le substrat rayonnant (3; 66; 100; 151; 200; 300; 350; 400; 500;550). Le dispositif de refroidissement comprend une plaque de canal (10;52;127;163;202;252;301) située sur un côté du substrat rayonnant (3; 66; 100; 151; 200; 300; 350; 400; 500; 550) en face de la puce à DEL (4;351), un dispositif pour entraîner l'écoulement du milieu de refroidissement, un canal de refroidissement contenant le milieu de refroidissement et formé entre la plaque de canal (10; 52; 127; 163; 202; 252; 301) et le substrat rayonnant (3; 66; 100; 151; 200; 300; 350; 400; 500; 550). Le canal de refroidissement et le substrat rayonnant (3; 66; 100; 151; 200; 300; 350; 400; 500; 550) sont scellés par un gaz ou un liquide. L'arrière de la puce à DEL (4; 351) est entièrement couvert par le canal de refroidissement. Le côté du substrat rayonnant (3; 66; 100; 151; 200; 300; 350; 400; 500; 550) en face de la puce à DEL (4; 351) entre directement en contact avec le milieu de refroidissement. Etant donné que la température du milieu de refroidissement est facilement contrôlée, le dispositif entraînant l'écoulement du milieu de refroidissement peut faire s'écouler ce dernier rapidement dans le canal de refroidissement et accélérer l'échange de chaleur. La chaleur générée par la puce à DEL (4; 351) peut ainsi être évacuée plus rapidement et en plus grande quantité et l'effet de refroidissement est donc amélioré.
PCT/CN2010/079705 2010-09-01 2010-12-13 Structure intégrée de del avec dispositif de refroidissement Ceased WO2012027936A1 (fr)

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CN201020516074.8 2010-09-01
CN2010205160748U CN201804865U (zh) 2010-09-01 2010-09-01 带有冷却装置的led集成结构

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CN102005447B (zh) * 2010-09-01 2012-07-11 杨东佐 带有冷却装置的led集成结构
CN201820758U (zh) * 2010-09-15 2011-05-04 杨东佐 一种带有冷却装置的led集成结构
WO2013082803A1 (fr) * 2011-12-09 2013-06-13 GE Lighting Solutions, LLC Lampe led possédant une gestion thermique magnétique
CN103327671A (zh) * 2012-03-19 2013-09-25 黄如金 一种led灯具的pcb电路板
CN103196051B (zh) * 2013-03-15 2014-11-26 于德海 一种高效散热的led模组与led显示屏
CN104154511B (zh) * 2014-07-08 2017-09-26 华南理工大学 用于led灯具的基于磁制冷泵循环散热的结构及其方法
CN108766897B (zh) * 2018-06-12 2020-05-08 厦门大学 实现大功率GaN器件层散热的三维异质结构的封装方法
CN110252224B (zh) * 2018-07-09 2021-11-05 黄位凤 一种连续流光化学反应器
CN109683357B (zh) * 2019-01-10 2022-01-25 惠科股份有限公司 冷却装置及显示装置的加工生产线
CN110299336A (zh) * 2019-06-26 2019-10-01 东北大学 一种大功率芯片封闭式液态金属二回路冷却系统
CN112474162A (zh) * 2020-12-08 2021-03-12 东莞市腾腾电子有限公司 雾化结构及雾化器
CN112923248B (zh) * 2021-02-26 2022-12-23 同辉电子科技股份有限公司 一种均匀出光的cob光源
CN114122242B (zh) * 2022-01-25 2022-05-13 宏齐光电子(深圳)有限公司 一种基于倒装led芯片的封装结构
CN115654420B (zh) * 2022-09-26 2024-08-27 重庆长安汽车股份有限公司 一种磁制冷式散热灯具及车辆

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