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WO2012026757A3 - 형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지 - Google Patents

형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지 Download PDF

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Publication number
WO2012026757A3
WO2012026757A3 PCT/KR2011/006254 KR2011006254W WO2012026757A3 WO 2012026757 A3 WO2012026757 A3 WO 2012026757A3 KR 2011006254 W KR2011006254 W KR 2011006254W WO 2012026757 A3 WO2012026757 A3 WO 2012026757A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting device
device package
phosphor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/006254
Other languages
English (en)
French (fr)
Other versions
WO2012026757A2 (ko
Inventor
곽창훈
박일우
이규진
유철준
홍성재
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung LED Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110083886A external-priority patent/KR101253586B1/ko
Application filed by Samsung LED Co Ltd filed Critical Samsung LED Co Ltd
Priority to DE201111102800 priority Critical patent/DE112011102800T8/de
Priority to US13/818,373 priority patent/US8795817B2/en
Publication of WO2012026757A2 publication Critical patent/WO2012026757A2/ko
Publication of WO2012026757A3 publication Critical patent/WO2012026757A3/ko
Anticipated expiration legal-status Critical
Priority to US14/305,187 priority patent/US9722146B2/en
Ceased legal-status Critical Current

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
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    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

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Abstract

형광체 필름, 이의 제조방법, 발광칩에 형광층 도포방법이 개시된다. 개시된 형광체 필름은, 베이스 필름; 상기 베이스 필름 위에 형성된 것으로, 부분 경화된 수지물질에 형광입자가 혼합되어 이루어진 형광층; 및 상기 형광층 위에, 상기 형광층을 보호하기 위해 형성된 커버 필름;을 포함한다.
PCT/KR2011/006254 2010-08-25 2011-08-24 형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지 Ceased WO2012026757A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE201111102800 DE112011102800T8 (de) 2010-08-25 2011-08-24 Phosphorfilm, Verfahren zum Herstellen desselben, Beschichtungsverfahren für eine Phosphorschicht, Verfahren zum Herstellen eines LED-Gehäuses und dadurch hergestelltes LED-Gehäuse
US13/818,373 US8795817B2 (en) 2010-08-25 2011-08-24 Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured thereby
US14/305,187 US9722146B2 (en) 2010-08-25 2014-06-16 Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package and LED package manufactured thereby

Applications Claiming Priority (4)

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KR10-2010-0082640 2010-08-25
KR20100082640 2010-08-25
KR1020110083886A KR101253586B1 (ko) 2010-08-25 2011-08-23 형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지
KR10-2011-0083886 2011-08-23

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US13/818,373 A-371-Of-International US8795817B2 (en) 2010-08-25 2011-08-24 Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured thereby
US14/305,187 Continuation US9722146B2 (en) 2010-08-25 2014-06-16 Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package and LED package manufactured thereby

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US8795817B2 (en) 2014-08-05
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US20140291705A1 (en) 2014-10-02
US9722146B2 (en) 2017-08-01
DE112011102800T8 (de) 2013-08-14

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