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WO2012019909A1 - Procédé d'encapsulation d'un dispositif électronique - Google Patents

Procédé d'encapsulation d'un dispositif électronique Download PDF

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Publication number
WO2012019909A1
WO2012019909A1 PCT/EP2011/062881 EP2011062881W WO2012019909A1 WO 2012019909 A1 WO2012019909 A1 WO 2012019909A1 EP 2011062881 W EP2011062881 W EP 2011062881W WO 2012019909 A1 WO2012019909 A1 WO 2012019909A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
sheet
cover
heat
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/062881
Other languages
German (de)
English (en)
Inventor
Klaus KEITE-TELGENBÜSCHER
Judith Grünauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Priority to CN201180049543.7A priority Critical patent/CN103270618B/zh
Priority to KR1020137006303A priority patent/KR101871317B1/ko
Priority to DE112011102705T priority patent/DE112011102705A5/de
Publication of WO2012019909A1 publication Critical patent/WO2012019909A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M17/00—Producing multi-layer textile fabrics
    • D06M17/04—Producing multi-layer textile fabrics by applying synthetic resins as adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Definitions

  • pressure-sensitive adhesives are known in the prior art (for example US 2006/0100299 A1, WO 2007/087281 A1, US 2005/0227082 A1, DE 10 2008 047 964 A, DE 10 2008 060 1 13 A).
  • pressure-sensitive adhesives which can be activated after the bond by introduced energy (for example as actinic radiation or heat) are used (US 2006/0100299 A1, WO 2007/087281 A1), since the barrier effect is achieved in particular by a crosslinking reaction brought about by the introduced energy such adhesives can be improved.
  • the adhesive is then thermally activated at least in a partial area of its surface, so that a composite is formed at least with the substrate and cover, wherein the heat required for activation is generated substantially in the sheet at least comprising the sheet itself or in the boundary surfaces of the adhesive to the substrate and / or cover.
  • the electronic device is provided with a cover which carries those at least surrounding adhesive, wherein the adhesive is at least brought into contact with the substrate.
  • encapsulation is not only a complete enclosure with the aforementioned fabric, but also already a regional application of the fabric to the areas of the (opto) electronic arrangement to be encapsulated, for example a one-sided overlap or a framing of an electronic structure.
  • sheet-like structures are, in particular, all conventional and suitable structures having a substantially planar extension. These allow a surface bonding and can be configured differently, in particular flexible, as an adhesive film, adhesive tape, adhesive label or as Formstanzling.
  • the sheet may be formed as a cut sheet whose shape conforms to the shape of the bonding surface to reduce the risk that the electronic assembly will be thermally damaged in the course of heating.
  • Textile fabrics in the sense of this application each have two side surfaces, a front side and a back side.
  • the adhesive is in the form of an adhesive layer.
  • the sheet consists of a single layer of a heat-activable adhesive, which adheres substrate and cover with its two side surfaces.
  • the term "layer” refers in particular to a planar arrangement of a system of uniform functionality whose dimensions are significantly smaller in one spatial direction (thickness or height) than in the other two spatial directions defining the main extent (length and width).
  • Such a layer can be made compact or perforated and consist of a single material or of different materials, in particular if they contribute to the uniform functionality of this layer.
  • a layer may have a constant thickness over its entire areal extent or different thicknesses.
  • a layer may also have more than one functionality.
  • nitrile rubbers or derivatives thereof such as nitrile butadiene rubbers or mixtures (blends) of these base polymers, which additionally contain reactive resins such as phenolic resins; such a product is commercially available as tesa 8401 approximately. Due to its high flow viscosity, the nitrile rubber imparts a pronounced dimensional stability to the heat-activated adhesive film, as a result of which,
  • heat-activated adhesive systems with a low water vapor or oxygen permeation rate are preferably used.
  • activatable adhesives are known, for example, from EP 0 674 432 A1, US 2006/0100299 A1, WO 2007/087281 A1, DE 10 2009 036 970 A, JP 2005 298 703 A, EP 1 670 292 A and US 2007135552 A.
  • activatable adhesive systems can also be readily thermally activated by actinic radiation, for example UV radiation, if corresponding initiators, for example peroxides, are added.
  • FIG. 2 shows an alternative embodiment of an (opto) electronic device 1. Shown again is an electronic structure 3, which is arranged on a substrate 2 and encapsulated by the substrate 2 from below. Above and to the side of the electronic structure is now the fabric 5 arranged over its entire surface. The electronic structure 3 is thus encapsulated at these locations by the sheet 5. On the fabric 5, a cover 4 is then applied.
  • This cover 4 does not necessarily have to meet the high barrier requirements, in contrast to the previous embodiment, since the barrier is already provided by the fabric.
  • the cover 4 may, for example, only perform a mechanical protective function, but it may also be additionally provided as a permeation barrier.
  • the heating of the fabric 5 in this arrangement may comprise both the entire adhesive layer and alternatively only a portion of the surface, for example the region not covering the electronic structure.
  • a polyester film in a thickness of 100 ⁇ m was used for further tests, for example the film Melinex 506 from Teijin-DuPont-Films. Since the films themselves have no permeation barrier layer, no life test can be performed hereby. The bonding is therefore only visually assessed and manually tested for a connection to occur.
  • the inductor was embedded in a matrix of polyetheretherketone (PEEK) and the assembly thus obtained was used as the lower punch element of a pressing device, which also has an upper punch element.
  • the contact pressure due to the force F, with which the layer structure between the lower Press punch element and the upper punch element was applied perpendicular to the side surfaces of the heat-activated bondable sheet is shown in Table 3, respectively.
  • the distance between the bond line and the inductor was approx. 3 mm in each case.
  • a PTFE plate was placed accordingly.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Textile Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un procédé d'encapsulation d'un dispositif électronique pour l'isoler de perméants. Dans ce procédé • on prépare une structure plane comprenant au moins une composition adhésive ou thermofusible activable par la chaleur et • on applique la structure plane, au moins autour des zones à encapsuler du dispositif électronique, sur un substrat portant/comprenant le dispositif électronique, • on pose un recouvrement sur le dispositif électronique et au moins sur la composition adhésive qui l'entoure, en mettant la composition adhésive en contact avec le recouvrement, et • on active ensuite thermiquement la composition adhésive, au moins dans une zone partielle de sa surface, de manière à former un assemblage au moins du substrat et du recouvrement, la chaleur nécessaire à l'activation étant essentiellement générée dans la structure plane même contenant au moins la composition adhésive.
PCT/EP2011/062881 2010-08-13 2011-07-27 Procédé d'encapsulation d'un dispositif électronique Ceased WO2012019909A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201180049543.7A CN103270618B (zh) 2010-08-13 2011-07-27 封装电子装置的方法
KR1020137006303A KR101871317B1 (ko) 2010-08-13 2011-07-27 전자 장치를 캡슐화하기 위한 방법
DE112011102705T DE112011102705A5 (de) 2010-08-13 2011-07-27 Verfahren zur Kapselung einer elektronischen Anordnung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010039320.7 2010-08-13
DE102010039320 2010-08-13

Publications (1)

Publication Number Publication Date
WO2012019909A1 true WO2012019909A1 (fr) 2012-02-16

Family

ID=44773031

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/062881 Ceased WO2012019909A1 (fr) 2010-08-13 2011-07-27 Procédé d'encapsulation d'un dispositif électronique

Country Status (5)

Country Link
KR (1) KR101871317B1 (fr)
CN (1) CN103270618B (fr)
DE (1) DE112011102705A5 (fr)
TW (1) TW201222684A (fr)
WO (1) WO2012019909A1 (fr)

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DE102011079685A1 (de) * 2011-07-22 2013-01-24 Tesa Se Verfahren zum Herstellen einer Klebverbindung mit einem hitzeaktivierbaren Kleber mittels Induktionserwärmung
CN103594549A (zh) * 2012-08-13 2014-02-19 德莎欧洲公司 制造太阳能模块的方法
DE102015202415A1 (de) * 2015-02-11 2016-08-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoff, Verfahren zur berührungslosen Temperaturmessung des Klebstoffs und Verfahren zur verbesserten Verbindung zweier Bauteile mit Klebstoff
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
TWI635156B (zh) * 2016-07-27 2018-09-11 德商特薩股份有限公司 Electronic structure packaging tape and use thereof
DE102018108724A1 (de) * 2018-04-12 2019-10-17 fos4X GmbH Verfahren zum induktiven Kleben von Sensoren in Windenergieanlagen

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US11131431B2 (en) 2014-09-28 2021-09-28 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US8823165B2 (en) 2011-07-12 2014-09-02 Invensas Corporation Memory module in a package
US8405207B1 (en) 2011-10-03 2013-03-26 Invensas Corporation Stub minimization for wirebond assemblies without windows
US8659140B2 (en) 2011-10-03 2014-02-25 Invensas Corporation Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
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US8525327B2 (en) 2011-10-03 2013-09-03 Invensas Corporation Stub minimization for assemblies without wirebonds to package substrate
JP5887414B2 (ja) 2011-10-03 2016-03-16 インヴェンサス・コーポレイション 平行な窓を有するマルチダイのワイヤボンドアセンブリのスタブ最小化
US8513813B2 (en) 2011-10-03 2013-08-20 Invensas Corporation Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
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US9368477B2 (en) 2012-08-27 2016-06-14 Invensas Corporation Co-support circuit panel and microelectronic packages
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US11480305B2 (en) 2014-09-25 2022-10-25 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp
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US10560989B2 (en) 2014-09-28 2020-02-11 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
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US10514134B2 (en) 2014-12-05 2019-12-24 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US12264789B2 (en) 2014-12-05 2025-04-01 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US9897265B2 (en) 2015-03-10 2018-02-20 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp having LED light strip
US10161569B2 (en) 2015-09-02 2018-12-25 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US9484080B1 (en) 2015-11-09 2016-11-01 Invensas Corporation High-bandwidth memory application with controlled impedance loading
US9679613B1 (en) 2016-05-06 2017-06-13 Invensas Corporation TFD I/O partition for high-speed, high-density applications
CN105957980A (zh) * 2016-05-30 2016-09-21 京东方科技集团股份有限公司 Oled封装设备及oled封装方法
JP6789048B2 (ja) * 2016-09-23 2020-11-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US12060502B2 (en) * 2018-05-25 2024-08-13 3M Innovative Properties Company Phase separated articles
US11551963B2 (en) * 2020-02-14 2023-01-10 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
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TWI844043B (zh) * 2022-06-21 2024-06-01 德商Ｓｅｓ Ｒｆｉｄ解決方案有限公司 晶片封裝結構
CN114433971B (zh) * 2021-12-20 2023-07-25 中国电子科技集团公司第二十九研究所 一种使用磁振颗粒辅助进行堆叠焊接的方法

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KR101871317B1 (ko) 2018-06-27
DE112011102705A5 (de) 2013-05-29

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