[go: up one dir, main page]

WO2012099444A2 - Wire saw apparatus - Google Patents

Wire saw apparatus Download PDF

Info

Publication number
WO2012099444A2
WO2012099444A2 PCT/KR2012/000567 KR2012000567W WO2012099444A2 WO 2012099444 A2 WO2012099444 A2 WO 2012099444A2 KR 2012000567 W KR2012000567 W KR 2012000567W WO 2012099444 A2 WO2012099444 A2 WO 2012099444A2
Authority
WO
WIPO (PCT)
Prior art keywords
ingot
wire saw
coupled
saw device
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/000567
Other languages
French (fr)
Korean (ko)
Other versions
WO2012099444A3 (en
Inventor
장석준
박태인
조창석
조상식
곽범석
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OSUNG LST CO Ltd
Original Assignee
OSUNG LST CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OSUNG LST CO Ltd filed Critical OSUNG LST CO Ltd
Priority to CN2012800001111A priority Critical patent/CN103003040A/en
Publication of WO2012099444A2 publication Critical patent/WO2012099444A2/en
Publication of WO2012099444A3 publication Critical patent/WO2012099444A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Definitions

  • the present invention relates to a wire saw device, and more particularly, to a wire saw device having a basket that can support debris generated when cutting ingots by a wire saw.
  • a slicing process of cutting the ingot into sheets to manufacture a wafer is performed.
  • This slicing process has a variety of methods, the typical one of which is to reciprocate the piano wire or high tension wire in the chamber at high speed while spraying a slurry solution thereon, which is cut by friction between the slurry and the single crystal ingot attached to the wire. It is a wire saw method.
  • Wire saws are now widely used because they can cut ingots into multiple wafers at the same time, improving yield per unit time.
  • Korean Patent No. 887494 discloses an apparatus for cutting an ingot by a wire saw.
  • a beam having an ingot attached to the lower surface the beam is attached to the lower surface and has a fitting shape on the side
  • a ingot feed table is provided which is provided with a work plate and grooves matching with the fit shape of the work plate, to which the fit shape of the work plate is mounted.
  • the ingot is cut into a very thin wafer using an ingot cutting device as described above.
  • the wafer is partially broken due to the unevenness of the tension of the wire, which is the cutting tool.
  • the broken wafer falls down, and the falling wafer is completely separated from the ingot and falls between the other wafers cut, that is, in contact with each other.
  • a supporting member or the like is conventionally provided between two rollers, and the supporting member is generally provided with a conductor such as metal.
  • the current for detecting disconnection flowing through the wire flows to the supporting member, and as the supporting member is energized, the current flows through the entire chamber to which the supporting member is coupled.
  • An object of the present invention is to solve the conventional problems as described above, and to provide a wire saw device that can be prevented from being recognized as disconnection of a wire by a wafer that is partially broken and falls during ingot cutting. do.
  • an object of the present invention is to provide a wire saw device in which the wafer is partially broken and falling on the insulating basket, which can be easily identified from the outside.
  • a wire saw device for cutting a downwardly moving ingot, a plurality of bobbins spaced apart from each other to rotate; A wire reciprocatingly wound around the plurality of bobbins a plurality of times to cut an ingot; An insulation basket disposed below the ingot and spaced apart from the plurality of bobbins; It can be achieved by a wire saw device comprising a; guide plate coupled to the opposite side of the bobbin on both sides of the insulating basket.
  • the front and rear ends of the bobbin may further include a pair of support panels.
  • the apparatus may further include a coupling member coupled to the insulating basket and detachably coupled to the pair of support panels, respectively.
  • the coupling member may be an insulating material.
  • the insulating basket may form an inner space including a bottom panel and a plurality of side panels coupled to the edge of the bottom panel.
  • the bottom panel may include an inclined portion formed to be inclined downward from both sides of the central portion, and a through portion formed at an end of the inclined portion and having a through hole formed therein.
  • the side panel may be a through-hole for the slurry outflow.
  • the side panel may include a front end coupled to the front end of the bottom panel and side ends coupled to both ends of the bottom panel in a longitudinal direction, and the front end may be provided with a gripper.
  • the guide plate may be formed to be inclined upwardly outward with respect to the insulating basket to guide the falling ingot fragments during ingot cutting.
  • the guide plate may be an insulating material.
  • a wire saw device capable of preventing the wire from being recognized as disconnected by a wafer that is partially broken and falls during ingot cutting.
  • a wire saw device that is easy to externally identify that the wafer has partially broken and crashed into the insulating basket.
  • FIG. 1 is a perspective view of a cut portion of a wire saw device according to a first embodiment of the present invention
  • FIG. 1 is an exploded perspective view of FIG. 1;
  • FIG. 3 is an enlarged view of the insulating basket and the guide plate of FIG.
  • 4 and 5 are operation state diagrams of the wire saw device according to the first embodiment of the present invention.
  • the wire saw device is an ingot is installed inside the chamber of a predetermined size as in the conventional wire saw device, the cutting portion for cutting into a wafer by a wire while moving the ingot downward; It consists of a sending part including a plurality of rollers and a wire passing through the roller on one side of the chamber is installed to supply and withdraw the wire to the cut through the sending part.
  • FIG. 1 is a perspective view of a cut portion of the wire saw device according to a first embodiment of the present invention
  • Figure 2 is an exploded perspective view of FIG.
  • the cutting part 1 is installed inside the chamber 100, and includes a pair of support panels 10, a pair of bobbins 20, wires 30, and an insulating basket 40.
  • the guide plate 60 may be configured to include.
  • the pair of support panels 10 includes a first support panel 11 and a second support panel 12, and a pair of bobbins 20 to be described later are interposed with predetermined bearings, such as idle. As a member installed to rotate, spaced apart at regular intervals is installed inside the chamber 100.
  • first support panel 11 positioned at the front side may be fixed to the front inner wall of the chamber 100 and the second support panel 12 may be coupled to the rear inner wall of the chamber 100 by screws or bolts. have.
  • first supporting panel 11 may be formed with a groove or hole-shaped observation portion 11a to observe the insulating basket 40 to be described later.
  • each support panel may be provided with a predetermined groove or hole to which a pair of bobbins 20 to be described later are coupled.
  • a hole is formed.
  • the pair of bobbins 20 are composed of a first bobbin 21 and a second bobbin 22 and are arranged to be spaced apart from each other, and both ends are coupled to freely rotate to the pair of support panels 10 described above. .
  • a groove (not shown) may be formed on the outer surface of each bobbin so that the wire 30 to be described later is wound at a predetermined interval.
  • each bobbin may be driven by driving means for applying a driving force, such as a predetermined driving motor, through the second support panel 12 located at the rear.
  • a driving force such as a predetermined driving motor
  • the wire 30 is installed to pass through a plurality of rollers of the sending portion, and may be wound at least 300 to 400 times outside the pair of bobbins 20 described above from the sending portion, wherein the wires 30 are each The outer side of the bobbin may be wound in a manner such as fitting into the groove formed at a predetermined interval.
  • the wire 30 wound on the bobbin may be wound along the outer surface of each bobbin on one side according to the supply and withdrawal of the transmitter, and may be released on the other side.
  • the insulating basket 40 is made of an insulating material that is not energized, and a plurality of side panels 42 coupled to each edge of the bottom panel 41 and the bottom panel 41 forming an inner space. It can be composed of).
  • the bottom panel 41 is a panel having a predetermined thickness and may be formed of an inclined portion 41a and a through portion 41b.
  • the inclined portion 41a may be formed to be inclined downward from both sides of the central portion of the bottom panel 41.
  • the through part 41b is a portion extending from the inclined part 41a and may have a through hole 41b 'through which a slurry may penetrate downward.
  • the insulating basket 40 may be installed in the spaced space between the first bobbin 21 and the second bobbin 22 while being a lower portion of the ingot moving downward.
  • fragments of slurry or ingot may flow downward or move to both sides in the longitudinal direction of the insulating basket 40 through the inclined portion 41a of the insulating basket 40, and may flow through the inclined portion 41a.
  • the falling slurry may fall downward through the penetrating portion 41b.
  • the phenomenon that the slurry aggregates may not occur.
  • the side panel 42 may be formed of a front end portion 42a coupled to form a predetermined height at the front end of the bottom panel 41 and a side end portion 42b coupled to a predetermined height at both ends in the longitudinal direction. .
  • the rear end of the insulating basket 40 is coupled to abut the second support panel 12, so that it is coupled to the remaining three surfaces except for the rear surface, and if necessary, the entire edge, that is, all four surfaces It can also be coupled to.
  • the through-holes 42a 'and 42b' for slurry outflow may be formed in the front end portion 42a and the side end portion 42b as in the through portion 41b described above.
  • the front end portion 42a is provided with a gripping portion 42a '' that can be gripped when detached and detachable in a state in which the manager directly grips the insulation basket 40 when the detachable portion is attached to other components such as wire and bobbin. It can prevent damage or damage.
  • the insulating basket 40 may be detachably coupled to the first support panel 11 and the second support panel 12 by the coupling member 50.
  • the coupling member 50 has a large L-shaped cross section and is coupled to the coupling portion 51 and the longitudinal end of the insulating basket 40, coupled to the lower portion of the longitudinal end of the coupling portion 51 It may include a fixing portion 52.
  • the fixing unit 52 may be fastened to the inner surface of the support panel 10 described above so as to be detachable by a predetermined bolt or the like.
  • the guide plate 60 is provided as a pair of insulating materials and is coupled to the side ends 42b of the side panels 42 through coupling means 53, respectively, and the vertical plate 61 is coupled to the side ends 42b.
  • a bending plate 62 bent upwardly outward from the vertical plate 61, that is, inclined upwardly outwardly about the insulating basket 40.
  • the guide plate may be formed bent a plurality of times as needed, in this embodiment is shown that the bending plate is formed by bending once with respect to the vertical plate.
  • the vertical plate 61 may be formed with a communication hole 60a in communication with the slurry outflow through-hole 42b 'formed in the side end portion 42b coupled to face each other.
  • the slurry flowing down the inner wall of the vertical plate 61 may flow out through the slurry outflow through-hole 42b 'and the communication hole 60a.
  • FIG. 4 and 5 are operation state diagrams of the wire saw device according to the first embodiment of the present invention.
  • the wire 30 is wound around the first bobbin 21 and the second bobbin 22, and the ingot 200 is moved downward at a preset speed. At this time, the wire 30 is set in advance so that a current for detecting disconnection flows.
  • the ingot 200 is cut into a thin wafer by the wire 30, in which case the wafer 200A is partially cut, such as tension unevenness of the wire 30 or vibration of the entire apparatus. As it is broken, it slides downward while being sandwiched between other wafers.
  • the damaged wafer 200A is guided in the direction of the insulating basket 40 by the guide plate 50 to be in contact with the insulating basket 40. Since the insulating basket 40 and the guide plate 50 are insulating materials Since no current is supplied to the entire chamber, it can be prevented from being sensed as disconnection.
  • the device manager can easily find the wafer 200A that is broken in the insulating basket 40 from the outside through the observation portion 11a formed on the first support panel 11 to temporarily stop the entire device. The broken wafer can be removed and the device restarted.
  • the fine debris seated by dropping to the insulating basket 40 can be removed by separating the insulating basket 40 after the ingot is cut into a wafer.
  • the entire chamber is energized by a wafer which is easily observed from the outside when the ingot is partially damaged and partially damaged to contact the insulating basket. This can prevent misinterpretation by disconnection.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention relates to a wire saw apparatus for cutting an ingot. The wire saw apparatus for cutting a downwardly moving ingot according to the present invention comprises: a plurality of bobbins which are spaced apart from each other and rotate; a wire wound on the plurality of bobbins to cut an ingot; an insulating basket arranged in the spacing between the plurality of bobbins and beneath the ingot; and guide plates coupled to both sides of the insulation basket such that the guide plate faces the bobbins. Thus, a wafer which is partially broken and falls during ingot cutting may be prevented from being recognized as a disconnection of the wire, and the wafer which is partially broken and fallen in the insulation basket may be easily recognized from the outside.

Description

와이어쏘 장치Wire saw device

본 발명은 와이어쏘 장치에 관한 것으로서, 보다 상세하게는 와이어쏘에 의해 잉곳 절단시 발생하는 파편 등을 받칠 수 있는 바스켓이 구비된 와이어쏘 장치에 관한 것이다.The present invention relates to a wire saw device, and more particularly, to a wire saw device having a basket that can support debris generated when cutting ingots by a wire saw.

일반적으로 잉곳의 성장(growth) 공정이 완료된 후 웨이퍼로 제조하기 위해 잉곳을 낱장 단위로 절단하는 슬라이싱 공정이 진행된다.Generally, after the growth process of the ingot is completed, a slicing process of cutting the ingot into sheets to manufacture a wafer is performed.

이러한 슬라이싱 공정은 여러 가지 방식이 있는데, 그 대표적인 것은 챔버 내에서 피아노 와이어 또는 고장력 와이어를 빠른 속도로 왕복 주행시키면서 그 위에 슬러리(slurry) 용액을 분사시켜 와이어에 묻은 슬러리와 단결정 잉곳의 마찰에 의해 절단하는 와이어 쏘(Wire Saw) 방식이다.This slicing process has a variety of methods, the typical one of which is to reciprocate the piano wire or high tension wire in the chamber at high speed while spraying a slurry solution thereon, which is cut by friction between the slurry and the single crystal ingot attached to the wire. It is a wire saw method.

와이어 쏘 방식은 잉곳을 동시에 여러 개의 웨이퍼로 절단할 수 있어 단위 시간당 생산수율을 향상시킬 수 있기 때문에 현재 널리 쓰이고 있다.Wire saws are now widely used because they can cut ingots into multiple wafers at the same time, improving yield per unit time.

한국등록특허 제887494호에는 와이어 쏘에 의한 잉곳의 절단장치가 개시되어 있다. 여기서, 챔버의 내측 두 롤러에 300~400회 권취된 와이어의 상향에 설치된 잉곳을 고정하는 유닛으로서 하부면에 잉곳이 부착되는 빔과, 상기 빔이 하부면에 부착되고 측면에 끼워맞춤 형상을 갖는 워크플레이트와, 워크플레이트의 끼워맞춤 형상과 정합되는 요홈이 구비되어 워크플레이트의 끼워맞춤 형상이 장착되는 잉곳 피드 테이블이 개시되어 있다.Korean Patent No. 887494 discloses an apparatus for cutting an ingot by a wire saw. Here, as a unit for fixing the ingot installed upstream of the wire wound 300 to 400 times to the inner two rollers of the chamber, a beam having an ingot attached to the lower surface, the beam is attached to the lower surface and has a fitting shape on the side A ingot feed table is provided which is provided with a work plate and grooves matching with the fit shape of the work plate, to which the fit shape of the work plate is mounted.

상기와 같은 잉곳 절단장치를 이용하여 잉곳을 매우 얇은 두께의 웨이퍼로 절단하게 된다. 그런데, 잉곳을 웨이퍼로 절단하는 중에 절단기구인 와이어의 장력 등의 불균일에 의해 웨이퍼가 부분적으로 파손이 발생하게 된다.The ingot is cut into a very thin wafer using an ingot cutting device as described above. By the way, during the cutting of the ingot into the wafer, the wafer is partially broken due to the unevenness of the tension of the wire, which is the cutting tool.

이때, 파손된 웨이퍼는 하향으로 추락하게 되는데, 추락하는 웨이퍼는 잉곳으로부터 완전히 분리되어 추락하지 않고 절단된 다른 웨이퍼들 사이에 끼워져 있는 상태 즉, 상호 접촉된 상태에서 추락하게 된다.At this time, the broken wafer falls down, and the falling wafer is completely separated from the ingot and falls between the other wafers cut, that is, in contact with each other.

따라서, 추락하는 웨이퍼를 받아내기 위해 종래에는 두 롤러의 사이에 받침부재 등을 구비하고, 상기 받침부재는 통상적으로 금속 등의 도전체로 구비된 경우가 일반적이었다.Therefore, in order to pick up a falling wafer, a supporting member or the like is conventionally provided between two rollers, and the supporting member is generally provided with a conductor such as metal.

그런데, 받침부재 등에 추락하는 웨이퍼가 닿게 되는 경우 와이어에 흐르는 단선감지용 전류가 받침부재에 흐르게 되고, 받침부재가 통전됨에 따라 받침부재가 결합되는 챔버 전체에 전류가 흐르게 된다.However, when the wafer falling down on the supporting member or the like comes into contact with the wire, the current for detecting disconnection flowing through the wire flows to the supporting member, and as the supporting member is energized, the current flows through the entire chamber to which the supporting member is coupled.

결과적으로, 이와 같은 상태는 전체 시스템을 제어하는 제어부에서 와이어가 단선되어 챔버와 접촉되는 경우와 동일한 상태로 인식하게 되는 문제점이 있었다.As a result, such a state has a problem that the control unit for controlling the entire system recognizes the same state as when the wire is disconnected and in contact with the chamber.

본 발명의 과제는 상술한 바와 같은 종래의 문제점을 해결하기 위한 것으로서, 잉곳 절단시 부분적으로 파손되어 추락하는 웨이퍼에 의해 와이어의 단선으로 인식되는 것을 방지할 수 있는 와이어쏘 장치를 제공하는 것을 목적으로 한다.DISCLOSURE OF THE INVENTION An object of the present invention is to solve the conventional problems as described above, and to provide a wire saw device that can be prevented from being recognized as disconnection of a wire by a wafer that is partially broken and falls during ingot cutting. do.

또한, 웨이퍼가 부분적으로 파손되어 절연바스켓에 추락해 있는 것을 외부에서 식별이 용이한 와이어쏘 장치를 제공하는 것을 목적으로 한다.In addition, an object of the present invention is to provide a wire saw device in which the wafer is partially broken and falling on the insulating basket, which can be easily identified from the outside.

상기 과제는, 본 발명에 따라, 하향으로 이동하는 잉곳을 절단하는 와이어쏘 장치에 있어서, 상호 이격배치되어 회전하는 복수의 보빈; 상기 복수의 보빈에 복수 회 왕복 권선되어 잉곳을 절단하는 와이어; 상기 잉곳의 하부이면서 상기 복수의 보빈의 이격공간에 배치되는 절연바스켓; 상기 절연바스켓의 양측에 상기 보빈과 대향되도록 결합되는 안내플레이트;를 포함하는 것을 특징으로 하는 와이어쏘 장치에 의해 달성될 수 있다.According to the present invention, there is provided a wire saw device for cutting a downwardly moving ingot, a plurality of bobbins spaced apart from each other to rotate; A wire reciprocatingly wound around the plurality of bobbins a plurality of times to cut an ingot; An insulation basket disposed below the ingot and spaced apart from the plurality of bobbins; It can be achieved by a wire saw device comprising a; guide plate coupled to the opposite side of the bobbin on both sides of the insulating basket.

여기서, 상기 보빈의 전단과 후단이 결합되는 한 쌍의 지지패널을 더 포함할 수 있다.Here, the front and rear ends of the bobbin may further include a pair of support panels.

또한, 상기 절연바스켓과 결합되며 상기 한 쌍의 지지패널에 각각 착탈가능하도록 결합되는 결합부재를 더 포함할 수 있다. 이때, 상기 결합부재는 절연재질일 수 있다.The apparatus may further include a coupling member coupled to the insulating basket and detachably coupled to the pair of support panels, respectively. In this case, the coupling member may be an insulating material.

또한, 상기 절연바스켓은 바닥패널과 상기 바닥패널의 가장자리에 결합되는 다수의 측면패널을 포함하여 내부공간을 형성할 수 있다.In addition, the insulating basket may form an inner space including a bottom panel and a plurality of side panels coupled to the edge of the bottom panel.

또한, 상기 바닥패널은 중앙부의 양측으로부터 하향으로 경사지도록 형성된 경사부와, 상기 경사부의 말단에 연장형성되며 관통홀이 형성된 관통부를 포함할 수 있다.In addition, the bottom panel may include an inclined portion formed to be inclined downward from both sides of the central portion, and a through portion formed at an end of the inclined portion and having a through hole formed therein.

또한, 상기 측면패널에는 슬러리 유출용 관통홀이 형성될 수 있다. 상기 측면패널은 상기 바닥패널의 전방단부에 결합되는 전단부와, 상기 바닥패널의 길이방향 양측 단부를 따라 결합되는 측단부를 포함하며, 상기 전단부에는 파지가능한 파지부가 형성될 수 있다.In addition, the side panel may be a through-hole for the slurry outflow. The side panel may include a front end coupled to the front end of the bottom panel and side ends coupled to both ends of the bottom panel in a longitudinal direction, and the front end may be provided with a gripper.

또한, 상기 안내플레이트는 잉곳 절단시 낙하하는 잉곳 파편을 가이드하도록 상기 절연바스켓을 중심으로 상향 외측으로 경사지도록 형성될 수 있다. 이때, 상기 안내플레이트는 절연재질일 수 있다.In addition, the guide plate may be formed to be inclined upwardly outward with respect to the insulating basket to guide the falling ingot fragments during ingot cutting. In this case, the guide plate may be an insulating material.

본 발명에 따르면, 잉곳 절단시 부분적으로 파손되어 추락하는 웨이퍼에 의해 와이어의 단선으로 인식되는 것을 방지할 수 있는 와이어쏘 장치가 제공된다.According to the present invention, there is provided a wire saw device capable of preventing the wire from being recognized as disconnected by a wafer that is partially broken and falls during ingot cutting.

또한, 웨이퍼가 부분적으로 파손되어 절연바스켓에 추락해 있는 것을 외부에서 식별이 용이한 와이어쏘 장치가 제공된다.In addition, there is provided a wire saw device that is easy to externally identify that the wafer has partially broken and crashed into the insulating basket.

도 1은 본 발명의 제1실시예에 따른 와이어쏘 장치 중 절단부의 사시도,1 is a perspective view of a cut portion of a wire saw device according to a first embodiment of the present invention,

도 2는 도 1의 분해사시도,2 is an exploded perspective view of FIG. 1;

도 3은 도 2의 절연바스켓과 안내플레이트의 확대도,3 is an enlarged view of the insulating basket and the guide plate of FIG.

도 4와 도 5는 본 발명의 제1실시예에 따른 와이어쏘 장치의 작동상태도이다.4 and 5 are operation state diagrams of the wire saw device according to the first embodiment of the present invention.

설명에 앞서, 여러 실시예에 있어서, 동일한 구성을 가지는 구성요소에 대해서는 동일한 부호를 사용하여 대표적으로 제1실시예에서 설명하고, 그 외의 실시예에서는 제1실시예와 다른 구성에 대해서 설명하기로 한다.Prior to the description, in the various embodiments, components having the same configuration will be representatively described in the first embodiment using the same reference numerals, and in other embodiments, different configurations from the first embodiment will be described. do.

이하, 첨부한 도면을 참조하여 본 발명의 제1실시예에 따른 와이어쏘 장치에 대하여 상세하게 설명한다.Hereinafter, a wire saw device according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

본 발명의 제1실시예에 따른 와이어쏘 장치는 통상의 와이어쏘 장치에서와 같이 일정 크기의 챔버 내측에 잉곳이 설치되고, 상기 잉곳을 하향으로 이동시키면서 와이어에 의해 웨이퍼로 절단하는 절단부와, 상기 챔버의 일 측에 다수의 롤러 및 상기 롤러를 경유하는 와이어를 포함하는 송출부로 구성되어 상기 송출부를 통해 절단부에 와이어를 공급 및 회수하도록 설치된다.The wire saw device according to the first embodiment of the present invention is an ingot is installed inside the chamber of a predetermined size as in the conventional wire saw device, the cutting portion for cutting into a wafer by a wire while moving the ingot downward; It consists of a sending part including a plurality of rollers and a wire passing through the roller on one side of the chamber is installed to supply and withdraw the wire to the cut through the sending part.

도 1은 본 발명의 제1실시예에 따른 와이어쏘 장치 중 절단부의 사시도이고, 도 2는 도 1의 분해사시도이다.1 is a perspective view of a cut portion of the wire saw device according to a first embodiment of the present invention, Figure 2 is an exploded perspective view of FIG.

도 1 및 도 2를 참조하면, 절단부(1)는 챔버(100)의 내측에 설치되며, 한 쌍의 지지패널(10), 한 쌍의 보빈(20), 와이어(30), 절연바스켓(40) 및 안내플레이트(60)를 포함하여 구성될 수 있다.1 and 2, the cutting part 1 is installed inside the chamber 100, and includes a pair of support panels 10, a pair of bobbins 20, wires 30, and an insulating basket 40. And the guide plate 60 may be configured to include.

상기 한 쌍의 지지패널(10)은 제1지지패널(11)과 제2지지패널(12)로 구성되며, 후술할 한 쌍의 보빈(20)이 소정의 베어링 등이 개재되어 아이들(idle)회전하도록 설치되는 부재로서, 일정 간격으로 이격되어 챔버(100)의 내측에 설치된다.The pair of support panels 10 includes a first support panel 11 and a second support panel 12, and a pair of bobbins 20 to be described later are interposed with predetermined bearings, such as idle. As a member installed to rotate, spaced apart at regular intervals is installed inside the chamber 100.

이때, 전방에 위치하는 제1지지패널(11)은 챔버(100)의 전방내벽에, 제2지지패널(12)은 챔버(100)의 후방내벽에 나사 또는 볼트 등을 통해 결합되어 고정될 수 있다.In this case, the first support panel 11 positioned at the front side may be fixed to the front inner wall of the chamber 100 and the second support panel 12 may be coupled to the rear inner wall of the chamber 100 by screws or bolts. have.

또한, 제1지지패널(11)에는 후술할 절연바스켓(40)을 외부에서 관찰할 수 있도록 홈 또는 홀 형상의 관찰부(11a)가 형성될 수 있다.In addition, the first supporting panel 11 may be formed with a groove or hole-shaped observation portion 11a to observe the insulating basket 40 to be described later.

그리고, 각 지지패널에는 후술할 한 쌍의 보빈(20)이 결합되는 소정의 홈 또는 홀 등이 형성될 수 있으며, 본 실시예에서는 홀이 형성된 것을 도시하고 있다.In addition, each support panel may be provided with a predetermined groove or hole to which a pair of bobbins 20 to be described later are coupled. In this embodiment, a hole is formed.

상기 한 쌍의 보빈(20)은 제1보빈(21)과 제2보빈(22)으로 구성되어 상호 이격되도록 배치되며, 양단이 상술한 한 쌍의 지지패널(10)에 자유롭게 회전하도록 결합되어 있다.The pair of bobbins 20 are composed of a first bobbin 21 and a second bobbin 22 and are arranged to be spaced apart from each other, and both ends are coupled to freely rotate to the pair of support panels 10 described above. .

여기서, 각 보빈의 외측면에는 후술할 와이어(30)가 일정간격으로 권선되도록 홈(미도시)이 형성될 수 있다.Here, a groove (not shown) may be formed on the outer surface of each bobbin so that the wire 30 to be described later is wound at a predetermined interval.

그리고, 각 보빈은 후방에 위치한 제2지지패널(12)을 통해 소정의 구동모터 등의 구동력을 인가하는 구동수단이 결합되어 구동될 수 있다.In addition, each bobbin may be driven by driving means for applying a driving force, such as a predetermined driving motor, through the second support panel 12 located at the rear.

상기 와이어(30)는 송출부의 다수의 롤러를 경유하도록 설치되며, 송출부로부터 상술한 한 쌍의 보빈(20)의 외측에 적어도 300~400회 권선될 수 있고, 이때, 와이어(30)는 각 보빈의 외측에 일정간격으로 형성된 홈에 끼워맞춤 등의 방법으로 권선되어 있을 수 있다.The wire 30 is installed to pass through a plurality of rollers of the sending portion, and may be wound at least 300 to 400 times outside the pair of bobbins 20 described above from the sending portion, wherein the wires 30 are each The outer side of the bobbin may be wound in a manner such as fitting into the groove formed at a predetermined interval.

상기와 같이 보빈에 권선된 와이어(30)는 송출부의 공급 및 회수에 따라 일 측에서는 각 보빈의 외측면을 따라 권선되고, 타 측에서는 권선해제될 수 있다.As described above, the wire 30 wound on the bobbin may be wound along the outer surface of each bobbin on one side according to the supply and withdrawal of the transmitter, and may be released on the other side.

도 3은 도 2의 절연바스켓과 안내플레이트의 확대도이다. 도 3을 참조하면, 상기 절연바스켓(40)은 통전되지 않는 절연재질로 마련되며, 내부공간을 형성하는 바닥패널(41)과 바닥패널(41)의 각 가장자리에 결합되는 다수의 측면패널(42)로 구성될 수 있다.3 is an enlarged view of the insulating basket and the guide plate of FIG. 2. Referring to FIG. 3, the insulating basket 40 is made of an insulating material that is not energized, and a plurality of side panels 42 coupled to each edge of the bottom panel 41 and the bottom panel 41 forming an inner space. It can be composed of).

여기서, 바닥패널(41)은 일정 두께를 가지는 패널로서, 경사부(41a)와 관통부(41b)로 이뤄질 수 있다. 상기 경사부(41a)는 바닥패널(41)의 중앙부의 양측으로부터 하향으로 경사지도록 형성될 수 있다.Here, the bottom panel 41 is a panel having a predetermined thickness and may be formed of an inclined portion 41a and a through portion 41b. The inclined portion 41a may be formed to be inclined downward from both sides of the central portion of the bottom panel 41.

상기 관통부(41b)는 경사부(41a)로부터 연장형성된 부분으로서 슬러리(slurry)가 하향으로 관통하여 낙하할 수 있는 관통홀(41b')이 형성될 수 있다.The through part 41b is a portion extending from the inclined part 41a and may have a through hole 41b 'through which a slurry may penetrate downward.

이 같은 절연바스켓(40)은 하향으로 이동하는 잉곳의 하부이면서 상술한 제1보빈(21)과 제2보빈(22)의 이격공간에 설치될 수 있다.The insulating basket 40 may be installed in the spaced space between the first bobbin 21 and the second bobbin 22 while being a lower portion of the ingot moving downward.

즉, 절연바스켓(40)의 경사부(41a)를 통해 절연바스켓(40)의 길이방향 양측으로 슬러리 또는 잉곳의 파편 등이 하향으로 흘러내리거나 이동될 수 있으며, 경사부(41a)를 통해 흘러내리는 슬러리는 관통부(41b)를 통해 하향으로 낙하될 수 있다. 결과적으로, 절연바스켓(40)의 내부공간에서는 슬러리가 고여서 응고되는 현상이 발생하지 않을 수 있다.That is, fragments of slurry or ingot may flow downward or move to both sides in the longitudinal direction of the insulating basket 40 through the inclined portion 41a of the insulating basket 40, and may flow through the inclined portion 41a. The falling slurry may fall downward through the penetrating portion 41b. As a result, in the inner space of the insulating basket 40, the phenomenon that the slurry aggregates may not occur.

상기 측면패널(42)은 바닥패널(41)의 전방단부에 일정 높이를 형성하도록 결합되는 전단부(42a)와, 길이방향 양측 단부에 일정높이로 결합되는 측단부(42b)로 형성될 수 있다.The side panel 42 may be formed of a front end portion 42a coupled to form a predetermined height at the front end of the bottom panel 41 and a side end portion 42b coupled to a predetermined height at both ends in the longitudinal direction. .

본 실시예에서는 절연바스켓(40)의 후방단부가 제2지지패널(12)과 맞닿도록 결합되므로 후방면을 제외한 나머지 3면에 결합된 것을 도시하고 있으며, 필요에 따라 가장자리 전체 즉, 4면 모두에 결합될 수도 있다.In this embodiment, the rear end of the insulating basket 40 is coupled to abut the second support panel 12, so that it is coupled to the remaining three surfaces except for the rear surface, and if necessary, the entire edge, that is, all four surfaces It can also be coupled to.

여기서, 전단부(42a)와 측단부(42b)에는 상술한 관통부(41b)에서와 같이 슬러리 유출용 관통홀(42a', 42b')이 형성될 수 있다.Here, the through-holes 42a 'and 42b' for slurry outflow may be formed in the front end portion 42a and the side end portion 42b as in the through portion 41b described above.

또한, 전단부(42a)에는 착탈시 파지가능한 파지부(42a'')가 형성되어 착탈시 관리자가 직접 절연바스켓(40)을 파지한 상태에서 착탈이 가능하여 와이어 및 보빈 등의 다른 구성들에 훼손 또는 파손을 방지할 수 있다.In addition, the front end portion 42a is provided with a gripping portion 42a '' that can be gripped when detached and detachable in a state in which the manager directly grips the insulation basket 40 when the detachable portion is attached to other components such as wire and bobbin. It can prevent damage or damage.

한편, 절연바스켓(40)은 결합부재(50)에 의해 제1지지패널(11)과 제2지지패널(12)에 각각 착탈가능하도록 결합될 수 있다.Meanwhile, the insulating basket 40 may be detachably coupled to the first support panel 11 and the second support panel 12 by the coupling member 50.

여기서, 결합부재(50)는 대락 "L"자형 단면을 가지며 절연바스켓(40)의 길이방향 단부와 결합되는 결합부(51)와, 상기 결합부(51)의 길이방향 단부의 하부에 결합된 고정부(52)를 포함할 수 있다.Here, the coupling member 50 has a large L-shaped cross section and is coupled to the coupling portion 51 and the longitudinal end of the insulating basket 40, coupled to the lower portion of the longitudinal end of the coupling portion 51 It may include a fixing portion 52.

여기서, 고정부(52)는 상술한 지지패널(10)의 내측면에 각각 소정의 볼트(미도시) 등에 의해 착탈가능하도록 체결될 수 있다.Here, the fixing unit 52 may be fastened to the inner surface of the support panel 10 described above so as to be detachable by a predetermined bolt or the like.

종래는 받침대 등이 구비되더라도, 챔버에 일체로 형성되거나 착탈가능하더라도 보빈 등의 간섭을 회피하면서 분리해내야해서 불편함이 있었으나, 상술한 바와 같이 지지패널에 결합됨으로써 단지 볼트의 조임과 풀림만으로도 착탈이 가능하여 절연바스켓(40)의 분리가 용이할 수 있다.Conventionally, even if a pedestal or the like is provided, it is inconvenient to remove the bobbin or the like even if it is integrally formed or detachable in the chamber, but it is inconvenient because it is coupled to the support panel as described above. This may facilitate the separation of the insulating basket 40.

안내플레이트(60)는 절연재질의 한 쌍으로 마련되어 상술한 측면패널(42)의 측단부(42b)에 각각 결합수단(53)을 통해 결합되며, 측단부(42b)와 결합되는 수직판(61)과 수직판(61)으로부터 상향 외측 즉, 절연바스켓(40)을 중심으로 상향 외측으로 경사지도록 절곡된 절곡판(62)으로 구성될 수 있다.The guide plate 60 is provided as a pair of insulating materials and is coupled to the side ends 42b of the side panels 42 through coupling means 53, respectively, and the vertical plate 61 is coupled to the side ends 42b. ) And a bending plate 62 bent upwardly outward from the vertical plate 61, that is, inclined upwardly outwardly about the insulating basket 40.

이때, 안내플레이트는 필요에 따라 다수 회 절곡형성될 수도 있으며, 본 실시예에서는 수직판에 대해 절곡판이 1회 절곡되어 형성된 것을 도시하고 있다.At this time, the guide plate may be formed bent a plurality of times as needed, in this embodiment is shown that the bending plate is formed by bending once with respect to the vertical plate.

또한, 수직판(61)에는 서로 마주보면서 결합되는 측단부(42b)에 형성된 슬러리 유출용 관통홀(42b')과 연통되는 연통홀(60a)이 형성될 수 있다.In addition, the vertical plate 61 may be formed with a communication hole 60a in communication with the slurry outflow through-hole 42b 'formed in the side end portion 42b coupled to face each other.

즉, 수직판(61)의 내벽을 따라 흘러내리는 슬러리는 슬러리 유출용 관통홀(42b') 및 연통홀(60a)을 통해 외측으로 유출될 수 있다.That is, the slurry flowing down the inner wall of the vertical plate 61 may flow out through the slurry outflow through-hole 42b 'and the communication hole 60a.

상기와 같이 형성됨으로써 잉곳 절단시 발생하는 파편 등을 안정적으로 하향으로 가이드할 수 있다.By forming as described above, it is possible to guide the debris generated when cutting the ingot stably downward.

지금부터는 상술한 와이어쏘 장치의 제1실시예의 작동에 대하여 설명한다.The operation of the first embodiment of the wire saw device described above will now be described.

도 4와 도 5는 본 발명의 제1실시예에 따른 와이어쏘 장치의 작동상태도이다. 도 4를 참조하면, 제1보빈(21) 및 제2보빈(22)의 외측에 와이어(30)를 권선하고, 잉곳(200)을 사전에 설정된 속도로 하향으로 이동시킨다. 이때, 와이어(30)에는 단선감지용 전류가 흐르도록 사전에 설정되어 있다.4 and 5 are operation state diagrams of the wire saw device according to the first embodiment of the present invention. Referring to FIG. 4, the wire 30 is wound around the first bobbin 21 and the second bobbin 22, and the ingot 200 is moved downward at a preset speed. At this time, the wire 30 is set in advance so that a current for detecting disconnection flows.

그리고, 도 5에서와 같이, 와이어(30)에 의해 잉곳(200)이 얇은 두께의 웨이퍼로 절단되는데, 이때 와이어(30)의 장력 불균일 또는 전체 장치의 진동 등에 부분적으로 절단되는 웨이퍼(200A)가 파손되면서 다른 웨이퍼들 사이에 끼워진 상태로 하향으로 미끄러지듯이 이동되게 된다.In addition, as shown in FIG. 5, the ingot 200 is cut into a thin wafer by the wire 30, in which case the wafer 200A is partially cut, such as tension unevenness of the wire 30 or vibration of the entire apparatus. As it is broken, it slides downward while being sandwiched between other wafers.

이때, 파손되는 웨이퍼(200A)는 안내플레이트(50)에 의해 절연바스켓(40) 방향으로 가이드되면서 절연바스켓(40)과 맞닿게 되는데, 절연바스켓(40)과 안내플레이트(50)가 절연재질이므로 챔버 전체에 전류가 통전되지 않아 단선으로 감지되는 것을 방지할 수 있다.At this time, the damaged wafer 200A is guided in the direction of the insulating basket 40 by the guide plate 50 to be in contact with the insulating basket 40. Since the insulating basket 40 and the guide plate 50 are insulating materials Since no current is supplied to the entire chamber, it can be prevented from being sensed as disconnection.

또한, 장치 관리자는 제1지지패널(11)에 형성된 관찰부(11a)를 통해 외부에서 절연바스켓(40)에 파손된 웨이퍼(200A)를 용이하게 발견할 수 있어 장치 전체를 일시적으로 중단시킨 후, 파손된 웨이퍼를 제거하고 장치를 재가동할 수 있다.In addition, the device manager can easily find the wafer 200A that is broken in the insulating basket 40 from the outside through the observation portion 11a formed on the first support panel 11 to temporarily stop the entire device. The broken wafer can be removed and the device restarted.

아울러, 절연바스켓(40)으로 낙하하여 안착된 미세한 파편들은 잉곳을 웨이퍼로 절단완료한 후 절연바스켓(40)을 분리하여 제거할 수 있다.In addition, the fine debris seated by dropping to the insulating basket 40 can be removed by separating the insulating basket 40 after the ingot is cut into a wafer.

상술한 바와 같이 본 발명에 따라 절연재질의 절연바스켓 및 안내플레이트를 구비하면, 잉곳이 부분적으로 파손시 외부에서 관찰이 용이하며, 부분적으로 파손되어 절연바스켓과 맞닿게 되는 웨이퍼에 의해 챔버 전체가 통전되어 단선으로 오인식하는 것을 방지할 수 있다.As described above, when the insulating basket and the guide plate of the insulating material are provided in accordance with the present invention, the entire chamber is energized by a wafer which is easily observed from the outside when the ingot is partially damaged and partially damaged to contact the insulating basket. This can prevent misinterpretation by disconnection.

본 발명의 권리범위는 상술한 실시예에 한정되는 것이 아니라 첨부된 특허청구범위 내에서 다양한 형태의 실시예로 구현될 수 있다. 특허청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 누구든지 변형 가능한 다양한 범위까지 본 발명의 청구범위 기재의 범위 내에 있는 것으로 본다.The scope of the present invention is not limited to the above-described embodiments but may be implemented in various forms of embodiments within the appended claims. Without departing from the gist of the invention claimed in the claims, it is intended that any person skilled in the art to which the present invention pertains falls within the scope of the claims described herein to various extents which can be modified.

와이어쏘 장치를 사용하여 잉곳 절단시 부분적으로 파손되어 출락하는 웨이퍼에 의해 와이어가 단선으로 인식되는 것을 방지하여 연속적으로 작업이 가능하게 할 수 있다.By using a wire saw device, it is possible to prevent the wires from being recognized as disconnected by the wafer that is partially broken and outgoing during ingot cutting, thereby enabling continuous operation.

Claims (10)

하향으로 이동하는 잉곳을 절단하는 와이어쏘 장치에 있어서,In the wire saw device for cutting the ingot moving downwards, 상호 이격배치되어 회전하는 복수의 보빈;A plurality of bobbins spaced apart from each other to rotate; 상기 복수의 보빈에 복수 회 왕복 권선되어 잉곳을 절단하는 와이어;A wire reciprocatingly wound around the plurality of bobbins a plurality of times to cut an ingot; 상기 잉곳의 하부이면서 상기 복수의 보빈의 이격공간에 배치되는 절연바스켓;An insulation basket disposed below the ingot and spaced apart from the plurality of bobbins; 상기 절연바스켓의 양측에 상기 보빈과 대향되도록 결합되는 안내플레이트;를 포함하는 것을 특징으로 하는 와이어쏘 장치.And a guide plate coupled to both sides of the insulating basket so as to face the bobbin. 제 1항에 있어서,The method of claim 1, 상기 보빈의 전단과 후단이 결합되는 한 쌍의 지지패널을 더 포함하는 것을 특징으로 하는 와이어쏘 장치.The wire saw device further comprises a pair of support panels coupled to the front and rear ends of the bobbin. 제 1항에 있어서,The method of claim 1, 상기 절연바스켓과 결합되며 상기 한 쌍의 지지패널에 각각 착탈가능하도록 결합되는 결합부재를 더 포함하는 것을 특징으로 하는 와이어쏘 장치.And a coupling member coupled to the insulating basket and detachably coupled to the pair of support panels, respectively. 제 3항에 있어서,The method of claim 3, wherein 상기 결합부재는 절연재질인 것을 특징으로 하는 와이어쏘 장치.The coupling member is a wire saw device, characterized in that the insulating material. 제 1항에 있어서,The method of claim 1, 상기 절연바스켓은 바닥패널과 상기 바닥패널의 가장자리에 결합되는 다수의 측면패널을 포함하여 내부공간을 형성하는 것을 특징으로 하는 와이어쏘 장치.The insulation basket includes a bottom panel and a plurality of side panels coupled to the edge of the bottom panel to form an inner space. 제 5항에 있어서,The method of claim 5, 상기 바닥패널은 중앙부의 양측으로부터 하향으로 경사지도록 형성된 경사부와, 상기 경사부의 말단에 연장형성되며 관통홀이 형성된 관통부를 포함하는 것을 특징으로 하는 와이어쏘 장치.The bottom panel is a wire saw device characterized in that it comprises an inclined portion formed to be inclined downward from both sides of the central portion, and a through portion formed in the end of the inclined portion and a through hole formed. 제 5항에 있어서,The method of claim 5, 상기 측면패널에는 슬러리 유출용 관통홀이 형성된 것을 특징으로 하는 와이어쏘 장치.Wire saw device, characterized in that the side panel is formed with a through hole for slurry outflow. 제 5항에 있어서,The method of claim 5, 상기 측면패널은 상기 바닥패널의 전방단부에 결합되는 전단부와, 상기 바닥패널의 길이방향 양측 단부를 따라 결합되는 측단부를 포함하며, 상기 전단부에는 파지가능한 파지부가 형성된 것을 특징으로 하는 와이어쏘 장치.The side panel includes a front end coupled to the front end of the bottom panel, and a side end coupled along both ends in the longitudinal direction of the bottom panel, the front end is a wire saw, characterized in that the gripping portion is formed Device. 제 1항에 있어서,The method of claim 1, 상기 안내플레이트는 잉곳 절단시 낙하하는 잉곳 파편을 가이드하도록 상기 절연바스켓을 중심으로 상향 외측으로 경사지도록 형성된 것을 특징으로 하는 와이어쏘 장치.The guide plate is a wire saw device, characterized in that formed to be inclined upwardly outwards around the insulating basket to guide the falling ingot fragments during ingot cutting. 제 1항에 있어서,The method of claim 1, 상기 안내플레이트는 절연재질인 것을 특징으로 하는 와이어쏘 장치.The guide plate is a wire saw device, characterized in that the insulating material.
PCT/KR2012/000567 2011-01-21 2012-01-20 Wire saw apparatus Ceased WO2012099444A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012800001111A CN103003040A (en) 2011-01-21 2012-01-20 Wire saw device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0006206 2011-01-21
KR1020110006206A KR101038182B1 (en) 2011-01-21 2011-01-21 Wire saw device

Publications (2)

Publication Number Publication Date
WO2012099444A2 true WO2012099444A2 (en) 2012-07-26
WO2012099444A3 WO2012099444A3 (en) 2012-12-13

Family

ID=44404837

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/000567 Ceased WO2012099444A2 (en) 2011-01-21 2012-01-20 Wire saw apparatus

Country Status (4)

Country Link
KR (1) KR101038182B1 (en)
CN (1) CN103003040A (en)
TW (1) TWI449612B (en)
WO (1) WO2012099444A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014174350A1 (en) * 2013-04-24 2014-10-30 Meyer Burger Ag Wire saw

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101185683B1 (en) 2011-02-23 2012-09-24 주식회사 엘지실트론 Sawing apparatus of single cystral the same
EP2711979A1 (en) * 2012-09-24 2014-03-26 Meyer Burger AG Wafer cutting system
KR101431814B1 (en) * 2013-05-06 2014-08-18 (주) 위솔루션 Cutting Device of LED Boards or LCD Glass or OLED Glass using Muti Wire Saw
CN107984024B (en) * 2016-10-26 2022-01-28 精密表面处理解决方案公司 Wire saw
KR101905671B1 (en) * 2016-11-15 2018-10-10 한국에너지기술연구원 A cleaning device for silicone wafer with excellent inhibiting breakage, and cleaning method using the same
CN106863630B (en) * 2017-01-22 2019-09-27 江阴市展照科技有限公司 A kind of silicon slice linear cutter
KR20180097043A (en) 2017-02-22 2018-08-30 한솔테크닉스(주) Apparatus and method for slicing ingot
CN113117297B (en) * 2021-05-21 2023-01-13 广东电网有限责任公司 Electric power cement pole climbing device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3106294B2 (en) * 1996-07-23 2000-11-06 株式会社東京精密 Wire saw wire disconnection detector
JP2000061799A (en) * 1998-08-17 2000-02-29 Tokyo Seimitsu Co Ltd End material preventive plate of wire saw
JP2000218493A (en) * 1999-01-28 2000-08-08 Tokyo Seimitsu Co Ltd Wire saw
EP1284847B1 (en) * 2000-05-31 2007-02-21 MEMC ELECTRONIC MATERIALS S.p.A. Wire saw and process for slicing multiple semiconductor ingots
JP2004114249A (en) * 2002-09-27 2004-04-15 Ishii Hyoki Corp Wire disconnection detector for wire saws
CN100503166C (en) * 2003-10-27 2009-06-24 三菱电机株式会社 Multi Wire Saw
EP1748873A1 (en) * 2004-03-30 2007-02-07 Solaicx, Inc. Method and apparatus for cutting ultra thin silicon wafers
EP1738886A1 (en) * 2005-06-27 2007-01-03 HCT Shaping Systems S.A. Method of detecting dysfunctions in a wire sawing device and device for carrying out said method
JP2007160431A (en) * 2005-12-12 2007-06-28 Takatori Corp Cutting method using wire saw and cut work receiving member of wire saw
JP5430294B2 (en) 2009-01-29 2014-02-26 京セラ株式会社 Substrate manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014174350A1 (en) * 2013-04-24 2014-10-30 Meyer Burger Ag Wire saw

Also Published As

Publication number Publication date
WO2012099444A3 (en) 2012-12-13
TW201238730A (en) 2012-10-01
CN103003040A (en) 2013-03-27
TWI449612B (en) 2014-08-21
KR101038182B1 (en) 2011-06-01

Similar Documents

Publication Publication Date Title
WO2012099444A2 (en) Wire saw apparatus
CN107335997B (en) Automatic screw and rubber ring assembling equipment
WO2016010392A1 (en) Cutting apparatus and cutting method
WO2018120244A1 (en) Sandblasting production line system for flexible printed circuit board and feeding device
JP6513886B2 (en) Automatic fiber strip system and method
WO2013115506A1 (en) Electrode plate stamping device for secondary battery
WO2022045828A1 (en) Electrode cutting apparatus including detached foreign substance removing unit
WO2013118981A1 (en) Pole plate cutter assembly for secondary batteries
WO2013183831A1 (en) Ultra-slim stone cutting machine
CN211746269U (en) Automatic threading machine for oyster attached base strings
CN114019608B (en) Wave-shifting optical fiber discharging mechanism capable of being automatically locked
WO2013137584A1 (en) Device and method for cleaning workpieces of mold
US20250167528A1 (en) Aluminum Foil Stripping Device and Method
EP2613919A2 (en) Apparatus for slicing ingot
EP3406365A1 (en) Machine to process section bars, in particular made of aluminium, light alloys, pvc or the like
CN218490858U (en) A extracting device that is used for carrier to get material fast
CN211670422U (en) Cycloidal cutting machine
KR101518669B1 (en) Apparatus and method for continuous winding amorphous material
CN211254442U (en) Setting machine
CN215696835U (en) Guide device for two slitting outlets in vertical rolling
WO2023014084A1 (en) Blind manufacturing apparatus
WO2017034326A1 (en) Tabbing apparatus of solar battery cell
CN214166914U (en) Wire harness traction equipment
CN216565877U (en) Wire arranging device for wiring of mechanical and electrical plant control cabinet
CN220456443U (en) Grabbing mechanism and automatic cutting machine

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201280000111.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12736139

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12736139

Country of ref document: EP

Kind code of ref document: A2