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WO2012091316A3 - Appareil de traitement au laser - Google Patents

Appareil de traitement au laser Download PDF

Info

Publication number
WO2012091316A3
WO2012091316A3 PCT/KR2011/009451 KR2011009451W WO2012091316A3 WO 2012091316 A3 WO2012091316 A3 WO 2012091316A3 KR 2011009451 W KR2011009451 W KR 2011009451W WO 2012091316 A3 WO2012091316 A3 WO 2012091316A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
processing apparatus
laser processing
optical unit
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/009451
Other languages
English (en)
Korean (ko)
Other versions
WO2012091316A2 (fr
Inventor
유병소
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QMC Co Ltd
Original Assignee
QMC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by QMC Co Ltd filed Critical QMC Co Ltd
Publication of WO2012091316A2 publication Critical patent/WO2012091316A2/fr
Publication of WO2012091316A3 publication Critical patent/WO2012091316A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne un appareil de traitement au laser comprenant : une source de faisceau laser permettant de produire un faisceau laser ; et une unité optique permettant d'introduire le faisceau laser à l'intérieur d'un objet. L'unité optique comprend : un module de mise en forme de faisceau conçu pour corriger l'angle de divergence du faisceau laser ; un réseau de diffraction destiné à diffracter le faisceau laser ; et une lentille de focalisation conçue pour former un point lumineux en focalisant le faisceau laser à l'intérieur de l'objet.
PCT/KR2011/009451 2010-12-28 2011-12-08 Appareil de traitement au laser Ceased WO2012091316A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100136368A KR101298019B1 (ko) 2010-12-28 2010-12-28 레이저 가공 장치
KR10-2010-0136368 2010-12-28

Publications (2)

Publication Number Publication Date
WO2012091316A2 WO2012091316A2 (fr) 2012-07-05
WO2012091316A3 true WO2012091316A3 (fr) 2012-09-07

Family

ID=46383620

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/009451 Ceased WO2012091316A2 (fr) 2010-12-28 2011-12-08 Appareil de traitement au laser

Country Status (3)

Country Link
KR (1) KR101298019B1 (fr)
TW (1) TWI466748B (fr)
WO (1) WO2012091316A2 (fr)

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WO2014079478A1 (fr) 2012-11-20 2014-05-30 Light In Light Srl Traitement par laser à grande vitesse de matériaux transparents
EP2754524B1 (fr) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Procédé et dispositif destinés au traitement basé sur laser de substrats plats, galette ou élément en verre, utilisant un faisceau laser en ligne
EP2781296B1 (fr) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Dispositif et procédé de découpe de contours à partir de substrats plats au moyen d'un laser
US9291825B2 (en) 2013-03-22 2016-03-22 Applied Materials Israel, Ltd. Calibratable beam shaping system and method
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
CN103846547A (zh) * 2014-02-12 2014-06-11 苏州兰叶光电科技有限公司 多光束整形激光加工系统
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
WO2016010949A1 (fr) 2014-07-14 2016-01-21 Corning Incorporated Procédé et système pour former des perforations
LT3169477T (lt) 2014-07-14 2020-05-25 Corning Incorporated Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
WO2016010943A2 (fr) 2014-07-14 2016-01-21 Corning Incorporated Procédé et système permettant d'arrêter la propagation d'une fissure
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
DE102014213775B4 (de) * 2014-07-15 2018-02-15 Innolas Solutions Gmbh Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
CN104148802B (zh) * 2014-08-04 2017-01-25 北京万恒镭特机电设备有限公司 光束形成装置及其形成方法
TWI576186B (zh) * 2014-08-20 2017-04-01 Lever focusing module for laser processing
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
JP2018507154A (ja) 2015-01-12 2018-03-15 コーニング インコーポレイテッド マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
CN107666983B (zh) 2015-03-27 2020-10-02 康宁股份有限公司 可透气窗及其制造方法
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
KR101789185B1 (ko) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
SG11201809797PA (en) 2016-05-06 2018-12-28 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
JP6632467B2 (ja) * 2016-05-18 2020-01-22 株式会社ディスコ レーザー加工装置及びレーザー加工方法
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
CN106425112B (zh) * 2016-11-02 2018-11-06 国神光电科技（上海）有限公司 一种激光划片的方法及系统
KR102582652B1 (ko) * 2016-12-21 2023-09-25 삼성디스플레이 주식회사 레이저 결정화 장치
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
KR102636043B1 (ko) 2019-01-21 2024-02-14 삼성디스플레이 주식회사 레이저 에칭 장치와 그것을 이용한 레이저 에칭 방법
JP7499628B2 (ja) * 2020-07-07 2024-06-14 住友重機械工業株式会社 ビーム整形光学装置及び真円度調整方法
CN112914433A (zh) * 2021-04-23 2021-06-08 常州纵慧芯光半导体科技有限公司 一种激光设备及扫地机器人
CN113459678B (zh) * 2021-07-28 2022-06-07 杭州爱新凯科技有限公司 一种激光3d打印机边缘光斑面积补偿方法
CN114152194B (zh) * 2021-11-16 2022-10-04 华中科技大学 一种基于反射光栅的微位移测量装置及方法
CN114309923A (zh) * 2021-12-17 2022-04-12 深圳市大族数控科技股份有限公司 光束间距调节模组及加工设备
KR102654348B1 (ko) * 2022-04-07 2024-04-04 (주)이오테크닉스 홈 형성 장치 및 홈 형성 방법
CN119602074A (zh) * 2023-09-01 2025-03-11 深圳市绎立锐光科技开发有限公司 激光光源及加工装置

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KR20040110434A (ko) * 2003-06-19 2004-12-31 엘지전자 주식회사 블레이즈 회절격자를 갖는 광 픽업 장치
JP2005014050A (ja) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd レーザ加工装置
KR100984726B1 (ko) * 2010-04-28 2010-10-01 유병소 레이저를 이용한 대상물 가공 방법, 대상물 가공 장치, 및 대상물 가공 시스템

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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2002113711A (ja) * 2000-10-11 2002-04-16 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びそれに用いるレーザ加工装置
KR20040110434A (ko) * 2003-06-19 2004-12-31 엘지전자 주식회사 블레이즈 회절격자를 갖는 광 픽업 장치
JP2005014050A (ja) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd レーザ加工装置
KR100984726B1 (ko) * 2010-04-28 2010-10-01 유병소 레이저를 이용한 대상물 가공 방법, 대상물 가공 장치, 및 대상물 가공 시스템

Also Published As

Publication number Publication date
KR20120074508A (ko) 2012-07-06
TW201228762A (en) 2012-07-16
KR101298019B1 (ko) 2013-08-26
WO2012091316A2 (fr) 2012-07-05
TWI466748B (zh) 2015-01-01

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