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WO2012082702A3 - Chemical mechanical planarization (cmp) pad conditioner and method of making - Google Patents

Chemical mechanical planarization (cmp) pad conditioner and method of making Download PDF

Info

Publication number
WO2012082702A3
WO2012082702A3 PCT/US2011/064565 US2011064565W WO2012082702A3 WO 2012082702 A3 WO2012082702 A3 WO 2012082702A3 US 2011064565 W US2011064565 W US 2011064565W WO 2012082702 A3 WO2012082702 A3 WO 2012082702A3
Authority
WO
WIPO (PCT)
Prior art keywords
cmp
chemical mechanical
mechanical planarization
pad conditioner
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/064565
Other languages
French (fr)
Other versions
WO2012082702A2 (en
Inventor
Jianhui Wu
Eric M. Schulz
Srinivasan Ramanath
Arup K. Khaund
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Abrasifs SA
Saint Gobain Abrasives Inc
Original Assignee
Saint Gobain Abrasifs SA
Saint Gobain Abrasives Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Abrasifs SA, Saint Gobain Abrasives Inc filed Critical Saint Gobain Abrasifs SA
Priority to JP2013543411A priority Critical patent/JP2013544664A/en
Priority to SG2013045018A priority patent/SG191108A1/en
Priority to CN2011800629179A priority patent/CN103299402A/en
Priority to EP11849399.8A priority patent/EP2652773A2/en
Priority to KR1020137017391A priority patent/KR20130088891A/en
Publication of WO2012082702A2 publication Critical patent/WO2012082702A2/en
Publication of WO2012082702A3 publication Critical patent/WO2012082702A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate.
PCT/US2011/064565 2010-12-13 2011-12-13 Chemical mechanical planarization (cmp) pad conditioner and method of making Ceased WO2012082702A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013543411A JP2013544664A (en) 2010-12-13 2011-12-13 Chemical mechanical planarization (CMP) pad conditioner and method of forming the same
SG2013045018A SG191108A1 (en) 2010-12-13 2011-12-13 Chemical mechanical planarization (cmp) pad conditioner and method of making
CN2011800629179A CN103299402A (en) 2010-12-13 2011-12-13 Chemical Mechanical Planarization (CMP) Polishing Pad Dresser and Method of Manufacturing
EP11849399.8A EP2652773A2 (en) 2010-12-13 2011-12-13 Chemical mechanical planarization (cmp) pad conditioner and method of making
KR1020137017391A KR20130088891A (en) 2010-12-13 2011-12-13 Chemical mechanical planarization (cmp) pad conditioner and method of making

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42256310P 2010-12-13 2010-12-13
US61/422,563 2010-12-13

Publications (2)

Publication Number Publication Date
WO2012082702A2 WO2012082702A2 (en) 2012-06-21
WO2012082702A3 true WO2012082702A3 (en) 2013-01-24

Family

ID=46199840

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/064565 Ceased WO2012082702A2 (en) 2010-12-13 2011-12-13 Chemical mechanical planarization (cmp) pad conditioner and method of making

Country Status (8)

Country Link
US (1) US20120149287A1 (en)
EP (1) EP2652773A2 (en)
JP (1) JP2013544664A (en)
KR (1) KR20130088891A (en)
CN (1) CN103299402A (en)
SG (1) SG191108A1 (en)
TW (1) TW201246342A (en)
WO (1) WO2012082702A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG193340A1 (en) * 2011-03-07 2013-10-30 Entegris Inc Chemical mechanical planarization pad conditioner
EP2835220B1 (en) * 2013-08-07 2019-09-11 Reishauer AG Trimming tool, and method for manufacturing the same
JP6010511B2 (en) * 2013-08-22 2016-10-19 株式会社荏原製作所 Method for measuring surface roughness of polishing pad
CN104517018B (en) * 2013-09-30 2017-07-14 无锡华润上华科技有限公司 New product grinds method for computing data in a kind of CMP
US9144883B2 (en) * 2014-02-12 2015-09-29 Taiwan Semiconductor Manufacturing Co., Ltd Abrasive article, conditioning disk and method for forming abrasive article
TWI621503B (en) * 2017-05-12 2018-04-21 Kinik Company Ltd. Chemical mechanical abrasive polishing pad conditioner and manufacturing method thereof
US11213929B2 (en) * 2018-07-23 2022-01-04 Saint-Gobain Abrassives, Inc. Abrasive article and method for forming
SG11202111151XA (en) * 2019-04-09 2021-11-29 Entegris Inc Segment designs for discs
KR102268582B1 (en) * 2019-07-15 2021-06-24 신한다이아몬드공업 주식회사 CMP MANUFACTURING METHOD AND CMP PAD Conditioner USING THE SAME
CN114227557A (en) * 2021-12-24 2022-03-25 西安奕斯伟材料科技有限公司 Trimming disc, preparation method thereof and chemical mechanical polishing equipment
CN116728293A (en) * 2023-06-27 2023-09-12 宁波晶钻科技股份有限公司 A kind of CMP dresser manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020036138A (en) * 2000-11-08 2002-05-16 추후제출 A diamond grid cmp pad dresser
US20050095959A1 (en) * 1999-11-22 2005-05-05 Chien-Min Sung Contoured CMP pad dresser and associated methods
US20050276979A1 (en) * 2003-07-25 2005-12-15 Slutz David E CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US20090224370A1 (en) * 2008-03-10 2009-09-10 Slutz David E Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US7124753B2 (en) * 1997-04-04 2006-10-24 Chien-Min Sung Brazed diamond tools and methods for making the same
JP2002331460A (en) * 2001-05-09 2002-11-19 Mitsubishi Materials Corp Electroplated whetstone
JP2003039329A (en) * 2001-08-02 2003-02-13 Mitsubishi Materials Corp Single layer whetstone and method of manufacturing the same
JP4084944B2 (en) * 2002-01-31 2008-04-30 旭ダイヤモンド工業株式会社 Conditioner for CMP
JP2006305659A (en) * 2005-04-27 2006-11-09 Nippon Steel Corp Polishing cloth dresser
JP4791121B2 (en) * 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 Polishing cloth dresser
BRPI0814936A2 (en) * 2007-08-23 2015-02-03 Saint Gobain Abrasives Inc OPTIMIZED CONCEPTION OF CMP CONDITIONER FOR NEXT GENERATION CX oxide / metal
JP5255860B2 (en) * 2008-02-20 2013-08-07 新日鉄住金マテリアルズ株式会社 Polishing cloth dresser
US20100261419A1 (en) * 2009-04-10 2010-10-14 Chien-Min Sung Superabrasive Tool Having Surface Modified Superabrasive Particles and Associated Methods

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050095959A1 (en) * 1999-11-22 2005-05-05 Chien-Min Sung Contoured CMP pad dresser and associated methods
KR20020036138A (en) * 2000-11-08 2002-05-16 추후제출 A diamond grid cmp pad dresser
US20050276979A1 (en) * 2003-07-25 2005-12-15 Slutz David E CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US20090224370A1 (en) * 2008-03-10 2009-09-10 Slutz David E Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing

Also Published As

Publication number Publication date
JP2013544664A (en) 2013-12-19
KR20130088891A (en) 2013-08-08
WO2012082702A2 (en) 2012-06-21
TW201246342A (en) 2012-11-16
SG191108A1 (en) 2013-07-31
CN103299402A (en) 2013-09-11
US20120149287A1 (en) 2012-06-14
EP2652773A2 (en) 2013-10-23

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