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WO2012058222A2 - Structure d'émetteur à couche destiné à résister à la fissuration - Google Patents

Structure d'émetteur à couche destiné à résister à la fissuration Download PDF

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Publication number
WO2012058222A2
WO2012058222A2 PCT/US2011/057707 US2011057707W WO2012058222A2 WO 2012058222 A2 WO2012058222 A2 WO 2012058222A2 US 2011057707 W US2011057707 W US 2011057707W WO 2012058222 A2 WO2012058222 A2 WO 2012058222A2
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Prior art keywords
electrode
conductive layer
core material
solid solution
solute
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PCT/US2011/057707
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WO2012058222A3 (fr
Inventor
Nels Jewell-Larsen
Guilian Gao
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Adeia Semiconductor Solutions LLC
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Tessera LLC
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Priority to CN2011800634374A priority Critical patent/CN103459042A/zh
Priority to EP11781712.2A priority patent/EP2632601A2/fr
Publication of WO2012058222A2 publication Critical patent/WO2012058222A2/fr
Publication of WO2012058222A3 publication Critical patent/WO2012058222A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00—Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/34—Constructional details or accessories or operation thereof
    • B03C3/40—Electrode constructions
    • B03C3/60—Use of special materials other than liquids

Definitions

  • This application relates generally to electrodes in electrohydrodynamic or electrostatic devices such as electrohydrodynamic fluid accelerators and electrostatic precipitators, and particularly to classes of materials that can be used to form such electrodes.
  • an ion flow air mover device such as an electrohydrodynamic (EHD) device or electro-fluid dynamic (EFD) device, may result in improved cooling efficiency, reduced vibrations, power consumption, electronic device temperatures, and noise generation. This may reduce overall device lifetime costs, device size or volume, and may improve electronic device performance or user experience.
  • EHD electrohydrodynamic
  • EFD electro-fluid dynamic
  • EHD technology uses ion flow principles to move fluids (e.g., air molecules).
  • fluids e.g., air molecules.
  • Basic principles of EHD fluid flow are reasonably well understood by persons of skill in the art. Accordingly, a brief illustration of ion flow using corona discharge principles in a simple two electrode system sets the stage for the more detailed description that follows.
  • EHD principles include applying a high intensity electric field between a first electrode 10 (often termed the “corona electrode,” the “corona discharge electrode,” the “emitter electrode” or just the “emitter”) and a second electrode 12.
  • Fluid molecules such as surrounding air molecules, near the emitter discharge region 11 become ionized and form a stream 14 of ions 16 that accelerate toward second electrode 12, colliding with neutral fluid molecules 17.
  • momentum is imparted from the stream 14 of ions 16 to the neutral fluid molecules 17, inducing a corresponding movement of fluid molecules 17 in a desired fluid flow direction, denoted by arrow 13, toward second electrode 12.
  • Second electrode 12 may be variously referred to as the "accelerating,” “attracting,” “target” or “collector” electrode. While stream 14 of ions 16 is attracted to, and generally neutralized by, second electrode 12, neutral fluid molecules 17 continue past second electrode 12 at a certain velocity.
  • the movement of fluid produced by EHD principles has been variously referred to as “electric,” “corona” or “ionic” wind and has been defined as the movement of gas induced by the movement of ions from the vicinity of a high voltage discharge electrode 10.
  • Ozone (0 3 ) while naturally occurring, can also be produced during operation of various electronics devices, including EHD devices, photocopiers, laser printers and electrostatic air cleaners, and by certain kinds of electric motors and generators, etc. Elevated ozone levels have been associated with respiratory irritation and certain health issues. Therefore, ozone emission can be subject to regulatory limits such as those set by the Underwriters Laboratories (UL) or the Environmental Protection Agency (EPA). Accordingly, techniques to reduce ozone concentrations have been developed and deployed to catalytically or reactively break down ozone (O3) into the more stable diatomic molecular form (0 2 ) of oxygen.
  • UL Underwriters Laboratories
  • EPA Environmental Protection Agency
  • corona erosion refers to various adverse effects from a plasma discharge environment including enhanced oxidation, and etching or sputter of emitter surfaces. In general, corona erosion can result from any plasma or ion discharge including, silent discharge, AC discharge, dielectric barrier discharge (“DBD”) or the like.
  • the emitter and collector of particular metals.
  • the emitter may be made of tungsten and the collector made of aluminum to provide desired conductivity, hardness and strength.
  • pure metals are often deficient in some regard with respect to other desirable materials characteristics.
  • One proposed solution is to use an alloy in place of a pure metal. While various metals or alloys may be selected to address a particular one of these performance parameters, a combination of two materials having known performance characteristics often yields an alloy or compound exhibiting significantly different characteristics.
  • a collector may be made of an aluminum alloy to increase its hardness.
  • the emitter electrode may be made of stainless steel, so that the three elements of iron, nickel and chromium are present and exposed to the atmosphere in which the EHD device operates. While each of the elements present in the alloy will contribute in some way to the overall characteristics required, alloys of such metals do not always provide the same desirable characteristics as the pure metals would alone and such compound characteristics are not always readily predictable.
  • a multi-layered electrode can benefit from prolonged performance through use of a barrier material between an electrode core material and an overlying conductive layer.
  • the conductive layer can be compromised, e.g., via microcracking or through pin-hole formation, which could otherwise expose the core material to the adverse effects of the corona environment.
  • the barrier material is robust to the effects of the corona environment and thus protects the core material and extends the performance life of the electrode.
  • alloys comprising solid-solutions may be employed as a conductive layer in emitter and collector electrodes or other electrodes or components of EHD devices to provide a range of combined, yet substantially independent, desirable materials characteristics.
  • the solid solution includes a solvent metal and one or more solute material(s).
  • the solute materials can include metals, semi-metals, non-metals and compounds.
  • the solute material forms an interstitial or substitutional solid solution in the solvent metal.
  • electrohydrodynamic (“EHD") device emitter and collector electrodes may be made of solid solution alloys exhibiting substantially independent material properties corresponding to the various selected components of the solid solution alloy. To provide desirable combinations of characteristics in varied applications, these components may be further formed of multiple materials selected to exhibit a combination of materials performance characteristics.
  • Advantageous emitter and collector electrode characteristics can include, e.g. :
  • the performance characteristics of the alloy may be determined by the independent performance characteristics of the solvent metal and solute material.
  • an alloy of nickel is infused with carbon (e.g., at 1 atomic weight percent) resulting in carbon atoms in solid solution in a matrix of nickel atoms.
  • carbon e.g., at 1 atomic weight percent
  • both nickel and carbon are present at the surface of the alloy and each contributes respective independent properties and characteristics to the combined material performance characteristics.
  • cementite or Fe 3 C which is a conventional intermetallic compound, exhibits very different properties from iron and carbon separately.
  • an emitter electrode material includes palladium solvent metal and a silver solute material.
  • Palladium exhibits many desirable characteristics such as high strength and conductivity, while silver is an excellent catalyst for ozone.
  • some palladium atoms are displaced by silver at the surface of the electrode, and, in some cases through at least a substantial portion of the bulk of the electrode.
  • the materials characteristics of the electrode are substantially similar to those of pure palladium, with the addition of an ozone reducing catalytic effect provided by sufficient concentration of silver atoms at the electrode surface.
  • Silver (Ag) is an excellent candidate for imparting ozone reduction characteristics to an emitter electrode, e.g., a corona emitter wire. Silver, however, does not generally exhibit long life in the emitter wire corona environment. It has been discovered that an AgPd solid solution for the outer emitter electrode coating maintains much of the Ag ozone benefit while at the same time increasing the emitter life over pure Ag. However, the difference in the size of the Pd and Ag atoms can generate some degree of stress in such a solid solution layer due to the strain on the lattice. It has been found that these stresses within the AgPd solid solution layer can result in micro-cracking of the surface in some cases, which can accelerate electrode deterioration and electrode failure. The micro-cracks in the solid solution layer expose the underlying core material of the emitter electrode which can be more susceptible to corona plasma induced degradation.
  • a layered electrode structure can mitigate cracking or at least propagation of cracks and corona erosion beyond the outer AgPd layer under corona plasma conditions. It has been further discovered that the electrode may be made robust to micro-cracking of the surface by creation of an underlying intermediate layer(s) that is less susceptible to deterioration in a corona environment thereby mitigating exposure of the electrode core material to the plasma discharge environment following compromise of the outer layer and enabling the electrode to maintain mechanical and electrical integrity. For example, an ozone reducing material or other exposed material may be exhausted without compromising the functionality of the underlying emitter electrode.
  • a multi-layered structure is formed over the electrode core material.
  • the sublayers prevent formation of micro-cracks in the outer layers from exposing underlying electrode core materials which deteriorate more quickly in the corona plasma environment.
  • a particular implementation includes a multi-layered structure including, starting from the outermost layer, an ozone reducing material that may be prone to cracking or wear, such as PdAg.
  • a diffusion barrier material limits formation of the solid solution to the outermost layer.
  • An adhesion layer such as Ni binds the diffusion barrier material to an underlying corona plasma resistant barrier material, such as Pd, or a platinum group metal, e.g.
  • rhodium, iridium, platinum and palladium can include gold, titanium-tungsten alloy, chromium, rhodium, iridium, platinum and palladium.
  • the corona plasma resistant barrier material is in turn bound by a second adhesion material, such as Ni or Au, to a mechanically robust, high-strength electrode core material such as titanium, steel, tungsten, tungsten alloy, tantalum, molybdenum or nickel.
  • a method of producing a layered electrode system includes depositing materials on an electrode core, e.g., a tungsten core, in the following order: Ni (adhesion layer), Pd, Ni (diffusion barrier), Pd (solvent metal), and Ag (solute material).
  • Ni adheresion layer
  • Pd nickel
  • Ni diffusion barrier
  • Pd solvent metal
  • Ag solute material
  • Micro-cracking can be mitigated, in some implementations, by
  • a barrier layer may still be advantageous to protect the electrode core, in some cases.
  • the solvent metal has a lattice structure and the first solute material has a first molecular structure tending to stress the lattice structure of the solvent metal when in solid solution.
  • the second solute material has a second molecular structure tending to mitigate the stress on the lattice structure of the solvent metal from the first solute material when in solid solution together with the first solute material in the solvent metal.
  • the solvent metal includes palladium
  • the first solute material includes silver
  • the second solute material includes at least one of nickel, manganese and copper.
  • titanium or tantalum serves as the solvent metal. Both of these metals exhibit high strength and conductance, yet typically oxidize in the type of plasma environment commonly found in an EHD device. Gold, however, resists tarnishing and oxidation and is soluble in both titanium and tantalum. A gold- enriched solid solution electrode surface is thus more resistant to oxidation than either of the pure solvent metals, improving at least that characteristic without significantly impacting other desirable solvent metal properties like tensile strength or electrical conductivity.
  • the longevity of an EHD device may be improved if dust or other detrimental materials do not accumulate on the emitter and collector electrode surfaces.
  • Different pure metals suitable for use as emitter or collector electrodes generally exhibit similar relatively high friction coefficients.
  • non-metal materials such as carbon graphite are known to have relatively low friction coefficients.
  • some metals, notably palladium can absorb nearly up to about 2 wt% carbon in interstitial solid solution.
  • An interstitial solid solution of graphite in palladium provides the characteristics of palladium, with the additional low friction coefficient characteristic of graphite.
  • a solid solution including graphite can provide a low coefficient of friction and/or low surface adhesion to an electrode surface.
  • the solute material atoms fit inside the empty volume or "interstices" of the solvent metal matrix.
  • the solute material atoms displace some of the solvent metal atoms in the solvent metal matrix.
  • one or more compounds or alloys may serve as the solute material in solid solution with the solvent metal.
  • a solid solution can include molybdenum as the solvent metal modified by the addition of a nickel molybdenum compound as the solute material.
  • the materials characteristics are those of molybdenum and the compound MoNi.
  • a single solvent metal may accommodate more than one solute material, each added to confer different, substantially independent characteristics.
  • a palladium solvent metal may receive both silver and manganese independently as solute materials.
  • one aspect of the invention features a multi- layered electrode for use in an electrohydrodynamic device.
  • the electrode includes an electrode core material and a conductive layer about the core material, the conductive layer being susceptible to adverse effects from a plasma discharge environment, e.g. , following micro-crack formation, pinhole formation, defect formation, corona erosion or consumption of a portion of the conductive layer.
  • a barrier material is disposed between the electrode core material and the conductive layer.
  • the barrier material being substantially robust to adverse effects from exposure to a plasma discharge environment following compromise of the conductive layer, e.g., due to micro-cracking, pin hole formation, defect formation or corona erosion of the conductive layer.
  • the conductive layer is a solid solution and includes a solvent metal and at least one solute material.
  • the barrier material includes a diffusion barrier material selected to bound diffusion of the solute material within the solvent metal.
  • an adhesion promoting layer is disposed between the barrier material and at least one of the electrode core material and the conductive layer.
  • At least one of the barrier material and the adhesion promoting layer includes at least one of nickel, gold, titanium-tungsten alloy and chromium.
  • At least one of the barrier material and the adhesion promoting material further includes multiple distinct layers.
  • the multiple layers of the at least one of the barrier material and the adhesion promoting material include nickel, rhodium, iridium, platinum and palladium.
  • the conductive layer includes a solid solution in which a solvent metal includes palladium and a first solute material includes silver.
  • the conductive layer includes an ozone reducing material.
  • the electrode core material includes at least one of tungsten, tungsten alloy, tungsten rhenium alloy, titanium, steel, tantalum, molybdenum and nickel.
  • the conductive layer is a solid solution formed by heat treating distinct solvent metal and solute material depositions.
  • the barrier layer is selected to resist corona erosion following consumption of a portion of the conductive layer.
  • one aspect of the invention features an electrohydrodynamic device including one or more collector electrodes; and a layered emitter electrode in spaced relation to the one or more collector electrodes.
  • the layered emitter electrode and one or more collector electrodes are energizable to motivate fluid flow along a flow path.
  • the layered emitter electrodes include: an electrode core material, a conductive layer about the core material, the conductive layer being susceptible to adverse effects from a plasma discharge environment, e.g. , micro-crack propagation, pinhole formation, defect formation and corona erosion.
  • a barrier material is provided between the electrode core material and the conductive layer. The barrier material being substantially robust to adverse effects from exposure to a plasma discharge environment following micro-cracking, pinhole formation, defect formation, corona erosion or consumption of the conductive layer.
  • the conductive layer includes a solid solution of a solvent metal and a solute material, the solute material exhibiting one or more of ozone reactivity, resistance to oxidation, resistance to corona erosion, low coefficient of friction, and low surface adhesion.
  • the conductive layer includes palladium and nickel
  • the layered electrode further includes an adhesion promoting layer includes nickel between the electrode core material and the conductive layer.
  • one aspect of the invention features an apparatus including an enclosure and a thermal management assembly for use in convection cooling of one or more devices within the enclosure.
  • the thermal management assembly defines a flow path for conveyance of air between portions of the enclosure over heat transfer surfaces positioned along the flow path to dissipate heat generated by the one or more devices.
  • the thermal management assembly includes an electrohydrodynamic (EHD) fluid accelerator including one or more collector electrodes and a layered emitter electrode in spaced relation to the one or more collector electrodes.
  • the layered emitter electrode and one or more collector electrodes are energizable to motivate fluid flow along a flow path.
  • the layered emitter electrode includes: an electrode core material, a conductive layer about the core material, the conductive layer being susceptible to adverse effects from a plasma discharge environment, e.g., micro-crack propagation, pin hole formation, defect formation or corona erosion.
  • a barrier material is provided between the electrode core material and the conductive layer. The barrier material being substantially robust to adverse effects from exposure to a plasma discharge environment following compromise of the conductive layer, e.g., due to micro-crack propagation, pin hole formation, defect formation, corona erosion or consumption of a portion of the conductive layer.
  • the one or more devices includes one of a computing device, laptop computer, tablet computer, smart phone, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.
  • the solute material is configured to reduce ozone.
  • the first solute material is an ozone reducing material, e.g., catalyst, selected from a group that includes: manganese dioxide (Mn0 2 ); silver (Ag); silver oxide (Ag 2 0); and an oxide of copper (CuO).
  • an electrohydrodynamic fluid accelerator includes an emitter electrode and/or at least one collector electrode including a solid solution and energizable to generate ions and to thereby motivate fluid flow along a flow path.
  • the collector electrode is coupled into a heat transfer pathway to dissipate heat into the fluid flow.
  • the emitter and/or collector electrodes exhibit performance characteristics of both the solvent metal and solute material(s) of the solid solution.
  • a method of making a product includes providing an electrode core and providing a solvent metal and solute material to form a solid solution on the electrode core material.
  • the solvent metal and solute material provide respective first and second performance characteristics.
  • forming the solid solution component includes one of dip coating, spray coating or electroplating an underlying structure with the solid solution. In some applications, forming the solid solution component includes one of electroplating, anodizing or alodizing an underlying structure. In some cases, heat treatment of separate solvent and solute materials deposited by any of the above methods can be used to form the solid solution.
  • one aspect of the invention features a method of forming an electrode.
  • the method includes: providing an electrode core material and providing a conductive layer over the electrode core material, the conductive layer being susceptible to at least one of micro-cracking pinhole formation, defect formation and corona erosion.
  • the method further includes providing a barrier material between the electrode core material and the conductive layer to substantially mitigate exposure of the electrode core material due to the at least one of micro- cracking pin hole formation, defect formation and corona erosion of the conductive layer.
  • the method includes providing an adhesion promoting material between the barrier material and at least one of the electrode core material and the conductive layer.
  • At least one of the adhesion promoting material and the barrier material includes nickel.
  • providing the conductive layer includes heat treating silver and palladium deposits such that the silver diffuses into the palladium but not into the barrier material.
  • the method further includes providing a Pt group metal layer between the electrode core material and the conductive layer.
  • the method further includes positioning heat transfer surfaces downstream of, and proximate to, the collector electrode; and fixing an emitter electrode proximate to the collector electrode that, when energized, generates ions and thereby motivates fluid flow over the heat transfer surfaces.
  • the emitter electrode, collector electrode and heat transfer surfaces are so positioned and fixed to constitute a thermal management assembly.
  • the method includes introducing the thermal management assembly into an electronic device and thermally coupling a heat dissipating device thereof to the heat transfer surfaces.
  • electrohydrodynamic fluid accelerator devices also referred to as “EHD devices,” “EHD fluid accelerators,” and the like.
  • EHD devices electrohydrodynamic fluid accelerator devices
  • Such devices are suitable for use as a component in a thermal management solution to dissipate heat generated by an electronic circuit amongst other things.
  • EHD device configurations in which a corona discharge at or proximate to an emitter electrode operates to generate ions that are accelerated in the presence of electrical fields, thereby motivating fluid flow.
  • corona discharge-type devices provide a useful descriptive context, it will be understood (based on the present description) that other ion generation techniques may also be employed.
  • other ion generation techniques may also be employed.
  • other ion generation techniques may also be employed.
  • in some implementations are described relative to particular EHD device configurations in which a corona discharge at or proximate to an emitter electrode operates to generate ions that are accelerated in the presence of electrical fields, thereby motivating fluid flow.
  • techniques such as silent discharge, AC discharge, dielectric barrier discharge (“DBD”) or the like may be used to generate ions that are in turn accelerated in the presence of electrical fields and to motivate fluid flow.
  • DBD dielectric barrier discharge
  • the emitter electrode and the collector electrode(s) together at least partially define an electrohydrodynamic fluid accelerator.
  • emitter electrode and the collector electrode(s) can be positioned relative to one another such that, when energized, ions are generated therebetween and fluid flow is thereby motivated along a fluid flow path.
  • the electrohydrodynamic fluid accelerator includes the emitter electrode and is energizable to motivate fluid flow along a fluid flow path, and the collector electrode surfaces are disposed upstream of the electrohydrodynamic fluid accelerator along the fluid flow path and are operable as part of an electrostatic precipitator.
  • a multi-layered electrode including an intermediate barrier layer robust to corona erosion is energizable to contribute to flow of ion current in one of an electrohydrodynamic fluid accelerator and an electrostatic precipitator.
  • both the emitter electrode and the collector electrode(s) are operable as part of an electrohydrodynamic fluid accelerator.
  • the emitter electrode and the collector electrode(s) are operable as part of an electrostatic precipitator.
  • at least one additional electrode surface is disposed either upstream or downstream of the
  • electrohydrodynamic fluid accelerator or electrostatic precipitator along the fluid flow path.
  • the EHD device is part of a thermal
  • the thermal management assembly for use in convective cooling of one or more devices within an enclosure.
  • the thermal management assembly defines a flow path for conveyance of air between portions of the enclosure over heat transfer surfaces positioned along the flow path to dissipate heat generated by the one or more devices.
  • the thermal management assembly includes an electrohydrodynamic (EHD) fluid accelerator including emitter and collector electrodes energizable to motivate fluid flow along the flow path.
  • EHD electrohydrodynamic
  • the one or more devices includes one of a computing device, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.
  • an EHD device for thermal management in such devices includes, e.g., substantially silent operation, reduced power consumption, reduced vibration, reduced thermal solution footprint and volume, and form factor flexibility, e.g., capability to utilize space around other electronics.
  • Figure 1 is a depiction of certain basic principles of electrohydrodynamic (EHD) fluid flow.
  • Figure 2 depicts a cross-sectional view of a multi-layered electrode including an electrode core, a barrier material and a conductive layer about the barrier material.
  • Figure 3 depicts a solid solution formed of a solvent metal and two solute materials.
  • Figure 4 depicts an interstitial solid solution matrix structure.
  • Figure 5 depicts a substitutional solid solution matrix structure.
  • Figure 6 depicts a block diagram of a method of forming a multi-layered electrode including a solid solution layer.
  • Figure 7 depicts a multi-layered electrode structure providing robustness against electrode erosion following surface micro-cracking.
  • Figure 8 depicts a block diagram of a method of forming a multi-layered electrode structure.
  • Figure 9 depicts a schematic block diagram illustrating one
  • Figure 10 is a rear view of a display device including an EHD device in which a multi-layered electrode may operate to motivate airflow along a localized flow path.
  • Figures 1 la-b depict top views of tablet or handheld computing devices including an EHD in which a multi-layered electrode may operate to motivate airflow.
  • thermal management systems described herein employ EHD devices to motivate flow of a fluid, typically air, based on acceleration of ions generated as a result of corona discharge.
  • Other implementations may employ other ion generation and motivation techniques and will nonetheless be understood in the descriptive context provided herein.
  • techniques such as silent discharge, AC discharge, dielectric barrier discharge (DBD) or the like may be used to generate ions that are in turn accelerated in the presence of electrical fields to motivate fluid flow.
  • heat transfer paths are provided to transfer heat from where it is generated or dissipated to a location(s) within an enclosure where air flow motivated by an EHD device(s) flows over primary heat transfer surfaces.
  • heat generated by various system electronics e.g., microprocessors, graphics units, etc.
  • other system components e.g., light sources, power units, etc.
  • an electrode 200 includes an electrode core 202 and a conductive layer 204 about core 202.
  • a barrier material 203 is interposed between conductive layer 204 and core 202.
  • Barrier material 203 is robust to corona erosion and other adverse effects of exposure to a corona discharge environment following compromise of conductive layer 204, e.g., due to micro-cracking, pin hole formation, or corona erosion.
  • conductive layer 204 comprises a solid solution including a solvent metal 206 and a solute material 208.
  • electrode core 202 and solvent metal 206 can include at least one of, e.g., tungsten or its alloys, titanium, tantalum, palladium, molybdenum, and titanium nitride.
  • solute electrode material 208 can include at least one of silver, nickel, manganese, gold, carbon, hydrogen, silicon and germanium.
  • Electrode 200 can be an emitter, collector or other electrode component of an EHD device.
  • an emitter electrode 200 includes a surface, e.g., conductive layer 204, comprising a solvent metal 206 and a solute material 208 selected to provide two substantially independent performance characteristics to the electrode surface.
  • One or more collector electrodes can be positioned in spaced relation to emitter electrode 200 with the electrodes being energizable to motivate fluid flow along a flow path.
  • the solute material 208 causes electrode 200 to exhibit one or more of ozone reactivity, resistance to oxidation, resistance to corona erosion, low coefficient of friction, and low surface adhesion.
  • the solute material 208 may be selected to have an ozone reduction function, e.g. , to catalyze or otherwise reduce ozone generated by the device.
  • a material that includes silver (Ag) may be used to reduce ozone in an air flow.
  • Silver may also be used to prevent silica growth.
  • solute material 208 can include at least one of silver (Ag), silver oxide (Ag20), manganese dioxide (Mn02), oxides of copper (CuO), palladium, cobalt, iron and carbon or other ozone reactive materials.
  • Ozone reducing material refers to any material useful to catalyze, bind, sequester or otherwise reduce ozone.
  • Ozone reducing materials can include ozone catalysts, ozone catalyst binders, ozone reactants or other materials suitable to react with, bind to, or otherwise reduce or sequester ozone.
  • Ozone reducing materials can be selected to also target other undesirable airborne materials and pollutants.
  • conductive layer 204 is formed via one of electroplating, anodizing, sputter deposition, dip coating and vapor deposition onto electrode core 202 over barrier material 203.
  • the conductive layer 204 forms a substantially pore-free conductive layer over electrode core 202.
  • conductive layer 204 forms a discontinuous or varying layer over electrode core 202. Such a conductive layer 204 need not be uniform or continuous over the entirety of core 202 or of operating surface of electrode 200.
  • the solute material 208 is deposited on the underlying solvent metal 206 and is then heat treated to form the conductive layer 204.
  • a material that includes silver (Ag) is deposited over a palladium electrode core 202.
  • the silver material and core 202 are then heat treated to infuse the silver into the surface of the palladium electrode core 202 to produce a conductive layer 204 that reduces ozone production and can also prevent silica growth.
  • the conductive layer 204 may provide low adhesion or a "non stick" surface, or may exhibit a surface property that repels silica, which is a common material in dendrite formation.
  • the solute material 208 may include carbon such as graphite, and may have low adhesion to dendrite formation and other detrimental material, and may improve the ease of mechanically removing such detrimental material.
  • Electrode performance characteristics may also be enhanced or provided by treating the surface or conductive layer 204 of electrode 200.
  • surface conditioning and “conditioning materials” may be used to refer to any surface coating, surface deposit, surface alteration or other surface treatment suitable to provide ozone reduction, low surface adhesion, or other surface-specific performance or benefits described herein.
  • ozone reducing materials may be provided on various components in the form of "surface
  • conditioning on certain surfaces, e.g., on radiator surfaces, collector electrode surfaces, or other component surfaces.
  • electrode 200 is depicted as being substantially circular, any number of profiles may be used in electrode structures.
  • electrode 200 may take the form of a plate, wire, rod, array, needle, cone, or the like and benefit from a multi- layered structure as described.
  • conductive layer 300 is formed, at least through a substantial portion thereof, of a solid solution 304 including a solvent metal 306 and one or more solute material(s) 308/310.
  • the solid solution 304 is of a substantially consistent composition throughout a thickness of the electrode 300.
  • the solute materials 308/310 are
  • the solute materials 308/310 include at least one of titanium nitride, chromium carbide and silica. In some implementations, the solute materials 308/310 include at least one of a metal, semi-metal, non-metal and a compound. Thus, one or multiple solute materials may be selected to provide desired performance characteristics in addition to those characteristics of the solvent metal 306.
  • the solvent metal 306 provides at least a first performance characteristic, e.g., moderate tensile strength and moderate hardness.
  • the solute materials 308/310 provide at least a second performance characteristic, e.g., ozone reduction, low surface adhesion, low coefficient of friction, resistance to one of oxidation and corona erosion.
  • Conductive layer 300 may be formed substantially entirely of solid solution 304.
  • solid solution 304 may comprise only a portion of the thickness of conductive layer 300.
  • solid solution 304 may be more concentrated or even limited to an outer portion of conductive layer 300 depending on the method of formation.
  • solid solution 304 may be formed on a preexisting electrode substrate via any number of plating, deposition, or other surface treatments.
  • an interstitial solid solution structure 400 includes a matrix of molecules of a solvent metal 402 and molecules of a solute material 404 in the interstices 406 of the matrix.
  • solute materials may be infused into the matrix of the solvent metal 402.
  • multiple solute materials 404 may be infused into the matrix of the solvent metal 402.
  • Some examples of interstitial solid solutions include: carbon in iron, and hydrogen in palladium.
  • Such infusion can be accomplished, for example, by mixing the solvent metal 402 and solute material 404 in molten form.
  • the solute material 404 may be infused into the surface of a solid solvent metal 402 via any suitable deposition method and heat treatment or other suitable infusion method. Other methods include sol gel, vapor phase deposition and wet plating.
  • a solute material may cause internal stresses in the matrix of the solvent metal 402. It has been discovered that infusion of a multiple solute materials 404 of differing molecule size or properties can serve to at least partially mitigate such stresses and reduce the degree of resultant surface micro-cracking. For example, a first solute material of manganese (atomic radius 127 pm) in palladium (atomic radius 137 pm) at 5 atomic percent solution may result in significant micro- cracking. It has been discovered that infusion of a second solute material of silver (atomic radius 144 pm) can serve to mitigate the internal matrix stresses and resultant surface micro-cracking.
  • the second solute material which is a smaller molecule than that of the first solute material, allows for localized relief of lattice or matrix stresses due to the tight fit of the first solute material within the interstices of the matrix.
  • the second solute material may serve to further disperse the first solute material throughout the matrix, further reducing localized stress.
  • the interstitial solute material 404 need not be uniformly dispersed within the solvent metal 402 but may be concentrated in discrete areas or within a particular thickness or other region.
  • a substitutional solid solution structure 500 includes solvent metal molecules 502 and solute material molecules 504 in a matrix in which the solute material molecules 504 have displaced solvent metal molecules 502.
  • substitutional solid solutions include: silver in palladium, and manganese in palladium, and copper in nickel.
  • emitter electrode 10 may be energizable to generate ions and may be positioned relative to collector electrode(s) 12 to motivate fluid flow along a fluid flow path.
  • emitter electrode 10 and collector electrode(s) 12 may at least partially define an EHD fluid accelerator.
  • Any number of additional electrodes may be positioned upstream and downstream of the EHD fluid accelerator along the fluid flow path.
  • a collector electrode can be disposed upstream of the EHD fluid accelerator along the fluid flow path and can operate as an electrostatic precipitator.
  • a method 600 of making a product includes providing an electrode core material, (block 602).
  • the method further includes providing over the core material a barrier material robust to effects of a corona environment, (block 603)
  • the method further includes providing a conductive layer over the barrier material.
  • the conductive layer includes a solid solution. Formation of the solid solution conductive layer includes providing a solvent metal with a first performance characteristic, (block 604). At least a first solute material is also provided with a second performance characteristic, (block 606). A solid solution is then formed about the electrode core from the solvent metal and the solute material(s). (block 608). Each of the solvent metal and the solute material remain substantially pure at the atomic level within the solid solution and thus impart the respective independent first and second
  • the solid solution can be first formed and then deposited on the electrode core.
  • providing the solid solution on the electrode can comprise providing, separately, the solute material and the solvent metal and heat treating the solute material and solvent metal to induce formation of the solid solution.
  • the solid solution is provided on the electrode via at least one of electroplating, vapor deposition, and sputter deposition.
  • the solid solution is provided substantially at the surface of the electrode.
  • the solid solution extends, at least partially, into sublayers of the electrode.
  • Example solvent metals include, e.g., at least one of tungsten or its alloys, titanium, tantalum, palladium, molybdenum, and titanium nitride.
  • Example solute material(s) include, e.g., at least one of silver, nickel, gold, carbon, hydrogen, silicon, germanium, titanium nitride, chromium carbide, and silica.
  • a multi-layered electrode structure 700 provides robustness against electrode erosion following surface micro-cracking.
  • An electrode core material 702 is provided with various barrier layers between the core material and an outermost conductive layer 704.
  • the conductive layer 704, e.g., an AgPd solid solution provides ozone reduction or other desired performance characteristic. Due, at least in part, to the difference in the size of the solid solution atoms, e.g., between the Pd solvent metal and Ag solute material atoms, micro-cracks can form in conductive layer 704, which can expose underlying layers to corona erosion.
  • Solute materials may include, for example, manganese, silver, nickel, gold, carbon, hydrogen, silicon, germanium, titanium nitride, chromium carbide and silica.
  • Electro-cracking of the surface can accelerate deterioration of the electrode as the micro-cracks expose the underlying electrode core material 702.
  • Some electrode core material 702 candidates e.g., titanium, are susceptible to corona plasma induced degradation.
  • electrode core material is a mechanically robust, high-strength material such as tungsten, steel, or titanium.
  • a layered electrode structure can mitigate cracking or at least propagation of cracks beyond the outer AgPd solid solution layer under corona plasma conditions.
  • a multi- layered structure 700 is described, starting from the conductive layer 704, e.g., an ozone reducing material that may be prone to cracking or wear, such as PdAg.
  • a layer of pure solvent metal 706 may remain between the diffusion barrier and the conductive layer 704 depending on the depth of penetration of the solute material into the solvent metal.
  • a diffusion barrier material 708 limits formation of the solid solution to the outermost layer 704, e.g., in cases where the solid solution is formed on the electrode rather than before coating onto the electrode.
  • Suitable diffusion barrier materials include nickel, chromium, platinum, and titanium-tungsten oxy-nitride.
  • layer 708 may be omitted in cases where the solid solution of conductive layer 704 is formed before application of conductive layer 704 because the solute material will not diffuse into underlying layers.
  • a Pt metal group layer 710 underlying diffusion barrier material 708 is bonded to electrode core material 702 via an adhesion layer 712.
  • Suitable adhesion layer materials can include nickel, chromium and titanium.
  • Pt group metals can include Pd, Rh, Ir, Pt, etc.
  • the Pt group metal layer 710 may serve as diffusion barrier layer 708, such that these two layers are effectively a single layer.
  • the conductive of layer 704 may not be formed in situ, but may be applied as a solid solution, such that layers 706 and 708 are omitted.
  • a method of producing a layered electrode system 800 includes providing an electrode core (block 802) and depositing various materials (blocks 804-812) on the electrode core, e.g., on a tungsten (W) or W alloy core.
  • An adhesion layer e.g., Ni or Au
  • a Pt group metal layer e.g., Pd
  • a diffusion barrier layer e.g. , Ni, is provided over the Pt group metal layer, (block 808).
  • a solvent metal layer e.g., Pd
  • a solute material e.g., Ag
  • the solute material is then diffused into the solvent metal to form a solid solution, with diffusion being limited to the solvent metal layer by the diffusion barrier material.
  • the various electrode layers may be applied in the following order: Ni, Pd, Ni, Pd, and Ag.
  • the Ag layer is then diffused into the Pd at high temperature and the Ni layer serves as a diffusion barrier to protect the underlying Pd layer.
  • any erosion of the solute material or at the loci of micro-cracks in the conductive layer may be largely constrained to the outermost layer(s), protecting the underlying layers, and significantly, the electrode core material.
  • implementations of the multi- layered electrode structure provide a durable sublayer beneath a more corona erosion susceptible outermost layer.
  • Ni nickel
  • Cu copper
  • nickel, manganese and copper also form oxides that can catalyze reduction of ozone.
  • addition of nickel or copper into a solid solution containing palladium and silver can serve to mitigate the lattice stresses and resultant micro-cracking observed with palladium and silver alone in solid solution.
  • an electrode for use in an electrohydrodynamic device includes an electrode core material and a solid solution conductive layer about the core material.
  • the solid solution conductive layer includes a solvent metal and a first solute material, which, when in solid solution alone with the solvent metal, produces micro-cracking of the solid solution conductive layer.
  • the solid solution further includes a second solute material, which, when in solid solution in the solvent metal together with the first solute material, substantially mitigates micro-cracking of the solid solution conductive layer.
  • the solvent metal has a lattice structure and the first solute material has a first molecular structure tending to stress the lattice structure of the solvent metal when in solid solution.
  • the second solute material has a second molecular structure tending to mitigate the stress on the lattice structure of the solvent metal from the first solute material when in solid solution together with the first solute material in the solvent metal.
  • the solvent metal includes palladium
  • the first solute material includes silver
  • the second solute material includes at least one of nickel, manganese and copper.
  • an EHD product is made by a method that includes positioning an emitter or collector electrode comprising a solid solution and at least one other electrode to motivate fluid flow along a flow path when the electrodes are energized.
  • One or both of the emitter and collector electrodes, or another electrode includes a surface comprising a solid solution comprising a solvent metal and a solute material selected to provide two substantially independent performance characteristics to the respective electrode surface.
  • the method further includes positioning heat transfer surfaces in the flow path to transfer heat to the fluid flow.
  • the emitter electrode, collector electrode and primary heat transfer surfaces are so positioned and fixed to constitute a thermal management assembly.
  • the method includes introducing the thermal management assembly into an electronic device and thermally coupling a heat generating or dissipating device thereof to the primary heat transfer surfaces.
  • the electronic device includes at least one of a computing device, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.
  • an EHD fluid accelerator includes an emitter electrode and a collector electrode(s) energizable to generate ions and to thereby motivate fluid flow along a flow path.
  • Primary heat transfer surfaces are positioned downstream of the emitter electrode along the flow path. The radiator is coupled into a heat transfer pathway to dissipate heat from a device into the fluid flow.
  • the radiator is distinct from the collector electrode, but proximate thereto in the flow path. In some cases, the radiator is positioned immediately downstream of the collector electrode. In some cases, the radiator abuts the collector electrode. In some cases, the radiator is spaced a distance apart from the collector electrode. Still, in some implementations, the downstream radiator and the collector electrode are constituent surfaces of a unitary structure that functions both as the collector electrode and as a radiator. In some cases, the downstream radiator and the collector are separately formed, but joined to form the unitary structure. In some cases, the radiator and collector are integrally formed.
  • a monolithic structure may act as a collector electrode and a heat transfer radiator.
  • the solid solution materials may be selected to provide both desirable performance characteristics for both electrode and radiator functions.
  • the collector electrodes and radiator are provided (or at least fabricated) as separate structures that may be mated, integrated or more generally positioned proximate to each other in operational configurations.
  • thermal management systems described herein employ EFA or EHD devices to motivate flow of a fluid, typically air, based on acceleration of ions generated as a result of corona discharge.
  • Other implementations may employ other ion generation techniques and will nonetheless be understood in the descriptive context provided herein.
  • heat transfer surfaces that may or may not be monolithic or integrated with collector electrodes, heat dissipated by electronics (e.g., microprocessors, graphics units, etc.) and/or other components can be transferred to the fluid flow and exhausted.
  • heat transfer paths e.g., heat pipes
  • heat transfer paths are provided to transfer heat from where it is dissipated or generated to a location(s) within the enclosure where air flow motivated by an EFA or EHD device(s) flows over heat transfer surfaces.
  • the emitter electrode is an elongated wire and the collector electrode includes two elongated plates substantially parallel to the emitter electrode.
  • the emitter and collector electrodes may be selected and arranged in any manner suitable to generate ions and thereby motivate fluid flow.
  • planar portions of the collector electrodes may be oriented generally orthogonally to the longitudinal extent of an emitter electrode wire. Any references to leading, trailing, upstream, or downstream are to be understood with directional reference to EHD fluid flow.
  • collector electrodes can provide significant heat transfer to fluid flows motivated therethrough or thereover.
  • the collector electrodes can also serve as a primary heat transfer surface.
  • the primary heat transfer surfaces do not participate substantially in EHD fluid acceleration, i.e., they do not serve as electrodes.
  • EHD device technologies present significant opportunities for adapting structures, geometries, scale, flow paths, controls and placement to meet thermal management challenges in a wide range of applications, systems and devices of various form factors.
  • reference to particular materials, dimensions, packaging or form factors, thermal conditions, loads or heat transfer conditions and/or system designs or applications is merely illustrative.
  • FIG. 9 is a schematic block diagram illustrating one implementation of an environment in which a solid solution electrode may operate.
  • An electronic device 900 such as a computer, includes an EFA or EHD air cooling device 920.
  • Electronic device 900 comprises a housing 916, or case, having a cover 910 that includes a display device 912. A portion of the front surface 921 of housing 916 has been cut away to reveal interior 922.
  • Housing 916 of electronic device 900 may also comprise a top surface (not shown) that supports one or more input devices that may include, for example, a keyboard, touchpad and tracking device.
  • Electronic device 900 further comprises electronic circuit 960 which generates heat in operation.
  • a thermal management solution comprises a heat pipe 944 that draws heat from electronic circuit 960 to heat sink device 942.
  • EHD device 920 is powered by high voltage power supply 930 and is positioned proximate to heat sink 942.
  • Electronic device 900 may also comprise many other circuits, depending on its intended use; to simplify illustration of this second implementation. Other components that may occupy interior area 922 of housing 916 have been omitted from FIG. 9.
  • high voltage power supply 930 is operated to create a voltage difference between emitter electrodes and collector electrodes disposed in EHD device 920, generating an ion flow or stream that moves ambient air toward the collector electrodes.
  • the moving air leaves EHD device 920 in the direction of arrow 902, traveling through the protrusions of heat sink 942 and through an exhaust grill or opening 970 in the rear surface 918 of housing 916, thereby dissipating heat accumulating in the air above and around heat sink 942.
  • the position of illustrated components, e.g., of power supply 930 relative to EHD device 920 and electronic circuit 960 may vary from that shown in FIG. 9.
  • electronic device 900 has been greatly simplified for purposes of illustration and the position of illustrated components, e.g., of power supply 930 relative to EHD device 920 and electronic circuit 960, may vary from that shown in FIG. 9. While device 900 is depicted as a laptop computing device, tablet devices, and handheld devices may likewise benefit from EHD cooling and ozone reduction as described.
  • a controller 932 is connected to EHD device 920 and may use sensor inputs to determine the state of the air cooling system, e.g., to determine a need for cleaning electrodes on a timed or scheduled basis, on a system efficiency
  • Electrode performance may be determined, for example, by monitoring voltage levels, current levels, acoustic levels, electrical potentials, determining of the presence of a level of contamination by optical means, detecting an event or performance parameter, or other methods indicating a benefit from mechanically cleaning or conditioning the electrode.
  • one or more EHD air movers 1066 including a multi-layered electrode may be positioned along an edge of a display device 1060, e.g., television or monitor, to provide air flow to dissipate heat generated by a light source 1050 of the display device 1060.
  • the air flow can travel a flow path extending across a major dimension of the display device or can travel a more localized path. Heat transfer and dissipation can be aided by heat spreaders, heat pipes, or other thermal spreaders/paths.
  • EHD air movers 1066 motivate air flow over a relatively short flow path across heat transfer surfaces associated with light sources 1060.
  • one or more EHD air movers 1066 including a multi-layered electrode are constructed and arranged to motivate air flow (indicated by broad arrows) through or within a tablet or handheld computing device 1080, 1080'.
  • air flow may be drawn into and exhausted from device 1080 as in FIG. 9a, passing, e.g., over a battery, CPU, display light source, or associated heat transfer surfaces.
  • the air flow may circulate within a substantially sealed portion of an enclosure of device 1080' to better distribute heat for radiative heat transfer from the enclosure to the environment.
  • device 1080 has a total thickness of less than about 10 mm and a display surface covers substantially an entire major surface thereof.
  • Any air flow topology and EHD air mover placement may be suitably selected relative to respective electronic assemblies (or circuit boards) for processors (e.g., CPU, GPU, etc.) and/or radio frequency (RF) sections (e.g., WiFi, WiMax, 3G/4G voice/data, GPS, etc.).
  • processors e.g., CPU, GPU, etc.
  • RF radio frequency
  • an EFA or EHD air cooling system or other similar ion action device employing an electrode cleaning system may be integrated in an operational system such as a laptop or desktop computer, a projector or video display device, etc., while other implementations may take the form of subassemblies.
  • EFA or EHD devices such as air movers, film separators, film treatment devices, air particulate cleaners, photocopy machines and cooling systems for electronic devices such as computers, laptops and handheld devices.
  • One or more devices includes one of a computing device, projector, copy machine, fax machine, printer, radio, audio or video recording device, audio or video playback device, communications device, charging device, power inverter, light source, medical device, home appliance, power tool, toy, game console, television, and video display device.

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Abstract

La présente invention concerne un appareil de gestion thermique comprenant un accélérateur de fluide électro-hydrodynamique, dans lequel une électrode d'émetteur et une autre électrode peuvent être excitées afin de provoquer un écoulement de fluide. L'électrode d'émetteur est une structure multicouche comprenant un matériau de cœur d'électrode et une couche conductrice extérieure qui est sensible à la microfissuration ou à l'érosion par effet de couronne. Un matériau de barrière résistant aux effets adverses d'un environnement de décharge de plasma est placé en tant que sous-couche afin de protéger le matériau de cœur d'électrode sous-jacent après l'altération de la couche conductrice. Une couche de promoteur d'adhérence peut être utilisée entre le matériau de barrière et le matériau de cœur d'électrode ou entre d'autres couches de la structure. L'invention concerne également un procédé de réalisation d'un produit EHD, consistant à positionner l'électrode multicouche par rapport à l'autre électrode afin de provoquer l'écoulement de fluide lors de son excitation.
PCT/US2011/057707 2010-10-28 2011-10-25 Structure d'émetteur à couche destiné à résister à la fissuration Ceased WO2012058222A2 (fr)

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EP11781712.2A EP2632601A2 (fr) 2010-10-28 2011-10-25 Structure d'émetteur à couche destiné à résister à la fissuration

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013032990A1 (fr) * 2011-09-02 2013-03-07 Tessera, Inc. Fil d'émetteur ayant une section transversale à couches multiples
WO2023180627A1 (fr) * 2022-03-21 2023-09-28 Teknologian Tutkimuskeskus Vtt Oy Unité de collecte pour un système de filtration d'air, système de filtration d'air et procédé de production d'un élément de collecte

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120162903A1 (en) * 2010-12-23 2012-06-28 Macdonald Mark Electro-hydrodynamic cooling for handheld mobile computing device
US8587945B1 (en) 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
US10091257B2 (en) 2015-02-10 2018-10-02 Cisco Technology, Inc. Managing a virtual waiting room for online meetings
CN106552713B (zh) * 2015-11-26 2018-09-07 北京纳米能源与系统研究所 一种摩擦电除尘装置、除尘系统和除尘方法
CN108811288B (zh) * 2017-05-03 2023-10-03 深圳天基权健康科技集团股份有限公司 一种等离子体发生装置用电晕电极及其制作方法
SE543734C2 (en) * 2019-03-11 2021-07-06 Apr Tech Ab Cooling of electronic components with an electrohydrodynamic flow unit

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE557185C (de) * 1929-05-05 1932-11-19 Siemens Schuckertwerke Akt Ges Elektrode fuer elektrische Gasreinigungsanlagen
US3374941A (en) * 1964-06-30 1968-03-26 American Standard Inc Air blower
FR1439531A (fr) * 1965-06-29 1966-05-20 Honeywell Inc Perfectionnements aux dépoussiéreurs électrostatiques
DE1557020A1 (de) * 1966-05-18 1970-03-12 Buettner Werke Ag Niederschlagelektrode fuer Elektro-Entstauber
DE1557147A1 (de) * 1966-10-01 1970-03-19 Metallgesellschaft Ag Spruehelektroden fuer elektrostatische Staubabscheider
US3789278A (en) * 1972-12-20 1974-01-29 Ibm Corona charging device
US4227234A (en) * 1978-07-03 1980-10-07 Xerox Corporation Corona charging element
DE2854742C2 (de) * 1978-12-19 1986-03-27 Sachs Systemtechnik Gmbh, 8720 Schweinfurt Elektrofilter
US4210847A (en) * 1978-12-28 1980-07-01 The United States Of America As Represented By The Secretary Of The Navy Electric wind generator
AT377204B (de) * 1980-11-05 1985-02-25 Hans Oppitz Elektrode fuer vorzugsweise elektrostatische anwendungsbereiche
US4585320A (en) * 1984-12-12 1986-04-29 Xerox Corporation Corona generating device
DE3641169A1 (de) * 1986-12-02 1988-06-09 Hoechst Ag Walzenelektrode und vorrichtung zur oberflaechenvorbehandlung von folienbahnen mittels elektrischer koronaentladung
US6290823B1 (en) * 2000-04-21 2001-09-18 American Roller Company Convertible electrode roller for corona treating systems
JP3770782B2 (ja) * 2000-08-23 2006-04-26 シャープ株式会社 イオン発生装置を備えた空気清浄機及び空気調和機
US7661468B2 (en) * 2005-01-24 2010-02-16 Ventiva, Inc. Electro-hydrodynamic gas flow cooling system
US8545599B2 (en) * 2010-10-28 2013-10-01 Tessera, Inc. Electrohydrodynamic device components employing solid solutions
US20130056241A1 (en) * 2011-09-02 2013-03-07 Tessera, Inc. Emitter wire with layered cross-section

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013032990A1 (fr) * 2011-09-02 2013-03-07 Tessera, Inc. Fil d'émetteur ayant une section transversale à couches multiples
WO2023180627A1 (fr) * 2022-03-21 2023-09-28 Teknologian Tutkimuskeskus Vtt Oy Unité de collecte pour un système de filtration d'air, système de filtration d'air et procédé de production d'un élément de collecte
FI131672B1 (en) * 2022-03-21 2025-09-05 Teknologian Tutkimuskeskus Vtt Oy Collection unit for an air filtration system, air filtration system and method for producing a collection element

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WO2012058222A3 (fr) 2012-08-02

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