WO2011129514A1 - Led package having a thermoelectric cooling device embedded therein - Google Patents

Abstract

Disclosed is an LED package having a thermoelectric cooling device embedded therein. An LED device is mounted on the top surface of a circuit board. The thermoelectric cooling device is installed adjacent to the LED device and parallel to the top surface of the circuit board. A sealant is formed over the LED device and the thermoelectric cooling device.

Description

LED package with integrated thermoelectric cooling element

The present invention relates to an LED package in which a thermoelectric cooling element is incorporated, and moreover,

More particularly, the present invention relates to an LED package incorporating a thermoelectric cooling element that actively discharges heat generated from the LED element to the outside using the thermoelectric cooling element.

LED (light-emitting diode) devices are attracting attention as a light source in various fields such as display devices, indoor and outdoor lighting, automotive headlights because of low power consumption. LED devices generate high-temperature heat due to internal resistance, etc., and heat dissipation is a very important technology because this heat greatly affects the performance and life of the LED device.

Conventional LED devices are usually formed by forming an electrode pattern on a printed circuit board (PCB) made of a plastic material such as silicon and attaching an LED element. However, since the PCB itself has poor heat dissipation characteristics, heat generated from the LED element is transferred to the outside. It does not release easily. Accordingly, there is a problem in that the LED element is overheated, thereby deteriorating optical characteristics, or shortening the life of the LED element.

Passive cooling and active cooling have been proposed as LED element heat dissipation to solve this problem. An example of the passive cooling method is disclosed in Korean Patent No. 10-703218, which uses aluminum, which is a metal material having good thermal conductivity, as a material of a circuit board to which an LED device is bonded, and forms an anodized film on the aluminum substrate. Thereafter, a plurality of substrate electrodes are formed, and the substrate electrodes are electrically connected to the LED elements to relate to the LED package.

However, the prior art is due to the limitation of the thermal conductivity of the aluminum substrate is a metal material

There is a difficulty in sufficiently dissipating the heat generated by the LED element. An example of an active cooling method is disclosed in Korean Patent Laid-Open Publication No. 2009-103263, which will be described below with reference to FIG. The light emitting unit 10 composed of the LED element is bonded to the upper portion of the heat sink 80, the flame-retardant insulating rubber 90 is bonded to the lower portion of the heat sink 80 by soldering 85, and the light emitting unit 10 In order to absorb heat generated in the flame-retardant insulating rubber 90, a conductive material copper plate 40, a high thermal conductive insulator 30, a metal base 20 such as copper or aluminum is sequentially stacked.

The lower portion of the metal base 20 uses a Peltier effect to install the thermoelectric semiconductor 50 to absorb the heat transmitted from the light emitting unit 10 from the top and to discharge to the bottom. In order to discharge the heat released to the lower portion of the thermoconductor 50 to the outside, a conductive material 60, an insulator 70, and a flame-retardant insulating rubber 75 are sequentially laminated to the lower portion of the thermoconductor 50. do. However, when the heat generated in the light emitting unit 10 is transferred to the metal base 20 through the copper plate 40 and the high thermal conductive insulator 30, the heat transfer efficiency is lowered, so that the cooling efficiency of the light emitting unit 10 is reduced. There is a problem that the overall size is reduced, and the size of the LED package increases as the conductive material is stacked on the upper and lower portions of the thermoelectric semiconductor 50.

The present invention is proposed to solve the above problems of the conventionally proposed methods, a horizontal thermoelectric cooling element adjacent to the LED element on the circuit board mounted with the LED element, or the circuit board and the circuit board The purpose of the present invention is to provide an LED package in which a thermoelectric cooling element is installed between the LED elements installed at an upper portion of the LED element to actively dissipate heat generated from the LED element to the outside. In addition, another object of the present invention is to provide an LED package incorporating a thermoelectric cooling device capable of preventing the LED device from deteriorating optical characteristics and shortening the lifespan by actively dissipating heat generated from the LED device to the outside.

According to an embodiment of the present invention, a circuit board having an LED (LED) device mounted on the upper surface; A thermoelectric cooling element disposed horizontally on an upper surface of the circuit board adjacent to the LED element; And an encapsulation material formed on top of the LED element and the thermoelectric cooling element.

The circuit board may have a cavity formed on an upper portion thereof, the LED element may be mounted on a bottom surface of the cavity, and the thermoelectric cooling element may be installed on a bottom surface of the cavity adjacent to the LED element.

The thermoelectric cooling device is characterized in that a plurality of P-type thermoelectric semiconductors and N-type thermoelectric semiconductors are alternately installed horizontally and connected in series.

The P-type thermoelectric semiconductor and the N-type thermoelectric semiconductor may be disposed radially around the LED element.

The thermoelectric cooling device may be provided in plural to form a concentric circle around the LED device.

An insulating groove may be formed at a lower surface of the circuit board corresponding to the position of the LED element.

An insulation groove may be formed at a lower surface of the circuit board corresponding to the positions of the LED element and the thermoelectric cooling element.

An insulating groove may be formed at a position corresponding to the LED element and the thermoelectric cooling element in an upper portion of the circuit board.

The circuit board may be provided with a heat insulating member in the lower portion of the LED element.

The heat insulating member may be installed at a position corresponding to the LED element and the thermoelectric cooling element in the upper portion of the circuit board.

A heat insulating member may be installed in the form of a partition between the LED element and the thermoelectric cooling element among upper surfaces of the circuit board.

The heat insulating member may be made of a porous material.

The heat insulating member may include a plurality of holes formed on upper surfaces of the plurality of stacked silicon wafers, and a plurality of voids formed in the silicon wafer in communication with the holes.

A heat dissipation fin may be further installed on the bottom surface of the circuit board.

The heat dissipation fin may be installed at a bottom surface of the circuit board corresponding to a position of an electrode that generates heat from the thermoelectric cooling element.

An oxide film may be further formed on the upper surface of the circuit board.

After the oxide film is formed, a portion of the upper surface of the circuit board corresponding to the oxide film may be removed.

A cap is installed between the LED element, the thermoelectric cooling element, and the encapsulant, and an interior between the LED element, the thermoelectric cooling element, and the cap may be in a hollow state.

The material of the circuit board may be made of any one selected from aluminum, copper, gold, silver, and combinations thereof.

On the other hand, according to another embodiment of the present invention, an LED (LED) device is provided on the circuit board; A thermoelectric cooling element disposed between the LED element and the circuit board and alternately connecting a plurality of P-type thermoelectric semiconductors and N-type thermoelectric semiconductors in series; And an encapsulation material formed on an upper portion of the circuit board such that the LED element and the thermoelectric cooling element are inherently provided.

A heat dissipation fin may be further installed on the bottom surface of the circuit board.

A cap is installed between the LED element, the thermoelectric cooling element, and the encapsulant, and an interior between the LED element, the thermoelectric cooling element, and the cap may be in a hollow state.

According to the LED package in which the thermoelectric cooling element is proposed according to the present invention, a horizontal thermoelectric cooling element is installed adjacent to the LED element on a circuit board on which the LED element is mounted, or between the LED element and the circuit board. By installing a thermoelectric cooling element, the heat generated from the LED element is actively emitted to the outside, thereby reducing the optical characteristics of the LED element and reducing the lifespan.

1 is a cross-sectional view showing a cooling structure of the LED package according to the prior art,

2 is a cross-sectional view showing an LED package according to a first embodiment of the present invention,

3 is a plan view of FIG.

4 to 7 are plan views showing a state in which the thermoelectric cooling device according to the first embodiment of the present invention is disposed;

8 is a cross-sectional view showing a state in which the heat insulation member is installed according to the first embodiment of the present invention;

9 is a cross-sectional view showing a heat insulating member according to a first embodiment of the present invention;

10 to 15 are plan views showing a state in which the thermoelectric cooling device according to the first embodiment of the present invention is disposed;

16 is a cross-sectional view showing a state in which an oxide film is formed according to a first embodiment of the present invention;

17 is a cross-sectional view showing a cap-shaped encapsulant according to the first embodiment of the present invention

18 is a perspective view of an LED package according to a second embodiment of the present invention, and

19 is a cross-sectional view showing a cap-shaped encapsulant according to a second embodiment of the present invention.

* Description of the sign *

100, 100 ': LED element 200, 200': circuit board

210: cavity 230: heat insulating member

231 silicon wafer 233 holes

235: cavity 250: insulation groove

300, 300 ': thermoelectric semiconductor module 310, 310': p-type thermoelectric semiconductor

330, 330 ': N-type thermoconductor 350, 350': electrode

400, 400 ': Encapsulant 500, 500': Heat dissipation fin

Objects, other objects, features and advantages of the present invention will be readily understood through the following preferred embodiments associated with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the present invention to those skilled in the art. In the present specification, when a component is mentioned to be on another component, it means that it may be formed directly on the other component or a third component may be interposed therebetween. In addition, in the drawings, the thickness of the components are exaggerated for the effective description of the technical content.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, the words 'comprises' and / or 'comprising' do not exclude the presence or addition of one or more other components.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In describing the specific embodiments below, various specific details are set forth in order to explain the invention more specifically and to help understand. However, those skilled in the art can understand that the present invention can be used without these various specific details. In some cases, it is mentioned in advance that parts of the invention which are commonly known in the description of the invention and which are not highly related to the invention are not described in order to prevent confusion in explaining the invention without cause. In addition, in designating reference numerals to components of each drawing, the same components have the same number even though they are displayed on different drawings.

Hereinafter, with reference to the accompanying drawings, it will be described in detail with respect to the LED package incorporating the thermoelectric cooling device according to a first embodiment of the present invention.

2 is a cross-sectional view showing the LED package according to the first embodiment of the present invention, Figure 3 is a plan view of Figure 2, Figures 4 to 7 and 10 to 15 according to the first embodiment of the present invention It is a top view which shows the state which thermoelectric cooling element was arrange | positioned.

Referring to FIG. 2, the LED package in which the thermoelectric cooling device is installed according to the first embodiment of the present invention includes an LED (LED) device 100, a circuit board 200, a heat insulating member 230, and a heat insulating groove 250. The thermoelectric cooling element 300 may include an encapsulant 400 and a heat dissipation fin 500.

As shown in FIGS. 2 and 3, the LED element 100 is mounted on the upper surface of the circuit board 200 and is electrically connected to a conductive circuit provided on the surface of the circuit board 200 through bonding means. In this case, the LED device 100 may be supplied with driving power through the circuit board 200. Light emitted from the LED device 100 may be converted into light of a different color by the phosphor contained in the encapsulant 400 to be described later. For example, the light emitted from the blue LED device generating blue light may be emitted as white light through wavelength conversion by the phosphor contained in the encapsulant 400.

The LED device 100 may be mounted on the upper surface of the circuit board 200. The LED device 100 forms the circuit board 200 in a planar shape and mounts it on the upper surface thereof, or forms a cavity 210 on the upper surface of the circuit board 200 as shown in FIG. Can be mounted

In this case, the cavity 210 may be formed to be inclined from the upper surface of the circuit board 200 so that its inner wall decreases in radius from the top to the bottom in order to reflect the light emitted from the LED element 100 within a desired direction angle range. It is preferable that the inclined inner wall of the cavity 210 is formed of a metal material having excellent reflectivity, or the surface is metal-coated to form a reflective surface.

The thermoelectric cooling element 300 may install a horizontal thermoelectric cooling element 300 adjacent to the LED element 100. That is, the thermoelectric cooling element 300 is horizontally installed on the upper surface of the circuit board 200 adjacent to the LED element 100.

The thermoelectric cooling device 300 serves as a cooling device that absorbs heat generated from the LED device 100 from one side and releases it to the other side by using a Peltier effect. That is, one end adjacent to the LED element 100 becomes a heat absorbing portion for absorbing heat, and the other end becomes a heat generating portion for emitting absorbed heat.

The thermoelectric cooling element 300 may be configured by connecting the P-type thermoelectric semiconductor 310 and the N-type thermoelectric semiconductor 330 in series. In this case, the size of the P-type thermoconductor 310 and the N-type thermoconductor 330 may be minimized.

The P-type thermoelectric semiconductor 310 and the N-type thermoelectric semiconductor 330 are energized by an electrode 350 provided on the upper surface of the circuit board 200. In this case, an insulating layer (not shown) is formed below the electrode 350 with the circuit board 200.

When the user wants to actively cool the heat generated by the LED device 100 using the thermoelectric cooling device 300, as illustrated in FIG. 3, the plurality of P-type thermoelectric semiconductors 310 and N-type thermoelectric semiconductors 330. ) Alternately horizontally installed, and the thermoelectric cooling device 300 in which the P-type thermoelectric semiconductor 310 and the N-type thermoelectric semiconductor 330 are connected in series is radially centered on the LED device 100. It may be disposed adjacent to the LED element 100 along the edge of the (100).

In this case, as shown in FIG. 4, a plurality of P-type thermoconductors 310 and N-type thermoconductors 330 are disposed adjacent to the LED elements 100 at positions opposing to the LED elements 100. can do.

Meanwhile, as shown in FIG. 5, the thermoelectric cooling device 300 including the P-type thermoelectric semiconductor 310, the N-type thermoelectric semiconductor 330, and the electrode 350 is formed around the LED device 100. A plurality of adjacent LED elements 100 may be installed along the edge of the 100.

In addition, as illustrated in FIG. 6, a plurality of thermoelectric cooling elements 370 and 380 may be installed on the upper surface of the circuit board 200 to form a concentric circle around the LED element 100. For example, a first thermoelectric cooling element 370 including a plurality of P-type thermoconductors, N-type thermoconductors, and electrodes may be disposed to be radially spaced apart from the LED element 100, and the LED element 100 may be disposed. ), A second thermoelectric cooling element 380 including a plurality of P-type thermoelectric semiconductors, N-type thermoelectric semiconductors, and electrodes may be disposed adjacent to a heat generating portion of the first thermoelectric cooling element 370.

In addition, a plurality of thermoelectric cooling elements such as a third thermoelectric cooling element adjacent to the second thermoelectric cooling element 380 and a fourth thermoelectric cooling element adjacent to the third thermoelectric cooling element may be sequentially installed in the same manner as described above.

The first thermoelectric cooling element 370 disposed adjacent to the LED element 100 emits heat generated by the LED element 100 through the heat generating unit, and the second thermoelectric cooling element 380 is the first thermoelectric cooling element 370. By absorbing the heat emitted from the) and released to the outside through the heat generating portion it is possible to quickly transfer the heat generated from the LED device 100 to the outside.

In addition, as shown in FIG. 7, one thermoelectric cooling device 300 may be configured by interconnecting the first thermoelectric cooling device and the second thermoelectric cooling device arranged in a concentric manner with respect to the LED device 100. have.

As described above, by effectively active cooling the LED device 100 in all directions around the LED device 100, it is possible to prevent optical properties such as the brightness of the LED device 100 due to heat from being lowered. It is possible to prevent the life of the LED device 100 is shortened.

In addition, as shown in FIG. 2, an insulating groove 250 having a predetermined depth in the upper surface direction may be formed on the lower surface of the circuit board 200. The location of the insulating groove 250 is a lower surface of the circuit board 200 corresponding to the position of the LED device 100, the area of the bottom surface of the insulating groove 250 can be formed larger than the area of the LED device 100. have.

Air in the insulation groove 250 is to perform a heat insulation function. As shown in FIG. 2 and FIG. 8, the heat insulating groove part 250 is for inducing heat conduction toward the heat absorbing part side of the thermoelectric cooling element 300 by blocking the heat conduction path to the lower portion of the circuit board 200.

8 is a cross-sectional view showing a state in which the heat insulating member is installed according to the first embodiment of the present invention, Figure 9 is a cross-sectional view showing a heat insulating member according to the first embodiment of the present invention.

2 and 8 schematically show a heat conduction path in which heat transferred from the LED element 100 to the circuit board 200 is guided to the thermoelectric cooling element 300 by the heat insulating groove 250. This is because the heat dissipation efficiency using the thermoelectric cooling element 300 to the outside than the heat dissipation to the outside through the circuit board 200 is greater.

On the other hand, referring to Figure 8, the circuit board 200 may be provided with a heat insulating member 230 in the lower portion of the mounted LED element 100. That is, the heat insulating member 230 may be installed on the upper surface of the circuit board 200 on which the LED element 100 is mounted.

At this time, the heat insulating member 230 is formed smaller than the area of the LED element 100, the portion of the circuit board 200 that the heat of the LED element 100 is in contact with the LED element 100 around the heat insulating member 230 It is preferable to configure so as to easily conduct through the heat absorbing portion side of the thermoelectric cooling device (300).

On the other hand, the heat insulating member 230 may be made of a porous material in order to reduce the thermal conductivity.

9 is a view showing an example of a heat insulating member 230 made of a porous material according to an embodiment of the present invention.

Referring to FIG. 9, the heat insulating member 230 stacks a plurality of silicon wafers 231 and bonds them with an oxide film 237, and the upper surface of the stacked silicon wafers 231 is disposed on an upper surface of the silicon wafer 231. After forming the plurality of holes 233, the plurality of voids 235 are formed in the stacked silicon wafer 231 by etching (eg, wet etching) through the holes 233. It can manufacture by a method.

Such a heat insulating member 230 of the porous material may use the heat insulating property of the air trapped in the cavity 235.

In addition, as shown in FIG. 2, a heat dissipation fin 500 may be further provided on the bottom surface of the circuit board 200. The heat dissipation fin 500 serves to discharge heat conducted to the circuit board 200 to the outside. The heat dissipation fins 500 may be installed over the entire lower surface of the circuit board 200.

Meanwhile, as shown in FIG. 8, a part of the heat emitted from the heat generating part of the thermoelectric cooling element 300 is transferred to the circuit board 200, and the thermoelectric part is formed by the heat insulating groove part 250 formed on the bottom surface of the circuit board 200. Part of the heat induced to the heat absorbing portion side of the cooling element 300 is moved along the circuit board 200 to the circuit board near the heat generating portion of the thermoelectric cooling element 300.

Therefore, the portion of the thermoelectric cooling element 300 in which the heat generating part electrode is positioned is heated to a higher temperature than the other portion, so that the circuit board 200 corresponding to the electrode position of the thermoelectric cooling element 300 is formed. By installing the heat radiation fins 550 only in the bottom position may be configured to increase the amount of heat radiation in this portion.

The circuit board 200 may be generally formed of a silicon material, but may be formed of any one selected from a material consisting of aluminum, copper, gold, silver, and combinations having high thermal conductivity. By using a material having a high thermal conductivity, a large amount of heat emitted from the heat generating portion of the thermoelectric cooling element 300 is quickly conducted to the circuit board 200, and easily radiates the conducted heat to the outside to the LED element 100. Cooling efficiency can be increased. In this case, the heat dissipation fin 500 may also be formed of any one of aluminum, copper, gold, silver, and a combination thereof having high thermal conductivity, thereby increasing heat dissipation efficiency to the outside.

The encapsulant 400 may be formed on the LED element 100 and the thermoelectric cooling element 300. The encapsulant 400 may fix the LED element 100 and the thermoelectric cooling element 300 to an upper portion of the circuit board 200, in particular, a bottom surface of the cavity 210. Here, the encapsulant 400 may be a transparent resin such as a silicone resin, an epoxy resin, or a mixed resin thereof, and it is preferable to use a silicone resin to which phosphors and other mixtures are added. The encapsulant 400 may be configured to act as a lens.

10 is a cross-sectional view showing another example in which the heat insulation member and the heat insulation groove portion are installed according to the first embodiment of the present invention.

As shown in FIG. 10, a heat insulating member 230 may be widely installed at a position corresponding to the LED element 100 and the thermoelectric cooling element 300 mounted on the circuit board 200 among upper portions of the circuit board 200. Can be. That is, the heat insulating member 230 may be installed on the entire upper surface of the circuit board 200 on which the LED element 100 is mounted.

Therefore, since the heat insulating member 230 is formed larger than the area of the LED element 100, the heat of the LED element 100 to the circuit board 200 in contact with the LED element 100 around the heat insulating member 230 Without facing, it may be configured to be easily conducted to the heat absorbing portion side of the thermoelectric cooling element (300).

In addition, as illustrated in FIG. 10, an insulating groove 250 having a predetermined depth in an upper surface direction may be formed on a lower surface of the circuit board 200. The insulation groove 250 may be formed in a groove shape on a lower surface of the circuit board 200 corresponding to the position of the insulation member 230 illustrated in FIG. 10. Air in the insulation groove 250 is to perform a heat insulation function.

11 is a cross-sectional view showing another example of the heat insulating member and the heat insulating groove.

Referring to FIG. 11, a heat insulating member 230 may be installed at a position corresponding to the LED element 100 and the thermoelectric cooling element 300 among the upper portions of the circuit board 200. In addition, the lower surface of the circuit board 200 may be formed with an insulating groove 250 having a predetermined depth in the upper surface direction. The heat insulating groove 250 is a lower surface of the circuit board 200 corresponding to the position of the LED element 100 shown in FIG. 11, but the area of the bottom surface of the heat insulating groove 250 is larger than the area of the LED element 100. It can form large.

12 is a cross-sectional view showing another example of the heat insulating member and the heat insulating groove.

Referring to FIG. 12, a heat insulating member 230 may be installed at a position corresponding to the LED element 100 among upper portions of the circuit board 200. In addition, the lower surface of the circuit board 200 may be formed with a heat insulating groove 250 having a predetermined depth in the upper surface direction. The insulation groove 250 may be formed on the lower surface of the circuit board 200 corresponding to the positions of the LED element 100 and the thermoelectric cooling element 300 illustrated in FIG. 12.

The arrow shown in FIG. 12 schematically illustrates a heat conduction path in which heat transferred from the LED element 100 to the circuit board 200 is guided to the thermoelectric cooling element 300 by the heat insulating groove 250. This is because the heat dissipation efficiency using the thermoelectric cooling element 300 to the outside than the heat dissipation to the outside through the circuit board 200 is greater.

13 is a cross-sectional view showing another example of the heat insulating member and the heat insulating groove.

Referring to FIG. 13, a heat insulating member 230 may be installed at a position corresponding to the LED element 100 among upper portions of the circuit board 200. In addition, the insulating groove 250 may be formed on the lower surface of the circuit board 200 corresponding to the position of the LED element 100 and the thermoelectric cooling element 300 of the circuit board 200 as a whole. In addition, the insulating grooves 251, 252, and 253 may be formed at positions corresponding to the LED element 100 and the thermoelectric cooling element 300 among the upper portions of the circuit board 200. That is, the insulating grooves 251, 252, and 253 may be formed at positions corresponding to the LED element 100 and the thermoelectric cooling element 300 among the upper portions of the insulating grooves 250.

According to the embodiments described above with reference to FIGS. 10 to 13, the heat insulation members 230, 231, and 232 may be configured such that the heat of the LED element 100 may be increased in the vicinity of the heat insulation members 230, 231, and 232. Through the portion of the circuit board 200 in contact with the (100) to be easily conducted to the heat absorbing portion side of the thermoelectric cooling element (300). In addition, the heat insulating grooves 250, 251, 252, and 253 block the heat conduction path to the lower portion of the circuit board 200 to induce heat conduction toward the heat absorbing portion side of the thermoelectric cooling element 300, whereby the heat insulating grooves ( Air in 250, 251, 252, and 253 may perform an adiabatic function.

14 and 15 are cross-sectional views showing another example of the heat insulating member and the heat insulating groove.

14 and 15, a heat insulating member 230 may be installed at a position corresponding to the LED element 100 among upper portions of the circuit board 200. In addition, the insulating members 231 and 232 may be installed in the form of a partition wall between the LED element 100 and the thermoelectric cooling element 300 among the upper surfaces of the circuit board 200. Therefore, the LED element 100, the thermoelectric cooling element 300, and the heat insulating members 231 and 232 may be installed together on the upper surface of the circuit board 200. When there are a plurality of thermoelectric cooling elements 300, a plurality of heat insulating members 231 and 232 are installed in the form of partition walls. Referring to FIG. 15, the insulating members 231 and 232 may be formed along the periphery of the P-type thermoconductor 310 and the N-type thermoconductor 330, and one side thereof may face the LED element 100. Can be. The heat insulating members 231 and 232 are elements for heat insulation of the heat generated from the LED device 100 and may be formed as a heat insulating coating layer.

Insulating members 231 and 232 having a partition shape are formed between the LED element 100 and the thermoelectric cooling element 300, so that the heat of the LED element 100 is led around the insulating elements 231 and 232. It is preferable to configure such that it is easily conducted to the heat absorbing portion side of the thermoelectric cooling element 300 through the portion of the circuit board 200 in contact with 100.

16 is a cross-sectional view showing a state in which an oxide film is formed according to the first embodiment of the present invention.

Referring to FIG. 16, an insulating groove 250 having a predetermined depth in an upper surface direction may be formed on a lower surface of the circuit board 200. The insulation groove 250 may be formed on the bottom surface of the circuit board 200 corresponding to the position of the LED element 100 illustrated in FIG. 12. In addition, an oxide film 510 may be further formed on the upper surface of the circuit board 200. The oxide film 510 may be formed before the LED device 100 and the thermoelectric cooling device 300 are mounted on the upper surface of the circuit board 200. After the oxide film is formed and cured, or after the LED device 100 and the thermoelectric cooling device 300 are mounted, portions of the upper surface of the circuit board 200 corresponding to the oxide film 510 may be removed.

A portion of the circuit board 200 is removed by the oxide film 510, and the oxide film 510 acts as the circuit board 200, thereby providing a path through which heat is transferred from the LED element 100 to the circuit board 200. Can be blocked beforehand. As a result, the circuit board 200 may be overheated, thereby heating the LED device 100, thereby eliminating the problem that the optical characteristics of the LED device 100 are degraded or the life thereof is shortened.

17 is a cross-sectional view showing a cap-shaped encapsulant according to the first embodiment of the present invention.

Referring to FIG. 17, a heat insulation member 230 is installed at a position corresponding to the LED element 100 among upper portions of the circuit board 200, and a bottom surface of the circuit board 200 corresponding to the position of the LED element 100 is provided. Insulating groove 250 having a predetermined depth in the upper direction may be formed. In addition, a cap 610 may be installed between the LED element 100, the thermoelectric cooling element 300, and the encapsulant 400.

The cap 610 has the same curvature as the upper surface of the encapsulant 400 or has a different curvature. The interior between the LED device 100, the thermoelectric cooling device 300, and the cap 610 may be in a hollow state. The cap 610 may prevent the heat generated from the LED element 200 from being dispersed in the encapsulant 400 direction, and may rapidly absorb the heat from the thermoelectric cooling element 300.

Hereinafter, with reference to the accompanying drawings, it will be described in detail with respect to the LED package containing a thermoelectric cooling device according to a second embodiment of the present invention.

18 is a perspective view illustrating an LED package according to a second embodiment of the present invention.

Referring to FIG. 18, an LED package incorporating a thermoelectric cooling device according to a second embodiment of the present invention may include an LED device 100 ′, a circuit board 200 ′, a thermoelectric cooling device 300 ′, and an encapsulant 400. '), May include a heat radiation fin (500').

The LED device 100 ′ may be formed on the top surface of the circuit board 200 ′ in a planar shape. In addition, the LED element 100 'is electrically connected to a conductive circuit provided on the surface of the circuit board 200' by bonding means. Since the LED element 100 'is the same as described in the first embodiment of the present invention, a detailed description thereof will be omitted.

The LED element 100 'is installed on the circuit board 200'. The circuit board 200 'may be formed of a silicon material, but preferably, any one selected from aluminum, copper, gold, silver, and a combination of materials having high thermal conductivity may be used to generate heat generated from the LED device 100'. It can be easily delivered to the outside.

Hereinafter, since the circuit board 200 ′ is as described in the first embodiment of the present invention, a detailed description thereof will be omitted.

The user may form the encapsulant 400 'on the circuit board 200'. The LED element 100 ′ and the thermoelectric cooling element 300 ′ to be described later are embedded in the encapsulant 400 ′ and fixed to the upper portion of the circuit board 200 ′ by the encapsulant 400 ′.

Hereinafter, since the encapsulant 400 ′ is as described in the first embodiment of the present invention, a detailed description thereof will be omitted.

The thermoelectric cooling element 300 ′ may be installed vertically between the LED element 100 ′ and the circuit board 200 ′. That is, the thermoelectric cooling element 300 'is provided with electrodes 350' provided on the upper surface of the circuit board 200 'and the lower surface of the LED element 100', respectively, on the thermoelectric substrates 600 'and 601'. And a plurality of P-type thermoconductors 310 'and N-type thermoconductors 330' alternately connected in series by the electrodes 350 '. Here, the P-type thermoelectric semiconductor 310 'and the N-type thermoelectric semiconductor 330' may be joined in series in a π-type. An insulating layer (not shown) is formed between the thermoelectric substrates 600 'and 601' and the electrode 350 '.

Here, the thermoelectric cooling element 300 'is an end portion absorbing heat at one end adjacent to the LED element 100', and the other end is a heat generating portion emitting the absorbed heat. Therefore, heat emitted from the LED element 100 'is actively absorbed by the heat absorbing portion of the thermoelectric cooling element 300' and is transferred to the circuit board 200 'through the heat generating portion.

In order to easily dissipate heat transferred to the circuit board 200 'to the outside, a heat dissipation fin 500' may be further installed on the bottom surface of the circuit board 200 '. In this case, the heat dissipation fin 500 may be formed of any one of aluminum, copper, gold, silver, and a combination thereof having high thermal conductivity, thereby increasing heat dissipation efficiency.

Hereinafter, since the heat radiation fin 500 'is the same as described in the first embodiment of the present invention, a detailed description thereof will be omitted.

19 is a cross-sectional view showing a cap-shaped encapsulant according to a second embodiment of the present invention.

Referring to FIG. 19, a cap 610 ′ may be installed between the LED element 100 ′, the thermoelectric cooling element 300 ′, and the encapsulant 400 ′. The cap 610 ′ has the same curvature as the top surface of the encapsulant 400 ′ or has a different curvature. The interior between the LED element 100 'and the thermoelectric cooling element 300' and the cap 610 'may be hollow. The cap 610 ′ may prevent the heat generated from the LED element 200 ′ from dispersing in the direction of the encapsulant 400 ′ as much as possible, and may allow the cap 610 ′ to be rapidly absorbed by the thermoelectric cooling element 300 ′.

As described above, the present invention has been described by way of limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains various modifications and variations from such descriptions. This is possible. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below but also by the equivalents of the claims.

Claims (22)

A circuit board on which an LED element is mounted; A thermoelectric cooling element disposed horizontally on an upper surface of the circuit board adjacent to the LED element; And An LED package with a built-in thermoelectric cooling element, characterized in that it comprises an encapsulant formed on the LED element and the thermoelectric cooling element. The method of claim 1, The circuit board is formed with a cavity (cavity) on the top, the LED element is mounted on the bottom of the cavity, the thermoelectric cooling element is installed on the bottom surface of the cavity adjacent to the LED element Built-in LED package. The method of claim 1, The thermoelectric cooling device is an LED package with a built-in thermoelectric cooling device, characterized in that a plurality of P-type thermoelectric semiconductor and N-type thermoelectric semiconductor alternately installed horizontally and connected in series. The method of claim 3, The p-type thermoelectric semiconductor and the n-type thermoelectric semiconductor is an LED package with a built-in thermoelectric cooling element, characterized in that the radial arrangement around the LED element. The method of claim 4, wherein The thermoelectric cooling element LED package with a built-in thermoelectric cooling element, characterized in that a plurality of concentric circles are formed around the LED element. The method of claim 1, An LED package with a built-in thermoelectric cooling element, characterized in that the insulating groove is formed in the lower surface position of the circuit board corresponding to the position of the LED element. The method of claim 1, LED package with a thermoelectric cooling element, characterized in that the heat insulating groove is formed in the lower surface position of the circuit board corresponding to the position of the LED element and the thermoelectric cooling element. The method of claim 1, LED package with a built-in thermoelectric cooling element, characterized in that the heat insulating groove is formed in a position corresponding to between the LED element and the thermoelectric cooling element of the upper portion of the circuit board. The method of claim 1, LED package with a built-in thermoelectric cooling element, characterized in that the heat insulating member is installed on the lower portion of the LED element. The method of claim 1, LED package with a built-in thermoelectric cooling element, characterized in that the heat insulating member is installed in a position corresponding to the LED element and the thermoelectric cooling element in the upper portion of the circuit board. The method of claim 1, LED package with a built-in thermoelectric cooling element, characterized in that the insulating member is installed in the form of a partition between the LED element and the thermoelectric cooling element of the upper surface of the circuit board. The method according to any one of claims 9 to 11, The thermal insulation member is an LED package with a built-in thermoelectric cooling element, characterized in that consisting of a porous material. The method according to any one of claims 9 to 11, The heat insulating member includes a plurality of holes formed on upper surfaces of the plurality of stacked silicon wafers, and a plurality of voids formed in the silicon wafer in communication with the holes. LED package. The method of claim 1, LED package incorporating a thermoelectric cooling element, characterized in that the heat radiation fin is further installed on the lower surface of the circuit board. The method of claim 14, The heat dissipation fin is an LED package containing a thermoelectric cooling element, characterized in that installed in the lower surface position of the circuit board corresponding to the position of the electrode that generates heat from the thermoelectric cooling element. The method of claim 1, LED package with a built-in thermoelectric cooling element, characterized in that the oxide film is further formed on the upper surface of the circuit board. The method of claim 16, After the oxide film is formed, the LED package with a built-in thermoelectric cooling element, characterized in that the portion of the upper surface of the circuit board corresponding to the oxide film is removed. The method of claim 1, An LED package having a thermoelectric cooling element embedded therein, wherein a cap is installed between the LED element and the thermoelectric cooling element and the encapsulant, and an interior between the LED element and the thermoelectric cooling element and the cap is in a hollow state. . The method of claim 1, The material of the circuit board is an LED package containing a thermoelectric cooling element, characterized in that consisting of any one selected from aluminum, copper, gold, silver and combinations thereof. A circuit board on which an LED device is installed; A thermoelectric cooling element disposed between the LED element and the circuit board and alternately connecting a plurality of P-type thermoelectric semiconductors and N-type thermoelectric semiconductors in series; And And an encapsulant formed on an upper portion of the circuit board such that the LED element and the thermoelectric cooling element are embedded therein. The method of claim 20, LED package incorporating a thermoelectric cooling element, characterized in that the heat radiation fin is further installed on the lower surface of the circuit board. The method of claim 20, An LED package having a thermoelectric cooling element embedded therein, wherein a cap is installed between the LED element and the thermoelectric cooling element and the encapsulant, and an interior between the LED element and the thermoelectric cooling element and the cap is in a hollow state. .

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