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WO2011126702A3 - Encapsulated curing agents - Google Patents

Encapsulated curing agents Download PDF

Info

Publication number
WO2011126702A3
WO2011126702A3 PCT/US2011/028938 US2011028938W WO2011126702A3 WO 2011126702 A3 WO2011126702 A3 WO 2011126702A3 US 2011028938 W US2011028938 W US 2011028938W WO 2011126702 A3 WO2011126702 A3 WO 2011126702A3
Authority
WO
WIPO (PCT)
Prior art keywords
curing agent
composition
temperature
encapsulated
curing agents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/028938
Other languages
French (fr)
Other versions
WO2011126702A2 (en
Inventor
Yayun Liu
Wenhua Zhang
Lirong Bao
Allison Yue Xiao
Steven P. Pauls, Sr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Corp
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Publication of WO2011126702A2 publication Critical patent/WO2011126702A2/en
Publication of WO2011126702A3 publication Critical patent/WO2011126702A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/04—Making microcapsules or microballoons by physical processes, e.g. drying, spraying
    • B01J13/043—Drying and spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/06—Making microcapsules or microballoons by phase separation
    • B01J13/12—Making microcapsules or microballoons by phase separation removing solvent from the wall-forming material solution
    • B01J13/125—Making microcapsules or microballoons by phase separation removing solvent from the wall-forming material solution by evaporation of the solvent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/06—Making microcapsules or microballoons by phase separation
    • B01J13/14—Polymerisation; cross-linking
    • B01J13/16—Interfacial polymerisation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)

Abstract

An encapsulated curing agent, for use in a chemical composition to be cured, such as, an adhesive or encapsulant, comprises a polymeric coating forming a shell around a curing agent core. The curing agent is capable of exhibiting a morphology change and expanding upon the application of heat at a temperature below the degradation temperature of the polymeric coating material, and below the curing temperature of the encapsulant or adhesive composition in which the encapsulated curing agent is to be used. This allows the curing agent to escape from the encapsulation coating and into the composition to be cured before the cure temperature of the composition is reached.
PCT/US2011/028938 2010-03-30 2011-03-18 Encapsulated curing agents Ceased WO2011126702A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31898710P 2010-03-30 2010-03-30
US61/318,987 2010-03-30

Publications (2)

Publication Number Publication Date
WO2011126702A2 WO2011126702A2 (en) 2011-10-13
WO2011126702A3 true WO2011126702A3 (en) 2012-01-12

Family

ID=44763466

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/028938 Ceased WO2011126702A2 (en) 2010-03-30 2011-03-18 Encapsulated curing agents

Country Status (2)

Country Link
TW (1) TW201139631A (en)
WO (1) WO2011126702A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9683129B2 (en) 2014-12-04 2017-06-20 Prc-Desoto International, Inc. Polythioether sealants with extended working time
MX390555B (en) 2015-05-15 2025-03-20 Dow Global Technologies Llc MATERIAL DISTRIBUTION SYSTEMS FOR LAMINATOR.
US11001540B2 (en) 2015-07-07 2021-05-11 Bae Systems Plc Cast explosive composition
EP3115348A1 (en) * 2015-07-07 2017-01-11 BAE Systems PLC Cast explosive composition
US11186528B2 (en) 2015-07-07 2021-11-30 Bae Systems Plc PBX composition
WO2017189388A1 (en) * 2016-04-25 2017-11-02 3M Innovative Properties Company Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles
EP3555169A1 (en) 2016-12-13 2019-10-23 3M Innovative Properties Company Epoxy stabilization using acid-coated nitrogen-containing catalysts, particles, and methods
US20220195247A1 (en) 2019-03-28 2022-06-23 3M Innovative Properties Company Structural bonding tape with epoxide microcapsules
JP2022526956A (en) 2019-03-28 2022-05-27 スリーエム イノベイティブ プロパティズ カンパニー Epoxide microcapsules with pickering emulsifier
CN109957377A (en) * 2019-04-28 2019-07-02 祝亚琴 A kind of closure dispersing agent
CN111808268A (en) * 2020-07-23 2020-10-23 苏州科技大学 A kind of epoxy resin latent curing agent and preparation method thereof
WO2022123498A1 (en) 2020-12-10 2022-06-16 3M Innovative Properties Company Crosslinked polymer particles and related compositions and processes

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3505428A (en) * 1966-01-03 1970-04-07 Inmont Corp Curable normally stable compositions containing cross linking agent in capsule form
US4808639A (en) * 1986-07-16 1989-02-28 Production Previews, Inc. Liquid curable adhesive composition comprising a polyester resin and a microencapsulated peroxide curing agent
US5589523A (en) * 1994-03-15 1996-12-31 Toray Industries, Inc. Microcapsule-type curing agent, method for producing the same, thermosetting resin composition, prepreg and fiber reinforced composite material
US6113728A (en) * 1989-03-09 2000-09-05 Hitachi Chemical Company, Ltd. Process for connecting circuits and adhesive film used therefor
US20050107494A1 (en) * 2002-02-18 2005-05-19 Takayuki Matsushima Latent hardener, process for producing the same, and adhesive containing latent hardener
EP1557438A1 (en) * 2002-10-25 2005-07-27 Asahi Kasei Chemicals Corporation Capsule type hardener and composition
WO2010122995A1 (en) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3505428A (en) * 1966-01-03 1970-04-07 Inmont Corp Curable normally stable compositions containing cross linking agent in capsule form
US4808639A (en) * 1986-07-16 1989-02-28 Production Previews, Inc. Liquid curable adhesive composition comprising a polyester resin and a microencapsulated peroxide curing agent
US6113728A (en) * 1989-03-09 2000-09-05 Hitachi Chemical Company, Ltd. Process for connecting circuits and adhesive film used therefor
US5589523A (en) * 1994-03-15 1996-12-31 Toray Industries, Inc. Microcapsule-type curing agent, method for producing the same, thermosetting resin composition, prepreg and fiber reinforced composite material
US20050107494A1 (en) * 2002-02-18 2005-05-19 Takayuki Matsushima Latent hardener, process for producing the same, and adhesive containing latent hardener
EP1557438A1 (en) * 2002-10-25 2005-07-27 Asahi Kasei Chemicals Corporation Capsule type hardener and composition
WO2010122995A1 (en) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent

Also Published As

Publication number Publication date
WO2011126702A2 (en) 2011-10-13
TW201139631A (en) 2011-11-16

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