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WO2011115399A3 - Film adhésif et panneau tactile - Google Patents

Film adhésif et panneau tactile Download PDF

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Publication number
WO2011115399A3
WO2011115399A3 PCT/KR2011/001773 KR2011001773W WO2011115399A3 WO 2011115399 A3 WO2011115399 A3 WO 2011115399A3 KR 2011001773 W KR2011001773 W KR 2011001773W WO 2011115399 A3 WO2011115399 A3 WO 2011115399A3
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive film
touch panel
present
resistance
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/001773
Other languages
English (en)
Korean (ko)
Other versions
WO2011115399A2 (fr
Inventor
김장순
송민석
이억형
최원구
이재관
이용훈
한학림
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LX Hausys Ltd
Original Assignee
LG Hausys Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Hausys Ltd filed Critical LG Hausys Ltd
Priority to JP2012541967A priority Critical patent/JP5856066B2/ja
Priority to EP11756530.9A priority patent/EP2548932B1/fr
Priority to US13/510,066 priority patent/US9534149B2/en
Priority to CN201180004527.6A priority patent/CN102656243B/zh
Publication of WO2011115399A2 publication Critical patent/WO2011115399A2/fr
Publication of WO2011115399A3 publication Critical patent/WO2011115399A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/163—Indexing scheme relating to constructional details of the computer
    • G06F2200/1634—Integrated protective display lid, e.g. for touch-sensitive display in handheld computer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y10T428/31797—Next to addition polymer from unsaturated monomers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Position Input By Displaying (AREA)

Abstract

Cette adhésion concerne un film adhésif et un panneau tactile. Selon la présente invention, même lorsqu'un film adhésif est appliqué sur un panneau tactile, par exemple sur un panneau adhésif capacitif, et directement fixé à une couche conductrice, ledit film empêche efficacement la résistance de la couche conductrice d'augmenter et présente une résistance supérieure à la chaleur. Le film adhésif de l'invention est supérieur en termes de longévité, de caractéristiques optiques, d'aptitude à être découpé, d'aptitude au façonnage, de mouillabilité et de résistance au gauchissement.
PCT/KR2011/001773 2010-03-16 2011-03-14 Film adhésif et panneau tactile Ceased WO2011115399A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012541967A JP5856066B2 (ja) 2010-03-16 2011-03-14 粘着フィルム及びタッチパネル
EP11756530.9A EP2548932B1 (fr) 2010-03-16 2011-03-14 Panneau tactile
US13/510,066 US9534149B2 (en) 2010-03-16 2011-03-14 Adhesive film and touch panel
CN201180004527.6A CN102656243B (zh) 2010-03-16 2011-03-14 粘结薄膜及触控面板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100023285A KR101585270B1 (ko) 2010-03-16 2010-03-16 점착 필름 및 터치패널
KR10-2010-0023285 2010-03-16

Publications (2)

Publication Number Publication Date
WO2011115399A2 WO2011115399A2 (fr) 2011-09-22
WO2011115399A3 true WO2011115399A3 (fr) 2012-02-09

Family

ID=44650585

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/001773 Ceased WO2011115399A2 (fr) 2010-03-16 2011-03-14 Film adhésif et panneau tactile

Country Status (7)

Country Link
US (1) US9534149B2 (fr)
EP (1) EP2548932B1 (fr)
JP (1) JP5856066B2 (fr)
KR (1) KR101585270B1 (fr)
CN (1) CN102656243B (fr)
TW (1) TWI445797B (fr)
WO (1) WO2011115399A2 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6760348B1 (en) * 1998-12-28 2004-07-06 Globespanvirata, Inc. System and method for tone detection in a discrete multi-tone system
KR101191117B1 (ko) * 2009-09-28 2012-10-15 주식회사 엘지화학 터치 패널
KR101385039B1 (ko) * 2011-10-11 2014-04-14 제일모직주식회사 점착제 조성물, 점착필름, 그 제조방법 및 이를 이용한 디스플레이 부재
JP5889035B2 (ja) * 2012-02-22 2016-03-22 リンテック株式会社 粘着シート
KR20130131795A (ko) * 2012-05-24 2013-12-04 (주)엘지하우시스 유연도가 높은 점착 조성물
JP5811117B2 (ja) * 2013-03-05 2015-11-11 信越化学工業株式会社 硬化性シリコーン組成物の硬化方法
KR101795101B1 (ko) 2013-10-23 2017-11-07 주식회사 엘지화학 고굴절 점착제 필름 및 이를 포함하는 터치 패널
JP6372669B2 (ja) * 2013-11-21 2018-08-15 エルジー・ケム・リミテッド 保護フィルム
JP6324045B2 (ja) * 2013-12-04 2018-05-16 三菱電機株式会社 表示装置
EP3092278A4 (fr) * 2014-01-07 2017-10-04 Orthobond, Inc. Adhésif de surface pour dispositifs
WO2016031280A1 (fr) * 2014-08-26 2016-03-03 オリンパス株式会社 Endoscope, et système endoscopique comprenant ledit endoscope
US20160329562A1 (en) 2014-12-16 2016-11-10 Sanyo Electric Co., Ltd. Negative electrode active material for nonaqueous electrolyte secondary batteries and nonaqueous electrolyte secondary battery containing negative electrode active material
KR20170135882A (ko) 2015-04-10 2017-12-08 다우 코닝 도레이 캄파니 리미티드 플루오로알킬기 함유 경화성 오가노폴리실록산 조성물, 그의 경화물 및 당해 경화물을 구비한 전자 부품 또는 표시 장치
TWI564762B (zh) 2015-04-22 2017-01-01 恆顥科技股份有限公司 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片
CN107960100B (zh) * 2015-04-28 2021-04-02 信越化学工业株式会社 有机硅粘合剂组合物和胶带
KR102379808B1 (ko) 2016-04-22 2022-03-31 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 고유전성 필름, 그의 용도 및 제조 방법
CN109844048B (zh) * 2016-10-14 2021-10-15 信越化学工业株式会社 导热性复合硅橡胶片及其制造方法
JP7460315B2 (ja) * 2017-03-31 2024-04-02 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
WO2018186161A1 (fr) 2017-04-03 2018-10-11 東レ・ダウコーニング株式会社 Résine d'organopolysiloxane réactive au durcissement, composition adhésive sensible à la pression utilisant celle-ci et utilisation de celle-ci
CN107386540A (zh) * 2017-07-05 2017-11-24 林和国 一种光伏多金属结构材料
EP3650515B1 (fr) * 2017-07-07 2025-05-21 Dow Corning Toray Co., Ltd. Composition d'organopolysiloxane pour former une couche auto-adhésive et son utilisation
KR102604331B1 (ko) 2017-12-22 2023-11-23 다우 도레이 캄파니 리미티드 적층체 및 그 용도
EP3835389A4 (fr) 2018-08-10 2022-05-18 Dow Toray Co., Ltd. Composition d'organopolysiloxane destinée à former une couche adhésive sensible à la pression et son utilisation
WO2020032287A1 (fr) 2018-08-10 2020-02-13 ダウ・東レ株式会社 Composition d'organopolysiloxane pour former une couche adhésive sensible à la pression et son utilisation
JP7046197B2 (ja) 2018-08-10 2022-04-01 ダウ・東レ株式会社 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
WO2020121930A1 (fr) 2018-12-13 2020-06-18 ダウ・東レ株式会社 Composition adhésive à base de silicones et son utilisation
CN110204726B (zh) * 2019-06-11 2022-02-11 上海本诺电子材料有限公司 一种有机硅改性丙烯酸树脂的制备方法
KR102847441B1 (ko) 2019-08-13 2025-08-21 다우 도레이 캄파니 리미티드 감압 접착층 형성성 오가노폴리실록산 조성물 및 그의 사용
US20220275262A1 (en) 2019-08-13 2022-09-01 Dow Toray Co., Ltd. Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof
CN114269875B (zh) 2019-08-13 2024-05-14 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
CN110471570B (zh) * 2019-08-22 2024-07-05 京东方科技集团股份有限公司 触控模组的制作方法、触控模组和触控显示装置
WO2022138345A1 (fr) 2020-12-25 2022-06-30 ダウ・東レ株式会社 Composition adhésive à base de silicones et son utilisation
TWI834405B (zh) * 2022-12-01 2024-03-01 財團法人工業技術研究院 雙面膠及多層結構體

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5955198A (en) * 1994-07-04 1999-09-21 Matsushita Electric Co., Ltd. Transparent touch panel
EP1297489B1 (fr) * 2000-07-06 2004-09-22 3M Innovative Properties Company Materiau adhesif pour ecrans tactiles
US20050202238A1 (en) * 2004-03-12 2005-09-15 Nitto Denko Corporation Transparent double-sided pressure-sensitive adhesive tape or sheet and touch panel
KR20100009574A (ko) * 2007-04-20 2010-01-27 닛토덴코 가부시키가이샤 투명 점착 시트 및 플랫 패널 디스플레이

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337376A (en) 1976-09-20 1978-04-06 Hitachi Ltd Manufacture for color receiving tube
US4617238A (en) 1982-04-01 1986-10-14 General Electric Company Vinyloxy-functional organopolysiloxane compositions
JPS58174418A (ja) 1982-04-07 1983-10-13 Toshiba Corp 光重合組成物
JPH0627162B2 (ja) 1988-05-31 1994-04-13 信越化学工業株式会社 光硬化性オルガノポリシロキサン組成物
JPH06148887A (ja) 1991-01-28 1994-05-27 Oki Electric Ind Co Ltd 感光性樹脂組成物
JP3376629B2 (ja) 1993-03-19 2003-02-10 東レ株式会社 感光性樹脂組成物およびこれを使用したパターン形成方法
DE4329599C1 (de) 1993-09-02 1995-03-16 Bayer Ag Verfahren zur Entfernung von Verunreinigungen aus Hydrazinhydrat
WO1996008367A2 (fr) * 1994-09-16 1996-03-21 Avery Dennison Corporation Structure adhesive autocollante multicouche
JP2002313121A (ja) * 2001-04-16 2002-10-25 Nitto Denko Corp タッチパネル付照明装置及び反射型液晶表示装置
JP2003177241A (ja) 2001-12-10 2003-06-27 Fujimori Kogyo Co Ltd 光学用積層体、粘着剤転写テープ、および光学用積層体の製造法
JP3880418B2 (ja) * 2002-02-21 2007-02-14 日東電工株式会社 両面粘着シートおよびタッチパネルの表示装置への貼着固定方法
JP4493273B2 (ja) * 2003-01-29 2010-06-30 日東電工株式会社 両面粘着シートおよびタッチパネル付き表示装置
JP4618993B2 (ja) 2003-10-02 2011-01-26 日東電工株式会社 感圧性接着テープ又はシート及び光学フィルム
JP5299804B2 (ja) 2004-08-03 2013-09-25 綜研化学株式会社 金属貼着用粘着シート
JP4678847B2 (ja) * 2004-10-28 2011-04-27 信越化学工業株式会社 シリコーン組成物から得られる粘着層を有する粘着性フィルム
JP2006281670A (ja) * 2005-04-01 2006-10-19 Shin Etsu Chem Co Ltd 熱圧着用シート
JP5382841B2 (ja) 2005-10-31 2014-01-08 日東電工株式会社 導電性積層フィルム、タッチパネル用電極板、タッチパネルおよび導電性積層フィルム用粘着剤
JP5591477B2 (ja) * 2008-03-13 2014-09-17 日東電工株式会社 光学部材用粘着剤組成物、光学部材用粘着剤層、粘着型光学部材、透明導電性積層体、タッチパネルおよび画像表示装置
EP2650340A3 (fr) 2008-10-15 2014-04-16 Mitsubishi Plastics, Inc. Feuille adhésive transparente et dispositif d'affichage d'image
CN102439105B (zh) * 2009-05-26 2015-04-15 三菱树脂株式会社 具有再剥离性的粘合材料
JP2011057883A (ja) 2009-09-11 2011-03-24 Sliontec Corp 透明性無基材両面テープ・シートおよびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5955198A (en) * 1994-07-04 1999-09-21 Matsushita Electric Co., Ltd. Transparent touch panel
EP1297489B1 (fr) * 2000-07-06 2004-09-22 3M Innovative Properties Company Materiau adhesif pour ecrans tactiles
US20050202238A1 (en) * 2004-03-12 2005-09-15 Nitto Denko Corporation Transparent double-sided pressure-sensitive adhesive tape or sheet and touch panel
KR20100009574A (ko) * 2007-04-20 2010-01-27 닛토덴코 가부시키가이샤 투명 점착 시트 및 플랫 패널 디스플레이

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