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WO2011111958A2 - Cooling apparatus for an led lamp - Google Patents

Cooling apparatus for an led lamp Download PDF

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Publication number
WO2011111958A2
WO2011111958A2 PCT/KR2011/001534 KR2011001534W WO2011111958A2 WO 2011111958 A2 WO2011111958 A2 WO 2011111958A2 KR 2011001534 W KR2011001534 W KR 2011001534W WO 2011111958 A2 WO2011111958 A2 WO 2011111958A2
Authority
WO
WIPO (PCT)
Prior art keywords
led
lamp
pipe
led module
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/001534
Other languages
French (fr)
Korean (ko)
Other versions
WO2011111958A3 (en
Inventor
이주동
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DYESKOM Co Ltd
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DYESKOM Co Ltd
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Filing date
Publication date
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Publication of WO2011111958A2 publication Critical patent/WO2011111958A2/en
Publication of WO2011111958A3 publication Critical patent/WO2011111958A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • FIG. 8 is a view showing a state in which the LED lamp of the present invention is installed on the LED street light.
  • the pipe coupling groove 111 may be formed at the center of the rear side of the lamp case 110, but may be formed at a position slightly away from the center of the rear side of the lamp case 110 as shown in the drawing.
  • the detachment preventing means is, for example, a state in which the fastening bolt 140 penetrated rearward from the inside of the LED lamp 100 and the cooling water pipe 1 coupled to the pipe coupling groove 111 of the LED lamp 100.
  • it is configured to include an attachment hole 300 is coupled to the rear of the LED lamp 100 and the nut 141 is coupled to the fastening bolt 140.
  • the silicon coating portion between the LED lamp 100 and the coolant pipe 1 by the packing 200 and the silicon becomes a vacuum state, and the heat generated from the LED lamp 100 is a refrigerant located in the coolant pipe 1. Is cooled.
  • the heat sink 500 also performs a function of transferring heat generated from the AC-DC converter 150 toward the cooling water pipe 1.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a cooling apparatus for a light-emitting diode (LED) lamp that uses light-emitting diodes as a light source. The cooling apparatus is configured such that an LED module mounting unit extends in a lengthwise direction within the LED lamp, a plurality of heat pipes are arranged between an LED module and the LED module mounting unit such that the heat pipes are vertical to the LED module mounting unit, and a pipe coupling groove for coupling a coolant pipe is formed at the rear side of the LED lamp, thereby quickly transferring heat generated by the LED lamp to the coolant pipe through the heat pipes, and thus cooling the LED lamp in the quickest possible way.

Description

[규칙 제26조에 의한 보정 12.05.2011]　엘이디 조명등 냉각장치[Revision 12.05.2011 by Rule 26] 규칙 LED Lighting Lamp Cooling System

본 발명은 엘이디 조명등 냉각장치에 관한 것으로, 특히 발광다이오드(LED)를 광원으로 하는 엘이디 조명등을 사용함에 있어, LED의 고출력에 의하여 발생된 고열을 효율적으로 냉각시킬 수 있는 엘이디 조명등 냉각장치에 관한 것이다.The present invention relates to an LED lamp cooling apparatus, and more particularly to an LED lamp cooling apparatus that can efficiently cool the high heat generated by the high power of the LED in the use of the LED lighting lamp as a light emitting diode (LED) as a light source. .

오늘날 전기/전자 기술의 발전으로 다양한 전기적으로 안정적인 발광 소자들이 개발되었으며, 대표적인 발광 소자로는 발광다이오드(Light Emitting Diode; LED)가 있다.Today, with the development of electric / electronic technology, various electrically stable light emitting devices have been developed, and a representative light emitting device is a light emitting diode (LED).

발광다이오드(LED)는 고체 발광 표시 소자 중의 하나로 빛의 3원색인 적색(R), 녹색(G), 청색(B)의 광(光)을 발생하는 단색LED뿐만 아니라 다양한 분야에 응용될 수 있는 백색 광 LED가 개발되었다.The light emitting diode (LED) is one of the solid state light emitting display devices, and may be applied to various fields as well as a monochromatic LED that generates light of three primary colors of light (R), green (G), and blue (B). White light LEDs have been developed.

이러한 LED의 응용 분야로는 일반 표시 장치에서 디스플레이의 백라이트용 발광원은 물론 백열 전구나 형광 램프, 가로등을 대체할 수 있는 차세대 조명 설비로 점차 그 활용범위가 확대되고 있다.The application field of the LED is gradually being used as a next-generation lighting equipment that can replace incandescent bulbs, fluorescent lamps, street lights, as well as a light emitting source for the backlight of the display in a general display device.

LED를 이용한 조명 설비(이하, 엘이디 조명등이라 함), 예를 들어, LED 가로등은 일반 형광등의 가로등과는 달리 점등 회로가 단순하고, 인버터 회로와 철심형 안정기가 불필요하며, 전력 소모가 적고 수명이 길기 때문에 유지나 보수비용이 적은 장점이 있다.Lighting fixtures using LEDs (hereinafter referred to as LED lamps), for example, LED streetlights, unlike ordinary fluorescent streetlights, has a simple lighting circuit, does not require inverter circuits and iron ballasts, and consumes less power and has a longer lifetime. Because of the long, it has the advantage of low maintenance and repair costs.

그러나, 이와 같은 LED 가로등의 단점으로는 열적 스트레스로 인한 특성 열화 및 고장이 발생한다는 측면이다.However, the disadvantages of such LED street light is that the characteristics deterioration and failure due to thermal stress occurs.

이는 LED를 동작시키기 위해 다수의 LED에 입력되는 전원이 높을수록 발생하는 열이 많아지기 때문에 고장 및 특성 열화가 발생하게 된다.This is because the higher the power input to the plurality of LEDs to operate the LED, the more heat is generated, causing failure and deterioration of characteristics.

이러한 고열을 발생시키는 엘이디 조명등을 최대한 빨리 냉각시킬 수 있는 엘이디 조명등 냉각장치가 필요하다.There is a need for an LED lamp cooling device capable of cooling the LED lamps that generate such high heat as quickly as possible.

본 발명은 상기와 같은 문제점을 해결하기 위해 창안한 것으로, 그 목적은 발광다이오드(LED)를 광원으로 하는 엘이디 조명등을 사용함에 있어, LED의 고출력에 의하여 발생된 고열을 효율적으로 냉각시킬 수 있도록 하기 위하여 엘이디 조명등의 내측에 LED모듈안착부를 길이방향으로 길게 구성하고, LED모듈과 LED모듈안착부 사이에 다수의 히트파이프를 배치하되, 히트파이프를 상기 LED모듈안착부와 수직방향으로 배치하며, 엘이디 조명등의 후측에 냉각수파이프를 체결하기 위한 파이프결합홈을 구성하여, 엘이디 조명등에서 발생되는 열이 히트파이프를 통해 빠른 시간 내에 냉각수파이프로 전달되도록 구성한 엘이디 조명등 냉각장치를 제공하는 데 있다.The present invention has been made to solve the above problems, the object of which is to use an LED lamp as a light source as a light emitting diode (LED), to efficiently cool the high heat generated by the high power of the LED In order to configure the LED module seating portion in the longitudinal direction inside the LED lamp, and to arrange a plurality of heat pipes between the LED module and the LED module seating portion, the heat pipe is disposed in a vertical direction with the LED module seating portion, By providing a pipe coupling groove for fastening the cooling water pipe on the rear side of the lamp, to provide an LED lamp cooling device configured to transfer heat generated from the LED lamp to the coolant pipe within a short time through the heat pipe.

또한, 본 발명은 히트파이프와 LED모듈안착부 사이에 알루미늄 재질의 방열판을 삽입하여, 냉각효율을 보다 향상시키도록 한 엘이디 조명등 냉각장치를 제공하는 데 있다.In addition, the present invention is to provide an LED lighting lamp cooling device to insert a heat sink made of aluminum between the heat pipe and the LED module mounting portion to further improve the cooling efficiency.

또한, 본 발명은 조명등케이스의 내측에 AC-DC 컨버터를 구성하여, AC-DC 컨버터에서 발생되는 열도 냉각되도록 한 엘이디 조명등 냉각장치를 제공하는 데 있다.In addition, the present invention is to provide an LED lamp cooling device configured to cool the heat generated from the AC-DC converter by configuring an AC-DC converter inside the lamp case.

특히 본 발명은 이러한 엘이디 조명등을 냉각수파이프에 결합함에 있어, 파이프결합홈에 실리콘을 도포하거나 방열테이프를 부착하여 냉각효율을 최대화할 수 있는 엘이디 조명등 냉각장치를 제공하는 데 있다.In particular, the present invention is to provide an LED lamp cooling device that can maximize the cooling efficiency by applying a silicone coating to the pipe coupling groove, or attaching a heat radiation tape in coupling the LED lamp to the cooling water pipe.

본 발명의 엘이디 조명등 냉각장치는 소규모로 운영되는 가로등이나 전등뿐만 아니라 대규모로 운영되는 축구장이나 야구장 같은 경기장 등 이 엘이디 조명등이 필요로 하는 모든 장소(예: 휴게소, 간판 등)에 설치할 수 있다.LED lighting lamp cooling apparatus of the present invention can be installed in all places (such as rest areas, signboards, etc.) that the LED lights, such as stadiums such as football or baseball field that is operated on a large scale, as well as street lamps or lights operated on a small scale.

상기와 같은 목적을 이루기 위해 본 발명은 LED(121)가 구비된 LED모듈(120)을 포함한 엘이디 조명등(100)에서 방출되는 열을 냉각시키는 엘이디 조명등 냉각장치에 있어서, 상기 엘이디 조명등(100)의 내측에 LED모듈(120)을 안착하기 위한 LED모듈안착부(130)가 길이방향으로 길게 구성되고, 상기 LED모듈(120)과 LED모듈안착부(130) 사이에 다수의 히트파이프(400)를 배치하되, 상기 히트파이프(400)는 상기 LED모듈안착부(130)와 수직방향으로 구성되며, 상기 엘이디 조명등(100)의 후측에 냉각수파이프(1)가 밀착결합될 수 있도록 파이프결합홈(111)을 구성하고, 상기 냉각수파이프(1)를 엘이디 조명등(100)의 파이프결합홈(111)에 결합시킨 상태에서, 상기 냉각수파이프(1)가 파이프결합홈(111)에서 이탈되는 것을 방지하기 위한 이탈방지수단을 구성하는 것을 특징으로 한다.In order to achieve the above object, the present invention in the LED lamp cooling apparatus for cooling the heat emitted from the LED lamp 100 including the LED module 120 provided with the LED 121, of the LED lamp 100 The LED module seating unit 130 for seating the LED module 120 is configured to be long in the longitudinal direction, and a plurality of heat pipes 400 are disposed between the LED module 120 and the LED module seating unit 130. The heat pipe 400 is disposed in a vertical direction with the LED module seating unit 130, and the pipe coupling groove 111 is configured to closely couple the cooling water pipe 1 to the rear side of the LED lamp 100. ) And in a state in which the coolant pipe 1 is coupled to the pipe coupling groove 111 of the LED lamp 100 to prevent the coolant pipe 1 from being separated from the pipe coupling groove 111. It is characterized by configuring a separation prevention means.

상기 이탈방지수단은 엘이디 조명등(100)의 내측에서 후방으로 관통된 체결볼트(140); 상기 냉각수파이프(1)를 엘이디 조명등(100)의 파이프결합홈(111)에 결합시킨 상태에서, 그 엘이디 조명등(100)의 후방에서 결합되는 부착구(300); 및 상기 체결볼트(140)에 결합되는 너트(141)를 포함하여, 상기 냉각수파이프(1)의 외주면에 엘이디 조명등(100) 및 부착구(300)가 밀착 구성되는 것을 특징으로 한다.The detachment preventing means includes a fastening bolt 140 penetrating rearward from the inside of the LED lamp (100); An attachment hole 300 coupled to the rear of the LED lamp 100 in a state in which the cooling water pipe 1 is coupled to the pipe coupling groove 111 of the LED lamp 100; And a nut 141 coupled to the fastening bolt 140, wherein the LED lamp 100 and the attachment port 300 are closely attached to the outer circumferential surface of the cooling water pipe 1.

또한, 본 발명은 상기 엘이디 조명등(100)의 파이프결합홈(111)에 고리형태의 패킹(200)을 삽입하기 위한 패킹삽입홈(210)을 구성하며, 상기 패킹삽입홈(210)에 패킹(200)을 삽입한 후, 패킹(200)의 내측에 해당하는 파이프결합홈(111)에 실리콘을 도포하거나 방열테이프를 부착하는 것을 특징으로 한다.In addition, the present invention comprises a packing insertion groove 210 for inserting the ring-shaped packing 200 in the pipe coupling groove 111 of the LED lamp 100, packing (in the packing insertion groove 210) ( After inserting the 200, it is characterized in that to apply the silicon or heat radiation tape to the pipe coupling groove 111 corresponding to the inside of the packing 200.

또한, 본 발명은 상기 히트파이프(400)와 LED모듈안착부(130) 사이에 알루미늄 재질의 방열판(500)을 삽입하는 것을 특징으로 한다.In addition, the present invention is characterized in that the heat sink 500 is inserted between the heat pipe 400 and the LED module seat 130.

상기 엘이디 조명등(100)은 전체적으로 육면체 형상이고 전방이 개방된 조명등케이스(110), 상기 조명등케이스(110)의 내측에 LED모듈(120)을 안착시키기 위해 전방으로 돌출 형성된 LED모듈안착부(130), 상기 LED모듈안착부(130)에 안착되는 것으로, 다수의 LED(121)가 배치되어 전원공급시 전방으로 빛을 출사하는 LED모듈(120), 및 개방되어 있는 조명등케이스(110)의 전방을 커버하는 것으로, 투명재질로 이루어지는 보호커버를 포함하여 구성되는 것을 특징으로 한다.The LED lamp 100 has a hexahedral shape as a whole, the front of the lamp case 110, the LED module seating portion 130 protruded forward to seat the LED module 120 in the interior of the lamp case 110. To be seated on the LED module seating unit 130, a plurality of LEDs 121 are arranged to emit light to the front when the power supply, the LED module 120, and the front of the open lamp case 110 is opened. To cover, characterized in that comprises a protective cover made of a transparent material.

상기 엘이디 조명등(100)은 조명등케이스(110)의 내측면에 형성되어 반사광이 전방으로 확산(

Figure 64f4
散)될 수 있도록 반사판을 더 구성하는 것을 특징으로 한다.The LED lamp 100 is formed on the inner surface of the lamp case 110, the reflected light is diffused forward (
Figure 64f4
And iii) further configuring a reflector to enable it.

상기 조명등케이스(110)의 내측에는 교류(AC)를 직류(DC)로 변환시키는 AC-DC컨버터(150)가 구성되는 것을 특징으로 한다.Inside the lamp case 110 is characterized in that the AC-DC converter 150 for converting AC (AC) to direct current (DC) is configured.

상기 엘이디 조명등(100)은 집어등 또는 LED가로등에 구성되는 것을 특징으로 한다.The LED lamp 100 is characterized in that it is configured in a collecting light or LED street light.

본 발명의 엘이디 조명등 냉각장치는 엘이디 조명등의 내측에 LED모듈안착부를 길이방향으로 길게 구성하고, LED모듈과 LED모듈안착부 사이에 다수의 히트파이프를 배치하되, 히트파이프를 상기 LED모듈안착부와 수직방향으로 배치하며, 엘이디 조명등의 후측에 냉각수파이프를 체결하기 위한 파이프결합홈을 구성함에 따라 엘이디 조명등에서 발생되는 열이 히트파이프를 통해 빠른 시간 내에 냉각수파이프로 전달되도록 하여, 엘이디 조명등을 최대한 빨리 냉각시킬 수 있다.LED lighting device cooling device of the present invention is configured to the LED module mounting portion in the longitudinal direction in the interior of the LED lamp, and arranged a plurality of heat pipes between the LED module and the LED module seating portion, the heat pipe and the LED module seating portion Arranged in the vertical direction and forming a pipe coupling groove for fastening the coolant pipe on the rear side of the LED lamp, the heat generated from the LED lamp is transferred to the coolant pipe through the heat pipe in a short time, so that the LED lamp is turned on as soon as possible. Can be cooled.

또한, 본 발명은 히트파이프와 LED모듈안착부 사이에 알루미늄 재질의 방열판을 삽입함에 따라 엘이디 조명등의 냉각효율을 보다 향상시킬 수 있다.In addition, the present invention can further improve the cooling efficiency of the LED lighting by inserting the heat sink of the aluminum material between the heat pipe and the LED module mounting portion.

또한, 본 발명은 조명등케이스의 내측에 AC-DC 컨버터를 구성하여, AC-DC 컨버터에서 발생되는 열도 함께 냉각시킬 수 있다.In addition, the present invention configures the AC-DC converter inside the lamp case, it is also possible to cool the heat generated by the AC-DC converter.

특히 본 발명은 이러한 엘이디 조명등을 냉각수파이프에 결합함에 있어, 파이프결합홈에 실리콘을 도포하거나 방열테이프를 부착하여 냉각효율을 최대화할 수 있다.Particularly, in the present invention, when the LED lighting lamp is coupled to the cooling water pipe, it is possible to maximize the cooling efficiency by applying silicon to the pipe coupling groove or by attaching a heat dissipation tape.

도 1 및 도 2는 본 발명의 일실시예에 따른 엘이디 조명등 냉각장치를 전방에서 바라본 분리사시도.1 and 2 is an exploded perspective view of the LED lighting lamp cooling apparatus according to an embodiment of the present invention viewed from the front.

도 3은 본 발명의 일실시예에 따른 엘이디 조명등 냉각장치를 전방에서 바라본 결합사시도.Figure 3 is a perspective view of the LED illumination lamp cooling apparatus according to an embodiment of the present invention viewed from the front.

도 4 및 도 5는 본 발명의 일실시예에 따른 엘이디 조명등 냉각장치를 후방에서 바라본 분리사시도 및 결합사시도.4 and 5 is an exploded perspective view and a combined perspective view of the LED lighting lamp cooling apparatus according to an embodiment of the present invention from the rear.

도 6은 본 발명의 히트파이프의 절단 사시도.Figure 6 is a cut perspective view of the heat pipe of the present invention.

도 7은 본 발명의 다른 일실시예에 따른 엘이디 조명등 냉각장치의 분리사시도.Figure 7 is an exploded perspective view of the LED lighting lamp cooling apparatus according to another embodiment of the present invention.

도 8은 본 발명의 엘이디 조명등이 LED가로등에 설치된 상태를 보여준 도면.8 is a view showing a state in which the LED lamp of the present invention is installed on the LED street light.

상기와 같은 목적을 이루기 위해 본 발명은 LED(121)가 구비된 LED모듈(120)을 포함한 엘이디 조명등(100)에서 방출되는 열을 냉각시키는 엘이디 조명등 냉각장치에 있어서, 상기 엘이디 조명등(100)의 내측에 LED모듈(120)을 안착하기 위한 LED모듈안착부(130)가 길이방향으로 길게 구성되고, 상기 LED모듈(120)과 LED모듈안착부(130) 사이에 다수의 히트파이프(400)를 배치하되, 상기 히트파이프(400)는 상기 LED모듈안착부(130)와 수직방향으로 구성되며, 상기 엘이디 조명등(100)의 후측에 냉각수파이프(1)가 밀착결합될 수 있도록 파이프결합홈(111)을 구성하고, 상기 냉각수파이프(1)를 엘이디 조명등(100)의 파이프결합홈(111)에 결합시킨 상태에서, 상기 냉각수파이프(1)가 파이프결합홈(111)에서 이탈되는 것을 방지하기 위한 이탈방지수단을 구성하는 것을 특징으로 한다.In order to achieve the above object, the present invention in the LED lamp cooling apparatus for cooling the heat emitted from the LED lamp 100 including the LED module 120 provided with the LED 121, of the LED lamp 100 The LED module seating unit 130 for seating the LED module 120 is configured to be long in the longitudinal direction, and a plurality of heat pipes 400 are disposed between the LED module 120 and the LED module seating unit 130. The heat pipe 400 is disposed in a vertical direction with the LED module seating unit 130, and the pipe coupling groove 111 is configured to closely couple the cooling water pipe 1 to the rear side of the LED lamp 100. ) And in a state in which the coolant pipe 1 is coupled to the pipe coupling groove 111 of the LED lamp 100 to prevent the coolant pipe 1 from being separated from the pipe coupling groove 111. It is characterized by configuring a separation prevention means.

이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 실시예를 상세하게 설명하고자 한다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1 및 도 2는 본 발명의 일실시예에 따른 엘이디 조명등 냉각장치를 전방에서 바라본 분리사시도이고, 도 3은 본 발명의 일실시예에 따른 엘이디 조명등 냉각장치를 전방에서 바라본 결합사시도이며, 도 4 및 도 5는 본 발명의 일실시예에 따른 엘이디 조명등 냉각장치를 후방에서 바라본 분리사시도 및 결합사시도이다. 또한, 도 6은 본 발명의 히트파이프의 절단 사시도이다.1 and 2 is an exploded perspective view of the LED lamp cooling apparatus according to an embodiment of the present invention viewed from the front, Figure 3 is a combined perspective view of the LED lamp cooling apparatus according to an embodiment of the present invention from the front, FIG. 4 and 5 is an exploded perspective view and a combined perspective view of the LED lighting lamp cooling apparatus according to an embodiment of the present invention viewed from the rear. 6 is a cutaway perspective view of the heat pipe of the present invention.

먼저, 냉각수파이프(1)에 대해 설명하면, 일정한 길이를 가지면서 내부에 중공부(12)가 형성된 파이프이다.First, the cooling water pipe 1 will be described. The pipe 12 has a hollow portion 12 formed therein with a predetermined length.

상기 냉각수파이프(1)의 양단은 밀폐되도록 구성될 수도 있지만, 내부의 냉매가 순환될 수 있도록 연결될 수도 있다.Both ends of the cooling water pipe 1 may be configured to be sealed, but may be connected to allow the refrigerant inside to circulate.

또한, 냉각수파이프(1)의 재질은 알루미늄, 구리, 철 등을 사용할 수 있는데, 수명, 내구성 및 인장강도 등을 감안하여 스테인레스 재질로 사용하는 것이 바람직하다.In addition, the material of the cooling water pipe 1 may be aluminum, copper, iron or the like, but is preferably used as a stainless material in view of the life, durability and tensile strength.

상기 냉매로는 냉각수, 냉각유 또는 부동액 등과 액체를 사용할 수도 있고, 기체 상태의 냉각가스 등을 사용할 수도 있다.As the coolant, a coolant, a coolant, an antifreeze, or a liquid may be used, or a gaseous cooling gas or the like may be used.

도 1 내지 도 5를 참조하면, 본 발명은 냉각수파이프(1)의 일측 외주면에는 엘이디 조명등(100)이 형성되고, 냉각수파이프(1)의 타측 외주면에는 상기 엘이디 조명등(100)을 후방에서 지지하는 부착구(300)가 형성된다.1 to 5, the present invention is an LED lamp 100 is formed on one outer peripheral surface of the coolant pipe 1, the other outer peripheral surface of the coolant pipe 1 to support the LED lamp 100 from the rear The attachment hole 300 is formed.

엘이디 조명등(100)은 조명등케이스(110), LED모듈안착부(130) 및 LED모듈(120)을 포함하여 구성된다.The LED lamp 100 is configured to include a lamp case 110, LED module seat 130 and the LED module 120.

조명등케이스(110)는 전체적으로 길이방향으로 긴 육면체 형상이고 전방이 개방되며, 내부가 비어 있는 형태를 가진다. 이 비어 있는 부분에는 LED모듈(120) 등이 설치된다.The lamp case 110 has a long hexahedron shape in the longitudinal direction as a whole, the front is open, and the interior is empty. The empty part is provided with the LED module 120 and the like.

또한, 조명등케이스(110)의 내측에는 교류(AC)를 직류(DC)로 변환시키는 AC-DC컨버터(150)를 구성할 수도 있다.In addition, an AC-DC converter 150 for converting alternating current (AC) into direct current (DC) may be configured inside the lamp case 110.

또한, 조명등케이스(110)의 후측에는 냉각수파이프(1)가 밀착결합될 수 있도록 파이프결합홈(111)이 구성된다.In addition, the rear side of the lamp case 110, the pipe coupling groove 111 is configured so that the cooling water pipe 1 is in close contact.

파이프결합홈(111)은 조명등케이스(110)의 후측의 정중앙에 형성될 수도 있지만 도면에서와 같이 조명등케이스(110)의 후측의 정중앙에서 약간 벗어난 위치에 형성될 수도 있다.The pipe coupling groove 111 may be formed at the center of the rear side of the lamp case 110, but may be formed at a position slightly away from the center of the rear side of the lamp case 110 as shown in the drawing.

LED모듈안착부(130)는 조명등케이스(110)의 내측에서 전방으로 돌출 형성된 구조로 이루어지는데, 이 돌출된 부분에 LED모듈(120)이 안착된다. The LED module seating unit 130 has a structure formed to protrude forward from the inside of the lamp case 110, the LED module 120 is seated on the protruding portion.

LED모듈안착부(130)는 조명등케이스(110) 길이방향, 즉 파이프 길이방향으로 길게 형성되고, 그 상부는 평평하게 구성된다.LED module seating portion 130 is formed long in the longitudinal direction of the lamp case 110, that is, the pipe longitudinal direction, the upper portion is formed flat.

또한, LED모듈안착부(130)는 파이프결합홈(111)과 가장 근접한 위치에 설치되는 것이 좋다.In addition, the LED module seating unit 130 is preferably installed in the closest position to the pipe coupling groove 111.

LED모듈(120)은 상기 LED모듈안착부(130)에 안착되는 것으로, 다수의 LED(121)가 배치되어 전원공급시 전방으로 빛을 방출한다.The LED module 120 is seated on the LED module seating unit 130, and a plurality of LEDs 121 are disposed to emit light forward when the power is supplied.

또한, 본 발명의 엘이디 조명등(100)은 보호커버 및 반사판을 더 포함할 수도 있다.In addition, the LED lamp 100 of the present invention may further include a protective cover and a reflecting plate.

보호커버는 개방되어 있는 조명등케이스(110)의 전방을 커버하는 것으로, 투명재질로 이루어진다.The protective cover covers the front of the lamp case 110 that is open and is made of a transparent material.

반사판은 조명등케이스(110)의 내측면에 형성되어 반사광이 전방으로 확산(

Figure 64f4
散)될 수 있도록 한다.The reflector is formed on the inner surface of the lamp case 110 so that the reflected light is diffused forward (
Figure 64f4
Iv) to be made.

본 발명은 냉각수파이프(1)를 엘이디 조명등(100)의 파이프결합홈(111)에 결합시킨 상태에서, 냉각수파이프(1)가 파이프결합홈(111)에서 이탈되는 것을 방지하기 위한 이탈방지수단을 구성한다.The present invention provides a separation prevention means for preventing the coolant pipe 1 from being separated from the pipe coupling groove 111 in a state in which the cooling water pipe 1 is coupled to the pipe coupling groove 111 of the LED lamp 100. Configure.

상기 이탈방지수단은 일례로서, 엘이디 조명등(100)의 내측에서 후방으로 관통된 체결볼트(140)와, 상기 냉각수파이프(1)를 엘이디 조명등(100)의 파이프결합홈(111)에 결합시킨 상태에서, 그 엘이디 조명등(100)의 후방에서 결합되는 부착구(300)와, 상기 체결볼트(140)에 결합되는 너트(141)를 포함하여 구성된다.The detachment preventing means is, for example, a state in which the fastening bolt 140 penetrated rearward from the inside of the LED lamp 100 and the cooling water pipe 1 coupled to the pipe coupling groove 111 of the LED lamp 100. In, it is configured to include an attachment hole 300 is coupled to the rear of the LED lamp 100 and the nut 141 is coupled to the fastening bolt 140.

부착구(300)는 중앙부분이 벤딩(bending)되고, 양 가장자리가 평평하게 구성된다.The attachment hole 300 has a central portion bent and both edges are flat.

상기 부착구(300)의 평평한 부분에는 볼트결합공(310)이 형성되는데, 이 볼트결합공(310)을 통하여 부착구(300)가 체결볼트(140)에 결합된다. 이후, 너트(141)를 이용하여 조이면 냉각수파이프(1)를 기준으로 냉각수파이프(1)의 일측 외주면에는 엘이디 조명등이 밀착형성되고, 냉각수파이프(1)의 타측 외주면에는 부착구(300)가 밀착형성된다.A flat portion of the attachment hole 300 is formed with a bolt coupling hole 310, through which the attachment hole 300 is coupled to the fastening bolt 140. Then, when tightened using the nut 141, LED lighting, etc. are closely formed on one outer peripheral surface of the cooling water pipe 1 based on the cooling water pipe 1, and the attachment hole 300 is closely attached to the other outer peripheral surface of the cooling water pipe 1. Is formed.

본 발명은 엘이디 조명등(100)의 파이프결합홈(111)에 고리형태의 패킹(200)을 삽입하기 위한 패킹삽입홈(210)이 구성된다. The present invention is a packing insertion groove 210 for inserting the ring-shaped packing 200 in the pipe coupling groove 111 of the LED lamp 100 is configured.

상기 패킹삽입홈(210)에 패킹(200)을 삽입한 후, 패킹(200)의 내측에 해당하는 파이프결합홈(111)에 실리콘을 도포하거나 방열테이프를 부착한다. 이는 열 전달을 우수하도록 하기 위한 것이다.After the packing 200 is inserted into the packing insertion groove 210, silicon is applied to the pipe coupling groove 111 corresponding to the inside of the packing 200 or a heat dissipation tape is attached. This is to ensure good heat transfer.

패킹(200)은 실리콘이 외측으로 누설되는 것을 방지할 뿐만 아니라 냉각수파이프(1)와 엘이디 조명등(100)간 긴밀유지 역할을 수행한다.The packing 200 not only prevents the silicon from leaking to the outside, but also serves to maintain a close relationship between the coolant pipe 1 and the LED lamp 100.

그 결합과정을 살펴보면, 파이프결합홈(111) 내에 형성된 패킹삽입홈(210)에 패킹(200)을 삽입하고 패킹(200)의 내측에 해당하는 파이프결합홈(111)에 실리콘을 도포한 후, 냉각수파이프(1)를 파이프결합홈(111)에 결합시킨다. 이후, 엘이디 조명등(100)의 후방에서 부착구(300)를 이용하여 체결볼트(140)에 체결한 후, 너트(141)결합하면 도 3 및 도 5와 같은 형태가 된다. Looking at the coupling process, after inserting the packing 200 into the packing insertion groove 210 formed in the pipe coupling groove 111 and applying the silicon to the pipe coupling groove 111 corresponding to the inside of the packing 200, The coolant pipe 1 is coupled to the pipe coupling groove 111. Then, after fastening to the fastening bolt 140 by using the mounting holes 300 in the rear of the LED lamp 100, when the nut 141 is coupled to form the same as in Figs.

그러면 패킹(200)과 실리콘에 의하여 엘이디 조명등(100)과 냉각수파이프(1) 사이의 실리콘 도포부분은 진공상태가 될 뿐만 아니라 엘이디 조명등(100)에서 발생된 열은 냉각수파이프(1) 내에 위치한 냉매에 의하여 냉각된다.Then, the silicon coating portion between the LED lamp 100 and the coolant pipe 1 by the packing 200 and the silicon becomes a vacuum state, and the heat generated from the LED lamp 100 is a refrigerant located in the coolant pipe 1. Is cooled.

한편, 본 발명은 LED모듈(120)과 LED모듈안착부(130) 사이에 다수의 히트파이프(400)를 배치하되, 상기 히트파이프(400)는 상기 LED모듈안착부(130)와 수직방향으로 구성한다. 즉, LED모듈안착부(130)의 상부면에는 LED모듈안착부(130)와 수직방향으로 다수의 히트파이프(Heat Pipe)(400)가 배치되고, 상기 히트파이프(400)의 상측에 는 LED모듈(120)이 배치된다.Meanwhile, in the present invention, a plurality of heat pipes 400 are disposed between the LED module 120 and the LED module seating unit 130, and the heat pipe 400 is perpendicular to the LED module seating unit 130. Configure. That is, a plurality of heat pipes 400 are disposed on an upper surface of the LED module seating unit 130 in a direction perpendicular to the LED module seating unit 130, and an LED is disposed on the upper side of the heat pipe 400. Module 120 is disposed.

히트파이프(400)는 내부가 중공이면서 양측이 밀폐된 구조로, 열전달이 우수한 재질로 이루어진다.The heat pipe 400 has a hollow structure and both sides are sealed, and the heat pipe 400 is made of a material having excellent heat transfer.

본 발명의 일실시예에서는 다수의 히트파이프(400)를 병렬로 연이어 연결한 후, 양단이 밀폐되도록 구성하였다.(도 6 참조)In an embodiment of the present invention, after connecting the plurality of heat pipes 400 in series, the both ends are configured to be sealed. (See FIG. 6).

또한, 본 발명의 일실시예에서는 상기와 같은 구조의 히트파이프(400)를 다수개 일정 간격으로 배치한다.In addition, in an embodiment of the present invention, a plurality of heat pipes 400 having the above structure are arranged at regular intervals.

상기 히트파이프(400)는 그 내부의 밀폐된 진공 공간에서 순환하는 작동유체(410)가 연속적으로 액체-증기간의 상변화(증발과 응축)할 때 동반되는 잠열(潛熱)을 이용하여 열을 이동시킴으로써, 단일상의 작동유체(410)를 이용하는 통상의 열전달기기에 비해 획기적인 성능을 발휘한다.The heat pipe 400 transfers heat by using latent heat (潛 熱) that is accompanied when the working fluid 410 circulating in the closed vacuum space therein continuously undergoes phase change (evaporation and condensation) of the liquid-vapor period. By doing so, it exhibits breakthrough performance compared to a conventional heat transfer device using the single-phase working fluid 410.

히트파이프(400)의 재질은 일례로서, 동, 금, 알루미늄, 백금 등이 있다.The heat pipe 400 may be made of, for example, copper, gold, aluminum, platinum, or the like.

상기와 같이, 본 발명은 LED모듈안착부(130)의 상부에 수직방향으로 다수의 히트파이프(Heat Pipe)(400)를 배치하고, 상기 히트파이프(400)의 상측에 LED모듈(120)이 배치된 상태에서, 엘이디 조명등(100)의 파이프결합홈(111)에 냉매가 채워진 냉각수파이프(1)를 결합하고, 부착구(300)를 이용하여 엘이디 조명등(100)이 냉각수파이프(1)에 고정되도록 하였다. 추가로, 본 발명은 조명등케이스(110)의 내측에 AC-DC컨버터(150)를 구성하였다.As described above, the present invention arranges a plurality of heat pipes 400 in the vertical direction on the upper part of the LED module seating unit 130, and the LED module 120 is located above the heat pipes 400. In the arranged state, the coolant pipe 1 filled with the refrigerant is coupled to the pipe coupling groove 111 of the LED lamp 100, and the LED lamp 100 is connected to the coolant pipe 1 by using the attachment hole 300. To be fixed. In addition, the present invention configured the AC-DC converter 150 inside the lamp case 110.

이러한 상태에서 엘이디 조명등(100)을 가동(ON)하면 엘이디 조명등(100)의 LED모듈(120) 및 AC-DC컨버터(150)에서 열이 발생하게 된다. 이 열은 히트파이프(400)로 전달된다.In this state, when the LED lamp 100 is turned on, heat is generated in the LED module 120 and the AC-DC converter 150 of the LED lamp 100. This heat is transferred to the heat pipe 400.

상기 히트파이프(400)는 특성상 전체가 고른 열 분포가 이루어지므로 상기 발생된 열은 히트파이프(400)의 중앙부분에 위치한 LED모듈안착부(130)를 통하여 냉각수파이프(1)에 전달되어, 냉각수파이프(1) 내의 냉매에 의하여 냉각된다Since the heat pipe 400 has a uniform heat distribution in its entirety, the generated heat is transferred to the coolant pipe 1 through the LED module seating unit 130 located at the center of the heat pipe 400, thereby cooling water. Cooled by the refrigerant in pipe 1

대부분은 열은 냉매에서 식혀지고, 냉각수파이프(1)를 통해 일부 방열되기도 한다.Most of the heat is cooled in the refrigerant, and some of the heat dissipation through the coolant pipe (1).

이와 같이, 냉각수파이프(1)를 통하여 열 냉각이 주로 이루어지므로 히트파이프(400)의 양 가장자리로 전달된 열은 히트파이프(400)의 중앙 부분으로 빠르게 이동한다. As such, since the thermal cooling is mainly performed through the coolant pipe 1, the heat transferred to both edges of the heat pipe 400 quickly moves to the center portion of the heat pipe 400.

본 발명의 일실시예에서는 히트파이프(400) 대신 내부가 채워진 봉 형태의 금속부재를 사용할 수 있다.In an embodiment of the present invention, instead of the heat pipe 400, a rod-shaped metal member may be used.

또한, 상기 금속부재는 열전도성이 우수한 금속, 예를 들어, 알루미늄(Al), 금(Au), 은(Ag), 구리(Cu) 등과 같은 금속으로 구현될 수 있다.In addition, the metal member may be formed of a metal having excellent thermal conductivity, for example, a metal such as aluminum (Al), gold (Au), silver (Ag), copper (Cu), or the like.

도 7은 본 발명의 다른 일실시예에 따른 엘이디 조명등 냉각장치의 분리사시도로, 상기 히트파이프(400)와 LED모듈안착부(130) 사이에 알루미늄 재질의 방열판(500)을 삽입하는 것 이외에, 도 1 내지 5와 같은 구성을 가진다.Figure 7 is a separate perspective view of the LED lighting lamp cooling apparatus according to another embodiment of the present invention, in addition to inserting a heat sink 500 of aluminum material between the heat pipe 400 and the LED module seat 130, 1 to 5 has the configuration as shown.

방열판(500)은 LED모듈 안착부의 직상부에 위치하는 것으로, LED모듈(120)에서 냉각수파이프(1)로의 열 전달 속도를 향상시키기 위해 구비된 것이다.The heat sink 500 is located directly above the LED module seating portion, and is provided to improve the heat transfer rate from the LED module 120 to the coolant pipe 1.

방열판(500)은 AC-DC컨버터(150)에서 발생된 열을 냉각수파이프(1) 쪽으로 전달하는 기능도 수행한다.The heat sink 500 also performs a function of transferring heat generated from the AC-DC converter 150 toward the cooling water pipe 1.

도 8은 본 발명의 엘이디 조명등(100)이 LED가로등(10)에 설치된 상태를 보여준 도면이다.8 is a view showing a state in which the LED lamp 100 of the present invention is installed on the LED street light (10).

도면에 도시된 바와 같이, LED가로등(10)은 지면과 수직으로 솟아 있는 지주(11)와, 지주(11) 상부에 지면과 거의 평행하게 뻗어있는 냉각수파이프(1)와, 냉각수파이프(1)의 일단에 위치한 엘이디 조명등(100)과, 냉각수파이프(1)의 타단에 위치한 방열판(12) 등으로 구성할 수 있다.As shown in the figure, the LED street light 10 is a strut 11 that rises perpendicularly to the ground, a coolant pipe 1 extending substantially parallel to the ground on the top of the strut 11, and the coolant pipe 1 LED lighting lamp 100 located at one end of the, and the heat sink 12 and the like located at the other end of the coolant pipe (1).

냉각수파이프(1)는 도면에도 도시한 바와 같은 형태대로 휘어지게 제작할 수도 있다. The cooling water pipe 1 may be manufactured to be bent in the form as shown in the figure.

엘이디 조명등(100)은 다수의 LED(121)가 LED모듈(120)에 장착되어 공급되는 외부 전원을 기반으로 발광되며, 엘이디 조명등(100)의 아래쪽은 광을 투과시킬 수 있는 투명 재질의 보호커버가 씌워지고, 위쪽은 부착구(300)가 씌워져 엘이디 조명등(100) 내부를 밀폐시켜 외부로부터 이물질(예를 들어, 먼지, 물 등)이 침투하지 않도록 한다.LED lamp 100 is a plurality of LEDs 121 is emitted based on the external power supplied to the LED module 120 is supplied, the lower side of the LED lamp 100 is a transparent protective cover that can transmit light Is covered, the upper portion is covered with the attachment hole 300 to seal the inside of the LED lamp 100 to prevent foreign substances (eg, dust, water, etc.) from penetrating from the outside.

엘이디 조명등(100)에서 발생된 열은 냉각수파이프(1) 내의 냉매에 의해 대부분 식혀지지만, 본 발명의 방열판(12)을 더 구비함으로써 더욱 빨리 냉각할 수 있게 된다.Most of the heat generated by the LED lamp 100 is cooled by the refrigerant in the cooling water pipe 1, but by further providing the heat sink 12 of the present invention can be cooled more quickly.

본 발명의 엘이디 조명등 냉각장치는 소규모로 운영되는 가로등이나 전등뿐만 아니라 대규모로 운영되는 축구장이나 야구장 같은 경기장 등 이 엘이디 조명등(100)이 필요로 하는 모든 장소(예: 휴게소, 간판 등)에 설치할 수 있다.LED lighting lamp cooling apparatus of the present invention can be installed in any place (eg, rest area, signage, etc.) that the LED lighting lamp 100, such as stadiums such as football stadiums or baseball stadiums that are operated on a large scale, as well as street lamps or lights operated in a small scale. have.

상기와 같이, 본 발명의 바람직한 실시예를 참조하여 설명하였지만, 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.As described above, with reference to the preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that it can be changed.

본 발명은 엘이디 조명등 관련 분야에 이용될 수 있다.The present invention can be used in the field of LED lighting.

Claims (8)

LED(121)가 구비된 LED모듈(120)을 포함한 엘이디 조명등(100)에서 방출되는 열을 냉각시키는 엘이디 조명등 냉각장치에 있어서,In the LED lamp cooling apparatus for cooling the heat emitted from the LED lamp 100 including the LED module 120 having the LED 121, 상기 엘이디 조명등(100)의 내측에 LED모듈(120)을 안착하기 위한 LED모듈안착부(130)가 구성되고;An LED module seating unit 130 for mounting the LED module 120 inside the LED lamp 100 is configured; 상기 LED모듈(120)과 LED모듈안착부(130) 사이에 다수의 히트파이프(400)를 배치하되, 상기 히트파이프(400)는 상기 LED모듈안착부(130)와 수직방향으로 구성되며;Arranging a plurality of heat pipes (400) between the LED module (120) and the LED module seating unit (130), wherein the heat pipe (400) is configured to be perpendicular to the LED module seating unit (130); 상기 엘이디 조명등(100)의 후측에 냉각수파이프(1)가 밀착결합될 수 있도록 파이프결합홈(111)을 구성하고;A pipe coupling groove 111 is configured to allow the cooling water pipe 1 to be closely coupled to the rear side of the LED lamp 100; 상기 냉각수파이프(1)를 엘이디 조명등(100)의 파이프결합홈(111)에 결합시킨 상태에서, 상기 냉각수파이프(1)가 파이프결합홈(111)에서 이탈되는 것을 방지하기 위한 이탈방지수단을 구성하며;In the state in which the cooling water pipe 1 is coupled to the pipe coupling groove 111 of the LED lamp 100, a separation preventing means for preventing the cooling water pipe 1 from being separated from the pipe coupling groove 111 is configured. To; 상기 LED모듈안착부(130)를 파이프결합홈(111)과 냉각수파이프(1) 길이방향으로 설치하여, LED모듈(120)에서 발생된 열을 상기 파이프결합홈(111)에 결합된 냉각수파이프(1) 내의 냉각수에 의해 냉각되도록 구성하고;The LED module seating unit 130 is installed in the pipe coupling groove 111 and the cooling water pipe 1 in the longitudinal direction, and heat generated from the LED module 120 is coupled to the pipe coupling groove 111 with the cooling water pipe ( Configured to be cooled by the cooling water in 1); 상기 LED모듈안착부(130)가 조명등케이스(110)의 내측에서 전방으로 돌출 형성되도록 구성하는 것을 특징으로 하는 엘이디 조명등 냉각장치.The LED module seating portion 130 from the inside of the lamp case 110 to the front LED lighting lamp cooling device, characterized in that configured to protrude. 청구항 1에 있어서,The method according to claim 1, 상기 이탈방지수단은 엘이디 조명등(100)의 내측에서 후방으로 관통된 체결볼트(140);The detachment preventing means includes a fastening bolt 140 penetrating rearward from the inside of the LED lamp (100); 상기 냉각수파이프(1)를 엘이디 조명등(100)의 파이프결합홈(111)에 결합시킨 상태에서, 그 엘이디 조명등(100)의 후방에서 결합되는 부착구(300); 및An attachment hole 300 coupled to the rear of the LED lamp 100 in a state in which the cooling water pipe 1 is coupled to the pipe coupling groove 111 of the LED lamp 100; And 상기 체결볼트(140)에 결합되는 너트(141)를 포함하여,Including a nut 141 coupled to the fastening bolt 140, 상기 냉각수파이프(1)의 외주면에 엘이디 조명등(100) 및 부착구(300)가 밀착 구성되는 것을 특징으로 하는 엘이디 조명등 냉각장치.LED lighting lamp cooling device characterized in that the LED lighting lamp 100 and the attachment port 300 is in close contact with the outer peripheral surface of the cooling water pipe (1). 청구항 1에 있어서,The method according to claim 1, 상기 엘이디 조명등(100)의 파이프결합홈(111)에 고리형태의 패킹(200)을 삽입하기 위한 패킹삽입홈(210)을 구성하며;A packing insertion groove 210 for inserting the annular packing 200 into the pipe coupling groove 111 of the LED lamp 100; 상기 패킹삽입홈(210)에 패킹(200)을 삽입한 후, 패킹(200)의 내측에 해당하는 파이프결합홈(111)에 실리콘을 도포하거나 방열테이프를 부착하는 것을 특징으로 하는 엘이디 조명등 냉각장치.After inserting the packing 200 into the packing insertion groove 210, LED lighting lamp cooling device, characterized in that to apply a silicone coating or heat radiation tape to the pipe coupling groove 111 corresponding to the inside of the packing 200. . 청구항 1에 있어서,The method according to claim 1, 상기 히트파이프(400)와 LED모듈안착부(130) 사이에 알루미늄 재질의 방열판(500)을 삽입하는 것을 특징으로 하는 엘이디 조명등 냉각장치.LED lighting lamp cooling device, characterized in that the heat pipe 400 and the heat sink 500 of the aluminum material is inserted between the heat pipe 400 and the LED module mounting portion 130. 청구항 1에 있어서,The method according to claim 1, 상기 엘이디 조명등(100)은 전체적으로 육면체 형상이고 전방이 개방되며, 내측에 상기 LED모듈안착부(130)가 구성되는 조명등케이스(110);The LED lamp 100 is a hexahedral shape as a whole and the front is open, the lamp case 110, the LED module seating portion 130 is configured on the inside; 상기 LED모듈안착부(130)에 안착되는 것으로, 다수의 LED(121)가 배치되어 전원공급시 전방으로 빛을 출사하는 LED모듈(120); 및It is seated on the LED module seating unit 130, the LED module 120 is disposed to emit light to the front when the power supply is disposed; And 개방되어 있는 조명등케이스(110)의 전방을 커버하는 것으로, 투명재질로 이루어지는 보호커버를 포함하여 구성되는 것을 특징으로 하는 엘이디 조명등 냉각장치.LED lighting lamp cooling device to cover the front of the open lamp case 110, including a protective cover made of a transparent material. 청구항 5에 있어서,The method according to claim 5, 상기 엘이디 조명등(100)은 조명등케이스(110)의 내측면에 형성되어 반사광이 전방으로 확산(
Figure 64f4
散)될 수 있도록 반사판을 더 구성하는 것을 특징으로 하는 엘이디 조명등 냉각장치.The LED lamp 100 is formed on the inner surface of the lamp case 110, the reflected light is diffused forward (
Figure 64f4
Iii) LED lighting lamp cooling device further comprises a reflector so that it can be. 청구항 1에 있어서,The method according to claim 1, 상기 LED모듈안착부(130)와 상기 히트파이프(400)의 교차부분에, 상기 히트파이프(400)의 중앙부분이 위치하도록 구성하는 것을 특징으로 하는 엘이디 조명등 냉각장치.LED lighting unit cooling unit, characterized in that the central portion of the heat pipe 400 is configured to be located at the intersection of the LED module seating portion 130 and the heat pipe (400). 청구항 1에 있어서,The method according to claim 1, 상기 히트파이프(400)는 다수의 히트파이프(400)를 병렬로 연이어 연결한 후, 양단이 밀폐되도록 구성하는 것을 특징으로 하는 엘이디 조명등 냉각장치.The heat pipe (400) after connecting a plurality of heat pipes in series in parallel, LED lighting lamp cooling apparatus, characterized in that the both ends are configured to be sealed.
PCT/KR2011/001534 2010-03-08 2011-03-07 Cooling apparatus for an led lamp Ceased WO2011111958A2 (en)

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