WO2011155365A1 - Article moulé présentant de fines irrégularités de surface et procédé de production associé - Google Patents
Article moulé présentant de fines irrégularités de surface et procédé de production associé Download PDFInfo
- Publication number
- WO2011155365A1 WO2011155365A1 PCT/JP2011/062473 JP2011062473W WO2011155365A1 WO 2011155365 A1 WO2011155365 A1 WO 2011155365A1 JP 2011062473 W JP2011062473 W JP 2011062473W WO 2011155365 A1 WO2011155365 A1 WO 2011155365A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- curable resin
- resin composition
- parts
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
- C08F283/126—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes on to polysiloxanes being the result of polycondensation and radical polymerisation reactions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/61—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/804—Materials of encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0053—Moulding articles characterised by the shape of the surface, e.g. ribs, high polish
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
- B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Definitions
- R 1 , R 2 and R 3 are a group having a polymerizable double bond
- the polysiloxane segment (a1) is represented by the general formula (1).
- R 1 is a group having the polymerizable double bond
- R 2 and R 3 is a group having the polymerizable double bond and the polysiloxane segment (a1) has both of the structural units represented by the general formula (1) and the general formula (2)
- R It shows that at least one of 1 , R 2 and R 3 is a group having a polymerizable double bond.
- the vinyl polymer segment (a2) can be obtained by using a polymerization initiator such as tert-butyl peroxide, cumene hydroperoxide, diisopropyl peroxycarbonate or the like.
- a photopolymerization initiator When the curable resin composition used in the present invention is cured with ultraviolet rays, which are active energy rays, it is preferable to use a photopolymerization initiator.
- Known photopolymerization initiators may be used, and for example, one or more selected from the group consisting of acetophenones, benzyl ketals, and benzophenones can be preferably used.
- the acetophenones include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 4 -(2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone and the like.
- a low pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, a xenon lamp, an argon laser, a helium / cadmium laser, an ultraviolet light emitting diode, or the like can be used.
- a low pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, a xenon lamp, an argon laser, a helium / cadmium laser, an ultraviolet light emitting diode, or the like can be used.
- ultraviolet rays having a wavelength of about 180 to 400 nm The irradiation amount of ultraviolet rays is appropriately selected depending on the type and amount of the photopolymerization initiator used.
- Examples thereof include a method, an air spray method, a brush coating, a roller coating, a trowel coating, a dipping method, a pulling method, a nozzle method, a winding method, a flow method, a piling method, and a patching method.
- the film thickness largely depends on the desired depth of the unevenness, but is preferably in the range of 0.03 ⁇ m to 300 ⁇ m.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Silicon Polymers (AREA)
- Polyurethanes Or Polyureas (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020127032370A KR101521486B1 (ko) | 2010-06-08 | 2011-05-31 | 표면에 미세한 요철을 갖는 성형체 및 그 제조 방법 |
| CN201180028661.XA CN102933633B (zh) | 2010-06-08 | 2011-05-31 | 表面具有微细凹凸的成形体及其制造方法 |
| JP2011550159A JP4985879B2 (ja) | 2010-06-08 | 2011-05-31 | 表面に微細な凹凸を有する成形体及びその製造方法 |
| US13/702,793 US20130146138A1 (en) | 2010-06-08 | 2011-05-31 | Shaped article having fine surface irregularities and method for producing the shaped article |
| DE112011101963.7T DE112011101963B4 (de) | 2010-06-08 | 2011-05-31 | Formgegenstand mit feinen Oberflächenunregelmäßigkeiten und Verfahren zur Herstellung des Formgegenstands |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-130929 | 2010-06-08 | ||
| JP2010130929 | 2010-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2011155365A1 true WO2011155365A1 (fr) | 2011-12-15 |
Family
ID=45097973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2011/062473 Ceased WO2011155365A1 (fr) | 2010-06-08 | 2011-05-31 | Article moulé présentant de fines irrégularités de surface et procédé de production associé |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130146138A1 (fr) |
| JP (1) | JP4985879B2 (fr) |
| KR (1) | KR101521486B1 (fr) |
| CN (1) | CN102933633B (fr) |
| DE (1) | DE112011101963B4 (fr) |
| TW (1) | TWI488920B (fr) |
| WO (1) | WO2011155365A1 (fr) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013125574A1 (fr) * | 2012-02-21 | 2013-08-29 | Dic株式会社 | Base de verre et stratifié de verre |
| JP2013225625A (ja) * | 2012-04-23 | 2013-10-31 | Tokuyama Corp | 光硬化性ナノインプリント用組成物およびパターンの形成方法 |
| WO2013161627A1 (fr) * | 2012-04-27 | 2013-10-31 | 日産化学工業株式会社 | Matériau d'empreinte |
| JP2014057016A (ja) * | 2012-09-14 | 2014-03-27 | Tokuyama Corp | 光硬化性ナノインプリント用組成物およびパターンの形成方法 |
| JP2014202955A (ja) * | 2013-04-05 | 2014-10-27 | 三菱レイヨン株式会社 | 微細凹凸構造体、硬化性組成物、加飾シート、および加飾樹脂成形体、並びに微細凹凸構造体、および加飾樹脂成形体の製造方法 |
| WO2015137438A1 (fr) * | 2014-03-14 | 2015-09-17 | Dic株式会社 | Matériau de réserve pour gravure au plasma d'oxygène, film de réserve, et stratifié l'utilisant |
| WO2017043344A1 (fr) * | 2015-09-09 | 2017-03-16 | 日産化学工業株式会社 | Agent de revêtement de motif inversé de planarisation contenant du silicium |
| US10137661B2 (en) | 2013-04-05 | 2018-11-27 | Mitsubishi Chemical Corporation | Microrelief structural body, decorative sheet, decorative resin molded body, method for producing microrelief structural body, and method for producing decorative resin molded body |
| JP2019167259A (ja) * | 2018-03-22 | 2019-10-03 | 株式会社豊田中央研究所 | 有機シリカ薄膜、その製造方法、それを用いたレーザー脱離イオン化質量分析用基板、及び、レーザー脱離イオン化質量分析法 |
| CN112743947A (zh) * | 2020-12-29 | 2021-05-04 | 潍坊同有新材料科技有限公司 | 一种光热双重固化振膜复合材料及其制备方法 |
| WO2022107601A1 (fr) * | 2020-11-17 | 2022-05-27 | Dic株式会社 | Composition d'encre pour jet d'encre, couche de conversion de lumière et filtre coloré |
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| US10177259B2 (en) * | 2013-06-17 | 2019-01-08 | Kaneka Corporation | Solar cell module and method for producing solar cell module |
| JP2015160759A (ja) * | 2014-02-26 | 2015-09-07 | チタン工業株式会社 | 透明導電性複合酸化物微粉末及びその製造方法並びに透明導電性膜 |
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| CN111148357B (zh) * | 2019-12-31 | 2021-06-01 | 上海冠众光学科技有限公司 | 一种层压模具的制作方法 |
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-
2011
- 2011-05-31 JP JP2011550159A patent/JP4985879B2/ja not_active Expired - Fee Related
- 2011-05-31 CN CN201180028661.XA patent/CN102933633B/zh not_active Expired - Fee Related
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- 2011-05-31 KR KR1020127032370A patent/KR101521486B1/ko not_active Expired - Fee Related
- 2011-05-31 US US13/702,793 patent/US20130146138A1/en not_active Abandoned
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| WO2013125574A1 (fr) * | 2012-02-21 | 2013-08-29 | Dic株式会社 | Base de verre et stratifié de verre |
| JP2013225625A (ja) * | 2012-04-23 | 2013-10-31 | Tokuyama Corp | 光硬化性ナノインプリント用組成物およびパターンの形成方法 |
| KR101592997B1 (ko) | 2012-04-27 | 2016-02-11 | 닛산 가가쿠 고교 가부시키 가이샤 | 임프린트 재료 |
| WO2013161627A1 (fr) * | 2012-04-27 | 2013-10-31 | 日産化学工業株式会社 | Matériau d'empreinte |
| CN103503115A (zh) * | 2012-04-27 | 2014-01-08 | 日产化学工业株式会社 | 压印材料 |
| KR20150004245A (ko) * | 2012-04-27 | 2015-01-12 | 닛산 가가쿠 고교 가부시키 가이샤 | 임프린트 재료 |
| US9631081B2 (en) | 2012-04-27 | 2017-04-25 | Nissan Chemical Industries, Ltd. | Imprint material |
| JPWO2013161627A1 (ja) * | 2012-04-27 | 2015-12-24 | 日産化学工業株式会社 | インプリント材料 |
| CN103503115B (zh) * | 2012-04-27 | 2016-01-13 | 日产化学工业株式会社 | 压印材料 |
| JP2014057016A (ja) * | 2012-09-14 | 2014-03-27 | Tokuyama Corp | 光硬化性ナノインプリント用組成物およびパターンの形成方法 |
| JP2014202955A (ja) * | 2013-04-05 | 2014-10-27 | 三菱レイヨン株式会社 | 微細凹凸構造体、硬化性組成物、加飾シート、および加飾樹脂成形体、並びに微細凹凸構造体、および加飾樹脂成形体の製造方法 |
| US10137661B2 (en) | 2013-04-05 | 2018-11-27 | Mitsubishi Chemical Corporation | Microrelief structural body, decorative sheet, decorative resin molded body, method for producing microrelief structural body, and method for producing decorative resin molded body |
| JP5871203B1 (ja) * | 2014-03-14 | 2016-03-01 | Dic株式会社 | 酸素プラズマエッチング用レジスト材料、レジスト膜、及びそれを用いた積層体 |
| WO2015137438A1 (fr) * | 2014-03-14 | 2015-09-17 | Dic株式会社 | Matériau de réserve pour gravure au plasma d'oxygène, film de réserve, et stratifié l'utilisant |
| WO2017043344A1 (fr) * | 2015-09-09 | 2017-03-16 | 日産化学工業株式会社 | Agent de revêtement de motif inversé de planarisation contenant du silicium |
| JPWO2017043344A1 (ja) * | 2015-09-09 | 2018-07-19 | 日産化学工業株式会社 | シリコン含有平坦化性パターン反転用被覆剤 |
| US10508174B2 (en) | 2015-09-09 | 2019-12-17 | Nissan Chemical Industries, Ltd. | Silicon-containing coating agent for reversing planarization pattern |
| JP2019167259A (ja) * | 2018-03-22 | 2019-10-03 | 株式会社豊田中央研究所 | 有機シリカ薄膜、その製造方法、それを用いたレーザー脱離イオン化質量分析用基板、及び、レーザー脱離イオン化質量分析法 |
| WO2022107601A1 (fr) * | 2020-11-17 | 2022-05-27 | Dic株式会社 | Composition d'encre pour jet d'encre, couche de conversion de lumière et filtre coloré |
| JP7151929B1 (ja) * | 2020-11-17 | 2022-10-12 | Dic株式会社 | インクジェット用インク組成物、光変換層及びカラーフィルタ |
| CN112743947A (zh) * | 2020-12-29 | 2021-05-04 | 潍坊同有新材料科技有限公司 | 一种光热双重固化振膜复合材料及其制备方法 |
| CN112743947B (zh) * | 2020-12-29 | 2022-08-16 | 潍坊同有新材料科技有限公司 | 一种光热双重固化振膜复合材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4985879B2 (ja) | 2012-07-25 |
| TW201204788A (en) | 2012-02-01 |
| CN102933633A (zh) | 2013-02-13 |
| KR20130040907A (ko) | 2013-04-24 |
| JPWO2011155365A1 (ja) | 2013-08-01 |
| US20130146138A1 (en) | 2013-06-13 |
| TWI488920B (zh) | 2015-06-21 |
| CN102933633B (zh) | 2014-09-17 |
| KR101521486B1 (ko) | 2015-05-20 |
| DE112011101963T5 (de) | 2013-04-11 |
| DE112011101963B4 (de) | 2017-06-08 |
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