WO2011150798A1 - Tec refrigerating installation and electrical apparatus using same - Google Patents

Abstract

A thermoelectric cooling module TEC refrigerating installation comprises a TEC module, a first heat exchanging device and a second heat exchanging device. The TEC module includes a cold end and a hot end opposite to each other. The first heat exchanging device is disposed at the cold end of the TEC module for heat exchanging with medium around the cold end of the TEC module. The second heat exchanging device is disposed at the hot end of the TEC module, including an evaporating end and a condensing end. The second heat exchanging device is provided with cooling medium inside used for heat exchanging by phase change between the evaporating end and the condensing end. The evaporating end abuts on the hot end of the TEC module. The TEC refrigerating installation can increase the efficiency of heat exchanging by employing the second heat exchanging device, enabling energy saving and environmental protection.

Description

 TEC refrigerating device and electric device therefor The present application claims to be Chinese patent filed on November 25, 2010, the Chinese Patent Office, application number 201010559094.8, the invention titled "a TEC refrigeration device and its application of electrical devices" Priority of the application, the entire contents of which are incorporated herein by reference. Technical field

 The present invention relates to a refrigeration apparatus, and more particularly to a TEC refrigeration apparatus and an electrical apparatus therefor.

Background technique

 In the field of communications, electronic devices have high requirements for the temperature of the working environment. The communication device generally dissipates heat during operation, and the accumulated heat is concentrated in the environment around the electronic device, causing the working environment temperature of the electronic device to rise. When the temperature is high enough, the electronics will not work properly. In order to ensure that the electronics can work properly, it is often necessary to install a refrigerating air conditioner for the electronics. However, the large size of refrigeration and air conditioning is inconsistent with the current trend of miniaturization of equipment; in addition, the refrigerant used in refrigeration and air conditioning has a large environmental pollution and does not conform to the current concept of green environmental protection. Therefore, the TEC module (The Thermoelectric Cooling Module) is an ideal replacement for refrigeration and air conditioning because of its small size and no refrigerant. The TEC module typically includes a cold end and a hot end. In order to improve the cooling efficiency of the TEC module, a fan is usually disposed at the cold end and the hot end of the TEC module, and the heat dissipation efficiency of the TEC module is controlled by controlling the rotation speed of the fan. However, the TEC module of this structure has high noise and high power consumption, and does not conform to the concept of green environmental protection. Therefore, how to reduce the energy consumption of the TEC module has become an urgent problem to be solved. Summary of the invention

Embodiments of the present invention provide a low energy-consuming, environmentally-friendly TEC refrigeration device, and an electrical device using the TEC refrigeration device. A TEC refrigeration device includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end opposite the cold end. The first heat exchange device is disposed at a cold end of the TEC module for heat exchange with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at a hot end of the TEC module, the second heat exchange device includes an evaporation end and a condensation end, and the evaporation end is adjacent to or in contact with a hot end of the TEC module, The condensation end is away from the evaporation end; a cooling medium is disposed in the second heat exchange device, and the cooling medium is used for heat exchange in a phase change manner at the evaporation end and the condensation end.

 An electrical device comprising a TEC refrigerating device that is rejected by the machine and disposed on the machine, the machine rejecting the body. The TEC refrigeration unit includes a TEC module, a first heat exchange unit, and a second heat exchange unit. The TEC module includes a cold end and a hot end opposite the cold end. The first heat exchange device is disposed at a cold end of the TEC module and is coupled to the reject. The second heat exchange device is disposed at a hot end of the TEC module, the second heat exchange device includes an evaporation end and a condensation end, and the evaporation end is adjacent to or in contact with a hot end of the TEC module. The condensing end is away from the evaporation end; a cooling medium is disposed in the second heat exchange device, and the cooling medium is used for heat exchange in a phase change manner at the evaporation end and the condensation end.

 The TEC refrigerating device and the electric device therefor according to the embodiments of the present invention use a second heat exchange device capable of rapid heat dissipation to accelerate heat exchange with the hot end of the TEC module, thereby improving heat exchange rate without A fan needs to be placed at the hot end of the TEC module, which saves energy and achieves environmental protection.

DRAWINGS

 1 is a schematic view of an electrical device according to a first embodiment of the present invention;

 2 is a schematic diagram of an electrical device according to a second embodiment of the present invention.

detailed description

Embodiments of the present invention provide a thermoelectric refrigeration module (TEC) refrigeration device, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end opposite the cold end. The first heat exchange device is disposed at a cold end of the TEC module for heat exchange with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at a hot end of the TEC module, and the second heat exchange device includes an evaporation end And a condensing end, wherein the second heat exchange device is provided with a cooling medium, wherein the cooling medium is used for heat exchange in a phase change manner at the evaporation end and the condensation end, and the evaporation end and the TEC module heat The ends are adjacent.

 The TEC refrigeration device provided by the embodiment of the invention uses a second heat exchange device capable of rapid heat dissipation to accelerate heat exchange with the hot end of the TEC module, thereby improving heat exchange rate, thereby achieving energy saving and environmental protection. . The invention will be described in detail below with reference to the accompanying drawings.

 Referring to FIG. 1 , a schematic diagram of an electrical device 10 according to a first embodiment of the present invention includes a machine rejection 100 and a TEC refrigeration device 200 disposed on the machine rejection 100.

 The machine reject 100 includes a reject 120, a plurality of electrical components 140 disposed within the reject 120, and a protective cover 130 disposed on the side of the reject 100.

 The TEC refrigeration device 200 is disposed on the reject body 120 for cooling the electrical component 140 in the reject body 120. The protective cover 130 is disposed on the TEC refrigeration device 200 to protect the TEC refrigeration device. 200.

 The TEC refrigeration unit 200 includes a TEC module 210, a first heat exchange unit 220, and a second heat exchange unit 230.

 The TEC module 210 is a refrigeration element that includes a cold end 212 and a hot end 214 opposite the cold end 212. The cold end 212 is capable of absorbing heat around it and the hot end 214 is for dissipating heat to the surroundings.

 During use, the cold end 212 of the TEC module 210 needs to correspond to or contact the heat source to absorb the heat of the heat source to cool the heat source, and the hot end 214 is used to dissipate the heat absorbed by the cold end 212 to the outside.

 In this embodiment, in order to increase or decrease the heat dissipation efficiency of the hot end 214 of the TEC module 210, a heat conducting plate 216 may be disposed on the hot end 214, and the heat conducting plate 216 is preferably made of a high thermal conductive material such as copper, aluminum or alloy. And made of thermally conductive graphite. A thermally conductive filler may also be filled between the contact interface of the heat conducting plate 216 and the hot end 214 to increase the contact area between the heat conducting plate 216 and the hot end 214 to reduce thermal resistance and improve heat transfer efficiency.

The first heat exchange device 220 is disposed at the cold end 212 of the TEC module 210 and is coupled to the machine reject 120. In the embodiment, the first heat exchange device 220 is located inside the machine 100 to increase the heat exchange area of the cold end 212 of the TEC module 210, thereby improving heat exchange. effectiveness.

 In this embodiment, the first heat exchange device 220 may be an array of heat dissipation fins made of a highly thermally conductive material such as copper, aluminum, or thermally conductive graphite. The first heat exchange device 220 may also employ a heat transfer device such as a heat pipe, a thermosiphon, or a steam chamber.

 The second heat exchange device 230 is disposed at the hot end 214 of the TEC module 210 for

The heat at the hot end 214 of the TEC module 210 accelerates diffusion.

 In this embodiment, the second heat exchange device 230 includes an evaporation end 232, a condensation end 234, and a second heat exchange device 230 for phase change between the evaporation end 232 and the condensation end 234. A cooling medium 236 that performs heat exchange.

 The evaporation end 232 is adjacent or in contact with the hot end 214 of the TEC module 210, and the condensation end 234 is remote from the evaporation end 232.

 In this embodiment, the evaporation end 232 is disposed on the heat conducting plate 216 of the TEC module 210. In order to further increase the heat exchange rate of the second heat exchange device 230 with the surrounding environment, a plurality of heat dissipation plates 238 may be disposed on the second heat exchange device 230. The heat dissipation plate 238 is evenly disposed between the evaporation end 232 and the condensation end 234 to increase the contact area of the second heat exchange device 230 with the surrounding space, so that the second heat is generated by natural convection of the air. The heat on the switching device 230 is carried away.

 The second heat exchange device 230 is located outside the reject body 100 and is thermally insulated from the internal space of the reject body 100. The protective cover 130 houses the second heat exchange device 230 therein.

 The second heat exchange device 230 in this embodiment may be a high heat conduction device such as a heat pipe, a thermosiphon, or a steam chamber.

In use, the TEC refrigeration device 200 cools and cools the internal space of the reject 100 through the cold end 212 of the TEC module 210, thereby ensuring that the electrical component 140 disposed within the reject 100 operates at an appropriate temperature. The evaporation end 232 of the second heat exchange device 230 disposed at the hot end 214 of the TEC module 210 will absorb the heat dissipated by the hot end 214 to vaporize the cooling medium 236 at the location of the evaporation end 232. The vaporized cooling medium 236 will move toward the condensing end 234 of the second heat exchange device 230 and condense at the condensing end 234 to vent heat. The second heat exchange device 230 performs rapid transfer and dissipation of heat through the cyclic phase change between the condensation end 234 and the evaporation end 232 of the cooling medium 236, thereby achieving the purpose of internally reducing the temperature of the machine 100. The TEC refrigeration device 200 accelerates heat exchange with the hot end 214 of the TEC module 210 by employing a second heat exchange device 230 that can perform rapid heat dissipation, thereby increasing heat exchange rate without requiring the TEC module A fan is provided at the hot end 214 of the 210, which saves energy and reduces noise to achieve environmental protection.

 In order to be able to uniformly cool the interior of the machine 100, the TEC refrigeration unit 200 may also include a cold end fan 240. The cold end fan 240 is disposed outside the first heat exchange device 220 to speed up the convection speed of the medium in the space where the first heat exchange device 220 is located, thereby achieving uniform cooling of the TEC refrigeration device 200. purpose.

 Referring to FIG. 2, a schematic diagram of an electrical device 20 according to a second embodiment of the present invention includes a machine rejection 300 and a TEC refrigeration device 400 disposed on the machine rejection 300.

 The machine reject 300 includes a reject body 310, a plurality of electrical components 320 disposed within the reject body 310, and a protective cover 330 disposed on the side of the reject body 300.

 The TEC refrigeration unit 400 includes a TEC module 410, a first heat exchange unit 440, and a second heat exchange unit 430.

 The TEC module 410 includes a cold end 412 and a hot end 414 opposite the cold end. The first heat exchange device 440 and the second heat exchange device 430 are disposed on the cold end 412 and the hot end 414 of the TEC module 410, respectively.

 In this embodiment, the TEC module 410 further includes a heat conducting plate 416 disposed between the hot end 414 and the second heat exchange device 430 for conducting heat.

 The first heat exchange device 440 includes a heat slug 422, a first heat conducting member 424, a temperature controlled phase change module 426, and a second heat conducting member 428.

 The heat slug 422 is disposed at the cold end 412 of the TEC module 410. One end of the first heat conducting member 424 is disposed on the heat dissipating block 422 and is in contact with the heat dissipating block 422, and the other end of the first heat conducting member 424 is connected to the temperature control phase change module 426.

 The first heat conducting member 424 in this embodiment may be a high heat conducting device such as a heat pipe, a thermosiphon or a steam chamber, and includes an evaporation end 424a and a condensation end 424b. The condensation end 424b is disposed on the heat sink block 422, and the evaporation end 424a is coupled to the temperature control phase change module 426.

The temperature control phase change module 426 is disposed on the reject body 310 of the machine rejection 300, and the temperature control phase change module 426 can be made of a phase change material such as a paraffin material. The temperature control phase change module 426 may exhibit different states at different temperatures to accumulate a certain amount of thermal energy or cold energy, thereby ensuring that the temperature inside the machine rejection 300 does not change drastically and affects the operation of the electrical component 320. .

 One end of the second heat conducting member 428 is disposed on the temperature control phase change module 426, and the other end extends into the reject body 310. The second heat conducting member 428 in this embodiment may employ the same high heat conducting device as the first heat conducting member 424 and includes an evaporation end 428a and a condensation end 428b. The condensation end 428b of the second heat conducting member 428 is disposed on the temperature controlled phase change module 426, and the evaporation end 428a extends into the reject body 310.

 It can be understood that the evaporation end and the condensation end of the first heat conducting member 424 and the second heat conducting member 428 are not fixed, and the condensation end and the evaporation end are defined according to the temperature difference between the two ends of the heat conducting member, for example, the temperature is high. One end is the evaporation end, and the lower one is the condensation end.

 The second heat exchange device 430 is disposed at the hot end 414 of the TEC module 410. In this embodiment, the second heat exchange device 430 includes an evaporation end 432, a condensation end 434, and a second heat exchange device 430 for phase change at the evaporation end 432 and the condensation end 434. A cooling medium 436 that performs heat exchange.

 The evaporation end 432 is adjacent or in contact with the hot end 414 of the TEC module 410, and the condensation end 434 is remote from the evaporation end 432. In this embodiment, the evaporation end 432 is disposed on the heat conducting plate 416 of the TEC module 410.

 In order to further increase the heat exchange rate of the second heat exchange device 430 with the surrounding environment, a plurality of heat dissipation plates 438 may be disposed on the second heat exchange device 430. The heat dissipation plate 438 is evenly disposed between the evaporation end 432 and the condensation end 434 for increasing the contact area of the second heat exchange device 430 with the surrounding space, so as to be the second by the natural convection of the air. The heat on the heat exchange device 430 is carried away.

 The second heat exchange device 430 is located outside the reject body 300 and is thermally insulated from the internal space of the reject body 300. The protective cover 330 houses the second heat exchange device 430 therein.

 The second heat exchange device 430 in this embodiment may be a high heat conduction device such as a heat pipe, a thermosiphon, or a steam chamber.

The TEC refrigeration device 400 provided in this embodiment accelerates heat exchange with the hot end 414 of the TEC module 410 by using a second heat exchange device 430 capable of rapid heat dissipation, thereby generating heat. The exchange rate does not require a fan to be placed at the hot end 414 of the TEC module 410, which saves energy while reducing noise for environmental protection. In addition, the temperature control phase change module 426 of the first heat exchange device 420 stores a certain amount of thermal energy or cold energy, so that the temperature in the machine rejection 300 can be maintained within a certain range, so that the TEC refrigeration device 400 and the use thereof The electrical device 20 of the TEC refrigeration unit 400 is capable of maintaining a relatively stable operating temperature in a large temperature differential environment.

 The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., which are within the spirit and scope of the present invention, should be included in the protection of the present invention. Within the scope.

Claims

Rights request  A thermoelectric refrigeration module TEC refrigeration device, characterized in that the TEC refrigeration device comprises a TEC module, a first heat exchange device, and a second heat exchange device;  The TEC module includes a cold end and a hot end opposite the cold end;  The first heat exchange device is disposed at a cold end of the TEC module for heat exchange with a medium surrounding the cold end of the TEC module;  The second heat exchange device is disposed at a hot end of the TEC module; the second heat exchange device includes an evaporation end and a condensation end, and the evaporation end is adjacent to or in contact with a hot end of the TEC module. Said condensation end is away from said evaporation end;  A cooling medium is disposed in the second heat exchange device, and the cooling medium is used for heat exchange in a phase change manner at the evaporation end and the condensation end.  2. The TEC refrigeration apparatus according to claim 1, wherein the first heat exchange device is an array of heat dissipation fins and is made of copper, aluminum, or thermally conductive graphite.  3. The TEC refrigeration unit of claim 1 wherein said TEC refrigeration unit further comprises a cold end fan, said cold end fan being disposed outside said first heat exchange unit.  The TEC refrigeration device according to claim 1, wherein the first heat exchange device comprises a heat dissipation block, a first heat conduction member, a temperature control phase change module, and a second heat conduction member;  The heat dissipation block is disposed at a cold end of the TEC module;  One end of the first heat conducting member is disposed on the heat dissipation block, and the other end of the first heat conducting member is connected to the temperature control phase change module;  The second heat conducting member is disposed on the temperature control phase change module through one end.  The TEC refrigerating apparatus according to claim 4, wherein the first heat conducting member is a heat pipe, a thermosiphon or a steam chamber;  The first heat-conducting member includes an evaporation end and a condensation end, and a condensation end of the first heat-conducting member is disposed on the heat-dissipating block, and an evaporation end of the first heat-conducting member is connected to the temperature-controlled phase change module .  The TEC refrigerating apparatus according to claim 4, wherein the second heat conducting member is a heat pipe, a thermosiphon or a steam chamber; The second heat conducting member includes an evaporation end and a condensation end, and the second heat conducting member passes through the condensation end thereof It is disposed on the temperature control phase change module.  The TEC refrigerating apparatus according to any one of claims 1 to 6, wherein the TEC module further comprises a heat conducting plate, the heat conducting plate is disposed at a hot end of the TEC module, and the second The evaporation end of the heat exchange device is placed on the heat conducting plate of the TEC module.  The TEC refrigerating apparatus according to claim 1, wherein the second heat exchange device further comprises a plurality of heat dissipating plates, wherein the heat dissipating plates are intermittently disposed between the evaporation end and the condensation end .  An electrical device comprising: a thermoelectric refrigeration module TEC refrigeration device that is disposed on the machine and rejected by the machine, the machine rejection comprising a reject body, wherein the TEC refrigeration device comprises a TEC module, the first heat exchange a device, and a second heat exchange device;  The TEC module includes a cold end and a hot end opposite the cold end;  The first heat exchange device is disposed at a cold end of the TEC module and connected to the reject body for heat exchange with a medium surrounding the cold end of the TEC module;  The second heat exchange device is disposed at a hot end of the TEC module; the second heat exchange device includes an evaporation end and a condensation end, and the evaporation end is adjacent to or in contact with a hot end of the TEC module. Said condensation end is away from said evaporation end;  A cooling medium is disposed in the second heat exchange device, and the cooling medium is used for heat exchange in a phase change manner at the evaporation end and the condensation end.  10. The electrical device according to claim 9, wherein the first heat exchange device is an array of heat dissipation fins and is made of copper, aluminum, or thermally conductive graphite.  11. The electrical device according to claim 9, wherein the first heat exchange device comprises a heat dissipation block, a first heat conduction member, a temperature control phase change module, and a second heat conduction member;  The heat dissipation block is disposed at a cold end of the TEC module;  One end of the first heat conducting member is disposed on the heat dissipation block, and the other end of the first heat conducting member is connected to the temperature control phase change module;  The temperature control phase change module is disposed on the machine to reject;  One end of the second heat conducting member is disposed on the temperature control phase change module, and the other end of the second heat conducting member extends into the interior of the machine. 12. The electrical device according to claim 11, wherein the first heat conducting member is hot Tube, thermosiphon or steam chamber; and,  The first heat-conducting member includes an evaporation end and a condensation end, and a condensation end of the first heat-conducting member is disposed on the heat-dissipating block, and an evaporation end of the first heat-conducting member is connected to the temperature-controlled phase change module .  13. The electrical device according to claim 11, wherein the second heat conducting member is a heat pipe, a thermosiphon or a steam chamber;  The second heat-conducting member includes an evaporation end and a condensation end, and the second heat-conducting member is disposed on the temperature-controlled phase change module through a condensation end thereof, and the evaporation end of the second heat-conducting member is located at the machine internal.  The electrical device according to any one of claims 9 to 13, wherein the TEC module further comprises a heat conducting plate, the heat conducting plate is disposed at a hot end of the TEC module, and the second heat The evaporation end of the exchange device is placed on the heat conducting plate of the TEC module.  The electric device according to claim 9, wherein the second heat exchange device further comprises a plurality of heat dissipation plates, and the heat dissipation plates are evenly disposed between the evaporation end and the condensation end.