WO2011034290A2 - Cooling apparatus and cooling method for an indirect extruder - Google Patents

Abstract

The present invention relates to a cooling apparatus and to a cooling method for an indirect extruder, wherein the technical aim of the present invention is to provide a cooling apparatus and a cooling method for an indirect extruder, which enable a cooling medium to flow through a stem and a die, and which directly inject the cooling medium into an extrudate in the die, to thereby prevent the temperature of the extrudate from excessively rising and thus improving the speed of extrusion. For this purpose, the cooling apparatus for an indirect extruder according to the present invention comprises a stem, a die and a billet. The stem has an outer surface on which a plurality of cooling medium injection ports are formed such that a cooling medium can be supplied therethrough, and has an interior in which a plurality of cooling medium conveying pipes are connected to the respective cooling medium injection ports to enable the cooling medium to flow toward the ends of the cooling medium conveying pipes. The die is connected to an end of the stem, and has an interior in which a plurality of cooling medium dispersing pipes are formed to disperse the cooling medium conveyed through the cooling medium conveying pipes, and has an outer surface on which a cooling medium dispersing groove is formed. The cooling medium dispersing groove has dispersing holes connected to the cooling medium dispersing pipes such that the cooling medium conveyed through the cooling medium conveying pipes is uniformly supplied to the cooling medium dispersing pipes via the dispersing holes. The billet is arranged at an end of the die to shape the extrudate that has been extruded through the stem and the die by indirect extrusion. The cooling medium cools the die while passing through the cooling medium dispersing pipes, and cools the extrudate while being directly injected into the extrudate after passing through the cooling medium dispersing pipes.

Description

Indirect Extruder Chiller and Cooling Method

The present invention relates to a cooling apparatus and a cooling method for an indirect extruder, and more particularly to a cooling apparatus and a cooling method for an indirect extruder by increasing the extrusion speed by directly injecting a cooling medium to the extrusion material of the indirect extruder.

Extrusion processing is a method in which the material inserted into the resistant tool is molded by applying pressure from one side to a gap made in the tool, and the shape of the extruded material changes according to the shape of the gap.

At this time, when the outflow direction of the material is the same as the travel direction of the tool, it is called forward extrusion, forward extrusion, direct extrusion, and the like, and in the opposite direction, reverse extrusion, backward extrusion, indirect extrusion, and the like.

Because of the frictional force acting between the tool and the material, the extrusion force on the positive extrusion side is increased, so the reverse force is advantageous in terms of the required force. However, in the case of the reverse extrusion, the strength and dimensions of the tool are limited, and the surface oxide film remains as it is. It is easy to appear on the product surface.

In extrusion, lubrication is an important issue because friction greatly affects the flow of material. Impact extruders with very high processing speeds and liquid extruders for placing high pressure liquids into tools have also been developed.

On the other hand, the cooling apparatus applied to the extrusion process can be largely divided into a method of cooling the die by passing the cooling medium into the die and a method of directly cooling the extruded material by spraying the cooling medium on the extrusion material passed through the die.

In the direct extrusion method most widely used in the current industrial field, the die and the extrudate are easily cooled because the die is fixed and the extrudate passed through the die is immediately exposed to the extruder.

However, unlike the direct extrusion method, the indirect extrusion method, which is mainly used for the extrusion of high strength / low extrudable materials such as high strength aluminum alloys, not only the stem and the die connected thereto are located inside the container of high temperature during the extrusion process, Since it takes a long time to pass through the long stem to the outside of the extrusion apparatus, it is difficult to apply the cooling method applied in the existing direct extrusion process or there is a problem of relatively low cooling efficiency.

To date, a cooling device for an indirect extruder has been proposed to cool the stem and die by transferring a cooling medium such as liquid nitrogen through lines attached to the inside and outside of the stem.

However, since this method is an indirect cooling method for cooling extrusion element devices such as stems and dies, it is difficult to efficiently control heat generated by friction between the die and the extruded material and deformation of the extruded material during the extrusion process. Therefore, there is a problem in that there is a limit in suppressing the occurrence of surface defects of the extrudate due to the temperature increase.

The present invention has been made to solve the problems as described above, by moving the cooling medium through the stem and the die, and spraying it directly to the extrusion material in the die to suppress excessive temperature rise of the extrusion material to increase the extrusion speed An object of the present invention is to provide a cooling device and a cooling method for an indirect extruder.

Another object of the present invention is to provide a cooling apparatus and a cooling method for an indirect extruder that can extend the life of the extruder element parts.

In order to achieve the above object, the indirect extruder cooling apparatus according to the present invention has a plurality of cooling medium inlets for supplying a cooling medium formed on an outer circumferential surface thereof and connected to the cooling medium inlets to move the cooling medium to the end. A plurality of cooling medium transfer pipes are formed therein, and a plurality of cooling medium dispersion pipes connected to the end of the stem and dispersing the cooling medium moved through the cooling medium transfer pipe are formed therein. A die having a plurality of dispersion holes connected to a dispersion pipe and having a cooling medium dispersion groove formed at the outside to uniformly supply the cooling medium moved through the cooling medium transfer pipe to the cooling medium dispersion pipe through the distribution hole; A billet forming an extrudate through the inner circumference of the die and stem by indirect extrusion at the end of the die The thermocouple is seated in a thermocouple groove continuously formed on an outer circumferential surface of the stem and the die, wherein the cooling medium cools the stem while passing through the cooling medium transfer pipe and cools the die while passing through the cooling medium dispersion pipe. And after passing through the cooling medium dispersion pipe is directly sprayed on the extruded material characterized in that for cooling the extruded material.

In addition, the cooling medium dispersion groove may be formed in a ring shape having a radially equal distance from the inner peripheral surface of the die, the dispersion hole may be formed having the same rotational movement distance in the cooling medium dispersion groove.

In addition, one end of the cooling medium dispersion pipe may be connected to the distribution hole, and the other end may be connected to the inner circumferential surface of the die.

In addition, the cooling medium may be air, water, inert gas, or liquefied nitrogen.

In addition, the die may pass through the inside, one end is connected to the thermocouple groove of the die, the other end may be formed with a thermocouple hole is located adjacent to the extruded material.

In addition, the apparatus for cooling an indirect extruder according to the present invention includes a plurality of cooling medium transfer pipes having a plurality of cooling medium inlets formed on the outer circumferential surface thereof and connected to the cooling medium inlets to move the cooling medium to the ends. A dispersion hole formed therein and a plurality of cooling medium dispersion pipes connected to an end of the stem and dispersing the cooling medium moved through the cooling medium transfer pipe and connected to the cooling medium dispersion pipe Indirectly extruded from the end of the die and the end of the die is formed with a plurality of cooling medium dispersion grooves for uniformly supplying the cooling medium moved through the cooling medium transfer pipe to the cooling medium dispersion pipe through the distribution hole And a billet forming an extruded material that penetrates the die and the interior of the stem, wherein the billet is formed on the outer peripheral surface of the stem and the die. The thermocouple is seated in a thermocouple groove continuously formed in the groove, and the cooling medium dispersion groove is formed in a ring shape having a radially equal distance from the center of the die, and the dispersion hole is formed in the upper, lower, left sides of the cooling medium dispersion groove. A hollow portion formed at right intervals of 90 degrees and formed inside the die to form the extruded material by indirect extrusion, wherein the cooling medium passes through the cooling medium transfer pipe and moves the stem. Cooling the die while cooling and passing through the cooling medium dispersion pipe, and after passing through the cooling medium dispersion pipe is directly injected into the extruded material to cool the extruded material.

In addition, the cooling medium dispersion groove may further include a dispersion hole formed at equal intervals on both sides of the same straight line with respect to the dispersion holes formed in the upper and lower portions.

In addition, the hollow portion of the die may increase in cross-sectional area by increasing the horizontal and vertical lengths from the end of the die forming the extruded material by indirect extrusion to the portion connected to the end of the stem.

In addition, one end of the cooling medium dispersion pipe may be connected to the distribution hole, and the other end may be connected to the inner surface of the hollow part.

In addition, the cooling medium may be air, water, inert gas, or liquefied nitrogen.

In addition, the die may pass through the inside, one end is connected to the thermocouple groove of the die, the other end may be formed with a thermocouple hole is located adjacent to the extruded material.

In addition, the cooling method of the indirect extruder according to the present invention is a cooling medium injecting step of injecting a cooling medium into the stem, and the first cooling medium is transferred to the end of the stem and the cooling medium passes through the inside of the stem And a cooling medium dispersion step in which the cooling medium is uniformly distributed into the die connected to the end of the stem, and a second transfer of the cooling medium through the inside of the die and moved to the end of the die. And a cooling medium spraying step in which the cooling medium is directly injected into the extruded material passing through the inner circumferential surface or the hollow portion of the die.

In addition, the first cooling medium transfer step is to move the cooling medium to the end of the stem through the cooling medium transfer pipe formed in the inside of the stem to cool the stem.

In addition, the cooling medium dispersing step is a homogenization process in which the cooling medium is supplied to the cooling medium dispersion groove of the die connected to the end of the stem and uniformized, and through the dispersion hole formed in the cooling medium dispersion groove. It may include a dispersion process to be dispersed in a cooling medium dispersion tube formed in the die.

In the second conveying step of the cooling medium, the cooling medium may be moved to an end of the die through a cooling medium distribution tube formed in the die, and the die may be cooled.

As described above, the indirect extruder cooling apparatus and the cooling method according to the present invention are a cooling method in which the high-pressure cooling medium is in direct contact with the extruder and the extruder element parts. Prevention increases the extrusion speed and extends the life of the extruder components.

1 is a schematic view of a cooling apparatus for an indirect extruder according to a first embodiment of the present invention.

Figure 2 is a schematic diagram showing the front portion of the die of the cooling apparatus for indirect extruder according to the first embodiment of the present invention.

Figure 3 is a schematic diagram showing a side cross-section of the die of the cooling apparatus for indirect extruder according to the first embodiment of the present invention.

Figure 4 is a photograph of the back of the die of the cooling apparatus for indirect extruder according to the first embodiment of the present invention.

5 is a schematic view of a cooling apparatus for an indirect extruder according to a second embodiment of the present invention.

Figure 6 is a schematic diagram showing the front of the die of the cooling apparatus for indirect extruder according to a second embodiment of the present invention.

Figure 7 is a schematic diagram showing a side cross-section of the die of the cooling apparatus for indirect extruder according to a second embodiment of the present invention.

Figure 8 is a schematic diagram showing a cross-section of the die of the cooling apparatus for indirect extruder according to a second embodiment of the present invention.

Figure 9 is a photograph of the back of the die of the cooling apparatus for indirect extruder according to a second embodiment of the present invention.

10 is a block diagram of a cooling method of an indirect extruder according to an embodiment of the present invention.

11 is a block diagram of a cooling medium dispersion step of the cooling method of the indirect extruder according to an embodiment of the present invention.

12 is an indirect extrusion of the AZ61 alloy indirectly extruded without using a cooling device for an indirect extruder according to the first embodiment of the present invention when indirectly extruded at 250 ° C billet temperature, extrusion rate 25, ram speed 8.5 mm / s conditions Exterior Photo.

13 is an appearance of an extruded material indirectly extruded using an indirect extruder cooling apparatus according to the first embodiment of the present invention when the AZ61 alloy is indirectly extruded at a condition of an initial billet temperature of 250 ° C., an extrusion ratio of 25, and a ram speed of 8.5 mm / s. Picture.

** Explanation of symbols for main parts of drawings **

10: Stem 11: Cooling medium inlet

12: Cooling medium transfer pipe 13, 25: Thermocouple groove

20: Die 21: Cooling medium distribution groove

22: dispersion hole 23: cooling medium dispersion pipe

24: thermocouple hall 26: hollow

30: Billet 40: Extrusion material

50: extrusion container 60: thermocouple

S10: cooling medium injection step

S20: Cooling medium first transfer step

S30: cooling medium dispersion step

S31: Homogenization Process

S32: Dispersion Process

S40: second step of cooling medium

S50: cooling medium spraying step

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; First, it should be noted that the same components or parts in the drawings represent the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the gist of the present invention.

1 is a schematic view of a cooling apparatus for an indirect extruder according to a first embodiment of the present invention, Figure 2 is a schematic view showing a front portion of a die of the cooling apparatus for an indirect extruder according to a first embodiment of the present invention. 3 is a schematic diagram illustrating a side cross-section of the die, and FIG. 4 is a photograph of the back of the die.

As shown in FIG. 1, a cooling apparatus for an indirect extruder according to a first embodiment of the present invention includes a stem 10, a die 20, a billet 30, and the stem 10 and the die 20. And an extrusion container 50 covering the billet 30.

The stem 10 includes a plurality of cooling medium inlets 11 and a plurality of cooling medium conveying tubes 12.

The cooling medium inlet 11 is an inlet through which a cooling medium is supplied into the stem 10 and is formed on an outer circumferential surface of the stem 10.

The cooling medium may be air, water, inert gas, or liquefied nitrogen. In this case, the cooling medium is preferably injected into the stem 10 by a high pressure.

The cooling medium transfer pipe 12 is formed inside the stem 10, and one end thereof is connected to the cooling medium inlet 11, and transfers the cooling medium supplied to the cooling medium inlet 11 to the cooling medium. Move to die 20 connected to end of tube 12.

Therefore, the cooling medium moving through the cooling medium transfer pipe 12 may suppress excessive temperature rise of the stem 10 to prolong the life of the stem 10.

The die 20 is connected to the end of the stem 10, and as shown in FIGS. 1 to 4, the die 20 includes a plurality of cooling medium dispersion pipes 23 and cooling medium dispersion grooves 21.

The cooling medium dispersion pipe 23 is formed in the die 20, as shown in Figures 1 to 3, one end is connected to the dispersion hole 22 to be described later, the other end is the die ( It is connected to the inner peripheral surface of 20 to distribute the cooling medium moved through the cooling medium transfer pipe 12 into the die 20.

The cooling medium dispersion groove 21 is formed on the outside of the die 20, specifically, on the outer peripheral bottom surface of the die 20, and the dispersion hole 22 connected to the cooling medium dispersion pipe 23 in the groove. It is formed in plurality.

The cooling medium dispersion groove 21 may be formed in a ring shape having the same separation distance radially from the inner peripheral surface of the die 20, the dispersion hole 22 is the same rotation in the cooling medium dispersion groove 21 It can be formed having a moving distance.

The cooling medium dispersion groove 21 uniformly supplies the cooling medium moved through the cooling medium transfer pipe 12 to the cooling medium dispersion pipe 23 through the dispersion hole 22.

Therefore, the cooling medium may extend the life of the die 20 by cooling the die 20 while penetrating the cooling medium dispersion pipe 23, and after passing through the cooling medium dispersion pipe 23, The extruded material 40 may be cooled while being directly injected into the extruded material 40 to be described later penetrating the inner circumferential surface of the die 20.

The cooling medium dispersing pipe 23 and the cooling medium dispersing hole 22 may be formed at various positions of the die 20 to cool the extruding material having various shapes. The indirect extruder according to the first embodiment of the present invention. In the case of using a cooling device for cooling, the rod-like extruded material can be cooled.

On the other hand, the cooling apparatus for indirect extruder according to the first embodiment of the present invention may include a thermocouple 60 on the outer peripheral surface of the stem 10 and the die 20, as shown in FIG.

That is, the stem 10 and the die 20 may be continuously formed with thermocouple grooves 13 and 25 on the outer circumferential surface, and the thermocouple 60 is seated in the thermocouple grooves 13 and 25 so that the extruded material. The temperature of die 20 located close to 40 can be measured.

In addition, the die 20 may have a thermocouple hole 24 penetrating the inside of the die 20.

Specifically, one end of the thermocouple hole 24 may be connected to the thermocouple groove 25 of the die 20, and the other end thereof may be positioned adjacent to the extruded material 40.

The billet 30 forms the extruded material 40 that penetrates the stem 10 and the inner circumferential surface of the die 20 by indirect extrusion at the end of the die 20.

As the extruded material 40 is prevented from overheating during the extrusion process by the cooling medium injected directly inside the die 20, the extrusion speed is increased.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; First, it should be noted that the same components or parts in the drawings represent the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the gist of the present invention.

1 is a schematic view of a cooling apparatus for an indirect extruder according to a first embodiment of the present invention, Figure 2 is a schematic view showing a front portion of a die of the cooling apparatus for an indirect extruder according to a first embodiment of the present invention. 3 is a schematic diagram illustrating a side cross-section of the die, and FIG. 4 is a photograph of the back of the die.

As shown in FIG. 1, a cooling apparatus for an indirect extruder according to a first embodiment of the present invention includes a stem 10, a die 20, a billet 30, and the stem 10 and the die 20. And an extrusion container 50 covering the billet 30.

The stem 10 includes a plurality of cooling medium inlets 11 and a plurality of cooling medium conveying tubes 12.

The cooling medium inlet 11 is an inlet through which a cooling medium is supplied into the stem 10 and is formed on an outer circumferential surface of the stem 10.

The cooling medium may be air, water, inert gas, or liquefied nitrogen. In this case, the cooling medium is preferably injected into the stem 10 by a high pressure.

The cooling medium transfer pipe 12 is formed inside the stem 10, and one end thereof is connected to the cooling medium inlet 11, and transfers the cooling medium supplied to the cooling medium inlet 11 to the cooling medium. Move to die 20 connected to end of tube 12.

Therefore, the cooling medium moving through the cooling medium transfer pipe 12 may suppress excessive temperature rise of the stem 10 to prolong the life of the stem 10.

The die 20 is connected to the end of the stem 10, and as shown in FIGS. 1 to 4, the die 20 includes a plurality of cooling medium dispersion pipes 23 and cooling medium dispersion grooves 21.

The cooling medium dispersion pipe 23 is formed in the die 20, as shown in Figures 1 to 3, one end is connected to the dispersion hole 22 to be described later, the other end is the die ( It is connected to the inner peripheral surface of 20 to distribute the cooling medium moved through the cooling medium transfer pipe 12 into the die 20.

The cooling medium dispersion groove 21 is formed on the outside of the die 20, specifically, on the outer peripheral bottom surface of the die 20, and the dispersion hole 22 connected to the cooling medium dispersion pipe 23 in the groove. It is formed in plurality.

The cooling medium dispersion groove 21 may be formed in a ring shape having the same separation distance radially from the inner peripheral surface of the die 20, the dispersion hole 22 is the same rotation in the cooling medium dispersion groove 21 It can be formed having a moving distance.

The cooling medium dispersion groove 21 uniformly supplies the cooling medium moved through the cooling medium transfer pipe 12 to the cooling medium dispersion pipe 23 through the dispersion hole 22.

Therefore, the cooling medium may extend the life of the die 20 by cooling the die 20 while penetrating the cooling medium dispersion pipe 23, and after passing through the cooling medium dispersion pipe 23, The extruded material 40 may be cooled while being directly injected into the extruded material 40 to be described later penetrating the inner circumferential surface of the die 20.

The cooling medium dispersing pipe 23 and the cooling medium dispersing hole 22 may be formed at various positions of the die 20 to cool the extruding material having various shapes. The indirect extruder according to the first embodiment of the present invention. In the case of the cooling apparatus for rods, the extruded rod-like material can be cooled.

On the other hand, the cooling apparatus for indirect extruder according to the first embodiment of the present invention may include a thermocouple 60 on the outer peripheral surface of the stem 10 and the die 20, as shown in FIG.

That is, the stem 10 and the die 20 may be continuously formed with thermocouple grooves 13 and 25 on the outer circumferential surface, and the thermocouple 60 is seated in the thermocouple grooves 13 and 25 so that the extruded material. The temperature of die 20 located close to 40 can be measured.

In addition, the die 20 may have a thermocouple hole 24 penetrating the inside of the die 20.

Specifically, one end of the thermocouple hole 24 may be connected to the thermocouple groove 25 of the die 20, and the other end thereof may be positioned adjacent to the extruded material 40.

The billet 30 forms the extruded material 40 that penetrates the stem 10 and the inner circumferential surface of the die 20 by indirect extrusion at the end of the die 20.

As the extruded material 40 is prevented from overheating during the extrusion process by the cooling medium injected directly inside the die 20, the extrusion speed is increased.

Hereinafter, a cooling apparatus for an indirect extruder according to a second embodiment of the present invention will be described in detail.

FIG. 5 is a schematic view of a cooling apparatus for an indirect extruder according to a second embodiment of the present invention, and FIG. 7 is a schematic diagram showing a side cross-section of the die, FIG. 8 is a schematic diagram showing a cross-section of the die, and FIG. 9 is a photograph of the back of the die.

As shown in FIG. 5, a cooling apparatus for an indirect extruder according to a second embodiment of the present invention includes a stem 10, a die 20, a billet 30, and the stem 10 and the die 20. And an extrusion container 50 covering the billet 30.

The stem 10 has the same configuration and contents as the stem of the cooling device for an indirect extruder according to the first embodiment of the present invention.

Therefore, the stem 10 is formed at the inside of the stem 10 and the cooling medium inlet 11 and the stem 10 are formed in plurality on the outer circumferential surface as the inlet through which the cooling medium is supplied into the stem 10. A cooling medium transfer pipe 12 connected to the cooling medium inlet 11 and moving the cooling medium supplied to the cooling medium inlet 11 to a die 20 connected to an end of the cooling medium transfer pipe 12. It may include.

Therefore, the cooling medium moving through the cooling medium transfer pipe 12 can suppress excessive temperature rise of the stem 10 to extend the life of the stem 10, wherein the cooling medium is air, water , Inert gas, or liquefied nitrogen, and the cooling medium may be injected into the stem 10 by a high pressure.

The die 20 is connected to the end of the stem 10, and as shown in Figs. 5 to 9, the hollow portion 26, the plurality of cooling medium distribution pipe 23 and the cooling medium distribution groove (21).

The hollow part 26 may be formed in the die 20 to form the extruded material 40 by indirect extrusion and may have a plate shape. Therefore, the extruded material 40 penetrating the hollow part 26 may be a plate-shaped extruded material 40.

At this time, the hollow portion 26 is increased in the horizontal and vertical length from the end of the die 20, which forms the extruding material 40 by indirect extrusion, to the part connected to the end of the stem 10, thereby increasing the cross-sectional area. This can increase.

The cooling medium dispersion pipe 23 is formed in the die 20, as shown in Figure 5 to 8, one end is connected to the dispersion hole 22, the other end is the die 20 Is connected to the inner surface of the hollow portion 26 of the cooling medium moved through the cooling medium transfer pipe 12 may be dispersed into the die 20.

The cooling medium dispersion groove 21 is formed on the outside of the die 20, specifically, on the outer peripheral bottom surface of the die 20, and the dispersion hole 22 connected to the cooling medium dispersion pipe 23 in the groove. It is formed in plurality.

The cooling medium dispersion groove 21 may be formed in a ring shape having the same separation distance radially from the center of the die 20, the dispersion hole 22 is the top and bottom of the cooling medium dispersion groove 21 It can be formed spaced at 90-degree intervals on the left and right.

In this case, the cooling medium dispersion groove 21 may further include a dispersion hole 22 formed at equal intervals on both sides of the same straight line with respect to the dispersion holes 22 formed in the upper and lower portions. Accordingly, the cooling medium dispersion groove 21 has three dispersion holes 22 formed at upper and lower portions thereof, and one dispersion hole 22 is formed at both sides thereof, so that eight dispersion holes 22 are formed. Can be formed.

The cooling medium dispersion groove 21 uniformly supplies the cooling medium moved through the cooling medium transfer pipe 12 to the cooling medium dispersion pipe 23 through the dispersion hole 22.

Accordingly, the cooling medium may extend the life of the die 20 by cooling the die 20 while penetrating the cooling medium dispersion pipe 23, and after passing through the cooling medium dispersion pipe 23, The extruded material 40 may be cooled while being directly injected into the extruded material 40 penetrating the plate-shaped hollow portion 26 of the die 20.

That is, as described above, the cooling medium dispersion pipe 23 and the cooling medium dispersion hole 22 are formed in the upper and lower portions of the die 20 so as to penetrate the hollow part 26. Cooling medium is directly injected into the upper and lower portions to cool the extruded material 40, thereby forming a plate-shaped extruded material 40.

On the other hand, the cooling medium dispersion pipe 23 and the cooling medium dispersion hole 22 is the shape of the extruded material 40, that is, the plate-shaped extruded material 40 according to the second embodiment of the present invention as well as other various asymmetry It may be formed at various locations of the die 20 to cool various extrusion materials such as the extrusion material.

On the other hand, the cooling apparatus for indirect extruder according to the second embodiment of the present invention, as shown in Figure 5, the thermocouple 60 may be included on the outer peripheral surface of the stem 10 and the die 20, the die The thermocouple hole 24 penetrating the inside of the die 20 may be formed.

That is, the stem 10 and the die 20 have the thermocouple 60 seated in the thermocouple grooves 13 and 25 continuously formed on the outer circumferential surface thereof so as to adjust the temperature of the die 20 located close to the extruded material 40. The thermocouple hole 24 may be measured, and one end thereof may be connected to the thermocouple groove 25 of the die 20, and the other end thereof may be adjacent to the extruded material 40.

The billet 30 has the same configuration and contents as the billet of the cooling apparatus for indirect extruder according to the first embodiment of the present invention.

Thus, the billet 30 forms an extruded material 40 penetrating the inside of the stem 10 and the die 20 by indirect extrusion at the end of the die 20, the extruded material 40 is As the overheating during the extrusion process is prevented by the cooling medium injected directly inside the die 20, the extrusion speed is increased.

Hereinafter, a cooling method of an indirect extruder according to an embodiment of the present invention will be described in detail.

10 is a block diagram of a cooling method of an indirect extruder according to an embodiment of the present invention, and FIG. 11 is a block diagram of a cooling medium dispersion step of a cooling method of an indirect extruder according to an embodiment of the present invention.

In the cooling method of the indirect extruder according to an embodiment of the present invention, as shown in Figure 10, the cooling medium injection step (S10), the cooling medium first transfer step (S20), and the cooling medium dispersion step (S30) and The cooling medium includes a second transfer step S40 and a cooling medium injection step S50.

The cooling medium injection step (S10) is a step of injecting a cooling medium into the stem 10, as shown in FIGS. 1 and 5.

The cooling medium is supplied into the stem 10 through the cooling medium inlet 11 formed on the outer circumferential surface of the stem 10.

The first cooling medium transfer step (S20) is a step in which the cooling medium passes through the inside of the stem 10 and moves to the end of the stem 10.

The cooling medium is moved to the end of the stem 10 through the cooling medium transfer pipe 12 formed inside the stem 10, while the cooling medium moves the cooling medium transfer pipe 12. The stem 10 may be cooled.

The cooling medium dispersion step (S30) is a step in which the cooling medium is uniformly dispersed into the die 20 connected to the end of the stem 10.

As illustrated in FIG. 11, the cooling medium dispersion step S30 includes a homogenization process S31 and a dispersion process S32.

1 through 9, the cooling medium is supplied to the cooling medium dispersion groove 21 of the die 20 connected to the end of the stem 10 to be homogenized. It is a process.

The dispersing process (S32) is a process in which the cooling medium is uniformly dispersed in the cooling medium dispersion pipe 23 formed in the die 20 through the dispersion hole 22 formed in the cooling medium dispersion groove 21. to be.

The second cooling medium transfer step (S40) is a step in which the cooling medium passes through the die 20 and moves to the end of the die 20.

The cooling medium is moved to the end of the die 10 through the cooling medium dispersion pipe 23, and the die 10 is cooled while the cooling medium moves the cooling medium dispersion pipe 23. Can be.

The cooling medium spraying step (S50) is a step in which the cooling medium is directly injected to the extruded material 40 passing through the inner peripheral surface or the hollow portion of the die 20.

Specifically, as shown in FIG. 1, the cooling medium is injected into the inner circumferential surface of the die 20, which is the end of the cooling medium dispersion tube 23, and is directly sprayed onto the extruded material passing through the die 20 to form a rod. 5, or as shown in FIG. 5, the extrusion material is injected into the inner surface of the hollow portion 26 of the die 20, which is the end of the cooling medium dispersion pipe 23, but passes through the die 20 By spraying directly on the plate-shaped extruded material to suppress the excessive temperature rise of the extruded material 40 can increase the extrusion speed.

Hereinafter, an experimental example using the indirect extruder cooling apparatus according to the first embodiment of the present invention will be described in detail.

12 is an indirect extrusion of the AZ61 alloy indirectly extruded without using a cooling device for an indirect extruder according to the first embodiment of the present invention when indirectly extruded at 250 ° C billet temperature, extrusion rate 25, ram speed 8.5 mm / s conditions 13 is an indirect extrusion using an indirect extruder cooling apparatus according to the first embodiment of the present invention when the AZ61 alloy is indirectly extruded at an initial billet temperature of 250 ° C., an extrusion ratio of 25, and a ram speed of 8.5 mm / s. It is a photograph of the appearance of an extruded material.

Experimental Example

Mg-6% by weight Al-1% by weight Zn-0.3% by weight Mn (hereinafter referred to as AZ61) A quaternary magnesium alloy billet was prepared, followed by indirect extrusion.

The billet was cast using a low carbon steel crucible (mild steel). At this time, in order to prevent oxidation of the molten metal, a mixture of SF ₆ and CO ₂ was applied to the upper portion of the molten metal to prevent contact with the atmosphere.

The billets were 80 mm in diameter and 200 mm in length, and were heat-treated at 400 ° C. for 10 hours after casting. The heat-treated billets were extruded into rods using an indirect extruder with a maximum extruding force of 500 tonf at an initial billet temperature of 250 ° C., an extrusion ratio of 25, and a ram speed of 8.5 mm / s (extrusion production rate of 12.75 m / min).

Air was used as a cooling medium for cooling during extrusion, and a pressure of 8 kgf / cm ² was imposed for smooth supply of the cooling medium.

As shown in FIG. 12, the appearance of the AZ61 alloy extruded material 40 manufactured in a state in which the cooling device is not operated during extrusion can be seen that a serious defect occurs in the extrusion process.

This defect occurs when the extrusion material temperature rises above the melting temperature of the Mg ₁₇ Al ₁₂ phase present in the Mg-Al-based alloy during the extrusion process.

On the other hand, Figure 13 shows the appearance of the extruding material 40 when the cooling using air as a refrigerant under the same extrusion conditions as in FIG. As shown in FIG. 13, unlike the AZ61 alloy extruded material, which is not cooled, it can be confirmed that a healthy extruded material 40 is manufactured, and the effect of increasing the extrusion speed by using a cooling device can be confirmed.

As described above with reference to the drawings illustrating an indirect extrusion cooling device and a cooling method according to the present invention, the present invention is not limited by the embodiments and drawings disclosed herein, the scope of the technical spirit of the present invention Of course, various modifications can be made by those skilled in the art.

The present invention is a cooling method of directly contacting the high-pressure cooling medium to the extruder and the extruder element parts, the cooling effect is superior to the conventional method, the extrusion speed is increased by preventing overheating during the extrusion process, and the life of the extruder element parts are extended. The present invention relates to a cooling device and a cooling method for an indirect extruder, which can be more effectively used in the field of extruder cooling.

Claims (13)

A stem having a plurality of cooling medium inlets formed on the outer circumferential surface to which a cooling medium is supplied, and connected to the cooling medium inlets to move the cooling medium to an end thereof; A plurality of cooling medium dispersion pipes connected to the end of the stem and dispersing the cooling medium moved through the cooling medium transfer pipe are formed therein, and a plurality of distribution holes connected to the cooling medium dispersion pipe are formed. A die having a cooling medium dispersion groove externally provided to uniformly supply the cooling medium moved through the cooling medium transfer pipe to the cooling medium dispersion pipe through the distribution hole; And A billet forming an extrudate through the inner circumference of the die and stem by indirect extrusion at the end of the die, The thermocouple is seated in the thermocouple groove continuously formed on the outer peripheral surface of the stem and die, The cooling medium cools the stem while passing through the cooling medium transfer pipe, cools the die while passing through the cooling medium dispersion pipe, passes through the cooling medium dispersion pipe, and is sprayed directly onto the extruded material to provide the extruded material. Cooling apparatus for indirect extruder, characterized in that for cooling. The method of claim 1, The cooling medium dispersion groove is formed in a ring shape having the same separation distance radially from the inner peripheral surface of the die, The dispersion hole is a cooling device for an indirect extruder, characterized in that formed in the cooling medium dispersion groove having the same rotational movement distance. The method of claim 1, The cooling medium dispersion pipe is a cooling device for an indirect extruder, characterized in that one end is connected to the dispersion hole, the other end is connected to the inner peripheral surface of the die. A stem having a plurality of cooling medium inlets formed on the outer circumferential surface to which a cooling medium is supplied, and connected to the cooling medium inlets to move the cooling medium to an end thereof; A plurality of cooling medium dispersion pipes connected to the end of the stem and dispersing the cooling medium moved through the cooling medium transport pipe are formed therein, and a plurality of distribution holes connected to the cooling medium dispersion pipe are formed. A die having a cooling medium dispersion groove externally provided to uniformly supply the cooling medium moved through the cooling medium transfer pipe to the cooling medium dispersion pipe through the distribution hole; And A billet forming an extrudate through the interior of the die and stem by indirect extrusion at the end of the die, A thermocouple is seated in a thermocouple groove continuously formed on the outer circumferential surface of the stem and the die. The cooling medium dispersion groove is formed in a ring shape having a radially equal distance from the center of the die, the dispersion hole is formed spaced at 90 degrees apart from the top, bottom, left and right of the cooling medium dispersion groove, respectively. The hollow portion formed in the die to form the extruded material by indirect extrusion is made of a plate shape, The cooling medium cools the stem while passing through the cooling medium transfer pipe, cools the die while passing through the cooling medium dispersion pipe, passes through the cooling medium dispersion pipe, and is sprayed directly onto the extruded material to provide the extruded material. Cooling apparatus for indirect extruder, characterized in that for cooling. The method of claim 4, wherein The cooling medium dispersion groove further comprises a distribution hole formed at equal intervals on both sides of the same straight line with respect to the distribution holes formed in the upper and lower portions. The method of claim 4, wherein Cooling device for an indirect extruder, characterized in that the hollow portion of the die is increased from the end of the die forming the extrusion material by the indirect extrusion to the portion connected to the end of the stem increases cross-sectional area to increase the cross-sectional area. The method of claim 4, wherein The cooling medium dispersion pipe is a cooling device for indirect extruder, characterized in that one end is connected to the dispersion hole, the other end is connected to the inner surface of the hollow portion. The method according to claim 1 or 4, The cooling medium is a cooling device for indirect extruder, characterized in that made of air, water, inert gas, or liquefied nitrogen. The method according to claim 1 or 4, Wherein the die penetrates inside, one end is connected to the thermocouple groove of the die, the other end is a cooling device for an indirect extruder, characterized in that the thermocouple hole is formed adjacent to the extrusion material. A cooling medium injection step of injecting a cooling medium into the stem; A first transfer step of the cooling medium through which the cooling medium passes through the inside of the stem and is moved to an end of the stem; A cooling medium dispersion step of uniformly dispersing the cooling medium into a die connected to an end of the stem; A second transfer step of the cooling medium passing through the inside of the die and moving to the end of the die; And And a cooling medium spraying step in which the cooling medium is directly injected into the extruding material passing through the inner circumferential surface or the hollow portion of the die. The method of claim 10, The first cooling medium transfer step, Cooling medium of the indirect extruder characterized in that the cooling medium is moved to the end of the stem through the cooling medium transfer pipe formed inside the stem to cool the stem. The method of claim 10, The cooling medium dispersion step, A homogenization process in which the cooling medium is supplied to the cooling medium dispersion grooves of the die connected to the end of the stem and uniformized; And And dispersing the cooling medium into a cooling medium dispersion pipe formed in the die through a dispersion hole formed in the cooling medium dispersion groove. The method of claim 10, The second conveyance of the cooling medium is a cooling method of the indirect extruder, characterized in that the cooling medium is moved to the end of the die through the cooling medium dispersion pipe formed in the die to cool the die.

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