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WO2011002116A1 - Structure de dissipation de chaleur pour un boîtier d’un appareil de communication sans fil - Google Patents

Structure de dissipation de chaleur pour un boîtier d’un appareil de communication sans fil Download PDF

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Publication number
WO2011002116A1
WO2011002116A1 PCT/KR2009/003569 KR2009003569W WO2011002116A1 WO 2011002116 A1 WO2011002116 A1 WO 2011002116A1 KR 2009003569 W KR2009003569 W KR 2009003569W WO 2011002116 A1 WO2011002116 A1 WO 2011002116A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
enclosure
contact
installation
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/003569
Other languages
English (en)
Korean (ko)
Inventor
김덕용
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KMW Inc
Original Assignee
KMW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KMW Inc filed Critical KMW Inc
Priority to PCT/KR2009/003569 priority Critical patent/WO2011002116A1/fr
Publication of WO2011002116A1 publication Critical patent/WO2011002116A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing

Definitions

  • the present invention relates to a housing device of a wireless communication device, and more particularly to a heat dissipation structure of the housing device.
  • various communication devices are installed in a wireless communication device enclosure, among which a high power amplifier, a radio frequency (RF) signal processing block, a high speed signal processing device, a power supply device, and a digital processing unit are generated. Are also equipped.
  • RF radio frequency
  • the heat generated by the devices operating at their maximum load increases the air temperature inside the communication device enclosure containing these devices. As such, if the air temperature inside the enclosure rises, the heat will shorten the life of the equipment and reduce its function, affecting other adjacent devices, and in severe cases, it may cause malfunction or inability to process the data.
  • an object of the present invention is to provide a heat dissipation structure of an enclosure of a wireless communication device for enabling more efficient heat dissipation.
  • Another object of the present invention is to provide a heat dissipation structure of the enclosure of the wireless communication device for improving the heat dissipation efficiency to configure a smaller size of the housing device, to facilitate the configuration and installation of the housing device.
  • the present invention in the heat dissipation structure of the housing device of the wireless communication device, a plurality of heat dissipation fins, and is fixedly coupled to the installation column is installed the whole housing device is mounted to the entire housing device through this And a heat dissipation plate including a mounting structure for contacting and a contact structure for contacting a portion of an outer surface of the mounting pillar when the mounting mechanism is installed to the mounting pillar through the mounting mechanism.
  • the heat dissipation structure of the enclosure of the wireless communication device according to the present invention has a good heat dissipation efficiency of the enclosure and can be miniaturized, and thus can be easily manufactured and installed.
  • FIG. 1 is a cross-sectional view of an enclosure of a wireless communication device according to the prior art.
  • FIG. 3 is a perspective view of a heat sink according to the prior art
  • FIG. 4 is a perspective view showing a heat dissipation structure of a housing device of a wireless communication device according to an embodiment of the present invention
  • Figure 5 is a plan view cut structure of the main part of Figure 4
  • FIG. 1 is a cross-sectional view of a housing device of a wireless communication device according to the prior art
  • Figure 2 is a partially cut perspective view of the housing device of a wireless communication device according to the prior art
  • Figure 3 is a perspective view of a heat sink according to the prior art. 1 to 3, an example of a general communication device housing apparatus to which the present invention is applied will be described.
  • a general communication device 100 includes a housing 110 having a predetermined accommodation space, and a communication space such as a high output amplifier, a power supply, and the like in the accommodation space within the housing 110. Electronic devices are mounted.
  • the rear side of the enclosure 100 is provided with a cooling device 130 for cooling the elevated temperature in the enclosure 100, the cooling device 130 by using a passive cooling method and a fan simply attached to the heat sink 140.
  • a cooling device 130 for cooling the elevated temperature in the enclosure 100, the cooling device 130 by using a passive cooling method and a fan simply attached to the heat sink 140.
  • the plurality of heat dissipation fins 145 are integrally installed on the rear of the enclosure 110 and Blowing fan 150 installed in the lower portion of the enclosure 110 and the rear side of the enclosure 110 to forcibly blow air into the heat sink 140, a plurality of air to be discharged to the outside It consists of the porous plate 160 with through holes formed therein.
  • Communication electronic devices 115 are mounted in the enclosure 110, that is, at positions corresponding to the heat sink 140.
  • the door 113 is installed on the front of the enclosure.
  • the porous plate 160 may be attached to the rear of the housing 110.
  • a plurality of blowing fans 150 may be installed at the lower end between the heat sink 140 and the porous plate 160.
  • And to prevent radiant heat may be additionally installed on the outer circumferential surface of the lower body spaced apart from the radiant heat prevention plate (not shown).
  • Such communication device enclosures are commonly applied to outdoor communication devices that should be installed high above the ground, such as in the installation pillar of the base station antenna.
  • the structure of the heat dissipating plate 140 is improved, and the heat dissipating plate is directly contacted with the installation pillar, and the installation pillar itself is proposed as a heat dissipation tool.
  • the heat dissipation structure of the enclosure according to the present invention with reference to FIGS. 3 and 4 will be described in more detail.
  • the heat sink 240 is fixedly coupled to the installation pillar 300 of the base station antenna according to the characteristics of the present invention is provided with a mounting mechanism for mounting the entire enclosure 200 to the installation pillar 300 of the antenna through this do.
  • the mounting fixture may be a screw groove structure 222, as in the example of FIG. 4, the screw groove structure 222 being screwed to the bracket device 220 which is fixedly coupled to the actual antenna mounting pillar 300. It is coupled through, the entire housing device 200 including the heat sink 240 is fixed to the installation pillar 300 of the antenna via the bracket device 220.
  • bracket device 220 is provided at two positions, respectively, at an upper end and a lower end of the heat sink 240 to be coupled to two places of the elongated mounting pillar 300.
  • the heat sink 240 may be formed with a screw groove structure 222 on the top and bottom, respectively, to correspond to the bracket device 220.
  • the heat dissipation plate 240 is provided with a contact structure 250 for contacting a part of the outer circumferential surface of the installation pillar 300 when installed on the mounting pillar 300 through the bracket device 220.
  • the contact structure 250 is for transmitting the heat of the heat dissipation 240 to the installation column 300.
  • the contact structure 250 may have a contact surface with the installation pillar 300 having one side curved surface of the cylinder. As the contact area between the contact structure 250 and the installation pillar 300 is wider, heat transfer is made.
  • the contact structure 250 is designed to contact the pillar 300 with as many parts as possible, and in addition, the heat sink 240
  • the contact structure 250 may be manufactured integrally with the heat sink 240 through an extrusion method, such as the plurality of heat sink fins 245, or may be manufactured separately from the heat sink 240 body to correspond to the heat sink 240. It may be coupled to the coupling site through screwing or the like.
  • the efficient heat transfer between the contact structure 250 and the installation column 300 of the heat sink 240 is also made so that the enclosure 200 can be more firmly fixed through the contact structure 250.
  • Thermal-pads 260 of suitable materials and structures may be further installed in order to facilitate this. As shown in FIG. 4, the thermal pad 260 preferably has a structure in accordance with the contact surface shape of the contact structure 250 and the installation pillar 300.
  • the heat dissipation structure of the enclosure of the wireless communication device may be formed.
  • the mounting mechanism is formed on the heat sink, so that the entire enclosure is fixed.
  • the mounting mechanism for fixing the enclosure is not provided on the heat sink but the enclosure. It may have a structure which is installed at another part of the device to fix the enclosure to the installation pillar.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne une structure de dissipation de chaleur pour un boîtier d'un appareil de communication sans fil, la structure comprenant une plaque de dissipation de chaleur comprenant : une pluralité d'ailettes de dissipation de chaleur ; une structure de montage associée et fixée à une colonnette d'installation sur laquelle est installé l'ensemble du boîtier ; et une structure de contact conçue pour venir au contact d'une partie d'une surface extérieure de la colonnette d'installation une fois installée sur la colonnette d'installation au moyen de la structure de montage.
PCT/KR2009/003569 2009-06-30 2009-06-30 Structure de dissipation de chaleur pour un boîtier d’un appareil de communication sans fil Ceased WO2011002116A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2009/003569 WO2011002116A1 (fr) 2009-06-30 2009-06-30 Structure de dissipation de chaleur pour un boîtier d’un appareil de communication sans fil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2009/003569 WO2011002116A1 (fr) 2009-06-30 2009-06-30 Structure de dissipation de chaleur pour un boîtier d’un appareil de communication sans fil

Publications (1)

Publication Number Publication Date
WO2011002116A1 true WO2011002116A1 (fr) 2011-01-06

Family

ID=43411181

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003569 Ceased WO2011002116A1 (fr) 2009-06-30 2009-06-30 Structure de dissipation de chaleur pour un boîtier d’un appareil de communication sans fil

Country Status (1)

Country Link
WO (1) WO2011002116A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105208826A (zh) * 2014-06-26 2015-12-30 中兴通讯股份有限公司 一种散热装置、通信设备及散热方法
EP3177124A4 (fr) * 2014-08-21 2017-09-06 Huawei Technologies Co. Ltd. Produit de communication et système de station de base
CN109429463A (zh) * 2017-08-31 2019-03-05 株洲中车时代电气股份有限公司 一种辅助变流器及磁悬浮列车
WO2019211359A1 (fr) * 2018-05-02 2019-11-07 Airrays Gmbh Système d'antenne, système de communication et procédé
CN112188318A (zh) * 2019-07-05 2021-01-05 深圳市华创技术有限公司 一种基于5g网络的通信设备及使用方法
CN114826289A (zh) * 2022-04-24 2022-07-29 石家庄开发区泰顺电子通讯有限公司 小功率短波发射机
EP4109326A1 (fr) * 2021-06-24 2022-12-28 Shenzhen Wins Electronic Technology Co., Ltd. Hôte d'identification de fréquence radio

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004105261A1 (fr) * 2003-05-23 2004-12-02 Kmw Inc. Ensemble boitier pour dispositif de communication exterieur
KR200419966Y1 (ko) * 2006-04-19 2006-06-26 에스케이텔레시스 주식회사 무급전 중계기의 운용시스템
US20080239632A1 (en) * 2007-03-27 2008-10-02 Adc Telecommunications, Inc. Apparatus for improving the accessiblity of a mounted structure
KR20090119206A (ko) * 2008-05-15 2009-11-19 주식회사 케이엠더블유 무선통신기기의 함체장치의 열방출 구조

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004105261A1 (fr) * 2003-05-23 2004-12-02 Kmw Inc. Ensemble boitier pour dispositif de communication exterieur
KR200419966Y1 (ko) * 2006-04-19 2006-06-26 에스케이텔레시스 주식회사 무급전 중계기의 운용시스템
US20080239632A1 (en) * 2007-03-27 2008-10-02 Adc Telecommunications, Inc. Apparatus for improving the accessiblity of a mounted structure
KR20090119206A (ko) * 2008-05-15 2009-11-19 주식회사 케이엠더블유 무선통신기기의 함체장치의 열방출 구조

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105208826A (zh) * 2014-06-26 2015-12-30 中兴通讯股份有限公司 一种散热装置、通信设备及散热方法
EP3177124A4 (fr) * 2014-08-21 2017-09-06 Huawei Technologies Co. Ltd. Produit de communication et système de station de base
US9872416B2 (en) 2014-08-21 2018-01-16 Huawei Technologies Co., Ltd. Communications product and base station system
CN109429463A (zh) * 2017-08-31 2019-03-05 株洲中车时代电气股份有限公司 一种辅助变流器及磁悬浮列车
WO2019211359A1 (fr) * 2018-05-02 2019-11-07 Airrays Gmbh Système d'antenne, système de communication et procédé
US11387539B2 (en) 2018-05-02 2022-07-12 Xilinx, Inc. Antenna system, communication system, method
CN112188318A (zh) * 2019-07-05 2021-01-05 深圳市华创技术有限公司 一种基于5g网络的通信设备及使用方法
CN112188318B (zh) * 2019-07-05 2022-07-15 深圳市华创技术有限公司 一种基于5g网络的通信设备及使用方法
EP4109326A1 (fr) * 2021-06-24 2022-12-28 Shenzhen Wins Electronic Technology Co., Ltd. Hôte d'identification de fréquence radio
CN114826289A (zh) * 2022-04-24 2022-07-29 石家庄开发区泰顺电子通讯有限公司 小功率短波发射机

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