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WO2011089862A1 - Procédé de fabrication de corps monté et dispositif de montage - Google Patents

Procédé de fabrication de corps monté et dispositif de montage Download PDF

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Publication number
WO2011089862A1
WO2011089862A1 PCT/JP2011/000071 JP2011000071W WO2011089862A1 WO 2011089862 A1 WO2011089862 A1 WO 2011089862A1 JP 2011000071 W JP2011000071 W JP 2011000071W WO 2011089862 A1 WO2011089862 A1 WO 2011089862A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
substrate
electrode
solder
metal bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/000071
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English (en)
Japanese (ja)
Inventor
孝 ▲松▼村
崇之 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Publication of WO2011089862A1 publication Critical patent/WO2011089862A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2224/92143—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a bump connector
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
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    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method for manufacturing a mounting body and a mounting apparatus.
  • Patent Document 1 Japanese Patent Laid-Open No. 9-260421
  • Patent Document 2 Japanese Patent No. 2823012
  • Patent Document 3 Japanese Patent No. 3921459
  • solder is provided on at least one surface of the electrode of the substrate and the electrode of the electronic component, and the substrate, the insulating adhesive layer, and the electronic component are provided.
  • a method of manufacturing a mounting body including a coupling step.
  • the pressing step may include a step of pressing the electronic component against the substrate with an elastic body held by the head.
  • the pressing step may include a step of simultaneously pressing a plurality of electronic components against the substrate with an elastic body.
  • the manufacturing method may further include a step of pre-coating solder on at least one of the substrate electrode and the electronic component electrode.
  • solder is provided on at least one surface of the electrode of the substrate and the electrode of the electronic component, and after the substrate, the insulating adhesive layer, and the electronic component are laminated in this order, By pressing the electronic component against the substrate, the insulating adhesive layer is penetrated, and the pressing portion that contacts the electrode of the electronic component and the electrode of the substrate, and the insulating adhesive layer is heated to the first temperature
  • a heating controller that heats the insulating adhesive layer and then heats the solder to a second temperature to form a metal bonding layer containing solder between the electrode of the substrate and the electrode of the electronic component;
  • a mounting apparatus is provided.
  • the pressing portion may have an elastic body, and the electronic component may be pressed against the substrate with the elastic body.
  • the pressing unit may be an elastic body that simultaneously presses a plurality of electronic components against the substrate.
  • An example of a sectional view of mounting body 100 is shown roughly.
  • An example of the flowchart of the manufacturing method of the mounting body 100 is shown.
  • An example of sectional drawing in the process of laminating substrate 110, adhesive film 320, electronic component 140, and electronic component 160 is shown roughly.
  • An example of sectional drawing in the process of thermosetting adhesive film 320 is shown roughly.
  • An example of mounting device 510 is shown roughly.
  • FIG. 1 schematically shows an example of a cross-sectional view of the mounting body 100.
  • the mounting body 100 may include a substrate 110, an insulating layer 120, an electronic component 140, and an electronic component 160.
  • the substrate 110 include a printed wiring board, a multilayer wiring substrate, a flexible substrate, and a glass substrate.
  • the insulating layer 120 has an insulating property.
  • the insulating layer 120 may bond the substrate 110 to the electronic component 140 and the electronic component 160.
  • the insulating layer 120 is obtained, for example, by curing a thermosetting resin.
  • the electronic component 140 and the electronic component 160 may have a bump 142 and a bump 162, respectively.
  • the bump 142 and the bump 162 are electrically connected to the electrode pad 114 and the electrode pad 116 of the substrate 110, respectively.
  • Examples of the electronic component 140 and the electronic component 160 include ICs, LSIs, resistors, and other substrates.
  • the bump 142 and the bump 162 may be an example of an electrode of an electronic component.
  • the electrode pad 114 and the electrode pad 116 may be an example of a substrate electrode.
  • the metal bonding layer 154 may bond the bump 142 and the electrode pad 114.
  • the metal bonding layer 154 may electrically connect the bump 142 and the electrode pad 114.
  • the metal bonding layer 154 may include a metal having a lower melting point than the bump 142 and the electrode pad 114.
  • the metal bonding layer 154 may include an alloy of a metal having a lower melting point than the bump 142 and the electrode pad 114 and at least one of the bump 142 and the electrode pad 114.
  • the metal bonding layer 156 may bond the bump 162 and the electrode pad 116.
  • the metal bonding layer 156 may electrically connect the bump 162 and the electrode pad 116.
  • the metal bonding layer 156 may include a metal having a melting point lower than that of the bump 162 and the electrode pad 116.
  • the metal bonding layer 156 may include an alloy of a metal having a lower melting point than the bump 162 and the electrode pad 116 and at least one of the bump 162 and the electrode pad 116.
  • FIG. 2 shows an example of a flowchart of a method for manufacturing the mounting body 100.
  • the substrate 110, the electronic component 140, and the electronic component 160 are prepared in S202.
  • solder is precoated on the surface of the electrode pad 116 of the substrate 110. Also, solder is precoated on the surface of the bump 142 of the electronic component 140.
  • the substrate 110, the electronic component 140, and the electronic component 160 are aligned, and the electronic component 140 and the electronic component 160 are disposed on the substrate 110.
  • An adhesive layer is disposed between the substrate 110 and the electronic component 140 and the electronic component 160. The adhesive layer bonds the substrate 110 to the electronic component 140 and the electronic component 160.
  • S204 may be an example of a stacking stage.
  • the adhesive layer preferably has an insulating property when the substrate 110 and the electronic component 140 and the electronic component 160 are electrically connected.
  • the insulating layer 120 may be formed by thermosetting the adhesive layer.
  • the adhesive layer is a temperature at which the solder pre-coated on the surface of the bump 142 forms the metal bonding layer 154 with the electrode pad 114, or the solder pre-coated on the surface of the electrode pad 116 is metal with the bump 162.
  • the thermosetting is preferably performed at a temperature lower than the temperature at which the bonding layer 156 is formed.
  • the adhesive layer may include at least one of a thermosetting resin and a thermoplastic resin.
  • the adhesive layer may include a film-forming resin, a liquid curable component, and a curing agent.
  • the film forming resin include phenoxy resin, polyester resin, polyamide resin, and polyimide resin. It is preferable to include a phenoxy resin from the viewpoint of easy availability of materials and connection reliability.
  • liquid curing component examples include liquid epoxy resins and acrylates. It is preferable to have two or more functional groups from the viewpoints of connection reliability and cured product stability.
  • the curing agent examples include imidazole, amines, sulfonium salts, and onium salts when the liquid curing component is a liquid epoxy resin.
  • the liquid curing component is an acrylate, an organic peroxide can be exemplified as the curing agent.
  • the adhesive layer may contain additives such as various rubber components, softeners and various fillers.
  • the adhesive layer may be a paste-like adhesive or a sheet-like adhesive film.
  • the adhesive layer may be NCF (Non Conductive Film).
  • the electronic component 140 and the electronic component 160 may be arranged on the substrate 110 after the adhesive layer is arranged on the substrate 110.
  • the electronic component 140 and the electronic component 160 may be disposed on the substrate 110 after an adhesive layer is attached to the bump-side surfaces of the electronic component 140 and the electronic component 160. Thereby, it is possible to prepare a work in which the substrate 110, the adhesive layer, the electronic component 140, and the electronic component 160 are stacked in this order.
  • the workpiece prepared in S204 is pressed, and the electronic component 140 and the electronic component 160 are pressed against the substrate 110.
  • the bump 142 pre-coated with solder penetrates the adhesive layer, and the bump 142 pre-coated with solder and the electrode pad 114 come into contact with each other.
  • the bump 162 penetrates the adhesive layer, and the bump 162 and the electrode pad 116 pre-coated with solder come into contact with each other.
  • S206 may be an example of a pressing step.
  • the electronic component 140 and the electronic component 160 may be pressed against the substrate 110 with an elastic body.
  • the elastic body include elastomers such as natural rubber, synthetic rubber, and silicone rubber. Thereby, the position shift of the electronic component 140 and the electronic component 160 can be prevented. Further, even when a plurality of types of electronic components having different heights are mounted on a substrate, all the electronic components can be pressed against the substrate by pressing the electronic components with an elastic body. Thereby, a several electronic component can be pressed simultaneously and a tact time can be shortened.
  • the adhesive layer disposed between the substrate 110, the electronic component 140, and the electronic component 160 is heated to thermally cure the adhesive layer.
  • S208 may be an example of a thermosetting stage.
  • the adhesive layer is heated to a temperature at which the adhesive layer is thermally cured and the substrate 110 and the electronic component 140 and electronic component 160 are bonded.
  • the adhesive layer has a temperature at which the solder pre-coated on the surface of the bump 142 forms the metal bonding layer 154 with the electrode pad 114, or the solder pre-coated on the surface of the electrode pad 116 and the bump 162. The temperature is lower than the temperature at which the metal bonding layer 156 is formed.
  • the pressing step and the thermosetting step are not limited to this.
  • the pressing step and the thermosetting step may be performed in the same process.
  • the workpiece may be heated while pressing the workpiece, or the workpiece may be pressed while heating the workpiece.
  • the workpiece is heated to form a metal bonding layer 154 between the electrode pad 114 and the bump 142.
  • a metal bonding layer 156 is formed between the electrode pad 116 and the bump 162.
  • S210 may be an example of a metal bonding step.
  • the temperature at which the metal bonding layer 154 and the metal bonding layer 156 are formed in S210 is different from the temperature at which the adhesive layer is thermally cured in S208.
  • the temperature at which the metal bonding layer 154 and the metal bonding layer 156 are formed in S210 may be higher than the temperature at which the adhesive layer is thermally cured in S208.
  • the temperature when the adhesive layer is thermally cured in S208 may be 100 ° C. to 180 ° C.
  • the temperature when forming the metal bonding layer 154 and the metal bonding layer 156 in S210 may be 200 ° C. to 265 ° C.
  • the metal bonding layer 154 may be formed by melting the solder pre-coated on the surface of the bump 142. Alternatively, the metal bonding layer 154 may be formed by fusing the solder pre-coated on the surface of the bump 142 and the electrode pad 114 to form an alloy. Similarly, the metal bonding layer 156 may be formed by melting solder precoated on the surface of the electrode pad 116. Alternatively, the metal bonding layer 156 may be formed by fusing the solder pre-coated on the surface of the electrode pad 116 and the bump 162 to form an alloy.
  • the steps S206, S208, and S210 may be performed using the same apparatus.
  • the steps S206 and S208 may be performed using the same device, and the step S210 may be performed using a device different from the device that performs S206 and S208.
  • the metal bonding layer 154 and the metal bonding layer 156 can be formed between the substrate 110 and the electronic component 140 and the electronic component 160. Thereby, the connection reliability of the board
  • the metal bonding layer 154 and the metal bonding layer 156 are formed after the adhesive layer is thermally cured. Thereby, it can suppress that a solder spreads to the space
  • the substrate 110, the electronic component 140, and the electronic component 160 it is not necessary to press the substrate 110, the electronic component 140, and the electronic component 160 in the step of forming the metal bonding layer 154 and the metal bonding layer 156.
  • elastomers such as a natural rubber used for an elastic body, synthetic rubber, and silicone rubber, can be controlled.
  • the insulating layer 120 is formed between the substrate 110 and the electronic component 140 and the electronic component 160.
  • FIG. 3 schematically shows an example of a cross-sectional view in the step of laminating the substrate 110, the adhesive film 320, the electronic component 140, and the electronic component 160.
  • FIG. 3 schematically shows an example of a cross-sectional view of the workpiece 300.
  • the workpiece 300 includes a substrate 110, an adhesive film 320, an electronic component 140, and an electronic component 160.
  • the substrate 110, the adhesive film 320, the electronic component 140, and the electronic component 160 are laminated in this order.
  • the bump 142 has a precoat layer 342 on the surface of the bump 142.
  • the precoat layer 342 may be a metal having a lower melting point than the bump 142 and the electrode pad 114. Examples of the precoat layer 342 include solder or solder that has been subjected to rust prevention treatment.
  • the precoat layer 342 may be formed by reflow.
  • the bump 142 and the electrode pad 114 may include at least one metal selected from the group consisting of gold, silver, copper, nickel, and solder.
  • the precoat layer 342 may use solder having a melting point lower than that of the solder included in the bump 142 or electrode pad 114.
  • the electrode pad 116 has a precoat layer 316 on the surface of the electrode pad 116.
  • the precoat layer 316 may be a metal having a lower melting point than the bump 162 and the electrode pad 116. Examples of the precoat layer 316 include solder or solder subjected to rust prevention treatment.
  • the precoat layer 342 may be formed by reflow.
  • the bump 162 and the electrode pad 116 may include at least one metal selected from the group consisting of gold, silver, copper, nickel, and solder.
  • the precoat layer 316 may use solder having a melting point lower than that of the solder included in the bump 162 or electrode pad 116.
  • the adhesive film 320 includes a thermosetting resin, and is thermally cured at a temperature lower than the temperature at which the precoat layer 342 and the precoat layer 316 form the metal bonding layer 154 and the metal bonding layer 156.
  • the adhesive film 320 may be an example of an insulating adhesive layer and the adhesive layer described in connection with S204.
  • FIG. 4 schematically shows an example of a cross-sectional view in the step of thermosetting the adhesive film 320.
  • the bump 142 penetrates the adhesive film 320, and the precoat layer 342 formed on the surface of the bump 142 and the electrode pad 114 come into contact with each other.
  • the bump 162 penetrates the adhesive film 320, and the bump 162 and the precoat layer 316 formed on the surface of the electrode pad 116 come into contact with each other.
  • the oxide film can be physically destroyed.
  • the metal bonding layer 154 and the metal bonding layer 156 can be formed without flux.
  • the adhesive film 320 is thermally cured, and the insulating layer 120 is formed. Thereby, it can suppress that the electrodes which are not intended are electrically connected.
  • the precoat layer 342 and the precoat layer 316 have not yet formed the metal bonding layer 154 and the metal bonding layer 156.
  • the adhesive film 320 is thermally cured at a temperature lower than the temperature at which the precoat layer 342 and the precoat layer 316 form the metal bonding layer 154 and the metal bonding layer 156. Therefore, the adhesive film 320 can be thermally cured before forming the metal bonding layer 154 and the metal bonding layer 156.
  • the metal bonding layer 154 and the metal bonding layer 156 can be formed by heating the workpiece 300 and melting the precoat layer 342 and the precoat layer 316. As described above, the mounting body 100 can be manufactured.
  • FIG. 5 schematically shows an example of the mounting apparatus 510.
  • the mounting apparatus 510 may include a stage 520, a head 530, a drive unit 540, and a control unit 550.
  • FIG. 5 schematically shows an example of the mounting apparatus 510 in a state where the workpiece 300 is held between the stage 520 and the head 530.
  • Stage 520 holds work 300.
  • the stage 520 may heat the workpiece 300.
  • the stage 520 may include a heating unit 522.
  • the heating unit 522 may heat the stage 520 based on an instruction from the control unit 550.
  • the head 530 sandwiches the workpiece 300 between the head 530 and the stage 520.
  • the head 530 may include a head main body 532, a pressing member 534, and a holding member 536.
  • the head 530 and the pressing member 534 may be an example of a pressing unit.
  • the head main body 532 presses the pressing member 534 toward the stage 520.
  • the head body 532 may be a highly rigid metal such as iron or stainless steel.
  • the pressing member 534 is disposed between the head main body 532 and the stage 520.
  • the pressing member 534 presses the workpiece 300 toward the stage 520.
  • the electronic component 140 is pressed against the substrate 110, and the bump 142 on which the precoat layer 342 is formed penetrates the adhesive film 320.
  • the electronic component 160 is pressed against the substrate 110, and the bump 162 penetrates the adhesive film 320.
  • the precoat layer 342 of the bump 142 and the electrode pad 114 come into contact with each other.
  • the bump 162 and the precoat layer 316 of the electrode pad 116 are in contact with each other.
  • the pressing member 534 may be a material that is more elastic than the head body 532.
  • the pressing member 534 may be an elastomer such as natural rubber, synthetic rubber, or silicone rubber. Thereby, a some electronic component can be pressed simultaneously with respect to a board
  • the pressing member 534 may be an example of an elastic body.
  • the holding member 536 holds the pressing member 534 on the surface of the head main body 532 facing the stage 520.
  • the holding member 536 may hold the peripheral edge portion of the pressing member 534.
  • the driving unit 540 moves the head 530 toward the stage 520 based on an instruction from the control unit 550. Accordingly, the head 530 presses the electronic component 140 and the electronic component 160 against the substrate 110 with the pressing member 534. In addition, the driving unit 540 separates the head 530 from the stage 520 based on an instruction from the control unit 550. Examples of the drive unit 540 include an air cylinder, a hydraulic cylinder, and a servo motor.
  • the drive unit 540 moves the head 530 toward the stage 520
  • the drive unit 540 is not limited to this.
  • the driving unit 540 may move the stage 520 toward the head 530.
  • the control unit 550 may control the heating unit 522 to heat the stage 520.
  • the controller 550 may control the drive unit 540 to raise and lower the head 530.
  • the control unit 550 may be an example of a heating control unit.
  • the control unit 550 may control the driving unit 540 to move the head 530 toward the stage 520 and press the workpiece 300. At this time, the control unit 550 may heat the workpiece 300 to thermally cure the adhesive film 320.
  • the control unit 550 may control the heating unit 522 so that the temperature of the workpiece 300 falls within a predetermined temperature range. At this time, the control unit 550 may control the heating unit 522 so that the temperature of the adhesive film 320 is higher than the thermosetting temperature of the adhesive film 320. Control unit 550 may control heating unit 522 such that the temperature of precoat layer 342 and precoat layer 316 is lower than the temperature at which metal bonding layer 154 and metal bonding layer 156 are formed.
  • control unit 550 controls the driving unit 540 to raise the head 530. As a result, the pressing member 534 is separated from the stage 520.
  • the controller 550 separates the pressing member 534 and the stage 520 and then heats the workpiece 300 on which the insulating film 120 is formed by the thermosetting of the adhesive film 320, so that the gap between the electrode pad 114 and the bump 142 is increased.
  • a metal bonding layer 154 may be formed.
  • a metal bonding layer 156 may be formed between the electrode pad 116 and the bump 162.
  • the control unit 550 may control the heating unit 522 so that the temperature of the stage 520 is different between the step of forming the metal bonding layer 154 and the metal bonding layer 156 and the step of thermosetting the adhesive film 320.
  • the control unit 550 may control the heating unit 522 so that the temperature of the workpiece 300 is within a predetermined temperature range. At this time, the control unit 550 may control the heating unit 522 so that the temperature of the precoat layer 342 and the precoat layer 316 is higher than the temperature at which the metal bonding layer 154 and the metal bonding layer 156 are formed.
  • the mounting apparatus 510 can manufacture the mounting body 100. Further, the metal bonding layer 154 and the metal bonding layer 156 can be formed in a state where the pressing member 534 is separated from the stage 520. As a result, deterioration of the pressing member 534 can be suppressed.
  • the mounting apparatus 510 performs the process of thermally curing the adhesive film 320 and the process of forming the metal bonding layer 154 and the metal bonding layer 156 has been described.
  • the mounting apparatus 510 is not limited to this.
  • the mounting apparatus 510 may perform the process of thermally curing the adhesive film 320, and the apparatus different from the mounting apparatus 510 may perform the process of forming the metal bonding layer 154 and the metal bonding layer 156.
  • a reflow apparatus can be exemplified as an apparatus for performing the step of forming the metal bonding layer 154 and the metal bonding layer 156.
  • An IC having a bump pitch of 85 ⁇ m was prepared as an evaluation element (TEG).
  • the size of the IC was 6.3 mm ⁇ 6.3 mm.
  • Three ICs were prepared.
  • the bump of the evaluation element was prepared by pre-coating 15 ⁇ m Sn-2.5Ag on the surface of a 20 ⁇ m Cu electrode by reflow. 272 bumps were produced per IC.
  • a circuit board having an electrode pad pitch of 85 ⁇ m was prepared as an evaluation element (TEG).
  • the electrode pad of the evaluation element was produced by plating Au on the surface of the Ni electrode.
  • the size of the circuit board was 38 mm ⁇ 38 mm.
  • B14-4 (Sony Chemical & Information Device Co., Ltd.) was prepared as an example of NCF (Non Conductive Film).
  • B14-4 was cut into a size of 7 mm ⁇ 7 mm to prepare three NCFs.
  • Three NCFs were attached to the surface of the circuit board where the electrode pads were formed.
  • the IC and the circuit board were aligned, and the IC was placed on each of the three NCFs.
  • the circuit board and the three ICs were heated while being pressed to temporarily press-bond the three ICs to the circuit board.
  • Temporary pressure bonding conditions were set to a temperature of 100 ° C. and a pressure of 3 kgf.
  • the crimping time was set to 1 second.
  • the circuit board after provisional pressure bonding was heated while pressing, and three ICs were finally pressure bonded to the circuit board.
  • the conditions for the main pressure bonding were set to a temperature of 180 ° C. and a pressure of 2 MPa.
  • the crimping time was set to 20 seconds.
  • B14-4 was thermoset by main compression.
  • the circuit board after the main pressure bonding was reflowed under the condition of a peak temperature of 265 ° C. to melt Sn-2.5Ag.
  • the reflow time was set to 300 seconds.
  • a moisture absorption reflow test For the purpose of confirming connection reliability, a moisture absorption reflow test, a pressure cooker test (PCT), and a temperature cycle test (TCT) were conducted. After each test, a continuity test was performed on 40 bumps per IC. The continuity test was carried out by a four-terminal method.
  • the moisture absorption reflow test was conducted under the condition of Level 2a of JEDEC (Joint Electron Engineering Engineering Council). As a result of the moisture absorption reflow test, no connection failure occurred.
  • the pressure cooker test was performed under the conditions of a pressure of 0.23 Mpa, a temperature of 130 ° C., and a humidity of 85% RH. The pressure cooker test was conducted for up to 200 hours, but no connection failure occurred.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Selon l'invention, le procédé de fabrication d'un corps monté présentant un degré élevé de fiabilité de liaison comprend une étape de disposition en couches dans laquelle une soudure est disposée sur la surface d'au moins l'électrode d'un substrat ou bien de l'électrode d'un composant électronique, et dans laquelle le substrat, une couche d'adhésion isolée et le composant électronique sont disposés en couches dans cet ordre; une étape de pressage dans laquelle l'électrode du composant électronique et l'électrode du substrat sont mises en contact au moyen de la couche d'adhésion isolée en pressant le composant électronique sur le substrat; une étape de durcissement thermique dans laquelle la couche d'adhésion isolée est durcie thermiquement par chauffage de la couche d'adhésion isolée à une première température; et une étape de liaison métallique dans laquelle une couche de liaison métallique comprenant la soudure est formée entre l'électrode du substrat et l'électrode du composant électronique par chauffage de la soudure à une seconde température.
PCT/JP2011/000071 2010-01-22 2011-01-11 Procédé de fabrication de corps monté et dispositif de montage Ceased WO2011089862A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010012275A JP2011151259A (ja) 2010-01-22 2010-01-22 実装体の製造方法および実装装置
JP2010-012275 2010-01-22

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WO2011089862A1 true WO2011089862A1 (fr) 2011-07-28

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TW (1) TW201140767A (fr)
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JP6140531B2 (ja) * 2013-05-30 2017-05-31 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 半導体チップ接合装置および半導体チップ接合方法
CN106576427A (zh) 2014-08-13 2017-04-19 R.R.当纳利父子公司 生产电子器件的方法和设备
EP3183693B1 (fr) 2014-08-19 2018-08-29 R. R. Donnelley & Sons Company Appareil et procédé pour surveiller un paquet pendant un transit
US10379072B2 (en) 2016-01-04 2019-08-13 Cryovac, Llc Multiple detector apparatus and method for monitoring an environment
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JP6690308B2 (ja) * 2016-03-08 2020-04-28 日立化成株式会社 半導体装置を製造する方法
US10342136B2 (en) 2016-09-23 2019-07-02 R.R. Donnelley & Sons Company Monitoring device
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JP7670731B2 (ja) * 2020-11-25 2025-04-30 株式会社Fuji 電気回路形成方法、および電気回路形成装置

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JP2011151259A (ja) 2011-08-04

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