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WO2011087215A3 - Carte sonde - Google Patents

Carte sonde Download PDF

Info

Publication number
WO2011087215A3
WO2011087215A3 PCT/KR2010/009143 KR2010009143W WO2011087215A3 WO 2011087215 A3 WO2011087215 A3 WO 2011087215A3 KR 2010009143 W KR2010009143 W KR 2010009143W WO 2011087215 A3 WO2011087215 A3 WO 2011087215A3
Authority
WO
WIPO (PCT)
Prior art keywords
interface blocks
wires
lower parts
substrate pieces
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/009143
Other languages
English (en)
Korean (ko)
Other versions
WO2011087215A2 (fr
Inventor
김형익
이호준
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mico TN Ltd
Original Assignee
Mico TN Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mico TN Ltd filed Critical Mico TN Ltd
Publication of WO2011087215A2 publication Critical patent/WO2011087215A2/fr
Publication of WO2011087215A3 publication Critical patent/WO2011087215A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Power Engineering (AREA)

Abstract

L'invention concerne une carte sonde qui comprend des structures de sonde, des pièces de substrat, des blocs d'interface, des cartes de support et des cartes de circuit imprimé. Les structures de sonde comprennent des sondes qui transmettent et reçoivent des signaux électriques de et vers une pastille de puce d'une cible d'inspection par l'intermédiaire d'un contact physique. Les pièces de substrat sont respectivement agencées dans les parties inférieures des structures de sonde, elles sont électriquement raccordées aux sondes et elles sont équipées de fils de différentes longueurs sur les surfaces supérieures et inférieures. Les blocs d'interface sont respectivement agencés dans les parties inférieures des pièces de substrat, ils sont respectivement raccordés aux fils et ils sont équipés d'éléments de raccordement de mêmes longueurs sur les surfaces supérieures et inférieures. Les cartes de support comprennent des orifices à travers lesquels les blocs d'interface sont insérés afin d'être attachés de manière détachable respectivement à celles-ci et elles supportent les blocs d'interface. Les cartes de circuit imprimé sont agencées dans les parties inférieures des cartes de support et elles sont équipées de fils respectivement raccordés électriquement aux éléments de raccordement des blocs d'interface.
PCT/KR2010/009143 2010-01-13 2010-12-21 Carte sonde Ceased WO2011087215A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100003060A KR101674135B1 (ko) 2010-01-13 2010-01-13 프로브 카드
KR10-2010-0003060 2010-01-13

Publications (2)

Publication Number Publication Date
WO2011087215A2 WO2011087215A2 (fr) 2011-07-21
WO2011087215A3 true WO2011087215A3 (fr) 2011-11-10

Family

ID=44304760

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/009143 Ceased WO2011087215A2 (fr) 2010-01-13 2010-12-21 Carte sonde

Country Status (2)

Country Link
KR (1) KR101674135B1 (fr)
WO (1) WO2011087215A2 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101229233B1 (ko) * 2011-08-17 2013-02-04 (주)기가레인 프로브카드
KR101280419B1 (ko) * 2011-08-17 2013-06-28 (주)기가레인 프로브카드
WO2015132747A1 (fr) * 2014-03-06 2015-09-11 Technoprobe S.P.A. Carte sonde à haute planéité pour appareil de test pour dispositifs électroniques
KR101785428B1 (ko) 2016-04-21 2017-10-16 (주) 마이크로프랜드 반도체소자 테스트소켓
IT201600079679A1 (it) * 2016-07-28 2018-01-28 Technoprobe Spa Scheda di misura di dispositivi elettronici
IT201700017061A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura perfezionata per applicazioni ad alta frequenza
CN107272046B (zh) * 2017-06-09 2023-10-03 东莞中子科学中心 用于测量束流剖面的探测器
KR102139584B1 (ko) * 2019-03-07 2020-07-30 (주)티에스이 반도체 소자 테스트용 소켓 장치
KR102342805B1 (ko) * 2019-12-26 2021-12-23 (주)포인트엔지니어링 프로브 카드
KR102361396B1 (ko) * 2020-04-22 2022-02-10 (주)포인트엔지니어링 양극산화막 구조체 및 이를 포함하는 프로브 카드
KR102821919B1 (ko) * 2020-04-22 2025-06-17 (주)포인트엔지니어링 프로브 카드
KR102388030B1 (ko) * 2020-07-15 2022-04-20 (주)엠투엔 프로브 핀, 이를 제조하는 방법 및 이를 구비하는 프로브 카드
KR102685223B1 (ko) * 2022-04-27 2024-07-17 (주)티에스이 프로브의 돌출길이가 조정되는 프로브 헤드
KR102742433B1 (ko) * 2022-04-27 2024-12-16 (주)티에스이 프로브의 돌출길이가 조정되는 프로브 헤드
KR102520860B1 (ko) * 2022-11-08 2023-04-12 주식회사 유니밴스 열변형 개선 스티프너 프로브 카드

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US20040113640A1 (en) * 2002-12-16 2004-06-17 Cooper Timothy E. Apparatus and method for limiting over travel in a probe card assembly
US20050035775A1 (en) * 2003-08-13 2005-02-17 Yu Zhou Probe contact system using flexible printed circuit board
US20070152689A1 (en) * 2006-01-03 2007-07-05 Chipmos Technologies (Bermuda) Ltd. Modular probe card
KR20080075978A (ko) * 2007-02-14 2008-08-20 (주) 미코티엔 탐침 구조물 및 이를 갖는 프로브 카드
KR20090080210A (ko) * 2008-01-21 2009-07-24 (주) 미코티엔 탐침 구조물 및 이를 갖는 전기적 검사 장치
KR20090096582A (ko) * 2009-04-22 2009-09-11 주식회사 엠아이티 어드밴스 프로브카드와 그의 프로브헤드 조립체 구성방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US20040113640A1 (en) * 2002-12-16 2004-06-17 Cooper Timothy E. Apparatus and method for limiting over travel in a probe card assembly
US20050035775A1 (en) * 2003-08-13 2005-02-17 Yu Zhou Probe contact system using flexible printed circuit board
US20070152689A1 (en) * 2006-01-03 2007-07-05 Chipmos Technologies (Bermuda) Ltd. Modular probe card
KR20080075978A (ko) * 2007-02-14 2008-08-20 (주) 미코티엔 탐침 구조물 및 이를 갖는 프로브 카드
KR20090080210A (ko) * 2008-01-21 2009-07-24 (주) 미코티엔 탐침 구조물 및 이를 갖는 전기적 검사 장치
KR20090096582A (ko) * 2009-04-22 2009-09-11 주식회사 엠아이티 어드밴스 프로브카드와 그의 프로브헤드 조립체 구성방법

Also Published As

Publication number Publication date
KR20110083053A (ko) 2011-07-20
KR101674135B1 (ko) 2016-11-09
WO2011087215A2 (fr) 2011-07-21

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