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WO2011087188A1 - Led lamp having detachable heat sink - Google Patents

Led lamp having detachable heat sink Download PDF

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Publication number
WO2011087188A1
WO2011087188A1 PCT/KR2010/003045 KR2010003045W WO2011087188A1 WO 2011087188 A1 WO2011087188 A1 WO 2011087188A1 KR 2010003045 W KR2010003045 W KR 2010003045W WO 2011087188 A1 WO2011087188 A1 WO 2011087188A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
led
led lamp
light
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/003045
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French (fr)
Korean (ko)
Inventor
변문기
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PUYO ELECTRONICS CO Ltd
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PUYO ELECTRONICS CO Ltd
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Publication date
Application filed by PUYO ELECTRONICS CO Ltd filed Critical PUYO ELECTRONICS CO Ltd
Publication of WO2011087188A1 publication Critical patent/WO2011087188A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/02Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for adjustment
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/04Refractors for light sources of lens shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

Definitions

  • the present invention relates to a LED lamp of the floodlight type to form a heat dissipating unit by stacking a removable heat dissipation plate, more specifically to ensure the optimum cooling effect by adjusting the number of removable heat dissipation plate mounted on the lamp body according to external conditions
  • the present invention relates to an LED lamp having a removable heat sink.
  • LED Light Emitting Diode
  • LED Light Emitting Diode
  • LED Light Emitting Diode
  • it has the advantage of being an eco-friendly light source that can realize light of low power consumption, long life and various colors.
  • deterioration of the LED element occurs when the driving temperature of the LED element exceeds 60 degrees. Therefore, in order to apply the LED element to the lamp, a heat dissipation system that can effectively cool the heat generated from the LED element must be equipped.
  • the present invention was developed to solve the above problems, by adjusting the number of removable heat dissipation plate mounted on the LED lamp body according to the heat dissipation conditions of the place to be installed, so as to ensure the optimum cooling effect according to the place It is an object of the present invention to provide an LED lamp having a removable heat sink.
  • each removable heat dissipation plate is mounted on the LED light body one by one, by changing the shape of the removable heat dissipation plate, it is possible to easily configure the LED light having an optimized structure in the installation place.
  • the LED lamp can be configured to be applied to a building having a high height.
  • FIG. 1 is a front view of the LED lamp having a removable heat dissipation plate according to the present invention.
  • Figure 2 is a cross-sectional view of the LED lamp having a removable heat dissipation plate according to the present invention.
  • Figure 3 is an exploded view of the LED lamp having a removable heat dissipation plate according to the present invention.
  • Figure 4 is a modified view of the LED lamp having a removable heat dissipation plate according to the present invention.
  • FIG. 5 is an exploded perspective view showing a main portion of the present invention.
  • FIG. 6 is a cross-sectional view showing the main portion of the present invention.
  • Figure 7 is a cross-sectional view showing a state in which another embodiment of the disk guide applied to the present invention is applied.
  • FIG. 8 is a view showing another embodiment of a disk guide applied to the present invention.
  • An object of the present invention is to solve the above problem that it is difficult to configure an LED lamp having an optimized heat dissipation system due to different heat dissipation conditions depending on the installation place in the design of the LED lamp.
  • a light source is formed using an LED element, and one or more removable heat sinks are mounted on the LED lamp body including the LED light source so that heat generated from the LED light source can be transferred to the heat sink. It was.
  • This lamp is characterized in that it is possible to easily configure the heat dissipation unit optimized for the installation site by adjusting the number of the removable heat sink is mounted according to the environment of the installation site.
  • FIG. 1 and 2 are a front view and a cross-sectional view of an LED lamp having a removable heat dissipation plate according to the present invention, wherein the heat dissipation unit 20 comprising one or more removable heat dissipation plates 22 and one or more disc guides 21 and an LED lamp Top plate 10, reflective shade 70, LED module 30, aspherical lens 82 for transmitting the light emitted from the LED module away, lens holder 81 for holding the aspherical lens and lens holder cover Removable heat dissipation plate (83), consisting of a converter 40 for supplying power to the LED module, the lower plate 50 of the LED lamp to which the converter 40 is mounted, the bracket portion 60 used to install the LED light It shows the structure of the LED lamp having.
  • the heat dissipation unit 20 comprising one or more removable heat dissipation plates 22 and one or more disc guides 21 and an LED lamp Top plate 10, reflective shade 70, LED module 30, aspherical lens 82 for transmitting the light emitted from the LED module
  • the LED module 30 used as a light source of an LED lamp emits light and emits a large amount of heat, and this heat is applied to the LED lamp top plate 10 made of aluminum through one or more disk guides 21 of the same aluminum material. ) And one or more removable heat dissipation plates 22 to be released to the outside.
  • FIG. 3 is an exploded view of an LED lamp having a removable heat sink according to the present invention.
  • a plurality of heat sinks 22 are laminated between the LED light upper plate 10 and the LED light lower plate 50 to form a heat dissipation unit 20, the LED light upper plate 10 and the LED light lower plate 50.
  • the heat sink is formed between the upper plate 10 and the lower plate 50, and forms a plurality of pinholes 10a and 50a in an annular portion at the center of the ring, and a plurality of long holes 10b and 50b to the outside thereof.
  • the pinhole 22a and the long hole 22b are also formed in the 22, and a donut-shaped disk guide 21 having a thicker thickness than the heat sink 22 is sandwiched between the heat sinks 22 to be installed.
  • a plurality of pinholes corresponding to the pinholes 22a are drilled in the 21.
  • the disc plate 21 is interposed between the heat sinks 22, and then the top plate 10 and the bottom plate 50 are disposed upward and downward of the guide 21.
  • the inner guide pin 11 is inserted into the pinholes 10a, 22a, and 50a, and then the screws 94 are assembled at both ends of the inner guide pin 11 to form a plurality of upper and lower plates 10 and 50, respectively.
  • the heat sinks 22 are to be installed at predetermined intervals.
  • the number of heat sinks 22 provided between the upper plate 10 and the lower plate 50 can be appropriately varied according to the capacity of the LED module 30 as a light source.
  • the converter 40 is fixedly coupled to the bottom of the LED lamp lower plate 50 using the screw 95, and both ends of the bracket 61 are installed when installing the bracket 61 for mounting the lamp on the wall or ceiling.
  • the bracket holder 62 is fastened by being fixed as a bolt 63, and the bracket holder 62 is screwed onto the lower plate 50 using the side guide pin 12 and the screw 94 to fix the bracket (62).
  • the hook 64 is assembled to the nut 96 as a nut 96, the hook 64 is mounted on the wall or ceiling using the hook 64 or the bracket 61.
  • Reflector 70 is installed on the upper surface of the upper plate 10 to accommodate the reflector 70.
  • the reflector 70 is formed in a dome shape and has a reflector cover 71 having a reflecting surface 72 reflecting light forward.
  • the cover glass 74 is coupled to the open end of the reflector cover 71 by using a silicon ring 73.
  • the aspherical lens 82 is installed inside the reflection shade 70 so as to be located inside the reflection shade 70, more specifically, in front of the LED module 30.
  • the lens holder cover inside the reflection shade 70 A lens holder 81 is provided, and an aspherical lens 82 is provided in the lens holder cover 83 of the lens holder 81 so that the light irradiated from the LED module 30 is an aspherical lens ( 82 is collected and diverged to the center through the light, and the light scattered to the periphery of the aspherical lens 82 is collected again by using the reflecting surface 72 of the reflecting shade 70 to dramatically increase the light reach. Make it work.
  • a plurality of vent grooves 21a are formed on the upper or lower surface of the disk guide 21 from the outside toward the center as shown in FIG. 8, so that the disk guide 21 is installed between the plurality of heat sinks 22.
  • the air flow from the outer side to the inner side or the inner side to the outer side through the vent groove 21a is possible to further improve the heat dissipation efficiency.
  • the LED module 30 composed of one or more LED elements 31 and a metal PCB 32 emits light and heat generated is transmitted to the one or more disk guides 21 through the LED lamp top plate 10. Is delivered to and released from the at least one removable heat dissipation plate 22.
  • the one or more disk guides 21 serve to maintain a distance between the one or more removable heat dissipation plates 22 to facilitate heat dissipation, and the air may flow upward and downward through the long holes 10b, 22b, and 50b.
  • a thermally conductive compound is sufficiently filled in each bonding surface.
  • the one or more disk guides 21 and the one or more removable heat sinks 22 are aligned with each other by one or more inner guide pins 11 and one or more side guide pins 12 and have a mechanical strength against external impact. To be guaranteed.
  • the number of the removable heat dissipation plate 22 and the disk guide 21 mounted on the LED lamp upper plate 10 is greater than or equal to 55 degrees at the surface temperature of the LED element 31 constituting the LED module 30.
  • the minimum quantity that can be prevented from climbing is determined by the location where the LED light having a removable heat sink is installed.
  • FIG. 4 is a modified view of the LED lamp having a removable heat dissipation plate according to the present invention, wherein the shape of the removable heat dissipation plate 22 is changed, and the reflection shade 70, the aspherical lens 82, the lens holder 81 and the lens It is an application example in which the shape of a lamp was easily changed by attaching the diffusion glass cover 84 and the diffusion glass cover holder 85 instead of the holder cover 83.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to a floodlight-type LED lamp in which detachable heat radiation plates are stacked to configure a heat radiation part, and in which a heat radiation part having an optimum cooling capability can be easily configured by adjusting the number and the amount of space in between the detachable heat radiation plates mounted on a lamp body depending on the environmental conditions under which the lamp is installed.

Description

탈착식 방열 판을 가지는 엘이디 조명등LED light with removable heat sink

본 발명은 탈착식 방열 판을 적층 시켜 방열부를 구성하는 투광등 형태의 LED 조명등에 관한 것으로, 더욱 구체적으로는 외부 조건에 따라 조명등 몸체에 장착되는 탈착식 방열 판의 수를 조절함으로써 최적의 냉각 효과를 보장할 수 있도록 한 탈착식 방열 판을 가지는 LED 조명등에 관한 것이다.The present invention relates to a LED lamp of the floodlight type to form a heat dissipating unit by stacking a removable heat dissipation plate, more specifically to ensure the optimum cooling effect by adjusting the number of removable heat dissipation plate mounted on the lamp body according to external conditions The present invention relates to an LED lamp having a removable heat sink.

LED(Light Emitting Diode, 발광다이오드)는 전압을 인가하면 빛이 발광(發光) 되는 반도체의 일종으로써, 전력 소모가 적고 수명이 길며 다양한 색상의 빛을 구현할 수 있는 친환경적인 광원이라는 장점이 있다. 하지만, 열에 취약하기 때문에 LED 소자의 구동 온도가 60도 이상이 되면 LED 소자의 열화가 일어나게 된다. 따라서 LED 소자를 조명등에 적용하기 위해서는 LED 소자에서 발생하는 열을 효과적으로 냉각할 수 있는 방열 시스템이 반드시 갖추어져야만 한다.LED (Light Emitting Diode) is a kind of semiconductor that emits light when voltage is applied, and it has the advantage of being an eco-friendly light source that can realize light of low power consumption, long life and various colors. However, since it is vulnerable to heat, deterioration of the LED element occurs when the driving temperature of the LED element exceeds 60 degrees. Therefore, in order to apply the LED element to the lamp, a heat dissipation system that can effectively cool the heat generated from the LED element must be equipped.

하지만, LED 조명등이 설치되는 장소에 따라 요구되는 방열 조건 역시 각기 달라지기 때문에 어떤 경우에는 실제 필요한 방열 효과보다 큰 방열 능력을 가지는 방열 시스템이 조명등에 장착되고, 또 다른 경우에는 장착된 방열 시스템의 방열 능력이 부족하여 LED 소자에서 발생하는 열을 제대로 빼주지 못하게 되는 경우가 발생하고 있는 실정이다.However, since the heat dissipation requirements are also different depending on where the LED lamp is installed, in some cases a heat dissipation system having a greater heat dissipation capacity than the actual heat dissipation effect is mounted on the lamp, and in other cases, heat dissipation of the mounted heat dissipation system. There is a case that the lack of ability to properly remove the heat generated from the LED device.

본 발명은 상기와 같은 문제점을 해결하기 위해 개발된 것으로, 설치되는 장소의 방열 조건에 따라 LED 조명등 몸체에 장착되는 탈착식 방열 판의 수를 조절함으로써, 장소에 따라 최적의 냉각 효과를 보장할 수 있도록 한 탈착식 방열 판을 가지는 LED 조명등을 제공할 수 있도록 함을 그 목적으로 한다.The present invention was developed to solve the above problems, by adjusting the number of removable heat dissipation plate mounted on the LED lamp body according to the heat dissipation conditions of the place to be installed, so as to ensure the optimum cooling effect according to the place It is an object of the present invention to provide an LED lamp having a removable heat sink.

본 발명의 LED 조명등 몸체에 탈착식 방열판을 적층 식으로 장착하여 원하는 방열 능력을 가지는 LED 조명등을 쉽게 구현할 수 있도록 한 것이다.By attaching a removable heat sink to the LED lamp body of the present invention in a laminated manner, it is possible to easily implement an LED lamp having a desired heat dissipation ability.

본 발명에 따른 탈착식 방열 판을 가지는 LED 조명등에 대한 효과는 다음과 같다.Effects of the LED lamp having a removable heat dissipation plate according to the present invention are as follows.

첫째, LED 조명등 몸체에 탈착식 방열 판을 적층 식으로 하나씩 장착시킴으로써 원하는 방열 능력을 가지는 LED 조명등을 쉽게 구성할 수 있다.First, it is possible to easily configure the LED lamp having the desired heat dissipation ability by mounting the removable heat sink to the LED lamp body one by one in a laminated manner.

둘째, LED 조명등 몸체에 개개의 탈착식 방열 판이 하나씩 장착되는 구조이기 때문에 탈착식 방열 판의 형태를 변경하여 설치함으로써 설치 장소에 최적화된 구조를 가지는 LED 조명등을 쉽게 구성할 수 있다.Second, since each removable heat dissipation plate is mounted on the LED light body one by one, by changing the shape of the removable heat dissipation plate, it is possible to easily configure the LED light having an optimized structure in the installation place.

셋째, LED 모듈로부터 방출되는 빛이 비구면 렌즈와 반사 갓을 통해 외부로 조사되면서 그 도달 거리를 비약적으로 늘릴 수 있기 때문에 높은 전고를 가지는 건물에도 적용할 수 있는 LED 조명등을 구성할 수 있다.Third, since the light emitted from the LED module is irradiated to the outside through the aspherical lens and the reflection shade, the reach can be dramatically increased, so that the LED lamp can be configured to be applied to a building having a high height.

도 1은 본 발명에 의한 탈착식 방열 판을 가지는 LED 조명등의 정면도.1 is a front view of the LED lamp having a removable heat dissipation plate according to the present invention.

도 2는 본 발명에 의한 탈착식 방열 판을 가지는 LED 조명등의 단면도.Figure 2 is a cross-sectional view of the LED lamp having a removable heat dissipation plate according to the present invention.

도 3은 본 발명에 의한 탈착식 방열 판을 가지는 LED 조명등의 분해도.Figure 3 is an exploded view of the LED lamp having a removable heat dissipation plate according to the present invention.

도 4는 본 발명에 의한 탈착식 방열 판을 가지는 LED 조명등의 변형도.Figure 4 is a modified view of the LED lamp having a removable heat dissipation plate according to the present invention.

도 5 는 본 발명의 요부구성을 보인 분해 사시도.5 is an exploded perspective view showing a main portion of the present invention.

도 6 은 본 발명의 요부구성을 보인 단면도.6 is a cross-sectional view showing the main portion of the present invention.

도 7 은 본 발명에 적용된 디스크 가이드의 다른 실시예가 적용된 상태를 보인 단면도.Figure 7 is a cross-sectional view showing a state in which another embodiment of the disk guide applied to the present invention is applied.

도 8 은 본 발명에 적용된 디스크 가이드의 다른 실시예를 보인 도면.8 is a view showing another embodiment of a disk guide applied to the present invention.

<도면의 주요 부분에 대한 도면 부호의 설명><Description of reference numerals for the main parts of the drawings>

10: LED 조명등 상판, 11: 내부 가이드 핀,10: LED lamp tops, 11: internal guide pins,

12: 사이드 가이드 핀, 20: 방열부,12: side guide pin, 20: heat dissipation unit,

21: 디스크 가이드, 22: 방열 판,21: disc guide, 22: heat sink,

30: LED 모듈, 31: LED 소자,30: LED module, 31: LED element,

32: 메탈 PCB, 40: 컨버터,32: metal PCB, 40: converter,

50: LED 조명등 하판, 60: 브라켓 부,50: the bottom of the LED light, 60: bracket portion,

61: 브라켓, 62: 브라켓 홀더,61: bracket, 62: bracket holder,

63: 볼트, 64: 후크,63: bolts, 64: hooks,

70: 반사 갓, 71: 반사 갓 커버,70: reflective lampshade 71: reflective lampshade cover,

72: 반사면, 73: 실리콘 링,72: reflecting surface, 73: silicon ring,

74: 커버 유리, 81: 렌즈 홀더, 74: cover glass, 81: lens holder,

82: 비구면 렌즈, 83: 렌즈 홀더 커버,82: aspherical lens, 83: lens holder cover,

84: 확산 유리 커버, 85: 확산 유리 커버 홀더,84: diffuse glass cover, 85: diffuse glass cover holder,

91~95: 나사, 96: 후크 고정용 너트.91-95: screw, 96: hook fixing nut.

21a: 통기홈,21a: ventilation groove,

본 발명의 LED 조명등 몸체에 탈착식 방식으로 방열 판을 설치 구성하여 상기 방열판에 의해 LED소자 열에 의해 파괴되는 것을 방지함은 물론 상기 방열판을 탈부착하여 LED 소자에서 발생되는 열을 최적의 형태로 방열할 수 있도록 한 것이다.By installing a heat dissipation plate in a detachable manner in the LED lamp body of the present invention to prevent being destroyed by the heat of the LED element by the heat dissipation as well as detaching the heat dissipation can dissipate heat generated in the LED element in an optimal form. It would be.

본 발명은 LED 조명등을 설계함에 있어 설치 장소에 따라 각기 다른 방열 조건으로 인해, 최적화된 방열 시스템을 가지는 LED 조명등을 구성하기 힘들다는 상기의 문제점을 해결하는 것을 목적으로 한다.An object of the present invention is to solve the above problem that it is difficult to configure an LED lamp having an optimized heat dissipation system due to different heat dissipation conditions depending on the installation place in the design of the LED lamp.

상기의 목적을 달성하기 위해 LED 소자를 이용하여 광원을 형성하고, 이 LED 광원을 포함한 LED 조명등 몸체에 탈착식 방열 판을 하나 이상 장착함으로써 LED 광원에서 발생한 열이 탈착식 방열 판에 전달되어 방열 될 수 있도록 하였다.In order to achieve the above object, a light source is formed using an LED element, and one or more removable heat sinks are mounted on the LED lamp body including the LED light source so that heat generated from the LED light source can be transferred to the heat sink. It was.

본 조명등은 설치되는 장소의 환경에 따라 장착되는 탈착식 방열 판이 장착되는 수를 조절함으로써 설치되는 장소에 최적화된 방열부를 쉽게 구성할 수 있다는 것을 특징으로 한다.This lamp is characterized in that it is possible to easily configure the heat dissipation unit optimized for the installation site by adjusting the number of the removable heat sink is mounted according to the environment of the installation site.

이하, 첨부된 도면을 참조하여 본 발명을 설명하면 다음과 같다.Hereinafter, the present invention will be described with reference to the accompanying drawings.

도 1과 도 2는 본 발명에 의한 탈착식 방열 판을 가지는 LED 조명등의 정면도와 단면도로써, 하나 이상의 탈착식 방열 판(22) 및 하나 이상의 디스크 가이드(21)로 구성된 방열부(20)와, LED 조명등 상판(10), 반사 갓(70), LED 모듈(30), 상기 LED 모듈로부터 방출되는 빛을 멀리 전달시켜주는 비구면 렌즈(82), 상기 비구면 렌즈를 잡아주는 렌즈 홀더(81) 및 렌즈 홀더 커버(83), 상기 LED 모듈에 전원을 공급해주는 컨버터(40), 상기 컨버터(40)가 장착되는 LED 조명등 하판(50), LED 조명을 설치하는데 사용되는 브라켓 부(60)로 구성되는 탈착식 방열 판을 가지는 LED 조명등의 구조를 보여준다.1 and 2 are a front view and a cross-sectional view of an LED lamp having a removable heat dissipation plate according to the present invention, wherein the heat dissipation unit 20 comprising one or more removable heat dissipation plates 22 and one or more disc guides 21 and an LED lamp Top plate 10, reflective shade 70, LED module 30, aspherical lens 82 for transmitting the light emitted from the LED module away, lens holder 81 for holding the aspherical lens and lens holder cover Removable heat dissipation plate (83), consisting of a converter 40 for supplying power to the LED module, the lower plate 50 of the LED lamp to which the converter 40 is mounted, the bracket portion 60 used to install the LED light It shows the structure of the LED lamp having.

LED 조명등의 광원으로 사용되는 LED 모듈(30)은 빛을 발광하면서 많은 양의 열을 발산하게 되고 이 열은 알루미늄 재질의 LED 조명등 상판(10)을 통해 역시 같은 알루미늄 재질의 하나 이상의 디스크 가이드(21) 및 하나 이상의 탈착식 방열 판(22)으로 전달되어 외부로 방출된다. The LED module 30 used as a light source of an LED lamp emits light and emits a large amount of heat, and this heat is applied to the LED lamp top plate 10 made of aluminum through one or more disk guides 21 of the same aluminum material. ) And one or more removable heat dissipation plates 22 to be released to the outside.

도 3은 본 발명에 의한 탈착식 방열 판을 가지는 LED 조명등의 분해도이다.3 is an exploded view of an LED lamp having a removable heat sink according to the present invention.

도면과 같이 LED 조명등 상판(10)과 LED 조명등 하판(50) 사이에 다수의 방열판(22)을 적층하여 방열부(20)를 이루도록 구성하는데, LED 조명등 상판(10)과 LED 조명등 하판(50)의 중앙부에 환형으로 다수의 핀홀(10a)(50a)을 형성하고, 그 외곽으로는 다수의 장공(10b)(50b)을 형성하며, 상판(10)과 하판(50)의 사이에 설치되는 방열판(22)에도 핀홀(22a)과 장공(22b)이 형성되고, 설치되는 방열판(22)들 사이에는 방열판(22)에 비해 두께가 두꺼운 도우넛 형상의 디스크 가이드(21)가 끼워지며, 이 디스크 가이드(21)에는 핀홀(22a)에 대응하는 복수개의 핀홀이 타공되어 있다.As shown in the drawing, a plurality of heat sinks 22 are laminated between the LED light upper plate 10 and the LED light lower plate 50 to form a heat dissipation unit 20, the LED light upper plate 10 and the LED light lower plate 50. The heat sink is formed between the upper plate 10 and the lower plate 50, and forms a plurality of pinholes 10a and 50a in an annular portion at the center of the ring, and a plurality of long holes 10b and 50b to the outside thereof. The pinhole 22a and the long hole 22b are also formed in the 22, and a donut-shaped disk guide 21 having a thicker thickness than the heat sink 22 is sandwiched between the heat sinks 22 to be installed. A plurality of pinholes corresponding to the pinholes 22a are drilled in the 21.

상기 방열판(22)들을 상판(10)과 하판(50)사이에 설치할 때에는 방열판(22) 사이에 디스크 가이드(21)를 개재한 후 가이드(21)의 상하측으로 상판(10)과 하판(50)을 맞대고, 내부 가이드핀(11)을 핀홀(10a,22a,50a)로 끼운 후 내부 가이드핀(11)의 양단에 나사(94)를 조립하여 상판(10)과 하판(50) 사이에 다수의 방열판(22)들이 소정 간격으로 설치되도록 하는 것이다.When the heat sinks 22 are installed between the top plate 10 and the bottom plate 50, the disc plate 21 is interposed between the heat sinks 22, and then the top plate 10 and the bottom plate 50 are disposed upward and downward of the guide 21. Face each other, the inner guide pin 11 is inserted into the pinholes 10a, 22a, and 50a, and then the screws 94 are assembled at both ends of the inner guide pin 11 to form a plurality of upper and lower plates 10 and 50, respectively. The heat sinks 22 are to be installed at predetermined intervals.

상판(10)과 하판(50)사이에 설치되는 방열판(22)의 갯수는 광원인 LED 모듈(30)의 용량에 따라 적절히 가변시킬 수 있다.The number of heat sinks 22 provided between the upper plate 10 and the lower plate 50 can be appropriately varied according to the capacity of the LED module 30 as a light source.

그리고, 컨버터(40)를 나사(95)를 이용하여 LED 조명등 하판(50)의 저면에 고정 결합하며, 조명등을 벽면이나 천정에 거치하기 위한 브라켓(61)을 설치할 때에는 브라켓(61)의 양단을 브라켓 홀더(62)에 볼트(63)로서 결합하여 고정시키고, 그 브라켓 홀더(62)를 사이드 가이드 핀(12)과 나사(94)를 이용하여 하판(50)에 나사조립하여 고정시키며, 브라켓(61)에 후크(64)를 너트(96)로서 조립하여 조명등을 거치하고자 할 때에는 후크(64) 또는 브라켓(61)을 이용하여 벽면이나 천정에 설치한다.Then, the converter 40 is fixedly coupled to the bottom of the LED lamp lower plate 50 using the screw 95, and both ends of the bracket 61 are installed when installing the bracket 61 for mounting the lamp on the wall or ceiling. The bracket holder 62 is fastened by being fixed as a bolt 63, and the bracket holder 62 is screwed onto the lower plate 50 using the side guide pin 12 and the screw 94 to fix the bracket (62). When the hook 64 is assembled to the nut 96 as a nut 96, the hook 64 is mounted on the wall or ceiling using the hook 64 or the bracket 61.

한편, LED 조명등 상판(10)의 상부면 중앙에 다수의 LED 소자(31)가 메탈 PCB(32)에 장착되어 있는 LED 모듈(30)을 나사(93)를 이용하여 설치하고, LED 모듈(30)을 수용하도록 상판(10)의 상부면에 반사갓(70)을 설치하는데, 반사갓(70)은 돔 형상으로 이루어지고 내측에 빛을 전방으로 반사시키는 반사면(72)이 형성된 반사갓 커버(71)를 구비하고, 이 반사갓 커버(71)의 개구단에 커버유리(74)를 실리콘링(73)을 이용하여 결합시켜 구성한다.On the other hand, in the center of the upper surface of the LED lamp upper plate 10, the LED module 30, in which a plurality of LED elements 31 are mounted on the metal PCB 32, is installed using the screw 93, and the LED module 30 Reflector 70 is installed on the upper surface of the upper plate 10 to accommodate the reflector 70. The reflector 70 is formed in a dome shape and has a reflector cover 71 having a reflecting surface 72 reflecting light forward. The cover glass 74 is coupled to the open end of the reflector cover 71 by using a silicon ring 73.

상기한 반사갓(70)의 내측, 더욱 상세하게는 LED모듈(30)의 전방에 위치하도록 비구면렌즈(82)를 반사갓(70) 내측에 설치하는데, 이를위하여 반사갓(70)의 내측에 렌즈홀더커버(83)가 구비된 렌즈홀더(81)를 설치하고, 이 렌즈홀더(81)의 렌즈홀더커버(83)에 비구면렌즈(82)를 설치하여 LED모듈(30)에서 조사되는 빛이 비구면 렌즈(82)를 통해 중앙으로 모이며 발산되고, 이 중 상기 비구면 렌즈(82)의 주변으로 산란하는 빛을 반사 갓(70)의 반사면(72)을 이용해 다시 모아 줌으로써 빛의 도달 거리를 비약적으로 향상시킬 수 있도록 한다.The aspherical lens 82 is installed inside the reflection shade 70 so as to be located inside the reflection shade 70, more specifically, in front of the LED module 30. To this end, the lens holder cover inside the reflection shade 70. A lens holder 81 is provided, and an aspherical lens 82 is provided in the lens holder cover 83 of the lens holder 81 so that the light irradiated from the LED module 30 is an aspherical lens ( 82 is collected and diverged to the center through the light, and the light scattered to the periphery of the aspherical lens 82 is collected again by using the reflecting surface 72 of the reflecting shade 70 to dramatically increase the light reach. Make it work.

또한, 상기 디스크 가이드(21)의 상면 또는 하면에 외측으로 부터 중심을 향하는 복수개의 통기홈(21a)을 도 8과 같이 형성하므로서, 다수의 방열판(22) 사이사이에 디스크 가이드(21)가 설치되었을때 상기 통기홈(21a)을 통해 외측에서 내측으로 또는 내측에서 외측으로의 공기 유동이 가능해져 방열효율을 한층 더 향상시킬 수 있게된다.In addition, a plurality of vent grooves 21a are formed on the upper or lower surface of the disk guide 21 from the outside toward the center as shown in FIG. 8, so that the disk guide 21 is installed between the plurality of heat sinks 22. When the air flow from the outer side to the inner side or the inner side to the outer side through the vent groove 21a is possible to further improve the heat dissipation efficiency.

하나 이상의 LED 소자(31)와 Metal PCB(32)로 구성된 상기 LED 모듈(30)이 발광하며 생성된 열은 상기 LED 조명등 상판(10)을 통해 상기 하나 이상의 디스크 가이드(21)에 전달되며 이 열은 다시 상기 하나 이상의 탈착식 방열 판(22)으로 전달되어 방출된다. 이때 상기 하나 이상의 디스크 가이드(21)는 상기 하나 이상의 탈착식 방열 판(22) 간에 거리를 유지시켜 열 방출을 원활히 해주는 역할을 하며, 장공(10b)(22b)(50b)을 통해 상하 방향으로 공기의 유동이 가능해지게되어 열 방출효율을 높여줄 수 있고, 또한 디스크 가이드(21a)에 형성된 통기홈(21a)을 통해 내외측으로도 공기의 유동이 이루어져 방열 효율은 더욱 향상될 수 있는 것이며, 상기 LED 조명등 상판(10)과 상기 하나 이상의 디스크 가이드(21) 및 상기 하나 이상의 탈착식 방열 판(22) 사이의 열 저항을 최소화하기 위하여 각각의 접합 면에 열전도성 컴파운드를 충분히 충진시켜 주도록 한다.The LED module 30 composed of one or more LED elements 31 and a metal PCB 32 emits light and heat generated is transmitted to the one or more disk guides 21 through the LED lamp top plate 10. Is delivered to and released from the at least one removable heat dissipation plate 22. In this case, the one or more disk guides 21 serve to maintain a distance between the one or more removable heat dissipation plates 22 to facilitate heat dissipation, and the air may flow upward and downward through the long holes 10b, 22b, and 50b. It is possible to flow to increase the heat dissipation efficiency, and also through the vent groove (21a) formed in the disk guide (21a) is the flow of air to the inside and the outside can be further improved heat dissipation efficiency, the LED lamp In order to minimize the thermal resistance between the top plate 10 and the at least one disk guide 21 and the at least one removable heat dissipation plate 22, a thermally conductive compound is sufficiently filled in each bonding surface.

또한, 상기 하나 이상의 디스크 가이드(21) 및 상기 하나 이상의 탈착식 방열 판(22)은 하나 이상의 내부 가이드 핀(11)과 하나 이상의 사이드 가이드 핀(12)에 의하여 서로 정렬되며 외부 충격에 대한 기계적 강도도 보장될 수 있게 한다. In addition, the one or more disk guides 21 and the one or more removable heat sinks 22 are aligned with each other by one or more inner guide pins 11 and one or more side guide pins 12 and have a mechanical strength against external impact. To be guaranteed.

상기 LED 조명등 상판(10)에 장착되는 상기 탈착식 방열 판(22) 및 상기 디스크 가이드(21)의 수는 상기 LED 모듈(30)을 구성하는 상기 LED 소자(31)의 표면 온도가 최대 55도 이상 올라가지 않도록 할 수 있는 최소 수량으로 정하며 이는 탈착식 방열 판을 가지는 LED 조명등이 설치되는 장소에 따라 달라진다.The number of the removable heat dissipation plate 22 and the disk guide 21 mounted on the LED lamp upper plate 10 is greater than or equal to 55 degrees at the surface temperature of the LED element 31 constituting the LED module 30. The minimum quantity that can be prevented from climbing is determined by the location where the LED light having a removable heat sink is installed.

도 4는 본 발명에 의한 탈착식 방열 판을 가지는 LED 조명등의 변형도로서, 상기 탈착식 방열 판(22)의 모양을 변경시키고 반사 갓(70)과 비구면 렌즈(82) 및 렌즈 홀더(81)와 렌즈 홀더 커버(83) 대신에 확산 유리 커버(84)와 확산 유리 커버 홀더(85)를 장착함으로써 쉽게 조명등의 모양을 변경한 적용 예이다.4 is a modified view of the LED lamp having a removable heat dissipation plate according to the present invention, wherein the shape of the removable heat dissipation plate 22 is changed, and the reflection shade 70, the aspherical lens 82, the lens holder 81 and the lens It is an application example in which the shape of a lamp was easily changed by attaching the diffusion glass cover 84 and the diffusion glass cover holder 85 instead of the holder cover 83.

Claims (7)

알루미늄 재질로 이루어진 LED 조명등 상판(10)과;LED lamp upper plate 10 made of aluminum; 하나 이상의 LED 소자(31)와 메탈 PCB(32)로 구성되어 LED 조명등 상판(10)에 설치되는 LED 모듈(30)과; An LED module 30 composed of one or more LED elements 31 and a metal PCB 32 and installed on the LED lamp top plate 10; LED 모듈(30)을 수용하도록 LED 조명등 상판(10)의 일면에 결합되는 반사갓(70)과;A reflection shade 70 coupled to one surface of the LED lamp upper plate 10 to accommodate the LED module 30; 상기 LED 모듈(30)로부터 방출되는 빛을 멀리 전달시켜주는 비구면 렌즈(82)와; An aspherical lens (82) for delivering light emitted from the LED module (30) away; 상기 비구면 렌즈(82)를 잡아줄 수 있도록 반사갓(70) 내측에 설치되는 렌즈 홀더(81) 및 렌즈 홀더 커버(83)와; A lens holder 81 and a lens holder cover 83 installed inside the reflection shade 70 so as to hold the aspherical lens 82; 하나 이상의 탈착식 방열 판(22) 및 하나 이상의 디스크 가이드(21)로 구성되어 상판(10)에 접하도록 설치되는 방열부(20)와; A heat dissipation unit 20 including one or more removable heat dissipation plates 22 and one or more disc guides 21 and installed to be in contact with the upper plate 10; 상기 LED 모듈(30)에 전원을 공급해주는 컨버터(40)와; A converter 40 for supplying power to the LED module 30; 상기 컨버터(40)가 장착되며 방열부(20)의 후단에 설치되는 LED 조명등 하판(50)과; An LED lamp lower plate 50 mounted with the converter 40 and installed at a rear end of the heat dissipation unit 20; 상기 LED 조명등 하단(50)에 설치되어 LED 조명을 설치하는데 사용되는 브라켓 부(60); 로 구성된 것을 특징으로 하는 탈착식 방열 판을 가지는 LED 조명등. A bracket part 60 installed at the bottom of the LED lamp 50 and used to install the LED light; LED lighting having a removable heat sink, characterized in that consisting of. 제 1항에 있어서,The method of claim 1, 상기 방열부(20)를 구성하는 탈착식 방열 판(22)과 디스크 가이드(21)의 장착 수량을 조절하여 조명등이 설치되는 장소에 따라 최적의 냉각 효율을 가질 수 있도록 하는 것을 특징으로 하는 탈착식 방열 판을 가지는 LED 조명등.Removable heat dissipation plate, characterized in that to achieve the optimum cooling efficiency according to the place where the lamp is installed by adjusting the number of mounting of the removable heat dissipation plate 22 and the disk guide 21 constituting the heat dissipation unit 20 LED lamp with a light. 제 1항에 있어서,The method of claim 1, 상기 방열부(20)를 구성하는 하나 이상의 디스크 가이드(21)의 높이를 변경하여 상기 방열부(20)를 구성하는 하나 이상의 탈착식 방열 판(22) 간의 거리를 조절함으로써 조명등이 설치되는 장소에 따라 최적의 냉각 효율을 가질 수 있도록 하는 것을 특징으로 하는 탈착식 방열 판을 가지는 LED 조명등.By changing the height of the at least one disk guide 21 constituting the heat dissipation unit 20 by adjusting the distance between the one or more removable heat dissipation plate 22 constituting the heat dissipation unit 20 according to the place where the lamp is installed. LED lighting lamp having a removable heat sink characterized in that it has an optimal cooling efficiency. 제 1항에 있어서, The method of claim 1, 상기 방열부(20)를 구성하는 하나 이상의 탈착식 방열 판(22)의 크기 및 모양을 변형시킴으로써 조명등이 설치되는 장소의 환경적 특징에 맞춰 조명등의 크기 및 모양을 쉽게 변형할 수 있음을 특징으로 하는 탈착식 방열 판을 가지는 LED 조명등.By modifying the size and shape of the at least one removable heat dissipation plate 22 constituting the heat dissipation unit 20 is characterized in that the size and shape of the light can be easily modified in accordance with the environmental characteristics of the place where the light is installed. LED light with removable heat sink. 제 1항에 있어서, The method of claim 1, 상기 LED 모듈(30)에서 방출되는 빛이 상기 비구면 렌즈(82)를 통해 중앙으로 모이며 발산되고, 반사갓(70)의 내측에 빛을 전방으로 반사하는 반사면(72)을 형성하여 상기 비구면 렌즈(82)의 주변으로 산란하는 빛이 반사면(72)에 의해 다시 모아 짐에 따라 빛의 도달 거리를 비약적으로 향상시킬 수 있음을 특징으로 하는 탈착식 방열 판을 가지는 LED 조명등.The light emitted from the LED module 30 is collected and diverged toward the center through the aspherical lens 82, and forms a reflective surface 72 reflecting light forwardly inside the reflection shade 70 to form the aspherical lens. LED light having a removable heat sink, characterized in that it can dramatically improve the reach of the light as the light scattered to the periphery of the (82) is collected by the reflecting surface (72). 제 1 항에 있어서, LED 조명등 상판(10)과 LED 조명등 하판(50)의 중앙부에 환형으로 다수의 핀홀(10a)(50a)을 형성하고, 그 외곽으로는 다수의 장공(10b)(50b)을 형성하며, 상판(10)과 하판(50)의 사이에 설치되는 방열판(22)에 핀홀(22a)과 장공(22b)이 형성되고, 설치되는 방열판(22)들 사이에는 방열판(22)에 비해 두께가 두꺼운 도우넛 형상의 디스크 가이드(21)가 끼워져 개재되며, 상기 핀홀을 통해 내부 가이드핀을 끼운 후 그 내부 가이드핀의 양단으로 나사를 결합하여 상판과 하판 사이에 다수의 방열판을 적층 결합한 것을 특징으로 하는 탈착식 방열판을 가지는 LED 조명등.According to claim 1, wherein the plurality of pinholes (10a) (50a) are formed in the center of the LED lamp upper plate 10 and the LED lamp lower plate 50 in an annular shape, and the outside of the plurality of long holes (10b) (50b) The pinhole 22a and the long hole 22b are formed in the heat sink 22 between the upper plate 10 and the lower plate 50, and the heat sink 22 is disposed between the heat sinks 22. The donut-shaped disk guide 21 having a thick thickness is inserted and interposed therebetween, and a plurality of heat sinks are laminated and coupled between the upper plate and the lower plate by inserting inner guide pins through the pinholes, and then coupling screws to both ends of the inner guide pins. LED lamp having a removable heat sink characterized in that. 제 1 항에 있어서, 상기 디스크 가이드의 상부면 또는 하부면에 외측과 내측을 연결하는 복수개의 통기홈을 환형으로 형성한 것을 특징으로 하는 탈착식 방열판을 가지는 LED 조명등.The LED lamp having a removable heat sink according to claim 1, wherein a plurality of ventilation grooves connecting the outside and the inside are formed in an annular shape on an upper surface or a lower surface of the disc guide.
PCT/KR2010/003045 2010-01-12 2010-05-14 Led lamp having detachable heat sink Ceased WO2011087188A1 (en)

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