WO2011075965A1 - Composite copper powder for manufacturing inner wall capillary structure of heat pipe - Google Patents
Composite copper powder for manufacturing inner wall capillary structure of heat pipe Download PDFInfo
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- WO2011075965A1 WO2011075965A1 PCT/CN2010/070912 CN2010070912W WO2011075965A1 WO 2011075965 A1 WO2011075965 A1 WO 2011075965A1 CN 2010070912 W CN2010070912 W CN 2010070912W WO 2011075965 A1 WO2011075965 A1 WO 2011075965A1
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- copper powder
- composite copper
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1121—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers
- B22F3/1125—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers involving a foaming process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
Definitions
- the present invention relates to a composite copper powder for use in the manufacture of a capillary wall inner wall capillary structure.
- the heat pipe includes a common sintered heat pipe, a composite heat pipe, a loop heat pipe, a Vapor chamber, and the like, and can be applied to aerospace, electric, electronic, and mechanical fields. Background technique
- Today's mainstream heat sink components include: cooling fans, heat sinks, heat sinks and heat sinks.
- the heat transfer fins, the heat dissipation module and the core heat transfer component of the heat sink are heat pipes.
- the heat pipe is composed of a metal pipe and a capillary structure layer on the inner wall of the pipe, and the inside thereof comprises: a hot fluid.
- the fluid absorbs heat to vaporize to form a high temperature gas, and the other end of the heat pipe condenses the high temperature gas due to a lower temperature.
- As a liquid fluid the liquid fluid returns to the heated end under the capillary force of the capillary structure layer, and thus repeats to form a continuous phase change heat transfer system.
- Aerospace engineering such as cooling and cooling of electronic warehouses and uniform temperature of surface of spacecraft
- Energy-saving projects such as various flue gases And waste heat recovery from air conditioning exhaust
- cooling of electronic components such as LEDs and computer components
- cooling of electrical systems such as engines or motors
- machining such as cooling of molds and tools.
- the capillary structure layer of the inner wall of the heat pipe is required to have a high porosity to ensure sufficient heat source contact area; on the other hand, it is required that the pores inside the structure jfr are connected well and have high capillary force, Ensure that ⁇ liquid fluid or media can pass smoothly and quickly in some devices.
- the commercially available copper powder has a porosity of less than 55% and a pore connectivity of less than 85% at a compaction sintering temperature of 900 - 1050 ° C.
- the water absorption rate of the capillary force is low and low. At 2.4 ⁇ /sec, it has been applied to the manufacture of heat pipes for low-end and mid-range devices, but it cannot meet the needs of high-end products.
- U.S. Patent No. 4,885,129 discloses a method of producing a heat pipe in which nickel powder and i water, a water soluble resin and a cellulose ether are mixed together, and then the rotating mixture is coated on the inner wall of the steel pipe, and finally heated under reduced pressure to form a metal. Inner wall. Due to its complicated process, it is not suitable for the production of heat-conducting tubes (commercial copper heat pipes are directly sintered after the copper powder is compacted, no solution coating is required), and the porosity of the capillary structure layer and the heat conduction effect of the heat-conducting tubes Also not mentioned.
- U.S. Patent No. 6,087,024 discloses a method of making a porous structure using a non-aqueous system, which first mixes a hydroxide with a siloxane having hydrogen, and then mixes with a metal powder or a ceramic powder and a catalyst to form a metal/ceramic The polysiloxane polymer is finally sintered to form a porous structure suitable for the fabrication of porous structural layers of reactive metals such as magnesium and aluminum. Due to its complicated process, it is not suitable for the production of heat-conducting tubes, and the void ratio of the capillary structure layer and the heat conduction effect of the tubes are not mentioned.
- Chinese patent 200610156330. 5 also proposes a preparation method of high porosity metal porous carrier material, but the sintering process also requires multi-stage heat preservation, which is used for special material shield/sorption storage and catalyst carrier, and the thermal conductivity is unknown. Not suitable for manufacturing heat pipes.
- the object of the present invention is to provide a composite copper powder for manufacturing a capillary structure layer of a heat pipe, which has a high porosity and a porosity ratio after being sintered by earthquake. And capillary force, can greatly improve the heat dissipation efficiency of the heat pipe.
- the object of the present invention is achieved by the following: A composite copper powder for producing a capillary structure inside a heat pipe, the composite copper being a mixture of copper powder and pore former powder.
- the copper powder may be selected from the group consisting of aerosolized copper powder, water atomized copper powder, reduced copper powder, and electrolytic copper powder.
- the copper powder in the particle size range of 30 ⁇ ⁇ - 600 ⁇ ⁇ , wherein the selected sister 100-400 ⁇ ⁇ ⁇
- the copper powder is a agglomerated powder and a single-particle non-agglomerated powder, of which a single-grain non-agglomerated powder is preferred.
- the non-agglomerated powder and the agglomerated powder have the same capillary structure, but the non-agglomerated powder has a good pass rate, and therefore a single-particle non-agglomerated powder is preferred.
- the pore former powder is a compound having a decomposition temperature of not higher than 700 °C.
- the pore former powder is selected from one or more of the group consisting of ammonium carbonate, ammonium hydrogencarbonate, copper acidate, copper carbonate, copper hydroxide, ammonium nitrite, polyethylene glycol, Polyvinyl alcohol, polyvinyl chloride, polystyrene, diazoaminobenzene, azobisisobutyronitrile, dinitrosopentamethylenetetramine, azodiamine, dihydrazide, urine seal, Paraffin and methyl cellulose.
- the pore former powder has a particle size ranging from 30 ⁇ m to 500 ⁇ , wherein preferably 30-200 ⁇ 0
- the pore former powder is added in an amount of 0.50% by weight based on the total weight of the composite copper powder, and further preferably 1 °/. -50%, still more preferably 1% - 20%.
- the pore former system used for different kinds of copper powders may be identical, and the most desirable pore former is one or more selected from the group consisting of urea, paraffin, polyethylene glycol, polyethylene. Alcohol, ammonium carbonate and methyl cellulose.
- the above preferred pore-forming agent is more cost-effective due to the sum of stability such as cost, safety, safety and stability.
- the use of the composite copper powder of the present invention enables a more advantageous capillary structure layer to be produced without changing the existing heat pipe manufacturing process.
- the composite copper obtained by the invention is sintered into a high-porosity capillary structure layer, and the effective porosity, through-hole and capillary force can be significantly improved on the original pure copper powder base, thereby greatly improving The heat transfer efficiency of the conduit.
- a high-end heat transfer tube excellent in heat dissipation can be produced.
- Another object of the invention is to provide a heat pipe having good heat dissipation efficiency. This object is achieved by the use of a heat pipe which is a heat pipe with an advantageous inner wall capillary structure which is made of composite copper.
- Another object of the present invention is to provide a highly efficient heat sink which is realized by using a heat pipe which is made of a heat pipe having an advantageous inner wall capillary structure, and which is made of a composite copper powder sintered. .
- Table 1 shows the decomposition temperatures of the pore formers used in the present invention. It can be seen that the pore former used in the present invention is a compound having a decomposition temperature of not higher than 70 (TC).
- a certain proportion of the pore former powder is added to the copper powder (the copper powder used is a single-particle copper powder), and the copper powder and the pore former powder are uniformly mixed to prepare a composite copper powder.
- the composite copper powder was shaken in the mold, it was sintered at 950 ° C for 30 minutes in a hydrogen reduction furnace, and the porosity (P ta ' ), the through porosity (R.), and the capillary water absorption rate (S p ) were measured.
- each of the examples includes a comparative sample without a pore former to facilitate comparison with the experimental results obtained by the present invention.
- the porosity is defined as the ratio of the volume of pores in the sintered body of the capillary structure after sintering of the copper powder in the total product.
- the measuring method is to measure the capillary structure of the regular shape to be measured, and obtain the weight n, and measure the size of the capillary structure sample with a caliper to calculate the total
- the density of copper is 8.96 g/cm 3
- the through-hole ratio indicates the value of the i-hole in the sintered body of the capillary structure that can communicate with the outside.
- the measured method is to immerse the capillary structure sintered body in water, and after it is saturated with water, the weight is m 2 , the density of water is 1.00 g/cm 3 , and the through-hole ratio is:
- the capillary water absorption rate indicates the amount of capillary force within the sintered capillary, and is characterized by measuring the water flow velocity in the capillary structure perpendicular to the horizontal plane under the action of capillary force. Water atomized copper powder
- Example 1 the porosity and the through-hole ratio did not change much as compared with the comparative actual hair, and the capillary water absorption rate was slightly increased.
- Example 2 compared with the comparative experiment, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 109%.
- Example 3 the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 66.7%.
- Example 4 compared with the comparison, the porosity and the through-hole ratio did not change much, and the capillary water absorption rate slightly increased.
- Example 5 compared with the comparative experiment, the porosity and the through-hole ratio were improved, and the capillary absorption rate was increased by 29.6%.
- Example 6 compared with the comparative experiment, the porosity and the through-hole ratio did not change much, and the capillary water absorption rate slightly increased.
- Example 7 compared with the comparative experiment, the porosity and the through-hole ratio were improved, and the capillary water absorption rate was increased by 30%.
- Example 8 compared with the comparative experiment, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 113%.
- Example 9 the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 66.7%.
- Example 10 the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 78.3 %. Aerosolized copper powder
- Example 11 the porosity, the through-hole ratio, and the capillary water absorption rate were compared with the comparison.
- the rate is basically unchanged.
- Example 12 the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 36.4%.
- Example 13 the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 84.2%.
- Example 14 the porosity and the through-hole ratio did not change much as compared with the comparative real face, and the capillary water absorption rate was slightly improved.
- Example 15 the porosity, the through-hole ratio, and the capillary suction ratio were substantially unchanged from the comparison.
- Example 16 the porosity and the through-hole ratio were greatly improved as compared with the comparative experiment, and the capillary water absorption rate was increased by 233%.
- Example 17 the porosity and the through-hole ratio were greatly improved as compared with the comparative experiment, and the capillary water absorption rate was increased by 433 %. Reduced copper powder
- Example 18 the porosity, the through-hole ratio, and the capillary suction rate were substantially unchanged as compared with the comparison.
- Example 19 the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 107% as compared with the comparison.
- Example 20 the porosity and the through-hole ratio were greatly improved as compared with the comparative real face, and the capillary water absorption rate was increased by 150%. It can also be seen from Table 2 that the bulk density of the composite copper powder ranges from L 2g/cin 3 - 3. 4g/cm 3 .
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Abstract
Description
一种用于制造热导管内壁毛细结构的复合铜粉 Composite copper powder for manufacturing capillary structure of heat pipe inner wall
技术领域 Technical field
本发明涉及一种复合铜粉， 用于制造热导管内壁毛细结构。 所述 热导管包括普通烧结型热导管、 复合热导管、 环路热导管（Loop heat p i pe )、 平板热导管 （ Vapor chamber )等， 可以应用于航空航天、 电 气、 电子和机械等领域。 背景技术 The present invention relates to a composite copper powder for use in the manufacture of a capillary wall inner wall capillary structure. The heat pipe includes a common sintered heat pipe, a composite heat pipe, a loop heat pipe, a Vapor chamber, and the like, and can be applied to aerospace, electric, electronic, and mechanical fields. Background technique
近年来， 随着航空航天、 电气和电子领域的快速发展， 尤其是半 导体制造和电子封装技术的日新月异， 电子电气元件的工作效率大幅 提升。 但是， 在元器件快速工作运转的同时， 热耗也在大量增加， 随 之而来的器件工作寿命和工作稳定性也受到严重制约， 据统计， 每当 CPU的工作温度上升 10°C, 其寿命将降低 50%; 当电机的工作温度上 升 20°C, 其故障率将增加 30%。 因此， 有效地传导和处理这部分热耗， 对于保证器件的工作稳定性和寿命至关重要。 In recent years, with the rapid development of aerospace, electrical and electronic fields, especially semiconductor manufacturing and electronic packaging technology, the efficiency of electronic and electrical components has increased significantly. However, while the components are working fast, the heat consumption is also greatly increased, and the subsequent working life and working stability of the device are also seriously restricted. According to statistics, whenever the operating temperature of the CPU rises by 10 ° C, The life expectancy will be reduced by 50%; when the operating temperature of the motor rises by 20 °C, the failure rate will increase by 30%. Therefore, effectively conducting and processing this part of the heat is critical to ensuring the operational stability and longevity of the device.
现今主流的散热器件包括： 散热风扇、 散热片、 散热模组和散热 器等。 其中的散热片、 散热模組和散热器的核心传热部件为热导管。 热导管由金属管和管内壁的毛细结构层组成， 其内部包^:热流体， 当热导管一端受热时， 流体吸收热量气化形成高温气体， 热导管另一 端由于温度较低使高温气体冷凝成液态流体， 液态流体在毛细结构层 的毛细力作用下返回受热端， 如此反复， 形成连续的相变传热系统。 Today's mainstream heat sink components include: cooling fans, heat sinks, heat sinks and heat sinks. The heat transfer fins, the heat dissipation module and the core heat transfer component of the heat sink are heat pipes. The heat pipe is composed of a metal pipe and a capillary structure layer on the inner wall of the pipe, and the inside thereof comprises: a hot fluid. When one end of the heat pipe is heated, the fluid absorbs heat to vaporize to form a high temperature gas, and the other end of the heat pipe condenses the high temperature gas due to a lower temperature. As a liquid fluid, the liquid fluid returns to the heated end under the capillary force of the capillary structure layer, and thus repeats to form a continuous phase change heat transfer system.
热导管的应用非常广泛， 并正在不断扩大， 目前主要应用于以下 几方面： （1 ) 宇航工程， 如电子仓冷却散热和飞船表面的均温； （2 ) 节能工程， 如各种烟道气和空调排气的余热回收； （3 ) 电子器件， 如 LED和电脑元器件散热； （4 ) 电气系统， 如引擎或电机的冷却； （5 ) 机械加工， 如铸型和刀具的冷却。 The application of heat pipes is very extensive and is expanding. Currently, it is mainly used in the following aspects: (1) Aerospace engineering, such as cooling and cooling of electronic warehouses and uniform temperature of surface of spacecraft; (2) Energy-saving projects, such as various flue gases And waste heat recovery from air conditioning exhaust; (3) cooling of electronic components such as LEDs and computer components; (4) cooling of electrical systems such as engines or motors; (5) machining, such as cooling of molds and tools.
由于铜具有优异的传热特性和相对较低的价格优势， 而成为制造 热导管的主要金属。 对于热导管内壁的毛细结构层一方面要求其 有 很高的孔隙率以保证有足够的热源接触面积； 另一方面， 要求毛 ^结 构材 jfr内部的孔隙连通好且具有高的毛细力， 以保证某些器件中 ό ι液 态散 流体或介质能顺利和快速地通过。 Due to its excellent heat transfer characteristics and relatively low price advantage, copper has become a manufacturing The main metal of the heat pipe. On the one hand, the capillary structure layer of the inner wall of the heat pipe is required to have a high porosity to ensure sufficient heat source contact area; on the other hand, it is required that the pores inside the structure jfr are connected well and have high capillary force, Ensure that 液态ιliquid fluid or media can pass smoothly and quickly in some devices.
目前， 市售的铜粉在震实烧结 （烧结温度为 900 - 1050°C ) ^的 孔隙率低于 55%, 孔隙连通率小于 85%, 用来评定毛细力的吸水專率 实验 ^直也低于 2. 4瞧 /sec, 已应用于中低端器件的热导管的制造， 但 却无法满足高端产品的需求。 At present, the commercially available copper powder has a porosity of less than 55% and a pore connectivity of less than 85% at a compaction sintering temperature of 900 - 1050 ° C. The water absorption rate of the capillary force is low and low. At 2.4 瞧/sec, it has been applied to the manufacture of heat pipes for low-end and mid-range devices, but it cannot meet the needs of high-end products.
美国专利 4885129公开了一种导热管的制造方法，其将镍粉和 i水、 水溶性树脂和纤维素醚混合在一起， 然后将旋转混合物涂覆在不，钢 管内壁， 最后减压加热形成金属内壁。 由于其工序复杂， 不太适合导 热管的制作（商业铜热导管是直接将铜粉填入震实后烧结而成的， 无 需溶液涂覆）， 同时毛细结构层空隙率和导热管的导热效果也未提及。 U.S. Patent No. 4,885,129 discloses a method of producing a heat pipe in which nickel powder and i water, a water soluble resin and a cellulose ether are mixed together, and then the rotating mixture is coated on the inner wall of the steel pipe, and finally heated under reduced pressure to form a metal. Inner wall. Due to its complicated process, it is not suitable for the production of heat-conducting tubes (commercial copper heat pipes are directly sintered after the copper powder is compacted, no solution coating is required), and the porosity of the capillary structure layer and the heat conduction effect of the heat-conducting tubes Also not mentioned.
美国专利 6087024公开了一种利用非水性系统制造多孔结构的方 法， 其先将氢氧化物和带氢的硅氧烷混合， 再与金属粉或陶瓷粉 ^、及 催化剂混合， 形成带金属 /陶瓷的聚硅氧烷聚合物， 最后烧结形成多 孔结构， 适于制造反应性金属的多孔结构层（例如镁和铝）。 由卞其 工序复杂， 不太适合导热管的制作， 同时毛细结构层空隙率和导 管 的导热效果也未提及。 U.S. Patent No. 6,087,024 discloses a method of making a porous structure using a non-aqueous system, which first mixes a hydroxide with a siloxane having hydrogen, and then mixes with a metal powder or a ceramic powder and a catalyst to form a metal/ceramic The polysiloxane polymer is finally sintered to form a porous structure suitable for the fabrication of porous structural layers of reactive metals such as magnesium and aluminum. Due to its complicated process, it is not suitable for the production of heat-conducting tubes, and the void ratio of the capillary structure layer and the heat conduction effect of the tubes are not mentioned.
中国专利 200610156330. 5也提出一种高孔隙率金属多孔载体材 料的制备方法， 但是其烧结过程还需多阶段保温， 用于特殊物盾 ^/吸 附储存和催化剂载体， 导热性能未知。 不适于制造导热管。 Chinese patent 200610156330. 5 also proposes a preparation method of high porosity metal porous carrier material, but the sintering process also requires multi-stage heat preservation, which is used for special material shield/sorption storage and catalyst carrier, and the thermal conductivity is unknown. Not suitable for manufacturing heat pipes.
因此， 需要一种复合铜粉， 使得在无需更改现有导热管制造本艺 的情况下， 能够产生更有利的内壁毛细结构层， 提高导热管的导 效 率。 发明 i内容 Therefore, there is a need for a composite copper powder which enables a more advantageous inner wall capillary structure layer and an improved conductivity of the heat pipe without changing the existing heat pipe manufacturing art. Invention i content
i本发明的目的是提供一种用于制造热导管内壁毛细结构层的复 合铜粉， 该复合铜粉经震实烧结后， 具有很高的孔隙率、 孔隙连 率 和毛细力， 可大大提高热导管的散热效率。 本发明目的通过以下 案 实现： 一种用于制造热导管内部毛细结构的复合铜粉， 该复合铜 ^为 铜粉和造孔剂粉末组成的混合物。 所述铜粉可以选自气雾化铜粉、 水 雾化铜粉、 还原铜粉和电解铜粉。 The object of the present invention is to provide a composite copper powder for manufacturing a capillary structure layer of a heat pipe, which has a high porosity and a porosity ratio after being sintered by earthquake. And capillary force, can greatly improve the heat dissipation efficiency of the heat pipe. The object of the present invention is achieved by the following: A composite copper powder for producing a capillary structure inside a heat pipe, the composite copper being a mixture of copper powder and pore former powder. The copper powder may be selected from the group consisting of aerosolized copper powder, water atomized copper powder, reduced copper powder, and electrolytic copper powder.
优选地， 所述铜粉的粉末粒度范围在 30 μ ηι- 600 μ ιη， 其中妹选 100-400 μ ιηο Preferably, the copper powder in the particle size range of 30 μ ηι- 600 μ ιη, wherein the selected sister 100-400 μ ιη ο
优选地， 所述铜粉为团化粉和单颗粒非团化粉， 其中优选单碑粒 非团化粉。 非团化粉和团化粉毛细结构相同， 但是非团化粉的通 ^率 要好， 因此优选单颗粒非团化粉。 Preferably, the copper powder is a agglomerated powder and a single-particle non-agglomerated powder, of which a single-grain non-agglomerated powder is preferred. The non-agglomerated powder and the agglomerated powder have the same capillary structure, but the non-agglomerated powder has a good pass rate, and therefore a single-particle non-agglomerated powder is preferred.
优选地， 所述造孔剂粉末为分解温度不高于 700°C的化合物。 优选地， 所述造孔剂粉末选自由下述化合物组成的组中的一个或 多个： 碳酸铵、 碳酸氢铵、 酸铜、 碳酸铜、 氢氧化铜、 亚硝酸铵、 聚乙二醇、 聚乙烯醇、 聚氯乙烯、 聚苯乙烯、 二偶氮氨基苯、 偶氣二 异丁腈、 二亚硝基五亚甲基四胺、 偶氮二曱酰胺、 二璜酰肼、 尿章、 石蜡和甲基纤维素。 Preferably, the pore former powder is a compound having a decomposition temperature of not higher than 700 °C. Preferably, the pore former powder is selected from one or more of the group consisting of ammonium carbonate, ammonium hydrogencarbonate, copper acidate, copper carbonate, copper hydroxide, ammonium nitrite, polyethylene glycol, Polyvinyl alcohol, polyvinyl chloride, polystyrene, diazoaminobenzene, azobisisobutyronitrile, dinitrosopentamethylenetetramine, azodiamine, dihydrazide, urine seal, Paraffin and methyl cellulose.
优选地，所述造孔剂粉末的粒度范围为 30 μ m - 500 μ ηι,其中优选 30-200 μ ιη0 Preferably, the pore former powder has a particle size ranging from 30 μm to 500 μηη, wherein preferably 30-200 μιη 0
优选地， 所述造孔剂粉末的添加量为复合铜粉总重量的 0. 50%,其中进一步优选 1°/。-50%， 更进一步优选 1%- 20%。 Preferably, the pore former powder is added in an amount of 0.50% by weight based on the total weight of the composite copper powder, and further preferably 1 °/. -50%, still more preferably 1% - 20%.
对于不同种类的铜粉所用的造孔剂体系可以完全相同， 其中最理 想的造孔剂为选自由下述化合物组成的组中的一个或多个： 尿素、 石 蜡、 聚乙二醇、 聚乙烯醇、 碳酸铵和甲基纤维素。 出于成本、 环^、 安全性和稳定性等稳定性总和考虑 , 以上优选造孔剂性价比更高 The pore former system used for different kinds of copper powders may be identical, and the most desirable pore former is one or more selected from the group consisting of urea, paraffin, polyethylene glycol, polyethylene. Alcohol, ammonium carbonate and methyl cellulose. The above preferred pore-forming agent is more cost-effective due to the sum of stability such as cost, safety, safety and stability.
使用本发明的复合铜粉， 使得在无需更改现有导热管制造工 ^的 情况下， 能够产生更有利的毛细结构层。 本发明所获得的复合铜 经 震实烧结后， 制成高孔隙率的毛细结构层， 其有效孔隙率、 通孔 和 毛细力可在原有純铜粉的基 上得到明显提高， 从而大大提高了 导 管的传热效率。 另外， 根据本发明的特别优选的实施例， 可以制 散 热性极好的高端导热管。 发明的另一个目的是提供一种具有良好散热效率的热导管。 该 目的通过使用下述热导管实现， 读导热管为一种带有有利的内壁毛细 结构的热导管， 该内壁毛细结构由复合铜^^烧结制成。 The use of the composite copper powder of the present invention enables a more advantageous capillary structure layer to be produced without changing the existing heat pipe manufacturing process. The composite copper obtained by the invention is sintered into a high-porosity capillary structure layer, and the effective porosity, through-hole and capillary force can be significantly improved on the original pure copper powder base, thereby greatly improving The heat transfer efficiency of the conduit. Further, according to a particularly preferred embodiment of the present invention, a high-end heat transfer tube excellent in heat dissipation can be produced. Another object of the invention is to provide a heat pipe having good heat dissipation efficiency. This object is achieved by the use of a heat pipe which is a heat pipe with an advantageous inner wall capillary structure which is made of composite copper.
本发明的另一个目的是提供一种高效散热器， 谊目的通过使用下 述热导管实现，其由带有有利的内壁毛细结构的热导管制成， 谅内部 毛细结构由复合铜粉烧结制成。 具 实施方式 Another object of the present invention is to provide a highly efficient heat sink which is realized by using a heat pipe which is made of a heat pipe having an advantageous inner wall capillary structure, and which is made of a composite copper powder sintered. . Implementation method
下面对本发明的优选实施例进行详细的描述。但是本领域技术人 员能够理解， 本发明并不局限于具体的实施例。 The preferred embodiments of the present invention are described in detail below. However, those skilled in the art will understand that the invention is not limited to the specific embodiments.
表 1示出了本发明使用的造孔剂的分解温度。 可以看出， 本发明 使用的造孔剂为的分解温度不高于 70(TC的化合物。 Table 1 shows the decomposition temperatures of the pore formers used in the present invention. It can be seen that the pore former used in the present invention is a compound having a decomposition temperature of not higher than 70 (TC).
将一定比例的造孔剂粉末加入铜粉中 （所用的铜粉为单颗粒铜 粉）， 使铜粉与造孔剂粉末均匀混合， 制备出复合铜粉。 A certain proportion of the pore former powder is added to the copper powder (the copper powder used is a single-particle copper powder), and the copper powder and the pore former powder are uniformly mixed to prepare a composite copper powder.
复合铜粉在模具中震实后， 在氢气还原炉中 950°C烧结 30分钟， 测量孔隙率 ( Pta' )、 通孔率（R。）和毛细吸水速率（Sp )。 After the composite copper powder was shaken in the mold, it was sintered at 950 ° C for 30 minutes in a hydrogen reduction furnace, and the porosity (P ta ' ), the through porosity (R.), and the capillary water absorption rate (S p ) were measured.
同时， 为了对比的目的， 每一实施例中均包括不加造孔剂的对比 试样， 以方便与本发明所得到的实验结果进行对比。 孔隙率定义为铜粉烧结后毛细结构烧结体内空孔的体积在总体 积中 j所占的比值。 其测量方法为将待测规则形状毛细结构样品至于天 枰 ， 得到其重量 n , 用卡尺测量毛细结构样品的尺寸可算出其总体 Meanwhile, for the purpose of comparison, each of the examples includes a comparative sample without a pore former to facilitate comparison with the experimental results obtained by the present invention. The porosity is defined as the ratio of the volume of pores in the sintered body of the capillary structure after sintering of the copper powder in the total product. The measuring method is to measure the capillary structure of the regular shape to be measured, and obtain the weight n, and measure the size of the capillary structure sample with a caliper to calculate the total
积 铜的密度为 8. 96 g/cm3, 孔隙率为： = (1- χ ΐ00%The density of copper is 8.96 g/cm 3 , and the porosity is: = (1- χ ΐ00%
实施例 1 中， 与对比实發相比， 孔隙率、 通孔率变化不大， 毛 细吸水速率稍有提高。 In Example 1, the porosity and the through-hole ratio did not change much as compared with the comparative actual hair, and the capillary water absorption rate was slightly increased.
实施例 2 中， 与对比实验相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 109 %。 In Example 2, compared with the comparative experiment, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 109%.
实施例 3 中， 与对比实验相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 66. 7 %。 In Example 3, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 66.7%.
实施例 4 中， 与对比实^相比， 孔隙率、 通孔率变化不大， 毛 细吸水速率稍有提高。 In Example 4, compared with the comparison, the porosity and the through-hole ratio did not change much, and the capillary water absorption rate slightly increased.
实施例 5中， 与对比实验相比， 孔隙率、通孔率有一定提高， 毛 细吸氷速率提高 29. 6 %。 In Example 5, compared with the comparative experiment, the porosity and the through-hole ratio were improved, and the capillary absorption rate was increased by 29.6%.
实施例 6 中， 与对比实验相比， 孔隙率、 通孔率变化不大， 毛 细吸水速率稍有提高。 In Example 6, compared with the comparative experiment, the porosity and the through-hole ratio did not change much, and the capillary water absorption rate slightly increased.
实施例 7中， 与对比实验相比， 孔隙率、通孔率有一定提高， 毛 细吸水速率提高 30 %。 In Example 7, compared with the comparative experiment, the porosity and the through-hole ratio were improved, and the capillary water absorption rate was increased by 30%.
实施例 8 中， 与对比实验相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 113 %。 In Example 8, compared with the comparative experiment, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 113%.
实施例 9 中， 与对比实睑相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 66. 7 %。 In Example 9, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 66.7%.
实施例 10中， 与对比实险相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 78. 3 %。 气雾化铜粉 In Example 10, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 78.3 %. Aerosolized copper powder
实施例 11 中， 与对比实 相比， 孔隙率、 通孔率、 毛细吸水速 率基本不变。 In Example 11, the porosity, the through-hole ratio, and the capillary water absorption rate were compared with the comparison. The rate is basically unchanged.
实施例 12中， 与对比实验相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 36. 4 %。 In Example 12, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 36.4%.
实施例 13中， 与对比实验相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 84. 2 %。 In Example 13, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 84.2%.
实施例 14中， 与对比实脸相比， 孔隙率、 通孔率变化不大， 毛 细吸水速率稍有提高。 电解铜粉 In Example 14, the porosity and the through-hole ratio did not change much as compared with the comparative real face, and the capillary water absorption rate was slightly improved. Electrolytic copper powder
实施例 15 中， 与对比实^^目比， 孔隙率、 通孔率、 毛细吸; 速 率基本不变。 In Example 15, the porosity, the through-hole ratio, and the capillary suction ratio were substantially unchanged from the comparison.
实施例 16中， 与对比实验相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 233 %。 In Example 16, the porosity and the through-hole ratio were greatly improved as compared with the comparative experiment, and the capillary water absorption rate was increased by 233%.
实施例 17中， 与对比实验相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 433 %。 还原铜粉 In Example 17, the porosity and the through-hole ratio were greatly improved as compared with the comparative experiment, and the capillary water absorption rate was increased by 433 %. Reduced copper powder
实施例 18 中， 与对比实险相比， 孔隙率、 通孔率、 毛细吸|速 率基本不变。 In Example 18, the porosity, the through-hole ratio, and the capillary suction rate were substantially unchanged as compared with the comparison.
实施例 19中， 与对比实险相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 107 %。 In Example 19, the porosity and the through-hole ratio were greatly improved, and the capillary water absorption rate was increased by 107% as compared with the comparison.
实施例 20中， 与对比实脸相比， 孔隙率、 通孔率大大提高， 毛 细吸水速率提高 150 %。 从表 2 还可以看出， 复合铜粉的松装密度范围为 L 2g/cin3 - 3. 4g/cm3。 In Example 20, the porosity and the through-hole ratio were greatly improved as compared with the comparative real face, and the capillary water absorption rate was increased by 150%. It can also be seen from Table 2 that the bulk density of the composite copper powder ranges from L 2g/cin 3 - 3. 4g/cm 3 .
尽管前述内容描述了本发明的特定实施例， 应当理解这些实^例 的组合、 变化和子集是可以预计的。 例如， 应当理解， 尽管此处^ [实 施例涉及复合铜粉， 这些实施例可以修改为用于制造导热管和 ¼热 另外， 也可以理解， 本发明也可以用于制造其它复合金属粉， 该 复合金属粉可以用于制造理想的毛细结构（空隙率、 通孔率以及毛细 吸水率较高）， 该复合金属粉为金属粉和造孔剂粉末组成的混合物， 所述金属粉可以是铁粉、 不锈钢粉、 锌粉、 铝粉以及合金粉。 Although the foregoing describes particular embodiments of the invention, it is understood that combinations, variations and sub-sets of these embodiments are contemplated. For example, it should be understood that although the embodiments herein relate to composite copper powder, these embodiments may be modified to be used to manufacture heat pipes and heat. In addition, it is also understood that the present invention can also be used to manufacture other composite metal powders which can be used to produce a desired capillary structure (void ratio, porosity, and capillary water absorption), which is A mixture of metal powder and pore former powder, which may be iron powder, stainless steel powder, zinc powder, aluminum powder, and alloy powder.
表 1 造孔剂的分解温度 Table 1 Decomposition temperature of pore former
造孔剂 常压分解温度（ °C ) 碳酸铵 150 Pore former atmospheric decomposition temperature ( °C ) ammonium carbonate 150
碳酸氢铵 30°C Ammonium bicarbonate 30 ° C
硫酸铜 650 Copper sulfate 650
碳義 220 Carbon meaning 220
氢氧化铜 140 Copper hydroxide 140
亚硝酸铵 40 Ammonium nitrite 40
聚乙二醇 360 Polyethylene glycol 360
聚乙烯醇 300 Polyvinyl alcohol 300
聚氯乙烯 200 Polyvinyl chloride 200
聚苯乙烯 330 Polystyrene 330
二偶氮氨基苯 103 Diazoaminobenzene 103
偶氮二异丁腈 65 Azobisisobutyronitrile 65
二亚硝基五亚曱基四胺 700 Dinitrosopentamethylenetetramine 700
偶氮二曱酰胺 205 Azodicarbamide 205
二璜酰肼 147 Diterpene hydrazide 147
尿素 160 Urea 160
石蜡 62 Paraffin 62
曱基纤维素 250 Mercapto cellulose 250
表 2 试样配比及测试结果 Table 2 sample ratio and test results
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-
2010
- 2010-03-08 WO PCT/CN2010/070912 patent/WO2011075965A1/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85100996A (en) * | 1985-04-01 | 1986-08-06 | 化工部北京化工研究院 | The method for making that is used for the porous surface metal tubes of enhanced boiling heat transfer |
| US20070039718A1 (en) * | 2005-08-17 | 2007-02-22 | Ming-Chih Chen | Heat pipe and manufacturing method for the same |
Non-Patent Citations (1)
| Title |
|---|
| VITYAZ P. A. ET AL.: "Properties of the Capillary Structure of Copper Powder.", POWDER METALLURGY AND METAL CERAMICS., vol. 24, no. 8, 1985, pages 657 - 660 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108014980A (en) * | 2018-01-15 | 2018-05-11 | 深圳市天添智能云设备有限公司 | A kind of UVLED solidification equipments |
| CN118936178A (en) * | 2024-08-14 | 2024-11-12 | 西安石油大学 | A preparation method for a flat-plate loop heat pipe capillary wick evaporator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101704103A (en) | 2010-05-12 |
| CN101704103B (en) | 2012-12-05 |
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