WO2011070736A1 - Noise-suppressing tape - Google Patents

Abstract

Disclosed is a noise-suppressing tape provided with: a dielectric layer (15) comprising a dielectric; a first conductor which comprises a conductive material, at least part of which has a repeating structure, and is provided inside the dielectric layer (15) or on a first surface (16) of the dielectric layer (15) so as to be opposite a second surface (17), said second surface being the surface on the side of the dielectric layer (15) opposite the first surface (16); and a connecting member (13) that is provided inside the dielectric layer (15) and is exposed on the second surface (17) side of the dielectric layer (15).

Description

Noise suppression tape

The present invention relates to a tape that suppresses noise propagation.

Recent electronic devices, particularly high-speed and high-performance electronic devices such as personal computers and workstations, have a problem of generating noise such as harmonic components of clock signals and radiating them outside the device. The radiated noise may interfere with the normal operation of other electronic devices. Therefore, a means for suppressing noise emission from the electronic device is desired.

Patent Document 1 describes a noise filter tape composed of an alloy-based magnetic film and a nonmagnetic insulator connected to one or both surfaces of the alloy-based magnetic film.

Japanese Patent Laid-Open No. 7-240593

In recent years, as the frequency used in electronic devices becomes higher, the band of generated noise shifts in the high frequency direction, and reaches, for example, several GHz. For this reason, means for suppressing noise in a wide band including high frequencies is desired. However, the noise suppression tape described in Patent Document 1 cannot suppress such high-frequency noise.

Therefore, in the present invention, a problem of propagation of noise in a wide band including a high frequency of about several GHz is an issue.

According to the present invention, the dielectric layer and the second surface that is the surface opposite to the first surface of the dielectric layer are opposed to the inside or the first surface of the dielectric layer. A first conductor having a repetitive structure in at least a partial region, and a connecting member provided inside the dielectric layer and penetrating the second surface of the dielectric layer, A noise suppression tape is provided.

Further, according to the present invention, the dielectric layer and the second surface that is the surface opposite to the first surface of the dielectric layer are opposed to the inside of the dielectric layer or the first surface. A first conductor having a repeating structure in at least a partial region, wherein the repeating structure of the first conductor is a plurality of island-shaped conductors separated from each other, and the island-shaped conductor An opening is provided in a part or all of the above, and a noise suppression tape is provided in which the wiring connected to the island-shaped conductor is provided.

According to the present invention, a noise suppression tape that suppresses noise propagation in a wide band including high frequencies is realized.

FIG. 3 is a perspective view schematically showing an example of an EBG structure constituted by the noise suppression tape of Embodiment 1-1. FIG. 3 is a cross-sectional view schematically showing an example of an EBG structure constituted by the noise suppression tape of Embodiment 1-1. FIG. 2 is a cross-sectional view schematically showing an example of the noise suppression tape of Embodiment 1-1 and an adherend. 6 is a cross-sectional view showing an example of a manufacturing process of the noise suppression tape of Embodiment 1-1. FIG. FIG. 3 is a cross-sectional view schematically showing an example of a noise suppression tape of Embodiment 1-2 and an adherend. FIG. 3 is an equivalent circuit diagram of a unit cell of an EBG structure configured with the noise suppression tape of Embodiment 1-2. 6 is a cross-sectional view showing an example of a manufacturing process of the noise suppression tape of Embodiment 1-2. FIG. FIG. 3 is a cross-sectional view schematically showing an example of the noise suppression tape of Embodiment 1-2. FIG. 3 is a plan view schematically showing an example of the noise suppression tape of Embodiment 1-2. It is sectional drawing which shows typically an example of the noise suppression tape of Embodiment 1-3, and a to-be-adhered thing. FIG. 3 is an equivalent circuit diagram of a unit cell of an EBG structure configured by the noise suppression tape of Embodiment 1-3. 6 is a cross-sectional view showing an example of a manufacturing process of the noise suppression tape of Embodiment 1-3. FIG. It is sectional drawing which shows typically an example of the noise suppression tape of Embodiment 1-3. It is a top view which shows typically an example of the noise suppression tape of Embodiment 1-3. FIG. 5 is a cross-sectional view schematically showing an example of a noise suppression tape of Embodiment 1-4 and an adherend. 6 is a cross-sectional view showing an example of a manufacturing process of the noise suppression tape of Embodiment 1-4. FIG. FIG. 6 is a cross-sectional view schematically showing an example of a noise suppression tape of Embodiment 1-5 and an adherend. 6 is a perspective view schematically showing an example of an island-shaped conductor of the noise suppression tape of Embodiment 1-5. FIG. FIG. 6 is a perspective view schematically showing an example of an EBG structure constituted by the noise suppression tape of Embodiment 1-5. FIG. 6 is a side view schematically showing an example of an EBG structure constituted by the noise suppression tape of Embodiment 1-5. FIG. 6 is an equivalent circuit diagram of a unit cell of an EBG structure configured with the noise suppression tape of Embodiment 1-5. 6 is a perspective view schematically showing an example of an island-shaped conductor of the noise suppression tape of Embodiment 1-6. FIG. FIG. 6 is a perspective view schematically showing an example of an EBG structure constituted by the noise suppression tape of Embodiment 1-6. FIG. 6 is an equivalent circuit diagram of a unit cell of an EBG structure constituted by the noise suppression tape of Embodiment 1-6. FIG. 3 is a cross-sectional view schematically showing an example of a noise suppression tape and an adherend of Embodiment 2-1. It is sectional drawing which shows typically an example and the to-be-adhered thing of the noise suppression tape of Embodiment 2-2. FIG. 6 is a cross-sectional view schematically showing an example of a noise suppression tape of Embodiment 2-4 and an adherend. FIG. 6 is a cross-sectional view schematically showing an example of a noise suppression tape of Embodiment 2-5 and an adherend. 6 is a plan view schematically showing an example of a second conductor of the noise suppression tape of Embodiment 2-5. FIG. FIG. 10 is a plan view schematically showing another example of the second conductor of the noise suppression tape of Embodiment 2-5. FIG. 10 is a perspective view schematically showing an example of an EBG structure configured by the noise suppression tape of Embodiment 2-5. FIG. 10 is a perspective view schematically showing another example of an EBG structure configured with the noise suppression tape of Embodiment 2-5. FIG. 5 is a plan view schematically showing a noise suppression tape of Embodiment 3-1. It is a top view which shows typically the noise suppression tape of Embodiment 3-2. FIG. 8 is a cross-sectional view schematically showing an example of a noise suppression tape of Embodiment 1-7 and an adherend. It is sectional drawing which shows typically an example and the to-be-adhered thing of a tape provided with the EBG structure.

Hereinafter, embodiments of the present invention that solve the above-described problems will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
<Embodiment 1>

Embodiment 1 mainly relates to claims 1 to 3, 9, 11, 12, 14 to 16, and 22.

The noise suppression tape of the present embodiment has a partial configuration among the components of an EBG (Electromagnetic Band Gap) structure. There are various EBG structures. For example, there are EBG structures as shown in FIGS. FIG. 1 is a perspective view schematically showing the configuration of the EBG structure, and FIG. 2 is a cross-sectional view of the EBG structure of FIG.

1 and 2 includes a sheet-like conductor 2, a plurality of island-like conductors 1 separated from each other, and a plurality of connecting members 3. The plurality of island-like conductors 1 are regions that overlap the sheet-like conductor 2 in plan view, and are disposed at positions away from the sheet-like conductor 2 with a dielectric layer (not shown) interposed therebetween. The plurality of island-shaped conductors 1 are periodically arranged. The connection member 3 is electrically connected to each of the plurality of island-like conductors 1 and the sheet-like conductor 2. This EBG structure has a plurality of unit cells A constituting the EBG structure, and the plurality of unit cells A are repeatedly arranged. For example, as shown in the figure, the unit cells A may be arranged with periodicity. The EBG structure formed by the unit cell A is an EBG structure having a so-called mushroom structure. The distance between the island-shaped conductor 1 and the sheet-shaped conductor 2, the thickness of the connecting member 3, the mutual distance between the island-shaped conductors 1 and the like. By adjusting the frequency band, the frequency band that becomes the band gap can be adjusted. According to this EBG structure, it becomes possible to suppress the propagation of noise on the surface of the sheet-like conductor 2. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 1 constitute a capacitance.

Here, “repetition” of the unit cell A includes a case where a part of the configuration is missing in any unit cell A. When the unit cell A has a two-dimensional array, “repetition” includes a case where the unit cell A is partially missing. In addition, in “periodicity”, a part of the constituent elements (the island-like conductor 1 and the connecting member 3) are shifted in some unit cells A, or the arrangement of some unit cells A itself is shifted. Cases are also included. In other words, even when the periodicity in the strict sense collapses, if the unit cell A is repeatedly arranged, the characteristics as a metamaterial can be obtained, so that “periodicity” has some defect. Permissible. The cause of these defects is that when wiring or vias are passed between unit cells A, when adding a metamaterial structure to an existing wiring layout, unit cells A cannot be arranged due to existing vias or patterns. Manufacturing errors, and existing vias and patterns may be used as part of the unit cell A. The above-mentioned premise is the same in all the following embodiments.

The noise suppression tape of the present embodiment includes, for example, a plurality of island-shaped conductors 1 separated from each other in the EBG structure shown in FIGS. It can be set as the structure which does not have. And in the state affixed on the to-be-adhered surface of the to-be-adhered object, the to-be-adhered surface of an to-be-adhered object functions as the sheet-like conductor 2 of the EBG structure shown in FIG. As a result, the EBG structure is constituted by a partial configuration (a plurality of island-like conductors 1 and a plurality of connecting members 3) included in the noise suppression tape and an adherend surface (sheet-like conductor 2) having conductivity of an adherend. Is configured.

According to such a noise suppression tape, the adherend surface having the conductivity of the adherend can be regarded as the sheet-like conductor 2 of the EBG structure shown in FIGS. As described above, according to the EBG structure shown in FIGS. 1 and 2, it is possible to suppress the propagation of noise on the surface of the sheet-like conductor 2. Therefore, according to the noise suppression tape of this embodiment, it is possible to suppress the propagation of noise on the adherend surface having the conductivity of the adherend. That is, it is possible to suppress the propagation of noise on the surface on which the noise suppression tape is attached. In such a case, for example, by pasting this noise suppression tape on the surface of the LSI or IC that generates noise, the noise can be prevented from propagating through the surface and spreading to the surroundings. As a result, electromagnetic waves can be prevented from being emitted from the electronic device.

Moreover, since the noise suppression tape of the present embodiment does not need to have a part of the components of the EBG structure, the manufacturing process can be simplified and the raw material cost can be suppressed. Furthermore, since the film thickness of the noise suppression tape itself can be reduced and the weight can be reduced, the ease of handling during storage and use is improved.

Next, the variation of the noise suppression tape which actualized this embodiment is demonstrated in detail. In addition, the noise suppression tape of this embodiment is not limited to the variation demonstrated below.
<< Embodiment 1-1 >>

Embodiment 1-1 mainly relates to claims 1 to 3 and 11 to 13.

FIG. 3A schematically shows an example of the noise suppression tape 10 of the first embodiment. FIG. 3A is a cross-sectional view showing a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of Embodiment 1-1 is formed on the dielectric layer 15 and the first surface 16 of the dielectric layer 15, and has a repetitive structure, for example, a periodic structure in at least a partial region. A first conductor (a plurality of island-shaped conductors 11). The first conductor is provided so as to face the second surface 17 which is the surface opposite to the first surface 16 of the dielectric layer 15. On the second surface 17 of the dielectric layer 15, an adhesive layer 18 that adheres to the adherend surface 21 of the adherend 20 is provided. In addition, a connection member 13 is provided inside the dielectric layer 15. The connection member 13 penetrates through the second surface 17 of the dielectric layer 15, penetrates through the adhesive layer 18, and is exposed from the surface of the adhesive layer 18 that contacts the adherend 20. The connection member 13 is electrically connected to the adherend surface 21 in a state where the noise suppression tape 10 is attached to the adherend surface 21 having conductivity of the adherend 20.

Hereinafter, each configuration will be described.

The dielectric layer 15 is made of a dielectric material. The dielectric layer 15 may be a flexible substrate, for example. More specifically, for example, a glass epoxy substrate or a fluororesin substrate may be used. The dielectric layer 15 may be a single layer or a multilayer. Note that the thickness of the dielectric layer 15 is a matter of design.

Next, the adhesive layer 18 can be made of, for example, an adhesive. The raw material of the adhesive is not particularly limited, and so-called adhesive raw materials such as natural rubber, acrylic resin, and silicone can be used. Such an adhesive layer 18 may contain a plurality of conductive fillers. In the present embodiment, the connection member 13 needs to be electrically connected to the adherend surface 21 in a state where the noise suppression tape 10 is attached to the adherend surface 21 having conductivity of the adherend 20. Therefore, if a plurality of conductive fillers are mixed in the adhesive layer 18, the above conduction can be realized more reliably. Note that the thickness of the adhesive layer 18 is a matter of design.

The first conductor having a repetitive structure, for example, a periodic structure, in at least a partial region has a plurality of island-like conductors 11 separated from each other as a repetitive structure. That is, the plurality of island-shaped conductors 11 separated from each other are repeatedly arranged, for example, periodically. The “repetition” in the island-shaped conductor 11 includes a case where the island-shaped conductor 11 is partially missing. Further, “periodic” includes a case where the arrangement of some of the island-shaped conductors 11 themselves is deviated. That is, even when the periodicity in the strict sense is broken, when the island-shaped conductors 11 are repeatedly arranged, the characteristics as a metamaterial of the EBG structure in which the island-shaped conductors 11 are part of the constituent elements. Therefore, a certain degree of defect is allowed for the “periodicity”.

In addition, “at least in a partial area” means that the entire surface of the noise suppression tape 10 may have a repeating structure or a part thereof may have a repeating structure. That is, the plurality of island-shaped conductors 11 separated from each other may be provided on the entire surface of the noise suppression tape 10 or may be provided on a part thereof. The raw material of the island-shaped conductor 11 is not particularly limited, and for example, copper or the like can be selected. The shape of the island is not particularly limited, and any shape such as a triangle, a quadrangle, a pentagon, a polygon having more vertices, and a circle can be selected. Furthermore, two or more types of island-shaped conductors 11 having different sizes and / or shapes may be included. In such a case, it is desirable that the two or more types of island-shaped conductors 11 are periodically arranged. The size of the island-shaped conductors 11, the mutual interval, and the like are design matters determined according to the frequency of noise that suppresses propagation. This assumption is the same in all the following embodiments.

The connecting member 13 can be made of metal such as copper, aluminum, stainless steel, for example. This connecting member 13 is in contact with the adherend surface 21 of the adherend 20 in a state where the noise suppression tape 10 is attached to the adherend 20 and is electrically connected. Further, the connecting member 13 is provided so as to be electrically connected to some or all of the island-shaped conductors 11. In FIG. 3A, a connecting member 13 is provided so as to be electrically connected to all the island-like conductors 11.

The connection member 13 may be provided periodically or may not be provided periodically. However, when the connection member 13 is provided periodically, the EBG structure constituted by the noise suppressing tape 10 and the adherend surface 21 having the conductivity of the adherend 20 causes Bragg reflection to generate a band gap band. It is desirable to be periodic because of the spread. Here, “periodic” includes a case where the arrangement of some of the connecting members 13 is shifted. This premise is the same in all embodiments having the connecting member 13 described below.

In the noise suppression tape 10 of Embodiment 1-1, the first surface 16 of the dielectric layer 15 has a non-conductive surface layer (see FIG. 5) that covers the dielectric layer 15 and the first conductor (island conductor 11). (Not shown) may be further provided.

Next, an example of a method for manufacturing the noise suppression tape 10 of Embodiment 1-1 will be described with reference to FIG. 3B. FIG. 3B is a cross-sectional view showing an example of a manufacturing process of the noise suppression tape 10 shown in FIG. 3A.

First, as shown in (1), a copper foil 11 is formed on a first surface of a substrate (dielectric layer 15) such as a glass epoxy substrate or a fluororesin substrate. Next, as shown in (2), a pattern (a plurality of island-shaped conductors 11 separated from each other) is formed by selectively etching a part of the copper foil 11 by photolithography and etching. Thereafter, as shown in (3), a hole penetrating the island-shaped conductor 11 and the dielectric layer 15 is formed by a drill.

Next, as shown in (4), a through pin (connecting member 13) made of a metal such as copper, aluminum, or stainless steel is inserted into the hole formed in (3).

Thereafter, as shown in (5), an adhesive layer 18 is formed on the second surface of the dielectric layer 15. The adhesive layer 18 is formed so that the connecting member 13 penetrates the adhesive layer 18 and is exposed from the surface (lower surface in the drawing) of the adhesive layer 18 that does not contact the dielectric layer 15. The specific means for forming in this way is not particularly limited, but may be the following means. For example, the length of the connecting member 13 inserted in (4) is configured such that one end protrudes from the second surface (lower surface in the drawing) of the dielectric layer 15 in the inserted state. Then, when the adhesive layer 18 is composed of a sheet-like adhesive and the sheet-like adhesive (adhesive layer 18) is formed on the second surface of the dielectric layer 15, the sheet-like adhesive (adhesive layer 18) is connected. One end of the connection member 13 is protruded from the surface of the sheet-like adhesive (adhesive layer 18) by strongly pressing into the protruding end of the member 13. You may implement | achieve in this way. As another means, the adhesive layer 18 is made of a fluid adhesive, and after the adhesive is applied to the second surface of the dielectric layer 15, the squeegee is used to form the connection member 13. The connecting member 13 may be protruded from the surface of the adhesive layer 18 by removing the adhesive applied to the surface. In the case of such means, if a plurality of conductive fillers are mixed in the adhesive layer 18, conduction between the connection member 13 and the adherend surface 21 of the adherend 20 can be ensured more reliably.

Thereafter, a non-conductive surface layer (not shown) that covers the first surfaces (the upper surface in the drawing) of the plurality of island-shaped conductors 11 and the dielectric layer 15 separated from each other may be further provided.

As shown in FIG. 3A, the noise suppression tape 10 of Embodiment 1-1 includes only a part of the components of the EBG structure shown in FIGS. Specifically, the EBG structure shown in FIGS. 1 and 2 includes a plurality of island-like conductors 1 and a plurality of connecting members 3 that are separated from each other, and the sheet-like conductor 2 is not provided. As shown in FIG. 3A, the noise suppression tape 10 according to the embodiment 1-1 has a partial configuration provided in the noise suppression tape 10 in a state where the noise suppression tape 10 is attached to the adherend surface 21 having conductivity of the adherend 20. The island-shaped conductor 11 and the connecting member 13 and the adherend surface 21 having conductivity of the adherend 20 constitute the EBG structure shown in FIGS.

That is, the conductive adherend surface 21 of the adherend 20 constitutes the sheet-like conductor 2 in the EBG structure shown in FIGS. And the island-shaped conductor 11 and the connection member 13 with which the noise suppression tape 10 is provided constitute the island-shaped conductor 1 and the connection member 3 in the EBG structure shown in FIGS. The EBG structure shown in FIG. 3A faces one island-shaped conductor 11, a connection member 13 that is electrically connected to the island-shaped conductor 11, and the island-shaped conductor 11 in the adherend surface 21 of the adherend 20. A unit cell A is configured including the region. And this unit cell A is periodically arranged, so that this structure functions as a metamaterial, for example, EBG.

Here, the EBG structure shown in FIGS. 1 and 2 can suppress the propagation of noise on the surface of the sheet-like conductor 2. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 1 constitute a capacitance. That is, according to the EBG structure shown in FIG. 3A constituting the EBG structure shown in FIGS. 1 and 2, noise on the surface of the adherend surface 21 constituting the sheet-like conductor 2 in the EBG structure. Can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure, that is, in the vicinity of the noise suppression tape 10 can be suppressed because adjacent island-shaped conductors 11 constitute a capacitance.

According to the noise suppression tape 10 of the embodiment 1-1, the adherend surface 21 of the adherend 20 is partially attached to the adherend surface 21 of the adherend 20 by simply attaching the noise suppression tape 10 to the adherend surface 21 of the adherend 20. The EBG structure can be formed. And the propagation of noise on the adherend surface 21 of the adherend 20 can be suppressed.

Moreover, since the EBG structure shown in FIGS. 1 and 2 formed by the noise suppression tape 10 of Embodiment 1-1 is relatively simple compared to other EBG structures, the manufacturing process of the noise suppression tape 10 is performed. In addition to being able to reduce, it is excellent in terms of manufacturing cost.

Here, the above-mentioned effects cannot be realized with a tape simply provided with an EBG structure as shown in FIGS. Hereinafter, the reason will be described with reference to FIG.

FIG. 26 is a cross-sectional view showing a state in which the tape 100 including the EBG structure is attached to the adherend surface 201 having conductivity of the adherend 200. The tape 100 shown in FIG. 26 includes the same EBG structure as the EBG structure shown in FIGS. That is, this EBG structure has a sheet-like conductor 102, a plurality of island-like conductors 101 separated from each other, and a plurality of connection members 103.

Here, as shown in FIG. 26, the tape 100 is usually provided with a layer 104 of an insulating adhesive in order to ensure adhesion with the adherend 200. As shown in FIG. 26, the adhesive layer 104 has a sheet-like conductor 102 and an adherend surface 201 of the adherend 200 in a state where the tape 100 including the EBG structure is attached to the adherend 200. The sheet-like conductor 102 constituting the EBG structure and the adherend surface 201 of the adherend 200 are electrically separated from each other. Thus, in the state where the adherend surface 201 of the adherend 200 and the EBG structure are electrically separated, the propagation of noise on the adherend surface 201 of the adherend 200 cannot be suppressed. This problem is not limited to the tape provided with the EBG structure shown in FIGS. 1 and 2, and similarly occurs in a tape provided with another EBG structure.

The noise suppression tape of this embodiment solves the above-described problems. In addition, the noise suppression tape of all the following embodiments is also comprised so that the above-mentioned subject can be solved.
<< Embodiment 1-2 >>

Embodiment 1-2 mainly relates to claims 1 to 3 and 11 to 13.

FIG. 4A schematically shows an example of the noise suppression tape 10 of the first embodiment. FIG. 4A is a cross-sectional view showing a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of Embodiment 1-2 is based on the configuration of the noise suppression tape 10 of Embodiment 1-1 (see FIG. 3A), and the shape of the connecting member 13 is different. Since other configurations are the same as those of the noise suppression tape 10 of Embodiment 1-1, description thereof is omitted here.

The connection member 13 of the embodiment 1-2 includes a conductive first connection member 13A, a conductive second connection member 13B, and a conductive third connection member 13C. One end of the first connecting member 13 </ b> A penetrates the second surface 17 of the dielectric layer 15 and also penetrates the adhesive layer 18, and is exposed from the surface of the adhesive layer 18 that contacts the adherend 20. The first connection member 13A is electrically connected to the second connection member 13B via the other end side. The other end of the first connecting member 13 </ b> A may penetrate the first surface 16 of the dielectric layer 15. The first connecting member 13 </ b> A passes through a hole provided in the island-shaped conductor 11 in a state of non-contact with the island-shaped conductor 11. The second connecting member 13 </ b> B is provided so as to be electrically connected to the first connecting portion 13 </ b> A and to face the island-shaped conductor 11. The planar shape of the second connecting member 13B may be a straight line, a curved line, a spiral shape, or other shapes. The third connecting member 13C is electrically connected to the second connecting member 13B via one end side, and is electrically connected to the island-like conductor 11 via the other end side extending in the direction of the second surface 17 of the dielectric layer 15. . One end of the third connection member 13 </ b> C may penetrate the first surface 16 of the dielectric layer 15. Here, an example at the time of making the 2nd connection member 13B into spiral shape is shown to FIG. 4D and 4E. 4D is a cross-sectional view taken along the line II ′ of FIG. 4E, and FIG. 4E is a plan view of FIG. 4D viewed from the top to the bottom in the drawing.

The EBG structure shown in FIG. 4A has a short stub type EBG structure in which a microstrip line formed including the connection member 13B functions as a short stub. Specifically, the connection member 13A forms an inductance. Further, the connecting member 13B is electrically coupled to the opposing island-shaped conductor 11 to form a microstrip line having the island-shaped conductor 11 as a return path. One end of the microstrip line is a short end by the third connection member 13C, and is configured to function as a short stub.

Here, the EBG structure configured in a state in which the noise suppression tape 10 of Embodiment 1-2 is attached to the adherend 20 has the noise suppression tape 10 of Embodiment 1-1 attached to the adherend 20. Different from the EBG structure configured in the above state.

The EBG structure constituted by the noise suppression tape of Embodiment 1-2 includes an adherend surface 21 of an adherend 20, a plurality of island-like conductors 11 separated from each other, and a plurality of connection members 13 (13A, 13B, 13C). This EBG structure includes one island-shaped conductor 11, connection members 13 (13 </ b> A, 13 </ b> B, 13 </ b> C) provided corresponding to the island-shaped conductor 11, and the bonded surface 21 of the bonded object 20. A unit cell A is configured including a region facing the island-shaped conductor 11. Since the unit cells A are periodically arranged, the structure functions as a metamaterial, for example, EBG. In the example shown in FIG. 4A, the unit cell A has a two-dimensional array in plan view.

FIG. 4B is an equivalent circuit diagram of the unit cell A shown in FIGS. 4A and 4D. As shown in FIG. 4B, the unit cell A includes an impedance unit 23 and an admittance unit 24. The impedance unit 23 includes a capacitance C generated between adjacent island conductors 11 and an inductance L created by the island conductors 11. The admittance part 24 includes a capacitance C created by the adherend surface 21 of the adherend 20 and the island-like conductor 11, an inductance L created by the first connecting member 13A, and a second connecting member 13B (transmission line) and the second one. And a short stub including three connecting members 13C.

Generally, it is known that the EBG structure generates an electromagnetic band gap in a frequency region in which the impedance portion 23 is capacitive and the admittance portion 24 is inductive. In the short stub type EBG structure of FIGS. 4A and 4D, by increasing the stub length of the short stub, the frequency band in which the admittance portion 24 becomes inductive can be lowered. For this reason, it is possible to lower the frequency of the band gap band. The short stub type EBG structure requires a stub length to reduce the frequency of the bandgap band, but does not necessarily require an area, so that the unit cell can be miniaturized.

According to this EBG structure, it is possible to suppress the propagation of noise on the surface of the adherend surface 21 of the adherend 20. Moreover, the propagation of noise in the vicinity of the EBG structure, that is, in the vicinity of the noise suppression tape 10 can be suppressed because adjacent island-shaped conductors 11 constitute a capacitance.

Next, an example of a method for manufacturing the noise suppression tape 10 of Embodiment 1-2 will be described with reference to FIG. 4C. 4C is a cross-sectional view illustrating an example of a manufacturing process of the noise suppression tape 10 illustrated in FIG. 4A.

First, as shown in (1), a copper foil 13B is formed on the first surface of a substrate (dielectric layer 15 (1)) such as a glass epoxy substrate or a fluororesin substrate, and the copper foil 11 is formed on the second surface. Form. Next, as shown in (2), a pattern (a plurality of island-shaped conductors 11 separated from each other) is formed by selectively etching a part of the copper foil 11 by photolithography and etching. Further, a pattern (second connection member 13B) is formed by selectively etching a part of the copper foil 13B by photolithography and etching. The island-shaped conductor 11 is formed in a pattern provided with holes for allowing the first connection member 13A to pass therethrough. This hole is provided larger than the diameter of the first connecting member 13A.

Thereafter, a hole penetrating the second connecting member 13B, the dielectric layer 15 (1), and the island-like conductor 11 is formed by a drill, and a through pin made of a metal such as copper, aluminum, or stainless steel is formed in the hole. The state shown in (3) is obtained by inserting (third connection member 13C).

Next, as shown in (4), the dielectric layer 15 (2) is formed on the second surface (the lower surface in the drawing) of the dielectric layer 15 (1). For example, a new substrate (dielectric layer 15 (2)) such as a glass epoxy substrate or a fluororesin substrate is prepared, and the first surface (upper surface in the figure) of the substrate (dielectric layer 15 (2)) is prepared. ) May be affixed to the second surface (lower surface in the figure) of the dielectric layer 15 (1). Thus, in this embodiment, the island-shaped conductor 11 (first conductor) is provided inside the dielectric layer 15.

Then, a hole penetrating the second connecting member 13B, the dielectric layers 15 (1) and 15 (2), and the island conductor 11 is formed using a drill. This hole is smaller in diameter than the hole provided in the island-shaped conductor 11 in (2) and passes through this hole in a state of non-contact with the side wall of the hole provided in the island-shaped conductor 11. It is formed by penetrating a drill. Thereafter, as shown in (6), a through pin (first connecting member 13A) made of a metal such as copper, aluminum, or stainless steel is inserted into the hole formed in (5).

Thereafter, as shown in (7), the adhesive layer 18 is formed on the second surface (the lower surface in the drawing) of the dielectric layer 15 (2). The adhesive layer 18 is formed so that the connecting member 13 </ b> A penetrates the adhesive layer 18. As specific means for forming in this way, the same means as described in Embodiment 1-1 can be used.

Thereafter, a non-conductive surface layer (not shown) is further provided to cover the first surface (the upper surface in the drawing) of the plurality of island-shaped conductors 11 and the dielectric layer 15 (1) separated from each other. Also good.

According to the noise suppression tape 10 of the embodiment 1-2, the adherend surface 21 of the adherend 20 is partially attached to the adherend surface 21 of the adherend 20 by simply attaching the noise suppression tape 10 to the adherend surface 21 of the adherend 20. The EBG structure can be formed. And the propagation of noise on the adherend surface 21 of the adherend 20 can be suppressed.

Further, the EBG structure (see FIG. 4A) configured by the noise suppression tape 10 of Embodiment 1-2 has a characteristic connection member 13 (13A, 13B, 13C) configuration, as shown in FIG. 4B. Various inductances L and capacitances C can be formed. As a result, the inductance L and capacitance C required for suppressing the propagation of noise in a desired frequency band are made larger than necessary for the size of the island-shaped conductor 11 and the connecting member 13 (13A, 13B, 13C). It becomes possible to obtain without. That is, the size of the unit cell A can be made relatively small. In such a case, the number of unit cells A per unit area in the plane of the noise suppression tape 10 can be increased, and a high-performance noise suppression tape 10 can be realized.
<< Embodiment 1-3 >>

Embodiment 1-3 mainly relates to claims 1 to 3, 11, and 12.

FIG. 5A schematically shows an example of the noise suppression tape 10 of the first embodiment. FIG. 5A is a cross-sectional view showing a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of Embodiment 1-3 is based on the configuration of the noise suppression tape 10 of Embodiment 1-1 (see FIG. 3A), and the shape of the connecting member 13 is different. Since other configurations are the same as those of the noise suppression tape 10 of Embodiment 1-1, description thereof is omitted here.

The connection member 13 according to Embodiment 1-3 includes a conductive first connection member 13A and a conductive second connection member 13B. One end of the first connecting member 13 </ b> A penetrates the second surface 17 of the dielectric layer 15 and also penetrates the adhesive layer 18, and is exposed from the surface of the adhesive layer 18 that contacts the adherend 20. The first connection member 13A is electrically connected to the second connection member 13B via the other end side. The other end of the first connecting member 13 </ b> A may penetrate the first surface 16 of the dielectric layer 15. The first connecting member 13 </ b> A passes through a hole provided in the island-shaped conductor 11 in a state of non-contact with the island-shaped conductor 11. The second connecting member 13 </ b> B is provided so as to be electrically connected to the first connecting portion 13 </ b> A and to face the island-shaped conductor 11. The planar shape of the second connecting member 13B may be a straight line, a curved line, a spiral shape, or other shapes. The other end of the second connecting member 13B is an open end. Here, an example at the time of making the 2nd connection member 13B into a spiral shape is shown to FIG. 5D and 5E. 5D is a cross-sectional view of the roll of FIG. 5E, and FIG. 5E is a plan view of FIG. 5D viewed from the top to the bottom in the drawing.

The EBG structure shown in FIG. 5A has an open stub type EBG structure in which a microstrip line including the connection member 13B functions as an open stub. Specifically, the connection member 13A forms an inductance. Further, the connecting member 13B is electrically coupled to the opposing island-shaped conductor 11 to form a microstrip line having the island-shaped conductor 11 as a return path. One end of the microstrip line is an open end, and is configured to function as an open stub.

Here, the EBG structure configured in a state in which the noise suppression tape 10 of Embodiment 1-3 is attached to the adherend 20 has the noise suppression tape 10 of Embodiment 1-1 or 1-2 attached to the adherend. 20 is different from the EBG structure formed in the state of being attached to 20.

The EBG structure constituted by the noise suppression tape of Embodiment 1-3 includes an adherend surface 21 of the adherend 20, a plurality of island-like conductors 11 separated from each other, and a plurality of connection members 13 (13A, 13B). And composed of The EBG structure includes one island-shaped conductor 11, a connection member 13 (13 </ b> A, 13 </ b> B) provided corresponding to the island-shaped conductor 11, and the island in the bonded surface 21 of the bonded object 20. The unit cell A is configured to include a region facing the conductor 11. Since the unit cells A are periodically arranged, the structure functions as a metamaterial, for example, EBG. In the example shown in FIG. 5A, the unit cell A has a two-dimensional array in plan view.

FIG. 5B is an equivalent circuit diagram of the unit cell A shown in FIG. 5A. As shown in FIG. 5B, the unit cell A includes an impedance unit 23 and an admittance unit 24. The impedance unit 23 includes a capacitance C generated between adjacent island conductors 11 and an inductance L created by the island conductors 11. The admittance part 24 includes a capacitance C created by the adherend surface 21 of the adherend 20 and the island-shaped conductor 11, an inductance L created by the first connection member 13A, and a second connection member 13B (transmission line). Open stub, consisting of

Generally, it is known that the EBG structure generates an electromagnetic band gap in a frequency region in which the impedance portion 23 is capacitive and the admittance portion 24 is inductive. In the open stub type EBG structure shown in FIGS. 5A and 5B, by increasing the stub length of the open stub, the frequency band in which the admittance portion 24 becomes inductive can be lowered. For this reason, it is possible to lower the frequency of the band gap band. The open stub type EBG structure requires a stub length to reduce the frequency of the bandgap band, but does not necessarily require an area. Therefore, the unit cell can be miniaturized.

According to this EBG structure, it is possible to suppress the propagation of noise on the surface of the adherend surface 21 of the adherend 20. Moreover, the propagation of noise in the vicinity of the EBG structure, that is, in the vicinity of the noise suppression tape 10 can be suppressed because adjacent island-shaped conductors 11 constitute a capacitance.

Next, an example of a method for manufacturing the noise suppression tape 10 of Embodiment 1-3 will be described with reference to FIG. 5C. FIG. 5C is a cross-sectional view showing an example of a manufacturing process of the noise suppression tape 10 shown in FIG. 5A.

First, as shown in (1), a copper foil 13B is formed on the first surface of a substrate (dielectric layer 15 (1)) such as a glass epoxy substrate or a fluororesin substrate, and the copper foil 11 is formed on the second surface. Form. Next, as shown in (2), a pattern (a plurality of island-shaped conductors 11 separated from each other) is formed by selectively etching a part of the copper foil 11 by photolithography and etching. Further, a pattern (second connection member 13B) is formed by selectively etching a part of the copper foil 13B by photolithography and etching. The island-shaped conductor 11 is formed in a pattern provided with holes for allowing the first connection member 13A to pass therethrough. This hole is provided larger than the diameter of the first connecting member 13A.

Next, as shown in (3), the dielectric layer 15 (2) is formed on the second surface (the lower surface in the drawing) of the dielectric layer 15 (1). For example, a new substrate (dielectric layer 15 (2)) such as a glass epoxy substrate or a fluororesin substrate is prepared, and the first surface (upper surface in the figure) of the substrate (dielectric layer 15 (2)) is prepared. ) May be affixed to the second surface (lower surface in the figure) of the dielectric layer 15 (1). Thus, in this embodiment, the island-shaped conductor 11 (first conductor) is provided inside the dielectric layer 15.

Then, as shown in (4), a hole penetrating the second connecting member 13B, the dielectric layers 15 (1), 15 (2), and the island-shaped conductor 11 is formed using a drill. This hole is smaller in diameter than the hole provided in the island-shaped conductor 11 in (2) and passes through this hole in a state of non-contact with the side wall of the hole provided in the island-shaped conductor 11. It is formed by penetrating a drill. Thereafter, as shown in (5), a through pin (first connecting member 13A) made of a metal such as copper, aluminum, or stainless steel is inserted into the hole formed in (4).

Thereafter, as shown in (6), an adhesive layer 18 is formed on the second surface (the lower surface in the drawing) of the dielectric layer 15 (2). The adhesive layer 18 is formed so that the connecting member 13 </ b> A penetrates the adhesive layer 18. As specific means for forming in this way, the same means as described in Embodiment 1-1 can be used.

Thereafter, a non-conductive surface layer (not shown) is further provided to cover the first surface (the upper surface in the drawing) of the plurality of island-shaped conductors 11 and the dielectric layer 15 (1) separated from each other. Also good.

According to the noise suppression tape 10 of Embodiment 1-3, the adherend surface 21 of the adherend 20 is part of the constituent elements by simply attaching the noise suppression tape 10 to the adherend surface 21 of the adherend 20. The EBG structure can be formed. And the propagation of noise on the adherend surface 21 of the adherend 20 can be suppressed.

Further, the EBG structure (see FIG. 5A) configured by the noise suppression tape of Embodiment 1-3 has various inductances as shown in FIG. 5B due to the configuration of the characteristic connection member 13 (13A, 13B). L and capacitance C can be formed. As a result, the inductance L and the capacitance C required for suppressing the propagation of noise in a desired frequency band can be achieved without increasing the size of the island-shaped conductor 11 and the connecting member 13 (13A, 13B) more than necessary. Can be obtained. That is, the size of the unit cell A can be made relatively small. In such a case, the number of unit cells A per unit area in the plane of the noise suppression tape 10 can be increased, and a high-performance noise suppression tape 10 can be realized.
<< Embodiment 1-4 >>
The embodiment 1-4 mainly relates to claims 1 to 3, 11, and 12.

FIG. 6A schematically shows an example of the noise suppression tape 10 of the first embodiment. FIG. 6A is a cross-sectional view illustrating a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of Embodiment 1-4 is based on the configuration of the noise suppression tape 10 of Embodiment 1-1 (see FIG. 3A), and the shape of the connecting member 13 is different. Since other configurations are the same as those of the noise suppression tape 10 of Embodiment 1-1, description thereof is omitted here.

The connection member 13 according to Embodiment 1-4 includes a conductive first connection member 13A and a conductive second connection member 13B. One end of the first connecting member 13 </ b> A penetrates the second surface 17 of the dielectric layer 15 and also penetrates the adhesive layer 18, and is exposed from the surface of the adhesive layer 18 in contact with the adherend 20. The first connection member 13A is electrically connected to the second connection member 13B via the other end side. The other end of the first connecting member 13 </ b> A does not contact the island-shaped conductor 11. The second connecting member 13 </ b> B is provided to be electrically connected to the first connecting portion 13 </ b> A and to face the island-shaped conductor 11. The planar shape of the second connecting member 13B may be a straight line, a curved line, a spiral shape, or other shapes. The other end of the second connecting member 13B is an open end.

The EBG structure shown in FIG. 6A has an open stub type EBG structure in which a microstrip line formed including the connection member 13B functions as an open stub. Specifically, the connection member 13A forms an inductance. Further, the connecting member 13B is electrically coupled to the opposing island-shaped conductor 11 to form a microstrip line having the island-shaped conductor 11 as a return path. One end of the microstrip line is an open end and is configured to function as an open stub.

Here, the EBG structure configured in a state where the noise suppression tape 10 of Embodiment 1-4 is attached to the adherend 20 is covered with the noise suppression tape 10 of any of Embodiments 1-1 to 1-3. It is different from the EBG structure that is configured in a state of being attached to the adhesive 20.

The EBG structure constituted by the noise suppression tape 10 of Embodiment 1-4 includes an adherend surface 21 of an adherend 20, a plurality of island-like conductors 11 separated from each other, and a plurality of connection members 13 (13A, 13B). ). The EBG structure includes one island-shaped conductor 11, a connection member 13 (13 </ b> A, 13 </ b> B) provided corresponding to the island-shaped conductor 11, and the island in the bonded surface 21 of the bonded object 20. The unit cell A is configured to include a region facing the conductor 11. Since the unit cells A are periodically arranged, the structure functions as a metamaterial, for example, EBG. In the example shown in FIG. 6A, the unit cell A has a two-dimensional array in plan view.

The equivalent circuit diagram of the unit cell A is the same as the equivalent circuit diagram (FIG. 5B) described in the embodiment 1-3. Therefore, the description here is omitted.

According to this EBG structure, it is possible to suppress the propagation of noise on the surface of the adherend surface 21 of the adherend 20. Moreover, the propagation of noise in the vicinity of the EBG structure, that is, in the vicinity of the noise suppression tape 10 can be suppressed because adjacent island-shaped conductors 11 constitute a capacitance.

Next, an example of a method for manufacturing the noise suppression tape 10 of Embodiment 1-4 will be described with reference to FIG. 6B. 6B is a cross-sectional view illustrating an example of a manufacturing process of the noise suppression tape 10 illustrated in FIG. 6A.

First, as shown in (1), a copper foil 13B is formed on the first surface of a substrate (dielectric layer 15 (1)) such as a glass epoxy substrate or a fluororesin substrate. Also, the copper foil 11 is formed on the first surface of another substrate (dielectric layer 15 (2)) such as a glass epoxy substrate or a fluororesin substrate. Next, as shown in (2), a pattern (second connection member 13B) is formed by selectively etching a part of the copper foil 13B by photolithography and etching. Further, a pattern (a plurality of island-like conductors 11 separated from each other) is formed by selectively etching a part of the copper foil 11 by photolithography and etching.

Thereafter, as shown in (3), a hole penetrating the second connecting member 13B and the dielectric layer 15 (1) is formed by a drill. Next, as shown in (4), a through pin (connecting member 13A) made of a metal such as copper, aluminum, or stainless steel is inserted into the hole formed in (3).

Thereafter, as shown in (5), the second surface (lower side in the figure) of the dielectric layer 15 (2) is placed on the first surface (upper side in the figure) of the dielectric layer 15 (1). Paste so that the side of Next, as shown in (6), the adhesive layer 18 is formed on the second surface (the lower surface in the drawing) of the dielectric layer 15 (1). The adhesive layer 18 is formed so that the connecting member 13 </ b> A penetrates the adhesive layer 18. As specific means for forming in this way, the same means as described in Embodiment 1-1 can be used.

Thereafter, a non-conductive surface layer (not shown) is further provided to cover the first surface (the upper surface in the drawing) of the plurality of island-shaped conductors 11 and the dielectric layer 15 (2) separated from each other. Also good.

According to the noise suppression tape 10 of Embodiment 1-4, the adherend surface 21 of the adherend 20 is part of the constituent elements by simply attaching the noise suppression tape 10 to the adherend surface 21 of the adherend 20. The EBG structure can be formed. And the propagation of noise on the adherend surface 21 of the adherend 20 can be suppressed.

Further, the EBG structure (see FIG. 6A) configured by the noise suppression tape 10 of Embodiment 1-4 has various configurations as shown in FIG. 5B depending on the configuration of the characteristic connection member 13 (13A, 13B). An inductance L and a capacitance C can be formed. As a result, the inductance L and the capacitance C required for suppressing the propagation of noise in a desired frequency band can be achieved without increasing the size of the island-shaped conductor 11 and the connecting member 13 (13A, 13B) more than necessary. Can be obtained. That is, the size of the unit cell A can be made relatively small. In such a case, the number of unit cells A per unit area in the plane of the noise suppression tape 10 can be increased, and a high-performance noise suppression tape 10 can be realized.
<< Embodiment 1-5 >>

Embodiment 1-5 mainly relates to claims 12, 14, and 16.

FIG. 7 schematically shows an example of the noise suppression tape 10 of the first embodiment. FIG. 7 is a cross-sectional view showing a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of Embodiment 1-5 is formed on the dielectric layer 15 and the first surface 16 of the dielectric layer 15, and has a repetitive structure, for example, a periodic structure in at least a partial region. A first conductor (a plurality of island-shaped conductors 11). The first conductor is provided so as to face the second surface 17 which is the surface opposite to the first surface 16 of the dielectric layer 15. On the second surface 17 of the dielectric layer 15, an adhesive layer 18 that adheres to the adherend surface 21 of the adherend 20 is provided.

The periodic structure of the first conductor is composed of a plurality of island conductors 11 separated from each other. Then, some or all of the plurality of island-like conductors 11 are provided with openings 11B as shown in the enlarged perspective view of FIG. When the openings 11B are provided in a part of the plurality of island-shaped conductors 11, it is desirable that the openings 11B are provided periodically. In the opening 11B, a wiring 11A having one end connected to the island-shaped conductor 11 is provided. The size of the opening 11B, the length of the wiring 11A, the thickness, and the like are design matters determined according to the frequency of noise that suppresses propagation. In the noise suppression tape 10 of Embodiment 1-5 shown in FIG. 7, a non-conductive surface layer (not shown) that covers the dielectric layer 15 and the first conductor is formed on the first surface 16 of the dielectric layer 15. Further, it may be provided.

Here, the EBG structure configured in a state where the noise suppression tape 10 of the embodiment 1-5 is attached to the adherend 20 is the noise suppression tape 10 of any of the embodiments 1-1 to 1-4. Is different from the EBG structure configured in a state in which is attached to the adherend 20.

9 and 10 schematically show an example of the EBG structure constituted by the noise suppression tape 10 of Embodiment 1-5 and the adherend surface 21 of the adherend 20. FIG. 9 is a perspective view showing a configuration of the EBG structure, and FIG. 10 is a side view of the EBG structure of FIG.

The EBG structure includes a sheet-like conductor 2, a plurality of island-like conductors 1 separated from each other, an opening 1B provided in the island-like conductor 1, and a wiring 1A provided in the opening 1B. The The plurality of island-like conductors 1 are regions that overlap the sheet-like conductor 2 in plan view, and are disposed at positions away from the sheet-like conductor 2 with a dielectric layer (not shown) interposed therebetween. The plurality of island-shaped conductors 1 are periodically arranged. The plurality of island-shaped conductors 1 are provided with openings 1 </ b> B, and wiring 1 </ b> A having one end connected to the island-shaped conductor 1 is provided in the openings 1 </ b> B.

The wiring 1A functions as an open stub, and the portion of the sheet-like conductor 2 facing the wiring 1A and the wiring 1A form a transmission line, for example, a microstrip line.

The EBG structure includes one island-shaped conductor 1, wiring 1A provided in the opening 1B of the island-shaped conductor 1, and a region of the sheet-shaped conductor 2 facing these. Unit cell A is configured. Since the unit cells A are periodically arranged, the structure functions as a metamaterial, for example, EBG. In the example shown in FIGS. 9 and 10, the unit cell A has a two-dimensional array in plan view.

The plurality of unit cells A have the same structure and are arranged in the same direction. The island-like conductor 1 and the opening 1B are square and are arranged so that the centers overlap each other. The wiring 1A extends from the substantially center of one side of the opening 1B substantially perpendicular to the side.

FIG. 11 is an equivalent circuit diagram of the unit cell A shown in FIGS. As shown in FIG. 11, a capacitance C is formed between the sheet-like conductor 2 and the island-like conductor 1. A capacitance C is also formed between the adjacent island conductors 1. An inductance L is formed in the island-shaped conductor 1 having the opening 1B.

Further, as described above, the wiring 1A functions as an open stub, and the portion of the sheet-like conductor 2 facing the wiring 1A and the wiring 1A form a transmission line 4, for example, a microstrip line. The other end of the transmission line is an open end.

According to this EBG structure, noise propagation on the surface of the sheet-like conductor 2 can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 1 constitute a capacitance. That is, according to the EBG structure of Embodiment 1-5 constituting this EBG structure, noise is propagated on the surface of the adherend surface 21 constituting the sheet-like conductor 2 in the EBG structure. Can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure, that is, in the vicinity of the noise suppression tape 10 can be suppressed because adjacent island-shaped conductors 11 constitute a capacitance.

Next, an example of a method for manufacturing the noise suppression tape 10 of Embodiment 1-5 will be described. In the noise suppression tape 10 of Embodiment 1-5, as shown in (1) of FIG. 3B, the copper foil 11 is applied to the first surface of a substrate (dielectric layer 15) such as a glass epoxy substrate or a fluororesin substrate. After the formation, as shown in (2), a pattern (a plurality of island-like conductors 11 separated from each other) is formed by selectively etching a part of the copper foil 11 by photolithography and etching. By this photolithography and etching, the island-shaped conductor 11 is formed in the pattern shown in FIG.

Next, the adhesive layer 18 is formed on the second surface of the dielectric layer 15, and then the plurality of island-like conductors 11 separated from each other and the first surface of the dielectric layer 15 are covered as necessary. A surface layer (not shown) is provided.

According to the noise suppression tape 10 of the embodiment 1-5, the adherend surface 21 of the adherend 20 is partially attached to the adherend surface 21 of the adherend 20 only by adhering the noise suppression tape 10 to the adherend surface 21 of the adherend 20. The EBG structure can be formed. And the propagation of noise on the adherend surface 21 of the adherend 20 can be suppressed.

Further, unlike the noise suppression tape 10 of Embodiment 1-1 to Embodiment 1-4, the noise suppression tape 10 of Embodiment 1-5 does not have the connection member 13, and therefore the connection member 13 and the adherend 20 It is not necessary to provide a means for ensuring conduction with the adherend surface 21. That is, the noise suppression tape 10 of Embodiment 1-5 is a noise suppression tape with high quality stability.

Furthermore, unlike the noise suppression tape 10 of Embodiment 1-1 to Embodiment 1-4, the noise suppression tape 10 of Embodiment 1-5 does not have the connecting member 13, so that the manufacturing process can be simplified and compared. Can be manufactured easily. In addition, raw material costs can be reduced.
<< Embodiment 1-6 >>

Embodiment 1-6 mainly relates to claims 12, 14 to 16.

The noise suppression tape 10 of Embodiment 1-6 is based on the configuration of the noise suppression tape of Embodiment 1-5 (see FIGS. 7 and 8), and the structure in the opening 11B provided in the island-shaped conductor 11 is different. . Other configurations are the same as those of the noise suppression tape of the embodiment 1-5, and thus description thereof is omitted here.

FIG. 12 shows an enlarged perspective view of the island-shaped conductor 11 of the noise suppression tape of Embodiment 1-6. In the noise suppression tape 10 of Embodiment 1-6, an opening 11B as shown in FIG. 12 is provided in a part or all of the plurality of island-shaped conductors 11, and in some or all of the openings 11B, The second island-shaped conductor 11C and the wiring 11A that connects the island-shaped conductor 11 and the second island-shaped conductor 11C are provided.

Here, the EBG structure configured in a state where the noise suppression tape 10 of Embodiment 1-6 is attached to the adherend 20 is the noise suppression tape 10 of any one of Embodiment 1-1 to Embodiment 1-5. Is different from the EBG structure configured in a state in which is attached to the adherend 20.

FIG. 13 schematically shows an example of an EBG structure constituted by the noise suppression tape 10 of Embodiment 1-6 and the adherend surface 21 of the adherend 20. FIG. 13 is a perspective view showing the configuration of the EBG structure. The side view of the EBG structure is the same as the side view (see FIG. 10) of the EBG structure described in Embodiment 1-5.

The EBG structure includes a sheet-like conductor 2, a plurality of island-like conductors 1 separated from each other, an opening 1B provided in the island-like conductor 1, a wiring 1A provided in the opening 1B, and a second island. And a conductor 1C. The plurality of island-like conductors 1 are regions that overlap the sheet-like conductor 2 in plan view, and are disposed at positions away from the sheet-like conductor 2 with a dielectric layer (not shown) interposed therebetween. The plurality of island-shaped conductors 1 are periodically arranged. The plurality of island-shaped conductors 1 are provided with openings 1 </ b> B, and wiring 1 </ b> A having one end connected to the island-shaped conductor 1 is provided in the openings 1 </ b> B. Further, in the opening 1B, a second island-shaped conductor 1C connected to the other end of the wiring 1A is provided.

This EBG structure has one island-like conductor 1, wiring 1 </ b> A and second island-like conductor 1 </ b> C provided in the opening 1 </ b> B of this island-like conductor 1, and these in the sheet-like conductor 2. The unit cell A is configured to include a region to be operated. By periodically disposing the unit cells A, the structure functions as a metamaterial, for example, an EBG (Electromagnetic Band Gap). In the example shown in FIG. 13, the unit cell A has a two-dimensional array in plan view.

The plurality of unit cells A have the same structure and are arranged in the same direction. The island-shaped conductor 1, the opening 1 </ b> B, and the second island-shaped conductor 1 </ b> C are square and are arranged so that their centers overlap each other. The wiring 1A extends from the approximate center of one side of the opening 1B substantially perpendicularly to this side. Then, the wiring 1A connects the center of the first side of the second island-shaped conductor 1C and the center of the side of the opening 1B facing the first side of the second island-shaped conductor 1C. Yes.

FIG. 14 is an equivalent circuit diagram of the unit cell A shown in FIG. As shown in FIG. 13, a capacitance C is formed between the island-like conductor 1 and the sheet-like conductor 2. A capacitance C is also formed between the adjacent island conductors 1. Further, a capacitance C is also formed between the second island-like conductor 1C and the sheet-like conductor 2. An inductance L is formed in the island-shaped conductor 1 having the opening 1B. The wiring 1A connecting the island-shaped conductor 1 and the second island-shaped conductor 1C has an inductance L.

According to this EBG structure, noise propagation on the surface of the sheet-like conductor 2 can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 1 constitute a capacitance. That is, according to the EBG structure of Embodiment 1-6 constituting this EBG structure, noise is propagated on the surface of the adherend surface 21 constituting the sheet-like conductor 2 in the EBG structure. Can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure, that is, in the vicinity of the noise suppression tape 10 can be suppressed because adjacent island-shaped conductors 11 constitute a capacitance.

Here, the manufacturing method of the noise suppression tape 10 of the embodiment 1-6 can be realized according to the manufacturing method of the noise suppression tape 10 described in the embodiment 1-5, and therefore the description thereof is omitted here.

According to the noise suppression tape 10 of the embodiment 1-6, the adherend surface 21 of the adherend 20 is partially attached to the adherend surface 21 by simply attaching the noise suppression tape 10 to the adherend surface 21 of the adherend 20. The EBG structure can be formed. And the propagation of noise on the adherend surface 21 of the adherend 20 can be suppressed.

Further, unlike the noise suppression tape 10 of the embodiments 1-1 to 1-4, the noise suppression tape 10 of the embodiment 1-6 does not have the connection member 13, and therefore the connection member 13 and the adherend 20 It is not necessary to provide a means for ensuring conduction with the adherend surface 21. That is, the noise suppression tape 10 of Embodiment 1-6 is a noise suppression tape with high quality stability.

Further, unlike the noise suppression tape 10 of Embodiment 1-1 to Embodiment 1-4, the noise suppression tape 10 of Embodiment 1-6 does not have the connecting member 13, so that the manufacturing process can be simplified and compared. Can be manufactured easily. In addition, raw material costs can be reduced.
<< Embodiment 1-7 >>
The first to seventh embodiments mainly relate to claims 1, 9, 11 to 15, 22.

FIG. 25 schematically shows an example of the noise suppression tape 10 of the first embodiment. FIG. 25 is a cross-sectional view showing a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of Embodiment 1-7 is different from that of Embodiment 1-1 to Embodiment 1-6 in that the dielectric layer 15 does not have the adhesive layer 18. Other configurations are the same as those of the noise suppression tape 10 of any one of Embodiments 1-1 to 1-6, and thus description thereof is omitted here.

The noise suppression tape 10 of Embodiment 1-7 that does not have the adhesive layer 18 uses, for example, a tape 22 having an adhesive means (adhesive etc.) as shown in the example of FIG. The second surface 17 is attached to the adherend 20 such that the second surface 17 contacts the adherend surface 21 of the adherend 20. In addition, it may be attached to the adherend 20 using a member such as glue or a push pin so that the second surface 17 of the dielectric layer 15 contacts the adherend surface 21 of the adherend 20.

When the noise suppression tape 10 according to any one of Embodiment 1-1 to Embodiment 1-4 is used as a basis, for example, when the noise suppression tape 10 according to Embodiment 1-1 is used as a basis as shown in FIG. The noise suppression tape 10 needs to be attached to the adherend 20 so that the connecting member 13 provided on the noise suppression tape 10 contacts the adherend surface 21 having the conductivity of the adherend 20.

According to the noise suppression tape 10 of the embodiment 1-7, the adherend surface 21 of the adherend 20 is partially attached to the adherend surface 21 of the adherend 20 by simply attaching the noise suppression tape 10 to the adherend surface 21 of the adherend 20. The EBG structure can be formed. And the propagation of noise on the adherend surface 21 of the adherend 20 can be suppressed.

<Embodiment 2>

Embodiment 2 mainly relates to claims 1, 4 to 8, 10 to 15, 17 to 21, 23.

The noise suppression tape of Embodiment 1 has a partial configuration among the components of the EBG structure, but the noise suppression tape of this embodiment includes all of the components of the EBG structure. In the noise suppression tape of this embodiment, the EBG structure included in the noise suppression tape and the adherend surface of the adherend are electrically connected to each other in a state where the noise suppression tape is attached to the adherend surface having conductivity of the adherend. Means.

If the noise suppression tape of this embodiment is affixed to the adherend surface of the adherend, the EBG structure provided in the noise suppression tape and the adherend surface having the conductivity of the adherend will conduct, and as a result. It becomes possible to suppress the propagation of noise on the adherend surface of the adherend. That is, it is possible to suppress the propagation of noise on the surface on which the noise suppression tape is attached. In such a case, for example, by sticking this noise suppression tape 10 on the surface of the LSI or IC that generates the noise, the noise can be prevented from propagating through the surface and spreading to the periphery. As a result, electromagnetic waves can be suppressed from being emitted from the electronic device.

Next, the variation of the noise suppression tape which actualized this embodiment is demonstrated in detail. In addition, the noise suppression tape of this embodiment is not limited to the variation demonstrated below.
<< Embodiment 2-1 >>

Embodiment 2-1 mainly relates to claims 1, 4 to 6, 8, 11 to 19, and 21.

FIG. 15 schematically shows an example of the noise suppression tape 10 of the second embodiment. FIG. 15 is a cross-sectional view showing a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of Embodiment 2-1 is formed on the dielectric layer 15 and the inside of the dielectric layer 15 or on the first surface 16, and has a repetitive structure, for example, a periodic structure in at least a partial region. And a second conductor 12 formed on the second surface 17 of the dielectric layer 15. The first conductor is composed of a plurality of island-like conductors 11 separated from each other. The second conductor 12 is a sheet-like conductor extending on the second surface 17 of the dielectric layer 15 so as to face the plurality of island-like conductors 11 in plan view.

The noise suppression tape 10 of Embodiment 2-1 includes an adhesive layer 14. The adhesive layer 14 is provided on a surface opposite to the surface in contact with the dielectric layer 15 of the second conductor 12 and adheres to the adherend surface 21 having conductivity of the adherend 20. The adhesive layer 14 is provided with a conductive member. The conducting member conducts the second conductor 12 and the adherend surface 21 in a state where the noise suppression tape 10 is attached to the adherend 20. In the case of the noise suppression tape 10 of Embodiment 2-1, this conductive member is a plurality of conductive fillers 14A mixed in the adhesive layer 14.

Here, inside the dielectric layer 15, a connection member 13 that is electrically connected to at least the second conductor 12 may be provided so as to correspond to a part or all of the island-shaped conductors 11. The connecting member 13 may be electrically connected to the island-shaped conductor 11 as shown in FIG.

Note that the configuration of the connecting member 13 is not limited to that shown in FIG. 15, and can be configured as shown in FIGS. 4A, 4D, 5A, 5D, 6A, for example. Since the connection member 13 shown in these drawings has been described in the first embodiment, description thereof is omitted here.

Further, instead of providing the connecting member 13, a part or all of the plurality of island-shaped conductors 11 is provided with an opening 11B as shown in the enlarged perspective view of FIG. A wiring 11 </ b> A connected to the island-shaped conductor 11 may be provided. Alternatively, as shown in the enlarged perspective view of FIG. 12, some or all of the plurality of island-shaped conductors 11 are provided with openings 11B, and the second island-like shape is provided in some or all of the openings 11B. The conductor 11C and the wiring 11A that connects the island-shaped conductor 11 and the second island-shaped conductor 11C may be provided.

The noise suppression tape 10 of Embodiment 2-1 can be manufactured according to the method of manufacturing the noise suppression tape 10 described in Embodiment 1. Therefore, detailed description of the manufacturing method here is omitted.

The noise suppression tape 10 of Embodiment 2-1 includes an EBG structure that includes a first conductor (a plurality of island-shaped conductors 11) and a second conductor 12 as part or all of the components. And in the state which this noise suppression tape 10 was affixed on the to-be-adhered surface 21 which has the electroconductivity of the to-be-adhered object 20, several located between the 2nd conductor 12 and the to-be-adhered surface 21 of the to-be-adhered object 20 The second conductor 12 and the adherend surface 21 of the adherend 20 are electrically connected by the adhesive layer 14 mixed with the conductive filler 14A. That is, the adherend surface 21 having conductivity of the adherend 20 and the EBG structure included in the noise suppression tape 10 are electrically connected.

According to the noise suppression tape 10 of the embodiment 2-1 as described above, the noise propagation on the adherend surface 21 can be achieved by simply attaching the noise suppression tape 10 to the adherend surface 21 having the conductivity of the adherend 20. Can be suppressed.

In addition, the noise suppression tape of Embodiment 2-1 provides conduction between the second conductor 12 and the adherend surface 21 of the adherend 20 by the plurality of conductive fillers 14A mixed in the adhesive layer 14. Secure stable conduction can be realized.
<< Embodiment 2-2 >>

Embodiment 2-2 mainly relates to claims 1, 4 to 7, 11 to 20.

FIG. 16 schematically shows an example of the noise suppression tape 10 of the second embodiment. FIG. 16 is a cross-sectional view showing a state in which the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of the embodiment 2-2 is based on the configuration of the noise suppression tape 10 of the embodiment 2-1 (see FIG. 15), and the configuration of the conductive member is different. Other configurations are the same as those of the noise suppression tape of the embodiment 2-1, and thus description thereof is omitted here.

The conductive member in the noise suppression tape 10 of Embodiment 2-2 is a via 14B provided in the adhesive layer 14 as shown in FIG. The via 14 </ b> B may be integrated with the connection member 13. The via 14 </ b> B can be made of metal such as copper, aluminum, and stainless steel, and penetrates the adhesive layer 14. For this reason, the via 14 </ b> B is electrically connected to the second conductor 12. Further, in a state where the noise suppression tape 10 is attached to the adherend surface 21 having conductivity of the adherend 20, the via 14 </ b> B is in contact with the adherend surface 21 and is electrically connected to the adherend surface 21. With the configuration of the via 14 </ b> B, the second conductor 12 and the adherend surface 21 of the adherend 20 are electrically connected in a state where the noise suppression tape 10 is attached to the adherend face 21 having conductivity of the adherend 20. To do. That is, the adherend surface 21 having conductivity of the adherend 20 and the EBG structure included in the noise suppression tape 10 are electrically connected. The connecting member 13 and the via 14B may be integrated.

Here, the manufacturing method of the noise suppression tape 10 of the embodiment 2-2 is based on the manufacturing method of the noise suppression tape 10 described in the first embodiment, and further, a manufacturing process of the via 14B described below is provided. Can be realized.

In the case of the noise suppression tape 10 of the embodiment 2-2 based on the noise suppression tape of the embodiments 1-1 to 1-4, for example, the island-shaped conductor 11, the dielectric layer 15, and the second conductor shown in FIG. After the structure in which 12 is laminated is formed, a hole penetrating the island-shaped conductor 11, the dielectric layer 15, and the second conductor 12 is formed by a drill. And the penetration pin comprised with metals, such as copper, aluminum, and stainless steel used as the connection member 13 and the via | veer 14B, is inserted in this hole.

In the case of the noise suppression tape 10 of the embodiment 2-2 based on the noise suppression tape of the embodiments 1-5 and 1-6, that is, the noise suppression tape without the connecting member 13, for example, the dielectric layer 15 ( 16), a via 14B (convex shape) is formed on the surface of the second conductor 12 by photolithography and etching. Pattern is formed.

According to the noise suppression tape 10 of the embodiment 2-2 as described above, the noise propagation on the adherend surface 21 can be achieved by simply attaching the noise suppression tape 10 to the adherend surface 21 having the conductivity of the adherend 20. Can be suppressed.
<< Embodiment 2-3 >>

Embodiment 2-3 mainly relates to claims 1, 4, 9, 11 to 17, 23.

The noise suppression tape 10 according to Embodiment 2-3 is different from the noise suppression tape 10 according to Embodiment 2-1 or 2-2 (see FIGS. 15 and 16) in that the adhesive layer 14 is not provided. Other configurations are the same as those of the noise suppression tape 10 according to the embodiment 2-1 or 2-2, and thus the description thereof is omitted here.

The noise suppression tape 10 of the embodiment 2-3 that does not have the adhesive layer 14 is made of, for example, a tape provided with an adhesive means (adhesive, etc.), a member such as glue or a push pin, and the second conductor 12 is covered. It is affixed to the adherend 20 so as to be in contact with the adherend surface 21 of the adherend 20. According to this configuration, the second conductor 12 and the adherend surface 21 of the adherend 20 are electrically connected in a state where the noise suppression tape 10 is attached to the adherend face 21 having the conductivity of the adherend 20. . That is, the adherend surface 21 having conductivity of the adherend 20 and the EBG structure included in the noise suppression tape 10 are electrically connected.

According to the noise suppression tape 10 of the embodiment 2-3 as described above, the noise propagation on the adherend surface 21 can be achieved only by attaching the noise suppression tape 10 to the adherend surface 21 having the conductivity of the adherend 20. Can be suppressed.
<< Embodiment 2-4 >>

Embodiment 2-4 mainly relates to claims 1, 4, 9, 11 to 17, 23.

FIG. 17 schematically shows an example of the noise suppression tape 10 of the second embodiment. FIG. 17 is a cross-sectional view showing a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of the embodiment 2-4 is based on the configuration of the noise suppression tape 10 of the embodiment 2-1 (see FIG. 15), and the second conductor 12 is an adhesive mixed with a plurality of conductive fillers 14A. It differs in that it is a layer 14. The other configuration is the same as that of the noise suppression tape 10 of Embodiment 2-1, and thus the description thereof is omitted here. According to this configuration, the second conductor 12 and the adherend surface 21 of the adherend 20 are bonded to each other in a state where the noise suppression tape 10 is attached to the adherend face 21 having conductivity of the adherend 20. The conductive filler 14A mixed in the layer 14 conducts. That is, the adherend surface 21 having conductivity of the adherend 20 and the EBG structure included in the noise suppression tape 10 are electrically connected.

The noise suppression tape 10 of Embodiment 2-4 can be manufactured according to the method of manufacturing the noise suppression tape 10 described in Embodiment 1. Therefore, detailed description here is omitted.

According to the noise suppression tape 10 of the embodiment 2-4 as described above, the noise propagation on the adherend surface 21 can be achieved by simply attaching the noise suppression tape 10 to the adherend surface 21 having the conductivity of the adherend 20. Can be suppressed.

Moreover, since the adhesive layer 14 mixed with a plurality of conductive fillers 14A constitutes the second conductor 12, the manufacturing process can be reduced and the raw material cost can be suppressed.
<< Embodiment 2-5 >>

Embodiment 2-5 mainly relates to claims 14 to 20.

FIG. 18 schematically shows an example of the noise suppression tape 10 of the second embodiment. FIG. 18 is a cross-sectional view showing a state where the noise suppression tape 10 is attached to the adherend 20.

The noise suppression tape 10 of Embodiment 2-5 is based on the configuration of the noise suppression tape 10 of Embodiment 2-2 (see FIG. 16), and differs in the following points. That is, “the noise suppressing tape 10 of the embodiment 2-2 (see FIG. 16) may or may not be provided with the connecting member 13, but the noise suppressing tape 10 of the embodiment 2-5 is not provided with the connecting member 13. The difference is that “the point of not being provided” and “the configuration of the via 14B provided in the adhesive layer 14 and the shape of the second conductor 12 are different”.

FIG. 19 schematically shows an example of the planar shape of the second conductor 12. The second conductor 12 has an opening 12B. The opening 12B is provided at a position facing each of the plurality of island-shaped conductors 11 arranged with periodicity. Further, in the opening 12B, a wiring 12A having one end connected to the second conductor 12 is provided.

FIG. 20 schematically shows another example of the planar shape of the second conductor 12. The second conductor 12 has an opening 12B. The opening 12B is provided at a position facing the island-shaped conductor 11. The opening 12B is provided with a second island-shaped conductor 12C and a wiring 12A that connects the second conductor 12 and the second island-shaped conductor 12C.

Here, FIGS. 21 and 22 are perspective views schematically showing an EBG structure composed of the second conductor 12 and the plurality of island-shaped conductors 11 as described above. The equivalent circuit diagram of the unit cell A of the EBG structure in FIG. 21 is the same as the equivalent circuit diagram of the unit cell A of the EBG structure in FIG. 9 (see FIG. 11). It has been changed to. Further, the equivalent circuit diagram of the unit cell A of the EBG structure in FIG. 22 is the same as the equivalent circuit diagram of the unit cell A of the EBG structure in FIG. 13 (see FIG. 14). It has been changed to. Therefore, detailed description of the EBG structure shown in FIGS.

Next, the configuration of the via 14B will be described. In the embodiment 2-5, the shape of the second conductor 12 has the opening 12B as described above, and the wiring 12A or the wiring 12A and the second island-shaped conductor 12C are provided in the opening 12B. Have. In order to maintain these desired electrical relationships, the adhesive layer 14 is made of an adhesive having no conductivity. The position of the via 14 </ b> B provided in the adhesive layer 14 is preferably a position in contact with only the second conductor 12.

According to this configuration, in a state where the noise suppression tape 10 is attached to the adherend surface 21 having the conductivity of the adherend 20, the second conductor 12 and the adherend surface 21 of the adherend 20 are connected to the via. Conducted by 14B. That is, the adherend surface 21 having conductivity of the adherend 20 and the EBG structure included in the noise suppression tape 10 are electrically connected.

Here, the manufacturing method of the noise suppression tape 10 of Embodiment 2-5 is based on the manufacturing method of the noise suppression tape 10 described in Embodiment 1, and further, the manufacturing process of the via 14B and the second conductor described below. This can be realized by adding 12 manufacturing steps. For example, a conductor film to be the second conductor 12 is formed on one surface of the dielectric layer 15 (see FIG. 18) to be thicker than a desired thickness, and then the surface of the conductor film is formed by photolithography and etching. The pattern in which the vias 14B are formed is formed. Thereafter, a pattern (second conductor 12) as shown in FIG. 19 or 20 is formed by photolithography and etching with the via 14B covered with a mask.

According to the noise suppression tape 10 of Embodiment 2-5 as described above, the noise propagation on the adherend surface 21 can be achieved by simply attaching the noise suppression tape 10 to the adherend surface 21 having the conductivity of the adherend 20. Can be suppressed.
<Embodiment 3>

Embodiment 3 mainly relates to claims 24 to 27.

The noise suppression tape of this embodiment is based on the configuration of the noise suppression tape of Embodiment 1 or 2.

In the noise suppression tape based on the configuration of the first embodiment, the EBG structure having two or more types of EBG structures is obtained by the noise suppression tape and the adherend when the noise suppression tape is attached to the adherend. Composed. Various EBG structures are arranged periodically.

The noise suppression tape based on the configuration of Embodiment 2 includes an EBG structure having two or more types of EBG structures. Various EBG structures are arranged periodically.

Note that different types of EBG structures mean EBG structures with different equivalent circuits and / or band gap bands of the unit cell A.

According to the noise suppression tape of this embodiment, it becomes possible to suppress the propagation of noise at a plurality of frequencies by attaching a single noise suppression tape to an adherend.
<< Embodiment 3-1 >>

Embodiment 3-1 mainly relates to claims 24 to 27.

FIG. 23 schematically shows an example of the noise suppression tape 10 of the present embodiment. FIG. 23 is a plan view of the noise suppression tape 10. In the figure, the unit cell of the EBG structure is shown by a rectangle for convenience. The number of unit cells to be arranged is a design matter, and the illustrated one is only an example.

23, the noise suppression tape 10 of Embodiment 3-1 has two types of EBG structures, and the two types of EBG structures are alternately arranged to constitute a checkered pattern.

According to this configuration, each of the two types of EBG structures is arranged with periodicity.

According to such a noise suppression tape 10, it becomes possible to suppress the propagation of noise at a plurality of frequencies by attaching a single noise suppression tape to an adherend.
<< Embodiment 3-2 >>

Embodiment 3-2 mainly relates to claims 24 to 27.

FIG. 24 schematically shows an example of the noise suppression tape 10 of the present embodiment. FIG. 24 is a plan view of the noise suppression tape 10. In the figure, for convenience, the unit cell A having an EBG structure is shown by a rectangle. Note that the number of unit cells A to be arranged is a matter of design, and what is shown is merely an example.

24, the noise suppression tape 10 of Embodiment 3-2 has two or more types of EBG structures, and there are a plurality of areas in which various EBG structures are periodically arranged. The plurality of areas are alternately arranged.

According to this configuration, each of the two or more types of EBG structures is arranged with periodicity.

According to such a noise suppression tape 10, it is possible to suppress the propagation of noise at a plurality of frequencies by attaching a single noise suppression tape to an adherend.

This application claims priority based on Japanese Patent Application No. 2009-278873 filed on Dec. 8, 2009, the entire disclosure of which is incorporated herein.

Claims (27)

A dielectric layer;
Provided inside or on the first surface of the dielectric layer so as to face the second surface, which is the surface opposite to the first surface of the dielectric layer, and has a repetitive structure in at least a partial region. A first conductor having,
A connection member provided inside the dielectric layer and penetrating through the second surface of the dielectric layer;
Noise suppression tape with In the noise suppression tape of Claim 1,
An adhesive layer is provided on the second surface of the dielectric layer;
The noise suppression tape which the said connection member penetrates the said contact bonding layer and is exposed from the surface which contacts the to-be-adhered thing of the said contact bonding layer. In the noise suppression tape of Claim 2,
A noise suppression tape in which a plurality of conductive fillers are mixed in the adhesive layer. In the noise suppression tape of Claim 1,
A noise suppression tape, wherein a second conductor that is electrically connected to the connection member is formed on the second surface of the dielectric layer. In the noise suppression tape of Claim 4,
An adhesive layer is provided on the surface of the second conductor opposite to the surface in contact with the second surface of the dielectric layer,
A noise suppression tape in which a conductive member is provided in the adhesive layer. In the noise suppression tape of Claim 5,
The conducting member is
The noise suppression tape which makes the said 2nd conductor and the said to-be-adhered surface conduct | electrically_connected in the state affixed on the to-be-adhered surface which has the electroconductivity of the to-be-adhered thing. In the noise suppression tape according to claim 5 or 6,
The conductive member is a noise suppression tape which is a via provided in the adhesive layer. In the noise suppression tape according to claim 5 or 6,
The conductive member is a noise suppression tape that is a plurality of conductive fillers mixed in the adhesive layer. In the noise suppression tape of Claim 1,
The noise suppression tape affixed so that the said 2nd surface of the said dielectric material layer may contact the to-be-adhered surface which has the electroconductivity of to-be-adhered object. In the noise suppression tape of Claim 4,
The noise suppression tape affixed so that the said 2nd conductor may contact the to-be-adhered surface which has the electroconductivity of to-be-adhered object. In the noise suppression tape as described in any one of Claim 1 to 10,
The noise suppression tape in which the connecting member is electrically connected to the adherend surface in a state where the noise suppression tape is attached to the adherend surface having conductivity of the adherend. In the noise suppression tape as described in any one of Claim 1 to 11,
The noise suppression tape, wherein the repeating structure of the first conductor is a plurality of island-shaped conductors separated from each other. 13. The noise suppression tape according to claim 12, wherein the connecting member is electrically connected to the island conductor. A dielectric layer;
Provided inside or on the first surface of the dielectric layer so as to face the second surface, which is the surface opposite to the first surface of the dielectric layer, and has a repetitive structure in at least a partial region. A first conductor having,
With
The repeating structure of the first conductor is a plurality of island-shaped conductors separated from each other,
An opening is provided in part or all of the island-shaped conductor,
A noise suppression tape in which a wiring connected to the island-shaped conductor is provided in the opening. The noise suppression tape according to claim 14,
A noise suppression tape in which a second island-shaped conductor connected to the wiring is provided in a part or all of the openings. The noise suppression tape according to claim 14 or 15,
A noise suppression tape, wherein an adhesive layer is provided on the second surface of the dielectric layer. The noise suppression tape according to claim 14 or 15,
A noise suppression tape in which a second conductor is formed on the second surface of the dielectric layer. The noise suppression tape according to claim 17,
An adhesive layer is provided on the surface of the second conductor opposite to the surface in contact with the second surface of the dielectric layer,
A noise suppression tape in which a conductive member is provided in the adhesive layer. The noise suppression tape according to claim 18,
The conducting member is
The noise suppression tape which makes the said 2nd conductor and the said to-be-adhered surface conduct | electrically_connected in the state affixed on the to-be-adhered surface which has the electroconductivity of the to-be-adhered thing. The noise suppression tape according to claim 18 or 19,
The conductive member is a noise suppression tape which is a via provided in the adhesive layer. The noise suppression tape according to claim 18 or 19,
The noise suppressing tape, wherein the conductive member is a plurality of conductive fillers mixed in the adhesive layer. The noise suppression tape according to claim 14 or 15,
The noise suppression tape affixed so that the said 2nd surface of the said dielectric material layer may contact the to-be-adhered surface which has the electroconductivity of to-be-adhered object. The noise suppression tape according to claim 17,
The noise suppression tape affixed so that the said 2nd conductor may contact the to-be-adhered surface which has the electroconductivity of to-be-adhered object. In the noise suppression tape according to any one of claims 1 to 3, 9, 14 to 16, and 22,
In a state where the noise suppression tape is attached to the adherend surface having the conductivity of the adherend, at least one type of EBG structure is configured by the configuration of the noise suppression tape and the adherend surface. Various EBG structures are noise suppression tapes arranged periodically. The noise suppression tape according to claim 24,
In a state in which the noise suppression tape is attached to the adherend surface, two types of EBG structures are configured by the configuration of the noise suppression tape and the adherend surface,
The two types of EBG structures are noise suppression tapes arranged alternately. In the noise suppression tape according to any one of claims 4 to 8, 10, 17 to 21, 23,
The noise suppression tape includes at least one type of EBG structure, and various EBG structures are periodically arranged. The noise suppression tape according to claim 26,
The noise suppression tape includes two types of EBG structures, and the two types of EBG structures are alternately arranged.

Images