WO2011064859A1 - ガラスマスク用熱硬化型保護液およびガラスマスク - Google Patents
ガラスマスク用熱硬化型保護液およびガラスマスク Download PDFInfo
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- WO2011064859A1 WO2011064859A1 PCT/JP2009/069935 JP2009069935W WO2011064859A1 WO 2011064859 A1 WO2011064859 A1 WO 2011064859A1 JP 2009069935 W JP2009069935 W JP 2009069935W WO 2011064859 A1 WO2011064859 A1 WO 2011064859A1
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- epoxy resin
- glass mask
- resin
- silicone resin
- protective film
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/48—Protective coatings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
Definitions
- the present invention relates to a thermosetting protective liquid for glass masks, and more particularly to a thermosetting protective liquid for glass masks having excellent transparency when used as a protective film and a glass mask having a transparent protective film.
- the printed wiring board and the resin relief printing plate are produced by closely exposing a photomask (exposure original) to an adhesive photoresist such as a liquid photoresist. For this reason, if the surface of the photomask is not subjected to any treatment, when the photomask is removed from the photoresist after completion of exposure, a part of the photoresist adheres to the photomask surface and remains on the photomask even after wiping. As a result, there arises a problem that the exposure accuracy is lowered. Under such circumstances, a surface protection film having releasability is conventionally provided on the surface of the photomask facing the photoresist to prevent the photoresist from adhering to the photomask (Patent Document 1). ).
- a film having a hard coat property is bonded, or a coating film having a hard coat property is provided on the article surface.
- a coating film having such hard coat properties a coating film using a curable resin such as an epoxy resin, an acrylic resin, or a silicone resin is known (Patent Document 2).
- the protective film is brittle, so that there is a problem that cracks are easily generated and the performance as a protective film cannot be obtained.
- the epoxy resin and the silicone resin are incompatible, so whitening due to incompatibility occurs when used as a protective film. It was recognized and there was a problem of inhibiting transparency.
- an object of the present invention is to provide a thermosetting protective liquid for glass masks that has good adhesion to a glass mask, excellent hard coat properties of a protective film, and does not generate cracks. Furthermore, it aims at providing the thermosetting protective liquid for glass masks which prevents the whitening by the incompatibility of a protective film, and a glass mask using the same.
- thermosetting protective liquid for glass mask according to the first aspect of the present invention includes a silicone resin, an epoxy resin, and a silicone oil, and includes a phenol novolac type epoxy resin as an epoxy resin.
- the thermosetting protective liquid for glass mask according to the second aspect of the present invention contains a silicone resin, an epoxy resin and a silicone oil, and 15 to 35% by weight in the silicone resin is an ester-modified silicone resin. It is what.
- the phenol novolac type epoxy resin is characterized by being contained in the epoxy resin in an amount of 30% by weight or more.
- the weight ratio of the silicone resin and the epoxy resin is 4: 6 to 8: 2.
- the curing agent is characterized by containing an amine compound without containing a metal alkoxide catalyst.
- the glass mask of the present invention is characterized in that a protective film using the thermosetting protective liquid for glass mask is formed on the glass mask.
- thermosetting protective liquid for glass mask of the present invention has good adhesion to the glass mask, and when used as a protective film, the hard coat property of the protective film is excellent, cracks do not occur, and epoxy resin and silicone resin It is possible to prevent whitening of the coating film due to incompatibility and to have excellent transparency. Moreover, since a metal alkoxide catalyst is not included as a curing agent and an amine compound is included, the storage stability of the protective liquid can be improved.
- the glass mask on which the protective film using the thermosetting protective liquid for glass mask of the present invention is formed can have excellent adhesion between the protective film and the glass mask. Moreover, since the hardness of a protective film is high and it can prevent the whitening of the coating film by the incompatibility of an epoxy resin and a silicone resin, it can be set as the glass mask which improved the exposure precision by being excellent in transparency. .
- thermosetting protective liquid for glass mask of the present invention An embodiment of the thermosetting protective liquid for glass mask of the present invention will be described.
- the thermosetting protective liquid for glass masks according to the first aspect includes a silicone resin, an epoxy resin, and silicone oil, and includes a phenol novolac type epoxy resin as an epoxy resin.
- the thermosetting protective liquid for glass mask according to the second aspect includes a silicone resin, an epoxy resin, and a silicone oil, and 15 to 35% by weight in the silicone resin is an ester-modified silicone resin.
- Silicone resin is used for improving adhesion to glass when used as a protective film and for increasing the hardness of the protective film.
- a silicone resin a methyl silicone resin, a methylphenyl silicone resin, a modified silicone resin, and the like can be used.
- the modified silicone resin an ester-modified silicone resin, an epoxy-modified silicone resin, an alkyd-modified silicone resin, One or a mixture of two or more acrylic-modified silicone resins can be used.
- an ester-modified silicone resin is included.
- the reason why the ester-modified silicone resin is used is that it has good compatibility with the epoxy resin described later, and does not cause whitening due to incompatibility when used as a protective film, thereby obtaining excellent transparency.
- the haze (JIS K7105: 1981) of such a protective film is preferably less than 1%.
- silicone resins include the KR400, KR500, KR510, KR213, ES1001N, ES1002T, KR5206, KR9706, KR5230, KR5234, KR5235, X-40-2308, X-40-2308, X -40-9238 and the like, and particularly as ester-modified silicone resins, KR5230, KR5234, KR5235, and the like.
- 15 to 35% by weight in the silicone resin is an ester-modified silicone resin, and more preferably 20 to 30% by weight. The reason why the content is 15% by weight or more is to obtain compatibility with the epoxy resin, and the reason why the content is 35% by weight or less is to prevent a decrease in the hardness of the coating film.
- the epoxy resin is used to impart hard coat properties to the protective film when used as a protective film.
- examples of such epoxy resins include novolak type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, biphenyl type epoxy resins, polycyclic aromatic type epoxy resins, hydrogenated alicyclic epoxy resins, and mesogenic skeleton epoxy resins. Etc. can be used.
- at least a phenol novolac type epoxy resin is included.
- the phenol novolac type epoxy resin is used to obtain hard coat properties when used as a protective film, and has good compatibility with the above-mentioned silicone resin. When used as a protective film, whitening due to incompatibility is achieved. This is to prevent it from happening.
- the haze (JIS K7105: 1981) of such a protective film is preferably less than 1%.
- a polyfunctional epoxy resin such as a novolac type epoxy resin, a bisphenol A type epoxy resin, a polycyclic aromatic type epoxy resin or the like is particularly preferable because hard coat properties when used as a protective film are easily obtained.
- the epoxy resin examples include the EPICLON series as the product name of Dainippon Ink and Chemicals, the JER series as the product name of Japan Epoxy Resin, and the Dainippon Ink as the phenol novolac type epoxy resin.
- the phenol novolac type epoxy resin is preferably contained in the epoxy resin in an amount of 30% by weight or more, more preferably 40% by weight or more, and particularly preferably 80% by weight or more.
- the reason why the content is 30% by weight or more is that compatibility with the above-described silicone resin is good and whitening due to incompatibility is not caused when the protective film is formed.
- the weight ratio of silicone resin and epoxy resin contained in the thermosetting protective liquid for glass mask is preferably 4: 6 to 8: 2.
- the ratio of the silicone resin further increases from the above ratio, cracks are likely to occur in the coating film, and when the ratio of the epoxy resin further increases from the above ratio, a coating film having sufficient hardness required for the protective film is obtained. It cannot be made, and it cannot be set as the excellent protective film for glass masks.
- Silicone oil is used to impart releasability and antifouling properties to the surface of the protective film when used as a protective film.
- silicone oil such as dimethyl silicone oil, methyl hydrogen silicone oil, methylphenyl silicone oil, and cyclic dimethyl silicone oil, and modified silicone oil in which an organic group is introduced into silicone oil can be used.
- modified silicone oils such as alkyl modification, polyether modification, fluorine modification, amino modification, mercapto modification, epoxy modification, carboxyl modification, higher fatty acid ester modification, methacryl modification and carbinol modification can be used.
- a reactive silicone oil having a group that reacts with a silicone resin or an epoxy resin in order to maintain releasability and antifouling property.
- silicone oil examples include KF96, KF69, KF99, KF54, KF968 and the like as trade names of Shin-Etsu Chemical Co., Ltd.
- particularly reactive silicone oils include KF410, KF412, KF351, KF354, KF618, KF945, KF859, KF858, KF861, KF864, KF880, X-22-161A, KF1001, KF101, X-22-3701E, X-22-3710, X-22-160AS, KF6001, KF6003, and the like.
- the silicone oil is preferably 0.05 to 1 part by weight with respect to 100 parts by weight of the resin component (solid content) in the protective liquid. 0.05 parts by weight or more is for obtaining sufficient releasability and antifouling properties, and 1 part by weight or less for reducing the surface tension when the coating liquid is used. This is to prevent the formation of a uniform and difficult to form a uniform coating film.
- thermosetting protective liquid for glass mask of the present invention can obtain a hard coat property on the protective film by cross-linking the above-mentioned silicone resin and epoxy resin with heat.
- a curing agent is required.
- an amine compound in a state in which a metal alkoxide catalyst is not included. It is conceivable to use a commonly used metal alkoxide catalyst as a curing catalyst for the silicone resin. However, when a metal alkoxide catalyst is used, it easily reacts with moisture in the atmosphere. There is a problem in terms of stability. On the other hand, by using an amine compound, it can be allowed to act as a curing catalyst for a silicone resin, and can also act as a curing agent for an epoxy resin. Therefore, it is possible to solve the problem of storage stability of the protective liquid, which has been a drawback of the metal alkoxide catalyst.
- a cure sol series manufactured by Shikoku Kasei Kogyo Co., Ltd. or a racamide series manufactured by DIC Co. can be used.
- the curing start temperature by the amine compound is preferably 100 ° C. or more in order to obtain storage stability of the liquid.
- the amine compound is preferably 1 to 10 parts by weight with respect to 100 parts by weight of the resin component (solid content) in the protective liquid.
- thermosetting protective liquid for glass mask of the present invention is prepared by mixing the above-described silicone resin, epoxy resin, silicone oil, curing agent and other components as necessary, and dissolving them in an appropriate solvent. Can do.
- the protective film obtained by the thermosetting protective liquid for glass mask of the present invention has a pencil hardness (JIS K5600-5-4: 1999) of 3H or higher when cured.
- the glass mask of the present invention is obtained by forming a protective film using the above-described thermosetting protective liquid for glass mask on a glass mask.
- the glass mask used in the present invention is a glass substrate on which a pattern is formed for forming a fine pattern on a printed wiring board or a resin relief plate.
- a glass mask include an emulsion mask formed by applying an emulsion in which gelatin and silver halide are mixed on a glass substrate, and a chromium mask forming a thin film made of chromium, chromium oxide, or the like on the glass substrate.
- the glass mask of the present invention is obtained by applying and heating a glass mask thermosetting protective liquid containing the above-mentioned silicone resin, epoxy resin, and silicone oil on a glass mask on which such a pattern is formed.
- a protective film having a hard coat property and a releasability is formed by thermosetting the resin component.
- a glass mask having excellent adhesion to the glass mask and hard coat properties can be obtained.
- a 1st viewpoint since compatibility with an epoxy resin and a silicone resin improves by including a phenol novolak-type epoxy resin as an epoxy resin, whitening of a protective film is suppressed and transparency improves. Thereby, the exposure accuracy in the case of forming a pattern on a printed wiring board or a resin relief plate is improved, and a fine pattern can be formed.
- compatibility with an epoxy resin and a silicone resin improves by including ester modified silicone resin as a silicone resin, whitening of a protective film is suppressed and transparency improves. Thereby, the exposure accuracy in the case of forming a pattern on a printed wiring board or a resin relief plate is improved, and a fine pattern can be formed.
- a method for forming a protective film on a glass mask known methods such as spin coating, die coating, cap coating, and bar coating can be used.
- the glass mask in which the pattern used in the present invention is formed includes those provided with a protective film and an undercoat layer for improving adhesion.
- thermosetting protective solutions for glass masks of Examples 1 to 5, Comparative Examples 1 to 3, and Reference Example 1 having the compositions shown in Table 1 below were applied onto a patterned emulsion mask by spin coating, at 150 ° C. and 70 ° C. Then, a protective film having a thickness of about 2 ⁇ m was formed, and the glass masks of Examples 1 to 5, Comparative Examples 1 to 3, and Reference Example 1 were produced.
- silicone resin 1 (X-40-2308: Shin-Etsu Chemical Co., Ltd., solid content 100%)
- silicone resin 2 epoxy-modified silicone resin (ES-1001N: Shin-Etsu Chemical Co., Ltd., solid content 45%)
- Silicone resin 3 ester-modified silicone resin (KR5235: Shin-Etsu Chemical Co., Ltd., solid content 60%)
- silicone resin 4 acrylic-modified silicone resin (KR9706: Shin-Etsu Chemical Co., Ltd., solid content 100%)
- epoxy resin 1 phenol Novolac type epoxy resin (JER157S70: Japan Epoxy Resin, solid content 100%)
- epoxy resin 2 (Epiclon 860: DIC, solid content 100%)
- epoxy resin 3 (Epiclon 840: DIC, solid content 100%)
- silicone oil KF6001: Shin-Etsu Chemical Co., Ltd., solid content 100%
- amine-based catalyst (Cureazole 2PZ-CN: Shikoku Chemicals) Gosha
- thermosetting protective liquids for glass masks of Examples 1 to 4 were excellent in liquid storage stability because they contained only an amine catalyst as a curing agent.
- thermosetting protective liquid for glass mask of Example 5 contains an amine catalyst and a metal alkoxide catalyst as a curing agent, there is a problem in liquid storage stability.
- the glass mask of Comparative Example 1 does not contain a phenol novolac type epoxy resin in the epoxy resin, whitening of the protective film was observed. Further, the weight ratio between the silicone resin and the epoxy resin was outside the range of 4: 6 to 8: 2, and the ratio of the silicone resin was large, so that cracks occurred.
- the glass mask of Comparative Example 2 does not contain a phenol novolac type epoxy resin in the epoxy resin, whitening of the protective film was observed. Further, since the ratio of the silicone resin to the epoxy resin is outside the range of 4: 6 to 8: 2, and the ratio of the epoxy resin is large, the surface hardness sufficient as the protective film cannot be obtained.
- the glass mask of Reference Example 1 has a lower haze than the glass masks of Comparative Examples 1 to 3 because the proportion of the phenol novolac type epoxy resin in the epoxy resin is less than 30% by weight. Whitening was observed.
- thermosetting protective solutions for glass masks of Examples 6 to 9 and Comparative Examples 4 to 8 having the compositions shown in Table 3 below were applied onto a patterned emulsion mask by spin coating, and heat cured at 150 ° C. for 70 minutes. A protective film having a thickness of about 2 ⁇ m was formed, and glass masks of Examples 6 to 9 and Comparative Examples 4 to 8 were produced.
- silicone resins 1 to 4 epoxy resins 1 to 2, silicone oil, amine catalyst, metal alkoxide catalyst: those used in Examples 1 to 5 and Comparative Examples 1 to 3, silicone resin 5: Methyl silicone resin (KR400: Shin-Etsu Chemical Co., Ltd., solid content 100%) was used.
- the protective film was not whitened. Further, since the weight ratio of the silicone resin and the epoxy resin in the thermosetting protective liquid for glass mask is within the range of 4: 6 to 8: 2, sufficient surface hardness can be obtained as a protective film.
- the protective film was free from cracks, and was excellent as a protective film for glass masks. Further, the thermosetting protective liquids for glass masks of Examples 6 to 8 were excellent in liquid storage stability because they contained only an amine catalyst as a curing agent.
- the protective film was not whitened. Further, since the weight ratio of the silicone resin and the epoxy resin in the thermosetting protective liquid for glass mask is within the range of 4: 6 to 8: 2, sufficient surface hardness can be obtained as a protective film. The protective film was free from cracks, and was excellent as a protective film for glass masks. However, since the thermosetting protective liquid for glass mask of Example 9 contains an amine catalyst and a metal alkoxide catalyst as a curing agent, there is a problem in liquid storage stability.
- the protective film is whitened.
- the weight ratio of the silicone resin and the epoxy resin in the thermosetting protective liquid for glass mask is outside the range of 4: 6 to 8: 2, and the surface hardness sufficient as a protective film cannot be obtained. .
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Abstract
Description
第2の観点として、シリコーン樹脂として、エステル変性シリコーン樹脂を含むことにより、シリコーン樹脂とエポキシ樹脂との相溶性を向上させ、白化を防止することができることを見出し、これを解決するに至った。
本発明の第2の観点に係るガラスマスク用熱硬化型保護液は、シリコーン樹脂、エポキシ樹脂及びシリコーンオイルを含み、前記シリコーン樹脂中の15~35重量%がエステル変性シリコーン樹脂であることを特徴とするものである。
第1の観点に係るガラスマスク用熱硬化型保護液は、シリコーン樹脂及びエポキシ樹脂、シリコーンオイルを含み、エポキシ樹脂としてフェノールノボラック型エポキシ樹脂を含むものである。
第2の観点に係るガラスマスク用熱硬化型保護液は、シリコーン樹脂、エポキシ樹脂及びシリコーンオイルを含み、前記シリコーン樹脂中の15~35重量%がエステル変性シリコーン樹脂である。
第1の観点では、特に、エステル変性シリコーン樹脂を後述するフェノールノボラック型エポキシ樹脂と共に用いることによって、さらにシリコーン樹脂とエポキシ樹脂との相溶性を向上させることができ好ましい。
第2の観点では、少なくとも、エステル変性シリコーン樹脂を含むものである。エステル変性シリコーン樹脂を用いるのは、後述するエポキシ樹脂との相溶性が良好で、保護膜とした場合に不相溶による白化を起させず、優れた透明性を得るためである。このような保護膜のヘーズ(JIS K7105:1981)は、1%未満であることが好ましい。
第2の観点では、シリコーン樹脂中の15~35重量%が、エステル変性シリコーン樹脂であり、更に好ましくは、20~30重量%である。15重量%以上とするのは、エポキシ樹脂との相溶性を得るためであり、35重量%以下とするのは、塗膜の硬度の低下を防止するためである。
第1の観点では、少なくともフェノールノボラック型エポキシ樹脂を含むものである。フェノールノボラック型エポキシ樹脂を用いるのは、保護膜とした場合のハードコート性を得るためのほかに、前述のシリコーン樹脂との相溶性が良好で、保護膜とした場合に不相溶による白化を起こさせないためである。このような保護膜のヘーズ(JIS K7105:1981)は、1%未満であることが好ましい。
第2の観点では、特に、保護膜とした場合のハードコート性が得易いため、ノボラック型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、多環芳香族型エポキシ樹脂などの多官能性エポキシ樹脂が好ましい。
第2の観点では、シリコーン樹脂として、エステル変性シリコーン樹脂を含むことによって、エポキシ樹脂とシリコーン樹脂との相溶性が向上するため、保護膜の白化が抑制されて透明性が向上する。これにより、プリント配線板や樹脂凸版にパターンを形成する場合の露光精度が向上し、微細パターンを形成することができる。
下記表1組成の実施例1~5、比較例1~3及び参考例1のガラスマスク用熱硬化型保護液を、パターン形成されたエマルジョンマスク上に、スピンコートにより塗布し、150℃、70分で加熱硬化させ、厚み約2μmの保護膜を形成し、実施例1~5、比較例1~3及び参考例1のガラスマスクを作製した。
実施例1~5および比較例1~3で得られたガラスマスクと保護膜との接着性を、碁盤目テープ法(JIS K5600-5-6:1999)により評価した。碁盤目テープ法による剥離試験の結果、碁盤目部分が剥離してしまったものを「×」、碁盤目部分が全く剥離しなかったものを「○」とした。結果を表3に示す。
実施例1~5、および比較例1~3で得られたガラスマスクの保護膜にクラックが生じるか否かを目視評価した。目視で確認できるクラックがみられるものを「×」、クラックがみられないものを「○」とした。評価結果を表3に示す。
実施例1~5および比較例1~3のガラスマスクの透明部分について、ヘーズメーター(HGM-2K:スガ試験機社)を用いて、JIS K7105:1981にしたがって、ヘーズを測定した。ヘーズが1%未満のものを「○」、1%以上5%未満のものを「△」、5%以上のものを「×」とした。結果を表3に示す。
JIS K5600-5-4:1999に従い、実施例1~5および比較例1~3のガラスマスクに形成された保護膜の表面の鉛筆硬度を測定した。その結果、鉛筆硬度が3H以上のものを「○」、3H未満のものを「×」とした。結果を表3に示す。
実施例1~5、および比較例1~3に用いたガラスマスク用熱硬化型保護液の3日後の液状態を観察した。流動性がなくなり、塗布液として使用できないものを「×」、流動性があり、塗布液として問題が無いもの「○」とした。評価結果を表3に示す。
下記表3組成の実施例6~9及び比較例4~8のガラスマスク用熱硬化型保護液を、パターン形成されたエマルジョンマスク上に、スピンコートにより塗布し、150℃、70分で加熱硬化させ、厚み約2μmの保護膜を形成し、実施例6~9及び比較例4~8のガラスマスクを作製した。
Claims (6)
- シリコーン樹脂、エポキシ樹脂及びシリコーンオイルを含み、エポキシ樹脂としてフェノールノボラック型エポキシ樹脂を含むことを特徴とするガラスマスク用熱硬化型保護液。
- 前記フェノールノボラック型エポキシ樹脂は、エポキシ樹脂中に30重量%以上含まれることを特徴とする請求項1記載のガラスマスク用熱硬化型保護液。
- シリコーン樹脂、エポキシ樹脂及びシリコーンオイルを含み、前記シリコーン樹脂中の15~35重量%がエステル変性シリコーン樹脂であることを特徴とするガラスマスク用熱硬化型保護液。
- 前記シリコーン樹脂と前記エポキシ樹脂の重量割合が、4:6~8:2であることを特徴とする請求項1~3何れか1項に記載のガラスマスク用熱硬化型保護液。
- 硬化剤として金属アルコキシド系触媒を含まずアミン系化合物を含むことを特徴とする請求項1~4何れか1項に記載のガラスマスク用熱硬化型保護液。
- ガラスマスク上に、請求項1~5何れか1項に記載のガラスマスク用熱硬化型保護液を用いた保護膜が形成されてなることを特徴とするガラスマスク。
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| KR1020127005943A KR20120109469A (ko) | 2009-11-26 | 2009-11-26 | 유리 마스크용 열경화형 보호액 및 유리 마스크 |
| PCT/JP2009/069935 WO2011064859A1 (ja) | 2009-11-26 | 2009-11-26 | ガラスマスク用熱硬化型保護液およびガラスマスク |
| CN200980162460.1A CN102612665B (zh) | 2009-11-26 | 2009-11-26 | 玻璃掩模用热固化型保护液及玻璃掩模 |
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Cited By (3)
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| WO2013157382A1 (ja) * | 2012-04-19 | 2013-10-24 | 株式会社きもと | ガラスマスク用熱硬化型保護液及びガラスマスク |
| CN103827989A (zh) * | 2011-10-03 | 2014-05-28 | 松下电器产业株式会社 | 压粉磁芯及其制造方法 |
| WO2014171315A1 (ja) * | 2013-04-19 | 2014-10-23 | 株式会社きもと | 離型性能回復液、離型性能回復方法及びフォトマスク |
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| CN1817966A (zh) * | 2004-12-16 | 2006-08-16 | Jsr株式会社 | 保护膜形成用组合物及保护膜 |
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| CN103827989A (zh) * | 2011-10-03 | 2014-05-28 | 松下电器产业株式会社 | 压粉磁芯及其制造方法 |
| WO2013157382A1 (ja) * | 2012-04-19 | 2013-10-24 | 株式会社きもと | ガラスマスク用熱硬化型保護液及びガラスマスク |
| CN104145216A (zh) * | 2012-04-19 | 2014-11-12 | 木本股份有限公司 | 玻璃掩模用热固化型保护液及玻璃掩模 |
| JPWO2013157382A1 (ja) * | 2012-04-19 | 2015-12-21 | 株式会社きもと | ガラスマスク用熱硬化型保護液及びガラスマスク |
| WO2014171315A1 (ja) * | 2013-04-19 | 2014-10-23 | 株式会社きもと | 離型性能回復液、離型性能回復方法及びフォトマスク |
| JP2014210861A (ja) * | 2013-04-19 | 2014-11-13 | 株式会社きもと | 離型性能回復液、離型性能回復方法及びフォトマスク |
Also Published As
| Publication number | Publication date |
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| CN102612665B (zh) | 2014-07-30 |
| CN102612665A (zh) | 2012-07-25 |
| KR20120109469A (ko) | 2012-10-08 |
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