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WO2011064622A1 - Dispositif ayant une fonction de détection de la corrosion et son procédé de fabrication - Google Patents

Dispositif ayant une fonction de détection de la corrosion et son procédé de fabrication Download PDF

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Publication number
WO2011064622A1
WO2011064622A1 PCT/IB2009/055393 IB2009055393W WO2011064622A1 WO 2011064622 A1 WO2011064622 A1 WO 2011064622A1 IB 2009055393 W IB2009055393 W IB 2009055393W WO 2011064622 A1 WO2011064622 A1 WO 2011064622A1
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WO
WIPO (PCT)
Prior art keywords
substrate
electromagnetic radiation
grating
corrosion
radiation beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2009/055393
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English (en)
Inventor
Aurelie Humbert
Magali Lambert
Youri Victorovitch Ponomarev
Matthias Merz
Romano Hoofman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
NXP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP BV filed Critical NXP BV
Priority to PCT/IB2009/055393 priority Critical patent/WO2011064622A1/fr
Publication of WO2011064622A1 publication Critical patent/WO2011064622A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
    • G01N17/04—Corrosion probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G01N2021/7769—Measurement method of reaction-produced change in sensor
    • G01N2021/7773—Reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G01N21/7703—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator using reagent-clad optical fibres or optical waveguides
    • G01N21/774—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator using reagent-clad optical fibres or optical waveguides the reagent being on a grating or periodic structure

Definitions

  • the invention relates to a device having a corrosion detection function.
  • the invention relates to a method of manufacturing a device having a corrosion detection function.
  • Corrosion is a major factor in reducing the structural integrity in the life of these structures but corrosion is also usually difficult to detect in a cost effective way. Corrosion measurement employs a variety of techniques to determine how corrosive the environment is and at what rate metal loss is being experienced.
  • US 5,646,400 discloses a nondestructive method and apparatus for optical detection and monitoring corrosion in structures normally inaccessible to light and
  • An optical fiber coated with a corrosion sensitive compound is embedded in the structure. Tapped Bragg gratings of different Bragg periods are spaced along the fiber and refract a narrow bandwidth component of a broad beam light pulse transmitted through the fiber. Due to corrosion, the refracted components are reflected by the compound and their amplitudes are detected and displayed for each narrow bandwidth.
  • a device having a corrosion detection function and a method of manufacturing a device having a corrosion detection function according to the independent claims are provided.
  • a (for instance monolithically integrated) device which comprises a substrate comprising a corrodible material (for instance a metal or any other substance being prone to corrosion), a grating (for instance a two-dimensional planar grating area) formed on and/or in the substrate (for instance, but not necessarily, coupled to the corrodible material), an electromagnetic radiation source (for instance a light source) formed on and/or in the substrate and adapted for directing an electromagnetic radiation beam (such as a coherent beam, for instance a coherent light beam) onto the grating, an electromagnetic radiation detector (for instance a light detector) formed on and/or in the substrate and adapted (or arranged) for detecting the electromagnetic radiation beam after interaction with (for instance after reflection at or after transmission through) the grating, and an evaluation unit (for instance a monolithically integrated electronic circuit) formed on and/or in the substrate and adapted for evaluating a corrosion state of the corrodible material based on the detected electromagnetic radiation beam.
  • a corrodible material for instance
  • a method of manufacturing a (for instance monolithically integrated) device comprising forming a substrate comprising a corrodible material, forming a grating on and/or in the substrate (for instance, but not necessarily coupled to the corrodible material), forming an electromagnetic radiation source on and/or in the substrate adapted for directing an electromagnetic radiation beam onto the grating, forming an electromagnetic radiation detector on and/or in the substrate adapted for detecting the electromagnetic radiation beam after interaction with the grating, and forming an evaluation unit on and/or in the substrate adapted for evaluating a corrosion state of the corrodible material based on the detected electromagnetic radiation beam.
  • grating may particularly denote an optical unit for producing spectra by diffraction. Close equidistant and parallel grooves or protrusions may be arranged on a surface.
  • a grating can be of a reflection type or a transmission type.
  • a surface of a grating can be planar or curved (for instance convex).
  • a grating may be a stimulus pattern formed of alternating stripes.
  • a grating may be any regularly spaced collection of essentially identical, parallel, elongated elements. Gratings may be formed as a single set of elongated elements, but can comprise two sets, in which case the second set may be perpendicular to the first.
  • corrosion may particularly denote deterioration of properties in a material due to reactions with its surroundings. In one peculiarity, this means a loss of an electron of metals reacting with water or oxygen or any other chemical action.
  • an integrally formed product may be provided which has an integrated corrosion detector indicative of corrosion of a specific material within the product.
  • the corrosion detection may be based on a reflection or transmission of an electromagnetic radiation beam generated within this product and detected within this product, wherein a diffraction characteristic at a grating may be indicative of a progress of a corrosion procedure.
  • the detected signal may be evaluated to qualitatively or quantitatively detemiine the progress of corrosion.
  • a signal indicative of the corrosion progress may be supplied to an entity arranged exterior of the product so that this entity can monitor the corrosion state of an embedded material within the product. This may allow to manufacture a small size, lightweight, compact corrosion detector which is highly reliable and which allows to derive corrosion information about an interior of the product.
  • Such an embodiment may be implemented, for instance, in the context of aircraft skins, ship hulls, highway structures, pipelines of all kinds, in ground fuel tanks, off shore drilling platforms, semiconductor manufacturing equipment, etc.
  • a corrosion sensor integrated in IC technology is provided which is based on a metal grating and the associated change of optical properties during the corrosion process.
  • an apparatus for detection of corrosion comprising a substrate, thereon arranged, a metal structure fomiing a grating and being arranged to interact with a corroding environment, a light source for producing a light pulse to be directed to the grating, a detector adapted to provide detection information indicative of reflections of the light pulse from the grating, a spectrum analyzer adapted for receiving said detection information and deteirnining an amplitude distribution of the reflections, and an entity for providing a signal indicative of the corrosion based on the determined amplitude distribution.
  • Such a sensor can be produced at low cost, be integrated in small IC devices, and allows to monitor the corrosion rate of a given material in a given environment. It is possible to integrate the sensor with associated CMOS control circuitry onto a tiny semiconductor chip. These sensors can evaluate and detect corrosion automatically and at a wanted frequency and can communicate with the outside word when a preset corrosion status is reached.
  • a sensor may include a grating of the material which corrosion rate needs to be monitored on the IC devices. The change of optical properties of the grating may be monitored as a function of time and may be correlated with the corrosion rate of the material.
  • Embodiments of the invention integrate corrosion sensing functionality on a silicon chip to provide an easy to use low-cost solution.
  • the principle of light interaction with corroding grating in a complete system (light source and detector with related electronics as well as the "corroding" grating) can be integrated monolithically on one chip. There is also no need to have an optical fibre (as the light source and detectors can be positioned underneath the grating).
  • Such system can be extremely small and can be used in a number of applications.
  • coupled to a standard (for instance wireless) sensor communication interface it can provide corrosion information in the environments where traditional bulky sensors cannot (for instance applyable for aviation industry).
  • the choice of the material to use for fabrication of the corroding grating may determine the sensitivity of the sensor and can be based on the actual conditions where the sensor is to be used.
  • the actual measurements are not performed on the structures that are corroding, but rather the corroding environment is evaluated ("monolithic optical corrosive environment monitor").
  • the prior knowledge of the effects that corrosive environment has on the structural properties of the materials subjected to the same environment as the sensor can be used to monitor, for instance, the integrity of such materials.
  • the light source is an integrated silicon light emitting device, such as provided by a p-n junction in avalanche breakdown regime, or an LED (for instance SiGe-based, GaAs ones are possible as well), or a laser (for instance Indium Phosphide-based lasers).
  • the light source may be arranged close to the device surface of the complete chip (that is to say buried underneath the top metal) and have a preferential direction of emission in the direction of the top metal (this can be ensured by appropriate light guides made in other than top metal layers) in which the grating is fabricated.
  • the grating may be made of a material that, under the influence of the environment, corrodes in such way that optical properties of reflected light are modified.
  • a light detector (or an array) can be used that can be integrated in silicon, such as a photodiode, a phototransistor, etc. (quite standard in silicon technology, used extensively in CMOS imaging, for instance). Such a system can also have optical elements on top (lenses, reflectors, etc., to collect the light corning back from the grating).
  • An array configuration may be advantageous as it might provide additional information on the directional change of the light reflected from the sensing grating.
  • a signal collected by the light detector(s) may be analysed by integrated on the same chip electronics (for instance signal acquisition, conditioning, memory storage and processing) to deliver needed output (for instance a degree of corrosion). This can also be coupled to a timing circuitry to allow realtime and historic data collection enabling to obtain a complete monitoring system.
  • the substrate may comprise an integrated circuit providing a main function of the entire product.
  • an integrated circuit may provide a memory function, a logic function, a signal processing function, a control function or the like.
  • the product may be an electronic product in which a monolithically integrated circuit may contribute its function. The proper functioning of such an integrated circuit may then be monitored by the embedded corrosion detector.
  • the device may be also free of any monolithically integrated circuit, apart from the evaluation unit.
  • the corrosion monitor may be important to determine the mechanical stability of a system suffering from corrosion.
  • a structural component of a vehicle such as an aircraft or a car may be monitored centrally by the embedded corrosion monitor so that any material deterioration may be detected at an early stage so as to prevent breakdown of a mechanical support function of the device.
  • the substrate may be a semiconductor substrate.
  • the substrate may be a silicon chip or wafer.
  • an internal corrosion detection system may be embedded. Corresponding consequences for the functioning of the device may be evaluated.
  • the corrodible material may comprise a metal.
  • a metal For example, copper, aluminium or other integrated circuit components, which may be prone to corrosion, may be monitored regarding a progress of a corrosion procedure, which could result in a failure of the corresponding metallic structure.
  • the grating may also be made of a metal.
  • the grating may comprise the same material as the corrodible material.
  • a corrosion progress in the grating may be a fingerprint of the corrosion process of the corrodible material, particularly when the corrodible material is located adjacent or close to the grating.
  • corresponding information may be derived regarding a very probable corrosion state of the corrodible material being part of a functional component of the device.
  • the grating may comprise a regular arrangement of a plurality of lines. These may be arranged in accordance with a specific pitch dimension and may provide an ordered structure at which refraction measurements of an electromagnetic radiation beam such as an optical beam may be performed.
  • the diffraction characteristics depend significantly on the structural parameters of the grating. When a corrosion procedure takes place, these characteristic geometrical features will be significantly altered (for instance due to a conversion of a metal into a metal oxide) so that a significant change in the optical diffraction characteristics may be detected.
  • Each of the plurality of lines may have a cross-sectional geometry having a rectangular, triangular, trapezoidal, or half circle geometry.
  • Such geometries may be manufactured for instance using procedures known from semiconductor technology involving the deposition of a mask, the patterning of the mask, and the performance of a corresponding etching procedure.
  • the electromagnetic radiation source may be adapted for generating a monochromatic and/or coherent electromagnetic radiation beam. It has been recognized by the present inventors that, for each wavelength of electromagnetic radiation, a corresponding characteristic curve of the reflection properties depending on a corrosion progress may take place. By using (basically) a single wavelength, an unambiguous correlation between corrosion progress and change of the optical properties may be derived (see description of the figures below). However, in another embodiment, also a polychromatic electromagnetic radiation beam may be used which may then require to store a lookup table or a characteristic curve or a calibration curve accessible to the evaluation unit so that a detected change of the optical properties may be correlated to a corresponding corrosion process by means of the data included in such a lookup table or calibration curve.
  • the electromagnetic radiation source may be a diode formed by a pn-junction. Such an electromagnetic radiation source which may be powered by an electric current applied to a pn-junction may be easily integratable into a monolithically circuit, for instance using implantation procedures. However, the electromagnetic radiation source may also comprise a light emitting diode. Also a light emitting diode may be manufactured in integrated circuit technology. It is also possible to provide another integratable light source such as a laser, for instance a VCSEL (Vertical Cavity Surface Emitting Laser).
  • VCSEL Vertical Cavity Surface Emitting Laser
  • the electromagnetic radiation detector may be a photo diode.
  • a photodiode for instance a pin-photodiode may also be manufactured easily in semiconductor technology.
  • all the components of the detector device may be monolithically integrated in semiconductor technology, particularly in silicon technology.
  • the evaluation unit may be adapted for generating an alert signal in case that the evaluated corrosion state is indicative of a corrosion progress, which exceeds a
  • One or more parameter values indicative of a corresponding corrosion progress may be stored quantitatively and may be compared with parameter values related to a present corrosion status indicated by a corresponding electromagnetic reflection signal.
  • different kinds of alarm signals for instance a "green” alarm signal, a "yellow” alarm signal and a “red” alarm signal
  • a “green” alarm signal for instance a "green” alarm signal, a "yellow” alarm signal and a “red” alarm signal
  • the device may comprise a communication interface unit adapted for communicating a signal indicative of a corrosion state to a remote communication partner device.
  • a communication interface unit may be an antenna which can also be monolithically integrated in or attached to a surface of the substrate.
  • corresponding technologies as known from RFID technology may be used.
  • a communication partner device such as a central monitoring computer or another control unit may be informed in a wireless manner and therefore in a very flexible way about a corrosion state of a product, allowing the control unit to, at an early stage, take appropriate measures which ensure a proper function of the device or an arrangement of devices which may be prone to corrosion.
  • This may, for instance, be advantageously applicable in the context of a distributed sensor system of a plurality of sensors of a complex plant, wherein the various sensors can also be arranged in an environment which provides harsh conditions to the respective sensor. If the reliability of a specific sensor becomes prone to failure since the corrosion has exceeded a certain amount or level, this information can be supplied to a central monitoring unit so that any false sensor signals may be prevented.
  • the manufacturing method may be carried out in CMOS technology, since the described procedures are compatible with CMOS technology.
  • Forming layers or components may include deposition techniques like CVD (chemical vapour deposition), PECVD (plasma enhanced chemical vapour deposition), ALD (atomic layer deposition), or sputtering.
  • Removing layers or components may include etching techniques like wet etching, vapour etching, etc., as well as patterning techniques like optical lithography, UV lithography, electron beam lithography, etc.
  • Embodiments of the invention are not bound to specific materials, so that many different materials may be used.
  • conductive structures it may be possible to use metallization structures, silicide structures or polysilicon structures.
  • semiconductor regions or components crystalline silicon may be used.
  • insulating portions silicon oxide or silicon nitride may be used.
  • the structure may be formed on a purely crystalline silicon wafer or on an SOI wafer (Silicon On Insulator).
  • CMOS complementary metal-oxide-semiconductor
  • BIPOLAR BIPOLAR
  • BICMOS BICMOS
  • Fig. 1 illustrates a cross-sectional view of a monolithically integrated semiconductor device according to an exemplary embodiment of the invention.
  • Fig. 2 illustrates a grating of a product according to an exemplary embodiment of the invention.
  • Fig. 3 illustrates a pitch width and other geometry parameters of a grating according to an exemplary embodiment.
  • Fig. 4 shows the geometrical conditions of a reflection of light at a grating.
  • Fig. 5 shows a reflection characteristic at a grating using a wavelength of 450 nm.
  • Fig. 6 shows a reflection characteristic at a grating using a wavelength of 850 nm.
  • Fig. 7 is a diagram illustrating a simulation efficiency in a reflected intensity for a wavelength of 450 nm for an angle 01.
  • Fig. 8 illustrates a simulation efficiency in a reflected intensity for a wavelength of 450 nm for an angle ⁇ 2.
  • Fig. 9 illustrates a simulation efficiency in a reflected intensity for a wavelength of 850 nm for an angle ⁇ 1.
  • Fig. 10 illustrates an arrangement of a partially corroded grating according to an exemplary embodiment.
  • Fig. 11 shows a diagram indicative of a simulation for a reflection at 450 nm in dependence of a corroded thickness for an angle ⁇ 1.
  • Fig. 12 illustrates a diagram indicative of a reflection for a wavelength of 450 nm in dependence of a corroded thickness for an angle ⁇ 2.
  • Fig. 13 shows a diagram illustrating a simulation efficiency in a reflected intensity for a wavelength of 850 nm for an angle for an angle ⁇ 1.
  • Fig. 14 illustrates a diagram showing a refractive index and an absorption index in dependence of a photon energy for copper.
  • Fig. 15 illustrates a diagram showing a refractive index and an absorption index in dependence of a photon energy for copper oxide.
  • Fig. 16 shows a diagram illustrating results of simulation intensities reflected for a wavelength of 450 nm for an angle ⁇ 1.
  • Fig. 17 shows a diagram illustrating results of simulation intensities reflected for a wavelength of 450 nm for an angle ⁇ 2.
  • Fig. 18 illustrates a diagram showing the result of a simulation of a dependency of an intensity reflected for a wavelength of 850 nm for an angle ⁇ 1.
  • Fig. 19 and Fig. 20 show alternative geometries for grating protrusions usable according to an exemplary embodiment of the invention.
  • Fig. 1 illustrates a monolithically integrated semiconductor chip 100 according to an exemplary embodiment of the invention.
  • the device 100 comprises a silicon substrate 102 (alternatively a GaAs or any other suitable for fabrication of the necessary circuitry and electromagnetic sources and detectors substrate) comprising a corrodible material (not shown in detail) being part of an integrated logic circuitry embedded in the silicon substrate 102.
  • a silicon substrate 102 alternatively a GaAs or any other suitable for fabrication of the necessary circuitry and electromagnetic sources and detectors substrate
  • a corrodible material not shown in detail
  • a regular grating 104 is formed on top of the device 100.
  • the grating 104 may be formed by depositing a metal (for instance copper, iron, or any other suitable material) layer and by performing a masking, patterning and etching procedure. By taking this measure, a regular arrangement of parallel lines 122 is formed.
  • the grating 104 may be made of copper, iron, or any other suitable material (can also be non-metal and organic in nature) being the corrodible material within the substrate 102.
  • the grating 104 is formed on a further layer 124 of an optically transparent material.
  • a laser diode 106 (having a pn-junction) is then formed in optical communication with the optically transparent layer 124.
  • a light beam 108 is emitted by the laser diode 106 which is directed through the optically transparent layer 124 onto the grating 104.
  • a corresponding interaction results in a characteristic reflection of the light beam 108 which is then directed towards a light detector 110, namely a photodiode, which is adapted for detecting the light beam 108 after interaction with the grating 104 and which is capable of converting the optical signal into an electronic signal.
  • This electronic signal is supplied to a monolithically integrated evaluation unit 112 which is embedded within an electrically insulating layer 126 and which is capable of processing the signal in a manner so that a corrosion state of the grating 104 (made of the same material as the corrodible material within the substrate 102 and therefore suffering from the same or very similar corrosion effects) can be determined.
  • the evaluation unit 112 may compare the obtained reflection signal with a data included in a lookup table correlating corrosion states with reflection signals. Thus, a corrosion state of the corrosive material may be determined based on the reflected optical beam 108.
  • a corresponding "no corrosion" signal may be supplied to an antenna 114 which may generate an electromagnetic radiation beam 116 to be directed to a central monitoring device (not shown in the figures) so that the proper functioning of the device 100 can be reported to the central monitoring device.
  • a first threshold value is exceeded which indicates that the product 100 still functions properly but already suffers to some extent of corrosion
  • a corresponding early warning signal may be sent to the central monitoring device.
  • an alert signal may be sent from the antenna 114 to the monitoring device. Since the communication signal 116 is a wireless signal, the monitoring device can be arranged at a remote position as compared to the device 100.
  • Fig. 2 illustrates the geometry of the reflection of the light beam 108 at the grating 104.
  • the grating 104 is formed by parallel oblong lines 122 having a rectangular cross-section and arranged on an underlying layer 202.
  • a transmitted beam 204 is shown in Fig. 2 which can be used as well for determining the corrosion state.
  • the grating 104 of the structure is formed by the lines 122 of material which are formed by conventional CMOS processing steps, such as deposition by CVD or PECVD, patterning with photolithography and dry/wet etch processes.
  • the lines 122 are of identical width, the pitch stays constant.
  • the material dimensions are decreasing. In that case, the dimensions of the grating 104 are changed (and the intensity of reflection), and/or
  • Fig. 3 shows a plan view of one pitch 300 of the grating 104 including a copper line 122 and an interspace 302 (representing air). A silicon portion 304 is shown as well.
  • the initial structure is shown in Fig. 3, the width if the copper lines 122 are 500nm, the height of the line is 1500 nm, and the pitch 300 of the structure is 1300nm.
  • the substrate 304 is silicon (no transmitted lights) and the corroding environment is air 302.
  • Fig. 4 is a three-dimensional view 400 defining several angles in a reflection geometry.
  • Fig. 5 shows a reflection characteristic at a grating using a wavelength of 450 nm and defines several angles.
  • Fig. 6 shows a reflection characteristic at a grating using a wavelength of 850 nm and defines several angles.
  • 450 nm and 850 nm two different wavelengths are being studied: 450 nm and 850 nm.
  • 450 nm three reflections are seen in the test structures, at angle equals to 0 degree, 20.3 degree ( ⁇ 2) and 43.8 degree ( ⁇ 3).
  • the corresponding intensity of the reflected light is respectively 15.6%, 12.6 % and 0.7 % of the incident beam intensity. Only ⁇ 1 and ⁇ 2 will be considered for following simulations.
  • the structure in direct contact with corroding environment (here air) is gradually corroded.
  • corroding environment here air
  • the structure is placed on top of the IC (for example in the passivation layer, to allow easy contact with corroding environment).
  • 5nm of material is being first removed laterally (each sides) and vertically. This corroded thickness is gradually increased to 25 nm by step of 5 nm.
  • the final structure and simulated intensities graph as a function of corroded thickness are represented in the various figures, for the different reflected angles and wavelengths.
  • Fig. 7 illustrates a diagram 700 having an abscissa 702 along which a thickness of a corroded portion of a grating is plotted. Along an ordinate 704, a reflected intensity is plotted.
  • Fig. 8, Fig. 9, Fig. 11, Fig. 12, Fig. 13, Fig. 16, Fig. 17, Fig. 18 illustrate further diagrams 800, 900, 1100, 1200, 1300, 1600, 1700, 1800 representing similar scenarios as Fig. 7.
  • Fig. 10 shows a grating 1000 which is partially corroded.
  • Reference numeral 1002 denotes silicon material
  • reference numeral 1004 denotes air
  • reference numeral 1006 denotes copper oxide
  • reference numeral 1008 denotes copper.
  • Fig. 11 to Fig. 13 show corresponding diagrams.
  • Fig. 14 illustrates a diagram 1400 having an abscissa 1402 along which a photon energy is plotted. Along a first ordinate 1404, a refractive index is plotted, and along a second ordinate 1406, an absorption index is plotted.
  • the scenario of Fig. 14 relates to copper material.
  • Fig. 15 illustrates a diagram 1500 similar to Fig. 14 but indicative of the situation for copper oxide.
  • a grating is shown having saw-tooth like protrusions 1900 having a triangular cross-section.
  • a grating is shown having protrusions 2000 having a trapezoidal cross-section.
  • the maximum of reflection can be shifted from the normal (0°) up to 15°, and can then be detected at a different angle.

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Abstract

L'invention porte sur un dispositif (100), qui comprend un substrat (102) comportant un matériau pouvant être corrodé, une grille (104) formée sur et/ou dans le substrat (102), une source de rayonnement électromagnétique (106) formée sur et/ou dans le substrat (102) et adaptée pour diriger un faisceau de rayonnement électromagnétique (108) sur la grille (104), un détecteur de rayonnement électromagnétique (110) formé sur et/ou dans le substrat (102) et adapté pour détecter le faisceau de rayonnement électromagnétique (108) après une interaction avec la grille (104), et une unité d'évaluation (112) formée sur et/ou dans le substrat (100) et adaptée pour évaluer un état de corrosion du matériau pouvant être corrodé en fonction du faisceau de rayonnement électromagnétique détecté (108).
PCT/IB2009/055393 2009-11-27 2009-11-27 Dispositif ayant une fonction de détection de la corrosion et son procédé de fabrication Ceased WO2011064622A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114088611A (zh) * 2021-11-09 2022-02-25 四川科力特油气技术服务有限公司 一种含硫气井含硫气体腐蚀评价装置和评价方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5646400A (en) 1995-07-14 1997-07-08 The United States Of America As Represented By The Secretary Of The Navy Corrosion detecting and monitoring method and apparatus
US6144026A (en) * 1997-10-17 2000-11-07 Blue Road Research Fiber optic grating corrosion and chemical sensor
US20050018945A1 (en) * 1994-11-29 2005-01-27 Dunphy James R. Optical fiber bragg grating coating removal detection

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050018945A1 (en) * 1994-11-29 2005-01-27 Dunphy James R. Optical fiber bragg grating coating removal detection
US5646400A (en) 1995-07-14 1997-07-08 The United States Of America As Represented By The Secretary Of The Navy Corrosion detecting and monitoring method and apparatus
US6144026A (en) * 1997-10-17 2000-11-07 Blue Road Research Fiber optic grating corrosion and chemical sensor

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
COOPER K R ET AL: "Optical fiber-based corrosion sensor systems for health monitoring of aging aircraft", 2001 IEEE AUTOTESTCON PROCEEDINGS. IEEE SYSTEMS READINESS TECHNOLOGY CONFERENCE. AUTOTESTCON 2001. VALLEY FORGE, PA, AUG. 20 - 23, 2001; [IEEE AUTOTESTCON PROCEEDINGS: IEEE SYSTEMS READINESS TECHNOLOGY CONFERENCE], NEW YORK, NY : IEEE, US LNKD- DOI:1, vol. CONF. 37, 20 August 2001 (2001-08-20), pages 847 - 856, XP010556154, ISBN: 978-0-7803-7094-4 *
GREENE J A ET AL: "Grating-based optical fiber-based corrosion sensors", PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING SPIE-INT. SOC. OPT. ENG USA, vol. 2718, 1996, pages 170 - 174, XP002593136, ISSN: 0277-786X *
LING H Y ET AL: "Viability of using an embedded FBG sensor in a composite structure for dynamic strain measurement", MEASUREMENT, INSTITUTE OF MEASUREMENT AND CONTROL. LONDON, GB LNKD- DOI:10.1016/J.MEASUREMENT.2005.11.011, vol. 39, no. 4, 1 May 2006 (2006-05-01), pages 328 - 334, XP025135582, ISSN: 0263-2241, [retrieved on 20060501] *
MATTHYS S ET AL: "Experimental testing of post-tensioned concrete girders instrumented with optical fibre gratings", PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING USA, vol. 5855, no. 1, 23 May 2005 (2005-05-23), pages 1060 - 1063, XP002593137, ISSN: 0277-786X *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114088611A (zh) * 2021-11-09 2022-02-25 四川科力特油气技术服务有限公司 一种含硫气井含硫气体腐蚀评价装置和评价方法
CN114088611B (zh) * 2021-11-09 2023-09-29 四川科力特油气技术服务有限公司 一种含硫气井含硫气体腐蚀评价装置和评价方法

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